iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide FPGA-EB-02007 Version 1.0 May 2017 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Contents Introduction ..........................................................................................................................................................................4 1. Features ........................................................................................................................................................................5 2. Power and Battery ........................................................................................................................................................8 2.1. Power Source ......................................................................................................................................................8 2.2. Current Measurement Test Points ......................................................................................................................8 2.3. Battery Management and 4.2 V Regulator..........................................................................................................8 3. Clock Sources ................................................................................................................................................................9 4. Software Requirements ..............................................................................................................................................10 5. Demonstrations ..........................................................................................................................................................11 5.1. Mobile Display Demonstration on U1 ...............................................................................................................11 5.2. Audio Microphone Demonstrations on U2 .......................................................................................................11 5.3. RGB LED Demonstration on U3 .........................................................................................................................11 5.4. Sensor Demonstrations on U3 ..........................................................................................................................12 5.5. Face Recognition Demonstration on U4 ...........................................................................................................12 6. Board Configuration and Programming ......................................................................................................................14 6.1. Jumpers and Switches .......................................................................................................................................14 6.2. Programming the iCE40 Devices Configuration Memory (CRAM) ....................................................................16 6.3. Programming Onboard SPI Flash .......................................................................................................................17 7. Communication Channels ...........................................................................................................................................19 7.1. USB ....................................................................................................................................................................19 7.2. Bluetooth...........................................................................................................................................................19 8. Ordering Information ..................................................................................................................................................20 References ..........................................................................................................................................................................21 Standards Documents .....................................................................................................................................................21 Lattice Semiconductor Documents .................................................................................................................................21 Technical Support Assistance...........................................................................................................................................21 Appendix A. iCE40 UltraPlus Mobile Development Board Schematics ...............................................................................22 Appendix B. iCE40 UltraPlus Mobile Development Board Bill of Materials ........................................................................36 Accessories .....................................................................................................................................................................42 Revision History ...................................................................................................................................................................44 (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figures Figure 1.1. iCE40 UltraPlus Mobile Development Platform Board (Top Side) ...................................................................... 6 Figure 1.2. iCE40 UltraPlus Mobile Development Platform Board (Bottom Side) ................................................................ 7 Figure 2.1. Power Block Diagram .......................................................................................................................................... 8 Figure 3.1. Clock Sources for the iCE40 UltraPlus MDP Board ............................................................................................. 9 Figure 5.1. Rework Resistor Positions Described in Parallel Video Bus Configuration ....................................................... 13 Figure 6.1. Board Configuration for Programming iCE40 UltraPlus Device "U1" ............................................................... 15 Figure 6.2. Programming iCE40 Devices on Board.............................................................................................................. 16 Figure 6.3. Programming SPI Flash on Board ...................................................................................................................... 17 Figure A.8.1. Block Diagram ................................................................................................................................................ 22 Figure A.8.2. iCE40UP5K FPGA A - Display .......................................................................................................................... 23 Figure A.8.3. iCE40UP5K FPGA B - Audio ............................................................................................................................ 24 Figure A.8.4. iCE40UP5K FPGA C - Sensor ........................................................................................................................... 25 Figure A.8.5. iCE40UP5K FPGA D - Camera ......................................................................................................................... 26 Figure A.8.6. Common Components- SPI ............................................................................................................................ 27 Figure A.8.7. Display Circuitry ............................................................................................................................................. 28 Figure A.8.8. Audio Circuitry ............................................................................................................................................... 29 Figure A.8.9. Sensor & RGB Circuitry .................................................................................................................................. 30 Figure A.8.10. Camera Circuitry .......................................................................................................................................... 31 Figure A.8.11. USB Programming ....................................................................................................................................... 32 Figure A.8.12. Power Supplies ............................................................................................................................................ 33 Figure A.8.13. Common Components................................................................................................................................. 34 Figure A.8.14. Battery Connector & Charger ...................................................................................................................... 35 Tables Table 6.1. iCE40 UltraPlus Device Selection ....................................................................................................................... 14 (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 3 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Introduction Thank you for choosing the Lattice iCE40 UltraPlusTM Mobile Development Platform (MDP) Board. This MDP board is an easy-to-use platform for demonstrating various features of the iCE40 UltraPlus for mobile applications. The MDP form-factor is similar to a mobile device (cell phone), with various sensors, display, Bluetooth communication, and others. The board contains four individual iCE40 UltraPlus devices, each configured with a unique set of interfaces to support multiple demonstrations. Features that can be demonstrated using this board include: Mobile Display (Onboard 1.54 inch 240 x 240 RGB wearable type display with MIPI DSI interface) Camera (Onboard VGA 640 x 480 sensor with CSI and parallel video interface option) Image and facial recognition Microphones (Onboard Dual I2S and Dual PDM microphones with audio amp, 3.5 mm and expansion connectors) Voice recognition Audio beam forming capabilities Sensors (Various Mobile Type Sensors with expansion connector) RGB LED Pressure Sensor Compass Sensor Gyroscope Sensor Accelerometer Sensor This guide describes how to begin using the MDP. The contents of this user guide include top-level functional descriptions of the various portions of the evaluation board, a summary of demonstrations, descriptions of the onboard connectors, switches, jumpers, configuration options, along with a complete set of schematics and the bill of materials. Note: Static electricity can severely shorten the lifespan of electronic components. Be careful to follow proper ESD prevention handling standards when handling and using the iCE40 UltraPlus Mobile Development Platform Board. (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 4 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 1. Features The iCE40 UltraPlus Mobile Development Platform development kit includes the items below. iCE40 UltraPlus Mobile Development Platform- PCB, case, and integrated Li-ion battery featuring: Four iCE40 UltraPlus devices (U1-U4 iCE5UP5K-WLCSP30) in 30-Ball WLCSP packages Large capacity of onboard SPI Flash memory (U37 Micron M25P80 8Mb) to store the FPGA demo bitstream for all four iCE40 UltraPlus devices Example of a PCB design using 0.40 mm Ball Pitch package Control switches to select which of the four devices is active (only one device is active at a time) Standard USB cable for device programming (Lattice part number HW-USBN-2A, HW-USBN-2B or equivalent) RoHS-compliant packaging and process Key Components iCE40UP5K-30WLCSP (4 pieces) Power Regulation Bluetooth module MIPI LCD Mobile Display (1.54 inch 240 x 240 RGB LH154Q01) Camera image sensor OVM7692 VGA 640 x 480 (CSI and parallel video interface option) Microphones (Dual I2S and Dual PDM microphones with audio amp, connectors for 3.5 mm and expansion) RGB LED Sensors that include: - Barometric pressure sensor - Compass sensor - 3D accelerometer and 3D gyroscope sensor - Three-axis linear accelerometer sensor Pre-loaded Demo - The kit includes a pre-loaded MIPI LCD Mobile Display demo. USB Connector Cable - A mini-B USB port provides power, a programming interface and communication channel for a PC to communicate directly to iCE40 devices. (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 5 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure 1.1 shows the top side while Figure 1.2 on the next page shows the bottom side of the iCE40 UltraPlus Mobile Development Platform Board indicating the specific features that are designed on the board. Figure 1.1. iCE40 UltraPlus Mobile Development Platform Board (Top Side) (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 6 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure 1.2. iCE40 UltraPlus Mobile Development Platform Board (Bottom Side) (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 7 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 2. Power and Battery 2.1. Power Source The MDP board can be powered by three sources: External USB Connector J5 (5V). Green LED D8 and Yellow LED D5 lights up when power is supplied. External AP Header Connector J16-8 (5 V) and J16-9 (GND). Yellow LED D5 lights up when power is supplied. Internal 250 mAH Li-ion battery contained internal to the MDP case. External power from USB connector J5 and AP header connector J16 are 'Diode-ORd'. If power is supplied to both connectors, the higher voltage powers the board. When external power is not supplied, the internal Li-ion battery contained in the case powers the board. Power switch SW2 turns the board ON and OFF by enabling/disabling the main voltage regulator outputs of 3.3V, 2.5V, and 1.2V. Green LED D9 lights up when the 3.3V rail is active and indicates that the board is powered ON. Figure 2.1. Power Block Diagram 2.2. Current Measurement Test Points Each of the four FPGAs have six 1 resistors in series with their power inputs to allow easy current measurements using a voltmeter and to ease reworking VCCIO voltage rails. See Appendix A. iCE40 UltraPlus Mobile Development Board Schematics for details. 2.3. Battery Management and 4.2 V Regulator Chip BQ24232 U15 provides automatic battery management and the board's 4.2V regulated voltage rail. The 4.2V rail (VSUPPLY) is used to generate all of the board's other voltages. The management chip is always ON (not controlled by power switch SW2). When external power is not available, the management chip uses the 250 mAH Li-ion battery internal to MDP case to generate the 4.2V rail. When external 5V is supplied (4.6V to 6.0V), the battery is automatically charged as required. The Green LED D6 lights during charging and turns OFF when charging is complete. Additionally, external power is used to generate the 4.2V rail. The BQ24232 battery charging is configured with external resistors. Default resistor configuration: 500 mA input current limit 200 mA charging current 25 mA end of charging termination current threshold 5-hour fast charge time and 30-minute pre-charge (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 8 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 3. Clock Sources A 27 MHz oscillator is built on the Mobile Development Platform board. External clock input can also be provided to this board depending on the J23 settings. There are six devices sharing the same clock source that are available at the same time. These include four iCE40UP5K(U1~U4) devices that are responsible for various demos, U43 which is a stereo audio DAC with direct drive headphone amplifier, and U39 which is an ultra-compact size 640 x 480 image sensor. Short Pins 2-3 leads the onboard 27 MHz clock to these devices and provides external clock source through Pin 2 and Pin 3 (GND). U14 On Board 27 MHz External Clock Source U1 ICE40UP5K - A (Display Demo) U2 ICE40UP5K - B (Audio Demo) U43 Max9850 (Audio DAC&Amplifier, Audio Demo) U3 ICE40UP5K - C (Sensor Demo) U4 ICE40UP5K - D (Camera Demo) U39 OVM7692 (Image Sensor, Camera Demo) Figure 3.1. Clock Sources for the iCE40 UltraPlus MDP Board (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 9 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 4. Software Requirements Install the following software before you begin developing designs for the board: Lattice iCEcube2 2017.01 (or higher) Used for developing your own custom designs for the iCE40 UltraPlus FPGA. Diamond Programmer(R) 3. 8 (or higher) Used to program the iCE40 UltraPlus FPGA. These software programs are available at the www.latticesemi.com/software. Make sure you log in to www.latticesemi.com, otherwise these software downloads will not be visible. (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 10 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 5. Demonstrations Four iCE40UP5K-30WLCSP (U1-U4) devices are used on the Mobile Development Platform board. The devices are responsible for specific demonstrations. Lattice provides separate user guides that describe each demo in detail. The documents cover board configuration and step-by-step instructions. Please refer to the relevant documents for more details. The following sections describe the Mobile Development Platform board demos. 5.1. Mobile Display Demonstration on U1 This demo showcases the ability of iCE40 UltraPlus to drive a small wearable display and buffer one full image frame. Key components for this demo include: U1 iCE40UP5K-30WLCSP J2 Display connector for MIPI LCD display (MIPI LCD Display, 1.4" LH154Q01 is included in the kit.) U11 Display backlight driver U13 1.8V and 3.0V voltage regulator Note: Be careful with the LCD display ribbon, it is fragile and can be damaged! 5.2. Audio Microphone Demonstrations on U2 FPGA U2 is optimized for microphone related demonstrations, such as audio beam. The board contains two I2S microphones, two PDM microphones, a 3.5 mm audio jack driven by a MAX9850 headphone audio amplifier, and an expansion connector allowing up to seven microphones used in an array. This demo shows the capability of picking up human voice and driving the output on the speaker with the same quality, irrespective of where the voice is originating from within a room. Key components for this demo include: U2 iCE40UP5K-30WLCSP U12/U19 I2S omnidirectional microphone with Bottom Port and Analog Output U94/U95 PDM omnidirectional microphone with Bottom Port and Analog Output U43 Audio DAC with headphone amplifier. J34 3.5 mm audio jack for analog output J15 Expansion connector supporting up to seven microphones. J25 Header used to configure FPGA to microphone connections 5.3. RGB LED Demonstration on U3 This demo showcases the capability of ICE40-UltraPlus to control and drive an RGB LED. A mobile app software GUI tool is provided to allow a user to remotely control the LED via a phone or tablet over Bluetooth. The features of the demo include: Ability to control the color of the LED from a color palette. Ability to control the brightness of the LED. Ability to control the ON/OFF time of the LED - thereby creating a pulsating breathing effect. Key components for this demo include: U3 iCE40UP5K-30WLCSP D13 RGB LED U30 Bluetooth Module used for remote control (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 11 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide It is recommended to download the RGB LED software GUI which interfaces with the MDP. This GUI allows you to control the RGB LED for color, brightness, blinking and `breathing'. Download the PC or MAC version of the GUI at www.latticesemi.com/ice40ultraplusmdp. 5.4. Sensor Demonstrations on U3 This demo showcases the capability of iCE40 UltraPlus to act as a sensor hub. Key components for this demo include: U3 iCE40UP5K-30WLCSP. U22 Digital barometric pressure sensor U35 High performance e-compass 3D accelerometer and 3D magnetometer U36 3D accelerometer and 3D gyroscope U38 3-axis "pico" accelerometer 5.5. Face Recognition Demonstration on U4 This demo showcases the capability of ICE40-UltraPlus to detect and react to a general human face. Key components for this demo include: U4 iCE40UP5K-30WLCSP. U39 Image Sensor OVM7692. U16 Camera Expansion Connector. U44 1.5V and 2.8V voltage regulator. This demo uses the VGA (640 x 480) sensor OVM7692 U39 or the camera expansion connector U16. The default interface uses CSI2, however, the interface can be configured for 3.3 V parallel video interface to support the facial recognition demo with the following rework: 1. Remove resistors: R15, R29, R30, R47, R73, R90, R91, R100, R125, R126, R127, R142, R143, R149, R150, R154, R155. 2. Install 0 resistors (or short with solder blob): R31, R32, R43, R52, R53, R54, R55, R56. 3. Verify resistors installed: R22, R159, R160. 4. If using Xtal U14 as clock source Jumper J23-2 and 3 else J23-2 should be open. (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 12 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure 5.1 shows the resistors of the rework. Resistors highlighted in red rectangle need to be removed; resistors highlighted in green rectangle need to install 0 resistors; blue highlights show the resistors needing installation verification. Figure 5.1. Rework Resistor Positions Described in Parallel Video Bus Configuration (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 13 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 6. Board Configuration and Programming The iCE40 UltraPlus Mobile Development Board has four iCE40 devices. Each device serves specific demo purposes. As there is only one USB to SPI bridge chip used onboard, programming different iCE40 devices can be completed using combinations of jumper and switch settings. The installed jumpers used on the MDP board have a 2 mm pin-pitch, not the standard 100-mil style. 6.1. Jumpers and Switches The iCE40 UltraPlus Mobile Development Board has the following jumpers: J19 Set these for either SPI Flash programing (both vertical) or SRAM (iCE40) programming (both horizontal), per the silkscreen markings on the board. J17 To program the iCE40 UltraPlus device U1, short pins 1-2. To program any other device on the board, short pins 910. Note: Follow the silkscreen markings on the board, pins 1-2 are at the top of this header bank. J25 To program the iCE40 UltraPlus device U2, short pins 1-2. To program any other device on the board, short pins 910. Note: Follow the silkscreen markings on the board, pins 1-2 are at the bottom of this header bank. J26 To program the iCE40 UltraPlus device U3, short pins 1-2. To program any other device on the board, short pins 910. Note: follow the silkscreen markings on the board, pins 1-2 are at the bottom of this header bank. J28 If you are doing SPI Flash programming, short pins 1-2. Otherwise, leave all pins open. The iCE40 UltraPlus Mobile Development Board has the following switches: SW5 This selects the target iCE40 UltraPlus device. Refer to Table 6.1 to select the correct device. Table 6.1. iCE40 UltraPlus Device Selection iCE40 UltraPlus FPGA Key Supported Features SW5 (2,1) U1 Display frame buffer: 240x240 display 18-bit color (R6,G6,B6), MIPI DSI interface OFF, OFF U2 On-board stereo microphones (I2S & PDM): 7-microphone expansion connector, headphone amp, audio output jack OFF, ON U3 Sensors: RGB LED, Pressure Sensor, Gyroscope, Accelerometer, Compass ON, OFF U4 640x480 VGA Camera, MIPI CSI interface, expansion connector utilizing single MIPI data lane ON, ON Reference Image Use the marking on switch to determine SW5-1 and SW5-2 orientations, including the `ON' direction (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 14 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide SW9 This switch is used to add/remove the BLE module from the SPI bus. It is recommended that the BLE module be removed from the SPI bus when the module is not in demo use. Figure 6.1 shows the setting of jumpers and switches while trying to program iCE40 device "U1"directly. Figure 6.1. Board Configuration for Programming iCE40 UltraPlus Device "U1" (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 15 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 6.2. Programming the iCE40 Devices Configuration Memory (CRAM) To program iCE40 UltraPlus devices' CRAM in Diamond Programmer: 1. Set board jumpers on J19 vertically for CRAM programming. 2. Remove board jumper J28: 1-2 for CRAM programming. 3. Use Diamond Programmer 3.8 or later. 4. Connect the iCE40 UltraPlus Mobile Development Platform board via the USB cable to a PC or MAC. 5. Start Diamond Programmer. 6. Set Device Family to iCE40 UltraPlus" and Device to "iCE40UP5K". Refer Figure 6.2 below. 7. Be sure to perform the "Program, Verify" operation. If you select only the "Program" operation, you may get a false positive that the device has programmed. 8. Field Programming Speed Settings should be set to "Use customer Clock Divider" and appropriate value "5" should be set in the text box below. 9. Open the Device Properties dialog. Apply the settings highlighted. 10. Access mode: set to "CRAM programming" to allow directly programming iCE40 devices. 11. Operation: set to "Fast Program" mode. 12. Programming File: load bit stream file for demo. 13. Click OK to exit Device Properties dialog. 14. Click the Program button in Diamond Programmer to download the bit stream file. Figure 6.2. Programming iCE40 Devices on Board (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 16 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 6.3. Programming Onboard SPI Flash To program SPI flash in Diamond Programmer: 1. Set board jumpers on J19 horizontally for SPI Flash programming. 2. Install board jumper J28: 1-2 for SPI Flash programming. 3. Start Diamond Programmer. 4. Set Device Family to iCE40 UltraPlus" and Device to "iCE40UP5K". 5. Be sure to do the "Program, Verify" operation. If you select only the "Program" operation, you may get a false positive that the device has programmed. 6. Field Programming Speed Settings should be set to "Use customer Clock Divider" and appropriate value "5" should be set in the text box below. 7. Open the Device Properties dialog. Apply the settings highlighted. Access mode: set to "SPI Flash Programming". Operation: set to "SPI Flash Erase, Program, Verify" mode. Programming File: load bit stream file for demo. SPI Flash Options: select correct Flash chip as shown in Figure 8.3 blow. Load from File button should be used to refresh fields such as "Data file size" and "End address(Hex)". 8. Click OK to exit Device Properties dialog. 9. Click the Program button in Diamond Programmer to download the bit stream file. Figure 6.3. Programming SPI Flash on Board (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 17 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide The main differences between programming ICE40 UltraPlus devices and programming SPI Flash are: 1. Board jumpers on J19: Vertical for CRAM programming and horizontal for SPI Flash programming. 2. Board jumpers J28: 1-2: Remove for CRAM programming and install for SPI Flash programming. 3. The settings in "Device Properties" dialog in Diamond Programmer. For more information on Diamond Programmer, please refer to its user guide. (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 18 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 7. Communication Channels To enable communication with external tools, devices or Apps on Smart phone, this board features a number of communication channels. 7.1. USB A USB cable from PC needs to be connected to J5 on board. This communication channel through U9 (FT2232H) is mainly used for programing the SPI flash on board, or program the ICE devices directly depends on settings on jumper J19. 7.2. Bluetooth This board features a Bluetooth module U30 to enable wireless communication with external devices like smart phones, which is very useful while need to run some APPs on smart phone in demos. This Bluetooth provide UART channel to communicate with ICE40 devices on board. (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 19 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide 8. Ordering Information Description Ordering Part Number iCE40 UltraPlus Mobile Development Platform iCE40UP5K-MDP-EVN China RoHS Environment- Friendly Use Period (EFUP) (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 20 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide References Standards Documents The standards used in this document and their abbreviations are listed on the table below. Abbreviation Standards Publication, Organization, and Date MIPI CSI2 MIPI Alliance, Mobile Industry Processor Interface MIPI Alliance, Camera Serial Interface For more information on the specifications that are applied in this document, contact the responsible standards groups listed on the table below. Standards Group MIPI Alliance Web URL http://www.mipi.org Lattice Semiconductor Documents Related documents available from your Lattice Semiconductor sales representative are listed on the table below. Document Title Data Sheet DS1056 iCE40 UltraPlus Family Data Sheet Technical Support Assistance Submit a technical support case through www.latticesemi.com/techsupport. (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 21 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Appendix A. iCE40 UltraPlus Mobile Development Board Schematics Figure A.8.1. Block Diagram (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 22 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.2. iCE40UP5K FPGA A - Display (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 23 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.3. iCE40UP5K FPGA B - Audio (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 24 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.4. iCE40UP5K FPGA C - Sensor (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 25 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.5. iCE40UP5K FPGA D - Camera (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 26 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.6. Common Components- SPI (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 27 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.7. Display Circuitry (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 28 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.8. Audio Circuitry (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 29 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.9. Sensor & RGB Circuitry (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 30 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.10. Camera Circuitry (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 31 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.11. USB Programming (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 32 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.12. Power Supplies (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 33 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.13. Common Components (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 34 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Figure A.8.14. Battery Connector & Charger (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 35 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Appendix B. iCE40 UltraPlus Mobile Development Board Bill of Materials Item 1 2 3 4 Reference C1, C6, C9, C12, C88, C98, C102, C106, C108, C111, C115, C117, C119, C122, C124, C127 C2, C5, C8, C10, C13, C34, C78, C81, C83, C89, C99, C101, C105, C109, C110, C114, C120, C121, C126, C133 C3, C4, C11, C14, C35, C53, C54, C55, C57, C59, C61, C79, C80, C82, C84, C93, C97, C103, C107, C112, C116, C118, C123, C128 C7, C73, C104, C113, C125 Qty Part PART_NUMBER Manufacturer Description 16 10n GRM033R61C10 3KA12D Murata CAP CER 10000PF 16V 10% X5R 0201 20 0.1u GRM033R61A10 4KE15D Murata CAP CER 0.1UF 10V X5R 0201 24 1u 885012105012 Wurth CAP CER 1UF 10V X5R 0402 5 10u Samsung CAP CER 10UF 10V X5R 0402 TDK CAP CER 1UF 16V 10% X5R 0402 CL05A106MP5N UNC C1005X5R1C105 K050BC 5 C15 1 1uF 6 C16 1 100n 885012205037 Wurth CAP CER 0.1UF 16V X7R 0402 7 C17, C19, C20, C22, C24, C25, C26, C28, C29, C32, C33, C36, C38, C39, C44, C47, C48, C49, C56, C60, C62, C63, C75, C76, C77, C85, C86, C87, C92, C100, C134, C135, C313, C409, C412, C414, C417, C418 38 0.1u 885012105010 Wurth CAP CER 0.1UF 10V X5R 0402 8 C18, C410 2 47u AVX CAP TANT POLY 47UF 10V 1210 9 C21, C27, C31, C40, C45, C400 6 10u Samsung CAP CER 10UF 6.3V X5R 0603 10 C23, C37 2 33p Wurth CAP CER 33PF 50V NP0 0402 11 C30, C43, C64 3 4.7u Yageo CAP CER 4.7UF 10V X5R 0603 12 C41, C42, C407 3 10u Samsung CAP CER 10UF 10V X6S 0603 13 C46, C413 2 0.1u Wurth CAP CER 0.1UF 10V X5R 0402 14 C50 1 10u Samsung CAP CER 10UF 10V X6S 0603 15 C51 1 2.2u TDK CAP CER 2.2UF 16V 10% X5R 0402 TCJB476M010R 0070 CL10A106MQ8N NNC 885012005058 CC0603KRX5R6B B475 CL10X106MP8N RNC 885012105010 CL10X106MP8N RNC C1005X5R1C225 K050BC (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 36 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Item Reference Qty Part PART_NUMBER Manufacturer Description 16 C52, C91, C129, C130 4 0.47u C1005X5R1E474 K050BB TK CAP CER 0.47UF 25V X5R 0402 17 C58, C94, C96 3 0.1uF 885012105016 Wurth CAP CER 0.1UF 16V X5R 0402 18 C65 1 0.22u 885012206048 Wurth CAP CER 0.22UF 16V X7R 0603 19 C66 1 0.1uF 885012105016 Wurth CAP CER 0.1UF 16V X5R 0402 20 C67, C68, C69 3 1uF GRM155R61C10 5KE01D Murata CAP CER 1UF 16V 10% X5R 0402 21 C70 1 1uF 885012208093 Wurth CAP CER 1UF 50V X7R 1206 22 C71 1 1uF GRM155R61C10 5KE01D Murata CAP CER 1UF 16V 10% X5R 0402 23 C72 1 100nF 885012105016 Wurth CAP CER 0.1UF 16V X5R 0402 24 C74 1 100n 885012105016 Wurth CAP CER 0.1UF 16V X5R 0402 25 C90, C95 2 4.7uF C1005X5R1A475 K050BC TDK CAP CER 4.7UF 10V 10% X5R 0402 26 C168, C169, C170 3 0.1uF 885012105016 Wurth CAP CER 0.1UF 16V X5R 0402 27 C415, C416 2 10u CL10X106MP8N RNC Samsung CAP CER 10UF 10V X6S 0603 28 D1, D11, D12, D14 4 GREEN 150060GS75000 Wurth LED GREEN CLEAR 0603 SMD 29 D2 1 Green 150060GS75000 Wurth LED GREEN CLEAR 0603 SMD 30 D3, D4 2 PMEG201 0AEH PMEG2010AEH, 115 NXP Semiconductor DIODE SCHOTTKY 20V 1A SOD123F 31 D5 1 YELLOW 150060YS75000 Wurth LED YELLOW RECT CLEAR 0603 32 D6 1 GREEN 150060GS75000 Wurth LED SMARTLED GREEN 570NM 0603 33 D7 1 Red 150060SS75000 Wurth LED RED CLEAR 0603 SMD 34 D8, D9 2 Green 150060VS75000 Wurth LED SUPER GREEN CLEAR 0603 SMD 35 D13 1 150141M17310 0 Wurth LED RGB CLEAR 1411 SMD 36 J2 1 150141M 173100 5035481220 5035481220 Molex Inc CONN RCPT BTB 12POS DL VERT SMD 37 J3, J11, J12 3 GND 608001162100 Wurth 38 J5 1 USB PWR 65100516121 Wurth CONN COM TYPE B MINI USB SMD 5P 39 J8 1 - - CONN HEADER .100 DUAL STR 10POS 40 J13, J15 2 61001021121 Wurth CONN HEADER VERT DUAL 10POS 2.54 41 J16 1 62101021921 Wurth 2.00 mm SMT Dual Pin Header 42 J17, J26, J27 3 62101021921 Wurth 2.00 mm SMT Dual Pin Header PMOD Connecto r 2x5 HEADER AP INTERCO NNECT iCEA Control (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 37 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Item Reference Qty 43 J18 1 44 J19 1 45 J23 1 Part BLE PROG SEL A3A04PA2SV(71) Clock Source Sel PART_NUMBER Manufacturer Description 62000311121 Wurth 2.00 mm THT Pin Header A3A-4PA2SV(71) Hirose CONN HEADER 2mm DUAL STR 4POS SMT 62000311121 Wurth 2.00 mm THT Pin Header 57202-G52-06LF Amphenol FCI 12 Positions Header, Unshrouded Connector 0.079" (2.00mm) Surface Mount Gold, GXTTM 46 J25 1 iCEA Control 47 J28 1 Common Control 62101021921 Wurth 2.00 mm SMT Dual Pin Header 48 J30, J32 2 CON24A -- -- -- 49 J31, J33 2 CON24A -- -- -- 50 J34 1 CUI_sj3524SMT SJ-3524-SMT-TR CUI Inc. CONN AUDIO JACK 3.5MM STEREO SMD 51 L1, L2, L3 3 600 ohm, 500 mA MMZ1608R601 A TDK FERRITE BEAD 600 OHM 0603 1LN 52 L4 1 22uH AIML-0805HC220M-T Abracon Corporation HIGH CURRENT CHIP IND 22.0UH 20% 53 R1, R84, R85, R86 4 100 RC1005J101CS Samsung RES 100 OHM 1/16W 5% 0402 54 R2, R49, R69, R70 4 2k2 RC1005J222CS Samsung RES 2.2K OHM 1/16W 5% 0402 55 R3 1 10K ERJ-2RKF1002X Panasonic 56 R4, R6, R7, R8, R12, R62, R63, R65, R200 9 10k ERJ-2RKF1002X Panasonic 57 R5 1 0 ERJ-3GEY0R00V Panasonic 58 R9 1 DNP -- -- -- 59 R10 1 2k2 RC1005J222CS Samsung RES 2.2K OHM 1/16W 5% 0402 6 10k ERJ-2RKF1002X Panasonic RES 10K OHM 1/10W 1% 0402 SMD 10 0 ERJ-2GE0R00X Panasonic RES 0.0 OHM 1/10W 0402 SMD 39 0 ERJ-3GEY0R00V Panasonic RES SMD 0.0 OHM JUMPER 1/10W 0603 60 61 62 R11, R14, R79, R97, R166, R167 R13, R29, R35, R37, R40, R76, R77, R205, R206, R224 R15, R19, R22, R30, R47, R56, R59, R60, R81, R83, R96, R141, R142, R143, R147, R148, R149, R150, R152, R153, R154, R155, R157, R158, R159, R160, R168, R169, R170, R171, R172, R173, R174, RES 10K OHM 1/10W 1% 0402 SMD RES 10K OHM 1/10W 1% 0402 SMD RES SMD 0.0 OHM JUMPER 1/10W 0603 (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 38 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Item Reference Qty Part PART_NUMBER Manufacturer Description R175, R176, R213, R218, R221, R222 63 R16, R17 2 10 RC1005J100CS Samsung RES 10 OHM 1/16W 5% 0402 64 R18 1 12k RC1005F123CS Samsung RES 12K OHM 1/16W 1% 0402 65 R20, R50, R145, R146 4 1k RC1005J102CS Samsung RES 1K OHM 1/16W 5% 0402 66 R21, R24, R25, R26, R27, R28 6 0 RC1005J000CS Samsung RES 0.0 OHM 1/16W JUMP 0402 67 R23 1 470 RC1005J471CS Samsung RES 470 OHM 1/16W 5% 0402 68 R31 1 0 ERJ-2GE0R00X Panasonic RES 0.0 OHM 1/10W 0402 SMD 69 R32, R43, R52, R53, R54, R55, R107, R108, R110, R132, R133, R134, R135, R136, R137, R138, R139, R140, R162, R163, R164, R165 22 0 ERJ-3GEY0R00V Panasonic RES SMD 0.0 OHM JUMPER 1/10W 0603 70 R33, R36, R72 3 30 ERJ-1GEJ300C Panasonic 71 R34, R38, R39, R71 4 1K ERJ-1GEF1001C Panasonic 72 R41 1 10k ERJ-2GEJ103X Panasonic 73 R42 1 18 ERJ-2GEJ180X Panasonic 74 R44 1 0 ERJ-2GE0R00X Panasonic 75 R45, R48, R67, R68, R75, R223 6 0 ERJ-2GE0R00X Panasonic 76 R46 1 30 ERJ-1GEJ300C Panasonic 77 R51 1 1K ERJ-2GEJ102X Panasonic 78 R57, R58 2 470 ERJ-3GEYJ471V Panasonic 79 R61 1 0.1 RUT1005FR100C S Samsung 80 R64 1 2K ERJ-2GEJ202X Panasonic 81 R66, R87, R203 3 100k RC1005J104CS Samsung 82 R73, R100 2 100 ERJ-1GEF1000C Panasonic 83 R74, R78, R98, R99 4 4.7K ERJ-3EKF4701V Panasonic 84 R80, R82 2 0 ERJ-3GEY0R00V Panasonic 85 R88, R89, R101, R102 4 4.7k ERJ-2RKF4701X Panasonic RES 30 OHM 1/20W 5% 0201 SMD RES SMD 1K OHM 1% 1/20W 0201 RES SMD 10K OHM 5% 1/10W 0402 RES SMD 18 OHM 5% 1/10W 0402 RES SMD 0.0 OHM JUMPER 1/10W 0402 RES 0.0 OHM 1/10W 0402 SMD RES 30 OHM 1/20W 5% 0201 SMD RES SMD 1K OHM 5% 1/10W 0402 RES SMD 470 OHM 5% 1/10W 0603 RES SMD 0.1 OHM 1% 1/10W 0402 RES SMD 2K OHM 5% 1/10W 0402 RES SMD 100K OHM 5% 1/16W 0402 RES SMD 100 OHM 1% 1/20W 0201 RES SMD 4.7K OHM 1% 1/10W 0603 RES SMD 0.0 OHM JUMPER 1/10W 0603 RES SMD 4.7K OHM 1% 1/10W 0402 (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 39 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Item Reference Qty Part PART_NUMBER Manufacturer 86 R90, R91 2 510k ERJ-2RKF5103X Panasonic 87 R92 1 4.32K ERJ-2RKF4321X Panasonic 88 R93 1 2.94K ERJ-2RKF2941X Panasonic 89 R94 1 3.57K ERJ-2RKF3571X Panasonic 90 R95 1 DNL -- -- 91 R103, R104 2 0.5 RL0603FR070R5L Yageo 92 R105, R106 2 4.7k ERJ-3EKF4701V Panasonic 93 R109, R111, R113, R115, R116 5 0 ERJ-3GEY0R00V Panasonic 94 R112, R114 2 0 ERJ-3GEY0R00V Panasonic 95 R117, R118, R120, R121, R122, R123, R124, R125, R126, R127, R128, R129, R130, R131 14 0 ERJ-3GEY0R00V Panasonic RES SMD 0.0 OHM JUMPER 1/10W 0603 96 R119 1 10k ERJ-3EKF1002V Panasonic RES SMD 10K OHM 1% 1/10W 0603 97 R178, R179, R180, R181, R182, R183, R184, R185, R186, R187, R188, R189, R190, R191, R192, R193, R194, R195, R196, R197, R198, R199, R201, R202 24 1 ERJ-3GEYJ1R0V Panasonic RES SMD 1 OHM 5% 1/10W 0603 98 R207, R208 2 0 ERJ-2GE0R00X Panasonic 99 R219, R220 2 0 ERJ-3GEY0R00V Panasonic 100 SW2 1 PWR EG1218 E-Switch 101 SW4, SW6, SW7 3 PB TL1015AF160QG E-Switch 102 SW5, SW8 2 416131160802 Wurth 103 SW9 1 416131160806 Wurth SW_SPST _2 SW_SPST _6 Description RES SMD 510K OHM 1% 1/10W 0402 RES SMD 4.32K OHM 1% 1/10W 0402 RES SMD 2.94K OHM 1% 1/10W 0402 RES SMD 3.57K OHM 1% 1/10W 0402 -- RES SMD 0.5 OHM 1% 1/10W 0603 RES SMD 4.7K OHM 1% 1/10W 0603 RES SMD 0.0 OHM JUMPER 1/10W 0603 RES SMD 0.0 OHM JUMPER 1/10W 0603 RES SMD 0.0 OHM JUMPER 1/10W 0402 RES SMD 0.0 OHM JUMPER 1/10W 0603 SWITCH SLIDE SPDT 30V.2A PC MNT SWITCH TACTILE SPST-NO 0.05A 12V DIP SWITCH 1.27MM PITCH 2POL 24V DIP SWITCH 1.27MM PITCH 6POL 24V (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 40 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Item Reference Qty Part PART_NUMBER Manufacturer Description 104 TP1, TP2, TP3, TP26, TP27, TP28, TP29, TP30, TP31, TP32, TP33, TP34, TP35, TP36, TP37, TP38, TP39, TP40, TP41, TP42, TP43, TP44, TP45, TP46, TP47, TP48, TP49, TP50, TP51, TP52, TP53, TP54, TP55, TP56, TP57, TP58, TP59, TP60, TP61, TP62, TP63, TP64, TP65, TP66, TP67, TP68, TP69, TP70, TP71, TP72, TP73, TP74, TP75, TP76, TP77, TP78, TP79, TP80, TP81, TP82, TP83, TP84, TP85, TP86, TP87, TP88, TP89, TP90, TP91, TP92 70 T POINT R -- -- -- 105 TP12, TP13 2 -- -- TEST POINT PC MINIATURE SMT 106 TP22, TP23, TP24, TP25 4 -- -- -- 107 U1, U2, U3, U4 4 iCE5UP5KUWG30 Lattice -- 108 U6 1 IC EEPROM 2KBIT 2MHZ SOT23-6 109 U8 1 XC6222B 331MR-G XC6222B331MR -G Microchip Technology Torex Semiconductor Ltd 110 U9 1 FT2232H FT2232HL FTDI IC USB HS DUAL UART/FIFO 64LQFP 111 U10 1 AP73121218W67 AP73121218W6-7 Diodes Inc IC REG LDO 1.2V/1.8V 0.15A SOT26 112 U11 1 TPS61061 TPS61061DRBR TI 113 U12, U19 2 INMP441 INMP441ACEZ Invensense 114 U13 1 MIC5320 MIC5320PGYMT TR Micrel Inc 115 U14 1 ASFLMB27.000M HZ-LC-T ASFLMB27.000MHZ-LC-T ABRACON OSC MEMS 27.000MHZ CMOS SMD 116 U15 1 BQ24232 BQ24232RGTT TI IC LI+ CHARGER PWR MGMT 16QFN 117 U16 1 Hirose FX12 - 40 Pos FX12B-40P0.4SV Hirose CONN PLUG 40POS 0.4MM SMD SHIELD 80_MIL_ PAD T POINT R iCE5UP5K WLCSP30 93LC56BT -I/OT 93LC56BT-I/OT IC REG LDO 3.3V 0.7A SOT25 IC LED DRIVER WHITE BCKLGT 8SON Omnidirectional Microphone with bottom port and I2S digital port IC REG LDO 3V/1.8V 0.15A 6TMLF (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 41 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Item Reference Qty Part PART_NUMBER Manufacturer Description 118 U22 1 BMP180 BMP180 Bosch SENSOR PRESSURE ABS 119 U30 1 SeeedBLE 113050012 Seeed 120 U35 1 LSM303DLHC ST Micro 121 U36 1 LSM330DLC ST Micro 122 U37 1 M25P80 M25P80VMW6G Micron IC FLASH 8MBIT 75MHZ 8SOW 123 U38 1 LIS2DS12 LIS2DS12TR STMicroelectro nics MEMS DIGITAL OUTPUT MOTION SENSO 124 U39 1 OVM7692-RAAA OmniVision SENSOR IMAGE 125 U41, U42 2 DG409LDQ-T1E3 Vishay 126 U43 1 MAX9850ETI+T Maxim Integrated AP7346D1528FS6-7 Diodes IC REG LDO 1.5V/2.8V X2DFN1212 MIC5335-SJYMT Micrel IC REG LDO 3.3V/2.5V 0.3A 6TMLF ESDR0502NMUT BG ON Semi TVS DIODE 5.5VWM 6UDFN MP34DB01 STMicroelectro nics 127 U44 1 128 U90 1 129 U93 1 LSM303D LHC LSM330D LC OVM769 2 DG409LD Q-T1-E3 MAX9850 AP7346D 1528FS67 MIC5335SJYMT ESDR050 2 Low cost ARM cortex-m0 based module for Bluetooth module ACCELEROMETER/MAGNETOM ETER 14LGA ACCELEROMETER/MAGNETOM ETER 28LGA 2 Circuit IC Switch 4:1 29 Ohm 16-TSSOP IC AMP AUDIO .095W STER 28TQFN 20Hz ~ 20kHz Digital, PDM Microphone MEMS (Silicon) 1.8V Omnidirectional (-26dB 3dB @ 94dB SPL) Solder Pads Square test point, 40mil inner diameter, 63mil outer diameter 130 U94, U95 2 MP34DB 01 131 VCC_P, VCC_N 2 TP_S_40_ 63 -- -- 132 Y1 1 12MHz ABM312.000MHZ-B2T Abracon Corp CRYSTAL 12MHZ 18PF SMD 133 iCE40UP Mobile Development Platform Board PCB 1 -- 305-PD-16-0605 PACTRON -- Accessories Item Reference Quantity Per Board 1 LCD Display 1 2 Battery 1 Recommended Purchase source www.vcdisplays. com - David Fontano / david@vcdisplay s.com http://www.eba y.com/itm/2517 66536585?_trksi d= PART_NUMBER Manufacturer Description LH154Q01-TD01 LG http://vcdisplays.com/in dex.php/inventory/lgdisplay/lh154q01-td01detail S107-19 or 652030 Syma 3.7V 240mAh Li-Po Battery for SYMA S026 RC Remote Quadcopter (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 42 FPGA-EB-02007-1.0 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide p2057872.m274 9.l2649&ssPage Name=STRK%3A MEBIDX%3AIT 3 J17, J19, J25, J26, J27, J28 30 - SPN02SXCN-RC Sullins Connector Solutions CONN JUMPER SHORTING 2MM GOLD (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-EB-02007-1.0 43 iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide Revision History Date Version May 2017 1.0 Change Summary Initial release. (c) 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 44 FPGA-EB-02007-1.0 7th Floor, 111 SW 5th Avenue Portland, OR 97204, USA T 503.268.8000 www.latticesemi.com