PC410S0NIP0F Series
1
Sheet No.: D2-A09001EN
Date Sep. 1. 2006
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device.
PC410S0NIP0F
Series
High Speed 10Mb/s, High CMR
Mini-fl at Package ∗OPIC Photo-
coupler
■Description
PC410S0NIP0F Series contains a LED optically cou-
pled to an OPIC.
It is packaged in a 8 pin mini-fl at.
Input-output isolation voltage(rms) is 3.75 kV.
High speed response (TYP. 10Mb/s) and CMR is
MIN. 10kV/μs.
■Features
1. 8 pin Mini-fl at package
2. Double transfer mold package
(Ideal for Flow Soldering)
3.
High noise immunity due to high instantaneous com-
mon mode rejection voltage (CMH : MIN. 10kV/μs, CML
: MIN. −10kV/μ
s
)
4. High speed response
(tPHL : TYP. 48ns, tPLH : TYP. 50ns)
5. Isolation voltage between input and output (Viso(rms) :
3.75kV)
6. Lead-free and RoHS driective compliant
■Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
fi le No. E64380 (as model No. PC410S)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an op-
tion), fi le No. 40009162 (as model No. PC410S)
3. Package resin : UL fl ammability grade (94V-0))
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.
■Applications
1. Programmable controller
2. Inverter
* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-pro-
cessing circuit integrated onto a single chip.
2
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
3.937±0.127
5.994±0.203
1.27±0.05 0.406±0.076
4
8 7 6 5
Primary side
mark
Date codeRank mark
PC410S
SHARP
mark
"S"
5.080±0.127
3.175±0.127
0.200±0.025
0.203±0.102
0.305MIN.
123
3.937±0.127
5.994±0.203
1.27±0.05 0.406±0.076
4VDE Identification mark
8 7 6 5
Primary side
mark
Date codeRank mark
PC410S
4
SHARP
mark
"S"
5.080±0.127
3.175±0.127
0.200±0.025
0.203±0.102
0.305MIN.
123
■Internal Connection Diagram
■Outline Dimensions
1. Mini-fl at Package [ex. PC410S0NIP0F]2.
Mini-fl at Package (VDE option) [ex. PC410S0YIP0F]
(Unit : mm)
Product mass : approx. 0.15gProduct mass : approx. 0.15g
1
2
3
4
8
7
6
5
1
2
3
4
5
6
7
8
N.C.∗
Anode
Cathode
N.C.∗
∗As for N.C. pins (➀, ➃), external connection is not allowed.
VE (Enable)
GND
VO (Open collector)
VCC
■Truth table
Input Enable Output
HHL
LHH
HLH
LLH
L : Logic (0)
H : Logic (1)
Plating material : Pd (Au fl ush)
3
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
repeats in a 20 year cycle
1st digit 2nd digit
Year of production Month of production
A.D. Mark A.D. Mark Month Mark
1990 A 2002 P January 1
1991 B 2003 R February 2
1992 C 2004 S March 3
1993 D 2005 T April 4
1994 E 2006 U May 5
1995 F 2007 V June 6
1996 H 2008 W July 7
1997 J 2009 X August 8
1998 K 2010 A September 9
1999 L 2011 B October O
2000 M 2012 C November N
2001 N : : December D
Date code (2 digit)
Country of origin
Japan
Rank mark
With or without.
4
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
■Electro-optical Characteristics (Unless otherwise specifi ed Ta=−40 to 85˚C)
Parameter Symbol Condition MIN. TYP.*5 MAX. Unit
Input
Forward voltage VF
IF=10mA 1.3 −1.8 V
Ta=25˚C, IF=10mA 1.4 1.5 1.75
Reverse current IRTa=25C, VR=5V −−
10 μA
Terminal capacitance CtTa=25C, V=0, f=1MHz −60 −pF
*6 Output
High level output voltage IOH VCC=VO=5.5V, VE=2V, IF=250μA−0.02 100 μA
Low level output voltage VOL
VCC=5.5V, VE=2V, IF=5mA, IOL=13mA
−0.4 0.6 V
High level enable current IEH V
CC=
5.5V, V
E=
2V −−
0.5 −1.6 mA
Low level enable current IEL V
CC=
5.5V, V
E=
0.5V −−
0.7 −1.6 mA
High level supply current ICCH
V
CC=
5.5V, V
E=
V
CC
, I
F=
0−5−mA
V
CC=
5.5V, V
E=
0.5V, I
F=
0−510mA
Low level supply current ICCL
V
CC=
5.5V, V
E=
V
CC
, I
F=
10mA −7−mA
V
CC=
5.5V, V
E=
0.5V, I
F=
10mA −5.5 13 mA
*6 Transfer characteristics
"High
→
Low" input threshold current IFHL V
CC=
5V, V
E=
2V, VO
=
0.6V, RL
=
350
Ω
−2.5 5 mA
Isolation resistance RISO Ta
=
25C, DC500V, 40 to 60%RH 5×1010 1011 −Ω
Floating capacitance CfTa
=
25C, V
=
0, f
=
1MHz −0.6 −pF
Response time
"High→Low" propagation delay time
tPHL
Ta
=
25C, I
F=
7.5mA, VCC
=
5V,
RL
=
350W, CL
=
15pF,
25 48 75 ns
"Low→High" propagation delay time
tPLH 25 50 75 ns
Rise time tr−20 −ns
Fall time tf−10 −ns
*7 Distortion of pulse width ΔtW−−
35 ns
Propagation delay skew tPSK −−
40 ns
"High
→
Low" enable propagation
delay time tEHL −15 −ns
Ta
=
25 C, IF
=
7.5mA, VCC
=
5V,
RL
=
350
Ω
, CL
=
15pF, VEH
=
3V
VEL
=
0
"Low
→
High" enable propagation
delay time tELH −10 −ns
Instantaneous common mode rejection
voltage (High level output) CMHIF=0, VO(Min)=2V Ta=25C, VCC=5V,
VCM=1kV(P-P),
RL=350Ω
10 20 −kV/μs
Instantaneous common mode rejection
voltage (Low level output) CML
IF
=
5mA,
VO(MAX)
=
0.8V −10 −20 −kV/μs
*5 All typical values at VCC=5V, Ta=25˚C
*6 It shall connect a by-pass capacitor of 0.01μF or more between VCC (pin ➇) and GND (pin ➄) near the device, when it measures the transfer characteristics and the output side
characteristics
*7 Distortion of pulse width Δtw= | tPHL−tPLH |
(Ta=Topr)
Parameter Symbol Rating Unit
Input
*1 Forward current IF20 mA
Reverse voltage VR5V
Power dissipation P 40 mW
Output
Supply voltage VCC 7V
Enable voltage VEVCC+0.5 V
Enable inpout current IE5mA
High level output voltage VOH 7V
Low level output current IOL 50 mA
*2
Output collector power dissipation
PC85 mW
Operating temperature Topr −40 to +85 C
Storage temperature Tstg −55 to +125 C
*3 Isolation voltage Viso(rms) 3.75 kV
*4 Soldering temperature Tsol 270 C
■Absolute Maximum Ratings
*1 Refer to Fig.4
*2 Refer to Fig.5
*3 40 to 60%RH, AC for 1minute, f=60Hz
*4 For 10s
5
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
■Model Line-up
Please contact a local SHARP sales representative to inquire about production status.
Package Taping
1 500pcs/reel
DIN EN60747-5-2
−
Approved
Model No. PC410S0NIP0F PC410S0YIP0F
6
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time
Fig.2 Test Circuit for Enable Propagation Delay Time
Fig.3 Test Circuit for Instantaneous Common Mode Rejection Voltage
1
2
3
45
6
7
8
350Ω
5V
47Ω
Pulse input
0.1μF
IF
CL
VO
*CL includes the probe
and wiring capacitance.
Timing diagram
90%
10%
7.5mA
3.75mA
0mA
5V
1.5V
IF
VO
tPHL tPLH
VOL
tr
tf
0.1μF
5V
350Ω
8
7
6
54
3
2
1
Pulse input
VE
IF=7.5mA
VO
CL
1.5V
5V
0.5V
1.5V
3V
VE
VO
tEHL tELH
VOL
*CL includes the probe
and wiring capacitance.
47Ω
Timing diagram
0.1μF
5V
350Ω
8
7
6
54
3
2
1
AB
SW IF
CL
VCM
*CL includes the probe and wiring capacitance.
1kV
0V
5V
VCM
VO
VOL
VO(MIN.)
VO(MAX.)
VO
(IF=0)
(IF=5mA)
When the switch for
LED sets to A
When the switch for
LED sets to B
7
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
Fig.4 Forward Current vs. Ambient
Temperature
Fig.5 Output Collector Power Dissipation
vs. Ambient Temperature
Fig.6 Forward Current vs. Forward Voltage Fig.7 High Level Output Current vs.
Ambient Temperature
Forward current IF (mA)
Ambient temperature Ta (C)
0
5
10
15
20
25
−40 0 25 50 100 125−25 75
85
Collector power dissipation PC (mW)
Ambient temperature Ta (C)
0
20
40
60
80
85
100
−40 0 25 50 100 125−25 75
85
0.1
10
1
100
1.21 1.4 1.6 1.8 2
Forward current IF (mA)
Forward voltage VF (V)
Ta=50˚C
Ta=25˚C
Ta=100˚CTa=−40˚C
Ta=0˚C
High level output current IOH (μA)
Ambient temperature Ta (C)
0.001
−60 −40 −20 0 4020 8060 100
0.01
0.1
1
10
100 VCC=VO=5.5V
IF=250μA
VE=2V
Low level output voltage VOL (V)
Ambient temperature Ta (C)
0
−60 −40 −20 0 20 40 60 80 100
0.1
0.2
0.3
0.4
0.5
0.6
0.8
0.7
VCC=5.5V
VE=2V
IF=5mA
16mA 12.8mA
9.6mA IOL=6.4mA
Input threshold current IFHL (mA)
Ambient temperature Ta (C)
0
−60 −40 −20 0 20 40 60 80 100
1
2
3
4
5
VCC=5V
VO=0.6V
VE=2V
RL=350Ω
Fig.8 Low Level Output Voltage vs.
Ambient Temperature
Fig.9 Input Threshold Current vs.
Ambient Temperature
8
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
Fig.10 Output Voltage vs. Forward Current Fig.11 Propagation Delay Time vs.
Forward Current
Fig.12-a Propagation Delay Time vs.
Ambient Temperature
Fig.12-b Propagation Delay Time vs.
Ambient Temperature
Output voltage VO (V)
Forward current IF (mA)
0
012345
1
2
3
4
5
6
RL=350Ω
VCC=5V
VE=2V
Ta=25˚C
RL=1kΩ
RL=4kΩ
Propagation delay time tPLH/tPHL (ns)
Forward current IF (mA)
0
579111315
20
40
60
100
80
tPLH
tPHL
VCC=5V
CL=15pF
RL=350Ω
Propagation delay time tPLH, tPHL (ns)
Ambient temperature Ta (C)
0
−60 −40 −20 0 20 40 60 80 100
20
40
60
100
80
tPHL
tPLH
VCC=5V
IF=7.5mA
CL=15pF
RL=350Ω
Propagation delay time tPLH, tPHL (ns)
Ambient temperature Ta (C)
0
−60 −40 −20 0 20 40 60 80 100
20
40
60
100
80
tPLH
tPHL
VCC=5V
IF=7.5mA
CL=15pF
RL=1kΩ
Fig.13 Response Time vs.
Ambient Temperature
Rise, Fall time tr/tf (ns)
Ambient temperature Ta (C)
0
−60 −40 −20 0 20 40 60 80 100
10
20
30
50
40
tr
tf
VCC=5V
IF=7.5mA
CL=15pF
RL=350Ω
Fig.12-c Propagation Delay Time vs.
Ambient Temperature
Propagation delay time tPLH, tPHL (ns)
Ambient temperature Ta (C)
20
−60 −40 −20 0 20 40 60 80 100
40
60
140
120
100
80
tPLH
tPHL
VCC=5V
IF=7.5mA
CL=15pF
RL=4kΩ
9
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
Fig.14 Distortion of Pulse width vs.
Ambient Temperature
Pulse width distrrion Δtw (ns)
Ambient temperature Ta (C)
−20
−60 −40 −20 0 20 40 60 80 100
0
20
40
60
80 VCC=5V
IF=7.5mA
CL=15pF
RL=1KΩ
RL=4KΩ
RL=350Ω
Remarks : Please be aware that all data in the graph are just for reference and anot for guarantee.
Fig.15 Erable Propagation Delay Time vs.
Ambient Temperature
Enable propagation delay time (ns)
Ambient temperature Ta (C)
0
−60 −40 −20 0 20 40 60 80 100
10
20
30
50
40
tELH
tEHL
VCC=5V
VEH=3mA
VEL=0
RL=350Ω
10
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
■Design Considerations
●Recommended operating conditions
Parameter Symbol MIN. TYP. MAX. Unit
Low level input current IFL 0−250 μA
High level input current IFH 8−15 mA
High level enable input voltage VEH 2−VCC V
Low level enable input voltage VEL 0−0.8 V
Supply voltage VCC 4.5 −5.5 V
Fan out (TTL load) N −−5−
Output pull-up resistor RL330 −4 000 Ω
Operating temperature Topr −40 −85 ˚C
●Notes about static electricity
Transistor of detector side in bipolar confi guration may be damaged by static electricity due to its minute de-
sign.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
●Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01μF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is fl oating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
As for N.C. pins (➀, ➃), external connection is not allowed.
This product is not designed against irradiation and incorporates non-coherent LED.
●Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
Please decide the input current which become 2 times of MAX. IFHL.
11
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
●Recommended foot print (reference)
1.27
0.64
1.9
7.49
1.271.27
(Unit : mm)
12
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
■Manufacturing Guidelines
●Soldering Method
Refl ow Soldering:
Refl ow soldering should follow the temperature profi le shown below.
Soldering should not exceed the curve of temperature profi le and time.
Please don't solder more than twice.
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in fl ow solder bath is allowed under the be-
low listed guidelines.
Flow soldering should be completed below 270C and within 10s.
Preheating is within the bounds of 100 to 150C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fi ne, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
(package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
13
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
●Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fi ne in ac-
tual using conditions since some materials may erode the packaging resin.
●Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specifi c brominated fl ame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
14
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
●Tape and Reel package
SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
Reel structure and Dimensions
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
φ330
b
13.5±1.5
c
φ100±1
d
φ13.0±0.2
e
φ21.0±0.8
f
2.0TYP.
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 500pcs/reel]
Dimensions List (Unit : mm)
A
12.0±0.3
B
5.50±0.05
C
1.75±0.10
D
8.0±0.1
E
2.00±0.05
H
5.4±0.1
I
0.30±0.05
J
3.7±0.1
K
6.3±0.1
F
4.0±0.1
G
φ1.55±0.05
K
FE
I
DJ
H
B
A
C
G
H
5˚MAX.
15
Sheet No.: D2-A09001EN
PC410S0NIP0F Series
■Important Notices
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifi cations, characteristics, data, materials, structure, and
other contents described herein at any time without no-
tice in order to improve design or reliability. Manufactur-
ing locations are also subject to change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specifi ed in the relevant specifi cation
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Offi ce automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffi c signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be re-
produced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publi-
cation.
[E254]
