Silicone Materials for
Electronic Devices
and Component Assemblies
Contents
Overview ................................................................................1-2
Industry Overview .............................................................3-4
Product Index
Adhesives and Sealants ...................................................5-6
Grease ......................................................................................7
Coating Materials ...............................................................7-8
Encapsulants / Potting Materials..................................9-10
Selection Guide ...............................................................11-12
Product Details
1 Part Condensation Cure ...........................................13-17
1 Part Heat (Addition) Cure .........................................18-20
2 Part Room Temperature. Cure ...............................21-22
2 Part Heat (Addition) Cure .........................................23-24
1 Part & 2 Part Gels .....................................................25-26
Junction Coating Resin (JCR) Grades............................27
Grease ...................................................................................28
UL Certifications...........................................................29-30
Technical Information..................................................31-32
FAQ ...........................................................................................33
Silicone Product
Profile
The products introduced in
this selector guide consist
of RTV (Room Temperature
Vulcanizing) silicone products
that are commonly found
in Electric and Electronic
applications and component
assemblies. This family of
silicone products consists
of both Room Temperature
Cure and Heat (Addition)
Cure grades.
Momentive Performance
Materials offers a
comprehensive portfolio
of silicone solutions to
help meet a broad array of
handling and performance
needs in electronic
components and assemblies.
Selection of the appropriate
type of RTV depends upon
the required manufacturing
process, handling
requirements, curing
conditions, equipment, and
desired material properties.
Condensation Cure
Condensation cure silicone
products cure when
exposed to moisture in
the environment at room
temperature. These
materials are categorized into
Alkoxy, Acetoxy, or Oxime
based on the byproducts
that occur during cure.
Heat (Addition) Cure
Heat cure grades cure upon
exposure to elevated heat or
room temperature.
RTV
Silicone
Varnish
Millable
Silicone Rubber
Silicone Oil
1 Part Condensation Cure
Condensation Cure
2 Part
Heat (Addition) Cure
Heat (Addition) Cure
Silicone
Sealing & Adhesion
Silicones are used in a wide
array of applications for
bonding components, and
sealing against moisture or
environmental contaminants.
A comprehensive portfolio of
1 Part and 2 Part Adhesives
and Sealants, many of which
are excellent candidates for
assembly applications on or
near sensitive electrical and
electronic components, are
available. These materials
are applied by a variety
of methods ranging from
manual dispensing to auto-
dispensing units for tube,
cartridge, pail, or drum
packages. Mixing for 2 Part
grades may be accomplished
by either manual processes
or meter mix dispensing,
depending on production
volume and post-mix material
properties.
Coating
The Coating process involves
the application of silicone
in a thin protective layer to
a component surface by
methods such as dip, flow,
spray, and selective robotic
coating. Selection of a
silicone coating material for a
particular application involves
the consideration of various
performance and processing
criteria.
Potting &
Encapsulation
Silicone rubber and gels are
widely used in electronics
to ensure mechanical and
environmental protection.
A full range of products
are offered in various cure
speeds, viscosities, and
performance, many of which
offer enhancements for
thermal cycling protection,
stress relief, material
strength, flame retardancy,
or optical clarity.
Performance Considerations
- Temperature Resistance
- Dielectric Resistance
- Flame Retardancy
- Low Volatility
- Stress Relief
Process Considerations
- Viscosity
- Cure Mechanism
- Cure Temperature
- Cure Time
- Pot Life
Performance Considerations
- Temperature Resistance
- Dielectric Resistance
- Flame Retardancy
- Low Volatility
- Adhesion
- Mechanical Strength
- Hardness
- Thermal Conductivity
Process Considerations
- Viscosity
- Cure Mechanism
- Cure Temperature
- Cure Time
- Pot Life
Performance Considerations
- Temperature Resistance
- Dielectric Resistance
- Flame Retardancy
- Low Volatility
- Adhesion
- Stress Relief
- Release Properties
- Thermal Conductivity
Process Considerations
- Viscosity
- Cure Mechanism
- Cure Temperature
- Cure Time
- Pot Life
Relative Performance Characteristics
Property Silicone RTV Epoxy Urethane
Temperature Range
-50 ~ +200 oC -50 ~ +150 oC -30 ~ +120 oC
Heat Resistance Good Poor Poor
Flame Retardancy
1
Good None None
UV Stability Good Poor Poor
Ozone Stability Good Poor Poor
Modulus Low High High
1
As a base material silicone demonstrates flame retardant properties comparable to UL94HB.
21
Industries Served
Electronic Devices and
Power Modules
Momentive Performance
Materials is a driving force
as a supplier of advanced
silicone technology to
the electronics industry.
Increasing electronic
component densities and
performance demands
have created a need for
specialized silicone solutions
from Momentive for a broad
mix of performance and
handling requirements.
Typical Applications:
- Power converters
- Inverters
- Hybrid ICs
- Micro-Electronic
packaging
- High-voltage component
insulation
- Membrane switches
- Photo couplers
Board Assembly
Silicones are found in board-
level adhesion, coating, and
encapsulation applications,
and contribute to the long-
term, reliable performance
of many components and
assemblies. A wide portfolio
of products is available,
providing flame retardancy,
thermal conductivity,
temperature resistance,
low-volatility, or high-purity
benefits.
Typical Applications:
- Board-level adhesion,
fixing, and sealing
- PCB coating
- Component
encapsulation
- Junction Coating Resins
Consumer Electronics
Silicones are commonly used
in a variety of consumer
electronics applications.
In addition to providing
adhesion to many substrates,
an array of grades are
available to provide heat
resistance, flame retardancy,
low volatility for sensitive
components, and moisture
protection.
Typical Applications:
- Flat panel displays
- PCs and Smart Phones
- LED Lighting
- Steam iron plate seals
- Air conditioner units
- Control panel insulation
- PCB fixing and sealing
Automotive Electronics
The automotive industry
plays a critical role in
integrating new electronic
technologies. As more and
more components migrate
to electronic solutions,
silicones play an increasingly
important role in helping
deliver material solutions that
contribute to design flexibility
and long-term component
reliability under harsh
operating conditions.
Typical Applications:
- ECU potting, sealing,
coating
- Wire connector sealing
- Sealing, encapsulation in
a broad range of sensors
- HVAC system sealing
- Vibration dampening
- Headlamp assemblies
Aviation and Aerospace
Avionics and frame assembly
needs in Aviation and
Aerospace are served
through silicone adhesives,
coating, encapsulation
and potting materials that
help withstand stress and
temperature extremes.
Typical Applications:
- Avionics
- Circuit and terminal
protection
- Wire sealants
- Engine gasketing
- Cargo door, window
sealing
- Weatherstrip adhesives
- Aviation lighting
- Ventilation ducts
Energy
Reliability of electronic
components and the ability
for panels to withstand
harsh conditions over the
lifecycle of the product are
important considerations in
solar energy applications.
Momentive Performance
Materials helps serve this
growing industry with its
range of potting materials
and sealants.
Typical Applications:
- Terminal box potting
- Box and base sealing
- Aluminum frame and
glass / EVA plate sealing
3 4
65
Regulatory restrictions may apply to products in certain countries.
Please contact a Momentive Performance Materials sales representatives for availability in specic regions.
Product Overview: Adhesives & Sealants Performance
Product
Detail
Type Grade Cure
Chemistry
Cured
Property Feature Flowability Flame
Retardancy
Low
Volatility
Thermally
Conductive
High Temp.
Resistance
Low Temp.
Resistance
FDA
Compliant MIL-Spec
RTV133 Alkoxy Rubber UL certified non-flowable sealant. Non-flowable UL94 V-0 P. 13
RTV167 Alkoxy Rubber High-strength paste adhesive with UL certified and Mil Spec. Non-flowable UL94 HB MIL-A-46146B P. 13
TSE385 Alkoxy Rubber Paste adhesive. Suitable for PC substrates. Non-flowable P. 13
TSE3853-W Alkoxy Rubber UL certified, semi-flowable paste. Semi-flowable UL94 V-0 P. 14
TSE3854DS Alkoxy Rubber UL certified paste adhesive. Non-flowable UL94 V-0 P. 13
TN3005 Alkoxy Rubber Fast tack, low volatile paste paste adhesive. Non-flowable •P. 13
TN3085 Alkoxy Rubber Fast tack, low volatile paste paste adhesive. UL certified Non-flowable UL94 V-0 • • P. 13
TSE3941M Alkoxy Rubber Fast tack, thermally conductive flowable sealant. Flowable •P. 14
TSE3944 Alkoxy Rubber Low volatile, UL certified flowable sealant. Semi-flowable UL94 V-0 •P. 14
TN3305 Alkoxy Rubber Fast tack, low volatile flowable adhesive / sealant Flowable •P. 14
TSE3971 Alkoxy Rubber Flowable adhesive / sealant. Flowable P. 14
TSE3976-B Alkoxy Rubber Low volatile, temperature resistant sealant. UL certified. Flowable UL94 HB • • P. 14
XE11-B5320 Alkoxy Rubber Fast tack, low volatile, thermally conductive adhesive. UL certified. Non-flowable UL94 HB • • P. 13
FRV1106 Acetoxy Rubber Fuel, solvent, chemical, and temperature-resistant fluoro sealant. Non-flowable •P. 16
RTV100 series Acetoxy Rubber FDA, USDA, and NSF compliant paste adhesive. Mil Spec. Non-flowable •MIL-A-46106B P. 17
RTV106 Acetoxy Rubber
Temperature-resistant adhesive. FDA, USDA, & NSF compliant. Mil Spec.
Non-flowable • • MIL-A-46106B P. 17
RTV116 Acetoxy Rubber
Temperature-resistant flowable sealant. FDA, USDA, & NSF compliant. Mil Spec.
Flowable • • MIL-A-46106B P. 17
RTV157 Acetoxy Rubber High strength paste / adhesive. Non-flowable P. 17
RTV159 Acetoxy Rubber High strength paste / adhesive. Temperature-resistant. Non-flowable •P. 17
TSE370 Acetoxy Rubber Fast tack, general purpose paste adhesive. Non-flowable P. 17
TSE382 Oxime Rubber Fast tack, general purpose adhesive paste. UL certified. Non-flowable UL94 HB P. 15
TSE3826 Oxime Rubber Fast tack adhesive for high-temperature applications. Non-flowable •P. 16
TSE3840-G Oxime Rubber UL certified general purpose adhesive / sealant. Semi-flowable UL94 V-0 P. 16
TSE3843-W Oxime Rubber UL certified general purpose adhesive / sealant. Semi-flowable UL94 V-1 •P. 16
TSE384-B Oxime Rubber UL certified general purpose adhesive / sealant. Non-flowable UL94 V-0 P. 16
TSE387 Oxime Rubber General purpose flowable adhesive / sealant. Flowable P. 16
TSE3877-B Oxime Rubber Flowable sealant for high-temperature applications. Flowable •P. 16
TSE388 Oxime Rubber Flowable general purpose adhesive / sealant. Flowable P. 16
TSE3212 Heat Rubber Thixotropic adhesive / sealant. Semi-flowable P. 18
TSE322 Heat Rubber Flowable adhesive / sealant. Flowable P. 18
TSE3221S Heat Rubber Flowable adhesive / sealant. Flowable P. 19
TSE322S Heat Rubber UL certified, semi-flowable adhesive / sealant. Semi-flowable UL94 HB P. 18
TSE326 Heat Rubber UL certified, high temperature-resistant adhesive / sealant. Flowable UL94 HB •P. 19
TSE3261-G Heat Rubber High temperature-resistant adhesive / sealant. Flowable •P. 18
TSE326M1Heat Rubber High temperature-resistant adhesive / sealant. Flowable •P. 19
TSE3280-G Heat Rubber Thermally conductive adhesive. Flowable •P. 18
TSE3281-G Heat Rubber Thermally conductive adhesive. Flowable •P. 19
XE13-B3208 Heat Rubber General purpose adhesive / sealant. Non-flowable P. 18
RTV577 Condensation Rubber Extreme low temperature resistant sealant. Release capability. Non-flowable •P. 21
RTV88 Condensation Rubber Semi-flowable temperature-resistant sealant. Release capability. Semi-flowable •P. 21
TSE3360 Heat Rubber General purpose adhesive / sealant. Non-flowable P. 23
TSE3380 Heat Rubber Thermally conductive adhesive. Fast cure at elevated temperatures. Flowable •P. 23
XE14-A0425 Heat Rubber Heat resistant, thermally conductive adhesive. Semi-flowable • • P. 23
1 TSE326M-EX in Europe and the Americas
1 Part Condensation Cure 1 Part Heat Cure
2P
RT
2 Part
Heat
Cure
87
Regulatory restrictions may apply to products in certain countries.
Please contact a Momentive Performance Materials sales representatives for availability in specic regions.
Grease - Product Index Performance
Product
Detail
Grade Feature Thermally
Conductive
Low
Bleed
Low
Volatility
Heat
Resistant
TSK5303
Moderate thermal conductivity with heat resistance.
• • • P. 28
TSK5370
General electrical insulation. Swell resistant on silicone.
•P. 28
TSK550 General electrical insulation, arc resistance. P. 28
TSK551 Insulator protection from salt, dust. P. 28
YG6111 Moderate thermal conductivity. • • P. 28
YG6240
Moderate thermal conductivity, low-bleed performance.
••• P. 28
YG6260 Moderate thermal conductivity. • • P. 28
TIG1000 High thermal conductivity. • • P. 28
Product Overview: Coating Materials Performance
Product
Detail
Type Grade Cure
Chemistry
Cured
Property Feature Flowability Flame
Retardancy
Low
Volatility
Thermally
Conductive
High Temp.
Resistance JCR Grade FDA
Compliant MIL-Spec
ECC3010 Alkoxy Rubber Fast cure conformal coating material. Solvent free Flowable P. 15
ECC3050S Alkoxy Rubber Fast cure conformal coating material. Low volatile. Solvent free Flowable •P. 15
ECS0600 Alkoxy Rubber High purity repairable electrode coating. Fast tack. Flowable •P. 15
ECS0601 Alkoxy Rubber High purity, non-repairable type electrode coating. UL certified. Flowable UL94 HB •P. 15
ECS0609FR Alkoxy Rubber High purity, non-repairable type electrode coating. UL certified. Flowable UL94 V-0 •P. 14
RTV160 Alkoxy Rubber UL certified flowable sealant. Flowable UL94 HB P. 14
TSE3941M Alkoxy Rubber Fast tack, thermally conductive flowable sealant. Flowable •P. 14
TSE3944 Alkoxy Rubber Low volatile, UL certified flowable sealant. Semi-flowable UL94 V-0 •P. 14
TN3305 Alkoxy Rubber Fast tack, low volatile flowable adhesive / sealant Flowable •P. 14
TSE3971 Alkoxy Rubber Flowable sealant. Flowable P. 14
TSE3976-B Alkoxy Rubber Low volatile, temperature resistant sealant. UL certified. Flowable UL94 HB • • P. 14
TSE398 Alkoxy Rubber Pourable coating / encapsulant. Flowable P. 15
TN3705 Alkoxy Rubber Low volatile, low viscosity coating / potting material Flowable •P. 15
XE11-A5133S Alkoxy Rubber Low volatile, UL certified, thermally conductive coating & potting. Flowable UL94 V-1 • • P. 14
RTV110 series Acetoxy Rubber
General purpose coating / encapsulant. FDA, USDA, and NSF compliant. Mil Spec.
Flowable •MIL-A-46106B P. 17
TSE387 Oxime Rubber General purpose flowable sealant / coating. Flowable P. 16
TSE3877-B Oxime Rubber Flowable sealant for high-temperature applications. Flowable •P. 16
TSE388 Oxime Rubber Flowable, general purpose sealant / coating. Flowable P. 16
TSE389 Oxime Rubber Flowable, UL certified coating / sealant. Flowable UL94 HB P. 16
ECC4865 Heat Rubber Extreme low viscosity coating material with UV tracer. Flowable P. 20
TSE3221S Heat Rubber Flowable sealant / coating material. Flowable P. 19
TSE325 Heat Rubber Flowable coating / encapsulant. Flowable P. 20
TSE3250 Heat Rubber Flowable coating / encapsulant. Flowable P. 20
TSE3251 Heat Rubber Flowable coating material. Semi-flowable P. 20
TSE3251-C Heat Rubber Flowable coating material. Semi-flowable P. 20
TSE325-B Heat Rubber Flowable coating / encapsulant. Flowable P. 20
TSJ3155 Heat Rubber High purity JCR-grade white rubber. Semi-flowable •P. 27
TSJ3195-W Heat Gel High purity JCR-grade white gel. Semi-flowable •P. 27
TSJ3185 Heat Gel High purity JCR-grade translucent gel. Semi-flowable •P. 27
RTV11 Condensation Rubber General purpose encapsulation and potting. FDA compliant. Flowable •P. 22
TSE3033 Heat Rubber Transparent coating / encapsulant. Fast cure at elevated temperatures. Flowable P. 24
TSE3331 Heat Rubber UL certified, thermally conductive, coating / encapsulant. Flowable UL94 V-0 •P. 23
TSE3331K1Heat Rubber Low viscosity variant of TSE3331. Flowable UL94 V-0 •P. 24
TSE3331K EX1Heat Rubber Low viscosity variant of TSE3331. Flowable UL94 V-0 •P. 23
XE14-B5778 Heat Rubber High purity JCR-grade translucent rubber. Semi-flowable •P. 27
TSJ3175 Heat Gel High purity JCR-grade thixotropic gel. Semi-flowable •P. 27
1 TSE3331K for Asia Pacific, TSE3331K EX for Europe and the Americas
1 Part Condensation Cure 1 Part Heat Cure
2P RT
2 Part
Heat
Cure
109
Regulatory restrictions may apply to products in certain countries.
Please contact a Momentive Performance Materials sales representatives for availability in specic regions.
Product Overview: Encapsulants and Potting Materials Performance
Product
Detail
Type Grade Cure
Chemistry
Cured
Property Feature
Flowability
Flame
Retardancy
Low
Volatility
Thermally
Conductive
High Temp.
Resistance
Low Temp.
Resistance
FDA
Compliant MIL-Spec
RTV160 Alkoxy Rubber UL certified flowable encapsulant. Flowable UL94 HB P. 14
TSE398 Alkoxy Rubber Pourable coating / encapsulant. Flowable P. 15
TN3705 Alkoxy Rubber Low volatile, low viscosity potting / coating material. Flowable •P. 15
XE11-A5133S Alkoxy Rubber Low volatile, UL certified, thermally conductive coating & potting. Flowable UL94 V-1 • • P. 14
RTV110 series Acetoxy Rubber
General purpose coating / encapsulant. FDA, USDA, and NSF compliant. Mil Spec.
Flowable •MIL-A-46106B P. 17
RTV116 Acetoxy Rubber
Temperature-resistant flowable sealant. FDA, USDA, and NSF compliant. Mil Spec.
Flowable • • MIL-A-46106B P. 17
TSE325 Heat Rubber Flowable coating / encapsulant. Flowable P. 20
TSE3250 Heat Rubber Flowable coating / encapsulant. Flowable P. 20
TSE325-B Heat Rubber Flowable coating / encapsulant. Flowable P. 20
TSE3051 Heat Gel Low viscosity potting gel. Flowable P. 25
TSE3051-FR Heat Gel UL certified variant of TSE3051. Flowable UL94 V-1 P. 25
TSE3051-L Heat Gel Low penetration variant of TSE3051. Flowable P. 25
TSE3053 Heat Gel High penetration gel. Flowable P. 25
RTV11 Condensation Rubber General purpose encapsulation and potting. FDA compliant. Flowable •P. 22
RTV31 Condensation Rubber High temperature resistant potting. Good release properties. Flowable •P. 22
RTV566 Condensation Rubber Low volatile, high-low temperature-resistance. Flowable • • • P. 21
RTV60 Condensation Rubber Extreme high temperature-resistant coating / potting. Release capability. Flowable •P. 21
TSE3663 Condensation Rubber Flowable encapsulant / potting material. Flowable P. 22
TSE3661 Condensation Rubber Flowable encapsulant / potting material. Flowable UL94 HB P. 22
TSE3664K Condensation Rubber UL certified, flowable encapsulant / potting material. Flowable UL94 V-0 P. 22
RTV615 Heat Rubber High strength potting material. Fast cure at elevated temperatures. Flowable •P. 23
TSE3032 Heat Rubber Transparent potting / encapsulant with excellent release properties. Flowable P. 23
TSE3033 Heat Rubber
Low viscosity, transparent potting material. Fast cure at elevated temperatures.
Flowable P. 24
TSE3331 Heat Rubber UL certified, thermally conductive, coating / encapsulant. Flowable UL94 V-0 •P. 23
TSE3331K1Heat Rubber Low viscosity variant of TSE3331. Flowable UL94 V-0 •P. 24
TSE3331K EX1Heat Rubber Low viscosity variant of TSE3331. Flowable UL94 V-0 •P. 23
TSE3431 Heat Rubber UL certified, thermally conductive potting material. Release capability. Flowable UL94 V-0 •P. 24
TSE3431-H Heat Rubber UL certified, thermally conductive potting material. Release capability. Flowable UL94 V-0 •P. 24
XE14-B7892 Heat Rubber
UL certified low-viscosity potting material. Low temperture cure. Release capability.
Flowable UL94 V-0 P. 24
YE5822 Heat Rubber Low viscosity potting material. Good release properties. Flowable P. 24
RTV6136-D1 Heat Gel Low viscosity potting gel with fast cure at low temperatures. Flowable P. 26
TSE3062 Heat Gel Fast cure at low temperatures. Flowable P. 26
TSE3070 Heat Gel High-elongation gel with low temperature cure. Flowable P. 26
1 TSE3331K for Asia Pacific, TSE3331K EX for Europe and the Americas
1 Part
Cond. Cure 1 Part Heat
Cure
2 Part Room
Temp. Cure 2 Part Heat Cure
12
Room TemperatureHeat
11
BLACK=Rubber RED=Gels
Viscosity and flowability of
the silicone material are often
key factors in the selection of
a material for use in sealing,
coating, and encapsulation /
potting applications. A broad
array of material performance
and viscosity combinations
are provided to help match
the requirements of many
applications.
Selection Guide
1 Part Grades
Viscosity
Range
Performance
Thermally
Conductive
Low
Volatility
UL
Certified
Temp.
Resistant
FDA
Compliant
General
Purpose
Non-
Flowable
TN3085 TN3005 TSE3854DS TSE385
XE11-B5320 TN3085 TN3085
XE11-B5320 RTV133
FRV1106 RTV100 RTV157
RTV106 RTV106 TSE370
TSE382 TSE3826
TSE384-B
XE13-B3208
High
Viscosity
TSE3976-B TSE3853-W TSE3976-B TSE3971
TSE3976-B
RTV159
TSE3843-W TSE3840-G TSE3877-B
TSE3843-W
TSE3212
TSE322
Medium
Viscosity
TSE3941M TSE3944 TSE3944 TSE398
XE11-A5133S XE11-A5133S XE11-A5133S
TN3305 RTV160
RTV167
RTV110 RTV116 RTV110
RTV116
TSE387
TSE388
TSE3280-G TSE322S TSE326 TSE3221S
TSE3281-G TSE325 TSE3261-G
TSE326M
Low
Viscosity
ECC3050S ECS0601 ECC3010
ECS0600 ECS0609FR
ECS0601
ECS0609FR
TN3705
TSE389
TSE3051FR TSE3051
TSE3051-L
TSE3053
TSE325
TSE3250
TSE3251
TSE3251-C
TSE325-B
2 Part Grades
Viscosity
Range
Performance
Thermally
Conductive
Low
Volatility
UL
Certified
Temp.
Resistant
FDA
Compliant
General
Purpose
Non-Flowable TSE3360
High
Viscosity
XE14-A0425 XE14-A0425 TSE3971
RTV577
RTV88
Medium
Viscosity
TSE3380
RTV566 RTV31 RTV11
RTV566
RTV60
Low
Viscosity
TSE3331 TSE3331 RTV615 RTV6136-D1
TSE3331K TSE3331K TSE3032
TSE3431 TSE3431 TSE3033
TSE3431-H TSE3431-H TSE3062
XE14-B7892 TSE3070
TSE3330
YE5822
TSE3661 RTV567 RTV567 TSE3663
TSE3664K TSE3664K
Cure System Performance Guide
Attribute Alkoxy Acetoxy Oxime Heat Cure
Fast Cure Slow Cure
Cure Byproduct Alcohol Alcohol Acetic Acid Methylethyl
Ketoxime None
Cure Speed Fast Slow Fast Moderate Very Fast
Corrosion on Copper None None Yes Yes None
Corrosion on Metals None None Yes None None
Odor Low Low Strong Low None
Strength Good Good Very Strong Good Good
Application Geometry and Cure Chemistry Options
The shape and conditions
of the part are important in
selecting the suitable silicone
grade for each application.
The following are some
general guidelines:
Shallow Cavity / Small Mass
Selection Options:
- 1 Part Condensation Cure
- 1 Part Heat Cure
- 2 Part Room Temp. Cure
- 2 Part Heat Cure
6mm
6mm
Deep Cavity / Large Mass
Selection Options:
- 1 Part Heat Cure
- 2 Part Room Temp. Cure
- 2 Part Heat Cure
12mm
25mm
Complex Design -
Exposed Surface
Selection Options:
- 1 Part Heat Cure
- 2 Part Room Temp. Cure
- 2 Part Heat Cure
12mm
12mm
Enclosed System
Selection Options:
- 1 Part Heat Cure
- 2 Part Heat Cure
Non-Flowable High
Viscosity - Flowable
Medium
Viscosity-Flowable
Low
Viscosity - Flowable
Alkoxy Acetoxy Oxime Heat
BLACK=Rubber RED=Gels
13 14
Product Details - 1 Part Condensation Cure Grades
Properties RTV167 RTV133 TSE385 TSE3854DS TN3005 TN3085
XE11-B5320
TSE3944 TSE3853-W TSE3971 TSE3976-B
XE11-A5133 S
TSE3941M TN3305 RTV160
ECS0609FR
Cure Chemistry Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy
Flowability Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable
Features and Benefits
High strength, paste
adhesive with MILA-
46106B and UL
certified
UL certified paste
adhesive.
Paste adhesive Paste adhesive.
UL certified
Fast tack, low volatile
paste adhesive.
Fast tack, low volatile
paste adhesive.
UL certified
Fast tack, low
volatile, thermally
conductive paste
adhesive.
Flowable low volatile
adhesive / sealant.
UL certified
Flowable adhesive /
sealant.
UL certified
Flowable adhesive /
sealant.
Flowable, high-temperature
resistant low volatile
adhesive / sealant. UL
certified
Flowable, low volatile
thermally conductive potting
/ coating material. UL
certified
Fast tack, thermally
conductive flowable
adhesive / sealant.
Fast tack, flowable
adhesive / sealant.
Flowable adhesive
with
UL certified
High-purity electrode
coating material with
fast tack performance.
UL certified
Adhesive / Sealant • • • • • • • • • • • • •
Coating • • • • • • • •
Encapsulant / Potting • •
Viscosity (23oC) Pa.s (P) - - - - - - - - 400 (4000) 1100 (1000) 1100 (1000) 160 (600) 150 (500) 147 (470) 138 (380)218 (180) 1
Application Rate g/min 180650----- ---------
Tack Free Time min 240 60 90 15 7 7 5 5 15 10 5 10 5 9 240 7
Specific Gravity (23oC) 1.12 1.23 1.10 1.33 1.04 1.63 2.59 1.31 1.31 1.04 1.08 1.64 1.64 1.04 1.04 1.22
Hardness 37 46 35 45 22 46 80 38 34 16 30 63 63 14 25 28
Tensile Strength
MPa (psi)
5.5 (800) 4.5 (650) 2.9 (420) 3.0 (435) 1.8 (260) 2.3 (335) 3.6 (520) 1.5 (220) 2.3 (335) 1.5 (220) 1.7 (245) 3.9 (565) 3.2 (465) 1.5 (220) 1.9 (275) 2.4 (350)
Elongation %600 250 390 300 330 150 40 170 270 350 210 100 70 400 230 250
Adhesive Strength
MPa (psi)
1.2 (175) - 2.0 (290) 2.2 (320) 1.2 (175) 1.3 (190) 1.3 (190) 1.0 (145) 1.3 (190) 1.1 (160) 1.3 (190) 1.3 (190) 1.4 (205) 1.0 (145) - 1.2 (175)
Thermal Conductivity W/m.K- - 0.17 0.34 0.18 0.7 1.3 0.36 0.34 0.18 0.18 0.83 0.83 0.18 - -
Volume Resistivity MΩ.m3.0x1073.0x1075.0x1072.0x1062.0x1064.0x1072.0x1071.0x1072.0x1062.0x1071.0x1074.0x1064.0x1062.0x1074.0x1061.0x105
Dielectric Strength kV/mm 20 20 22 25 23 22 17 22 20 21 20 20 21 26 20 20
Dielectric Constant (60Hz) 2.8 2.8 (100Hz) 3.0 3.1 4.0 2.9 2.6 3.8 3.1 2.9 3.5 4.0 4.0 2.7 2.8 3.1
Dissipation Factor (60Hz) 0.0026 0.001 (100Hz) 0.001 0.02 0.002 0.04 0.005 0.02 0.02 0.005 0.01 0.04 0.04 0.002 0.001 0.05
Low Molecular Siloxane (D3-D10)
wt% - - - - 0.01 0.01 0.010 0.028 - - 0.025 0.025 - 0.028 - -
Flame Retardancy UL94 HB UL94 V-0 UL94 V-0 UL94 V-0 UL94 HB UL94 V-0 UL94 V-0 UL94 HB UL94 V-1 UL94 HB UL94 V-0
Low Volatility • • • • • • • •
Temperature Resistance •
Thermally Conductive • • • •
FDA
MIL-Spec2
MIL-A-46106B
3
White • • • • • • • • • • • •
Clear • •
Black • • • • •
Gray • • • •
Tube • •• •• ••••••
Cartridge • • • • • • • • • • • • •
Can
Pail •
See Page 15 for details • •
1JIS K 6249 2Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions,
procedures, frequency and sampling. 3MIL-A-46106B Group I Type I Typical property data values should not be used as specifications
Application Color Packaging
0
1
2
3
4
5
6
6048362412
10oC, 30%RH
23oC, 50%RH
30oC, 60%RH
72
7
8
Cure Time h
Cure Depth mm
TN3305 (Alkoxy)
0
3
6
9
12
15
12096724824
10oC, 30%RH
10oC, 60%RH
10oC, 90%RH
30oC, 30%RH
30oC, 60%RH
30oC, 90%RH
50oC, 30%RH
50oC, 60%RH
50oC, 90%RH
Cure Depth mm
Cure Time h
TSE382 (Oxime)
0
5
10
15
20
96724824
10oC, 30%RH
10oC, 60%RH
10oC, 90%RH
30oC, 30%RH
30oC, 60%RH
Cure Time h
Cure Depth mm
30oC, 90%RH
50oC, 30%RH
50oC, 60%RH
50oC, 90%RH
TSE370 (Acetoxy)
0
0.1
0.2
0.3
0.4
10987654321
Cure Time h
Shear Adhesive Strength MPa
T
N
3
0
0
5
(
A
l
k
o
x
y
)
T
S
E
3
8
2
(
O
x
i
m
e
)
T
S
E
3
8
5
(
A
l
k
o
x
y
)
Manifestation of Adhesion
Cure Properties:
Condensation cure grades cure
with exposure to atmospheric
moisture. The cure process
begins from the outer surface
and proceeds inward.
Therefore, deep section curing
(in excess of 6mm) is not
recommended. Typically, tack-
free is achieved in 5-60 minutes
at 25oC, 50%RH, depending on
the grade.
Adhesion is typicaly
achieved after
5-15 hours. Full
material properties
including electronic
performance, is
achieved in up to 7
days.
15 16
Product Details - 1 Part Condensation Cure Grades
Properties TSE398 ECS0600 TN3705 ECS0601 ECS3050S ECC3010 TSE382 TSE3826 TSE384-B TSE3840-G TSE3843-W TSE3877-B TSE387 TSE388 TSE389 FRV110 6
Cure Chemistry Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Oxime Oxime Oxime Oxime Oxime Oxime Oxime Oxime Oxime Acetoxy
Flowability Flowable Flowable Flowable Flowable Flowable Flowable Non-Flowable Non-Flowable Non-Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Non-Flowable
Features and Benefits
Flowable adhesive /
sealant.
High-purity electrode
coating material with
fast tack performance.
Repairable type
Low volatile potting
and coating material
High-purity electrode
coating material
with fast tack
performance
Fast cure conformal
coating material. Low
volatile. Solvent free
Fast cure conformal
coating material.
Solvent free
General purpose
paste adhesive.
UL certified
High temperature
resistant paste
adhesive
General purpose
paste adhesive.
UL certified
UL certified
semiflowable
adhesive / sealant.
General purpose
flowable adhesive /
sealant.
UL certified
General purpose
flowable adhesive /
sealant.
UL certified
General purpose
flowable adhesive /
sealant.
General purpose
flowable adhesive /
sealant.
Flowable sealant /
coating material. UL
certified
Fluorosilicone with high
temperature performance.
Good fuel, oil, moisture, UV,
ozone & chemical resistance
Adhesive / Sealant • • • • • • • • •
Coating • • • • • • • • • •
Encapsulant / Potting • •
Viscosity (23oC) Pa.s (P) 17 (170) 15.0 (50) 11.5 (15) 11.4 (14) 10.55 (5.5) 10.11 (1.1) 1- - - - 500 (5000) 1300 (3000) 160 (600) 110 (100) 15.6 (56) 1-
Application Rate g/min ------- --------88
Tack Free Time min 10 7 7 7 5 3 10 10 60 30 60 20 90 60 30 20
Specific Gravity (23oC) 1.04 1.03 1.01 1.01 0.98 0.99 1.04 1.04 1.46 1.40 1.57 1.08 1.03 1.04 1.04 1.58
Hardness 14 20 13 25 22 35 28 29 50 31 60 25 25 16 30 42
Tensile Strength
MPa (
psi)
1.3 (190) 1.2 (175) 0.4 (60) 0.8 (115) - - 1.9 (275) 2.0 (290) 2.9 (421) 2.4 (350) 3.9 (565) 2.0 (290) 2.3 (335) 1.5 (220) 2.0 (290) 3.33 (485)
Elongation %230 450 130 150 - - 380 400 270 270 130 440 350 330 200 230
Adhesive Strength
MPa
(psi)
0.7 (100) - 0.2 (30) 0.3 (45) - - 1.7 (245) 1.4 (205) 1.4 (203) 1.5 (220) 1.8 (260) 2.0 (290) 1.3 (190) 1.3 (190) 1.8 (260) -
Thermal Conductivity W/m.K0.18 - 0.18 - - - 0.18 0.18 0.59 0.25 0.67 0.18 0.18 0.18 0.18 -
Volume Resistivity MΩ.m2.0x1074.0x1072.0x1072.0x1071.0x1071.0x1071.0x1071.0x1071.0x1071.0x1071.0x1071.0x1071.0x1071.0x1071.0x107-
Dielectric Strength kV/mm 23 20 26 20 20 20 23 23 22 22 21 20 20 20 20 13.7
Dielectric Constant (60Hz) 3.0 2.8 2.7 2.6 2.60 2.78 2.9 2.9 4.0 4.0 3.9 3.5 2.9 2.8 2.7 6.3 (1000Hz)
Dissipation Factor (60Hz) 0.01 0.001 0.002 0.002 0.001 0.001 0.004 0.004 0.016 0.02 0.02 0.01 0.004 0.008 0.009 -
Low Molecular Siloxane
(D3-D10)
wt% - 0.01 0.01 0.01 0.01 - - - - - - - - - - -
Flame Retardancy UL94 HB UL94 HB UL94 V-0 UL94 V-0 UL94 V-1 UL94 HB
Low Volatility • • • •
Temperature Resistance •••
Thermally Conductive •
FDA
MIL-Spec2
White • • • • • • • • •
Clear • • • • • • •
Black • • • • • • •
Gray • • •
Red • •
Tube • • • •
Cartridge • • • • • • • • • •
Can • •
Pail • • •
See Page 15 for details • • • •
1JIS K 6249 2Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions,
procedures, frequency and sampling.
Typical property data values should not be used as specifications
Application Color Packaging
Packaging Supplement
Grade Tube Cartridge Can Pail
W C B W C B G W C B W C B
TN3005 •••••••
TN3305 ••••••••
TN3705 ••••••••• •
TSE382 ••••••••
TSE387 •••••••
TSE389 •••••
W: White, C: Clear, B: Black, G: Gray
17 18
Product Details - 1 Part Condensation Cure Grades
Properties RTV157 RTV159 RTV100
series RTV106 TSE370 RT V116 RTV110
series
Cure Chemistry Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy
Flowability Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Flowable Flowable
Features and Benefits
High strength paste
adhesive
High temperature,
high strength, paste
adhesive
Paste adhesive with
FDA, USDA, NSF,
and MIL-A-46106B
High temperature
resistant paste
adhesive. FDA, USDA,
NSF, MIL-A-46106B
Fast tack paste
adhesive
High temperature resistant,
flowable adhesive. FDA,
USDA, NSF, MIL-A-47040,
MIL-A-46106B
Flowable adhesive
with FDA, USDA,
NSF, MIL-A-46106B
Adhesive / Sealant • • • • • •
Coating •
Encapsulant / Potting • •
Viscosity (23oC) Pa.s (P) - - - - - 25 (250) 1 20 (200) 1
Application Rate g/min 155 175 400 400 - - -
Tack Free Time min 45 45 20 20 5 30 20
Specific Gravity (23oC) 1.09 1.09 1.05 1.07 1.04 1.09 1.05
Hardness 28 20 30 30 22 20 25
Tensile Strength
MPa
(psi)
6.2 (900) 7.0 (1,025) 2.75 (400) 2.55 (370) 2.5 (365) 2.45 (355) 2.20 (320)
Elongation %825 350 450 400 530 350 325
Adhesive Strength
MPa
(psi)
1.3 (183)3- 1.4 (200)21.4 (200)22.2 (320)20.9 (125)20.7 (100)2
Thermal Conductivity W/m.K- - - - 0.18 - -
Volume Resistivity MΩ.m7.5x1061.1x1073.0x1073.0x1061.0x1072.0x1066.0x106
Dielectric Strength kV/mm 20.7 19.7 20 20 22 16 16
Dielectric Constant (60Hz) 2.9 2.6 2.8 2.8 3.0 2.8 2.8
Dissipation Factor (60Hz) 0.0009 0.0007 0.001 0.001 0.003 0.001 0.001
Low Molecular Siloxane
(D3-D10)
wt% -------
Flame Retardancy
Low Volatility
Temperature Resistance • • •
Thermally Conductive
FDA • • • •
MIL-Spec2M I L- A - 4 6 10 6 B 3M I L- A - 4 6 10 6 B 3M I L- A - 4 6 10 6 B 3M I L- A - 4 6 10 6 B 3
White RTV102 •RTV112
Clear RTV108 •RTV118
Black RTV103 •
Gray •
Red •••
Aluminum RTV109
Tube •••••••
Cartridge • • • •
Can
Pail • • • • • •
1ASTM D 2196S 2Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions,
procedures, frequency and sampling 3MIL-A-46106B Group III Type I
Typical property data values should not be used as specifications
Application Color Packaging
Cure Properties:
The cure performance of
1 Part Heat Cure grades
is demonstrated by the
relationship between
temperature and hardness,
and temperature and
adhesive strength of TSE322
when placed in an oven at
temperatures ranging from
80oC to 150oC.
Hardness &
Cure Time - TSE322
Adhesion &
Cure Time - TSE322
0
10
20
30
40
50
54321
Cure Time h
Hardness
678
150oC
120oC
100oC
80oC
0
1
2
3
54321
Cure Time h
Shear Adhesive Strength MPa
678
150oC
120oC100oC
80oC
Product Details - 1 Part Heat Cure Grades
Properties XE13-B3208 TSE3212 TSE322 TSE322S TSE3261-G TSE3280-G
Flowability Non-Flowable Semi-Flowable Non-Flowable Semi-Flowable Flowable Flowable
Features and Benefits
Paste adhesive /
sealant
Thixotropic adhesive
/ sealant
Flowable adhesive /
sealant
Flowable adhesive /
sealant. UL certified
High temperature
resistant flowable
adhesive / sealant
Thermally conductive
flowable adhesive
Adhesive / Sealant • • • • • •
Coating
Encapsulant / Potting •
Viscosity (23oC) Pa.s (P) 670 (6700) 1280 (2800) 1110 (1100) 170 (700) 150 (500) 160 (600) 1
Cure Condition oC/h 150/1 150/1 150/1 150/1 150/1 150/1
Specific Gravity (23oC) 1.08 1.26 1.27 1.26 1.48 2.10
Hardness 50 52 45 37 52 62
Tensile Strength
MPa
(psi)
4.4 (640) 3.7 (535) 3.4 (495) 3.6 (520) 4.9 (710) 3.2 (465)
Elongation %430 240 230 230 160 110
Adhesive Strength
MPa
(psi)
3.7 (535) 2.6 (375) 2.5 (365) 2.5 (365) 2.0 (290) 2.0 (290)
Thermal Conductivity W/m.K0.20 0.29 0.29 0.29 0.41 0.88
Volume Resistivity MΩ.m1.0x1072.0x1072.0x1071.0x1072.0x1072.5x106
Dielectric Strength kV/mm 23 20 20 25 22 21
Dielectric Constant (60Hz) 3.1 3.2 3.1 3.1 3.9 4.3
Dissipation Factor (60Hz) 0.001 0.001 0.006 0.006 0.005 0.002
Flame Retardancy UL94 HB
Temperature Resistance •
Thermally Conductive •
White •
Clear •
Black •
Gray • •
Blue • •
Tube • • •
Cartridge • • • • •
Can • • • •
Pail • • • • • •
1JIS K 6249 Typical property data values should not be used as specifications
Application PackagingColor
19 20
Storage under low temperature
conditions is important
particularly for 1-part heat cure
grades to prevent viscosity
inrease.
Storage Stability:
Product Details - 1 Part Heat Cure Grades
Properties TSE3281-G TSE3221S TSE326 TSE326M3TSE3251 TSE3251-C TSE325 TSE325-B TSE3250 ECC4865
Flowability Flowable Flowable Flowable Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable
Features and Benefits
Thermally conductive
flowable adhesive
Flowable adhesive
/ sealant, coating
material
High temperature
resistant flowable
adhesive. UL
certified
High temperature
resistant flowable
adhesive
Flowable coating
material
Flowable coating
material
Flowable potting /
coating material
Flowable potting /
coating material
Flowable potting /
coating material
Low viscosity conformal
coating with UV tracer, fast
thermal cure & long-term
viscosity stability
Adhesive / Sealant • • • •
Coating • • • • • • •
Encapsulant / Potting • • •
Viscosity (23oC) Pa.s (P) 60 (600) 1 58 (580) 128 (280) 116 (160) 1 8.5 (85) 17.0 (70) 14.0 (40) 13.5 (35) 11.3 (13) 10.25 (2.5) 2
Cure Condition oC/h 150/1 150/1 150/1 200/0.5 150/1 150/1 150/1 150/1 150/1 -
Specific Gravity (23oC) 2.70 1.03 1.45 1.46 1.02 1.02 1.02 1.02 0.97 1.19
Hardness 84 28 43 38 16 16 12 20 9 35
Tensile Strength
MPa
(psi)
4.5 (655) 2.8 (405) 3.4 (495) 2.9 (420) 0.7 (100) 0.7 (100) 0.7 (100) 0.9 (130) - -
Elongation %50 370 170 180 200 200 200 200 - -
Adhesive Strength
MPa
(psi)
2.5 (365) 2.5 (365) 2.0 (290) 1.5 (220) 0.4 (60) 0.4 (60) 0.4 (60) 0.4 (60) 0.1 (15) -
Thermal Conductivity W/m.K1.68 0.18 0.41 0.41 0.18 0.18 0.18 0.18 0.17 -
Volume Resistivity MΩ.m4.8x1066.0x1072.0x1072.0x1072.0x1072.0x1072.0x1072.0x1072.0x107-
Dielectric Strength kV/mm 15 23 22 22 20 20 21 21 21 20
Dielectric Constant (60Hz) 5.2 2.8 3.3 3.3 2.8 2.8 2.9 2.9 2.8 2.4
Dissipation Factor (60Hz) 0.002 0.001 0.02 0.02 0.002 0.001 0.001 0.001 0.001 0.01
Flame Retardancy UL94 HB
Temperature Resistance • •
Thermally Conductive •
White • •
Clear • • • •
Black •
Gray •
Red • •
Tube • •
Cartridge •
Can •••• •••••
Pail • • •
1JIS K 6249 2ASTM D2196S 3TSE325M EX in Europe and the Americas. Typical property data values should not be used as specifications
Application Color Packaging
100
200
300
400
4321
Storage Time months
Viscosity Pa s
TSE322 Viscosity and Storage Temperature
56
5
25oC
oC
.
21 22
Product Details - 2 Part Room Temperature Cure Grades
Properties RTV577 RTV88 RTV60 RTV566 RTV31 RT V11 TSE3663 TSE3661 TSE3664K
Components RTV5773DBT RTV883DBT RTV603DBT RTV566(A)3RTV566(B)3RTV313DBT RTV113DBT
TSE3663(A)
TSE3663(B) TSE3661(A) TSE3661(B) TSE3664(A) TSE3664(B)
Flowability Non-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable
Features and Benefits
Low temperature
resistant paste
sealant with good
release capabilities
High temperature
resistant, semi-flowable
sealant. Good
release capabilities
High temperature
resistant flowable
sealant with good
release capabilities
Low volatile, low out
gassing sealant with Low
and High temperature
performance capability
High temperature
resistant flowable
sealant with good
release capabilities
Sealant with
good release
properties. FDA
compliance
Flowable
encapsulant /
adhesive
Flowable
encapsulant /
adhesive
Flowable encapsulant
/ adhesive with fast
tack free times.
UL certified
Adhesive / Sealant • •
Coating •
Encapsulant / Potting • • • • • • •
Mixing Ratio ((A):(B) by weight) 100:0.5 100:0.5 100:0.5 100:0.1 100:0.5 100:0.5 100:2 100:2 100:7.5
Color (mixed) White Red Red Red Red White Off-White Off-White Gray
Viscosity (mixed) (23oC) Pa.s (P) 700 (7000) 2880 (8800) 247 (470) 243 (430) 225 (250) 211 (110) 24.0 (40)14.0 (40)13.0 (30)1
Pot Life (23oC) h2 0.75 2 1.5 2 1.5 0.5 0.5 0.1
Cure Condition oC/h 25/24 25/24 25/24 25/24 25/24 25/24 23/72 23/72 23/72
Specific Gravity (23oC) 1.35 1.47 1.48 1.49 1.42 1.19 1.19 1.19 1.41
Hardness 48 58 57 61 54 41 42 42 60
Tensile Strength
MPa
(psi)
3.0 (440) 5.8 (840) 6.9 (995) 5.5 (795) 5.9 (870) 2.1 (300) 1.4 (205) 1.4 (205) 3.0 (435)
Elongation %150 120 120 120 170 160 110 110 70
Adhesive Strength
MPa
(psi)
- - - 3.2 (465) - - 0.9 (130) 0.9 (130) 1.0 (145)
Thermal Conductivity W/m.K0.31 0.31 0.31 0.31 0.31 0.29 0.27 0.27 0.42
Volume Resistivity MΩ.m5.6x1062.8x1064.4x1062.0x1061.6x1061.1x1071.0x1071.0x1075.0x107
Dielectric Strength kV/mm 18.5 17.4 17.7 21.2 17 20.3 20 20 26
Dielectric Constant (60Hz) 3.98 (1kHz) 4.3 (1kHz) 4.0 (1kHz) 3.9 (1kHz) 4.4 (1kHz) 3.3 (1kHz) 3.1 3.1 3.1
Dissipation Factor (60Hz) 0.02 (1kHz) 0.03 (1kHz) 0.02 (1kHz) 0.02 (1kHz) 0.03 (1kHz) 0.006 (1kHz) 0.025 0.025 0.01
Flame Retardancy UL94 HB UL94 V-0
Low Volatility •
Temperature Resistance • • • • •
FDA •
Bottle • • •
Can • • •
Pail •••
Kit • • • • • •
1JIS K 6249 2ASTM D2196 3Sub-Zero long-term storage required. Typical property data values should not be used as specifications
Application Packaging
0
30
40
50
60
21
Time - h
Viscosity Pa.s
10
20
100 : 2.5
100 : 2.0
100 : 1.5
The cure speed of 2 Part
Condensation Cure grades
can be changed by adjusting
the amount of the catalyst
component. However, the
post-cure properties of the
material may vary from those
achieved under standard mixing
ratios, and therefore, adequate
testing and confirmation prior to
use in an application is required.
Cure Speed: TSE3663 - Mixing Ratios & Viscosity
(23oC)
23 24
Hardness &
Cure Time - TSE3380
Product Details - 2 Part Heat Cure Grades
Properties TSE3360 XE14-A0425 TSE3380 RTV615 TSE3032 TSE3331
TSE3331K EX3
TSE3331K 2TSE3431 TSE3431-H XE14-B7892 YE5822 TSE3033
Components TSE3360(A) TSE3360(B)
XE14-A0425(A) XE14-A0425(B)
TSE3380(A) TSE3380(B) RTV615(A) RTV615(B) TSE3032(A) TSE3032(B) TSE3331(A) TSE3331(B)
TSE3331KEX (A) TSE3331KEX (B)
TSE3331K(A) TSE3331K(B) TSE3431(A) TSE3431(B) TSE3431(A) TSE3431(B)
XE14-B7892(A) XE14-B7892(B)
YE5822(A) YE5822(A) TSE3033(A) TSE3033(B)
Flowability Non-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable
Features and Benefits
General purpose
paste adhesive with
extended pot life
High temperature
resistant paste adhesive
with thermal conductive
performance
Thermally conductive
paste adhesive
Low viscosity encapsulant
/ potting material with
capability to cure at RT.
FDA recognition
Transparent
encapsulant / potting
material with good
release properties
Thermally conductive
encapsulant / potting
material.
UL certified
Thermally conductive
encapsulant / potting
material.
UL certified
Thermally conductive
encapsulant / potting
material.
UL certified
Encapsulant / potting
material with UL certified,
thermal conductivity, and
good release properties
Encapsulant / potting
material with UL certified,
thermal conductivity, and
good release properties
Encapsulant / potting
material with UL certified,
low temperature cure, and
good release properties
Low viscosity transparent
encapsulant / potting
material. Good
release properties
Low viscosity
transparent
encapsulant / potting
material
Adhesive / Sealant •••
Coating • • • •
Encapsulant / Potting • • • • • • • • • •
Mixing Ratio ((A):(B) by weight) 100:100 100:100 100:100 100:10 100:10 100:100 100:100 100:100 100:10 100:10 100:100 100:10 100:100
Color (mixed) White
Reddish Brown
Gray Transparent Transparent Gray Dark Gray Dark Gray Black Black Black Transparent Transparent
Viscosity (mixed) (23oC) Pa.s (P) 640 (6400) 1400 (4000) 1 40 (400) 14.0 (40) 24.0 (40) 13.5 (35) 13.0 (30) 12.6 (26) 12.6 (26) 12.6 (26) 1 1.3 (13) 1 1.0 (10) 10.9 (9) 1
Pot Life (23oC) h24 24 8 4 4 8 8 8 1.5 1.5 2 4 6
Cure Condition oC/h 150/1 150/1 150/0.5 150/0.25 100/1 120/1 120/1 120/1 100/1 100/1 60/1 100/1 150/0.5
Specific Gravity (23oC) 1.12 2.11 2.70 1.02 1.02 1.51 1.43 1.43 1.50 1.52 1.39 0.97 1.01
Hardness 42 65 70 44 35 60 50 45 70 70 60 27 30
Tensile Strength
MPa
(psi)
5.4 (785) 5.0 (725) 2.5 (365) 6.3 (920) 4.5 (655) 2.9 (420) 3.0 (440) 3.1 (450) 4.9 (710) 4.1 (595) 3.5 (510) 0.4 (58) 1.0 (145)
Elongation %380 120 100 120 210 70 100 120 70 60 100 130 130
Adhesive Strength
MPa
(psi)
3.1 (450) 2.9 (420) 1.5 (220) - - 1.3 (190) 1.6 (230) 1.6 (230) - - - - 0.3 (44)
Thermal Conductivity W/m.K0.23 0.80 1.68 0.19 0.17 0.63 0.53 0.53 0.63 0.63 0.44 0.17 0.17
Volume Resistivity MΩ.m1.0x1072.0x1062.1x1061.8x1072.0x1072.0x1066.0x1066.0x1065.0x1075.0x1062.0x1072.0x1072.0x107
Dielectric Strength kV/mm 21 26 15 19.7 21 26 22 22 26 27 27 21 21
Dielectric Constant (60Hz) 3.0 3.4 5.7 2.7 (1kHz) 2.8 3.4 3.1 3.1 3.4 3.5 3.1 2.8 2.8
Dissipation Factor (60Hz) 0.001 0.017 0.002 0.0006 (1kHz) 0.001 0.017 0.015 0.015 0.014 0.014 0.01 0.001 0.001
Flame Retardancy UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0
Temperature Resistance •
Thermally Conductive • • • • • • •
FDA •
Bottle • • • •
Can •• • •••• ••••••••• ••
Pail • • • • • • • • • • • • •
Kit •
1JIS K 6249 2ASTM D2196 3Sub-Zero long-term storage required. Typical property data values should not be used as specifications
Application Packaging
Pot Life: Cure Properties:
The pot life of a 2 Part Heat
Cure grade is affected by
changes in viscosity that occur
after the components
have been mixed.
The cure performance of
2 Part Heat Cure grades
is demonstrated by the
relationship between
temperature and hardness of
TSE3380 when placed in an
oven at temperatures ranging
from 100oC to 150oC.
50
60
70
80
6030
Cure Time - min 90 120
150oC
120oC
100oC
Hardness
5
4
3
1
0
2
TSE3331 Viscosity Change After Mixing
2468
23oC
Time - h
Viscosity Pa.s
10
8
6
2
0
4
TSE3431-H Viscosity Change After Mixing
0.5 1 1.5 2
23oC
Time - h
Viscosity Pa.s
25 26
Product Details - 1 Part Gels
Properties TSE3051
TSE3051-FR
TSE3051-L TSE3053
Flowability Flowable Flowable Flowable Flowable
Features and Benefits
Low viscosity Low viscosity, UL
certified
Low viscosity, low
penetration
Low viscosity, high
penetration
Viscosity (23oC) Pa.s (P) 0.7 (7) 1 0.7 (7) 10.7 (7) 10.7 (7) 1
Cure Condition oC/h 125/2 150/1 125/2
125/2
Specific Gravity (23oC)
0.97 0.97 0.97 0.97
Penetration 85 85 65 105
Thermal Conductivity W/m.K0.17 0.17 0.17 0.17
Volume Resistivity MΩ.m1.0x1075.0x1071.0x107 1.0x107
Dielectric Strength kV/mm 18 18 18 18
Dielectric Constant (60Hz)
2.8 2.8 2.8 2.8
Dissipation Factor (60Hz)
0.001 0.001 0.001 0.001
Flame Retardancy UL94 V-1
White •
Transparent • • • •
Gray •
1kg can See below matrix •••
15kg can • •
1JIS K 6249 Typical property data values should not be used as specifications
Product Details - 2 Part Gels
Properties TSE3062 TSE3070
RTV6136-D1
Components TSE3062(A) TSE3062(B) TSE3070(A) TSE3070(B) RTV6126(A) RTV6126(B)
Flowability Flowable Flowable
Flowable
Features and Benefits
Low temperature cure
High elongation gel
Fast cure, low viscosity
Mixing Ratio ((A):(B) by weight) 100:100 100:100 100:100
Color (mixed) Transparent Transparent Transparent
Viscosity (mixed) (23oC) Pa.s (P) 1.0 (10)10.8 (8)10.75 (7.5)2
Pot Life (23oC) h1 4 0.5
Cure Condition oC/h 70/0.5 70/0.5 100/0.3
Specific Gravity (23oC) 0.97 0.97 0.98
Penetration
55 65 60
Thermal Conductivity W/m.K0.17 0.17 0.19
Volume Resistivity MΩ.m1.0x1071.0x1071.0x107
Dielectric Strength kV/mm 18 18 20.5
Dielectric Constant (60Hz) 2.7 2.7 2.8 (1kHz)
Dissipation Factor (60Hz) 0.001 0.001 0.001 (1kHz)
Bottle • •
Can • •
Pail •
1JIS K 6249 2ASTM D2196
Typical property data values should not be used as specifications
Color
Package
Pkg
TSE3051 W C G
1kg bottle •••
4kg can •
15kg can •
20kg pail ••
W: White, C: Clear, G: Gray
27 28
Product Details - 1 Part JCR Grades
Properties TSJ3155 TSJ3195-W TSJ3185
Flowability Semi-Flowable Semi-Flowable Semi-Flowable
Features and Benefits
Thixotropic JCR rubber.
Low post-cure hardness
contributes to stress relief
of critical components
Low viscosity JCR
gel. Provides stress
and vibration relief
performance
Thixotropic JCR
gel. Provides stress
and vibration relief
performance
Property Rubber Gel Gel
Viscosity (23oC) Pa.s (P) 6 (60)14 (40)13 (30)1
Color
White White Translucent
Cure Condition oC/h 150/4 150/4 150/4
Specific Gravity (23oC) 1.02 1.00 1.01
Hardness 11 - -
Penetration - 80 80
Thermal Conductivity
W/m.K0.18 0.18 0.18
Volume Resistivity
MΩ.m1.0x1071.0x1071.0x107
Dielectric Strength kV/mm 20 15 15
Dielectric Constant (60Hz) 2.8 2.8 2.7
Dissipation Factor (60Hz) 0.0004 0.0004 0.001
Na+K+ppm <2 <2 <2
Pkg: 500g bottle •••
1JIS K 6249 Typical property data values should not be used as specifications
Product Details - 2 Part JCR Grades
Properties XE14-B5778 TSJ3175
Components
XE14-B5778(A) XE14-B5778(B)
TSJ3175(A) TSJ3175(B)
Flowability Semi-Flowable Semi-Flowable
Features and Benefits
Flow-controllable
JCR rubber.
Thixotropic JCR gel.
Soft gel property
contributes to stress
and vibration relief
Property
Rubber Gel
Mixing Ratio ((A):(B) by weight)
100:100 100:100
Color (mixed) Translucent Black
Viscosity (mixed) (23oC) Pa.s (P) 14 (140)117 (170)1
Pot Life (23oC) h8 12
Cure Condition oC/h 80/2 125/2
Specific Gravity
(23oC) 1.02 1.01
Hardness
16 -
Penetration - 70
Thermal Conductivity W/m.K0.17 0.18
Volume Resistivity
MΩ.m2.0x1051.0x107
Dielectric Strength kV/mm 24 15
Dielectric Constant (60Hz) 2.7 2.7
Dissipation Factor (60Hz) 0.001 0.001
Na+K+ppm <2 <2
Pkg: 500g bottle ••••
1JIS K 6249 Typical property data values should not be used as
specifications
Product Details - Grease
Properties TSK5303 TSK5370 TSK550 TSK551 YG6111 YG6240 YG6260 TIG1000
Features and Benefits
Thermally conductive
compound for medium
heat dissipation. Heat
resistance
Compound for
electrical insulation
& sealing with swell resistant
performance
Compound for electrical
contact insulation
protection against
moisture & contaminants
Compound for electrical
contact insulation
protection against
moisture & contaminants
Thermally conductive
compound for medium
heat dissipation. Low
oil separation
Thermally conductive
compound for medium
heat dissipation. Low
oil separation
Thermally conductive
compound for medium
heat dissipation. Low
oil separation
Thermally conductive
compound for medium
to high heat dissipation
applications
Color White White White Green White White White White
Specific Gravity 2.34 - 1.03 1.03 2.45 2.45 2.30 2.50
Penetration 330 270 220 220 310 290 300 340
Bleed (150oC, 24h) %2.8 1.5 1.5 1.0 0.4 0.0 0.5 0.1
Evaporation (150oC, 24h) %0.2 0.2 0.2 0.3 0.1 0.4 0.1 0.1
Thermal Conductivity W/m.K0.84 - - - 0.84 0.84 0.84 1.00
Volume Resistivity MΩ.m- 1.0x1052.0x1072.0x1072.0x1062.0x1062.0x1073.0x106
Dielectric Constant (60Hz) 5.0 2.5 2.8 2.8 5.0 5.0 5.0 5.0
Dissipation Factor (60Hz) 0.005 0.0001 0.0002 0.0002 0.006 0.006 0.005 0.006
Low Molecular Siloxane
(D3-D10
)
wt% 0.0015 0.01 - - 0.01 0.003 0.003 0.003
Arc Resistance1 s- - 120< 120< - - - -
Low Volatility • • • • • •
Temperature Resistance •
Thermally Conductive • • • • •
Low Bleed •
Bottle ••••••
Can • • • • • •
Pail • • •
1ASTM D-495 Typical property data values should not be used as specifications
Packaging
3029
Type Grade Color Thickness
mm
RTI Flame
Class
HWI
(PLC)
HAI
(PLC)
HVTR
(PLC)
D495
(PLC)
CTI
(PLC) File No.
Elec.
Mech.
TSE3976-B
Black 0.64 105 105 HB - -
E56745Black 1.5 105 105 HB - -
Black 3.0 105 105 HB - -
XE11-A5133S White 3.0 105 105 V-1 - - E56745
XE11-B5320 White 1.5 105 105 HB - - E56745
White 3.0 105 105 HB - -
TSE3051-FR Clear 2.7-3.3 105 105 V-1 - - E56745
TSE322S N
NC 1.0 105 105 HB - -
E56745NC 1.5 105 105 HB - -
NC 3.0 105 105 HB - -
TSE326 Red 1.0 105 105 HB - - E56745
Red 3.0 105 105 HB - -
TSE3331
Black 1.0 105 105 V-0 - -
0 0 0 E56745
Black 1.6 105 105 V-0 2 0
Black 2.0 105 105 V-0 - -
Black 3.0 105 105 V-0 0 0
TSE3331K Black 2.5 105 105 V-0 - - E56745
Black 3.0 105 105 V-0 - -
TSE3331K EX Black 2.5 105 105 V-0 - - E56745
Black 3.0 105 105 V-0 - -
TSE3431 Gray 2.0 105 105 V-1 - - E56745
Gray 4.0 105 105 V-0 - -
TSE3431-H
Gray 1.0 105 105 V-0 0 0
0 1 1 E56745
Gray 1.5 105 105 V-0 - -
Gray 2.5 105 105 V-0 0 0
Gray 3.0 105 105 V-0 - -
TSE3664K
Gray 1.0 105 105 V-1 - -
E56745Gray 2.0 105 105 V-0 - -
Gray 3.0 105 105 V-0 0 0
XE14-B7892 Black 2.0 105 105 V-1 - - E56745
Black 3.0 105 105 V-0 - -
TSE3661 All 1.0 105 105 HB 4 0 0 E56745
All 3.0 105 105 HB 3 0
UL Certifications source: Underwriters Laboratories Inc.
Type Grade Color Thickness
mm
RTI Flame
Class
HWI
(PLC)
HAI
(PLC)
HVTR
(PLC)
D495
(PLC)
CTI
(PLC)
File
No.
Elec.
Mech.
ECS0601 Black Clear White 1.5 105 105 HB - - E56745
ECS0609FR Gray 0.2 105 105 V-0 - - E56745
Gray 3.0 105 105 V-0 - -
TN3085
Gray 1.0 105 105 V-1 00040
E56745
Gray 3.0 105 105 V-0 0 0
White 1.0 105 105 V-1 20030
White 3.0 105 105 V-0 1 0
RTV133
Black 0.71 105 105 V-1 3 0
0 3 0 E36952Black 1.6 105 105 V-1 2 0
Black 3.4 105 105 V-0 1 0
RTV160
White 0.75 105 105 HB 4 0
1 5 0 E36952
White 1.5 105 105 HB 3 0
White 2.5 105 105 HB 3 0
White 3.0 105 105 HB - -
RTV167
Gray 0.83 105 105 HB 3 0
0 5 0 E36952Gray 1.5 105 105 HB 2 0
Gray 2.6 105 105 HB 2 0
TSE382
Clear White 0.75 105 105 HB 4 0
0 4 0 E56745
Clear White 1.5 105 105 HB 3 0
Clear White 1.9 150 140 HB 3 0
Clear White 3.0 150 140 HB 3 0
TSE3826 Red 2.0 200 200 -- - E56745
Red 3.0 200 200 -- -
TSE3840-G
Gray 0.75 105 105 V-0 - -
0 2 0 E56745Gray 1.5 105 105 V-0 0 0
Gray 3.0 105 105 V-0 0 0
TSE3843-W
White 1.1 105 105 V-1 - -
0 1 1 E56745
White 1.5 105 105 V-1 0 0
White 1.9 150 140 V-1 - -
White 2.5 150 140 V-1 - -
White 3.0 150 140 V-1 - -
TSE384-B
Black 1.2 105 105 V-0 0 0
0 3 1 E56745Black 1.9 150 140 V-0 - -
Black 3.0 150 140 V-0 - -
TSE3853-W White 1.5 105 105 V-0 030 3 0 E56745
White 3.0 105 105 V-0 0 3
TSE3854DS
Gray 0.75 105 105 V-0 0 0
0 3 0 E56745
Gray 1.5 105 105 V-0 0 0
Gray 3.0 105 105 V-0 0 0
White 1.5 105 105 V-0 0 3
White 3.0 105 105 V-0 0 3
TSE389 Clear White Black 1.5 105 105 HB - - E56745
Clear White Black 3.0 105 105 HB - -
TSE3944
Gray 0.75 105 105 V-0 - -
0 3 0 E56745
White 0.75 105 105 V-1 - -
Gray White 1.5 105 105 V-0 0 0
Gray White 3.0 105 105 V-0 0 0
RTI: Relative Temperature Index PLC: Performance Level Category HWI: Hot Wire Ignition HAI: High-Current Arc Ignition
HVTR: High-Voltage Arc Tracking Rate D495: D495 High-Voltage Dry Arc Resistance CTI: Comparative Tracking Index
1 Part Condenstaion Cure
1 P Cond Cure 1 Part Heat Cure 2 Part
Arc Resistance
(sec)
≥ 420
360 - 419
300 - 359
240 - 299
180 - 239
120 - 179
60 - 119
<60
PLC
0
1
2
3
4
5
6
7
Tracking Index
(volts)
≥600
400 -599
250 - 399
175 - 249
100 - 174
<100
PLC
0
1
2
3
4
5
Resistance to ignition
when exposed to
high temperatures.
Expressed as the
mean number of
seconds required to
ignite a specimen
when wrapped with an
energized ni-chrome
resistive wire that
dissipates a specified
level of energy.
Ability to withstand
electrical arcing.
Expressed as the
number of arc rupture
exposures required to
ignite a specimen when
the arc occurs directly
on the surface or a
specified distance above
the test specimen.
Expressed as the rate
(inches per minute) that
a tracking path can
be produced on the
surface of the material
under standardized test
conditions.
Expressed as the
number of seconds that
a material resists the
formation of a surface-
conducting path
when subjected to an
intermittently occurring
arc of high voltage, low
current characteristics.
Expressed as that
voltage which causes
tracking after 50 drops
of 0.1% ammonium
chloride solution have
fallen on the material.
D495 CTI
HVTR Range
(in mm/min)
0 - 10
10.1 - 25.4
25.5 - 80
80.1 - 150
>150
PLC
0
1
2
3
4
HVTR
HAI
HWI
Mean No.
of Arcs
≥ 120
60 - 119
30 - 59
15 - 29
<15
PLC
0
1
2
3
4
Mean Ignition
Time
(sec)
≥ 120
60 - 119
30 - 59
15 - 29
7 - 14
<7
PLC
0
1
2
3
4
5
3231
Shear Adhesion Test Method
JIS Method ASTM Method
A: 25mm 1"
B: 10mm 0.5"
C: 1mm -
Pull Rate: 10mm/min. 1"/min.
Typical Chemical Resistance
Typical Heat Resistance
Typical Electrical Performance
1-Part Condensation Cure Adhesive (Alkoxy Type)
Electrical Performance of Cured Material
Dielectric Strength Test Method:
Equipment:
Dielectric voltage gauge
Voltage Rise:
1kV/s
Terminal Gap:
1mm (JIS C 2110)
BC
A
substrate
adhesive
Elapsed Time days
Hardness Chng.
50
40
30
10
0
20
-10
40
20
0
-40
-20
20
0
-20
-60
-80
-40
714 30 90 180 360
20oC
150oC
200oC
Adhesion Chng.
%
Elongation Chng.
%
1mm
12.5mm
adhesive
Typical Adhesion Performance
Condensation Cure Grades
Substrate
Alkoxy Acetoxy Oxime
Primer-
less ME121 ME123
XP80-A5363
Primer-
less ME121 ME123 Primer-
less ME121 ME123
XP80-A5363
/ YP9341
Copper • • •1 •1▲1 •1
Steel • • ▲• • •
Brass • • ▲1 ▲1▲1 •1
Stainless Steel • • ▲• • •
Aluminum • • • • • •
Galvanized Steel • • • • •
Tin • • • • • •
Acrylic Resin • • ו••
Phenol Resin • • • • • •
Epoxy Resin • • • • • •
Polycarbonate •2 •2 •2 •2
Soft Polyvinyl Chloride • • ×•× × •
Rigid Polyvinyl Chloride • • • • • • •
Polyester Film • • ▲• • • •
Unsaturated Polyester • • • • • • •
Polyamide • • • • • • • •3
Nylon 66 • • • •
PBT • • ▲• •3
PPS • • ▲•
ABS • • • • • • • •4
Polypropylene × × •× × ×
Polyethylene × × ▲× × × × ×
Fluorocarbon Resin × × × × × × ×
Silicone Resin Laminate • • • • • •
Chloroprene Rubber ▲•▲•▲•
Nitrile Rubber ▲• • • ▲•
Styrene Butadiene Rubber ▲•▲•
Ethylene Propylene Rubber ▲•▲•
Silicone • • • • • •
Glass • • • • • •
Ceramic • • • • • •
• Adheres completely, ▲ Adheres, but separates from surface when pulled, × Does not adhere
1 May corrode under some usage conditions, 2 Stress cracking may occur under some usage conditions, 3 YP9341, 4 XP80-A5363
Substrate
Condensation Cure Addition Cure General
ME121 ME123 YP9341
XP80-A5363
SS4004P SS4044P SS4179 ME151 ME153
XP81-B0016
SS4120 SS4155
Appearance
Yellow
Transparent Yellow
Transparent Transparent Yellow
Transparent
Pink
Yellow Clear
Colorless Yellow Yellow
Transparent Yellow
Transparent Clear
Colorless Blue
Substrates
Metals,
Glass,
Plastic
Plastic,
Rubber Plastic,
Rubber Polylefins Metals Metals Plastic
Metals,
Glass,
Plastic,
Ceramic
Plastic Metals,
Glass - -
Specific Gravity (23OC) 0.85 0.86 0.89 0.88 0.85 0.85 0.98 0.87 0.83 0.71 0.82 0.82
Non-Volatile Content 15% 15% 8% 7% 15% 15% 6% 24% 15% 7.5% 3% 10%
Drying Time (23OC) min 30 30 30 20 30 30 15 30 30 30 30 30
Solvents
Acetone
Toluene
IPA
Acetone
Toluene
IPA
Butyl
Acetate Toluene
Acetone
Xylene
N-butanol
IPA
Acetone
Xylene
N-butanol
IPA
Ethyl
Acetate
Toluene
Methanol
Toluene
IPA Toluene
IPA n-hexane Ethanol
Methanol Mineral
Spirits
TSE3843-W
Volume Resistivity
MΩ.m
Dielectric Strength
kV/mm
Conditions
40OC, 95%RH
25OC Immersed
40OC, 95%RH
25OC Immersed
Initial 1.6x1071.6x10729 29
1 Day 2.9x1062.2x10627 25
2 Days 2.5x1063.6x10629 22
3 Days 2.7x1061.9x10624 23
Metals RubberPlastic
Inorganic
33 34
Frequently
Asked
Questions
What does RTV mean?
RTV stands for Room Temperature
Vulcanization (cure). Despite the
low-temperature connotations
conveyed by this name, RTV
silicones consist of both Room
Temperture Cure and Heat Cure
grades.
What is the cure mechanism
of a condensation cure
product?
Condensation cure silicone
products cure when exposed to
atmospheric moisture. Moisture
in the air is generally required to
cure (or vulcanize) condensation
cure products. The cure process
begins from the outer surface,
and therefore time is required
for complete cure. The cure
time is affected by the reaction
mechanism and viscosity of the
material. Generally, at 25C and
50%RH, condensation cure RTV
silicones cure through in 24 to 48
hours. Full physical properties
may take up to 7 days to develop.
What is the depth (bead
thickness) limit for a
condensation cure grade?
For 1-part, condensation
cure products, the depth
(bead thickness) limitation is
approximately 6mm (1/4").
For 2-part, condensation
cure products, the depth
(bead thickness) limitation is
approximately 25mm (1").
Can I accelerate the cure
time of a 1-part product?
Condensation cure silicone cure
rates depend on humidity, silicone
thickness, and to a smaller degree
heat. Increasing the relative
humidity around the silicone or
reducing the thickness of the
material will reduce the time to cure
the material. Increased heat (not
over 50C) will somewhat reduce
cure time but as mentioned will do
so to a much smaller degree than
humidity or thickness.
What is the cure
mechanism of an addition
cure product?
Addition cure silicone RTV
products may be 1 or 2-part
and cure when exposed to heat.
Although some heat cure products
can cure at room temperature,
higher heat greatly accelerates the
cure. 1-part heat cure products
typically have an inhibitor in the
formulation that stops the product
from curing until an activation
temperature, greater than room
temperature, is achieved and the
inhibitor is driven off and the cure
reaction is allowed to proceed.
What does "tack free time"
mean?
Tack free refers to the amount of
time it takes for a condensation
cure silicone product to form a
cured outer layer (the cured outer
layer is not tacky like uncured
material).
What is "mix ratio"?
Mix ratio is a term used to state
the amount of each material to
be in a multi-component material.
The mix ratios for 2-part products
are described on the individual
product data sheets and are
given as a ratio by weight of each
material.
What does "pot life" or
"work life" mean?
The amount of time after a 2-part
grade is mixed with its curing
agent that it will remain useful or
pliable.
How do I remove silicone?
Before it is cured: use a putty knife
to remove any of the uncured
paste. Wipe the area clean with
isopropyl alcohol to remove any
leftover residue. After it is cured:
First mechanically remove as
much of the silicone as you can
with either a knife or a razor. A
solvent (mineral spirits, toluene,
xylene, acetone) can them be
used to remove any oily residue or
any remaining silicone, It may be
necessary to soak the silicone in a
solvent overnight to break it down.
Can I thin a silicone?
Silicone can be thinned using a
solvent in which the silicone is
miscible, generally an aromatic
solvent such as toluene or xylene.
As always, be sure to follow the
producer's instructions when
using solvent products and always
use in a well-ventilated area. The
shrinkage of the silicone and the
cure time will increase with the
addition of solvent. Alternative
suggestions would include non-
reactive fluids or an RTV with a
lower viscosity.
What can I do to improve
the adhesion of the silicone
adhesive to my parts?
The first step to good adhesion
is to have clean surfaces for the
silicone to bond to. For difficult-
to-bond-substrates, Momentive
Performance Materials offers a
number of primers that can be
used to improve and maximize
adhesion.
How do I ensure that air
is removed from 2-part
grades?
If you are hand mixing, air may
become added to the material
during the mixing process.
Vacuum de-airing is most effective
in removing air prior to use.
Automated mixing equipment
that utilizes a static mixer can
eliminate the need to de-air prior to
dispensing.
On complex high-density
electronics, air can sometimes be
trapped under components during
the potting process. Where this is
a concern, potting under vacuum
or vacuum de-airing after potting
can remove the trapped air. An
alternate approach may be to use
a grade with a low viscosity and
longer potlife and to cure at lower
temperatures (if heat-cure grade),
allowing entrapped air to escape
prior to the cure of the material.
What is cure inhibition, and
how do I prevent it?
Cure inhibition is a phenomenon
that may be observed in addition-
cure grades. These materials
use a platinum catalyst to drive
the curing reaction. Surfaces
containing water, sulphur,
nitrogen compounds, organic
metal compounds, or phosphate
compounds, may inhibit cure.
Cure inhibition is characterized
by a gummy or sticky appearance
of the silicone at the interface
between the silicone and
offending substrate. Inhibition
can be prevented by application
of a barrier coat, cleaning of
the offending material prior to
application of the silicone material,
replacing the offending material
with a suitable alternative, or
selection of a condensation cure
grade.
Other Electronic
Solutions from
Momentive
Performance
Materials
Provides detailed information
on silicone materials used
for thermal management
applications in electronics and
micro-electronics. Includes
SilCool* grease & adhesives, and
conventional grades for adhesion,
encapsulation and potting.
Provides opto-electronic
solutions for LED Packages and
Assemblies. Includes InvisiSil*
LED encapsulants, Glob Top,
Lens fabrication materials, Die
Attach adhesives, and Dot Matrix
assembly materials.
Dispensing Equipment Examples
Tube Type Dispensing Unit
Cartridge Type Dispensing Unit
Cartridge Air-Gun Dispensing Unit
Small Can Pump and Dispensing Unit
Pail Can Pump Unit
T h e r m a l M a n a g e m e n t S i l i c o n e s
f o r E l e c t r o n i c s
S i l i c o ne M a t e r i a l S o l u t i o n s f o r
L E D P ac k a g e s a n d A s s e m b l i e s
22 Corporate Woods Boulevard
Albany, NY 12211 USA
+1 800 295 2392
+1 607 786 8131
momentive.com
Copyright 2011 Momentive Performance Materials Inc. All rights reserved. MPM 131-155-00E-GL
Customer Service Centers
Worldwide Hotline
T +1 800 295 2392 / +1 607 786 8131
F +1 607 786 8309
North America
cs-na.silicones@momentive.com
Silicones – Fluids, UA, Silianes,
Specialty Coatings, RTV and Elastomers
T +1 800 523 5862 / +1 800 334 4674
F +1 304 746 1654 / +1 304 746 1623
Consumer Sealants/
Construction Sealants and Adhesives
T +1 877 943 7325
F +1 304 746 1654
Latin America
cs-la.silicones@momentive.com
South America
T +55 11 4534 9650
F +55 11 4534 9660
Mexico and Central America
T +52 55 2169 7670
F +52 55 2169 7699
Europe, Middle East, Africa and India
cs-eur.silicones@momentive.com
T +00 800 4321 1000 / +40 21 3111848
Pacific
cs-ap.silicones@momentive.com
China
T +800 820 0202 / +86 21 3860 4892
Japan
T +0120 975 400 / +81 276 20 6182
F +81 276 31 6259
Korea
T +82 2 6201 4600
F +82 2 6201 4601
Malaysia
T +60 3 9206 1555
F +60 3 9206 1533
Thailand
T +66 2207 3456
F +66 2207 3488
DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC., MOMENTIVE PERFORMANCE MATERIALS USA INC.,
MOMENTIVE PERFORMANCE MATERIALS ASIA PACIFIC PTE. LTD., MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC., MOMENTIVE PERFORMANCE MA-
TERIALS GmbH, THEIR SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (collectively “SUPPLIERS”), ARE SOLD BY THE RESPECTIVE LE-
GAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS’ STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER
SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION,
RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i)
THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN
INCORPORATING SUPPLIERS’ PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABIL-
ITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED
CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS
PROVIDED IN SUPPLIERS’ STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS
RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making its own determination as
to the suitability of Suppliers’ materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses neces-
sary to assure that its finished parts incorporating Suppliers’ products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any
other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers’ Standard Conditions of Sale or this
Disclaimer, unless any such modification is specifically agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of
any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of
its subsidiaries or affiliates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or
other intellectual property right.
Technical subject matter in this publication is described and protected by one or more of the following U.S. Patents and their foreign counterpart patents and/or patent ap-
plications: U.S. Patent Nos. 7,411,007; 7,388,049; 7,387,784; 7,381,769; 7,374,771; 7,241,835; 7,217,777; 6,759,479; 6,538,061; 6,531,540; 6,475,568; 6,444,745;
6,291,563; 6,207,782; 5,981,681; and 5,807,956. Other U.S. and foreign patents and/or patent applications not listed covering the subject matter may be relevant.
*SilCool and InvisiSil are trademarks of Momentive Performance Materials Inc.
The Momentive logo is a trademark of Momentive Performance Materials Holdings LLC.
