PAN1761
Bluetooth Low Energy & NFC Combo Module
Product Specification
Rev. 1.2
Wireless Modules

PAN1761 Bluetooth & NFC Module
Product Specification Rev. 1.2 Page 2
Overview
The PAN1761 is a short-range BLE and NFC single
mode module used for the implementation of
Bluetooth functionality into various electronic devices.
Features
• Small 15.6 mm x 8.7 mm x 1.9 mm SMD module
• Same form factor and pinout as PAN1026,
PAN1760, and PAN1760A
• Bluetooth Low Energy (BLE) 4.1 compliant
• 512 kbit EEPROM memory
• Host mode
• Standard SIG BLE profiles as well
as SPPoverBLE profiles available in the SDK
• UART, I2C & SPI interface, PWM output (3x),
ADC (3x), 10 programmable I/O
NFC
• Almost zero power consumption in standby mode
by using NFC wake up
• Dedicated Bluetooth partner selection by simple
device approximation
• Support for true out-of-band Bluetooth pairing
Characteristics
• Receiver sensitivity -91 dBm typ.
• Output power 0 dBm maximum setting
• Power supply 1.8 V to 3.6 V single operation
voltage
• Transmit power consumption @0dBm 5.8 mA
• Low Power 5 µA Sleep mode
• NFC Forum Type 3 compliant NFC tag (external
antenna)
• Operating temperature range -30 °C to +85 °C
Bluetooth
• GAP central and peripheral support for LE
• GATT, SMP, and SDB support for LE
• Support for Over-the-Air update
• Support for Scatternet/Mesh network
• Frequent changing of device address (improved
privacy, reduced tracking ability)
• Larger packet sizes (more efficient application
and network layer security)
Block Diagram
Chip
Antenna
Toshiba
TC35670
UART
GPIOs
Host Wake up
Wake up
Reset
Vcc 3.3 V
LPF
PAN1761
Bluetooth 4.1 Module
Crystal
26 MHz
DC-DC
Conversion
EEPROM
512kbit
NFCI²C
NFC Wake up
NFC
Antenna
PAN1761 Bluetooth & NFC Module
Product Specification Rev. 1.2 Page 3
PAN1761 Bluetooth & NFC Module
Product Specification Rev. 1.2 Page 4
Table of Contents
1 About This Document ......................................................................................................................... 5
1.1 Purpose and Audience .............................................................................................................. 5
1.2 Revision History ......................................................................................................................... 5
1.3 Use of Symbols ......................................................................................................................... 5
1.4 Related Documents ................................................................................................................... 5
2 Overview .............................................................................................................................................. 6
2.1 Block Diagram ........................................................................................................................... 7
2.2 Bluetooth IC ............................................................................................................................... 7
2.3 Pin Configuration ....................................................................................................................... 8
3 Detailed Description ......................................................................................................................... 11
3.1 Dimensions .............................................................................................................................. 11
3.2 Footprint .................................................................................................................................. 12
3.3 Packaging ................................................................................................................................ 13
3.4 Case Marking .......................................................................................................................... 16
4 Specification ..................................................................................................................................... 17
4.1 Default Test Conditions ........................................................................................................... 17
4.2 Absolute Maximum Ratings ..................................................................................................... 17
4.3 Recommended Operating Conditions ...................................................................................... 18
4.4 Power Up Sequence ................................................................................................................ 18
4.5 Current Consumption............................................................................................................... 18
4.6 Bluetooth RF Performance ...................................................................................................... 19
4.7 Antenna Radiation Pattern ....................................................................................................... 21
4.8 Reliability Tests ....................................................................................................................... 22
4.9 Recommended Soldering Profile ............................................................................................. 23
5 Cautions ............................................................................................................................................ 24
5.1 Design Notes ........................................................................................................................... 24
5.2 Installation Notes ..................................................................................................................... 24
5.3 Usage Condition Notes ............................................................................................................ 25
5.4 Storage Notes .......................................................................................................................... 25
5.5 Safety Cautions ....................................................................................................................... 25
5.6 Other Cautions ........................................................................................................................ 26
5.7 Life Support Policy ................................................................................................................... 26
6 Regulatory and Certification Information ....................................................................................... 27
6.1 RoHS and REACH Declaration ............................................................................................... 27
6.2 Federal Communications Commission (FCC) for US .............................................................. 27
6.3 Industry Canada Certification .................................................................................................. 29
6.4 European Conformity According to RED (2014/53/EU) ........................................................... 32
7 Appendix ........................................................................................................................................... 33
7.1 Ordering Information ................................................................................................................ 33
7.2 Contact Details ........................................................................................................................ 34
PAN1761 Bluetooth & NFC Module
1 About This Document
Product Specification Rev. 1.2 Page 5
1 About This Document
1.1 Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN1761 module. It is intended for hardware design,
application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to
as “the PAN1761” or “the module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
0.1
November 2015
1st preliminary version.
0.2
January 2016
PIN Table correction.
0.3
February 2016
Minor changes.
0.6
23.08.2016
Bluetooth 4.1
0.7
3.11.2016
Changes in power supply values and conditions during measurement of
output power and sensitivity
1.0
January 2017
Final version
1.1
March 2017
Updated temperature range
1.2
July 2017
New document structure and layout
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4 Related Documents
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
PAN1761 Bluetooth & NFC Module
2 Overview
Product Specification Rev. 1.2 Page 6
2 Overview
The PAN1761 is based on Toshiba's single chip TC35670 Bluetooth semiconductor device with
embedded Toshiba Bluetooth 4.1 LE stack, GATT profile, and an NFC Forum Type 3 compliant
NFC tag. Peak power consumption of only 5.8 mA in Tx mode allows advanced wireless
functionalities in IoT, medical, and industrial applications without compromising battery life.
Additionally, NFC allows products to wake up from zero standby power consumption to full
Bluetooth operation. Highly secure Bluetooth connections are created using NFC to exchange
link keys.
The PAN1761 can be operated in Host mode for very simple integration of Bluetooth
connectivity into existing products. The PAN1761 and the PAN1026 share the same footprint.
Only minor code changes are required when migrating from PAN1026. Previously developed
software (Bluetooth Low Energy profiles and applications) can be easily migrated with a minimal
effort.
FCC, IC, and CE approval are available.
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
Further information on the variants and versions 7.1 Ordering Information.
PAN1761 Bluetooth & NFC Module
2 Overview
Product Specification Rev. 1.2 Page 7
2.1 Block Diagram
2.2 Bluetooth IC
Chip
Antenna
Toshiba
TC35670
UART
GPIOs
Host Wake up
Wake up
Reset
Vcc 3.3 V
LPF
PAN1761
Bluetooth 4.1 Module
Crystal
26 MHz
DC-DC
Conversion
EEPROM
512kbit
NFCI²C
NFC Wake up
NFC
Antenna
PAN1761 Bluetooth & NFC Module
2 Overview
Product Specification Rev. 1.2 Page 8
2.3 Pin Configuration
Pin Assignment
Top View
Pin Functions
No
Pin Name
GPIO No
Pin Type
Description
A1
GND
Ground pin
Connect to ground
A2
NC
Not connected
A3
Reset
Digital input
Reset, active-low
A4
VCC
Power
2 V – 3.6 V analog/digital power supply
connection
A5
VCC
Power
2 V – 3.6 V analog/digital power supply
connection
A6
VCC
Power
2 V – 3.6 V analog/digital power supply
connection
A7
GND
Ground pin
Connect to ground
A8
NC
Not connected
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4
PAN1761 Bluetooth & NFC Module
2 Overview
Product Specification Rev. 1.2 Page 9
No
Pin Name
GPIO No
Pin Type
Description
A9
GND
Connect to ground
A11
GND
Connect to ground
A12
GND
Connect to ground
B1
NC
Not connected
B2
TAG_L0
NFC_Anten
na
B3
TAG_SCL
NFC_I2C
B4
NC
Not connected
B5
NC
Not connected
B6
NC
Not connected
B7
NC
Not connected
B8
NC
Not connected
B9
NC
Not connected
C1
NC
Not connected
C2
TAG_L1
NFC_Anten
na
C3
TAG_RFDET
Digital Out
C4
NC
Not connected
C5
NC
Not connected
C6
TAG_READYX
Digital Out
C7
TAG_SDA
PWM2
NFC_I2C
C8
GND
Ground Pin
Connect to ground
C9
GND
Ground Pin
Connect to ground
D1
NC
Not connected
D2
NC
Not connected
D3
GPIO1
AIN0
Digital I/O
D4
Wakeup
GPIO0
Digital I/O
D5
NC
Not connected
D6
TAG_PONX
Digital In
D7
GND
Ground Pin
Connect to ground
D8
GND
Ground Pin
Connect to ground
D9
NC
Not connected/placeholder for antenna
PAN1761 Bluetooth & NFC Module
2 Overview
Product Specification Rev. 1.2 Page 10
No
Pin Name
GPIO No
Pin Type
Description
E1
GPIO8
SDA
Digital I/O
Connected to internal EEPROM
E2
GPIO7
SCL
Digital I/O
Connected to internal EEPROM
E3
NC
Not connected
E4
NC
Not connected
E5
TAG_RECTOUT
E6
UART_RXD
GPIO4
Digital In
E7
GPIO2
PWM0/AIN1
Digital I/O
E8
GND
Ground Pin
Connect to ground
E9
GND
Ground Pin
Connect to ground
F1
GND
Ground Pin
Connect to ground
F2
EEPROM_WP
Digital In
EEPROM write protect /active low
F3
NC
Not connected
F4
NC
Not connected
F5
GPIO6
UART_1-
CTS/
UART2-RX
Digital In
Can be configured to UART2_RXD
F6
SLEEPXCLKIN
Clock
32.768 KHz sleep clock input
F7
UART_TXD
GPIO3
Digital Out
F8
GPIO5
UART1_RT
S/ UART2-
TX
Digital I/O
Can be configured to UART2_TXD
F9
GND
Ground Pin
Connect to ground
F11
GND
Ground Pin
Connect to ground
F12
GND
Ground Pin
Connect to ground
PAN1761 Bluetooth & NFC Module
3 Detailed Description
Product Specification Rev. 1.2 Page 11
3 Detailed Description
3.1 Dimensions
All dimensions are in millimeters.
No.
Item
Dimension
Tolerance
Remark
1
Width
8.70
± 0.30
2
Length
15.60
± 0.30
3
Height
1.80
± 0.20
With case
PAN1761 Bluetooth & NFC Module
3 Detailed Description
Product Specification Rev. 1.2 Page 12
3.2 Footprint
The outer dimensions have a tolerance of 0.3 mm.
Top View
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4
PAN1761 Bluetooth & NFC Module
3 Detailed Description
Product Specification Rev. 1.2 Page 13
3.3 Packaging
The product is a mass production status product and will be delivered in the package described
below.
3.3.1 Tape Dimensions
3.3.2 Packing in Tape
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
100730-PAN1720.vsd
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
PAN1761 Bluetooth & NFC Module
3 Detailed Description
Product Specification Rev. 1.2 Page 14
3.3.3 Component Direction
3.3.4 Reel Dimension
PAN1761 Bluetooth & NFC Module
3 Detailed Description
Product Specification Rev. 1.2 Page 15
3.3.5 Package Label
Example
(1T)
(1P)
(2P)
(9D)
(Q)
(HW/SW)
Lot code
Customer order number, if applicable
Order number
Date code
Quantity
Hardware/software version
3.3.6 Total Package
PAN1761 Bluetooth & NFC Module
3 Detailed Description
Product Specification Rev. 1.2 Page 16
3.4 Case Marking
Example
1
2
3
4
5
6
7
8
2D barcode, for internal usage only
Brand name
Hardware/software version
Order number
Lot code
FCC ID
IC ID
Marking for Pin 1
PAN1761 Bluetooth & NFC Module
4 Specification
Product Specification Rev. 1.2 Page 17
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1 Default Test Conditions
Temperature: 25 ± 10 °C
Humidity: 40 to 85 % RH
Supply Voltage: 3.3 V
4.2 Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
Parameter
Condition
Min.
Typ.
Max.
Units
Voltage on any digital pin
-0.3
VDD
+
0.3
V
Operating ambient temperature
range
-30
85
°C
Storage temperature range
-30
125
°C
Bluetooth RF inputs
10
dBm
ESD:
All pads, according to human-body
model, JEDEC STD 22, method
A114
According to charged-device
model, JEDEC STD 22, method
C101
1000
V
PAN1761 Bluetooth & NFC Module
4 Specification
Product Specification Rev. 1.2 Page 18
4.3 Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not
even momentarily or individually, as permanent damage to the module may
result.
Parameter
Condition
Min.
Typ.
Max.
Units
Power supply voltage
2.0
3.3
3.6
V
Maximum ambient operating temperature
-30
85
C
4.4 Power Up Sequence
When the power is turned on, set reset signal to low (RESET=Low). After OSC is stable,
release reset (RESET=High).
Crystal oscillator stabilizing time is about 2 msec, so define release time after sufficient
evaluation.
When the power is turned off, set reset signal to low (RESET=Low).
4.5 Current Consumption
The current consumption depends on the user scenario and on the setup and
timing in the power modes.
Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated.
VDD power supply
Reset signal
DCDC / LDO output
Power off
OSC boot timer
Operation
Power on
voltage
detection
RC delay
Reference clock
Stable
Unstable
PAN1761 Bluetooth & NFC Module
4 Specification
Product Specification Rev. 1.2 Page 19
4.6 Bluetooth RF Performance
4.6.1 Bluetooth Characteristics
Parameter
Condition
Min.
Typ.
Max.
Units
Operation
frequency
range
2 402
2 480
MHz
Channel
spacing
2
MHz
Output power
Maximum setting, measured at single ended
50 Ohm.
0
dBm
Sensitivity,
High Gain
mode
High-gain mode, measured at single ended
50 Ohm.
-90.0
dBm
4.6.2 NFC Tag Interface
PAN1761 has a built-in NFC Forum Type 3 Tag (NFC Tag) function.
Features of the PAN1761 NFC interface
• Built-in contactless IC card technology.
• Wireless interface: automatic detection of 212 kbps and 424 kbps transmission speed.
• I2C interface: maximum operational clock 400 kHz.
• Built-in EEPROM: general user area 1 520 bytes, protecting against defective data.
• Writing time: 5 ms (typ.), 1 bit error automatic correction, CRC automatic addition, and error
detection of read data.
• Security: mutual authentication with Message Authentication Code (MAC), variety access
attributes can be set. Writing prohibition, reading after authentication, writing after
authentication, writing with MAC.
The technology refers to the following standards: JIS X 6319-4, ISO/IEC 18092
Basic technical characteristics
Item
Remarks
Data transmission format
Half duplex, synchronization
Carrier frequency
13.56 MHz
Data transmission speed
212,424 Kbit/s (automatic detection)
Modulation
ASK
Coding
Manchester
Bit order
MSBF
PAN1761 Bluetooth & NFC Module
4 Specification
Product Specification Rev. 1.2 Page 20
4.6.3 NFC Operational Sequence
If a wireless carrier is detected, TAG_RFDET pin outputs high level. If the wireless carrier
disappears, TAG_RFDET pin turns back to low level due to pull-down resistance. Set VDDIO
and VDD pin to output high (power supply). At Write without Encryption or Read without
Encryption, if IDm stored in PAN1761 chip and iDm with command are consistent,
TAG_READYX pin outputs high level. After that, during supply of internal power source, the
high is kept. VDDIO and VDD pin need power supply for TAG_READYX pin to output high.
By becoming high in TAG_READYX pin, HOST can get to know that wireless reader writer
accesses the module.
Sequence example of operation over the wireless TAG interface
PAN1761 Bluetooth & NFC Module
4 Specification
Product Specification Rev. 1.2 Page 21
4.7 Antenna Radiation Pattern
PAN1761 Bluetooth & NFC Module
4 Specification
Product Specification Rev. 1.2 Page 22
4.8 Reliability Tests
The measurement should be done after the test device has been exposed to room temperature
and humidity for one hour.
No.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
• Freq.: 10~50 Hz; Amplitude:
1.5 mm; 20 min./cycle, 1 hrs. each
of XYZ axis
• Freq.: 30~100 Hz, 6G;
20 min./cycle, 1 hrs. each of XYZ
axis
2
Shock test
See above
Dropped onto hard wood from a
height of 50 cm for 3 times
3
Heat cycle test
See above
-40 °C for 30 min. and +85 °C for
30 min.; each temperature 300 cycles
4
Moisture test
See above
+60 °C, 90 % RH, 300 h
5
Low
temperature
test
See above
-40 °C, 300 h
6
High temp. test
See above
+85 °C, 300 h
PAN1761 Bluetooth & NFC Module
4 Specification
Product Specification Rev. 1.2 Page 23
4.9 Recommended Soldering Profile
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight
More than 75 percent of the soldering area shall be coated by solder
The soldering profiles should be adhered to in order to prevent
electrical or mechanical damage
Soldering profile assumes lead-free soldering
PAN1761 Bluetooth & NFC Module
5 Cautions
Product Specification Rev. 1.2 Page 24
5 Cautions
Failure to follow the guidelines set forth in this document may result in
degrading of the product’s functions and damage to the product.
5.1 Design Notes
1. Follow the conditions written in this specification, especially the control signals of this
module.
2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF
directly at the module).
3. This product should not be mechanically stressed when installed.
4. Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
5. Avoid assembly and use of the target equipment in conditions where the product’s
temperature may exceed the maximum tolerance.
6. The supply voltage should not be exceedingly high or reversed. It should not carry noise
and/or spikes.
7. Keep this product away from other high frequency circuits.
8. Refer to the recommended pattern when designing a board.
5.2 Installation Notes
1. Reflow soldering is possible twice based on the conditions set forth in 4.9
Recommended Soldering Profile. Set up the temperature at the soldering portion of this
product according to this reflow profile.
2. Carefully position the products so that their heat will not burn into printed circuit boards
or affect the other components that are susceptible to heat.
3. Carefully locate these products so that their temperatures will not increase due to the
effects of heat generated by neighboring components.
4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between the cover and
these products to occur.
5. This product should not be mechanically stressed or vibrated when reflowed.
6. To repair the board by hand soldering, follow the conditions set forth in this chapter.
7. Do not wash this product.
8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage
to the unit.
PAN1761 Bluetooth & NFC Module
5 Cautions
Product Specification Rev. 1.2 Page 25
5.3 Usage Condition Notes
1. Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, check and evaluate their operation befor assembly on the final products.
2. Do not use dropped products.
3. Do not touch, damage or soil the pins.
4. Follow the recommended condition ratings about the power supply applied to this
product.
5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on
PCB.
6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
7. These products are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information, and communication
equipment.
5.4 Storage Notes
1. The module should not be stressed mechanically during storage.
2. Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected:
– Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX,
– Storage in direct sunlight,
– Storage in an environment where the temperature may be outside the range of 5 °C to
35 °C, or where the humidity may be outside the 45 to 85 percent range,
– Storage of the products for more than one year after the date of delivery storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months
of storage.
3. Keep this product away from water, poisonous gas, and corrosive gas.
4. This product should not be stressed or shocked when transported.
5. Follow the specification when stacking packed crates (max. 10).
5.5 Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a
short circuit occurs, provide the following failsafe functions as a minimum:
PAN1761 Bluetooth & NFC Module
5 Cautions
Product Specification Rev. 1.2 Page 26
1. Ensure the safety of the whole system by installing a protection circuit and a protection
device.
2. Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
5.6 Other Cautions
1. Do not use the products for other purposes than those listed.
2. Be sure to provide an appropriate fail-safe function on your product to prevent any
additional damage that may be caused by the abnormal function or the failure of the
product.
3. This product has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
4. These products are not intended for uses other than under the special conditions shown
below. Before using these products under such special conditions, carefully check their
performance and reliability under the said special conditions to determine whether or not
they can be used in such a manner:
– In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash,
– In direct sunlight, outdoors, or in a dusty environment,
– In an environment where condensation occurs,
– In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOX).
5. If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
6. When you have any question or uncertainty, contact Panasonic.
5.7 Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.
PAN1761 Bluetooth & NFC Module
6 Regulatory and Certification Information
Product Specification Rev. 1.2 Page 27
6 Regulatory and Certification Information
6.1 RoHS and REACH Declaration
The latest declaration of environmental compatibility (Restriction of Hazardous Substances,
RoHS and Registration, Evaluation, Authorisation, and Restriction of Chemicals, REACH) for
supplied products can be found on the Panasonic website in the “Downloads” section of the
respective product 7.2.2 Product Information.
6.2 Federal Communications Commission (FCC) for US
6.2.1 FCC Notice
The PAN1761 including the antennas, which are listed in 6.2.5 Approved
Antenna List, complies with Part 15 of the FCC Rules.
The device meets the requirements for modular transmitter approval as detailed in FCC public
Notice DA00-1407. The transmitter operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may
cause undesired operation.
6.2.2 Caution
The FCC requires the user to be notified that any changes or modifications
made to this device that are not expressly approved by Panasonic Industrial
Devices Europe GmbH may void the user's authority to operate the
equipment.
This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates uses and
can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio
communications.
PAN1761 Bluetooth & NFC Module
6 Regulatory and Certification Information
Product Specification Rev. 1.2 Page 28
However, there is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help
6.2.3 Label Requirements
The OEM must ensure that FCC labelling requirements are met. This includes
a clearly visible label on the outside of the OEM enclosure specifying the
appropriate Panasonic FCC identifier for this product as well as the FCC
Notice above.
The FCC identifier is FCC ID: T7V1761.
This FCC identifier is valid for the PAN1761. The end product must in any case be labelled on
the exterior with:
"Contains FCC ID: T7V1761"
6.2.4 Antenna Warning
This antenna warning refers to the test device with the model number PAN1761 Chapter 7.1
Ordering Information
The device is tested with a standard SMA connector and with the antenna listed below. When
integrated into the OEM’s product, these fixed antennas require installation preventing end
users from replacing them with non-approved antennas. Any antenna not in the following table
must be tested to comply with FCC Section 15.203 for unique antenna connectors and with
Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in
6.2.5 Approved Antenna List is the same (FCC ID: T7V1761).
6.2.5 Approved Antenna List
Item
Part Number
Manufacturer
Frequency Band
Type
Gain (dBi)
1
LDA212G3110K
Murata
2.4 GHz
Chip antenna
+0.9
2
ANT2012
Yageo
2.4GHz
Chip-Antenna
+0.9
PAN1761 Bluetooth & NFC Module
6 Regulatory and Certification Information
Product Specification Rev. 1.2 Page 29
6.2.6 RF Exposure
To comply with FCC RF Exposure requirements, the OEM must ensure that
only antennas from the Approved Antenna List are installed 6.2.5 Approved
Antenna List.
The preceding statement must be included as a CAUTION statement in
manuals for products operating with the approved antennas in the previous
table to alert users on FCC RF Exposure compliance.
Any notification to the end user of installation or removal instructions about the
integrated radio module is not allowed.
The radiated output power of the PAN1761 with a mounted ceramic antenna
(FCC ID: T7V1761) is below the FCC radio frequency exposure limits.
Nevertheless, the PAN1761 shall be used in such a manner that the potential
for human contact during normal operation is minimized.
End users may not be provided with the module installation instructions.
OEM integrators and end users must be provided with transmitter operating
conditions for satisfying RF exposure compliance.
6.3 Industry Canada Certification
English
The PAN1761 is licensed to meet the regulatory requirements of Industry Canada (IC).
License ID: IC: 216Q-1761
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits.
Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca.
This device has been designed to operate with the antennas listed in 6.2.5 Approved
Antenna List, having a maximum gain of +0.9 dBi. Antennas not included in this list or having a
gain greater than +0.9 dBi are strictly prohibited for use with this device. The required antenna
impedance is 50 ohms. The antenna used for this transmitter must not be co-located or
operating in conjunction with any other antenna or transmitter.
Due to the model size, the IC identifier is displayed in the installation instruction only and it
cannot be displayed on the module’s label due to the limited size.
PAN1761 Bluetooth & NFC Module
6 Regulatory and Certification Information
Product Specification Rev. 1.2 Page 30
French
PAN1761 est garanti conforme aux dispositions règlementaires d’Industry Canada (IC).
License: IC: 216Q-1761
Il est recommandé aux fabricants d’appareils fixes, mobiles ou portables de consulter la
réglementation en vigueur et de vérifier la conformité de leurs produits relativement aux limites
d’exposition aux rayonnements radiofréquence ainsi qu’au débit d’absorption spécifique
maximum autorisé.
Des informations pour les utilisateurs sur la réglementation Canadienne concernant l’exposition
aux rayonnements RF sont disponibles sur le site www.ic.gc.ca.
Ce produit a été développé pour fonctionner spécifiquement avec les antennes listées dans le
tableau 6.2.5 Approved Antenna List, présentant un gain maximum de 0.9 dBi. Des antennes
autres que celles listées ici, ou présentant un gain supérieur à 0.9 dBi ne doivent en aucune
circonstance être utilisées en combinaison avec ce produit. L’impédance des antennes
compatibles est 50 Ohm. L’antenne utilisée avec ce produit ne doit ni être située à proximité
d’une autre antenne ou d’un autre émetteur, ni être utilisée conjointement avec une autre
antenne ou un autre émetteur.
En raison de la taille du produit, l’identifiant IC est fourni dans le manuel d’installation.
6.3.1 IC Notice
English
The device PAN1761 ( 7.1 Ordering Information), including the antennas
( 6.2.5 Approved Antenna List), complies with Canada RSS-GEN Rules.
The device meets the requirements for modular transmitter approval as
detailed in RSS-Gen.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may
cause undesired operation.
French
Le présent appareil PAN1761 ( 7.1 Ordering Information), les antennes y
compris ( 6.2.5 Approved Antenna List), est conforme aux CNR-Gen
d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes :
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
PAN1761 Bluetooth & NFC Module
6 Regulatory and Certification Information
Product Specification Rev. 1.2 Page 31
6.3.2 Labeling Requirements
English
Labeling Requirements
The OEM must ensure that IC labelling requirements are met. This includes a
clearly visible label on the outside of the OEM enclosure specifying the
appropriate Panasonic IC identifier for this product as well as the IC Notice
above.
The IC identifier is:
IC: 216Q-1761
This IC identifier is valid for all PAN1761 modules 7.1 Ordering Information.
In any case, the end product must be labelled on the exterior with:
"Contains IC: 216Q-1761”.
French
Obligations d’étiquetage
Les fabricants d’équipements d’origine (FEO) – en anglais Original Equipment
Manufacturer (OEM) – doivent s’assurer que les obligations d’étiquetage IC du
produit final sont remplies. Ces obligations incluent une étiquette clairement
visible à l’extérieur de l’emballage externe, comportant l’identifiant IC du
module Panasonic inclus, ainsi que la notification ci-dessus.
L’ identifiant IC est:
IC: 216Q-1761
Cet identifiant est valide pour tous les modules PAN1761 7.1 Ordering
Information. Dans tous les cas les produits finaux doivent indiquer sur leur
emballage externe la mention suivante:
"Contient IC: 216Q-1761”.
PAN1761 Bluetooth & NFC Module
6 Regulatory and Certification Information
Product Specification Rev. 1.2 Page 32
6.4 European Conformity According to RED (2014/53/EU)
All modules described in this Product Specification comply with the standards according to the
following LVD (2014/35/EU), EMC-D (2014/30/EU) together with the RED (2014/53/EU) articles:
3.1a Safety/Health: EN62368-1:2014
EN62311:2008
3.1b EMC: EN 301 489-1 V2.1.1:2017-02
EN 301 489-17 V3.1.1:2017-02
3.2 Radio: EN 300 328 V2.1.1:2016-11
As a result of the conformity assessment procedure described in the 2014/53/EU Directive, the
end customer equipment should be labelled as follows:
PAN1761 in the specified reference design can be used in all countries of the European
Economic Area (Member States of the EU, European Free Trade Association States [Iceland,
Liechtenstein, Norway]), Monaco, San Marino, Andorra and Turkey.
PAN1761 Bluetooth & NFC Module
7 Appendix
Product Specification Rev. 1.2 Page 33
7 Appendix
7.1 Ordering Information
Variants and Versions
Order Number
Brand Name
Description
MOQ1
ENW89848A1KF2
PAN1761
PAN1761 Bluetooth Low Energy & NFC Combo Module
1 500
1
Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces,
fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution
channels.
2
Samples are available on customer demand.
PAN1761 Bluetooth & NFC Module
7 Appendix
Product Specification Rev. 1.2 Page 34
7.2 Contact Details
7.2.1 Contact Us
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to
find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
7.2.2 Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
http://www.panasonic.com/rfmodules