935284068551 - NXP SEMICONDUCTORS

1. General description

NXP Semiconductors designed the LPC2470 microcontroller, powered by the

ARM7TDMI-S core, to be a highly integrated microcontroller for a wide range of

applications that require advanced communications and high q uality graphic displays. The

LPC2470 microcontroller is flashless. The LPC2470, with real-tim e debug interfaces that

include both JTAG and embedded trace, can execute both 32-bit ARM and 16-bit Thumb

instructions.

The LPC2470 microcontroller incorporates an LCD controller, a 10/100 Ethernet Media

Access Controller (MAC), a USB full-speed device/host/OTG controller with 4 kB of

endpoint RAM, four UARTs, two Controller Area Network (CAN) channels, an SPI

interface, two Synchronous Serial Ports (SSP), three I2C interfaces, and an I2S interface.

Supporting this collection of serial communications interface s ar e the follo win g fe at ur e

components; an on-chip 4 MHz internal oscillator, 98 kB of total RAM consisting of 64 kB

of local SRAM, 16 kB SRAM for Ethernet, 16 kB SRAM for general purpose DMA, 2 kB of

battery powered SRAM, and an External Memory Controller (EMC). These features make

this device optimally suited for portable electronics and Point-of-Sale (POS) applicatio ns.

Complementing the many serial communication controllers, versatile clocking capabilities,

and memory features are vario us 32-bit timers, a 10-bit ADC, 10-bit DAC, two PWM units,

and up to 160 fast GPIO lines. The LPC2470 connects 64 of the GPIO pins to th e

hardware based Vector Interrupt Controller (VIC ), allowing th e external input s to gener ate

edge-triggered inter rupt s. All of these featur es make the LPC2470 particul arly suitable for

industrial control and medical systems.

2. Features and benefits

ARM7TDMI-S processor, running at up to 72 MHz.

98 kB on-chip SRAM includes:

64 kB of SRAM on the ARM local bus for high performance CPU access.

16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM.

16 kB SRAM for general purpose DMA use also accessible by the USB.

2 kB SRAM data storage powered from the Real-Time Clock (RTC) power domain.

LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film

Tr ansistors (TFT) displays.

Dedicated DMA controller.

Selectable display resolution (up to 1024 768 pixels).

Supports up to 24-bit true-color mode.

Dual Advanced High-performance Bus (AHB) system allows simultaneous Ethernet

DMA, and USB DMA with no contention.

LPC2470

Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD,

USB 2.0 device/host/OTG, external memory interface

Rev. 4.1 — 16 October 2013 Product data sheet

Product data sheet Rev. 4.1 — 16 October 2013 2 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

EMC provides support for asynchronous static memory devices such as RAM, ROM

and flash, as well as dynamic memories such as single data rate SDRAM.

Advanced Vectored Interrupt Controller (VIC), supporting up to 32 ve ctored interrupts.

General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP,

I2S-bus, and Secure Digital/MultiMediaCard (SD/MMC) interface as well as for

memory-to-memory transfers.

Serial Interfaces:

Ethernet MAC with MII/RMII interface and associated DMA controller. These

functions reside on an independent AHB.

USB 2.0 full-speed dual port device/host/OTG controller with on-chip PHY and

associated DMA controller.

Four UARTs with fractional baud rate gener ation, o ne with mo dem cont rol I/O, one

with IrDA support, all with FIFO.

CAN controller with two channels.

SPI controller.

Two SSP controllers, with FIFO and multi-protocol capabilities. One is an alternate

for the SPI port, sharing its interrupt. SSPs can be used with the GPDMA controller.

Three I2C-bus interfaces (one with open-drain and two with standard port pins).

I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with

the GPDMA.

Other periph er als :

SD/MMC memory card interface.

160 General purpose I/O pins with configurable pull-up/down resistors.

10-bit ADC with input multiplexing among 8 pins.

10-bit DAC.

Four general purpose timers/counters with 8 capture inputs and 10 compar e

outputs. Each timer block has an external count input.

Two PWM/timer blocks with support for three-phase motor control. Each PWM has

an external count inputs.

RTC with separate power domain. Clock source can be the RTC oscillator or the

APB clock.

2 kB SRAM powered from the RTC p ower pin, allowin g dat a to be stored wh en the

rest of the chip is powered off.

WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator,

the RTC oscillator, or the APB clock.

Single 3.3 V power supply (3.0 V to 3.6 V).

4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as

the system clock.

Four reduced power modes: idle, sleep, power-down, and deep power-down.

Four external interrupt inputs co nfigurable as edge/level sensitive. All pins on port 0

and port 2 can be used as edge sensitive interrupt sources.

Processor wake-up from Power-down mode via any interrupt able to operate during

Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet

wake-up interrupt, CAN bus activity, port 0/2 pin interrupt).

Two independent power domains allow fine tuning of power consumption based on

needed features.

Product data sheet Rev. 4.1 — 16 October 2013 3 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

Each peripheral has it s own clock divider for further power saving. Th ese dividers help

reduce active power by 20 % to 30 %.

Brownout detect with separate thresholds fo r interrupt and forced reset.

On-chip power-on reset.

On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz.

On-chip PLL allows CPU operation up to the maximum CPU rate without the need for

a high frequency crystal. May be run from the main oscillator, the internal RC oscillator ,

or the RTC oscillator.

Boundary scan for simplified board testing.

Versatile pin function selections allow more possibilities for using on-chip peripheral

functions.

Standard ARM test/debug interface for compatibility with existing tools.

Emulation trace module supports real-time trace.

3. Applications

Industrial control

Medical systems

Portable electronics

Point-of-Sale (POS) equipment

4. Ordering information

4.1 Ordering options

Table 1. Ordering information

Type number Package

Name Description Version

LPC2470FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1

LPC2470FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls;

body 15 15 0.7 mm SOT950-1

Table 2. Ordering options

Type number Flash

(kB) SRAM (kB) External bus Ethernet USB

OTG/

OHCI/

device

+ 4 kB

FIFO

CAN channels

SD/

MMC GP

DMA

ADC channels

DAC channels

Temp range

Local bus

Ethernet buffer

GP/USB

RTC

Total

LPC2470FBD208 n/a 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1 40 C to

+85 C

LPC2470FET208 n/a 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1 40 C to

+85 C

Product data sheet Rev. 4.1 — 16 October 2013 4 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

5. Block diagram

Fig 1. LPC2470 block diagram

power domain 2

LPC2470

A[23:0]

D[31:0]

EXTERNAL

MEMORY

CONTROLLER

ALARM

002aad317

PWM0, PWM1

ARM7TDMI-S

PLL

EINT3 to EINT0

P3, P4

P0, P1, P2,

LEGACY GPI/O

64 PINS TOTAL

P0, P1

SCK, SCK0

3 × I2STX

3 × I2SRX

8 × LCD control

LCDVD[23:0]

LCDCLKIN

MOSI, MOSI0

SSEL, SSEL0

SCK1

MOSI1

MISO1

SSEL1

SCL0, SCL1, SCL2

8 × AD0

RTCX1

RTCX2

MCICLK, MCIPWR

RXD0, RXD2, RXD3

RD1, RD2

TD1, TD2

CAN1, CAN2

port1

XTAL1

TCK TDO

EXTIN0

XTAL2

RESET

TRST

TDITMS

HIGH-SPEED

GPIO

160 PINS

TOTAL

port2

64 kB

SRAM

INTERNAL

SRAM

CONTROLLER

TEST/DEBUG

INTERFACE

EMULATION

TRACE MODULE

trace signals

AHB

BRIDGE AHB

BRIDGE

ETHERNET

MAC WITH

DMA

16 kB

SRAM MASTER

PORT AHB T O

AHB BRIDGE SLAVE

PORT

system

clock

SYSTEM

FUNCTIONS

INTERNAL RC

OSCILLATOR

VDDA

VDD(3V3)

VDD(DCDC)(3V3)

VREF

VIC 16 kB

SRAM

USB DEVICE/

HOST/O TG WITH

4 kB RAM AND DMA

GP DMA

CONTROLLER

LCD INTERFACE

WITH DMA

I2S INTERFACE

SPI, SSP0 INTERFACE MISO, MISO0

SSP1 INTERFACE

SD/MMC CARD

INTERFACE MCICMD,

MCIDAT[3:0]

TXD0, TXD2, TXD3

UART0, UART2, UART3

UART1 TXD1, DTR1, RTS1

RXD1, DSR1, CTS1,

DCD1, RI1

I2C0, I2C1, I2C2 SDA0, SDA1, SDA2

EXTERNAL INTERRUPTS

CAPTURE/COMPARE

TIMER0/TIMER1/

TIMER2/TIMER3

A/D CONVERTER

D/A CONVERTER

2 kB BATTERY RAM

RTC

OSCILLATOR

REAL-

TIME

CLOCK

W ATCHDOG TIMER

SYSTEM CONTROL

2 × CAP0/CAP1/

CAP2/CAP3

4 × MAT2/MAT3,

2 × MAT0,

3 × MAT1

6 × PWM0/PWM1

1 × PCAP0,

2 × PCAP1

AOUT

VBAT

AHB T O

APB BRIDGE

MII/RMII

VBUS

DBGEN

P0, P2

AHB2 AHB1

control lines

VSSA, VSSCORE, VSSIO

Product data sheet Rev. 4.1 — 16 October 2013 5 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

6. Pinning information

6.1 Pinning

Fig 2. LPC2470 pinning LQFP208 p ackage

Fig 3. LPC2470 pinning TFBGA208 package

LPC2470FBD208

156

104

208

157

105

002aad318

002aad319

LPC2470FET208

Transparent top view

ball A1

index area

24681012

131415 17

1357911

Table 3. Pin allocation table

Pin Symbol Pin Symbol Pin Symbol Pin Symbol

Row A

1 P3[27]/D27/

CAP1[0]/PWM1[4] 2V

SSIO 3 P1[0]/ENET_TXD0 4 P4[31]/CS1

5 P1[4]/ENET_TX_EN 6 P1[9]/ENET_RXD0 7 P1[14]/ENET_RX_ER 8 P1[15]/

ENET_REF_CLK/

ENET_RX_CLK

9 P1[17]/ENET_MDIO 10 P1[3]/ENET_TXD3/

MCICMD/PWM0[2] 11 P4[15]/A15 12 VSSIO

Product data sheet Rev. 4.1 — 16 October 2013 6 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

13 P3[20]/D20/

PWM0[5]/DSR1 14 P1[11]/ENET_RXD2/

MCIDAT2/PWM0[6] 15 P0[8]/I2STX_WS/

LCDVD[16]/MISO1/

MAT2[2]

16 P1[12]/ENET_RXD3/

MCIDAT3/PCAP0[0]

17 P1[5]/ENET_TX_ER/

MCIPWR/PWM0[3] ---

Row B

1 P3[2]/D2 2 P3[10]/D10 3 P3[1]/D1 4 P3[0]/D0

5 P1[1]/ENET_TXD1 6 VSSIO 7 P4[30]/CS0 8 P4[24]/OE

9 P4[25]/WE 10 P4[29]/BLS3/MAT2[1]/

LCDVD[7]/LCDVD[11]/

LCDVD[3]/RXD3

11 P1[6]/ENET_TX_CLK/

MCIDAT0/PWM0[4] 12 P0[4]/I2SRX_CLK/

LCDVD[0]/RD2/CAP2[0]

13 VDD(3V3) 14 P3[19]/D19/

PWM0[4]/DCD1 15 P4[14]/A14 16 P4[13]/A13

17 P2[0]/PWM1[1]/TXD1/

TRACECLK/LCDPWR ---

Row C

1 P3[13]/D13 2 TDI 3 RTCK 4 P0[2]/TXD0

5 P3[9]/D9 6 P3[22]/D22/

PCAP0[0]/RI1 7 P1[8]/ENET_CRS_DV/

ENET_CRS 8 P1[10]/ENET_RXD1

DD(3V3) 10 P3[21]/D21/

PWM0[6]/DTR1 11 P4[28]/BLS2/MAT2[0]/

LCDVD[6]/LCDVD[10]/

LCDVD[2]/TXD3

12 P0[5]/I2SRX_WS/

LCDVD[1]/TD2/CAP2[1]

13 P0[7]/I2STX_CLK/

LCDVD[9]/SCK1/

MAT2[1]

14 P0[9]/I2STX_SDA/

LCDVD[17]/MOSI1/

MAT2[3]

15 P3[18]/D18/

PWM0[3]/CTS1 16 P4[12]/A12

17 VDD(3V3) ---

Row D

1TRST 2 P3[28]/D28/

CAP1[1]/PWM1[5] 3 TDO 4 P3[12]/D12

5 P3[11]/D11 6 P0[3]/RXD0 7 VDD(3V3) 8 P3[8]/D8

9 P1[2]/ENET_TXD2/

MCICLK/PWM0[1] 10 P1[16]/ENET_MDC 11 VDD(DCDC)(3V3) 12 VSSCORE

13 P0[6]/I2SRX_SDA/

LCDVD[8]/SSEL1/

MAT2[0]

14 P1[7]/ENET_COL/

MCIDAT1/PWM0[5] 15 P2[2]/PWM1[3]/CTS1/

PIPESTAT1/LCDDCLK 16 P1[13]/ENET_RX_DV

17 P2[4]/PWM1[5]/

DSR1/TRACESYNC/

LCDENAB/LCDM

---

Row E

1 P0[26]/AD0[3]/

AOUT/RXD3 2TCK 3TMS 4P3[3]/D3

14 P2[1]/PWM1[2]/RXD1/

PIPESTAT0/LCDLE 15 VSSIO 16 P2[3]/PWM1[4]/DCD1/

PIPESTAT2/LCDFP 17 P2[6]/PCAP1[0]/RI1/

TRACEPKT1/

LCDVD[0]/LCDVD[4]

Row F

1 P0[25]/AD0[2]/

I2SRX_SDA/TXD3 2 P3[4]/D4 3 P3[29]/D29/

MAT1[0]/PWM1[6] 4 DBGEN

Table 3. Pin allocation table …continued

Pin Symbol Pin Symbol Pin Symbol Pin Symbol

Product data sheet Rev. 4.1 — 16 October 2013 7 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

14 P4[11]/A11 15 P3[17]/D17/

PWM0[2]/RXD1 16 P2[5]/PWM1[6]/

DTR1/TRACEPKT0/

LCDLP

17 P3[16]/D16/

PWM0[1]/TXD1

Row G

1 P3[5]/D5 2 P0[24]/AD0[1]/

I2SRX_WS/CAP3[1] 3V

DD(3V3) 4V

DDA

14 n.c. 15 P4[27]/BLS1 16 P2[7]/RD2/

RTS1/TRACEPKT2/

LCDVD[1]/LCDVD[5]

17 P4[10]/A10

Row H

1 P0[23]/AD0[0]/

I2SRX_CLK/CAP3[0] 2 P3[14]/D14 3 P3[30]/D30/

MAT1[1]/RTS1 4V

DD(DCDC)(3V3)

14 VSSIO 15 P2[8]/TD2/TXD2/

TRACEPKT3/

LCDVD[2]/LCDVD[6]

16 P2[9]/

USB_CONNECT1/

RXD2/EXTIN0/

LCDVD[3]/LCDVD[7]

17 P4[9]/A9

Row J

1 P3[6]/D6 2 VSSA 3 P3[31]/D31/MAT1[2] 4 n.c.

14 P0[16]/RXD1/

SSEL0/SSEL 15 P4[23]/A23/

RXD2/MOSI1 16 P0[15]/TXD1/

SCK0/SCK 17 P4[8]/A8

Row K

1 VREF 2 RTCX1 3 RSTOUT 4V

SSCORE

14 P4[22]/A22/

TXD2/MISO1 15 P0[18]/DCD1/

MOSI0/MOSI 16 VDD(3V3) 17 P0[17]/CTS1/

MISO0/MISO

Row L

1 P3[7]/D7 2 RTCX2 3 VSSIO 4 P2[30]/DQMOUT2/

MAT3[2]/SDA2

14 n.c. 15 P4[26]/BLS0 16 P4[7]/A7 17 P0[19]/DSR1/

MCICLK/SDA1

Row M

1 P3[15]/D15 2 RESET 3 VBAT 4 XTAL1

14 P4[6]/A6 15 P4[21]/A21/

SCL2/SSEL1 16 P0[21]/RI1/

MCIPWR/RD1 17 P0[20]/DTR1/

MCICMD/SCL1

Row N

1 ALARM 2 P2[31]/DQMOUT3/

MAT3[3]/SCL2 3 P2[29]/DQMOUT1 4 XTAL2

14 P2[12]/EINT2/

LCDVD[4]/LCDVD[3]/

LCDVD[8]/LCDVD[18]/

MCIDAT2/I2STX_WS

15 P2[10]/EINT0 16 VSSIO 17 P0[22]/RTS1/

MCIDAT0/TD1

Row P

1 P1[31]/USB_OVRCR2/

SCK1/AD0[5] 2 P1[30]/USB_PWRD2/

VBUS/AD0[4] 3 P2[27]/CKEOUT3/

MAT3[1]/MOSI0 4 P2[28]/DQMOUT0

5 P2[24]/CKEOUT0 6 VDD(3V3) 7 P1[18]/USB_UP_LED1/

PWM1[1]/CAP1[0] 8V

DD(3V3)

Table 3. Pin allocation table …continued

Pin Symbol Pin Symbol Pin Symbol Pin Symbol

Product data sheet Rev. 4.1 — 16 October 2013 8 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

9 P1[23]/USB_RX_DP1/

LCDVD[9]/LCDVD[13]/

PWM1[4]/MISO0

10 VSSCORE 11 VDD(DCDC)(3V3) 12 VSSIO

13 P2[15]/CS3/

CAP2[1]/SCL1 14 P4[17]/A17 15 P4[18]/A18 16 P4[19]/A19

17 VDD(3V3) ---

Row R

1 P0[12]/USB_PPWR2/

MISO1/AD0[6] 2 P0[13]/USB_UP_LED2/

MOSI1/AD0[7] 3 P0[28]/SCL0 4 P2[25]/CKEOUT1

5 P3[24]/D24/

CAP0[1]/PWM1[1] 6 P0[30]/USB_D1 7 P2[19]/CLKOUT1 8 P1[21]/USB_TX_DM1/

LCDVD[7]/LCDVD[11]/

PWM1[3]/SSEL0

SSIO 10 P1[26]/USB_SSPND1/

LCDVD[12]/LCDVD[20]/

PWM1[6]/CAP0[0]

11 P2[16]/CAS 12 P2[14]/CS2/CAP2[0]/

SDA1

13 P2[17]/RAS 14 P0[11]/RXD2/SCL2/

MAT3[1] 15 P4[4]/A4 16 P4[5]/A5

17 P4[20]/A20/SDA2/SCK1 - - -

Row T

1 P0[27]/SDA0 2 P0[31]/USB_D+2 3 P3[26]/D26/

MAT0[1]/PWM1[3] 4 P2[26]/CKEOUT2/

MAT3[0]/MISO0

SSIO 6 P3[23]/D23/

CAP0[0]/PCAP1[0] 7 P0[14]/USB_HSTEN2/

USB_CONNECT2/

SSEL1

8 P2[20]/DYCS0

9 P1[24]/USB_RX_DM1/

LCDVD[10]/LCDVD[14]/

PWM1[5]/MOSI0

10 P1[25]/USB_LS1/

LCDVD[11]/LCDVD[15]/

USB_HSTEN1/MAT1[1]

11 P4[2]/A2 12 P1[27]/USB_INT1/

LCDVD[13]/LCDVD[21]/

USB_OVRCR1/CAP0[1]

13 P1[28]/USB_SCL1/

LCDVD[14]/LCDVD[22]/

PCAP1[0]/MAT0[0]

14 P0[1]/TD1/RXD3/SCL1 15 P0[10]/TXD2/SDA2/

MAT3[0] 16 P2[13]/EINT3/

LCDVD[5]/LCDVD[9]/

LCDVD[19]/MCIDAT3/

I2STX_SDA

17 P2[11]/EINT1/

LCDCLKIN/

MCIDAT1/I2STX_CLK

---

Row U

1 USB_D22P3[25]/D25/

MAT0[0]/PWM1[2] 3 P2[18]/CLKOUT0 4 P0[29]/USB_D+1

5 P2[23]/DYCS3/

CAP3[1]/SSEL0 6 P1[19]/USB_TX_E1/

USB_PPWR1/CAP1[1] 7 P1[20]/USB_TX_DP1/

LCDVD[6]/LCDVD[10]/

PWM1[2]/SCK0

8 P1[22]/USB_RCV1/

LCDVD[8]/LCDVD[12]/

USB_PWRD1/MAT1[0]

9 P4[0]/A0 10 P4[1]/A1 11 P2[21]/DYCS1 12 P2[22]/DYCS2/

CAP3[0]/SCK0

13 VDD(3V3) 14 P1[29]/USB_SDA1/

LCDVD[15]/LCDVD[23]/

PCAP1[1]/MAT0[1]

15 P0[0]/RD1/TXD3/SDA1 16 P4[3]/A3

17 P4[16]/A16 - - -

Table 3. Pin allocation table …continued

Pin Symbol Pin Symbol Pin Symbol Pin Symbol

Product data sheet Rev. 4.1 — 16 October 2013 9 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

6.2 Pin description

Table 4. Pin description

Symbol Pin Ball Type Description

P0[0] to P0[31] I/O Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each

bit. The operation of port 0 pins depends upon the pin function selected

via the pin connect block.

P0[0]/RD1/TXD3/

SDA1 94[1] U15[1] I/O P0[0] — General purpose digital input/output pin.

IRD1 — CAN1 receiver input.

OTXD3 — Transmitter output for UART3.

I/O SDA1 — I2C1 data input/output (this is not an open-drain pin).

P0[1]/TD1/RXD3/

SCL1 96[1] T14[1] I/O P0[1] — General purpose digital input/output pin.

OTD1 — CAN1 transmitter output.

IRXD3 — Receiver input for UART3.

I/O SCL1 — I2C1 clock input/output (this is not an open-drain pin).

P0[2]/TXD0 202[1] C4[1] I/O P0[2] — General purpose digital input/output pin.

OTXD0 — Transmitter output for UART0.

P0[3]/RXD0 204[1] D6[1] I/O P0[3] — General purpose digital input/output pin.

IRXD0 — Receiver input for UART0.

P0[4]/I2SRX_CLK/

LCDVD[0]/RD2/

CAP2[0]

168[1] B12[1] I/O P0[4] — General purpose digital input/output pin.

I/O I2SRX_CLK — I2S Receive clock. It is driven by the master and received

by the slave. Corresponds to the signal SCK in th e I2S-bus

specification.[2]

OLCDVD[0] — LCD data.[2]

IRD2 — CAN2 receiver input.

ICAP2[0] — Capture input for T imer 2, channel 0.

P0[5]/I2SRX_WS/

LCDVD[1]/TD2/

CAP2[1]

166[1] C12[1] I/O P0[5] — General purpose digital input/output pin.

I/O I2SRX_WS — I2S Receive word select. It is driven by the master and

received by the slave. Corresponds to the signal WS in the I2S-bus

specification.[2]

OLCDVD[1] — LCD data.[2]

OTD2 — CAN2 transmitter output.

ICAP2[1] — Capture input for T imer 2, channel 1.

P0[6]/I2SRX_SDA/

LCDVD[8]/

SSEL1/MAT2[0]

164[1] D13[1] I/O P0[6] — General purpose digital input/output pin.

I/O I2SRX_SDA — I2S Receive data. It is driven by the transmitter and read

by the receiver. Corresponds to the signal SD in the I2S-bus

specification.[2]

OLCDVD[8] — LCD data.[2]

I/O SSEL1 — Slave Select for SSP1.

OMAT2[0] — Match output for Timer 2, channel 0.

Product data sheet Rev. 4.1 — 16 October 2013 10 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P0[7]/I2STX_CLK/

LCDVD[9]/SCK1/

MAT2[1]

162[1] C13[1] I/O P0[7] — General purpose digital input/output pin.

I/O I2STX_CLK — I2S transmit clock. It is driven by the master and received

by the slave. Corresponds to the signal SCK in th e I2S-bus

specification.[2]

OLCDVD[9] — LCD data.[2]

I/O SCK1 — Serial Clock for SSP1.

OMAT2[1] — Match output for Timer 2, channel 1.

P0[8]/I2STX_WS/

LCDVD[16]/

MISO1/MAT2[2]

160[1] A15[1] I/O P0[8] — General purpose digital input/output pin.

I/O I2STX_WS — I2S Transmit word select. It is driven by the master and

received by the slave. Corresponds to the signal WS in the I2S-bus

specification.[2]

OLCDVD[16] — LCD data.[2]

I/O MISO1 — Master In Slave Out for SSP1.

OMAT2[2] — Match output for Timer 2, channel 2.

P0[9]/I2STX_SDA/

LCDVD[17]/

MOSI1/MAT2[3]

158[1] C14[1] I/O P0[9] — General purpose digital input/output pin.

I/O I2STX_SDA — I2S transmit data. It is driven by the transmitter and read

by the receiver. Corresponds to the signal SD in the I2S-bus

specification.[2]

OLCDVD[17] — LCD data.[2]

I/O MOSI1 — Master Out Slave In for SSP1.

OMAT2[3] — Match output for Timer 2, channel 3.

P0[10]/TXD2/

SDA2/MAT3[0] 98[1] T15[1] I/O P0[10] — General purpose digital input/output pin.

OTXD2 — Transmitter output for UART2.

I/O SDA2 — I2C2 data input/output (this is not an open-drain pin).

OMAT3[0] — Match output for Timer 3, channel 0.

P0[11]/RXD2/

SCL2/MAT3[1] 100[1] R14[1] I/O P0[11] — General purpose digital input/outpu t pin.

IRXD2 — Receiver input for UART2.

I/O SCL2 — I2C2 clock input/output (this is not an open-drain pin).

OMAT3[1] — Match output for Timer 3, channel 1.

P0[12]/

USB_PPWR2/

MISO1/AD0[6]

41[3] R1[3] I/O P0[12] — General purpose digital input/output pin.

OUSB_PPWR2 — Port Power enable signal for USB port 2.

I/O MISO1 — Master In Slave Out for SSP1.

IAD0[6] — A/D converter 0, input 6.

P0[13]/

USB_UP_LED2/

MOSI1/AD0[7]

45[3] R2[3] I/O P0[13] — General purpose digital input/output pin.

OUSB_UP_LED2 — USB port 2 GoodLink LED indicator. It is LOW when

device is configured (non-control endpoints enabled), or when host is

enabled and has dete cted a device on the bus. It is HIGH when the

device is not configured, or when host is enabled and has not detected a

device on the bus, or during global suspend. It transitions between LOW

and HIGH (flashes) when host is enabled and detects activity on the bus.

I/O MOSI1 — Master Out Slave In for SSP1.

IAD0[7] — A/D converter 0, input 7.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 11 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P0[14]/

USB_HSTEN2/

USB_CONNECT2/

SSEL1

69[1] T7[1] I/O P0[14] — General purpose digital input/output pin.

OUSB_HSTEN2 — Host Enabled status for USB port 2.

OUSB_CONNECT2 — SoftConnect control for USB port 2. Signal used to

switch an external 1.5 k resistor unde r software control. Used with the

SoftConnect USB feature.

I/O SSEL1 — Slave Select for SSP1.

P0[15]/TXD1/

SCK0/SCK 128[1] J16[1] I/O P0[15] — General purpose digital input/output pin.

OTXD1 — Transmitter output for UART1.

I/O SCK0 — Serial clock for SSP0.

I/O SCK — Serial clock for SPI.

P0[16]/RXD1/

SSEL0/SSEL 130[1] J14[1] I/O P0[16] — General purpose digital input/output pin.

IRXD1 — Receiver input for UART1.

I/O SSEL0 — Slave Select for SSP0.

I/O SSEL — Slave Select for SPI.

P0[17]/CTS1/

MISO0/MISO 126[1] K17[1] I/O P0[17] — General purpose digital input/output pin.

ICTS1 — Clear to Send input for UART1.

I/O MISO0 — Master In Slave Out for SSP0.

I/O MISO — Master In Slave Out for SPI.

P0[18]/DCD1/

MOSI0/MOSI 124[1] K15[1] I/O P0[18] — General purpose digital input/output pin.

IDCD1 — Data Carrier Detect input for UART1.

I/O MOSI0 — Master Out Slave In for SSP0.

I/O MOSI — Master Out Slave In for SPI.

P0[19]/DSR1/

MCICLK/SDA1 122[1] L17[1] I/O P0[19] — General purpose digital input/output pi n.

IDSR1 — Data Set Ready input for UART1.

OMCICLK — Clock output line for SD/MMC interface.

I/O SDA1 — I2C1 data input/output (this is not an open-drain pin).

P0[20]/DTR1/

MCICMD/SCL1 120[1] M17[1] I/O P0[20] — General purpose digital input/output pin.

ODTR1 — Data Terminal Ready output for UART1.

I/O MCICMD — Command line for SD/MMC interface.

I/O SCL1 — I2C1 clock input/output (this is not an open-drain pin).

P0[21]/RI1/

MCIPWR/RD1 118[1] M16[1] I/O P0[21] — General purpose digital input/output pin.

IRI1 — Ring Indicator input for UART1.

OMCIPWR — Power Supply Enable for external SD/MMC power supply.

IRD1 — CAN1 receiver input.

P0[22]/RTS1/

MCIDAT0/TD1 116[1] N17[1] I/O P0[22] — General purpose digital input/output pin.

ORTS1 — Request to Send output for UART1.

I/O MCIDAT0 — Data line 0 for SD/MMC interface.

OTD1 — CAN1 transmitter output.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 12 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P0[23]/AD0[0]/

I2SRX_CLK/

CAP3[0]

18[3] H1[3] I/O P0[23] — General purpose digital input/output pin.

IAD0[0] — A/D converter 0, input 0.

I/O I2SRX_CLK — Receive Clock. It is driven by the master and received by

the slave. Corresponds to the signal SCK in the I2S-bus specification.

ICAP3[0] — Capture input for T imer 3, channel 0.

P0[24]/AD0[1]/

I2SRX_WS/

CAP3[1]

16[3] G2[3] I/O P0[24] — General purpose digital input/output pin.

IAD0[1] — A/D converter 0, input 1.

I/O I2SRX_WS — Receive Word Select. It is driven by the master and

received by the slave. Corresponds to the signal WS in the I2S-bus

specification.

ICAP3[1] — Capture input for T imer 3, channel 1.

P0[25]/AD0[2]/

I2SRX_SDA/

TXD3

14[3] F1[3] I/O P0[25] — General purpose digital input/output pin.

IAD0[2] — A/D converter 0, input 2.

I/O I2SRX_SDA — Receive data. It is driven by the transmitter and read by

the receiver. Corresponds to the signal SD in the I2S-bus specification.

OTXD3 — Transmitter output for UART3.

P0[26]/AD0[3]/

AOUT/RXD3 12[3][4] E1[3][4] I/O P0[26] — General purpose digital input/output pi n.

IAD0[3] — A/D converter 0, input 3.

OAOUT — D/A converter output.

IRXD3 — Receiver input for UART3.

P0[27]/SDA0 50[5] T1[5] I/O P0[27] — General purpose digital input/output pin.

I/O SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus

compliance).

P0[28]/SCL0 48[5] R3[5] I/O P0[28] — General purpose digital input/output pin.

I/O SCL0 — I2C0 clock input/output. Open-drain ou tput (for I2C-bus

compliance).

P0[29]/USB_D+1 61[6] U4[6] I/O P0[29] — General purpose digital input/output pi n.

I/O USB_D+1 — USB port 1 bidirectional D+ line.

P0[30]/USB_D162

[6] R6[6] I/O P0[30] — General purpose digital input/output pin.

I/O USB_D1 — USB port 1 bidirectional D line.

P0[31]/USB_D+2 51[6] T2[6] I/O P0[31] — General purpose digital input/output pin.

I/O USB_D+2 — USB port 2 bidirectional D+ line.

P1[0] to P1[31] I/O Port 1: Port 1 is a 32 bit I/O port with individual direction controls for each

bit. The operation of port 1 pins depends upon the pin function selected

via the pin connect block.

P1[0]/

ENET_TXD0 196[1] A3[1] I/O P1[0] — General purpose digital input/output pin.

OENET_TXD0 — Ethernet transmit data 0 (RMII/MII interface).

P1[1]/

ENET_TXD1 194[1] B5[1] I/O P1[1] — General purpose digi tal input/output pin.

OENET_TXD1 — Ethernet transmit data 1 (RMII/MII interface).

P1[2]/

ENET_TXD2/

MCICLK/

PWM0[1]

185[1] D9[1] I/O P1[2] — General purpose digi tal input/output pin.

OENET_TXD2 — Ethernet transmit data 2 (MII interface).

OMCICLK — Clock output line for SD/MMC interface.

OPWM0[1] — Pulse Width Modulator 0, output 1.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 13 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P1[3]/

ENET_TXD3/

MCICMD/

PWM0[2]

177[1] A10[1] I/O P1[3] — General purpose digital input/output pin.

OENET_TXD3 — Ethernet transmit data 3 (MII interface).

I/O MCICMD — Command line for SD/MMC interface.

OPWM0[2] — Pulse Width Modulator 0, output 2.

P1[4]/

ENET_TX_EN 192[1] A5[1] I/O P1[4] — General purpose digi tal input/output pin.

OENET_TX_EN — Ethernet transmit data enable (RMII/MII interface).

P1[5]/

ENET_TX_ER/

MCIPWR/

PWM0[3]

156[1] A17[1] I/O P1[5] — General purpose digital input/output pin.

OENET_TX_ER — Ethernet Transmit Error (MII interface).

OMCIPWR — Power Supply Enable for external SD/MMC power supply.

OPWM0[3] — Pulse Width Modulator 0, output 3.

P1[6]/

ENET_TX_CLK/

MCIDAT0/

PWM0[4]

171[1] B11[1] I/O P1[6] — General purpose digital input/output pin.

IENET_TX_CLK — Ethernet Tran smit Clock (MII interface).

I/O MCIDAT0 — Data line 0 for SD/MMC interface.

OPWM0[4] — Pulse Width Modulator 0, output 4.

P1[7]/

ENET_COL/

MCIDAT1/

PWM0[5]

153[1] D14[1] I/O P1[7] — General purpose digital input/output pin.

IENET_COL — Ethernet Collision detect (MII interface).

I/O MCIDAT1 — Data line 1 for SD/MMC interface.

OPWM0[5] — Pulse Width Modulator 0, output 5.

P1[8]/

ENET_CRS_DV/

ENET_CRS

190[1] C7[1] I/O P1[8] — General purpose digi tal input/output pin.

IENET_CRS_DV/ENET_CRS — Ethernet Carrier Sense/Data V alid (RMII

interface)/ Ethernet Carrier Sense (MII interface).

P1[9]/

ENET_RXD0 188[1] A6[1] I/O P1[9] — General purpose digital input/output pin.

IENET_RXD0 — Ethernet receive data 0 (RMII/MII interface).

P1[10]/

ENET_RXD1 186[1] C8[1] I/O P1[10] — General purpose digital input/output pin.

IENET_RXD1 — Ethernet receive data 1 (RMII/MII interface).

P1[11]/

ENET_RXD2/

MCIDAT2/

PWM0[6]

163[1] A14[1] I/O P1[11] — General purpose digital input/output pin.

IENET_RXD2 — Ethernet Receive Data 2 (MII interface).

I/O MCIDAT2 — Data line 2 for SD/MMC interface.

OPWM0[6] — Pulse Width Modulator 0, output 6.

P1[12]/

ENET_RXD3/

MCIDAT3/

PCAP0[0]

157[1] A16[1] I/O P1[12] — General purpose digital input/output pin.

IENET_RXD3 — Ethernet Receive Data (MII interface).

I/O MCIDAT3 — Data line 3 for SD/MMC interface.

IPCAP0[0] — Capture input for PWM0, channel 0.

P1[13]/

ENET_RX_DV 147[1] D16[1] I/O P1[13] — General purpose digital input/output pin.

IENET_RX_DV — Ethernet Receive Data Valid (MII interface).

P1[14]/

ENET_RX_ER 184[1] A7[1] I/O P1[14] — General purpose digital input/output pin.

IENET_RX_ER — Ethernet receive error (RMII/MII interface).

P1[15]/

ENET_REF_CLK/

ENET_RX_CLK

182[1] A8[1] I/O P1[15] — General purpose dig ital input/output pin.

IENET_REF_CLK/ENET_RX_CLK — Ethernet Reference Clock (RMII

interface)/ Ethernet Receive Clock (MII interface).

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 14 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P1[16]/

ENET_MDC 180[1] D10[1] I/O P1[16] — General purpose digital input/output pin.

OENET_MDC — Ethernet MIIM clock.

P1[17]/

ENET_MDIO 178[1] A9[1] I/O P1[17] — General purpose digital input/output pin.

I/O ENET_MDIO — Ethernet MIIM data input and output.

P1[18]/

USB_UP_LED1/

PWM1[1]/CAP1[0]

66[1] P7[1] I/O P1[18] — General purpose digital input/output pin.

OUSB_UP_LED1 — USB port 1 GoodLink LED indicator. It is LOW when

device is configured (non-control endpoints enabled), or when host is

enabled and has dete cted a device on the bus. It is HIGH when the

device is not configured, or when host is enabled and has not detected a

device on the bus, or during global suspend. It transitions between LOW

and HIGH (flashes) when host is enabled and detects activity on the bus.

OPWM1[1] — Pulse Width Modulator 1, channel 1 output.

ICAP1[0] — Capture input for T imer 1, channel 0.

P1[19]/

USB_TX_E1/

USB_PPWR1/

CAP1[1]

68[1] U6[1] I/O P1[19] — General purpose digital input/output pin.

OUSB_TX_E1 — Tr ansmit Enable signal for USB port 1 (OTG

transceiver).

OUSB_PPWR1 — Port Power enable signal for USB port 1.

ICAP1[1] — Capture input for T imer 1, channel 1.

P1[20]/

USB_TX_DP1/

LCDVD[6]/

LCDVD[10]/

PWM1[2]/SCK0

70[1] U7[1] I/O P1[20] — General purpose digital input/output pin.

OUSB_TX_DP1 — D+ transmit data for USB port 1 (OTG transceiver).[7]

OLCDVD[6]/LCDVD[10] — LCD data.[7]

OPWM1[2] — Pulse Width Modulator 1, channel 2 output.

I/O SCK0 — Serial clock for SSP0.

P1[21]/

USB_TX_DM1/

LCDVD[7]/

LCDVD[11]/

PWM1[3]/SSEL0

72[1] R8[1] I/O P1[21] — General purpose digital input/output pin.

OUSB_TX_DM1 — D transmit data for USB port 1 (OTG transceiver).[7]

OLCDVD[7]/LCDVD[11 ] — LCD data. [7]

OPWM1[3] — Pulse Width Modulator 1, channel 3 output.

I/O SSEL0 — Slave Select for SSP0.

P1[22]/USB_RCV1/

LCDVD[8]/

LCDVD[12]/

USB_PWRD1/

MAT1[0]

74[1] U8[1] I/O P1[22] — General purpose digital input/output pin.

IUSB_RCV1 — Differential receive data for USB port 1 (OTG

transceiver).[7]

OLCDVD[8]/LCDVD[12] — LCD data.[7]

IUSB_PWRD1 — Power Status for USB port 1 (host power switch).

OMAT1[0] — Match output for Timer 1, channel 0.

P1[23]/

USB_RX_DP1/

LCDVD[9]/

LCDVD[13]/

PWM1[4]/MISO0

76[1] P9[1] I/O P1[23] — General purpose digital input/output pin.

IUSB_RX_DP1 — D+ receive data for USB port 1 (OTG transceiver).[7]

OLCDVD[9]/LCDVD[13] — LCD data.[7]

OPWM1[4] — Pulse Width Modulator 1, channel 4 output.

I/O MISO0 — Master In Slave Out for SSP0.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 15 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P1[24]/

USB_RX_DM1/

LCDVD[10]/

LCDVD[14]/

PWM1[5]/MOSI0

78[1] T9[1] I/O P1[24] — General purpose digital input/output pin.

IUSB_RX_DM1 — D receive data for USB port 1 (OTG transceiver).[7]

OLCDVD[10]/LCDVD[14] — LCD data.[7]

OPWM1[5] — Pulse Width Modulator 1, channel 5 output.

I/O MOSI0 — Master Out Slave in for SSP0.

P1[25]/USB_LS1/

LCDVD[11]/

LCDVD[15]/

USB_HSTEN1/

MAT1[1]

80[1] T10[1] I/O P1[25] — General purpose digital input/output pi n.

OUSB_LS1 — Low Speed status for USB port 1 (OTG transceiver).[7]

OLCDVD[11]/LCDVD[15] — LCD data.[7]

OUSB_HSTEN1 — Host Enabled status for USB port 1.

OMAT1[1] — Match output for Timer 1, channel 1.

P1[26]/

USB_SSPND1/

LCDVD[12]/

LCDVD[20]/

PWM1[6]/CAP0[0]

82[1] R10[1] I/O P1[26] — General purpose digital input/output pin.

OUSB_SSPND1 — USB port 1 Bus Suspend status (OTG transceiver).[7]

OLCDVD[12]/LCDVD[20] — LCD data.[7]

OPWM1[6] — Pulse Width Modulator 1, channel 6 output.

ICAP0[0] — Capture input for T imer 0, channel 0.

P1[27]/USB_INT1/

LCDVD[13]/

LCDVD[21]/

USB_OVRCR1/

CAP0[1]

88[1] T12[1] I/O P1[27] — General purpose digital input/output pin.

IUSB_INT1 — USB port 1 OTG transceiver interrupt (OTG transceiver).[7]

OLCDVD[13]/LCDVD[21] — LCD data.[7]

IUSB_OVRCR1 — USB port 1 Over-Current status.

ICAP0[1] — Capture input for T imer 0, channel 1.

P1[28]/USB_SCL1/

LCDVD[14]/

LCDVD[22]/

PCAP1[0]/MAT0[0]

90[1] T13[1] I/O P1[28] — General purpose digital input/output pi n.

I/O USB_SCL1 — USB port 1 I2C serial clock (OTG transceiver).[7]

OLCDVD[14]/LCDVD[22] — LCD data.[7]

IPCAP1[0] — Capture input for PWM1, channel 0.

OMAT0[0] — Match output for Timer 0, channel 0.

P1[29]/USB_SDA1/

LCDVD[15]/

LCDVD[23]/

PCAP1[1]/MAT0[1]

92[1] U14[1] I/O P1[29] — General purpose digital input/output pin.

I/O USB_SDA1 — USB port 1 I2C serial data (OTG transceiver).[7]

OLCDVD[15]/LCDVD[23] — LCD data.[7]

IPCAP1[1] — Capture input for PWM1, channel 1.

OMAT0[1] — Match output for Timer 0, channel 0.

P1[30]/

USB_PWRD2/

VBUS/AD0[4]

42[3] P2[3] I/O P1[30] — General purpose digital input/output pin.

IUSB_PWRD2 — Power Status for USB port 2.

IVBUS — Monitors the presence of USB bus power.

Note: This signal must be HIGH for USB reset to occur.

IAD0[4] — A/D converter 0, input 4.

P1[31]/

USB_OVRCR2/

SCK1/AD0[5]

40[3] P1[3] I/O P1[31] — General purpose digital input/outp ut pin.

IUSB_OVRCR2 — Over-Current status for USB port 2.

I/O SCK1 — Serial Clock for SSP1.

IAD0[5] — A/D converter 0, input 5.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 16 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P2[0] to P2[31] I/O Port 2: Port 2 is a 32-bit I/O port with individual direction controls for each

bit. The operation of port 2 pins depends upon the pin function selected

via the pin connect block.

P2[0]/PWM1[1]/

TXD1/TRACECLK/

LCDPWR

154[1] B17[1] I/O P2[0] — General purpose digital input/output pin.

OPWM1[1] — Pulse Width Modulator 1, channel 1 output.

OTXD1 — Transmitter output for UART1.

OTRACECLK — Trace clock.[8]

OLCDPWR — LCD panel power enable.[8]

P2[1]/PWM1[2]/

RXD1/PIPESTAT0/

LCDLE

152[1] E14[1] I/O P2[1] — General purpose digital input/output pin.

OPWM1[2] — Pulse Width Modulator 1, channel 2 output.

IRXD1 — Receiver input for UART1.

OPIPESTAT0 — Pipeline status, bit 0.[8]

OLCDLE — Line end signa l.[8]

P2[2]/PWM1[3]/

CTS1/PIPESTAT1/

LCDDCLK

150[1] D15[1] I/O P2[2] — General purpose digital input/output pin.

OPWM1[3] — Pulse Width Modulator 1, channel 3 output.

ICTS1 — Clear to Send input for UART1.

OPIPESTAT1 — Pipeline status, bit 1.[8]

OLCDDCLK — LCD panel clock.[8]

P2[3]/PWM1[4]/

DCD1/PIPESTAT2/

LCDFP

144[1] E16[1] I/O P2[3] — General purpose digital input/output pin.

OPWM1[4] — Pulse Width Modulator 1, channel 4 output.

IDCD1 — Data Carrier Detect input for UART1.

OPIPESTAT2 — Pipeline status, bit 2.[8]

OLCDFP — Frame pulse (STN). Verti c al synchronization pulse (TFT).[8]

P2[4]/PWM1[5]/

DSR1/

TRACESYNC/

LCDENAB/LCDM

142[1] D17[1] I/O P2[4] — General purpose digital input/output pin.

OPWM1[5] — Pulse Width Modulator 1, channel 5 output.

IDSR1 — Data Set Ready input for UART1.

OTRACESYNC — Trace Synchronization.[8]

OLCDENAB/LCDM — STN AC bias drive or TFT data enable output.[8]

P2[5]/PWM1[6]/

DTR1/

TRACEPKT0/

LCDLP

140[1] F16[1] I/O P2[5] — General purpose digital input/output pin.

OPWM1[6] — Pulse Width Modulator 1, channel 6 output.

ODTR1 — Data Terminal Ready output for UART1.

OTRACEPKT0 — Trace Packet, bit 0.[8]

OLCDLP — Line synchronization pulse (STN). Horizontal synchronization

pulse (TFT).[8]

P2[6]/PCAP1[0]/

RI1/

TRACEPKT1/

LCDVD[0]/

LCDVD[4]

138[1] E17[1] I/O P2[6] — General purpose digital input/output pin.

IPCAP1[0] — Capture input for PWM1, channel 0.

IRI1 — Ring Indicator input for UART1.

OTRACEPKT1 — Trace Packet, bit 1.[8]

OLCDVD[0]/LCDVD[4] — LCD data.[8]

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 17 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P2[7]/RD2/

RTS1/

TRACEPKT2/

LCDVD[1]/

LCDVD[5]

136[1] G16[1] I/O P2[7] — General purpose digital input/output pin.

IRD2 — CAN2 receiver input.

ORTS1 — Request to Send output for UART1.

OTRACEPKT2 — Trace Packet, bit 2.[8]

OLCDVD[1]/LCDVD[5] — LCD data.[8]

P2[8]/TD2/TXD2/

TRACEPKT3/

LCDVD[2]/

LCDVD[6]

134[1] H15[1] I/O P2[8] — General purpose digital input/output pin.

OTD2 — CAN2 transmitter output.

OTXD2 — Transmitter output for UART2.

OTRACEPKT3 — Trace packet, bit 3.[8]

OLCDVD[2]/LCDVD[6] — LCD data.[8]

P2[9]/

USB_CONNECT1/

RXD2/EXTIN0/

LCDVD[3]/

LCDVD[7]

132[1] H16[1] I/O P2[9] — General purpose digital input/output pin.

OUSB_CONNECT1 — USB1 SoftConnect control. Signal used to switch

an external 1.5 k resistor under the software control. Used with the

SoftConnect USB feature.

IRXD2 — Receiver input for UART2.

IEXTIN0 — External Tr igger Input.[8]

ILCDVD[3]/LCDVD[7] — LCD data.[8]

P2[10]/EINT0 110[9] N15[9] I/O P2[10] — General purpose digital input/output pi n.

Note: LOW on this pin while RESET is LOW forces on-chip bootloader to

take over control of the part after a reset.

IEINT0 — External interrupt 0 input.

P2[11]/EINT1/

LCDCLKIN/

MCIDAT1/

I2STX_CLK

108[9] T17[9] I/O P2[11] — General purpose digital input/output pin.

IEINT1 — External interrupt 1 input.[10]

OLCDCLKIN — LCD clock.[10]

I/O MCIDAT1 — Data line 1 for SD/MMC interface.

I/O I2STX_CLK — T ransmit Clock. It is driven by the master and received by

the slave. Corresponds to the signal SCK in the I2S-bus specification.

P2[12]/EINT2/

LCDVD[4]/

LCDVD[3]/

LCDVD[8]/

LCDVD[18]/

MCIDAT2/

I2STX_WS

106[9] N14[9] I/O P2[12] — General purpose digital input/output pin.

IEINT2 — External interrupt 2 input.[10]

OLCDVD[4]/LCDVD[3]/LCDVD[8]/LCDVD[18] — LCD data.[10]

I/O MCIDAT2 — Data line 2 for SD/MMC interface.

I/O I2STX_WS — Transmit Word Select. It is driven by the master and

received by the slave. Corresponds to the signal WS in the I2S-bus

specification.

P2[13]/EINT3/

LCDVD[5]/

LCDVD[9]/

LCDVD[19]/

MCIDAT3/

I2STX_SDA

102[9] T16[9] I/O P2[13] — General purpose digital input/outp ut pin.

IEINT3 — External interrupt 3 input.[10]

OLCDVD[5]/LCDVD[9]/LCDVD[19] — LCD data.[10]

I/O MCIDAT3 — Data line 3 for SD/MMC interface.

I/O I2STX_SDA — Transmit data. It is driven by the transmitter and read by

the receiver. Corresponds to the signal SD in the I2S-bus specification.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 18 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P2[14]/CS2/

CAP2[0]/SDA1 91[9] R12[9] I/O P2[14] — General purpose digital input/output pin.

OCS2 — LOW active Chip Select 2 signal.

ICAP2[0] — Capture input for T imer 2, channel 0.

I/O SDA1 — I2C1 data input/output (this is not an open-drain pin).

P2[15]/CS3/

CAP2[1]/SCL1 99[9] P13[9] I/O P2[15] — General purpose digital input/output pin.

OCS3 — LOW active Chip Select 3 signal.

ICAP2[1] — Capture input for T imer 2, channel 1.

I/O SCL1 — I2C1 clock input/output (this is not an open-drain pin).

P2[16]/CAS 87[1] R11[1] I/O P2[16] — General purpose digital input/output pin.

OCAS — LOW active SDRAM Column Address St robe.

P2[17]/RAS 95[1] R13[1] I/O P2[17] — General purpose digital input/outp ut pin.

ORAS — LOW active SDRAM Row Address Strobe.

P2[18]/

CLKOUT0 59[1] U3[1] I/O P2[18] — General purpose digital input/output pin.

OCLKOUT0 — SDRAM clock 0.

P2[19]/

CLKOUT1 67[1] R7[1] I/O P2[19] — General purpose digital input/output pin.

OCLKOUT1 — SDRAM clock 1.

P2[20]/DYCS0 73[1] T8[1] I/O P2[20] — General purpose digital input/output pin.

ODYCS0 — SDRAM chip select 0.

P2[21]/DYCS1 81[1] U11[1] I/O P2[21] — General purpose digital input/output pin.

ODYCS1 — SDRAM chip select 1.

P2[22]/DYCS2/

CAP3[0]/SCK0 85[1] U12[1] I/O P2[22] — General purpose digital input/output pin.

ODYCS2 — SDRAM chip select 2.

ICAP3[0] — Capture input for T imer 3, channel 0.

I/O SCK0 — Serial clock for SSP0.

P2[23]/DYCS3/

CAP3[1]/SSEL0 64[1] U5[1] I/O P2[23] — General purpose digital input/output pi n.

ODYCS3 — SDRAM chip select 3.

ICAP3[1] — Capture input for T imer 3, channel 1.

I/O SSEL0 — Slave Select for SSP0.

P2[24]/

CKEOUT0 53[1] P5[1] I/O P2[24] — General purpose digital input/output pin.

OCKEOUT0 — SDRAM clock enable 0.

P2[25]/

CKEOUT1 54[1] R4[1] I/O P2[25] — General purpose digital input/output pin.

OCKEOUT1 — SDRAM clock enable 1.

P2[26]/

CKEOUT2/

MAT3[0]/MISO0

57[1] T4[1] I/O P2[26] — General purpose digital input/output pin.

OCKEOUT2 — SDRAM clock enable 2.

OMAT3[0] — Match output for Timer 3, channel 0.

I/O MISO0 — Master In Slave Out for SSP0.

P2[27]/

CKEOUT3/

MAT3[1]/MOSI0

47[1] P3[1] I/O P2[27] — General purpose digital input/output pin.

OCKEOUT3 — SDRAM clock enable 3.

OMAT3[1] — Match output for Timer 3, channel 1.

I/O MOSI0 — Master Out Slave In for SSP0.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 19 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P2[28]/

DQMOUT0 49[1] P4[1] I/O P2[28] — General purpose digital input/output pin.

ODQMOUT0 — Data mask 0 used with SDRAM and static devices.

P2[29]/

DQMOUT1 43[1] N3[1] I/O P2[29] — General purpose digital input/ou tput pin.

ODQMOUT1 — Data mask 1 used with SDRAM and static devices.

P2[30]/

DQMOUT2/

MAT3[2]/SDA2

31[1] L4[1] I/O P2[30] — General purpose digital input/output pin.

ODQMOUT2 — Data mask 2 used with SDRAM and static devices.

OMAT3[2] — Match output for Timer 3, channel 2.

I/O SDA2 — I2C2 data input/output (this is not an open-drain pin).

P2[31]/

DQMOUT3/

MAT3[3]/SCL2

39[1] N2[1] I/O P2[31] — General purpose digital input/output pin.

ODQMOUT3 — Data mask 3 used with SDRAM and static devices.

OMAT3[3] — Match output for Timer 3, channel 3.

I/O SCL2 — I2C2 clock input/output (this is not an open-drain pin).

P3[0] to P3[31] I/O Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each

bit. The operation of port 3 pins depends upon the pin function selected

via the pin connect block.

P3[0]/D0 197[1] B4[1] I/O P3[0] — General purpose digital input/output pin.

I/O D0 — External memory data line 0.

P3[1]/D1 201[1] B3[1] I/O P3[1] — General purpose digital input/output pin.

I/O D1 — External memory data line 1.

P3[2]/D2 207[1] B1[1] I/O P3[2] — General purpose digital input/output pin.

I/O D2 — External memory data line 2.

P3[3]/D3 3[1] E4[1] I/O P3[3] — General purpose digital input/output pin.

I/O D3 — External memory data line 3.

P3[4]/D4 13[1] F2[1] I/O P3[4] — General purpose digi tal input/output pin.

I/O D4 — External memory data line 4.

P3[5]/D5 17[1] G1[1] I/O P3[5] — General purpose digi tal input/output pin.

I/O D5 — External memory data line 5.

P3[6]/D6 23[1] J1[1] I/O P3[6] — General purpose digital input/output pin.

I/O D6 — External memory data line 6.

P3[7]/D7 27[1] L1[1] I/O P3[7] — General purpose digital input/output pin.

I/O D7 — External memory data line 7.

P3[8]/D8 191[1] D8[1] I/O P3[8] — General purpose digital input/output pin.

I/O D8 — External memory data line 8.

P3[9]/D9 199[1] C5[1] I/O P3[9] — General purpose digital input/output pin.

I/O D9 — External memory data line 9.

P3[10]/D10 205[1] B2[1] I/O P3[10] — General purpose digital input/output pin.

I/O D10 — External memory data line 10.

P3[11]/D11 208[1] D5[1] I/O P3[11] — General purpose digital input/output pin.

I/O D11 — External memo ry data line 11.

P3[12]/D12 1[1] D4[1] I/O P3[12] — General purpose digital input/output pin.

I/O D12 — External memory data line 12.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 20 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P3[13]/D13 7[1] C1[1] I/O P3[13] — General purpose digital input/outp ut pin.

I/O D13 — External memory data line 13.

P3[14]/D14 21[1] H2[1] I/O P3[14] — General purpose digital input/output pin.

I/O D14 — External memory data line 14. On POR, this pin serves as the

BOOT0 pin.

P3[15]/D15 28[1] M1[1] I/O P3[15] — General purpose digital input/output pin.

I/O D15 — External memory data line 15. On POR, this pin serves as the

BOOT1 pin.

BOOT[1:0] = 00 selects 8-bit external memory on CS1.

BOOT[1:0] = 01 is reserved. Do not use.

BOOT[1:0] = 10 selects 32-bit external memory on CS1.

BOOT[1:0] = 11 selects 16-bit external memory on CS1.

P3[16]/D16/

PWM0[1]/TXD1 137[1] F17[1] I/O P3[16] — General purpose digital input/output pin.

I/O D16 — External memory data line 16.

OPWM0[1] — Pulse Width Modulator 0, output 1.

OTXD1 — Transmitter output for UART1.

P3[17]/D17/

PWM0[2]/RXD1 143[1] F15[1] I/O P3[17] — General purpose digital input/output pin.

I/O D17 — External memory data line 17.

OPWM0[2] — Pulse Width Modulator 0, output 2.

IRXD1 — Receiver input for UART1.

P3[18]/D18/

PWM0[3]/CTS1 151[1] C15[1] I/O P3[18] — General purpose digital input/output pin.

I/O D18 — External memory data line 18.

OPWM0[3] — Pulse Width Modulator 0, output 3.

ICTS1 — Clear to Send input for UART1.

P3[19]/D19/

PWM0[4]/DCD1 161[1] B14[1] I/O P3[19] — General purpose digital input/output pin.

I/O D19 — External memory data line 19.

OPWM0[4] — Pulse Width Modulator 0, output 4.

IDCD1 — Data Carrier Detect input for UART1.

P3[20]/D20/

PWM0[5]/DSR1 167[1] A13[1] I/O P3[20] — General purpose digital input/output pin.

I/O D20 — External memory data line 20.

OPWM0[5] — Pulse Width Modulator 0, output 5.

IDSR1 — Data Set Ready input for UART1.

P3[21]/D21/

PWM0[6]/DTR1 175[1] C10[1] I/O P3[21] — General purpose digital input/output pin.

I/O D21 — External memory data line 21.

OPWM0[6] — Pulse Width Modulator 0, output 6.

ODTR1 — Data Terminal Ready output for UART1.

P3[22]/D22/

PCAP0[0]/RI1 195[1] C6[1] I/O P3[22] — General purpose digital input/output pin.

I/O D22 — External memory data line 22.

IPCAP0[0] — Capture input for PWM0, channel 0.

IRI1 — Ring Indicator input for UART1.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 21 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P3[23]/D23/

CAP0[0]/

PCAP1[0]

65[1] T6[1] I/O P3[23] — General purpose digital input/output pin.

I/O D23 — External memory data line 23.

ICAP0[0] — Capture input for T imer 0, channel 0.

IPCAP1[0] — Capture input for PWM1, channel 0.

P3[24]/D24/

CAP0[1]/

PWM1[1]

58[1] R5[1] I/O P3[24] — General purpose digital input/output pin.

I/O D24 — External memory data line 24.

ICAP0[1] — Capture input for T imer 0, channel 1.

OPWM1[1] — Pulse Width Modulator 1, output 1.

P3[25]/D25/

MAT0[0]/

PWM1[2]

56[1] U2[1] I/O P3[25] — General purpose digital input/output pin.

I/O D25 — External memory data line 25.

OMAT0[0] — Match output for Timer 0, channel 0.

OPWM1[2] — Pulse Width Modulator 1, output 2.

P3[26]/D26/

MAT0[1]/

PWM1[3]

55[1] T3[1] I/O P3[26] — General purpose digital input/output pin.

I/O D26 — External memory data line 26.

OMAT0[1] — Match output for Timer 0, channel 1.

OPWM1[3] — Pulse Width Modulator 1, output 3.

P3[27]/D27/

CAP1[0]/

PWM1[4]

203[1] A1[1] I/O P3[27] — General purpose digital input/output pin.

I/O D27 — External memory data line 27.

ICAP1[0] — Capture input for T imer 1, channel 0.

OPWM1[4] — Pulse Width Modulator 1, output 4.

P3[28]/D28/

CAP1[1]/

PWM1[5]

5[1] D2[1] I/O P3[28] — General purpose digital input/output pin.

I/O D28 — External memory data line 28.

ICAP1[1] — Capture input for T imer 1, channel 1.

OPWM1[5] — Pulse Width Modulator 1, output 5.

P3[29]/D29/

MAT1[0]/

PWM1[6]

11[1] F3[1] I/O P3[29] — General purpose digital input/output pin.

I/O D29 — External memory data line 29.

OMAT1[0] — Match output for Timer 1, channel 0.

OPWM1[6] — Pulse Width Modulator 1, output 6.

P3[30]/D30/

MAT1[1]/

RTS1

19[1] H3[1] I/O P3[30] — General purpose digital input/output pin.

I/O D30 — External memory data line 30.

OMAT1[1] — Match output for Timer 1, channel 1.

ORTS1 — Request to Send output for UART1.

P3[31]/D31/

MAT1[2] 25[1] J3[1] I/O P3[31] — General purpose digital input/outp ut pin.

I/O D31 — External memory data line 31.

OMAT1[2] — Match output for Timer 1, channel 2.

P4[0] to P4[31] I/O Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each

bit. The operation of port 4 pins depends upon the pin function selected

via the pin connect block.

P4[0]/A0 75[1] U9[1] I/O P4[0] — ]General purpose digital input/output pin.

I/O A0 — External memory address line 0.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 22 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P4[1]/A1 79[1] U10[1] I/O P4[1] — General purpose digital input/output pin.

I/O A1 — External memory address line 1.

P4[2]/A2 83[1] T11[1] I/O P4[2] — General purpo se digital input/output pin.

I/O A2 — External memory address line 2.

P4[3]/A3 97[1] U16[1] I/O P4[3] — General purpose digital input/output pin.

I/O A3 — External memory address line 3.

P4[4]/A4 103[1] R15[1] I/O P4[4] — General purpose digital input/output pin.

I/O A4 — External memory address line 4.

P4[5]/A5 107[1] R16[1] I/O P4[5] — General purpose digital input/output pin.

I/O A5 — External memory address line 5.

P4[6]/A6 113[1] M14[1] I/O P4[6] — General purpose digital input/output pin.

I/O A6 — External memory address line 6.

P4[7]/A7 121[1] L16[1] I/O P4[7] — General purpose digital input/output pin.

I/O A7 — External memory address line 7.

P4[8]/A8 127[1] J17[1] I/O P4[8] — General purpose digital input/output pin.

I/O A8 — External memory address line 8.

P4[9]/A9 131[1] H17[1] I/O P4[9] — General purpose digital input/output pin.

I/O A9 — External memory address line 9.

P4[10]/A10 135[1] G17[1] I/O P4[10] — General purpose digital input/output pin.

I/O A10 — External memory address line 10.

P4[11]/A11 145[1] F14[1] I/O P4[11] — General purpose digital input/output pin.

I/O A11 — External memo ry address line 11.

P4[12]/A12 149[1] C16[1] I/O P4[12] — General purpose digital input/output pin.

I/O A12 — External memory address line 12.

P4[13]/A13 155[1] B16[1] I/O P4[13] — General purpose digital input/outp ut pin.

I/O A13 — External memory address line 13.

P4[14]/A14 159[1] B15[1] I/O P4[14] — General purpose digital input/outp ut pin.

I/O A14 — External memory address line 14.

P4[15]/A15 173[1] A11[1] I/O P4[15] — General purpose digital input/output pi n.

I/O A15 — External memory address line 15.

P4[16]/A16 101[1] U17[1] I/O P4[16] — General purpose digital input/ou tput pin.

I/O A16 — External memory address line 16.

P4[17]/A17 104[1] P14[1] I/O P4[17] — General purpose digital input/outp ut pin.

I/O A17 — External memory address line 17.

P4[18]/A18 105[1] P15[1] I/O P4[18] — General purpose digital input/outp ut pin.

I/O A18 — External memory address line 18.

P4[19]/A19 111[1] P16[1] I/O P4[19] — General purpose digital input/output pin.

I/O A19 — External memory address line 19.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 23 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

P4[20]/A20/

SDA2/SCK1 109[1] R17[1] I/O P4[20] — General purpose digital input/output pin.

I/O A20 — External memory address line 20.

I/O SDA2 — I2C2 data input/output (this is not an open-drain pin).

I/O SCK1 — Serial Clock for SSP1.

P4[21]/A21/

SCL2/SSEL1 115[1] M15[1] I/O P4[21] — General purpose digital input/output pin.

I/O A21 — External memory address line 21.

I/O SCL2 — I2C2 clock input/output (this is not an open-drain pin).

I/O SSEL1 — Slave Select for SSP1.

P4[22]/A22/

TXD2/MISO1 123[1] K14[1] I/O P4[22] — General purpose digital input/output pin.

I/O A22 — External memory address line 22.

OTXD2 — Transmitter output for UART2.

I/O MISO1 — Master In Slave Out for SSP1.

P4[23]/A23/

RXD2/MOSI1 129[1] J15[1] I/O P4[23] — General purpose dig ital input/ou tput pin.

I/O A23 — External memory address line 23.

IRXD2 — Receiver input for UART2.

I/O MOSI1 — Master Out Slave In for SSP1.

P4[24]/OE 183[1] B8[1] I/O P4[24] — General purpose digital input/outp ut pin.

OOE — LOW active Output Enable signal.

P4[25]/WE 179[1] B9[1] I/O P4[25] — General purpose digital input/outp ut pin.

OWE — LOW active Write Enable signal.

P4[26]/BLS0 119[1] L15[1] I/O P4[26] — General purpose digital input/output pin.

OBLS0 — LOW active Byte Lane Sele ct signal 0.

P4[27]/BLS1 139[1] G15[1] I/O P4[27] — General purpose digital input/output pin.

OBLS1 — LOW active Byte Lane Sele ct signal 1.

P4[28]/BLS2/

MAT2[0]/LCDVD[6]/

LCDVD[10]/

LCDVD[2]/

TXD3

170[1] C11[1] I/O P4[28] — General purpose digital input/output pin.

OBLS2 — LOW active Byte Lane Sele ct signal 2.

OMAT2[0] — Match output for Timer 2, channel 0.[11]

OLCDVD[6]/LCDVD[10]/LCDVD[2] — LCD data.[11]

OTXD3 — Transmitter output for UART3.

P4[29]/BLS3/

MAT2[1]

LCDVD[7]/

LCDVD[11]/

LCDVD[3]/RXD3

176[1] B10[1] I/O P4[29] — General purpose digital input/output pin.

OBLS3 — LOW active Byte Lane Sele ct signal 3.

OMAT2[1] — Match output for Timer 2, channel 1.[11]

OLCDVD[7]/LCDVD[11]/LCDVD[3] — LCD data.[11]

IRXD3 — Receiver input for UART3.

P4[30]/CS0 187[1] B7[1] I/O P4[30] — General purpose digital input/output pin.

OCS0 — LOW active Chip Select 0 signal.

P4[31]/CS1 193[1] A4[1] I/O P4[31] — General purpose digital input/output pin.

OCS1 — LOW active Chip Select 1 signal.

ALARM 37[13] N1[13] OALARM — RTC controlled output. This is a 1.8 V pin. It goes HIGH when

a RTC alarm is generated.

USB_D2 52 U1 I/O USB_D2 — USB port 2 bidirectional D line.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 24 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

DBGEN 9[1][16] F4[1][16] IDBGEN — JTAG interface control signal. Also used for boundary

scanning.

TDO 2[1][17] D3[1][17] OTDO — Test Data Out for JTAG interface.

TDI 4[1][16] C2[1][16] ITDI — Test Data In for JTAG interface.

TMS 6[1][16] E3[1][16] ITMS — Test Mode Select for JTAG interface.

TRST 8[1][16] D1[1][16] ITRST — Test Reset for JTAG interface.

TCK 10[1][17] E2[1][17] ITCK — Test Clock for JTAG interface. This clock must be slower than 1⁄6

of the CPU clock (CCLK) for the JTAG interface to operate.

RTCK 206[1][16] C3[1][16] I/O RTCK — JTAG interface control signal.

Note: LOW on this pin while RESET is LOW enables ETM pins (P2[9:0])

to operate as Trace port after reset.

RSTOUT 29 K3 O RSTOUT — This is a 3.3 V pin. LOW on this pin indicates LPC2470

being in Reset state.

RESET 35[12] M2[12] Iexternal reset input: A LOW on this pin resets the device, causing I/O

ports and peripherals to take on their default states, and processor

execution to begin at address 0. TTL with hysteresis, 5 V tolerant.

XTAL1 44[13][14] M4[13][14] I Input to the oscillator circuit and internal clock generator circuits.

XTAL2 46[13][14] N4[13][14] O Output from th e oscillator ampli f ier.

RTCX1 34[13][15] K2[13][15] I Input to the RTC oscillator circuit.

RTCX2 36[13][15] L2[13][15] O Output from the RTC oscillator circuit.

VSSIO 33, 63,

77, 93,

114,

133,

148,

169,

189,

200[13]

L3, T5,

R9, P12,

N16,

H14,

E15,

A12, B6,

A2[13]

Iground: 0 V reference for the digital IO pins.

VSSCORE 32, 84,

172[13] K4, P10,

D12[13] Iground: 0 V reference for the core.

VSSA 22[13] J2[13] Ianalog ground: 0 V reference. This should nominally be the same

voltage as VSSIO/VSSCORE, but should be isolated to minimize noise and

error.

VDD(3V3) 15, 60,

71, 89,

112,

125,

146,

165,

181,

198[13]

G3, P6,

P8, U13,

P17,

K16,

C17,

B13, C9,

D7[13]

I3.3 V supply voltage: This is the power supply voltage for the I/O ports.

n.c. 30, 117,

141[13] J4, L14,

G14[13] Inot connected pins : These pins must be left unconnected (floating).

VDD(DCDC)(3V3) 26, 86,

174[13] H4, P11,

D11[13] I3.3 V DC-to-DC converter sup pl y voltage: This is the power supply for

the on-chip DC-to-DC converter.

VDDA 20[13] G4[13] Ianalog 3.3 V pad supply voltage: This should be nominally the same

voltage as VDD(3V3) but should be isolated to minimize noise and error.

This voltage is used to power the ADC and DAC.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 25 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

[1] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.

[2] Either the I2S function or the LCD function is selectable, see Table 19, Table 20, and Table 21.

[3] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,

digital section of the pad is disabled.

[4] 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,

digital section of the pad is disabled.

[5] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. It requires an external pull-up to provide output

functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain

configuration applies to all functions on this pin.

[6] Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and

Low-speed mode only).

[7] Either the USB OTG function or the LCD function is selectable, see Table 19, Table 20, and Table 21.

[8] Either the trace function or the LCD function is selectable, see Table 19, Table 20, and Table 21.

[9] 5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.

[10] Either one of the external interrupts EINT1 to EINT3 or the LCD function is selectable, see Table 19, Table 20, and Table 21.

[11] Either one of the timer outputs MAT2[1] and MAT2[0] or the LCD function is selectable, see Table 19, Table 20, and Table 21.

[12] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.

[13] Pad provides special analog functionality.

[14] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding

is preferred to reduce susceptibility to noise). XTAL2 should be left floating.

[15] If the RTC is not used, these pins can be left floating.

[16] This pin has a built-in pull-up resistor.

[17] This pin has no built-in pull-up and no built-in pull-down resistor.

VREF 24[13] K1[13] IADC reference: This should be nominally the same voltage as VDD(3V3)

but should be isolated to minimize noise and error . The level on this pin is

used as a reference for ADC and DAC.

VBAT 38[13] M3[13] IRTC power supply: 3.3 V on this pin supplies the po wer to the R T C

peripheral.

Table 4. Pin description …continued

Symbol Pin Ball Type Description

Product data sheet Rev. 4.1 — 16 October 2013 26 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7. Functional description

7.1 Architectural overview

The LPC2470 microcontroller consists of an ARM7TDMI-S CPU with emulation support,

the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip

memory, the AMB A AHB interfacing to high-speed on-chip peripherals and external

memory, and the AMBA APB for connection to other on-chip peripheral functions. The

microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte

order.

The LPC2470 implements two AHBs in order to allow the Ethernet block to operate

without interference caused by other system activity. The primary AHB, referred to as

AHB1, includes the VIC, GPDMA controller, and EMC.

The second AHB, referred to as AHB2, includes only the Ethernet block and an

associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary

AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into

off-chip memory or unused space in memory residing on AHB1.

In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function,

and the Ethernet bl ock (via the bus bridge fr om AHB2). Bus masters with access to AHB2

are the ARM7 and the Ethernet block.

AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB

ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the

AHB address space. Lower speed peripheral functions are connected to the APB. The

AHB to APB bridge interfaces the APB to the AHB. APB peripherals are also allocated a

2 MB range of addresses, beginning at the 3.5 GB address point. Each APB peripheral is

allocated a 16 kB address space within th e APB address space.

The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers

high performance and very low power consumption. The ARM architecture is based on

Reduced Instruction Set Computer (RISC) principles, a nd the instruction set and related

decode mechanism are much simpler than those of microprogrammed complex

instruction set computers. This simplicity results in a high instructio n th ro ugh pu t an d

impressive real-time interrupt response from a small and cost-effective processor core.

Pipeline techniques are employed so that all p arts o f the processing and m emory systems

can operate continuously. Typically, while one instruction is being executed, its successor

is being decoded, and a third instruction is being fetched from memory.

The ARM7TDMI-S processor also employs a unique architectural strategy known as

Thumb, which makes it ideally suited to high-volume applications with memory

restrictions, or applications where code density is an issue.

The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the

ARM7TDMI-S processor has two instruction sets:

•the standard 32-bit ARM set

•a 16-bit Thumb s et

Product data sheet Rev. 4.1 — 16 October 2013 27 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

The Thumb set’ s 16-bit instruction length allo ws it to approach higher density comp ared to

standard ARM code while retaining most of the ARM’s performance.

7.2 On-chip SRAM

The LPC2470 includes a SRAM memory of 64 kB reserved for the ARM processor

exclusive use. This RAM may be used for code and/or dat a storage and ma y be accessed

as 8 bits, 16 bits, and 32 bits.

A 16 kB SRAM block serving as a buffer for the Ethernet controller and a 16 kB SRAM

associated with the second AHB can be used both for data and code storage, too. The

2 kB RTC SRAM can be used for data storage only. The RTC SRAM is battery powered

and retains the content in the absence of the main power supply.

7.3 Memory map

The LPC2470 me mory map incor porates seve ral distinct regi ons as shown in Table 5 and

Figure 4.

In addition, the CPU interrupt vectors may be remapped to allow them to reside in either

boot ROM or SRAM (see Section 7.26.6).

Table 5. LPC2470 memory usage and details

Address range General use Address range details and descr iption

0x0000 0000 to

0x3FFF FFFF Fast I/O 0x3FFF C000 - 0x3FFF FFFF Fast GPIO registers

0x4000 0000 to

0x7FFF FFFF On-chip RAM 0 x4000 0000 - 0x4000 FFFF R AM (64 kB)

0x7FE0 0000 - 0x7FE0 3FFF Ethernet RAM (16 kB)

0x7FD0 0000 - 0x7FD0 3FFF USB RAM (16 kB)

0x8000 0000 to

0xDFFF FFFF Off-Chip Memory Four static memory banks, 16 MB each

0x8000 0000 - 0x80FF FFFF Static memory bank 0

0x8100 0000 - 0x81FF FFFF Static memory bank 1

0x8200 0000 - 0x82FF FFFF Static memory bank 2

0x8300 0000 - 0x83FF FFFF Static memory bank 3

Four dynamic memory banks, 256 MB each

0xA000 0000 - 0xAFFF FFFF Dynamic memory bank 0

0xB000 0000 - 0xBFFF FFFF Dynamic memory bank 1

0xC000 0000 - 0xCFFF FFFF Dynamic memory bank 2

0xD000 0000 - 0xDFFF FFFF Dynamic memory bank 3

0xE000 0000 to

0xEFFF FFFF APB Peripherals 36 peripheral blocks, 16 kB each

0xF000 0000 to

0xFFFF FFFF AHB peripherals

Product data sheet Rev. 4.1 — 16 October 2013 28 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7.4 Interrupt controller

The ARM processor core has two interrup t inputs called Interrupt ReQuest (IRQ) and Fast

Interrupt ReQuest (FIQ). The VIC takes 32 interrupt request inputs which can be

programmed as FIQ or vectored IRQ types. The programmable assignment scheme

means that priorities of interrupts from the various peripherals can be dynamically

assigned and adjusted.

FIQs have the highest priority. If more than one request is assigned to FIQ, the VIC ORs

the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ

latency is achieved when only one request is classified as FIQ, because then the FIQ

Fig 4. LPC2470 memory map

0.0 GB

1.0 GB

0x0000 0000

RESERVED ADDRESS SPACE

SPECIAL REGISTERS

ON-CHIP STATIC RAM

RESERVED ADDRESS SPACE

0x4000 0000

0x3FFF 8000

0x3FFF FFFF

2.0 GB 0x8000 0000

0x7FFF FFFF

BOOT ROM

3.75 GB

4.0 GB

3.5 GB

AHB PERIPHERALS

APB PERIPHERALS 0xE000 0000

0xF000 0000

0xFFFF FFFF

002aad316

EXTERNAL STATIC AND DYNAMIC MEMORY

Product data sheet Rev. 4.1 — 16 October 2013 29 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

service routine can simply start dealing with that device. But if more than one request is

assigned to the FIQ class, the FIQ service routine can read a word from the VIC that

identifies which FIQ source(s) is (are) requesting an inte rr up t.

Vectored IRQs, which include all interrupt request s that ar e not classified as FIQs, have a

programmable interrupt priority. When more than one interrupt is assigned the same

priority and occu r simultaneously, the one connected to the lowest numbered VIC channe l

will be serviced first.

The VIC ORs the requests from all of the vectored IRQs to produce the IRQ signal to the

ARM processor. The IRQ service routine can start by reading a register from the VIC and

jumping to the address supplied by that register.

7.4.1 Interrupt sources

Each peripheral device has one interrupt line connected to the VIC but may have several

interrupt flags. Individual interrupt flags may also represent more than one interrupt

source.

Any pin on port 0 and port 2 (total of 64 pins) regardless of the selected function, can be

programmed to generate an interrupt on a rising edge, a falling edge, or both. Such

interrupt request coming from port 0 and/or port 2 will be combined with the EINT3

interrupt requests.

7.5 Pin connect block

The pin connect block allows selected pins of the microcontroller to have more than one

function. Configuration registers control the multiplexers to allow connection between the

pin and the on chip peripherals.

Peripherals should be conn ected to the appro priate pins prior to being activated and pr ior

to any related interrup t(s) being enabled. Activity of any enabled peripheral function that is

not mapped to a related pin should be considered undefined.

7.6 External memory controller

The LPC2470 EMC is an ARM PrimeCell MultiPort Memory Controller peripheral offering

support for asynchronous static memory devic es such as RAM, ROM, and flash. In

addition, it can be used as an interface with off-chip memory-mappe d devices and

peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant

peripheral.

7.6.1 Features

•Dynamic memory interface support including single data rate SDRAM.

•Asynchronous static memory device support including RAM, ROM, and flash, with or

without asynchronous page mode.

•Low transaction latency.

•Read and write buffers to reduce latency and to improve performance.

•8/16/32 data and 24 address lines wide st atic memory support.

•16 bit and 32 bit wide chip select SDRAM memory support.

•Static memory features include:

Product data sheet Rev. 4.1 — 16 October 2013 30 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

–Asynchronous page mode read

–Programmable Wait States

–Bus turnaround delay

–Output enable and write enable delays

–Extended wait

•Four chip selects for synchronous memory and four chip select s for static memory

devices.

•Power-saving modes dynamically control CKE and CLKOUT to SDRAMs.

•Dynamic memory self-refresh mode controlled by software.

•Controller supports 2048, 4096, and 8192 row address synchronous memory parts.

That is typical 512 MB, 256 MB, and 128 MB parts, with 4, 8, 16, or 32 data bits per

device.

•Separate reset domains allow the for auto-refresh through a chip reset if desired.

Note: Synchronous static memory devices (synchronous burst mode) are not supported.

7.7 General purpose DMA controller

The GPDMA is an AMBA AHB compliant peripheral allowing selected LPC2470

peripherals to have DMA support.

The GPDMA enables peripheral-to-memory, memory-to-peripheral,

peripheral- to -p erip he ra l, an d m em o ry- to -me mo ry transactions. Eac h DM A stre am

provides unidirectional serial DMA transfers for a single source and destin ation. For

example, a bidirectional port requires one stream for transmit and one for receive. The

source and destination areas can each be either a memory region or a peripheral, and

can be accessed through the AHB master.

7.7.1 Features

•Two DMA channels. Each channel can support a unidirectional transfer.

•The GPDMA can transfer data between the 16 kB SRAM, external memory, and

peripherals such as the SD/MMC, two SSPs, and the I2S interface.

•Single DMA and burst DMA request signals. Each peripheral connected to the

GPDMA can assert either a burst DMA request or a single DMA request. The DMA

burst size is set by programming the GPDMA.

•Memory-to-memory, memory-to-periphera l, peripheral-to-memory, and

peripheral-to-peripheral transfers.

•Scatter or gather DMA is supported through the use of linked lists. This means that

the source and destination areas do not have to occupy contiguous areas of memory.

•Hardware DMA channel priority. Each DMA channel has a specific hardware priority.

DMA channel 0 has the highest priority and channel 1 has the lowest pr iority. If

requests from two channels become active at the same time, the channel with the

highest priority is serviced first.

•AHB slave DMA programming interface. The GPDMA is programmed by writing to th e

DMA control register s ove r the AHB slav e int er fa ce.

Product data sheet Rev. 4.1 — 16 October 2013 31 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

•One AHB master for transferring data. This interface transfers data when a DMA

request goes active.

•32-bit AHB master bus width.

•Incrementing or non-incrementing addressing for source and destination.

•Programmable DMA burst size. The DMA burst size can be programmed to more

efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the

peripheral.

•Internal four-word FIFO per channel.

•Supports 8-bit, 16-bit, and 32-bit wide transactions.

•An interrupt to the pr ocessor ca n be gene rate d on a DMA comp letion or when a DMA

error has occurred.

•Interrupt masking. The DMA error and DMA terminal count interrupt requests can be

masked.

•Raw interrupt status. The DMA error and DMA count raw interrupt status can be read

prior to masking.

7.8 Fast general purpose parallel I/O

Device pins that are not connected to a specific peripheral function are controlled by the

GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate

registers allow setting or clearing any nu mber of outp uts simultan eou sly. The value of the

output register may be read back as well as the current state of the port pins.

LPC2470 use accelerated GPIO functions:

•GPIO registers are relocated to the ARM local bus so that the fastest possible I/O

timing can be achieved.

•Mask registers allow treating sets of port bits as a group, leaving other bits

unchanged.

•All GPIO registers are byte and half-word addressable.

•Entire port value can be written in one instruction.

Additionally, any pin on port 0 and port 2 (total of 64 pins) that is not configure d as an

analog input/output can be programmed to generate an interrupt on a rising edge, a falling

edge, or both. The ed ge detection is asynchronou s, so it may operate when clocks are no t

present such as during Power-down mode. Each enabled interrupt can be used to wake

the chip up from Power-down mode.

7.8.1 Features

•Bit level set and clear registers allow a single instr uction to set or clear any nu mber of

bits in one port.

•Direction control of individual bits.

•All I/O default to inputs after reset.

•Backward compatibility with other earlier devices is maintained with legacy port 0 and

port 1 registers appearing at the original addresses on the APB.

Product data sheet Rev. 4.1 — 16 October 2013 32 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7.9 LCD controller

The LCD controller provides all of the necessary control signals to interface directly to a

variety of color and mono chro me LCD panels. Both ST N (sing le a nd dua l panel) and TFT

panels can be oper ated. The disp lay resolu tion is se lect able a nd can be up to 1024 768

pixels. Several color modes are provided, up to a 24-bit true-col or non-palettized mode.

An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the

displayed data) while still supporting a large number of colors.

The LCD interface includes its own DMA controller to allow it to operate independently of

the CPU and other sys te m fu nc tion s. A built-in FIFO acts as a buffer for display data,

providing flexibility for system timing. Hardware cursor support can further reduce the

amount of CPU time needed to operate the display.

7.9.1 Features

•AHB bus master interface to access frame buffer.

•Setup and control via a separate AHB slave interface.

•Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data.

•Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays

with 4-bit or 8-bit interfaces.

•Supports single and dual-panel color STN displays.

•Supports Thin Film Transistor (TFT) color displays.

•Programmable display resolution including, but not limited to: 320 200, 320 240,

640 200, 640 240, 640 480, 800 600, and 1024 768.

•Hardware cursor support for single-panel displays.

•15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support.

•1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN.

•1, 2, 4, or 8 bpp palettized color displays for color STN and TFT.

•16 bpp true-color non-palettized, for color STN and TFT.

•24 bpp true-color non-palettized, for color TFT.

•Programmable timing for diff erent display pan els.

•256 entry, 16-bit palette RAM, arra ng ed as a 12 8 32-bit RAM.

•Frame, line, and pix el cloc k s ign als .

•AC bias signal for STN, data enable signal for TFT panels.

•Supports little and big-endian, and Windows CE data formats.

•LCD panel clock may be generated from the peripheral clock, or from a clock input

pin.

7.10 Ethernet

The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC

designed to provide optimized performance through the use of DMA hardware

acceleration. Features include a generous suite of control registers, half or full duplex

operation, flow control, control frames, hardware acceleration for transmit retry, receive

packet filtering an d wa ke-u p on LAN activity. Automatic frame transmissio n and recep tion

with scatter-gather DMA off-loads many operations from the CPU.

Product data sheet Rev. 4.1 — 16 October 2013 33 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access

the Ethernet SRAM for Ethernet da ta, control, and st atus information. All other AHB traffic

in the LPC2470 t akes pla ce on a dif ferent AHB subsystem, ef fectively separ ating Ethernet

activity from the rest of the system. The Ethernet DMA can also access off-chip memory

via the EMC, as well as the SRAM located on another AHB. However, using memory

other than the Ethernet SRAM, especially off-chip memory, will slow Ethernet access to

memory and increase the loading of its AHB.

The Ethernet block interfaces between an off-chip Ethernet PHY using the Media

Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media

Independent Interface Management (MIIM) serial bus.

7.10.1 Features

•Ethernet standards support:

–Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX,

100 Base-FX, and 100 Base-T4.

–Fully compliant with IEEE standard 802.3.

–Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back

pressure.

–Flexible transmit and receive frame options.

–Virtual Local Area Network (VLAN) frame support.

•Memory management:

–Independent transmit and receive buffers memory mapped to shared SRAM.

–DMA managers with scatter/gather DMA and arrays of frame descriptors.

–Memory traffic optimize d by buffering and pre-fetching.

•Enhanced Ethernet features:

–Receive filtering.

–Multicast and broadcast frame support for both transmit and receive.

–Optional automatic Frame Check Sequence (FCS) insertion with Circular

Redundancy Check (CRC) for transmit.

–Selectable automatic transmit frame padding.

–Over-length frame support for both transmit and receive allows any length frames.

–Promiscuous receive mode.

–Automatic collision back-off and frame retransmission.

–Includes power management by clock switching.

–Wake-on-LAN power management support allows system wake-up: using the

receive filters or a magic frame detection filter.

•Physical interface:

–Attachment of external PHY chip through standard MII or RMII interface.

–PHY register access is available via the MIIM interface.

Product data sheet Rev. 4.1 — 16 October 2013 34 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7.11 USB interface

The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a

host and one or more (up to 127) peripherals. The host controller allocates the USB

bandwidth to attached devices through a token-based protocol. The bus supports hot

plugging and dynamic configuration of the devices. All transactions are initiated by the

host controller.

The LPC2470 USB interface includes a device, host, and OTG controller. Details on

typical USB interfacing solutions can be found in Section 14.3 “Suggested USB interface

solutions” on page 73

7.11.1 USB device controller

The device controller enables 12 Mbit/s data exchange with a USB host controller. It

consists of a register interface, serial interface engine, endpoint buffer memory, and a

DMA controller. The serial interface eng ine decodes the USB dat a stream a nd writes dat a

to the appropriate endpoint buf fe r. The status of a completed USB transfer or error

condition is indicated via status registers. An interrupt is also generated if enabled. When

enabled, the DMA controller transfers data be tween the endpoint buffer and the USB

RAM.

7.11.1.1 Features

•Fully compliant with USB 2.0 specification (full speed).

•Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM.

•Supports Control, Bulk, Interrupt and Isochronous endpoints.

•Scalable realization of endpoints at run time.

•Endpoint Maximum packet size selection (up to USB maximum specification) by

software at run time.

•Supports SoftConnect and GoodLink features.

•While USB is in the Suspend mode, LPC2470 can enter one of the reduced power

modes and wake up on USB activity.

•Supports DMA transfers with th e DM A RAM of 16 kB on all no n- co nt rol endpoints.

•Allows dynamic switching between CPU-controlled and DMA modes.

•Double buffer implementation for Bulk and Isochronous endpoints.

7.11.2 USB host controller

The host controller ena bles full- and low-speed dat a exchange with USB devices attached

to the bus. It consists of register inte rface, serial interface engine and DMA controller . The

7.11.2.1 Features

•OHCI compliant

•Two down str e am ports

•Supports per-port power switching

Product data sheet Rev. 4.1 — 16 October 2013 35 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7.11.3 USB OTG controller

USB OTG is a supplement to the USB 2.0 specification that augments the capability of

existing mobile devices and USB peripherals by adding host functional ity for conne ction to

USB peripherals.

The OTG controller integrates the host controller, device controller, and a master-on ly I 2C

interface to implement OTG dual-role device functionality. The dedicated I2C interface

controls an external OTG transceiver.

7.11.3.1 Features

•Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision

1.0a.

•Hardware support for Host Negotiation Protocol (HNP).

•Includes a programmable timer required for HNP and Session Request Protocol

(SRP).

•Supports any OTG transceiver compliant with the OTG Transceiver Specification

(CEA-2011), Rev. 1.0.

7.12 CAN controller and acceptance filters

The Controller Area Network (CAN) is a serial communications protocol which efficiently

supports distributed real-time control with a very high level of security. Its domain of

application ranges from high-speed networks to low cost multiplex wiring.

The CAN block is intended to support multiple CAN buses simultaneously, allowing the

device to be used as a gateway, switch, or router between two of CAN buses in industrial

or automotive applications.

Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN

Library block, but the 8-bit registers of those devices have been combined in 32-bit words

to allow simult aneous access in the ARM environment. The main operational d iff erence is

that the recognition of received Identifiers, known in CAN terminology as Acceptance

Filtering, has been removed from the CAN controllers and centralized in a global

Acceptance Filter.

7.12.1 Features

•Two CAN controllers and buses.

•Data rates to 1 Mbit/s on each bus.

•32-bit register and RAM access.

•Compatible with CAN specification 2.0B, ISO 11898-1.

•Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN

buses.

•Acceptance Filter can provide FullC AN- style automatic reception for selected

Standard Identifiers.

•FullCAN messages can generate interrupts.

Product data sheet Rev. 4.1 — 16 October 2013 36 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7.13 10-bit ADC

The LPC2470 contains one ADC. It is a single 10-b it successive approximation ADC with

eight channels.

7.13.1 Features

•10-bit successive approximation ADC

•Input multiplexing among 8 pins

•Power-down mode

•Measurement range 0 V to Vi(VREF)

•10-bit conver sio n time  2.44 s

•Burst conversion mode for single or multiple inputs

•Optional conversion on transition of input pin or Timer Match signal

•Individual result registers for each ADC channel to reduce interrupt overhead

7.14 10-bit DAC

The DAC allows the LPC2470 to generate a var iable analog ou tput. The maximum outp ut

value of the DAC is Vi(VREF).

7.14.1 Features

•10-bit DAC

•Resistor string architecture

•Buffered output

•Power-down mode

•Selectable output drive

7.15 UARTs

The LPC2470 contains four UARTs. In addition to standard transmit and receive data

lines, UART1 also provides a full modem control handshake interface.

The UARTs include a fractional baud rate generato r. Standard baud rates such as

115200 Bd can be achieved with any crystal frequency above 2 MHz.

7.15.1 Features

•16 B Receive and Transmit FIFOs.

•Register locations conform to 16C550 industry standard.

•Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.

•Built-in fractional baud rate generator covering wide range of baud rates without a

need for external crystals of particular values.

•Fractional divider for baud rate control, auto baud capabilities and FIFO control

mechanism that enables software flow control implementation.

•UART1 equipped with stand ard modem interface signals. This module also provides

full support for hardware flow control (auto-CTS/RTS).

Product data sheet Rev. 4.1 — 16 October 2013 37 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

•UART3 includes an IrDA mode to support infrared communication.

7.16 SPI serial I/O controller

The LPC2470 cont ains on e SPI controller. SPI is a full duplex serial interface designed to

handle multiple maste rs and slaves co nnected to a given bus. Only a single maste r and a

single slave can communicate on the inte rface during a given data transfer. During a data

transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave

always sends 8 bits to 16 bits of data to the master.

7.16.1 Features

•Compliant with SPI specification

•Synchronous, Serial, Full Duplex Communication

•Combined SPI master and slave

•Maximum data bit rate of one eighth of the input clock rate

•8 bits to 16 bits per transfer

7.17 SSP serial I/O controller

The LPC2470 cont ains two SSP controllers. The SSP controller is cap able of operation on

a SPI, 4-wire SSI, or Microwire bus. It can intera ct with multiple masters and slaves on the

bus. Only a single maste r an d a sin gle slav e can communicate on the bus during a given

data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of

data flowing from the master to the slave and from the slave to the master. In practice,

often only one of these data flows carries meaningful data.

7.17.1 Features

•Compatible with Motorola SPI, 4-wire TI SSI, and National Semiconductor Microwire

buses

•Synchronous serial communication

•Master or slave operation

•8-frame FIFOs for both transmit and receive

•4-bit to 16-bit frame

•Maximum SPI bus data bit rate of one half (Master mode) and one twelfth (Slave

mode) of the input clock rate

•DMA transfers supp or te d by GPDM A

7.18 SD/MMC card interface

The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD

memory cards. The SD card interface conforms to the SD Multimedia Card Specification

Version 2.11.

7.18.1 Features

•The MCI provides all functions specific to the SD/MMC mem ory card. These include

the clock generation unit, power management control, and comma nd and data

transfer.

Product data sheet Rev. 4.1 — 16 October 2013 38 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

•Conforms to Multimedia Card Specification v2.11.

•Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96.

•Can be used as a multimedia card bus or a secure d igit al memo ry card bus ho st. The

SD/MMC can be connected to several multimedia cards or a single secure digital

memory card.

•DMA supported through the GPDMA controller.

7.19 I2C-bus serial I/O controller

The LPC2470 contains three I2C-bus controllers.

The I2C-bus is bidirectional, for inter-IC control using only two wires: a Serial Clock Line

(SCL), and a Seri al Dat a Line ( SDA). Ea ch device is recognized by a unique a ddress and

can operate as either a r eceiver-o nly device ( e.g., an LCD driver) or a tra nsmitter with the

capability to both receive and send information (such as memory). Transmitters and/or

receivers can oper ate in eithe r master or sl ave mo de, dependin g on wheth er the chip has

to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus and can

be controlled by more than one bus master connected to it.

The I2C-bus implemented in LPC2470 supports bit rates up to 400 kbit/s (Fast I2C-bus).

7.19.1 Features

•I2C0 is a standard I2C compliant bus interface with open-drain pins.

•I2C1 and I2C2 use standard I/O pins and do not support powering off of individual

devices connected to the same bus lines.

•Easy to configure as master, slave, or master/slave.

•Programmable clocks allow versatile rate control.

•Bidirectional data transfer between masters and slaves.

•Multi-master bus (no central master).

•Arbitration between simultaneously transmitting masters without corruption of serial

data on the bus.

•Serial clock synchronization allows devices with different bit rates to communicate via

one serial bus.

•Serial clock synchronization can be used as a handshake mech anism to suspend and

resume serial transfer.

•The I2C-bus can be used for test and diagnostic purposes.

7.20 I2S-bus serial I/O controllers

The I2S-bus provides a standard communication interface for digital audio applications.

The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,

and one word select signal. The basic I2S connection has one master, which is always the

master, and one slave. The I2S interfa c e on the LPC2 47 0 pro vid es a se parate tran sm it

and receive channel, each of which can operate as either a master or a slave.

Product data sheet Rev. 4.1 — 16 October 2013 39 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7.20.1 Features

•The interface has sep arate input/output channels each of which can o perate in master

or slave mode.

•Capable of handling 8-bit, 16-bit, and 32-bit word sizes.

•Mono and stereo audio data supported.

•The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1,

48) kHz.

•Configurable word select period in master mode (separately for I2S input and output).

•Two 8 word FIFO data buffers are provided, one for transmit and one for receive .

•Generates interrupt requests when buffer levels cross a programmable boundary.

•Two DMA requests, controlled by programmable buffer levels. These are connected

to the GPDMA block.

•Controls include reset, stop and mute options separately for I2S input and I2S output.

7.21 General purpose 32-bit timers/external event counters

The LPC2470 includes four 32-bit Timer/Counters. The Timer/Counter is designed to

count cycles of the system derived clock or an externally-supplied clock. It can optionally

generate interrupts or perform other actions at specified timer values, based on four

match registers. The Timer/Counter also includes four capture inputs to trap the timer

value when an input signal transitions, optionally generating an interrupt.

7.21.1 Features

•A 32-bit Timer/Counter with a programmable 32-bit prescaler.

•Counter or Timer operation.

•Up to four 32-bit capture channels per timer, that can take a snapshot of the timer

value when an input signal transitions. A capture event may also optionally generate

an interrupt.

•Four 32-bit matc h re gist er s tha t allo w:

–Continuous operation with optional interrupt generation on match.

–Stop timer on match with optional interrupt generation.

–Reset timer on match with optional interrupt generation.

•Up to four external outputs corresponding to match registers, with the following

capabilities:

–Set LOW on match.

–Set HIGH on match.

–Toggle on match.

–Do nothing on match.

Product data sheet Rev. 4.1 — 16 October 2013 40 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7.22 Pulse width modulator

The PWM is based on the standard Timer block and inherits all of its features, although

only the PWM function is pinned out on the LPC2470. The Timer is designed to count

cycles of the system derived clock and optionally switch pins, generate interrupts or

perform other actions when spe cified timer values occur , based on seven match registers.

The PWM function is in addition to these features and is based on match register events.

The ability to separately control rising and falling edge locations allows the PWM to be

used for more applications. For instance, multi-phase motor control typically requires

three non-overlapping PWM outputs with individual control of all three pulse widths and

positions.

Two match registers can be used to provide a single edge controlled PWM output. A

dedicated match register controls the PWM cycle rate, by rese tting the count upo n match.

The other match register controls the PWM edge position. Additional single edge

controlled PWM ou tp u ts require only on e m atc h register each, since the repetition rate is

the same for all PWM outputs. Multiple single edge controlled PWM output s will all have a

rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs .

Three match registers can be used to provide a PWM output with both ed ge s co ntr o lled .

Again, a dedicated match re gister controls the PWM cycle rate. The other match re gisters

control the two PWM edge positions. Additional double edge controlled PWM outputs

require only two match registers each, since the repetition rate is the same for all PWM

outputs.

With double edge controlled PWM outputs, specific match registers control the rising and

falling edge of the output. This allows both positive going PWM pulses (when the rising

edge occurs prior to the falling edge), and negative going PWM pulses (when the falling

edge occurs prior to the rising edge).

7.22.1 Features

•LPC2470 has two PWMs with the same oper ational features. These may be oper ated

in a synchronized fashion by setting them both up to run at the same rate, then

enabling both simultaneously. PWM0 acts as the master and PWM1 as the slave for

this use.

•Counter or Timer operation (may use the periph eral clock or one of th e capture inpu ts

as the clock source).

•Seven match registers allow up to 6 single edge controlled or 3 double edge

controlled PWM outputs, or a mix of both types. The match registers also allow:

–Continuous operation with optional interrupt generation on match.

–Stop timer on match with optional interrupt generation.

–Reset timer on match with optional interrupt generation.

•Supports single edge controlled and/or double edge controlled PWM outputs. Single

edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the

output is a constant LOW . Do uble edge controlled PWM outp uts can have eithe r edge

occur at any position within a cycle. This allows for both positive going and negative

going pulses.

Product data sheet Rev. 4.1 — 16 October 2013 41 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

•Pulse period and width can be any number of timer counts. This allows complete

flexibility in the trade-off between resolution and repetition rate. All PWM outputs will

occur at the same repetition rate.

•Double edge controlled PWM outputs can be progra mmed to be either positive going

or negative going pulses.

•Match register updates are synchronized with pulse outputs to prevent ge ne ra tio n of

erroneous pulses. Sof tware must ‘release’ new ma tch values before they ca n become

effective.

•May be used as a standard timer if the PWM mode is not enabled.

•A 32-bit Timer/Counter with a programmable 32-bit Prescaler.

7.23 Watchdog timer

The purpose of the watchdog is to reset the mi crocontroller within a reasonable amount of

time if it enters an erroneous state. When enabled, the watchdog will generate a system

reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined

amount of time.

7.23.1 Features

•Internally resets chip if not periodically reloaded.

•Debug mode.

•Enabled by soft ware but requires a har dware reset or a watchdog reset/interrupt to be

disabled.

•Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.

•Flag to indicate watchdog reset.

•Programmable 32-bit timer with internal prescaler.

•Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 232 4) in

multiples of Tcy(WDCLK) 4.

•The Watchdog Clock (WDCLK) source can be selected from the RTC clock, the

Internal RC oscillator (IRC), or the APB peripheral clock. This gives a wide range of

potential timing choices of Watchdog operation under different power reduction

conditions. It also provides the ability to run the WDT from an entirely internal source

that is not dependent on an external crystal and its associated components and

wiring, for increased reliability.

7.24 RTC and battery RAM

The RTC is a set of counte rs for measur ing time when system power is on, and optio nally

when it is off. It uses little power in Power-down and Deep power-down modes. On the

LPC2470, the RTC can be clocked by a separate 32.768 kHz oscillator or by a

programmable prescale divider based on the APB clock. Also, the RTC is powered by its

own power supply pin, VBAT, which can be connected to a battery or to the same 3.3 V

supply used by the rest of the device.

Product data sheet Rev. 4.1 — 16 October 2013 42 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions

require a minimum of power to operate, which can be supplied by an external battery.

When the CPU and the rest of chip functions are stopped and power removed, the RTC

can supply an alarm output that can be used by external hardware to restore chip power

and resume operation.

7.24.1 Features

•Measures the passage of time to maintain a calendar and clock.

•Ultra low power design to support battery powered systems.

•Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and

Day of Year.

•Dedicated 32 kHz oscillator or programmable prescaler from APB clock.

•Dedicated power supply pin can be connected to a battery or to the main 3.3 V.

•An alarm output pin is included to assist in waking up when the chip has had power

removed to all functions except the RTC and Battery RAM.

•Periodic interru pts can be generated fr om increments o f any field of the time registers,

and selected fractional second values. This enhancement enables the RTC to be

used as a System Timer.

•2 kB data SRAM powered by VBAT.

•RTC and Battery RAM power supply is isolated from the rest of th e chip.

7.25 Clocking and power control

7.25.1 Crystal oscillators

The LPC2470 includes three independent oscillators. These are the Main Oscillator, the

Internal RC oscillator, and the R TC oscillator. Each oscillator can be used for more than

one purpose as req uir ed in a particular applicatio n. Any of th e three clock so ur ces can be

chosen by software to drive the PLL and ultimately the CPU.

Following reset, the LPC2470 will operate from the Internal RC oscillator until switched by

software. This allows systems to operate without any external crystal and the boo tloader

code to operate at a known frequency.

7.25.1.1 Internal RC oscillator

The IRC may be used as the clock so urce for th e WDT, an d/or as the clock that drives the

PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is

trimmed to 1 % accuracy.

Upon power-up or any chip reset, the LPC2470 uses the IRC as the clock source.

Software may later switch to one of the other available clock sources.

7.25.1.2 Main oscillator

The main oscillator can be used as the clock source for the CPU, with or withou t using the

PLL. The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can

be boosted to a higher frequency, up to the maximum CPU operating frequency, by the

PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock

frequency is referred to as CCLK elsewhere in this document. The frequencies of

PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The

Product data sheet Rev. 4.1 — 16 October 2013 43 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

clock frequency for each peripheral can be selected individually and is refe rred to as

PCLK. Refer to Section 7.25.2 for additional information.

7.25.1.3 RTC oscillator

The RTC oscillator can be used as the clock source for the R TC and/or the WDT. Also, the

RTC oscillator can be used to drive the PLL and the CPU.

7.25.2 PLL

The PLL accepts an input clock frequency in the range of 32 kHz to 25 MHz. The input

frequency is multiplied up to a high frequency, then divided down to provide the actual

clock used by the CPU and the USB block.

The PLL input, in the range of 32 kHz to 25 MHz, may initially be divided down by a value

‘N’, which may be in the range of 1 to 256. This input division provides a wide range of

output frequencies from the same input frequency.

Following the PLL input divider is the PLL multiplier. This can multiply the input divider

output through the use of a Current Controlled Oscillator (CCO) by a value ‘M’, in the

range of 1 through 32768. The resulting freq uency must be in the range of 275 MHz to

550 MHz. The multiplier works by dividing the CCO output by the value of M, th en using a

phase-frequency detector to compare the divided CCO output to the multiplier input. The

error value is used to adjust the CCO frequency.

The PLL is turned off and bypassed following a chip Reset and by entering Power-down

mode. PLL is enabled by sof tware only. The program must configure and activate the PL L,

wait for the PLL to lock, then connect to the PLL as a clock source.

7.25.3 Wake-up timer

The LPC2470 begins operation at power-up and when awakened from Power-down and

Deep-power down modes by using the 4 MHz IRC oscillator as the clock source. This

allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the

application, software will need to enable these features and wait for them to stabilize

before they are used as a clock source.

When the main oscillator is initially activate d, the wake-up timer allows sof tware to e nsure

that the main oscillator is fully functional before the processor uses it as a clock source

and starts to execute instructions. This is important at power on, all types of Reset, and

whenever any of the aforementioned functions are turned off for any reason. Since th e

oscillator and other functions are turned off during Power-down and Deep power-down

modes, any wake-up of the processor from Power-down modes makes use of the

Wake-up Timer.

The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin

code execution. When power is applied to the chip, or when some eve nt caused the chip

to exit Power-down mode, some time is required for the oscillator to produce a signal of

sufficie nt amplitude to drive the clock logic. The amount of time d epends on many factors,

including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its

electrical characteristics (if a q uartz cr yst al is used) , as well as any other external cir cuitry

(e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient

conditions.

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NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7.25.4 Power control

The LPC2470 suppo rts a variety of powe r control features. There are four special modes

of processor power reduction: Idle mode, Sleep mode, Power-d own mode, and Deep

power-down mode. The CPU clock rate may also be controlled as needed by changing

clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This

allows a trade-off of power versus processing speed based on application req uirements.

In addition, Peripheral power control allows shutting down the clocks to individual on-chip

peripherals, allowing fine tuning of power consumption by eliminating all dynamic power

use in any periphera ls th at are not re qu ire d for th e ap plic at ion . Each of the peripherals

has its own clock divider which provides even better power control.

The LPC2470 also implements a separate power domain in order to allow turning off

power to the bulk of the device while ma intaining opera tion of the RTC and a small SRAM,

referred to as the Battery RAM.

7.25.4.1 Idle mode

In Idle mode, execution of instructions is suspended until either a Reset or interrupt

occurs. Peripheral functions continue operation during Idle mode and may generate

interrupts to cause the processor to resume execution. Idle mode eliminates dynamic

power used by the processor itself, memory systems and related controllers, and internal

buses.

7.25.4.2 Sleep mode

In Sleep mode, the oscillator is shut down and the chip receives no internal clocks. The

processor state an d re gis te rs, per i phe ra l registers, and internal SRAM values are

preserved throughout Sleep mode and the logic levels of chip pins remain static. The

output of the IRC is disabled but the IRC is not powered down fo r a fast wake-up later . The

32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the

wake-up source. The PLL is automatically turned off and disconnected. The CCLK and

USB clock dividers automatically get reset to zero.

The Sleep mode can be terminated and normal operation resumed by either a Reset or

certain specific interrupts that are able to function withou t clocks. Since all dynamic

operation of the chip is suspended, Sleep mode reduces chip power consumption to a

very low value.

On the wake-up from Sleep mode, if the IRC was used before entering Sleep mode, the

code execution and peripherals activities will resume after 4 cycles expire. If the main

external oscillator was used, the code execution will resume when 4096 cycles expire.

The customers need to reconfigure the PLL and clock divider s accordingly.

7.25.4.3 Power-down mode

Power-down mode does everything that Sleep mode does but also turns off the IRC

oscillator.

On the wake-up from Power-down mode, if the IRC was used before entering

Power-down mode, it will take IRC 60 s to start-up. After this 4 IRC cycles will expire

before the code execution can then be r esumed if the code was ru nning from SRAM. The

customers need to reconfigure the PLL and clock dividers accordingly after a wake-up

from Power-down mode.

Product data sheet Rev. 4.1 — 16 October 2013 45 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

7.25.4.4 Deep power-down mode

Deep power-down mode is similar to the Power-down mode, but now the on-ch ip

regulator that supplies power to the intern al logic is also shut of f. This produce s the lowest

possible power consumption without removing power fr om the entire chi p. Since the Deep

power-down mode shuts down the on-chip logic power supply, there is no register or

memory retention, and resumption of operation involves the same activities as a full chip

reset.

If power is supplied to the LPC2470 during Deep power-down mode, wake-up can be

caused by the RTC Alarm interrupt or by external Reset.

While in Deep power-down mode, external device power may be removed. In this case,

the LPC2470 will start up when external power is restored.

Essential data may be retained through Deep power-down mode (or through complete

powering of f of the chip) by storing dat a in the Battery RAM, as long as the external power

to the VBAT pin is maintained.

7.25.4.5 Power domains

The LPC2470 provides two independent power domains that allow the bulk of the device

to have power removed while maintaining operation of the RTC and the Batter y RAM.

On the LPC2470, I/O pads are powered by the 3.3 V (VDD(3V3)) pins, while the

VDD(DCDC)(3V3) pins power the on-chip DC-to-DC converter which in turn provides power to

the CPU and most of the peripherals.

Although both the I/O pad ring and the core require a 3.3 V supply, different powering

schemes can be used depending on the actual application requirements.

The first option assumes that power consumption is not a conce rn and th e design ties the

VDD(3V3) and VDD(DCDC)(3V3) pins together. This approach requires on ly one 3.3 V power

supply for both pads, the CPU, and peripherals. While this solution is simple, it does not

support powering down the I/O pad ring “on the fly” while keeping the CPU and

peripherals alive.

The second option uses two power supplie s; a 3.3 V supply for the I/O pads (VDD(3V3)) and

a dedicated 3.3 V supply for the CPU (VDD(DCDC)(3V3)). Having the on-chip DC-DC

converter powered independently from the I/O pad ring enables shutting do wn of the I/O

pad power supply “on the fly”, while the CPU and peripherals stay active.

The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions

require a minimum of power to operate, which can be supplied by an external battery.

When the CPU and the rest of chip functions are stopped and power removed, the RTC

can supply an alarm output that may be used by external hardware to restore chip power

and resume operation.

7.26 System control

7.26.1 Reset

Reset has four sources on the LPC2470: the RESET pin, the Watchdog reset, power-on

reset, and the BrownOut Detection (BOD) cir cuit. The RESET pin is a Schmitt trig ger input

pin. Assertion of chip Reset by any source, once the operating volt age attains a usable

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NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

level, starts the wake-up timer (see description in Section 7.25.3 “Wake-up timer”),

causing reset to remain asserted until the external Reset is de-asserted, the oscillator is

running, and a fixed number of clocks have passed.

Once the internal reset is removed, all of the processor and periph eral registers have

been initialized to predete rmined va lues and the LPC2470 continue s with booting from an

external static memory.

7.26.2 Boot process

The processor always boots from the off-chip static memory bank 1, executing code from

address 0x8100 0000 (see Table 5 “LPC2470 memory usage and details”). During the

boot process initiated by POR, the boot pins P3[15]/D15 and P3[14]/D14 are sampled,

and the external memor y banks 0 and 1 are configured with th e same data bus width. The

data bus wid th is determined by the setting of the two boot pins. Unused address pins ar e

configured as GPIO. See Section 14.2 “Suggested boot memory interface solutions” for

address and data bus interface details.

Remark: After POR, the addr ess ranges of chip select 1 and chip select 0 are swapped.

The user code residing in the external boot memory must be linked to exec ute from

address location 0x8000 0000.

When booting from external memory, the interrupt vectors are mapped to the bottom of

the external memory. Once booting is over, the application must map interrupt vectors to

the proper domain.

7.26.3 Brownout detection

The LPC2470 includ es 2-st age moni toring of the volta ge on the V DD(DCDC)(3V3) pins. If this

voltage falls below 2.95 V, the BOD asse rts an interrupt signal to the Vectored Interrupt

Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the

VIC in order to cause a CPU interrupt; if no t, so ftware can mo nitor the sig nal by readin g a

dedicated status register.

The second stag e of low-voltage detection assert s a BOD Reset and generates a Reset (if

this reset source is enabled in software) to inactivate the LP C2470 when the voltage on

the VDD(DCDC)(3V3) pins falls below 2.65 V. The BOD circuit maintains this reset down

below 1 V, at which point the power-on reset circuitry maintains the overall Reset.

Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this

hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly-executed event

loop to sense the condition.

7.26.4 AHB

The LPC2470 implement s two AHB in order to allo w the Ethernet block to ope rate without

interference caused by other system activity. The primary AHB, referred to as AHB1,

includes the Vectored Interrupt Controller, GPDMA controller, USB interface, and 16 kB

SRAM.

The second AHB, referred to as AHB2, includes only the Ethernet block and an

associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary

AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into

off-chip memory or unused space in memory residing on AHB1.

Product data sheet Rev. 4.1 — 16 October 2013 47 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the

GPDMA function, and the Etherne t block (via the bus bridge from AHB2). B us mast er s

with access to AHB2 are the ARM7 and the Ethernet block.

7.26.5 External interrupt inputs

The LPC2470 includes up to 68 edge sensitive interrupt inputs combin ed with up to four

level sensitive external interrupt inputs as selectable pin functions. The external interrupt

inputs can optionally be used to wake up the processor from Power-down mode.

7.26.6 Memory mapping control

The memory mapping control alters th e mapping of the interrupt vectors that appear at the

beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the Boot

ROM, the SRAM, or external memory. This allows code running in dif ferent memory

spaces to have control of the interrupts.

When booting from an external memory the interrupt ve ctors are mapped to the bottom of

the external me m or y. Once boo tin g is ove r the application must map interrupt vectors to

the proper domain.

7.27 Emulation and debugging

The LPC2470 support emulation and debugging via a JTAG serial port. A trace port allows

tracing program execution. Debugging and trace functions a re multiplexed only with

GPIOs on P2[0] to P2[9]. This means that all communication, timer, and interface

peripherals residing on other pins are available during the development and debugging

phase as they are when the application is run in the embedded system itself.

7.27.1 EmbeddedICE

The EmbeddedICE logic provides on-chip debug support. The debugging of the target

system requires a host computer running the debug ger software and an EmbeddedICE

protocol convertor. The EmbeddedICE protocol convertor converts the Remote Debug

Protocol commands to the JTAG data needed to access the ARM7TDMI-S core present

on the target system.

The ARM core has a Debu g Co mmunication Channel (DCC) function built-in. The DCC

allows a program running on the target to communica te with the host debugger or another

separate host without stopping the program flow or even entering the debug state. The

DCC is accessed as a coprocessor 1 4 by the program running on the ARM7TDMI-S core.

The DCC allows the JTAG port to be used for sending and receiving dat a without af fecting

the normal progr am flow. The DCC data and control register s are mapped in to addresses

in the EmbeddedICE logic.

The JTAG clock (TCK) must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG

interface to operate.

7.27.2 Embedded trace

Since the LPC2470 have significant amounts of on-chip memories, it is not possible to

determine how the processor core is operating simply by observing the external pins. The

ETM provides real-time trace capability for deeply embedded processor cores. It outputs

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NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

information about processor execution to a trace port. A software debug ger allows

configuration of the ETM using a JTAG interface and displays the trace information that

has been captured.

The ETM is connected directly to the ARM core and not to the main AMBA system bus. It

compresses the trace information and exports it through a narrow trace port. An external

Trace Port Analyzer captures the trace information under software debugger control. The

trace port can broadcast the Instruction trace information. Instruction trace (or PC trace)

shows the flow of execution of the processor and pro vides a list of all the instructions th at

were executed. Instruction trace is significantly compressed by only broadcasting branch

addresses as well as a set of status signals that indicate the pipeline status on a cycle by

cycle basis. Trace information gener ation can be controlled by selecting the trigger

resource. Trigger resources include address comparators, counters and sequencers.

Since trace information is compressed the software debugger requires a static image of

the code being executed. Self-modifying code can not be traced because of this

restriction.

7.27.3 RealMonitor

RealMonitor is a configurable software module, developed by ARM Inc., which enable s

real-time debug. It is a lightweight debug monitor that runs in the background wh ile users

debug their fo reground application. It co mmunicates with the host using the DCC, which is

present in the EmbeddedICE logic. The LPC2470 contain a specific configuration of

RealMonitor software programmed into the on-chip ROM memory.

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NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

8. Limiting values

[1] The following applies to the limiting values:

a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive

static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated

maximum.

b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSSIO/VSSCORE

unless otherwise noted.

[2] Including voltage on outputs in 3-state mode.

[3] Not to exceed 4.6 V.

[4] The peak current is limited to 25 times the corresponding maximum current.

[5] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined

based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.

[6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).[1]

Symbol Parameter Conditions Min Max Unit

VDD(3V3) supply voltage (3.3 V) core and external

rail 3.0 3.6 V

VDD(DCDC)(3V3) DC-to-DC converter supply voltage

(3.3 V) 3.0 3.6 V

VDDA analog 3.3 V pad supply voltage 0.5 +4.6 V

Vi(VBAT) input voltage on pin VBAT for the RTC 0.5 +4.6 V

Vi(VREF) input voltage on pin VREF 0.5 +4.6 V

VIA analog input voltage on ADC related

pins 0.5 +5.1 V

VIinput voltage 5 V tolerant I/O

pins; only valid

when the VDD(3V3)

supply voltage is

present

[2] 0.5 +6.0 V

other I/O pins [2][3] 0.5 VDD(3V3) +

0.5 V

IDD supply current per supply pin [4] - 100 mA

ISS ground current per ground pin [4] - 100 mA

Tstg storage temperature non-operating [5] 65 +150 C

Ptot(pack) total power dissipation (per package) based on package

heat transfer, not

device pow e r

consumption

-1.5W

VESD electrostatic discharge voltage human body

model; all pins [6] 2500 +2500 V

Product data sheet Rev. 4.1 — 16 October 2013 50 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

9. Thermal characteristics

The average chip junction temperature, Tj (C), can be calculated using the following

equation:

(1)

•Tamb = ambient temperature (C),

•Rth(j-a) = the package junction-to-ambient thermal resist ance (C/W)

•PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissip ation of

the I/O pins is of ten small and ma ny times can be n egligible. However it can be significant

in some applications.

TjTamb PDRth j a–

+=

Table 7. Thermal characteristics

VDD = 3.0 V to 3.6 V; Tamb =40 C to +85 C unless otherwise specified;

Symbol Parameter Conditions Min Typ Max Unit

Tj(max) maximum junction

temperature --125 C

Table 8. Thermal resistance value (C/W): ±15 %

VDD = 3.0 V to 3.6 V; Tamb =





C to +85



C unless otherwise specified;

LQFP208 TFBGA208

ja ja

JEDEC (4.5 in  4 in) JEDEC (4.5 in  4 in)

0 m/s 27.4 0 m/s 41

1 m/s 25.7 1 m/s 35

2.5 m/s 24.4 2.5 m/s 31

Single-layer (4.5 in  3 in) 8-layer (4.5 in  3 in)

0 m/s 35.4 0 m/s 34.9

1 m/s 31.2 1 m/s 30.9

2.5 m/s 29.2 2.5 m/s 28

jc 8.8 jc 8.3

jb 15.4 jb 13.6

Product data sheet Rev. 4.1 — 16 October 2013 51 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

10. Static characteristics

Table 9. Static characteristics

Tamb =40 C to +85 C for commercial applications, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

VDD(3V3) supply voltage (3.3 V) core and external rail 3.0 3.3 3.6 V

VDD(DCDC)(3V3) DC-to-DC converter

supply voltage (3.3 V) 3.0 3.3 3.6 V

VDDA analog 3.3 V pad

supply voltage 3.0 3.3 3.6 V

Vi(VBAT) input voltage on pin

VBAT [2] 2.0 3.3 3.6 V

Vi(VREF) input voltage on pin

VREF 2.5 3.3 VDDA V

IDD(DCDC)act(3V3) active mode DC-to-DC

converter supply

current (3.3 V)

VDD(DCDC)(3V3) =3.3V;

Tamb =25C; code

while(1){}

executed from the on-chip

SRAM; no peripherals

enabled; PCLK = CCLK / 8

CCLK = 12 MHz - 17.4 - mA

CCLK = 72 MHz - 66.1 - mA

IDD(DCDC)pd(3V3) Power-down mode

DC-to-DC con v e rter

supply current (3.3 V)

VDD(DCDC)(3V3) = 3.3 V;

Tamb =25C[3] -113-A

IDD(DCDC)dpd(3V3) Deep power-down

mode DC-to-DC

converter supply

current (3.3 V)

[3]

-20-A

IBATact active mode battery

supply current [4] -20-A

IBAT battery supply current Deep power-down mode [3] -20-A

Standard port pins, RESET, RTCK

IIL LOW-level input

current VI= 0 V; no pull-up - - 3 A

IIH HIGH-level input

current VI=V

DD(3V3); no pull-down - - 3 A

IOZ OFF-st ate output

current VO=0V; V

O=V

DD(3V3);

no pull-up/down -- 3A

Ilatch I/O latch-up current (0.5VDD(3V3)) < VI <

(1.5VDD(3V3));

Tj < 125 C

- - 100 mA

VIinput voltage pin configured to provide a

digital function [5][6][7]

[8] 0- 5.5V

VOoutput voltage output active 0 - VDD(3V3) V

VIH HIGH-level input

voltage 2.0 - - V

Product data sheet Rev. 4.1 — 16 October 2013 52 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

VIL LOW-level input

voltage -- 0.8V

Vhys hysteresis voltage 0.4 - - V

VOH HIGH-level output

voltage IOH =4 mA [9] VDD(3V3) 

0.4 --V

VOL LOW-level output

voltage IOL =4 mA [9] -- 0.4V

IOH HIGH-level output

current VOH =V

DD(3V3) 0.4 V [9] 4- - mA

IOL LOW-level output

current VOL =0.4V [9] 4- - mA

IOHS HIGH-level

short-circuit output

current

VOH =0V [10] -- 45 mA

IOLS LOW-level short-circuit

output current VOL =V

DDA [10] -- 50mA

Ipd pull-down current VI=5V [11] 10 50 150 A

Ipu pull-up current VI=0V 15 50 85 A

VDD(3V3) <V

I<5V [11] 00 0A

I2C-bus pins (P0[27]/SDA0 and P0[28]/SCL0)

VIH HIGH-level input

voltage 0.7VDD(3V3) --V

VIL LOW-level input

voltage - - 0.3VDD(3V3) V

Vhys hysteresis vo ltage - 0.05VDD(3V3) -V

VOL LOW-level output

voltage IOLS =3 mA [9] -- 0.4V

ILI input leakage current VI=V

DD(3V3) [12] -2 4A

VI=5V - 10 22 A

Table 9. Static characteristics … continued

Tamb =40 C to +85 C for commercial applications, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

Product data sheet Rev. 4.1 — 16 October 2013 53 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

[1] Typical ratings are not guaranteed. The values listed are at room te mperature (25 C), nominal supply voltages

[2] The RTC typically fails when Vi(VBAT) drops below 1.6 V.

[3] VDD(DCDC)(3V3) = 3.3 V; VDD(3V3) = 3.3 V; Vi(VBAT) = 3.3 V; Tamb =25C.

[4] On pin VBAT.

[5] Including voltage on outputs in 3-state mode.

[6] VDD(3V3) supply voltages must be present.

[7] 3-state outputs go into 3-state mode when VDD(3V3) is grounded.

[8] Please also see the errata note in errata sheet.

[9] Accounts for 100 mV voltage drop in all supply lines.

[10] Allowed as long as the current limit does not exceed the maximum current allowed by the device.

[11] Minimum condition for VI= 4.5 V, maximum condition for VI=5.5V.

[12] To VSSIO.

[13] Includes external resistors of 33 1 % on D+ and D.

Oscillator pins

Vi(XTAL1) input voltage on pin

XTAL1 0.5 +1.8 +1.95 V

Vo(XTAL2) output voltage on pin

XTAL2 0.5 +1.8 +1.95 V

Vi(RTCX1) input voltage on pin

RTCX1 0.5 +1.8 +1.95 V

Vo(RTCX2) output voltage on pin

RTCX2 0.5 +1.8 +1.95 V

USB pins

IOZ OFF-st ate output

current 0V<V

I<3.3V - - 10 A

VBUS bus supply voltage - - 5.25 V

VDI differential input

sensitivity voltage (D+) (D)0.2 - - V

VCM differential common

mode voltage range includes VDI range 0.8 - 2.5 V

Vth(rs)se single-ended receiver

switching threshold

voltage

0.8 - 2.0 V

VOL LOW-level output

voltage for

low-/full-speed

RL of 1.5 k to 3.6 V - - 0.18 V

VOH HIGH-level output

voltage (driven) for

low-/full-speed

RL of 15 k to GND 2.8 - 3.5 V

Ctrans transceiver

capacitance pin to GND - - 20 pF

ZDRV driver output

impedance for driver

which is not

high-speed capable

with 33  series resistor;

steady state drive [13] 36 - 44.1 

Table 9. Static characteristics …continued

Tamb =40 C to +85 C for commercial applications, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

Product data sheet Rev. 4.1 — 16 October 2013 54 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

10.1 Power-down mode

Vi(VBAT) = VDD(DCDC)(3V3) = 3.3 V; Tamb =25C.

Fig 5. I/O maximum supply current IDD(IO) versus temperature in Power-down mode

VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb =25C.

Fig 6. RTC battery maximum supply current IBAT versus temperature in Power-down

mode

002aae049

−2

IDD(IO)

(μA)

−4

temperature (°C)

−40 853510 60−15

VDD(3V3) = 3.3 V

VDD(3V3) = 3.0 V

002aae050

Vi(VBAT) = 3.3 V

Vi(VBAT) = 3.0 V

IBAT

(μA)

temperature (°C)

−40 853510 60−15

Product data sheet Rev. 4.1 — 16 October 2013 55 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

10.2 Deep power-down mode

VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb =25C.

Fig 7. Total DC-to-DC converter supply current IDD(DCDC)pd(3V3) at different temperatures

in Power-down mode

002aae051

200

600

400

800

temperature (°C)

−40 853510 60−15

VDD(DCDC)(3V3) = 3.3 V

VDD(DCDC)(3V3) = 3.0 V

IDD(DCDC)pd(3v3)

(μA)

VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb =25C.

Fig 8. I/O maximum supply current IDD(IO) versus temperature in Deep power-down

mode

temperature (°C)

−40 853510 60−15

002aae046

100

200

300

IDD(IO)

(μA)

VDD(3V3) = 3.3 V

VDD(3V3) = 3.0 V

Product data sheet Rev. 4.1 — 16 October 2013 56 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb =25C

Fig 9. RTC battery maximum supply current IBAT versus tempe r ature in Deep

power-down mode

VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb =25C.

Fig 10. Total DC-to-DC converter maximum supply current IDD(DCDC)dpd(3V3) versus

temperature in Deep power-down mode

002aae047

IBAT

(μA)

temperature (°C)

−40 853510 60−15

Vi(VBAT) = 3.3 V

Vi(VBAT) = 3.0 V

002aae048

temperature (°C)

−40 853510 60−15

IDD(DCDC)dpd(3v3)

(μA)

100

VDD(DCDC)(3V3) = 3.3 V

VDD(DCDC)(3V3) = 3.0 V

Product data sheet Rev. 4.1 — 16 October 2013 57 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

10.3 Electrical pin characteristics

Conditions: VDD(3V3) = 3.3 V; standard port pins.

Fig 11. Typical HIGH-le v el output voltage VOH versus HIGH-level output source current

IOH

Conditions: VDD(3V3) = 3.3 V; standard port pins.

Fig 12. Typical LOW-level output current IOL versus LOW-level output voltage VOL

IOH (mA)

0 24168

002aaf112

2.8

2.4

3.2

3.6

VOH

(V)

2.0

T = 85 °C

25 °C

−40 °C

VOL (V)

0 0.60.40.2

002aaf111

IOL

(mA)

T = 85 °C

25 °C

−40 °C

Product data sheet Rev. 4.1 — 16 October 2013 58 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

11. Dynamic characteristics

[1] Parameters are valid over operating temperature range unless otherwise specified.

[2] Typical ratings are not guaranteed. The values listed are at room te mperature (25 C), nominal supply voltages.

[3] Bus capacitance Cb in pF, from 10 pF to 400 pF.

Table 10. Dynamic character istics

Tamb =40 C to +85 C for commercial applications; VDD(3V3) over specified range s.[1]

Symbol Parameter Conditions Min Typ[2] Max Unit

External clock

fosc oscillator frequency 1 - 25 MHz

Tcy(clk) clock cycle time 40 - 1000 ns

tCHCX clock HIGH time Tcy(clk) 0.4 - - ns

tCLCX clock LOW time Tcy(clk) 0.4 - - ns

tCLCH clock rise time - - 5 ns

tCHCL clock fall time - - 5 ns

I2C-bus pins (P0[27]/SDA0 and P0[28]/SCL0)

tf(o) output fall time VIH to VIL 20 + 0.1  Cb[3] --ns

SSP interface

tsu(SPI_MISO) SPI_MISO set-up time Tamb = 25 C;

measured in

SPI Master

mode; see

Figure 17

-11-ns

Fig 13. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)

tCHCL tCLCX tCHCX

Tcy(clk)

tCLCH

002aaa907

Product data sheet Rev. 4.1 — 16 October 2013 59 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

11.1 Internal oscillators

[1] Parameters are valid over operating temperature range unless otherwise specified.

[2] Typical ratings are not guaranteed. The values listed are at room te mperature (25 C), nominal supply voltages.

11.2 I/O pins

[1] Applies to standard I/O pins and RESET pin.

11.3 USB interface

[1] Characterized but not implemented as production test. Guaranteed by design.

Table 11. Dynamic characteristic: internal oscillators

Tamb =40 C to +85 C; 3.0 V  VDD(3V3)  3.6 V.[1]

Symbol Parameter Conditions Min Typ[2] Max Unit

fosc(RC) internal RC oscillator frequency - 3.96 4.02 4.04 MHz

fi(RTC) R TC input frequency - - 32.768 - kHz

Table 12. Dynamic characteristic: I/O pins[1]

Tamb =40 C to +85 C; VDD(3V3) over specified ranges.

Symbol Parameter Conditions Min Typ Max Unit

trrise time pin configured as output 3.0 - 5.0 ns

tffall time pin configured as output 2.5 - 5.0 ns

Table 13. Dynamic characteristics of USB pins

CL = 50 pF; Rpu = 1.5 k on D+ to VDD(3V3),un less otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

trrise time 10 % to 90 % 8.5 - 13.8 ns

tffall time 10 % to 90 % 7.7 - 13.7 ns

tFRFM differential rise and fall time

matching tr/t

f--109%

VCRS output signal crossover voltage 1.3 - 2.0 V

tFEOPT source SE0 interval of EOP see Figure 16 160 - 175 ns

tFDEOP source jitter for differential transition

to SE0 transition see Figure 16 2-+5ns

tJR1 receiver jitter to next transition 18.5 - +18.5 ns

tJR2 receiver jitter for paired transitions 10 % to 90 % 9-+9ns

tEOPR1 EOP width at receiver must reject as

EOP; see

Figure 16

[1] 40 --ns

tEOPR2 EOP width at receiver must accept as

EOP; see

Figure 16

[1] 82 --ns

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Product data sheet Rev. 4.1 — 16 October 2013 60 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

11.4 Static external memory interface

Table 14. Dynamic char acteristics: Static external memory inte rface

CL=30pF, T

amb =40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V

Symbol Parameter Conditions Min Typ Max Unit

Common to read and write cycles[1]

tCSLAV CS LOW to address valid

time 0.29 0.20 2.54 ns

Read cycle parameters[1][2]

tOELAV OE LOW to address valid

time 0.29 0.20 2.54 ns

tCSLOEL CS LOW to OE LOW time 0.78 + Tcy(CCLK)  WA ITOEN 0 + Tcy(CCLK)  WAITOEN 0.49 + Tcy(CCLK)  WAITOEN ns

tam memory access time [3][4] (WAITRD  WAITOEN + 1) 

Tcy(CCLK)  12.70 (WAITRD  WAITOEN + 1) 

Tcy(CCLK)  9.57 (WAITRD  WAITOEN + 1) 

Tcy(CCLK)  8.11 ns

th(D) data input hold time [5] 0--ns

tCSHOEH CS HIGH to OE HIGH time 0.49 0 0.20 ns

tOEHANV OE HIGH to address invalid

time 0.20 0.20 2.44 ns

tOELOEH OE LOW to OE HIGH time 0.59 + (WAITRD 

WAITOEN + 1)  Tcy(CCLK)

0 + (WAITRD  WAIT OEN +

1)  Tcy(CCLK)

0.10 + (WAITRD 

WAITOEN + 1)  Tcy(CCLK)

tBLSLAV BLS LOW to address valid

time 0.39 0 2.54 ns

tCSHBLSH CS HIGH to BLS HIGH time 0.88 0.49 0.68 ns

Write cycle parameters[1][6]

tCSLWEL CS LOW to WE LOW time 0.88 + Tcy(CCLK)  (1 +

WAITWEN) 0.10 + Tcy(CCLK)  (1 +

WAITWEN) 0.20 + T cy(CCLK)  (1 +

WAITWEN) ns

tCSLBLSL CS LOW to BLS LOW time 0.88 0.49 0.98 ns

tWELDV WE LOW to data valid time 0.68 2.54 5.86 ns

tCSLDV CS LOW to data valid time 0 2.64 4.79 ns

tWELWEH WE LOW to WE HIGH time [3] 0.78 + Tcy(CCLK) 

(WAITWR  WAITWEN + 1) 0 + Tcy(CCLK)  (WAITWR 

WAITWEN + 1) 0.10 + Tcy(CCLK) 

(WAITWR  WAITWEN + 1) ns

tBLSLBLSH BLS LOW to BLS HIGH

time [3] 0.88 + Tcy(CCLK) 

(WAITWR  WAITWEN + 3) 0 + Tcy(CCLK)  (WAITWR 

WAITWEN + 3) 0.59 + Tcy(CCLK) 

(WAITWR  WAITWEN + 3) ns

tWEHANV WE HIGH to address invalid

time [3] 0 + Tcy(CCLK) 0.20 + Tcy(CCLK) 2.74 + Tcy(CCLK) ns

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Product data sheet Rev. 4.1 — 16 October 2013 61 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

[1] VOH = 2.5 V, VOL = 0.2 V.

[2] VIH = 2.5 V, VIL = 0.5 V.

[3] Tcy(CCLK) = 1⁄CCLK.

[4] Latest of address valid, CS LOW, OE LOW to data valid.

[5] Earliest of CS HIGH, OE HIGH, address change to data invalid.

[6] Byte lane state bit (PB) = 1.

tWEHDNV WE HIGH to data invalid

time [3] 0.78 + Tcy(CCLK) 2.54 + Tcy(CCLK) 5.96 + Tcy(CCLK) ns

tBLSHANV BLS HIGH to address

invalid time [3] 0.29 0.20 2.54 ns

tBLSHDNV BLS HIGH to data invalid

time [3] 0 2.545.37ns

Table 14. Dynamic char acteristics: Static external memory inte rface …continued

CL=30pF, T

amb =40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 4.1 — 16 October 2013 62 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

11.5 Dynamic external memory interface

[1] See Figure 18.

Table 15. Dynamic character istics: Dynamic external memory interface

CL=30pF, T

amb =40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V, EMC Dynamic Read Config Register = 0x0

(RD = 00)

Symbol Parameter Conditions Min Typ Max Unit

Common

td(SV) chip select valid delay time [1] - 1.05 1.76 ns

th(S) chip select hold time [1] 0.1 1.02 - ns

td(RASV) row address strobe valid delay time [1] - 1.51 1.95 ns

th(RAS) row address strobe hold time [1] 0.5 1.51 - ns

td(CASV) column address strobe valid delay time [1] - 0.98 1.27 ns

th(CAS) column address strobe hold time [1] 0.1 0.97 - ns

td(WV) write valid delay time [1] - 0.84 1.95 ns

th(W) write hold time [1] 0.1 0.84 - ns

td(GV) output enable valid delay time [1] - 0.95 1.86 ns

th(G) output enable hold time [1] 0.1 1 - ns

td(AV) address valid delay time [1] - 0.87 1.95 ns

th(A) address hold time [1] 0.1 0.81 - ns

Read cycle parameters

tsu(D) data input set-up time [1] 0.51 2.24 - ns

th(D) data input hold time [1] 0.57 2.41 - ns

Write cycle parameters

td(QV) data output valid delay time [1] - 2.65 4.36 ns

th(Q) data output hold time [1] 0.49 2.61 - ns

Product data sheet Rev. 4.1 — 16 October 2013 63 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

[1] See Figure 18.

Table 16. Dynamic character istics: Dynamic external memory interface

CL= 30 pF on all pins, Tamb =





C to 85



C, VDD(DCDC)(3V3) = VDD(3V3) = 3.3 V, EMC Dynamic Read Config Register = 0x1

(RD = 01), Tcy(CCLK) = 1/CCLK

Symbol Parameter Conditions Min Typ Max Unit

Common

td(SV) chip select valid delay

time [1] -3 + Tcy(CCLK) 1.5 + Tcy(CCLK) ns

th(S) chip select hold time [1] 4 + Tcy(CCLK) 3 + Tcy(CCLK) -ns

td(RASV) row address strobe valid

delay time [1] -3 + Tcy(CCLK) 1.5 + Tcy(CCLK) ns

th(RAS) row address strobe hold

time [1] 3 + Tcy(CCLK) 2.3 + Tcy(CCLK) -ns

td(CASV) column address strobe

valid delay time [1] -3.4 + Tcy(CCLK) 2.1 + Tcy(CCLK) ns

th(CAS) column address strobe

hold time [1] 4 + Tcy(CCLK) 3 + Tcy(CCLK) -ns

td(WV) write valid delay time [1] -3.4 + Tcy(CCLK) 2.1 + Tcy(CCLK) ns

th(W) write hold time [1] 4 + Tcy(CCLK) 3 + Tcy(CCLK) -ns

td(GV) output enable valid delay

time [1] -3 + Tcy(CCLK) 1.3 + Tcy(CCLK) ns

th(G) output enable hold time [1] 4 + Tcy(CCLK) 2.1 + Tcy(CCLK) -ns

td(AV) address valid delay time [1] -2.6 + Tcy(CCLK) 1.4 + Tcy(CCLK) ns

th(A) address hold time [1] 4 + Tcy(CCLK) 2.3 + Tcy(CCLK) -ns

Read cycle parameters

tsu(D) data input set-up time [1] 2.6 + Tcy(CCLK) 1.5 + Tcy(CCLK) -ns

th(D) data input hold time [1] 2.6 + Tcy(CCLK) 1.3 + Tcy(CCLK) -ns

Write cycle parameters

td(QV) data output valid delay

time [1] -2.6 + T

cy(CCLK)/2 4.8 + Tcy(CCLK)/2 ns

th(Q) data output hold time [1] 3.8 + Tcy(CCLK) 3.4 + Tcy(CCLK) -ns

Product data sheet Rev. 4.1 — 16 October 2013 64 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

11.6 Timing

Fig 14. External memory read access

addr

data

BLS

tCSLAV

tOELAV

tOELOEH

tCSLOEL

tam th(D)

tCSHOEH

tOEHANV

002aad955

tBLSLAV tCSHBLSH

Fig 15. External memory write access

addr

data

BLS/WE

CSLWEL

CSLBLSL

WELDV

CSLDV

WELWEH

BLSLBLSH

WEHANV

BLSHANV

WEHDNV

BLSHDNV

002aad956

CSLAV

Product data sheet Rev. 4.1 — 16 October 2013 65 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

Fig 16. Differential data-to-EOP transition skew and EOP wid th

002aab561

TPERIOD

differential

data lines

crossover point

source EOP width: tFEOPT

receiver EOP width: tEOPR1, tEOPR2

crossover point

extended

differential data to

SE0/EOP skew

n × TPERIOD + tFDEOP

Fig 17. MISO line set-up time in SSP Master mode

tsu(SPI_MISO)

SCK

shifting edges

MOSI

MISO

002aad326

sampling edges

Fig 18. Signal timing

002aad636

reference

clock

output signal (O)

input signal (I)

td(XXX) th(XXX)

th(D)

tsu(D)

Product data sheet Rev. 4.1 — 16 October 2013 66 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

12. ADC electrical characteristics

[1] Conditions: VSSA =0V, V

DDA =3.3V.

[2] The ADC is monotonic, there are no missing codes.

[3] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 19.

[4] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after

appropriate adjustment of gain and offset errors. See Figure 19.

[5] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the

ideal curve. See Figure 19.

[6] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset

error, and the straight line which fits the ideal transfer curve. See Figure 19.

[7] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated

ADC and the ideal transfer curve. See Figure 19.

[8] See Figure 20.

Table 17. ADC static characteristics

VDDA = 2.5 V to 3.6 V; Tamb =40 C to +85 C unless otherwise specifie d; ADC frequency 4.5 MHz.

Symbol Parameter Conditions Min Typ Max Unit

VIA analog input vol tage 0 - VDDA V

Cia analog input capacitance - - 1 pF

EDdifferential linearity error [1][2][3] --1LSB

EL(adj) integral non-linearity [1][4] --2LSB

EOoffset error [1][5] --3LSB

EGgain error [1][6] --0.5 %

ETabsolute er ror [1][7] --4LSB

Rvsi voltage source interface

resistance [8] --40k

Product data sheet Rev. 4.1 — 16 October 2013 67 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

(1) Example of an actual transfer curve.

(2) The ideal transfer curve.

(3) Differential linearity error (ED).

(4) Integral non-linearity (EL(adj)).

(5) Center of a step of the actual transfer curve.

Fig 19. ADC characteristics

1023

1022

1021

1020

1019

(2)

(1)

10241018 1019 1020 1021 1022 1023

7123456

1018

(5)

(4)

(3)

1 LSB

(ideal)

code

out

offset

error

gain

error

offset error

VIA (LSBideal)

002aae604

Vi(VREF) − VSSA

1024

1 LSB =

Product data sheet Rev. 4.1 — 16 October 2013 68 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

Fig 20. Suggested ADC interface - LPC2470 AD0[y] pin

LPC2XXX

AD0[y]SAMPLE AD0[y]

20 kΩ

3 pF 5 pF

Rvsi

VSSIO, VSSCORE

VEXT

002aad586

Product data sheet Rev. 4.1 — 16 October 2013 69 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

13. DAC electrical characteristics

14. Application information

14.1 LCD panel signal usage

Table 18. DAC electrical characteristics

VDDA = 3.0 V to 3.6 V; Tamb =40 C to +85 C unless otherwise specifie d

Symbol Parameter Conditions Min Typ Max Unit

EDdifferential linearity error - 1- LSB

EL(adj) integral non-linearity - 1.5 - LSB

EOoffset error - 0.6 - %

EGgain error - 0.6 - %

CLload capacitance - 200 - pF

RLload resistance 1 - - k

Table 19. LCD panel connections for STN single panel mode

External pin 4-bit mono STN single panel 8-bit mono STN single panel Color STN single panel

LPC2470 pin

used LCD function LPC2470 pin

used LCD function

LCDVD[23] - - - - - -

LCDVD[22] - - - - - -

LCDVD[21] - - - - - -

LCDVD[20] - - - - - -

LCDVD[19] - - - - - -

LCDVD[18] - - - - - -

LCDVD[17] - - - - - -

LCDVD[16] - - - - - -

LCDVD[15] - - - - - -

LCDVD[14] - - - - - -

LCDVD[13] - - - - - -

LCDVD[12] - - - - - -

LCDVD[11] - - - - - -

LCDVD[10] - - - - - -

LCDVD[9] - - - - - -

LCDVD[8] - - - - - -

LCDVD[7] - - P4[29][3] UD[7] P4[29][3] UD[7]

LCDVD[6] - - P4[28][3] UD[6] P4[28][3] UD[6]

LCDVD[5] - - P2[13][2] UD[5] P2[13][2] UD[5]

LCDVD[4] - - P2[12][2] UD[4] P2[12][2] UD[4]

LCDVD[3] P2[9][1] UD[3] P2[9][1] UD[3] P2[9][1] UD[3]

LCDVD[2] P2[8][1] UD[2] P2[8][1] UD[2] P2[8][1] UD[2]

LCDVD[1] P2[7][1] UD[1] P2[7][1] UD[1] P2[7][1] UD[1]

LCDVD[0] P2[6][1] UD[0] P2[6][1] UD[0] P2[6][1] UD[0]

Product data sheet Rev. 4.1 — 16 October 2013 70 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

[1] ETM replaced with LCD pins.

[2] External interrupt pins EINT1, EINT2, EINT3 replaced with LCD pins.

[3] Timer pins MAT2[0] and MAT2[1] replaced with LCD pins.

LCDLP P2[5][1] LCDLP P2[5][1] LCDLP P2[5][1] LCDLP

LCDENAB/

LCDM P2[4][1] LCDENAB/

LCDM

LCDFP P2[3][1] LCDFP P2[3][1] LCDFP P2[3][1] LCDFP

LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK

LCDLE P2[1][1] LCDLE P2[1][1] LCDLE P2[1][1] LCDLE

LCDPWR P2[0][1] CDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR

LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN P2[0][2] LCDPWR

Table 19. LCD panel connections for STN single panel mode

External pin 4-bit mono STN single panel 8-bit mono STN single panel Color STN single panel

LPC2470 pin

used LCD function LPC2470 pin

used LCD function

Table 20. LCD panel connections for STN dual panel mode

External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel

LPC2470 pin

used LCD function LPC2470 pin

used LCD function

LCDVD[23] - - - - - -

LCDVD[22] - - - - - -

LCDVD[21] - - - - - -

LCDVD[20] - - - - - -

LCDVD[19] - - - - - -

LCDVD[18] - - - - - -

LCDVD[17] - - - - - -

LCDVD[16] - - - - - -

LCDVD[15] - - P1[29][4] LD[7] P1[29][4] LD[7]

LCDVD[14] - - P1[28][4] LD[6] P1[28][4] LD[6]

LCDVD[13] - - P1[27][4] LD[5] P1[27][4] LD[5]

LCDVD[12] - P1[26][4] LD[4] P1[26][4] LD[4]

LCDVD[11] P4[29][3] LD[3] P1[25][4] LD[3] P1[25][4] LD[3]

LCDVD[10] P4[28][3] LD[2] P1[24][4] LD[2] P1[24][4] LD[2]

LCDVD[9] P2[13][2] LD[1] P1[23][4] LD[1] P1[23][4] LD[1]

LCDVD[8] P2[12][2] LD[0] P1[22][4] LD[0] P1[22][4] LD[0]

LCDVD[7] - - P1[21][4] UD[7] P1[21][4] UD[7]

LCDVD[6] - - P1[20][4] UD[6] P1[20][4] UD[6]

LCDVD[5] - - P2[13][2] UD[5] P2[13][2] UD[5]

LCDVD[4] - - P2[12][2] UD[4] P2[12][2] UD[4]

LCDVD[3] P2[9][1] UD[3] P2[9][1] UD[3] P2[9][1] UD[3]

LCDVD[2] P2[8][1] UD[2] P2[8][1] UD[2] P2[8][1] UD[2]

LCDVD[1] P2[7][1] UD[1] P2[7][1] UD[1] P2[7][1] UD[1]

Product data sheet Rev. 4.1 — 16 October 2013 71 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

[1] ETM replaced with LCD pins.

[2] External interrupt pins EINT1, EINT2, EINT3 replaced with LCD pins.

[3] Timer pins MAT2[0] and MAT2[1] replaced with LCD pins.

[4] USB OTG pins replaced by LCD pins.

LCDVD[0] P2[6][1] UD[0] P2[6][1] UD[0] P2[6][1] UD[0]

LCDLP P2[5][1] LCDLP P2[5][1] LCDLP P2[5][1] LCDLP

LCDENAB/

LCDM P2[4][1] LCDENAB/

LCDM

LCDFP P2[3][1] LCDFP P2[3][1] LCDFP P2[3][1] LCDFP

LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK

LCDLE P2[1][1] LCDLE P2[1][1] LCDLE P2[1][1] LCDLE

LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR

LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN

Table 20. LCD panel connections for STN dual panel mode

External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel

LPC2470 pin

used LCD function LPC2470 pin

used LCD function

Table 21. LCD panel connections for TFT panels

External

pin TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit

LPC2470

pin used LCD

function LPC2470

pin used LCD

function LPC2470 pin

used LCD

function LPC2470

pin used LCD

function

LCDVD[23] P1[29][4] BLUE3 P1[29][4] BLUE4 P1[29][4] BLUE4 P1[29][4] BLUE7

LCDVD[22] P1[28][4] BLUE2 P1[28][4] BLUE3 P1[28][4] BLUE3 P1[28][4] BLUE6

LCDVD[21] P1[27][4] BLUE1 P1[27][4] BLUE2 P1[27][4] BLUE2 P1[27][4] BLUE5

LCDVD[20] P1[26][4] BLUE0 P1[26][4] BLUE1 P1[26][4] BLUE1 P1[26][4] BLUE4

LCDVD[19] - - P2[13][2] BLUE0 P2[13][2] BLUE0 P2[13][2] BLUE3

LCDVD[18] - - - - P2[12][2] intensity P2[12][2] BLUE2

LCDVD[17] - - - - - - P0[9][5] BLUE1

LCDVD[16] - - - - - - P0[8][5] BLUE0

LCDVD[15] P1[25][4] GREEN3 P1[25][4] GREEN5 P1[25][4] GREEN4 P1[25][4] GREEN7

LCDVD[14] P1[24][4] GREEN2 P1[24][4] GREEN4 P1[24][4] GREEN3 P1[24][4] GREEN6

LCDVD[13] P1[23][4] GREEN1 P1[23][4] GREEN3 P1[23][4] GREEN2 P1[23][4] GREEN5

LCDVD[12] P1[22][4] GREEN0 P1[22][4] GREEN2 P1[22][4] GREEN1 P1[22][4] GREEN4

LCDVD[11] - - P1[21][4] GREEN1 P1[21][4] GREEN0 P1[21][4] GREEN3

LCDVD[10] - - P1[20][4] GREEN0 P1[20][4] intensity P1[20][4] GREEN2

LCDVD[9] - - - - - - P0[7][5] GREEN1

LCDVD[8] - - - - - - P0[6][5] GREEN0

LCDVD[7] P2[9][1] RED3 P2[9][1] RED4 P2[9][1] RED4 P2[9][1] RED7

LCDVD[6] P2[8][1] RED2 P2[8][1] RED3 P2[8][1] RED3 P2[8][1] RED6

LCDVD[5] P2[7][1] RED1 P2[7][1] RED2 P2[7][1] RED2 P2[7][1] RED5

LCDVD[4] P2[6][1] RED0 P2[6][1] RED1 P2[6][1] RED1 P2[6][1] RED4

LCDVD[3] - - P2[12][2] RED0 P4[29][3] RED0 P4[29][3] RED3

Product data sheet Rev. 4.1 — 16 October 2013 72 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

[1] ETM replaced with LCD pins.

[2] External interrupt pins EINT1, EINT2, EINT3 replaced with LCD pins.

[3] Timer pins MAT2[0] and MAT2[1] replaced with LCD pins.

[4] USB OTG pins replaced with LCD pins.

[5] I2S pins replaced with LCD pins.

14.2 Suggested boot memory interface solutions

‘a_m’ and ‘a_b’ in the following figures refer to the highest order address line of the

memory chip and the highest order microcontroller’s address line used respectively.

LCDVD[2] - - - - P4[28][3] intensity P4[28][3] RED2

LCDVD[1] - - - - - - P0[5][5] RED1

LCDVD[0] - - - - - - P0[4][5] RED0

LCDLP P2[5][1] LCDLP P2[5][1] LCDLP P2[5][1] LCDLP P2[5][1] LCDLP

LCDENAB/

LCDM P2[4][1] LCDENAB/

LCDM P2[4][1] LCDENAB/L

CDM

LCDFP P2[3][1] LCDFP P2[3][1] LCDFP P2[3][1] LCDFP P2[3][1] LCDFP

LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK

LCDLE P2[1][1] LCDLE P2[1][1] LCDLE P2[1][1] LCDLE P2[1][1] LCDLE

LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR

LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN

Table 21. LCD panel connections for TFT panels

External

pin TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit

LPC2470

pin used LCD

function LPC2470

pin used LCD

function LPC2470 pin

used LCD

function LPC2470

pin used LCD

function

Fig 21. Booting from two 8-bit memory chips

002aad322

IO[7:0]

A[a_m:0]

CS1

BLS1

D[15:8]

A[a_b:1]

IO[7:0]

A[a_m:0]

BLS0

D[7:0]

8-bit

MEMORY 8-bit

MEMORY

Product data sheet Rev. 4.1 — 16 October 2013 73 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

14.3 Suggested USB interface solutions

Fig 22. Booting from a single 16- bit memory chip

002aad323

IO[15:0]

A[a_m:0]

CS1

D[15:0]

A[a_b:1]

BLS1

BLS0

16-bit

MEMORY

Fig 23. LPC2470 USB interface on a self-powered device

LPC24XX

USB-B

connector

USB_D+

USB_CONNECT

soft-connect switch

USB_D−

BUS

SSIO,

SSCORE

DD(3V3)

1.5 kΩ

RS = 33 Ω

002aad587

RS = 33 Ω

USB_UP_LED

Product data sheet Rev. 4.1 — 16 October 2013 74 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

Fig 24. LPC2470 USB interface on a bus-powered device

LPC24XX

VDD(3V3)

1.5 kΩ

USB_UP_LED

002aad588

USB-B

connector

USB_D+

USB_D−

VBUS

VSSIO, VSSCORE

RS = 33 Ω

Product data sheet Rev. 4.1 — 16 October 2013 75 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

Fig 25. LPC2470 USB OTG port configuration: USB port 1 OTG dual-role device, USB port 2 host

USB_UP_LED1

USB_D+1

USB_D−1

USB_PWRD2

USB_SDA1

USB_SCL1

RSTOUT

15 kΩ15 kΩ

LPC24XX

USB-A

connector

Mini-AB

connector

33 Ω

VDD

USB_UP_LED2 VDD

USB_OVRCR2

LM3526-L

ENA

5 V

OUTA

FLAGA

VDD

D+

D−

VBUS

USB_PPWR2

USB_D+2

USB_D−2

002aad589

R4 R5 R6

R1 R2 R3 R4

USB_INT1

RESET_N

ADR/PSW

SPEED

SUSPEND

OE_N/INT_N

SCL

SDA

INT_N

VBUS

ISP1302 VSSIO,

VSSCORE

VSSIO,

VSSCORE

Product data sheet Rev. 4.1 — 16 October 2013 76 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

Fig 26. LPC2470 USB OTG port configuration: VP_VM mode

USB_TX_DP1

USB_TX_DM1

USB_RCV1

USB_RX_DP1

USB_RX_DM1

USB_SCL1

USB_SDA1

SPEED

ADR/PSW

SDA

SCL

RESET_N

INT_N

SUSPEND

OE_N/INT_N

SE0_VM

DAT_VP

RCV VBUS

LPC24XX ISP1302 USB MINI-AB

connector

33 Ω

002aad590

USB_TX_E1

RSTOUT

VDD

USB_INT1

USB_UP_LED1 VDD

VSSIO,

VSSCORE

Product data sheet Rev. 4.1 — 16 October 2013 77 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

Fig 27. LPC2470 USB OTG port configuration: USB port 2 device, USB port 1 host

USB_UP_LED1

USB_D+1

USB_D−1

USB_PWRD1

15 kΩ15 kΩ

LPC24XX

USB-A

connector

USB-B

connector

33 Ω

002aad595

VDD

USB_UP_LED2

USB_CONNECT2

VDD

USB_OVRCR1

USB_PPWR1

LM3526-L

ENA

5 V

FLAGA

OUTA

VDD

D+

D−

D+

D−

VBUS

USB_D+2

USB_D−2

VBUS VBUS

VSSIO,

VSSCORE

VSSIO,

VSSCORE

Product data sheet Rev. 4.1 — 16 October 2013 78 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

14.4 Crystal oscillator XTAL input and component selection

The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a

clock in slave mode, it is recommende d that the inpu t be coupled throug h a cap acitor with

Ci = 100 pF. To limit the input voltage to the specified range, choose an additio nal

capacitor to ground Cg which attenuates the input voltage by a factor Ci / (Ci + Cg). In

slave mode, a minimum of 200 mV (RMS) is needed.

Fig 28. LPC2470 USB OTG port configuration: USB port 1 host, USB port 2 host

USB_UP_LED1

USB_D+1

USB_D−1

USB_PWRD1

USB_PWRD2

15 kΩ

15 kΩ15 kΩ

15 kΩ

LPC24XX

USB-A

connector

USB-A

connector

33 Ω

002aad596

VDD

USB_UP_LED2 VDD

USB_OVRCR1

USB_OVRCR2

USB_PPWR1

LM3526-L

ENA

ENB

5 V

FLAGA

OUTA

OUTB

FLAGB

VDD

D+

D−

D+

D−

VBUS

USB_PPWR2

USB_D+2

USB_D−2

VSSIO,

VSSCORE

VSSIO,

VSSCORE

Fig 29. Slave mode operation of the on-chip oscillator

LPC2xxx

XTAL1

100 pF Cg

002aae718

Product data sheet Rev. 4.1 — 16 October 2013 79 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

In slave mode the input clock signal should be coup led by means of a cap acitor of 100 pF

(Figure 29), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This

corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.

The XTAL2 pin in this configuration can be left unconnected.

External components and models used in oscillation mode are shown in Figure 30 and in

Table 22 and Table 23. Since the feedback resistance is integrated on chip, only a crystal

and the capacitances CX1 and CX2 need to be connected externally in case of

fundamental mode oscillation (the fundamental frequency is represented by L, CL and

RS). Capacitance CP in Figure 30 represent s the p arallel p ackage cap acitance and sho uld

not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal

manufacturer.

Fig 30. Oscillator modes and models: oscillation mode of operation and external crystal

model used for CX1/CX2 evaluation

Table 22. Recommended values for CX1/CX2 in oscillation mode (crystal and external

components parameters): low frequency mode

Fundamental oscillation

frequency FOSC

Crystal load

capacitance CL

Maximum crystal

series resistance RS

External load

capacitors CX1/CX2

1 MHz to 5 MHz 10 pF < 300 18 pF, 18 pF

20 pF < 300 39 pF, 39 pF

30 pF < 300 57 pF, 57 pF

5 MHz to 10 MHz 10 pF < 300 18 pF, 18 pF

20 pF < 200 39 pF, 39 pF

30 pF < 100 57 pF, 57 pF

10 MHz to 15 MHz 10 pF < 160 18 pF, 18 pF

20 pF < 60 39 pF, 39 pF

15 MHz to 20 MHz 10 pF < 80 18 pF, 18 pF

002aag469

LPC2xxx

XTAL1 XTAL2

CX2

CX1

XTAL

=CLCP

Product data sheet Rev. 4.1 — 16 October 2013 80 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

14.5 RTC 32 kHz oscillator component selection

The RTC external oscillator circuit is shown in Figure 31. Sinc e the feedback resist ance is

integrated on chip, only a crystal, the capacitances CX1 and CX2 need to be connected

externally to the microcontroller.

Table 24 gives the crystal parameters that should be used. CL is the typical load

capacitance of the crystal and is usually specified by the crystal manufacturer. The actual

CL influences oscillation frequency. When using a crystal that is manufactured for a

different load capacitance, the circuit will oscillate at a slightly different frequency

(depending on the quality of the crystal) compared to the specified one. There fore for an

accurate time reference it is advise d to us e the loa d capacito rs as spec ifie d in Table 24

that belong to a specific CL. The value of external capacitances CX1 and CX2 specified in

this table are calculated from the inte rnal parasitic ca pacitances and the CL. Parasitics

from PCB and package are not taken into account.

Table 23. Recommended values for CX1/CX2 in oscillation mode (crystal and external

components parameters): high frequ ency mode

Fundamental oscillation

frequency FOSC

Crystal load

capacitance CL

Maximum crystal

series resistance RS

External load

capacitors CX1, CX2

15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF

20 pF < 100 39 pF, 39 pF

20 MHz to 25 MHz 10 pF < 160 18 pF, 18 pF

20 pF < 80 39 pF, 39 pF

Fig 31. RTC oscillator modes and mode ls : os c illation mode of operat io n an d ex te rnal

crystal model used for CX1/CX2 evaluation

Table 24. Recommended values for the RTC external 32 kHz oscillator CX1/CX2 components

Crystal load cap acitance

Maximum crystal series

resistance RS

External load capacitors CX1/CX2

11 pF < 100 k18 pF, 18 pF

13 pF < 100 k22 pF, 22 pF

15 pF < 100 k27 pF, 27 pF

002aaf495

LPC2xxx

RTCX1 RTCX2

CX2

CX1

32 kHz XTAL =CLCP

Product data sheet Rev. 4.1 — 16 October 2013 81 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

14.6 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines

The crystal should be connected on the PCB as close as possible to the oscillator input

and output pins of the chip. Take care that the load capacitors CX1, CX2, and CX3 in case

of third overtone crystal usage have a common ground plane. The external components

must also be connected to the ground plain. Loops must be made as small as possible in

order to keep the no ise couple d in via th e PCB as sm all as po ss ible . A lso parasitic s

should stay as small as possible. Values of CX1 and CX2 should be chosen sm alle r

accordingly to the increase in parasitics of the PCB layout.

14.7 Standard I/O pin configuration

Figure 32 shows the possible pin modes for standard I/O pins with analog input function:

•Digital output driver

•Digital input: Pull-up enabled/disabled

•Digital input: Pull-down enabled/disabled

•Analog input (for ADC input channels)

The default configuration for standard I/O pins is input with pull-up enabled. The weak

MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.

Fig 32. Standard I/O pin configuration with analog input

VDD

ESD

VSS

ESD

VDD

weak

pull-up

weak

pull-down

output enable

output

pull-up enable

pull-down enable

data input

analog input

select analog input

002aaf496

pin configured

as digital output

driver

pin configured

as digital input

pin configured

as analog input

Product data sheet Rev. 4.1 — 16 October 2013 82 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

14.8 Reset pin configuration

Fig 33. Reset pin configuration

VSS

reset

002aaf274

VDD

Rpu ESD

ESD

20 ns RC

GLITCH FILTER PIN

Product data sheet Rev. 4.1 — 16 October 2013 83 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

15. Package outline

Fig 34. Package outline SOT459-1 (LQFP208)

UNIT A1A2A3bpcE

(1) eH

ELL

pZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 1.45

1.35 0.25 0.27

0.17 0.20

0.09 28.1

27.9 0.5 30.15

29.85 1.43

1.08 7

0.080.121 0.08

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT459-1 136E30 MS-026 00-02-06

03-02-20

D(1)

28.1

27.9

30.15

29.85

1.43

1.08

pin 1 index

EA1

detail X L

(A )

HA2

vMB

vMA

208

157

156 105

104

0 5 10 mm

scale

LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1

max.

1.6

Product data sheet Rev. 4.1 — 16 October 2013 84 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

Fig 35. Package outline SOT950-1 (TFBGA208)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT950-1 - - -

SOT950-1

06-06-01

06-06-14

UNIT A

max

mm 1.2 0.4

0.3 0.8

0.6 15.1

14.9 15.1

14.9 0.8 12.8 0.15 0.08 0.1

DIMENSIONS (mm are the original dimensions)

TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm

0 5 10 mm

scale

A2b

0.5

0.4

D E e e1e2

12.8

v w y

0.12

ball A1

index area

eAC B

∅ vMC∅ wM

246810121416

1357911131517

ball A1

index area

B A

detail X

AA2

Product data sheet Rev. 4.1 — 16 October 2013 85 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

16. Abbreviations

Table 25. Acronym list

Acronym Description

ADC Analog-to-Digital Converter

AHB Advanced High-performance Bus

AMBA Advanced Microcontroller Bus Architecture

APB Advanced Peripheral Bus

BLS Byte Lane Select

BOD BrownOut Detection

CAN Controller Area Network

DAC Digital-to-Analog Converter

DCC Debug Communication Channel

DMA Direct Memory Access

EOP End Of Packet

ETM Embedded Trace Macrocell

GPIO General Purpose Input/Output

IrDA Infrared Data Association

JTAG Joint Test Action Group

LCD Liquid Crystal Display

MII Media Independent Interface

MIIM Media Independent Interface Management

OHCI Open Host Controller Interface

OTG On-The-Go

PHY Physical Layer

PLL Phase-Locked Loop

POR Power-On Reset

PWM Pulse Width Modulator

RMII Reduced Media Independent Interface

SD/MMC Secure Digital/MultiMediaCard

SE0 Single Ended Zero

SPI Serial Peripheral Interface

SSI Synchronous Serial Interface

SSP Synchronous Serial Port

TTL Transistor-Transistor Logi c

UART Universal Asynchronous Receiver/Transmitter

USB Universal Serial Bus

Product data sheet Rev. 4.1 — 16 October 2013 86 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

17. Revision history

Table 26. Revision history

Document ID Release date Data sheet statu s Change notice Supersedes

LPC2470 v.4.1 20131016 Product data sheet - LPC2470 v.4

Modifications: •Table 4 “Pin description”, Table note 9: Changed glitch filter spec from 5 ns to 10 ns.

•Table 10 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40.

•Table 16 “Dynamic characteristics: Dynamic external memory interface”: Changed td(QV) typ

and max.

LPC2470 v.4 20110908 Product data sheet - LPC2470 v.3

Modifications: •Table 4 “Pin description”: Updated description for USB_U P_ LED1 and USB_UP_LED2.

•Table 6 “Limiting values”: Added “non-operating” to conditions column of Tstg.

•Table 6 “Limiting values”: Updated Table note [5].

•Table 8 “Thermal resistance value (C/W): ±15 %”: Added new table.

•Table 14 “Dynamic characteristics: S t atic external memory interface”: Removed “AHB clock

= 1 MHz”.

•Table 14 “Dynamic characteristics: Static external memory interface”: Swapped min/max

values for tam.

•Table 14 “Dynamic characteristics: Static external memory interface”: Updated tWEHDNV

spec.

•Table 15 “Dynamic characteristics: Dynamic external memory interface”: Removed “AHB

clock = 1 MHz”.

•Table 16 “Dynamic characteristics: Dynamic external memory interface”: Added new table.

•Section 14.7 “Standard I/O pin configuration” Updated bullets.

Product data sheet Rev. 4.1 — 16 October 2013 87 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

LPC2470 v.3 20110214 Product data sheet - LPC2470 v.2

Modifications: •Changed data sheet status to Product data sheet.

•Table 4 “Pin description”: Added Table note 14 for XTAL1 and XTAL2 pins.

•Table 4 “Pin description”: Added Table note 15 for RTCX1 and RTCX2 pins.

•Table 4 “Pin description”: Added Table note 16 fo r DBGEN, TMS, TDI, TRST, and RTCK

pins.

•Table 4 “Pin description”: Added Table note 17 for TCK and TDO pins.

•Table 8 “Static characteristics”: Removed Rpu.

•Table 8 “S tatic characteristics”: Added Table note 3 to IDD(DCDC)pd(3V3), IDD(DCDC)dpd(3V3), and

IBAT.

•Table 8 “Static characteristics”: Changed Vhys typ for I2C-bus pins from 0.5VDD to 0.05VDD.

•Added Table 10 “Dynamic characteristic: internal oscillators”.

•Added Table 11 “Dynamic characteristic: I/O pins[1]”.

•Table 13 “Dynamic characteristics: Static external memory interfa c e”: Updated min, typical

and max values for th(D).

•Table 14 “Dynamic characteristics: Dynamic external memory interface”: Added Table

note 1.

•Table 14 “Dynamic characteristics: Dynamic external memory interface”: Updated text

under caption.

•Added Table 16 “DAC electrical characteristics”.

•Added Section 9 “Thermal characteristics”.

•Added Section 10.3 “Electrical pin characteristics”

•Added Section 14.4 “Crystal oscillator XTAL input and component selection”.

•Added Section 14.5 “RTC 32 kHz oscillator component selection” .

•Added Section 14.7 “Standard I/O pin configuration”

•Added Section 14.8 “Reset pin configuration”

•Moved Figure 13 “External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)”

to below Table 9 “Dynamic characteristics”.

•Updated Figure 19 “ADC characteristics”.

LPC2470 v.2 20091015 Preliminary data sheet - LPC2470 v.1

Modifications: •Table 6: Changed ESD min/max to 2500/+2500.

•Table 8: Up dated conditions and typical values for IDD(DCDC)act(3V3).

•Table 8: Updated Table note 13.

•Table 8: Updated min, typical and max values for oscillator pins.

•Added deep power-down mode info rmation.

•Added Section 11.3 “XTAL1 input”.

•Figure 23: Changed ISP1301 to ISP1302.

•Figure 24: Changed ISP1301 to ISP1302.

•Section 7.26.3 “Brownout detection”: Changed VDD(3V3) to VDD(DCDC)(3V3).

LPC2470 v.1 20081027 Preliminary data sheet - -

Table 26. Revision history …continued

Document ID Release date Data sheet statu s Change notice Supersedes

Product data sheet Rev. 4.1 — 16 October 2013 88 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

18. Legal information

18.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

18.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

18.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 4.1 — 16 October 2013 89 of 91

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omo tive use. It is neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product cl aims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

18.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

I2C-bus — logo is a trademark of NXP B.V.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 4.1 — 16 October 2013 90 of 91

continued >>

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

20. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9

7 Functional description . . . . . . . . . . . . . . . . . . 26

7.1 Architectural overview . . . . . . . . . . . . . . . . . . 26

7.2 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 27

7.3 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.4 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 28

7.4.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 29

7.5 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 29

7.6 External memory controller. . . . . . . . . . . . . . . 29

7.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

7.7 General purpose DMA controller . . . . . . . . . . 30

7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7.8 Fast general purpose parallel I/O . . . . . . . . . . 31

7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

7.9 LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 32

7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7.10 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

7.11 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 34

7.11.1 USB device controller. . . . . . . . . . . . . . . . . . . 34

7.11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

7.11 .2 USB host controller. . . . . . . . . . . . . . . . . . . . . 34

7.11.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

7.11.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 35

7.11.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

7.12 CAN controller and acceptance filters . . . . . . 35

7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

7.13 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.14 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.15 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.16 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 37

7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

7.17 SSP serial I/O controller . . . . . . . . . . . . . . . . . 37

7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

7.18 SD/MMC card interface . . . . . . . . . . . . . . . . . 37

7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

7.19 I2C-bus serial I/O controller . . . . . . . . . . . . . . 38

7.19.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

7.20 I2S-bus serial I/O controllers . . . . . . . . . . . . . 38

7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

7.21 Gene ral purpose 32-bit timers/external event

counters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

7.22 Pulse width modulator . . . . . . . . . . . . . . . . . . 40

7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

7.23 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 41

7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

7.24 RTC and battery RAM . . . . . . . . . . . . . . . . . . 41

7.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

7.25 Clocking and power control . . . . . . . . . . . . . . 42

7.25.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 42

7.25.1.1 Internal RC oscilla tor . . . . . . . . . . . . . . . . . . . 42

7.25.1.2 Main oscilla tor . . . . . . . . . . . . . . . . . . . . . . . . 42

7.25.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 43

7.25.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

7.25.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 43

7.25.4 Power control. . . . . . . . . . . . . . . . . . . . . . . . . 44

7.25.4.1 Idle mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

7.25.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 44

7.25.4.3 Power-down mode. . . . . . . . . . . . . . . . . . . . . 44

7.25.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 45

7.25.4.5 Power domains . . . . . . . . . . . . . . . . . . . . . . . 45

7.26 System control. . . . . . . . . . . . . . . . . . . . . . . . 45

7.26.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

7.26.2 Boot process . . . . . . . . . . . . . . . . . . . . . . . . . 46

7.26.3 Brownout detection . . . . . . . . . . . . . . . . . . . . 46

7.26.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

7.26.5 External interrupt inputs. . . . . . . . . . . . . . . . . 47

7.26.6 Memory mapping control . . . . . . . . . . . . . . . . 47

7.27 Emulation and debugging . . . . . . . . . . . . . . . 47

7.27.1 EmbeddedIC E . . . . . . . . . . . . . . . . . . . . . . . . 47

7.27.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 47

7.27.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 48

8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 49

9 Thermal characteristics . . . . . . . . . . . . . . . . . 50

10 Static characteristics . . . . . . . . . . . . . . . . . . . 51

10.1 Power-down mode. . . . . . . . . . . . . . . . . . . . . 54

10.2 Deep power-down mode . . . . . . . . . . . . . . . . 55

10.3 Electrical pin characteristics. . . . . . . . . . . . . . 57

11 Dynamic characteristics. . . . . . . . . . . . . . . . . 58

11.1 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 59

11.2 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

11.3 USB interface. . . . . . . . . . . . . . . . . . . . . . . . . 59

NXP Semiconductors LPC2470

Flashless 16-bit/32-bit microcontroller

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 16 October 2013

Document identifier: LPC2470

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

11.4 Static external memory interface . . . . . . . . . . 60

11.5 Dynamic external memory interface. . . . . . . . 62

11.6 Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

12 ADC electrical characteristics . . . . . . . . . . . . 66

13 DAC electrical characteristics . . . . . . . . . . . . 69

14 Application information. . . . . . . . . . . . . . . . . . 69

14.1 LCD panel signal usage . . . . . . . . . . . . . . . . . 69

14.2 Sug gested boot memory interface solutions. . 72

14.3 Sug gested USB interface solutions . . . . . . . . 73

14.4 Cryst al oscillator XTAL input and component

selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

14.5 RTC 32 kHz oscillator componen t selection. . 80

14.6 XTAL and RTCX Printed Circuit Board

(PCB) layout guidelines . . . . . . . . . . . . . . . . . 81

14.7 Standard I/O pin configuration . . . . . . . . . . . . 81

14.8 Reset pin configuration. . . . . . . . . . . . . . . . . . 82

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 83

16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 85

17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 86

18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 88

18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 88

18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 88

18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 89

19 Contact information. . . . . . . . . . . . . . . . . . . . . 89

20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90