PC410S0NIP0F Series PC410S0NIP0F Series High Speed 10Mb/s, High CMR Mini-flat Package OPIC Photocoupler Description Agency approvals/Compliance PC410S0NIP0F Series contains a LED optically coupled to an OPIC. It is packaged in a 8 pin mini-flat. Input-output isolation voltage(rms) is 3.75 kV. High speed response (TYP. 10Mb/s) and CMR is MIN. 10kV/s. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC410S) 2. Approved by VDE, DIN EN60747-5-2() (as an option), file No. 40009162 (as model No. PC410S) 3. Package resin : UL flammability grade (94V-0)) () Features DIN EN60747-5-2 : successor standard of DIN VDE0884. Applications 1. 8 pin Mini-flat package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. 10kV/s, CML : MIN. -10kV/s) 4. High speed response (tPHL : TYP. 48ns, tPLH : TYP. 50ns) 5. Isolation voltage between input and output (Viso(rms) : 3.75kV) 6. Lead-free and RoHS driective compliant 1. Programmable controller 2. Inverter * "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A09001EN Date Sep. 1. 2006 (c) SHARP Corporation PC410S0NIP0F Series Internal Connection Diagram 1 1 8 2 7 3 6 4 5 2 3 4 N.C. Anode Cathode N.C. 5 6 7 8 GND VO (Open collector) VE (Enable) VCC As for N.C. pins (, ), external connection is not allowed. Truth table Input H L H L Enable H H L L Output L H H H L : Logic (0) H : Logic (1) Outline Dimensions (Unit : mm) 5 1 1.27 2 3 Rank mark 4 Primary side mark 1 0.406 5 PC410S 4 0.05 6 0.076 1.27 Date code 2 4 VDE Identification mark 0.4060.076 Rank mark Date code 5.0800.127 0.305MIN. 3.1750.127 0.2030.102 3.1750.127 0.2000.025 5.0800.127 3 0.05 0.2000.025 Primary side mark 7 0.305MIN. Product mass : approx. 0.15g 0.2030.102 PC410S 8 SHARP mark "S" 5.9940.203 6 5.9940.203 7 3.9370.127 8 SHARP mark "S" 2. Mini-flat Package (VDE option) [ex. PC410S0YIP0F] 3.9370.127 1. Mini-flat Package [ex. PC410S0NIP0F] Product mass : approx. 0.15g Plating material : Pd (Au flush) Sheet No.: D2-A09001EN 2 PC410S0NIP0F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production Mark A.D. A 2002 B 2003 C 2004 D 2005 E 2006 F 2007 H 2008 J 2009 K 2010 L 2011 M 2012 N : Mark P R S T U V W X A B C : 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Rank mark With or without. Sheet No.: D2-A09001EN 3 PC410S0NIP0F Series Absolute Maximum Ratings Parameter Symbol *1 Forward current IF Reverse voltage VR Input Power dissipation P Supply voltage VCC Enable voltage VE Enable inpout current IE Output High level output voltage VOH Low level output current IOL *2 Output collector power dissipation PC Operating temperature Topr Storage temperature Tstg *3 Isolation voltage Viso(rms) *4 Soldering temperature Tsol Rating 20 5 40 7 VCC+0.5 5 7 50 85 -40 to +85 -55 to +125 3.75 270 Electro-optical Characteristics *6 *1 Refer to Fig.4 *2 Refer to Fig.5 *3 40 to 60%RH, AC for 1minute, f=60Hz *4 For 10s (Unless otherwise specified Ta=-40 to 85C) Symbol Forward voltage VF Reverse current Terminal capacitance High level output voltage Low level output voltage High level enable current Low level enable current IR Ct IOH VOL IEH IEL High level supply current ICCH Low level supply current ICCL "HighLow" input threshold current Isolation resistance Floating capacitance "HighLow" propagation delay time "LowHigh" propagation delay time Rise time Fall time *7 Distortion of pulse width Propagation delay skew "HighLow" enable propagation delay time "LowHigh" enable propagation delay time Instantaneous common mode rejection voltage (High level output) Instantaneous common mode rejection voltage (Low level output) IFHL RISO Cf tPHL tPLH tr tf tW tPSK Transfer characteristics Response time *6 Output Input Parameter (Ta=Topr) Unit mA V mW V V mA V mA mW C C kV C tEHL tELH CMH CML Condition MIN. 1.3 IF=10mA Ta=25C, IF=10mA 1.4 Ta=25C, VR=5V - Ta=25C, V=0, f=1MHz - VCC=VO=5.5V, VE=2V, IF=250A - VCC=5.5V, VE=2V, IF=5mA, IOL=13mA - VCC=5.5V, VE=2V - VCC=5.5V, VE=0.5V - VCC=5.5V, VE=VCC, IF=0 - VCC=5.5V, VE=0.5V, IF=0 - VCC=5.5V, VE=VCC, IF=10mA - VCC=5.5V, VE=0.5V, IF=10mA - VCC=5V, VE=2V, VO=0.6V, RL=350 - Ta=25C, DC500V, 40 to 60%RH 5x1010 Ta=25C, V=0, f=1MHz - 25 25 Ta=25C, IF=7.5mA, VCC=5V, - RL=350W, CL=15pF, - - - TYP.*5 - 1.5 - 60 0.02 0.4 -0.5 -0.7 5 5 7 5.5 2.5 1011 0.6 48 50 20 10 - - MAX. 1.8 1.75 10 - 100 0.6 -1.6 -1.6 - 10 - 13 5 - - 75 75 - - 35 40 Unit V A pF A V mA mA mA mA mA mA mA pF ns ns ns ns ns ns Ta=25 C, IF=7.5mA, VCC=5V, RL=350, CL=15pF, VEH=3V VEL=0 - 15 - ns - 10 - ns IF=0, VO(Min)=2V Ta=25C, VCC=5V, VCM=1kV(P-P), IF=5mA, RL=350 VO(MAX)=0.8V 10 20 - kV/s -10 -20 - kV/s *5 All typical values at VCC=5V, Ta=25C *6 It shall connect a by-pass capacitor of 0.01F or more between VCC (pin ) and GND (pin ) near the device, when it measures the transfer characteristics and the output side characteristics *7 Distortion of pulse width tw= | tPHL-tPLH | Sheet No.: D2-A09001EN 4 PC410S0NIP0F Series Model Line-up Taping 1 500pcs/reel DIN EN60747-5-2 Approved - Model No. PC410S0NIP0F PC410S0YIP0F Package Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A09001EN 5 PC410S0NIP0F Series Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time 7.5mA 8 2 7 3 6 IF 5V 3.75mA 0.1F 0mA IF Pulse input 1 tPHL 350 VO 4 5V 90% CL 47 tPLH VO 5 1.5V 10% *CL includes the probe and wiring capacitance. VOL tr tf Timing diagram Fig.2 Test Circuit for Enable Propagation Delay Time VE 3V Pulse input 1 8 2 7 3 6 5V VE 1.5V 0.1F 0.5V IF=7.5mA tEHL 350 4 5V VO CL 47 tELH VO 5 1.5V VOL Timing diagram *CL includes the probe and wiring capacitance. Fig.3 Test Circuit for Instantaneous Common Mode Rejection Voltage 1kV B IF A 1 8 2 7 3 6 4 5 5V VCM 0V 0.1F SW 350 CL VCM VO (IF=0) VO (IF=5mA) 5V VO(MIN.) When the switch for LED sets to A VO(MAX.) When the switch for LED sets to B V OL *CL includes the probe and wiring capacitance. Sheet No.: D2-A09001EN 6 PC410S0NIP0F Series Fig.4 Forward Current vs. Ambient Temperature Fig.5 Output Collector Power Dissipation vs. Ambient Temperature 100 Collector power dissipation PC (mW) Forward current IF (mA) 25 20 15 10 5 85 80 60 40 20 85 85 0 -40 -25 0 25 50 100 75 0 -40 -25 125 0 Fig.6 Forward Current vs. Forward Voltage High level output current IOH (A) 100 Forward current IF (mA) Ta=25C Ta=0C Ta=50C Ta=100C Ta=-40C 1 0.1 1 1.2 1.4 1.6 1.8 10 125 1 0.1 0.01 0.001 -60 2 -40 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Fig.8 Low Level Output Voltage vs. Ambient Temperature Fig.9 Input Threshold Current vs. Ambient Temperature 5 0.8 VCC=5.5V VE=2V IF=5mA 0.6 16mA 0.5 Input threshold current IFHL (mA) Low level output voltage VOL (V) 100 VCC=VO=5.5V IF=250A VE=2V Forward voltage VF (V) 0.7 75 50 Fig.7 High Level Output Current vs. Ambient Temperature 100 10 25 Ambient temperature Ta (C) Ambient temperature Ta (C) 12.8mA 9.6mA 0.4 IOL=6.4mA 0.3 0.2 4 VCC=5V VO=0.6V VE=2V RL=350 3 2 1 0.1 0 -60 -40 -20 0 20 40 60 80 0 -60 100 -40 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Ambient temperature Ta (C) Sheet No.: D2-A09001EN 7 PC410S0NIP0F Series Fig.10 Output Voltage vs. Forward Current Fig.11 Propagation Delay Time vs. Forward Current 6 100 VCC=5V CL=15pF RL=350 Propagation delay time tPLH/tPHL (ns) VCC=5V VE=2V 5 Output voltage VO (V) Ta=25C 4 3 RL=350 2 RL=1k RL=4k 1 0 80 60 tPLH 40 tPHL 20 0 0 1 2 3 4 5 5 7 9 Forward current IF (mA) Fig.12-a Propagation Delay Time vs. Ambient Temperature Propagation delay time tPLH, tPHL (ns) Propagation delay time tPLH, tPHL (ns) RL=350 VCC=5V IF=7.5mA CL=15pF tPHL 40 tPLH 20 0 -60 -40 -20 0 20 40 60 80 80 60 tPLH 40 tPHL 20 0 -60 100 RL=1k VCC=5V IF=7.5mA CL=15pF -40 -20 Ambient temperature Ta (C) 0 20 40 60 80 100 80 100 Ambient temperature Ta (C) Fig.12-c Propagation Delay Time vs. Ambient Temperature Fig.13 Response Time vs. Ambient Temperature 140 50 RL=4k VCC=5V IF=7.5mA CL=15pF 40 tPLH Rise, Fall time tr/tf (ns) Propagation delay time tPLH, tPHL (ns) 15 100 60 120 13 Fig.12-b Propagation Delay Time vs. Ambient Temperature 100 80 11 Forward current IF (mA) 100 80 60 30 tr 20 10 40 20 -60 VCC=5V IF=7.5mA CL=15pF RL=350 tPHL -40 -20 0 20 tf 40 60 80 0 -60 100 Ambient temperature Ta (C) -40 -20 0 20 40 60 Ambient temperature Ta (C) Sheet No.: D2-A09001EN 8 PC410S0NIP0F Series Fig.14 Distortion of Pulse width vs. Ambient Temperature 60 50 VCC=5V IF=7.5mA CL=15pF Enable propagation delay time (ns) Pulse width distrrion tw (ns) 80 Fig.15 Erable Propagation Delay Time vs. Ambient Temperature 40 RL=4K 20 RL=1K 0 -20 -60 RL=350 -40 -20 0 20 40 60 80 40 VCC=5V VEH=3mA VEL=0 RL=350 30 20 10 0 -60 100 Ambient temperature Ta (C) tELH tEHL -40 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Remarks : Please be aware that all data in the graph are just for reference and anot for guarantee. Sheet No.: D2-A09001EN 9 PC410S0NIP0F Series Design Considerations Recommended operating conditions Parameter Low level input current High level input current High level enable input voltage Low level enable input voltage Supply voltage Fan out (TTL load) Output pull-up resistor Operating temperature Symbol IFL IFH VEH VEL VCC N RL Topr MIN. 0 8 2 0 4.5 - 330 -40 TYP. - - - - - - - - MAX. 250 15 VCC 0.8 5.5 5 4 000 85 Unit A mA V V V - C Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01F or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. As for N.C. pins (, ), external connection is not allowed. This product is not designed against irradiation and incorporates non-coherent LED. Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. IFHL. Sheet No.: D2-A09001EN 10 PC410S0NIP0F Series Recommended foot print (reference) 1.9 0.64 1.27 1.27 1.27 7.49 (Unit : mm) Sheet No.: D2-A09001EN 11 PC410S0NIP0F Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak (package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A09001EN 12 PC410S0NIP0F Series Cleaning instructions Solvent cleaning : Solvent temperature should be 45C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A09001EN 13 PC410S0NIP0F Series Tape and Reel package SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions E D J G I 5 MA X. H H A B C F K Dimensions List A B 0.3 12.0 5.500.05 H I 0.1 5.4 0.300.05 C 1.750.10 J 3.70.1 D 8.00.1 K 6.30.1 E 2.000.05 F 4.00.1 (Unit : mm) G 1.550.05 Reel structure and Dimensions e d Dimensions List a b 330 13.51.5 e f 0.8 21.0 2.0TYP. c g (Unit : mm) c d 1001 13.00.2 g 2.00.5 f a b Direction of product insertion Pull-out direction [Packing : 1 500pcs/reel] Sheet No.: D2-A09001EN 14 PC410S0NIP0F Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A09001EN [E254] 15