PAN1761 Bluetooth Low Energy & NFC Combo Module Product Specification Rev. 1.2 Wireless Modules PAN1761 Bluetooth & NFC Module Overview The PAN1761 is a short-range BLE and NFC single mode module used for the implementation of Bluetooth functionality into various electronic devices. Characteristics * Receiver sensitivity -91 dBm typ. * Output power 0 dBm maximum setting * Power supply 1.8 V to 3.6 V single operation voltage Features * Small 15.6 mm x 8.7 mm x 1.9 mm SMD module * Same form factor and pinout as PAN1026, * * * * * * * * PAN1760, and PAN1760A * Bluetooth Low Energy (BLE) 4.1 compliant 512 kbit EEPROM memory Host mode Standard SIG BLE profiles as well as SPPoverBLE profiles available in the SDK UART, I2C & SPI interface, PWM output (3x), ADC (3x), 10 programmable I/O NFC * Almost zero power consumption in standby mode by using NFC wake up * * Transmit power consumption @0dBm 5.8 mA Low Power 5 A Sleep mode NFC Forum Type 3 compliant NFC tag (external antenna) Operating temperature range -30 C to +85 C Bluetooth * GAP central and peripheral support for LE * GATT, SMP, and SDB support for LE * Support for Over-the-Air update * Support for Scatternet/Mesh network * Frequent changing of device address (improved privacy, reduced tracking ability) * Larger packet sizes (more efficient application and network layer security) Dedicated Bluetooth partner selection by simple device approximation Support for true out-of-band Bluetooth pairing Block Diagram Vcc 3.3 V EEPROM 512 kbit PAN1761 Bluetooth 4.1 Module UART Crystal 26 MHz GPIOs Chip Antenna Host Wake up Toshiba TC35670 NFC Antenna DC-DC Conversion Wake up Reset NFC IC LPF NFC Wake up Product Specification Rev. 1.2 Page 2 PAN1761 Bluetooth & NFC Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. (c) Panasonic Industrial Devices Europe GmbH 2017. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status "Engineering Samples". This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by: The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 1.2 Page 3 PAN1761 Bluetooth & NFC Module Table of Contents 1 2 3 4 5 6 7 About This Document......................................................................................................................... 5 1.1 Purpose and Audience .............................................................................................................. 5 1.2 Revision History ......................................................................................................................... 5 1.3 Use of Symbols ......................................................................................................................... 5 1.4 Related Documents ................................................................................................................... 5 Overview .............................................................................................................................................. 6 2.1 Block Diagram ........................................................................................................................... 7 2.2 Bluetooth IC ............................................................................................................................... 7 2.3 Pin Configuration ....................................................................................................................... 8 Detailed Description ......................................................................................................................... 11 3.1 Dimensions .............................................................................................................................. 11 3.2 Footprint .................................................................................................................................. 12 3.3 Packaging ................................................................................................................................ 13 3.4 Case Marking .......................................................................................................................... 16 Specification ..................................................................................................................................... 17 4.1 Default Test Conditions ........................................................................................................... 17 4.2 Absolute Maximum Ratings ..................................................................................................... 17 4.3 Recommended Operating Conditions ...................................................................................... 18 4.4 Power Up Sequence ................................................................................................................ 18 4.5 Current Consumption............................................................................................................... 18 4.6 Bluetooth RF Performance ...................................................................................................... 19 4.7 Antenna Radiation Pattern....................................................................................................... 21 4.8 Reliability Tests ....................................................................................................................... 22 4.9 Recommended Soldering Profile ............................................................................................. 23 Cautions ............................................................................................................................................ 24 5.1 Design Notes ........................................................................................................................... 24 5.2 Installation Notes ..................................................................................................................... 24 5.3 Usage Condition Notes ............................................................................................................ 25 5.4 Storage Notes .......................................................................................................................... 25 5.5 Safety Cautions ....................................................................................................................... 25 5.6 Other Cautions ........................................................................................................................ 26 5.7 Life Support Policy ................................................................................................................... 26 Regulatory and Certification Information ....................................................................................... 27 6.1 RoHS and REACH Declaration ............................................................................................... 27 6.2 Federal Communications Commission (FCC) for US .............................................................. 27 6.3 Industry Canada Certification .................................................................................................. 29 6.4 European Conformity According to RED (2014/53/EU) ........................................................... 32 Appendix ........................................................................................................................................... 33 7.1 Ordering Information ................................................................................................................ 33 7.2 Contact Details ........................................................................................................................ 34 Product Specification Rev. 1.2 Page 4 PAN1761 Bluetooth & NFC Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1761 module. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as "the PAN1761" or "the module" within this document. 1.2 Revision History Revision 1.3 Date Modifications/Remarks 0.1 November 2015 1st preliminary version. 0.2 January 2016 PIN Table correction. 0.3 February 2016 Minor changes. 0.6 23.08.2016 Bluetooth 4.1 0.7 3.11.2016 Changes in power supply values and conditions during measurement of output power and sensitivity 1.0 January 2017 Final version 1.1 March 2017 Updated temperature range 1.2 July 2017 New document structure and layout Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product's functionality at risk. [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document 1.3 Use of Symbols. 1.4 Related Documents Please refer to the Panasonic website for related documents 7.2.2 Product Information. Product Specification Rev. 1.2 Page 5 PAN1761 Bluetooth & NFC Module 2 Overview 2 Overview The PAN1761 is based on Toshiba's single chip TC35670 Bluetooth semiconductor device with embedded Toshiba Bluetooth 4.1 LE stack, GATT profile, and an NFC Forum Type 3 compliant NFC tag. Peak power consumption of only 5.8 mA in Tx mode allows advanced wireless functionalities in IoT, medical, and industrial applications without compromising battery life. Additionally, NFC allows products to wake up from zero standby power consumption to full Bluetooth operation. Highly secure Bluetooth connections are created using NFC to exchange link keys. The PAN1761 can be operated in Host mode for very simple integration of Bluetooth connectivity into existing products. The PAN1761 and the PAN1026 share the same footprint. Only minor code changes are required when migrating from PAN1026. Previously developed software (Bluetooth Low Energy profiles and applications) can be easily migrated with a minimal effort. FCC, IC, and CE approval are available. Please refer to the Panasonic website for related documents 7.2.2 Product Information. Further information on the variants and versions 7.1 Ordering Information. Product Specification Rev. 1.2 Page 6 PAN1761 Bluetooth & NFC Module 2 Overview 2.1 Block Diagram Vcc 3.3 V EEPROM 512 kbit PAN1761 Bluetooth 4.1 Module UART Crystal 26 MHz GPIOs Chip Antenna Host Wake up Toshiba TC35670 NFC Antenna DC-DC Conversion Wake up Reset NFC IC LPF NFC Wake up 2.2 Bluetooth IC Product Specification Rev. 1.2 Page 7 PAN1761 Bluetooth & NFC Module 2 Overview 2.3 Pin Configuration Pin Assignment Top View 15.6 mm 5.0 1.2 2.4 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F11 F12 A11 A12 1.35 1.2 F1 8.70 mm 0.6 1.35 1.0 0.6 Pin Functions No Pin Name A1 GND A2 NC A3 Reset Digital input Reset, active-low A4 VCC Power 2 V - 3.6 V analog/digital power supply connection A5 VCC Power 2 V - 3.6 V analog/digital power supply connection A6 VCC Power 2 V - 3.6 V analog/digital power supply connection A7 GND Ground pin Connect to ground A8 NC Product Specification Rev. 1.2 GPIO No Pin Type Description Ground pin Connect to ground Not connected Not connected Page 8 PAN1761 Bluetooth & NFC Module 2 Overview No Pin Name A9 GND Connect to ground A11 GND Connect to ground A12 GND Connect to ground B1 NC Not connected B2 TAG_L0 NFC_Anten na B3 TAG_SCL NFC_I2C B4 NC Not connected B5 NC Not connected B6 NC Not connected B7 NC Not connected B8 NC Not connected B9 NC Not connected C1 NC Not connected C2 TAG_L1 NFC_Anten na C3 TAG_RFDET Digital Out C4 NC Not connected C5 NC Not connected C6 TAG_READYX C7 TAG_SDA C8 GND Ground Pin Connect to ground C9 GND Ground Pin Connect to ground D1 NC Not connected D2 NC Not connected D3 GPIO1 AIN0 Digital I/O D4 Wakeup GPIO0 Digital I/O D5 NC D6 TAG_PONX Digital In D7 GND Ground Pin Connect to ground D8 GND Ground Pin Connect to ground D9 NC Product Specification Rev. 1.2 GPIO No Pin Type Description Digital Out PWM2 NFC_I2C Not connected Not connected/placeholder for antenna Page 9 PAN1761 Bluetooth & NFC Module 2 Overview No Pin Name GPIO No Pin Type Description E1 GPIO8 SDA Digital I/O Connected to internal EEPROM E2 GPIO7 SCL Digital I/O Connected to internal EEPROM E3 NC Not connected E4 NC Not connected E5 TAG_RECTOUT E6 UART_RXD GPIO4 E7 GPIO2 PWM0/AIN1 Digital I/O E8 GND Ground Pin Connect to ground E9 GND Ground Pin Connect to ground F1 GND Ground Pin Connect to ground F2 EEPROM_WP Digital In EEPROM write protect /active low F3 NC Not connected F4 NC Not connected F5 GPIO6 UART_1CTS/ UART2-RX Digital In Digital In Can be configured to UART2_RXD Clock 32.768 KHz sleep clock input F6 SLEEPXCLKIN F7 UART_TXD GPIO3 Digital Out F8 GPIO5 UART1_RT S/ UART2TX Digital I/O Can be configured to UART2_TXD F9 GND Ground Pin Connect to ground F11 GND Ground Pin Connect to ground F12 GND Ground Pin Connect to ground Product Specification Rev. 1.2 Page 10 PAN1761 Bluetooth & NFC Module 3 Detailed Description 3 Detailed Description 3.1 Dimensions All dimensions are in millimeters. No. Item Dimension Tolerance Remark 1 Width 8.70 0.30 2 Length 15.60 0.30 3 Height 1.80 Product Specification Rev. 1.2 0.20 With case Page 11 PAN1761 Bluetooth & NFC Module 3 Detailed Description 3.2 Footprint The outer dimensions have a tolerance of 0.3 mm. Top View 15.6 mm 5.0 1.2 2.4 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F11 F12 A11 A12 1.35 1.2 F1 8.70 mm 0.6 1.35 1.0 0.6 Product Specification Rev. 1.2 Page 12 PAN1761 Bluetooth & NFC Module 3 Detailed Description 3.3 Packaging The product is a mass production status product and will be delivered in the package described below. 3.3.1 Tape Dimensions 3.3.2 Packing in Tape Direction of unreeling (for customer) trailer (empty) 1 x circumference / hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. 100730-PAN1720.vsd The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 1.2 Page 13 PAN1761 Bluetooth & NFC Module 3 Detailed Description 3.3.3 Component Direction 3.3.4 Reel Dimension Product Specification Rev. 1.2 Page 14 PAN1761 Bluetooth & NFC Module 3 Detailed Description 3.3.5 Package Label Example 3.3.6 (1T) Lot code (1P) Customer order number, if applicable (2P) Order number (9D) Date code (Q) Quantity (HW/SW) Hardware/software version Total Package Product Specification Rev. 1.2 Page 15 PAN1761 Bluetooth & NFC Module 3 Detailed Description 3.4 Case Marking Example 1 2D barcode, for internal usage only 2 Brand name 3 Hardware/software version 4 Order number 5 Lot code 6 FCC ID 7 IC ID 8 Marking for Pin 1 Product Specification Rev. 1.2 Page 16 PAN1761 Bluetooth & NFC Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature: Humidity: Supply Voltage: 4.2 25 10 C 40 to 85 % RH 3.3 V Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Parameter Condition Min. Typ. Max. Units Voltage on any digital pin -0.3 VDD + 0.3 V Operating ambient temperature range -30 85 C Storage temperature range -30 125 C Bluetooth RF inputs 10 ESD: 1000 dBm V All pads, according to human-body model, JEDEC STD 22, method A114 According to charged-device model, JEDEC STD 22, method C101 Product Specification Rev. 1.2 Page 17 PAN1761 Bluetooth & NFC Module 4 Specification 4.3 Recommended Operating Conditions The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Parameter Condition Power supply voltage Min. Typ. 2.0 Maximum ambient operating temperature 4.4 Max. Units 3.3 3.6 V -30 85 C Power Up Sequence When the power is turned on, set reset signal to low (RESET=Low). After OSC is stable, release reset (RESET=High). Crystal oscillator stabilizing time is about 2 msec, so define release time after sufficient evaluation. When the power is turned off, set reset signal to low (RESET=Low). VDD power supply Reset signal DCDC / LDO output Reference clock Unstable Power off RC delay 4.5 Power on voltage detection OSC boot timer Stable Operation Current Consumption The current consumption depends on the user scenario and on the setup and timing in the power modes. Assume VDD = 3.3 V, Tamb = 25 C, if nothing else stated. Product Specification Rev. 1.2 Page 18 PAN1761 Bluetooth & NFC Module 4 Specification 4.6 4.6.1 Bluetooth RF Performance Bluetooth Characteristics Parameter Condition Min. Operation frequency range Max. 2 402 Channel spacing 4.6.2 Typ. Output power Maximum setting, measured at single ended 50 Ohm. Sensitivity, High Gain mode High-gain mode, measured at single ended 50 Ohm. 2 480 Units MHz 2 MHz 0 dBm -90.0 dBm NFC Tag Interface PAN1761 has a built-in NFC Forum Type 3 Tag (NFC Tag) function. Features of the PAN1761 NFC interface * * * * * Built-in contactless IC card technology. * Security: mutual authentication with Message Authentication Code (MAC), variety access attributes can be set. Writing prohibition, reading after authentication, writing after authentication, writing with MAC. Wireless interface: automatic detection of 212 kbps and 424 kbps transmission speed. I2C interface: maximum operational clock 400 kHz. Built-in EEPROM: general user area 1 520 bytes, protecting against defective data. Writing time: 5 ms (typ.), 1 bit error automatic correction, CRC automatic addition, and error detection of read data. The technology refers to the following standards: JIS X 6319-4, ISO/IEC 18092 Basic technical characteristics Item Remarks Data transmission format Half duplex, synchronization Carrier frequency 13.56 MHz Data transmission speed 212,424 Kbit/s (automatic detection) Modulation ASK Coding Manchester Bit order MSBF Product Specification Rev. 1.2 Page 19 PAN1761 Bluetooth & NFC Module 4 Specification 4.6.3 NFC Operational Sequence If a wireless carrier is detected, TAG_RFDET pin outputs high level. If the wireless carrier disappears, TAG_RFDET pin turns back to low level due to pull-down resistance. Set VDDIO and VDD pin to output high (power supply). At Write without Encryption or Read without Encryption, if IDm stored in PAN1761 chip and iDm with command are consistent, TAG_READYX pin outputs high level. After that, during supply of internal power source, the high is kept. VDDIO and VDD pin need power supply for TAG_READYX pin to output high. By becoming high in TAG_READYX pin, HOST can get to know that wireless reader writer accesses the module. Sequence example of operation over the wireless TAG interface Product Specification Rev. 1.2 Page 20 PAN1761 Bluetooth & NFC Module 4 Specification 4.7 Antenna Radiation Pattern Product Specification Rev. 1.2 Page 21 PAN1761 Bluetooth & NFC Module 4 Specification 4.8 Reliability Tests The measurement should be done after the test device has been exposed to room temperature and humidity for one hour. No. Item 1 Vibration test Limit Electrical parameter should be in specification Condition * * Freq.: 10~50 Hz; Amplitude: 1.5 mm; 20 min./cycle, 1 hrs. each of XYZ axis Freq.: 30~100 Hz, 6G; 20 min./cycle, 1 hrs. each of XYZ axis 2 Shock test See above Dropped onto hard wood from a height of 50 cm for 3 times 3 Heat cycle test See above -40 C for 30 min. and +85 C for 30 min.; each temperature 300 cycles 4 Moisture test See above +60 C, 90 % RH, 300 h 5 Low temperature test See above -40 C, 300 h 6 High temp. test See above +85 C, 300 h Product Specification Rev. 1.2 Page 22 PAN1761 Bluetooth & NFC Module 4 Specification 4.9 Recommended Soldering Profile Reflow permissible cycle: 2 Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Soldering profile assumes lead-free soldering Product Specification Rev. 1.2 Page 23 PAN1761 Bluetooth & NFC Module 5 Cautions 5 Cautions Failure to follow the guidelines set forth in this document may result in degrading of the product's functions and damage to the product. 5.1 Design Notes 1. Follow the conditions written in this specification, especially the control signals of this module. 2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 F directly at the module). 3. This product should not be mechanically stressed when installed. 4. Keep this product away from heat. Heat is the major cause of decreasing the life of these products. 5. Avoid assembly and use of the target equipment in conditions where the product's temperature may exceed the maximum tolerance. 6. The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. 7. Keep this product away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board. 5.2 Installation Notes 1. Reflow soldering is possible twice based on the conditions set forth in 4.9 Recommended Soldering Profile. Set up the temperature at the soldering portion of this product according to this reflow profile. 2. Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. 3. Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. 5. This product should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit. Product Specification Rev. 1.2 Page 24 PAN1761 Bluetooth & NFC Module 5 Cautions 5.3 Usage Condition Notes 1. Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation befor assembly on the final products. 2. Do not use dropped products. 3. Do not touch, damage or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this product. 5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on PCB. 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment. 5.4 Storage Notes 1. The module should not be stressed mechanically during storage. 2. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: - Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, - Storage in direct sunlight, - Storage in an environment where the temperature may be outside the range of 5 C to 35 C, or where the humidity may be outside the 45 to 85 percent range, - Storage of the products for more than one year after the date of delivery storage period: Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. 3. Keep this product away from water, poisonous gas, and corrosive gas. 4. This product should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (max. 10). 5.5 Safety Cautions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum: Product Specification Rev. 1.2 Page 25 PAN1761 Bluetooth & NFC Module 5 Cautions 1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 5.6 Other Cautions 1. Do not use the products for other purposes than those listed. 2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the product. 3. This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These products are not intended for uses other than under the special conditions shown below. Before using these products under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner: - In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash, - In direct sunlight, outdoors, or in a dusty environment, - In an environment where condensation occurs, - In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). 5. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. 6. When you have any question or uncertainty, contact Panasonic. 5.7 Life Support Policy This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. Product Specification Rev. 1.2 Page 26 PAN1761 Bluetooth & NFC Module 6 Regulatory and Certification Information 6 Regulatory and Certification Information 6.1 RoHS and REACH Declaration The latest declaration of environmental compatibility (Restriction of Hazardous Substances, RoHS and Registration, Evaluation, Authorisation, and Restriction of Chemicals, REACH) for supplied products can be found on the Panasonic website in the "Downloads" section of the respective product 7.2.2 Product Information. 6.2 6.2.1 Federal Communications Commission (FCC) for US FCC Notice The PAN1761 including the antennas, which are listed in 6.2.5 Approved Antenna List, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407. The transmitter operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. 6.2.2 Caution The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Product Specification Rev. 1.2 Page 27 PAN1761 Bluetooth & NFC Module 6 Regulatory and Certification Information However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: 6.2.3 * * * Reorient or relocate the receiving antenna. * Consult the dealer or an experienced radio/TV technician for help Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Label Requirements The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7V1761. This FCC identifier is valid for the PAN1761. The end product must in any case be labelled on the exterior with: "Contains FCC ID: T7V1761" 6.2.4 Antenna Warning This antenna warning refers to the test device with the model number PAN1761 Chapter 7.1 Ordering Information The device is tested with a standard SMA connector and with the antenna listed below. When integrated into the OEM's product, these fixed antennas require installation preventing end users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and with Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in 6.2.5 Approved Antenna List is the same (FCC ID: T7V1761). 6.2.5 Approved Antenna List Item Part Number Manufacturer Frequency Band Type Gain (dBi) 1 LDA212G3110K Murata 2.4 GHz Chip antenna +0.9 2 ANT2012 Yageo 2.4GHz Chip-Antenna +0.9 Product Specification Rev. 1.2 Page 28 PAN1761 Bluetooth & NFC Module 6 Regulatory and Certification Information 6.2.6 RF Exposure To comply with FCC RF Exposure requirements, the OEM must ensure that only antennas from the Approved Antenna List are installed 6.2.5 Approved Antenna List. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of the PAN1761 with a mounted ceramic antenna (FCC ID: T7V1761) is below the FCC radio frequency exposure limits. Nevertheless, the PAN1761 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. 6.3 Industry Canada Certification English The PAN1761 is licensed to meet the regulatory requirements of Industry Canada (IC). License ID: IC: 216Q-1761 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in 6.2.5 Approved Antenna List, having a maximum gain of +0.9 dBi. Antennas not included in this list or having a gain greater than +0.9 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Due to the model size, the IC identifier is displayed in the installation instruction only and it cannot be displayed on the module's label due to the limited size. Product Specification Rev. 1.2 Page 29 PAN1761 Bluetooth & NFC Module 6 Regulatory and Certification Information French PAN1761 est garanti conforme aux dispositions reglementaires d'Industry Canada (IC). License: IC: 216Q-1761 Il est recommande aux fabricants d'appareils fixes, mobiles ou portables de consulter la reglementation en vigueur et de verifier la conformite de leurs produits relativement aux limites d'exposition aux rayonnements radiofrequence ainsi qu'au debit d'absorption specifique maximum autorise. Des informations pour les utilisateurs sur la reglementation Canadienne concernant l'exposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca. Ce produit a ete developpe pour fonctionner specifiquement avec les antennes listees dans le tableau 6.2.5 Approved Antenna List, presentant un gain maximum de 0.9 dBi. Des antennes autres que celles listees ici, ou presentant un gain superieur a 0.9 dBi ne doivent en aucune circonstance etre utilisees en combinaison avec ce produit. L'impedance des antennes compatibles est 50 Ohm. L'antenne utilisee avec ce produit ne doit ni etre situee a proximite d'une autre antenne ou d'un autre emetteur, ni etre utilisee conjointement avec une autre antenne ou un autre emetteur. En raison de la taille du produit, l'identifiant IC est fourni dans le manuel d'installation. 6.3.1 IC Notice English The device PAN1761 ( 7.1 Ordering Information), including the antennas ( 6.2.5 Approved Antenna List), complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-Gen. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. French Le present appareil PAN1761 ( 7.1 Ordering Information), les antennes y compris ( 6.2.5 Approved Antenna List), est conforme aux CNR-Gen d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes : 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. Product Specification Rev. 1.2 Page 30 PAN1761 Bluetooth & NFC Module 6 Regulatory and Certification Information 6.3.2 Labeling Requirements English Labeling Requirements The OEM must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC identifier is: IC: 216Q-1761 This IC identifier is valid for all PAN1761 modules 7.1 Ordering Information. In any case, the end product must be labelled on the exterior with: "Contains IC: 216Q-1761". French Obligations d'etiquetage Les fabricants d'equipements d'origine (FEO) - en anglais Original Equipment Manufacturer (OEM) - doivent s'assurer que les obligations d'etiquetage IC du produit final sont remplies. Ces obligations incluent une etiquette clairement visible a l'exterieur de l'emballage externe, comportant l'identifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus. L' identifiant IC est: IC: 216Q-1761 Cet identifiant est valide pour tous les modules PAN1761 7.1 Ordering Information. Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe la mention suivante: "Contient IC: 216Q-1761". Product Specification Rev. 1.2 Page 31 PAN1761 Bluetooth & NFC Module 6 Regulatory and Certification Information 6.4 European Conformity According to RED (2014/53/EU) All modules described in this Product Specification comply with the standards according to the following LVD (2014/35/EU), EMC-D (2014/30/EU) together with the RED (2014/53/EU) articles: 3.1a Safety/Health: EN62368-1:2014 EN62311:2008 3.1b EMC: EN 301 489-1 V2.1.1:2017-02 EN 301 489-17 V3.1.1:2017-02 3.2 Radio: EN 300 328 V2.1.1:2016-11 As a result of the conformity assessment procedure described in the 2014/53/EU Directive, the end customer equipment should be labelled as follows: PAN1761 in the specified reference design can be used in all countries of the European Economic Area (Member States of the EU, European Free Trade Association States [Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra and Turkey. Product Specification Rev. 1.2 Page 32 PAN1761 Bluetooth & NFC Module 7 Appendix 7 Appendix 7.1 Ordering Information Variants and Versions Order Number 2 ENW89848A1KF Brand Name Description PAN1761 PAN1761 Bluetooth Low Energy & NFC Combo Module 1 MOQ 1 500 1 Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels. 2 Samples are available on customer demand. Product Specification Rev. 1.2 Page 33 PAN1761 Bluetooth & NFC Module 7 Appendix 7.2 7.2.1 Contact Details Contact Us Please contact your local Panasonic Sales office for details on additional product options and services: For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com 7.2.2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents: For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules Product Specification Rev. 1.2 Page 34