1
Aug. 2009
BLOCK DIAGRAM
PIN CONFIGURATION (TOP VIEW)
Outline 28X9R
NC:NO CONNECTION
APPLICATIONS
MOSFET and IGBT module inverter driver for refrigerator,
air-conditioner, washing machine, AC-servomotor and gen-
eral purpose.
FEATURES
¡FLOATING SUPPLY VOLTAGE ................................. 600V
¡OUTPUT CURRENT ....................... +200mA/-500mA (typ)
¡THREE PHASE BRIDGE DRIVER
¡28Pin SSOP PACKAGE (Cut Pin Package)
DISTANCE BETWEEN HIGHSIDE-PHASE : 3.4mm
DESCRIPTION
M81712FP is high voltage Power MOSFET and IGBT mod-
ule driver for THREE PHASE bridge applications.
1. V
CC
2. NC
3. UPIN
4. VPIN
5. WPIN
6. UNIN
7. VNIN
8. WNIN
9. NC
10. NC
11. NC
12. GND
13. NC
14. NC
15.PGND
16. W
NO
17. V
NO
18. U
NO
28.U
FB
27.U
PO
26.U
FS
25.V
FB
24.V
PO
23.V
FS
22.NC
21.W
FB
20.W
PO
19.W
FS
GND
VREG
FILTER PULSE
GEN
INTER
LOCK
UV DETECT
FILTER
RQ
R
S
DELAY
VREG/V
CC
Level Shift
VREG/V
CC
Level Shift
UV DETECT
FILTER
FILTER
TYP.10kΩ
TYP.10kΩ
12
U
FB
28
U
PO
27
U
FS
26
U
NO
18
PGND
15
V
FB
SameasUPhase
SameasUPhase
25
V
PO
24
V
FS
23
V
NO
17
W
FB
21
W
PO
20
W
FS
19
W
NO
16
V
CC
1
UPIN
3
UNIN
6
WNIN
8
WPIN
5
VNIN
7
VPIN
4
MITSUBISHI SEMICONDUCTORS <HVIC>
M81712FP
HIGH VOLTAGE THREE PHASE BRIDGE DRIVER
2
Aug. 2009
ABSOLUTE MAXIMUM RATINGS (Ta=25°C unless otherwise specified)
–0.5 ~ 624
U,V,WFB-24 ~ U,V,WFB +0.5
–0.5~24
U,V,WFS-0.5 ~ U,V,WFB+0.5
–0.5~24
–0.5~VCC+0.5
–0.5~VCC+0.5
±50
1.84
18.4
54.39
–20 ~ 125
–20 ~ 100
–40 ~ 125
VBS = *FB-*FS
*PIN, *NIN Terminal
Ta = 25°C, On Board
Ta > 25°C, On Board
High Side Floating Supply Absolute Voltage
High Side Floating Supply Offset Voltage
High Side Floating Supply Voltage
High Side Output Voltage
Low Side Fixed Supply Voltage
Low Side Output Voltage
Logic Input Voltage
Allowable Offset Supply Voltage Transient
Package Power Dissipation
Linear Derating Factor
Junction-Case Thermal Resistance
Junction Temperature
Operation Temperature
Storage Temperature
V
V
V
V
V
V
V
V/ns
W
mW/°C
°C/W
°C
°C
°C
U,V,WFB
U,V,WFS
VBS
U,V,WPO
VCC
U,V,WNO
U,V,WIN
dVS/dt
PD
Kq
Rth(j-c)
Tj
Topr
Tstg
Symbol Parameter Conditions Ratings Unit
V
V
V
V
V
V
VS+10
0
10
10
0
-5
—
—
—
—
—
—
VS+20
500
20
20
5
5
High Side Floating Supply Absolute Voltage
High Side Floating Supply Offset Voltage
High Side Floating Supply Voltage
Low Side Fixed Supply Voltage
Logic Input Voltage
Power GND
Symbol UnitParameter Test conditions Limits
VBS = *FB–*FS
*PIN, *NIN Terminal
U,V,WFB
U,V,WFS
VBS
VCC
VIN
VPGND
RECOMMENDED OPERATING CONDITIONS
* For proper operation, the device should be used within the recommend conditions.
THERMAL DERATING FACTOR CHARACTERISTIC (MAXIMUM RATING)
Min. Typ. Max.
MITSUBISHI SEMICONDUCTORS <HVIC>
M81712FP
HIGH VOLTAGE THREE PHASE BRIDGE DRIVER
PackagePowerDissipationPd (W)
0
0
2.0
1.5
1.0
0.5
25 50 10075 125 150
TemparatureTa (°C)
3
Aug. 2009
µA
mA
mA
V
V
V
V
mA
µA
V
V
µs
V
V
µs
mA
mA
Ω
Ω
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
—
—
—
14.9
—
2.7
—
0.3
—
7.5
0.2
—
7.5
0.2
—
120
350
—
—
340
340
20
—
340
340
20
—
—
—
260
310
—
0.2
1.0
—
—
—
—
0.5
0
8.5
0.5
7.5
8.5
0.5
7.5
200
500
40
15
650
650
130
50
650
650
100
50
—
—
380
450
1.0
0.5
2.0
—
0.1
—
0.8
1.0
—
9.5
0.8
—
9.5
0.8
—
—
—
70
30
855
855
220
75
855
855
200
75
50
50
500
590
Floating Supply Leakage Current
VBS Standby Current
VCC Standby Current
High Level Output Voltage
Low Level Output Voltage
High Level Input Threshold Voltage
Low Level Input Threshold Voltage
High Level Input Bias Current
Low Level Input Bias Current
VBS Supply UV Reset Voltage
VBS Supply UV Hysteresis Voltage
VBS Supply UV Filter Time
VCC Supply UV Reset Voltage
VCC Supply UV Hysteresis Voltage
VCC Supply UV Filter Time
Output High Level Short Circuit Pulsed Current
Output Low Level Short Circuit Pulsed Current
Output High Level On Resistance
Output Low Level On Resistance
High Side Turn-On Propagation Delay
High Side Turn-Off Propagation Delay
High Side Turn-On Rise Time
High Side Turn-Off Fall Time
Low Side Turn-On Propagation Delay
Low Side Turn-Off Propagation Delay
Low Side Turn-On Rise Time
Low Side Turn-Off Fall Time
Delay Matching, High Side and Low
Side Turn-On
Delay Matching, High Side and Low
Side Turn-Off
Input Filter Time
Symbol UnitParameter Test conditions Limits
Min. Typ.* Max.
VB = VS = 600V, 1 per phase
1 per phase
IO = 0A, *NO, *PO
IO = 0A, *NO, *PO
*PIN, *NIN
*PIN, *NIN
*PIN, *NIN = 5V
*PIN, *NIN = 0V
*PO, *NO = 0V, *PIN, *NIN = 5V, PW < 10µs
*PO, *NO = 15V, *PIN, *NIN = 0V, PW < 10µs
IO = 20mA, ROH = (VOH-VO) /20mA
IO = 20mA, ROL = VO/20mA
CL = 1000pF between *HO-*V
S
Note.1
CL = 1000pF between *HO-*V
S
Note.1
CL = 1000pF between *HO-*V
S
Note.2
CL = 1000pF between *HO-*V
S
Note.2
CL = 1000pF between *LO-PGND Note.1
CL = 1000pF between *LO-PGND Note.1
CL = 1000pF between *LO-PGND Note.2
CL = 1000pF between *LO-PGND Note.2
|tdLH (*HO) -tdLH (*LO)|
|tdHL (*HO) -tdHL (*LO)|
*PIN, *NIN : Convex Pulse
*PIN, *NIN : Concave Pulse
IFS
IBS
ICC
VOH
VOL
VIH
VIL
IIH
IIL
VBSuvr
VBSuvh
tVBSuv
VCCuvr
VCCuvh
tVCCuv
IOH
IOL
ROH
ROL
tdLH(HO)
tdHL(HO)
trH
tfH
tdLH(LO)
tdHL(LO)
trL
tfL
∆tdLH
∆tdHL
tfilter
ELECTRICAL CHARACTERISTICS
(Ta=25
°
C, VCC=VBS(=*FB-*FS)=15V unless otherwise specified)
* Typ. is not specified.
MITSUBISHI SEMICONDUCTORS <HVIC>
M81712FP
HIGH VOLTAGE THREE PHASE BRIDGE DRIVER
4
Aug. 2009
MITSUBISHI SEMICONDUCTORS <HVIC>
M81712FP
HIGH VOLTAGE THREE PHASE BRIDGE DRIVER
Note2 : Output Rise/Fall Timing (Output capacitor load CL = 1000pF).
tf
(＊)
tr
(＊)
5V
10%→
90%→
←10%
←90%
P(N)IN
P(N)O
0V
Less than 50ns Less than 50ns
Note1 : Propagation Delay Timing (Output capacitor load CL = 1000pF).
Less than 50ns Less than 50ns
5V
tdHL(＊)tdLH(＊)
50% 50%
50%→
50%→
P(N)IN
P(N)O
0V
5
Aug. 2009
*PO = L, *NO = L
*NO = H
*PO ON = H
*NO,*PO = L when *PIN, *NIN is “L” at the same time
*PO = L when VBS UV tripped.
*NO = L when VCC UV tripped.
U,V,WPIN
H→L
H→L
L→H
L→H
X
H→L
Behavioral state
U,V,WNIN
L
H
L
H
L
X
UV(VCC)
H
H
H
X
H
L
UV(VBS)
H
H
H
H
L
H
U,V,WPO
L
L
H
L
L
L
U,V,WNO
L
H
L
L
L
L
Note1 : “L” state of VBS UV, VCC UV means that UV trip voltage.
Note2 : In the case of both input signals (*PIN and *NIN) are “H”, output signals (*PO and *NO) become “L”.
Note3 : X (*PIN) : L→H or H→LO X (*HIN) : H or L.
Note4 : Output Signal (*PO) is triggered by the edge of input signal.
MITSUBISHI SEMICONDUCTORS <HVIC>
M81712FP
HIGH VOLTAGE THREE PHASE BRIDGE DRIVER
＊PIN
＊PO
TIMING DIAGRAM
1. Input/Output Timing Diagram
High Active, in the case of both input signals (*PIN, *NIN) are “H”, output signals (*PO, *NO) become “L”.
＊PIN
＊NIN
＊PO
＊NO
FUNCTION TABLE
6
Aug. 2009
MITSUBISHI SEMICONDUCTORS <HVIC>
M81712FP
HIGH VOLTAGE THREE PHASE BRIDGE DRIVER
If V
CC
supply voltage drops below UV trip voltage (V
CC
uvt) for V
CC
supply UV filter time, *PO output signal is shut down. As
soon as V
CC
supply voltage rises over UV reset voltage, output signal *PO becomes “H” if *PIN input signal is “H”.
V
CCuvt
V
CCuvr
V
CCuvh
t
VCCuv
V
CC
＊PO
＊PIN
If V
CC
supply voltage drops below UV trip voltage (V
CC
uvt) for V
CC
supply UV filter time, *NO output signal is shut down. As
soon as V
CC
supply voltage rises over UV reset voltage, output signal *NO becomes “H” if *NIN input signal is “H”.
V
CCuvt
V
CCuvr
V
CCuvh
t
VCCuv
V
CC
＊NO
＊NIN
V
BSuvt
V
BSuvr
V
BSuvh
t
VBSuv
V
BS
＊PO
＊PIN
2. VCC (VBS) Supply Under Voltage Lockout Timing Diagram
If VBS supply voltage drops below UV trip voltage (VBSuvt) for VBS supply UV filter time, output signal is shut down. As soon
as VBS supply voltage rises over UV reset voltage, output signal *PO becomes “H” at following edge of input signal.
7
Aug. 2009
3. Allowable Supply Voltage Transient
It is recommended to suply VCC firstly and supply VBS secondly. When shutting off supply voltage, please shut off VBS firstly
and shut off VCC secondly. When applying VCC and VBS, power supply should be applied slowly. If it rises rapidly, output
signal (HO or LO) may be malfunction.
MITSUBISHI SEMICONDUCTORS <HVIC>
M81712FP
HIGH VOLTAGE THREE PHASE BRIDGE DRIVER
PACKAGE OUTLINE
Min
14.8
8.2
–
–
0
0.3
0.18
0°
11.63
0.65
–
0.3
D
E
A
2
A
A
1
b
p
c
q
H
E
e
y
L
Nom
15.0
8.4
2.05
–
0.1
0.35
0.2
–
11.93
0.8
–
0.5
Max
15.2
8.6
–
2.35
0.2
0.45
0.25
8°
12.23
0.95
0.10
0.7
Dimension in Millimeters
Reference
Symbol
36 19
18
1
H
E
E
A
*1
*2
*3
D
Index mark
y
F
c
A
2
A
1
L
Detail F
b
p
e
NOTE)
1. DIMENSIONS “*1” AND “*2”
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION “*3” DOES NOT
INCLUDE TRIM OFFSET.
