ICE40UP5K-MDP-EVN - LATTICE SEMICONDUCTOR

iCE40 UltraPlus Mobile Development

Platform

Evaluation Board User Guide

FPGA-EB-02007 Version 1.0

May 2017

iCE40 UltraPlus Mobile Development Platform 
Evaluation Board User Guide 
© 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.  
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
2    FPGA-EB-02007-1.0 
Contents 
Introduction .......................................................................................................................................................................... 4 
1. Features ........................................................................................................................................................................ 5 
2. Power and Battery ........................................................................................................................................................ 8 
2.1. Power Source ...................................................................................................................................................... 8 
2.2. Current Measurement Test Points ...................................................................................................................... 8 
2.3. Battery Management and 4.2 V Regulator.......................................................................................................... 8 
3. Clock Sources ................................................................................................................................................................ 9 
4. Software Requirements .............................................................................................................................................. 10 
5. Demonstrations .......................................................................................................................................................... 11 
5.1. Mobile Display Demonstration on U1 ............................................................................................................... 11 
5.2. Audio Microphone Demonstrations on U2 ....................................................................................................... 11 
5.3. RGB LED Demonstration on U3 ......................................................................................................................... 11 
5.4. Sensor Demonstrations on U3 .......................................................................................................................... 12 
5.5. Face Recognition Demonstration on U4 ........................................................................................................... 12 
6. Board Configuration and Programming ...................................................................................................................... 14 
6.1. Jumpers and Switches ....................................................................................................................................... 14 
6.2. Programming the iCE40 Devices Configuration Memory (CRAM) .................................................................... 16 
6.3. Programming Onboard SPI Flash ....................................................................................................................... 17 
7. Communication Channels ........................................................................................................................................... 19 
7.1. USB .................................................................................................................................................................... 19 
7.2. Bluetooth ........................................................................................................................................................... 19 
8. Ordering Information .................................................................................................................................................. 20 
References .......................................................................................................................................................................... 21 
Standards Documents ..................................................................................................................................................... 21 
Lattice Semiconductor Documents ................................................................................................................................. 21 
Technical Support Assistance........................................................................................................................................... 21 
Appendix A. iCE40 UltraPlus Mobile Development Board Schematics ............................................................................... 22 
Appendix B. iCE40 UltraPlus Mobile Development Board Bill of Materials ........................................................................ 36 
Accessories ..................................................................................................................................................................... 42 
Revision History ................................................................................................................................................................... 44 

  iCE40 UltraPlus Mobile Development Platform 
  Evaluation Board User Guide 
 
© 2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are 
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
FPGA-EB-02007-1.0    3 
Figures 
Figure 1.1. iCE40 UltraPlus Mobile Development Platform Board (Top Side) ...................................................................... 6 
Figure 1.2. iCE40 UltraPlus Mobile Development Platform Board (Bottom Side) ................................................................ 7 
Figure 2.1. Power Block Diagram .......................................................................................................................................... 8 
Figure 3.1. Clock Sources for the iCE40 UltraPlus MDP Board ............................................................................................. 9 
Figure 5.1. Rework Resistor Positions Described in Parallel Video Bus Configuration ....................................................... 13 
Figure 6.1. Board Configuration for Programming iCE40 UltraPlus Device “U1” ............................................................... 15 
Figure 6.2. Programming iCE40 Devices on Board.............................................................................................................. 16 
Figure 6.3. Programming SPI Flash on Board ...................................................................................................................... 17 
Figure A.8.1. Block Diagram ................................................................................................................................................ 22 
Figure A.8.2. iCE40UP5K FPGA A - Display .......................................................................................................................... 23 
Figure A.8.3. iCE40UP5K FPGA B - Audio ............................................................................................................................ 24 
Figure A.8.4. iCE40UP5K FPGA C - Sensor ........................................................................................................................... 25 
Figure A.8.5. iCE40UP5K FPGA D - Camera ......................................................................................................................... 26 
Figure A.8.6. Common Components- SPI ............................................................................................................................ 27 
Figure A.8.7. Display Circuitry ............................................................................................................................................. 28 
Figure A.8.8. Audio Circuitry ............................................................................................................................................... 29 
Figure A.8.9. Sensor & RGB Circuitry .................................................................................................................................. 30 
Figure A.8.10. Camera Circuitry .......................................................................................................................................... 31 
Figure A.8.11. USB Programming ....................................................................................................................................... 32 
Figure A.8.12. Power Supplies ............................................................................................................................................ 33 
Figure A.8.13. Common Components ................................................................................................................................. 34 
Figure A.8.14. Battery Connector & Charger ...................................................................................................................... 35 
Tables 
Table 6.1. iCE40 UltraPlus Device Selection ....................................................................................................................... 14 
 

iCE40 UltraPlus Mobile Development Platform

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4 FPGA-EB-02007-1.0

Introduction

Thank you for choosing the Lattice iCE40 UltraPlus™ Mobile Development Platform (MDP) Board.

This MDP board is an easy-to-use platform for demonstrating various features of the iCE40 UltraPlus for mobile

applications. The MDP form-factor is similar to a mobile device (cell phone), with various sensors, display, Bluetooth

communication, and others. The board contains four individual iCE40 UltraPlus devices, each configured with a unique

set of interfaces to support multiple demonstrations.

Features that can be demonstrated using this board include:

 Mobile Display (Onboard 1.54 inch 240 x 240 RGB wearable type display with MIPI DSI interface)

 Camera (Onboard VGA 640 x 480 sensor with CSI and parallel video interface option)

 Image and facial recognition

 Microphones (Onboard Dual I2S and Dual PDM microphones with audio amp, 3.5 mm and expansion connectors)

 Voice recognition

 Audio beam forming capabilities

 Sensors (Various Mobile Type Sensors with expansion connector)

 RGB LED

 Pressure Sensor

 Compass Sensor

 Gyroscope Sensor

 Accelerometer Sensor

This guide describes how to begin using the MDP. The contents of this user guide include top-level functional

descriptions of the various portions of the evaluation board, a summary of demonstrations, descriptions of the

onboard connectors, switches, jumpers, configuration options, along with a complete set of schematics and the bill of

materials.

Note:

Static electricity can severely shorten the lifespan of electronic components. Be careful

to follow proper ESD prevention handling standards when handling and using the

iCE40 UltraPlus Mobile Development Platform Board.

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FPGA-EB-02007-1.0 5

1. Features

The iCE40 UltraPlus Mobile Development Platform development kit includes the items below.

 iCE40 UltraPlus Mobile Development Platform– PCB, case, and integrated Li-ion battery featuring:

 Four iCE40 UltraPlus devices (U1-U4 iCE5UP5K-WLCSP30) in 30-Ball WLCSP packages

 Large capacity of onboard SPI Flash memory (U37 Micron M25P80 8Mb) to store the FPGA demo bitstream for

all four iCE40 UltraPlus devices

 Example of a PCB design using 0.40 mm Ball Pitch package

 Control switches to select which of the four devices is active (only one device is active at a time)

 Standard USB cable for device programming (Lattice part number HW-USBN-2A, HW-USBN-2B or equivalent)

 RoHS-compliant packaging and process

 Key Components

 iCE40UP5K-30WLCSP (4 pieces)

 Power Regulation

 Bluetooth module

 MIPI LCD Mobile Display (1.54 inch 240 x 240 RGB LH154Q01)

 Camera image sensor OVM7692 VGA 640 x 480 (CSI and parallel video interface option)

 Microphones (Dual I2S and Dual PDM microphones with audio amp, connectors for 3.5 mm and expansion)

 RGB LED

 Sensors that include:

– Barometric pressure sensor

– Compass sensor

– 3D accelerometer and 3D gyroscope sensor

– Three-axis linear accelerometer sensor

 Pre-loaded Demo – The kit includes a pre-loaded MIPI LCD Mobile Display demo.

 USB Connector Cable – A mini-B USB port provides power, a programming interface and communication channel

for a PC to communicate directly to iCE40 devices.

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6 FPGA-EB-02007-1.0

Figure 1.1 shows the top side while Figure 1.2 on the next page shows the bottom side of the iCE40 UltraPlus Mobile

Development Platform Board indicating the specific features that are designed on the board.

Figure 1.1. iCE40 UltraPlus Mobile Development Platform Board (Top Side)

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FPGA-EB-02007-1.0 7

Figure 1.2. iCE40 UltraPlus Mobile Development Platform Board (Bottom Side)

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8 FPGA-EB-02007-1.0

2. Power and Battery

2.1. Power Source

The MDP board can be powered by three sources:

 External USB Connector J5 (5V). Green LED D8 and Yellow LED D5 lights up when power is supplied.

 External AP Header Connector J16-8 (5 V) and J16-9 (GND). Yellow LED D5 lights up when power is supplied.

 Internal 250 mAH Li-ion battery contained internal to the MDP case.

External power from USB connector J5 and AP header connector J16 are 'Diode-ORd'. If power is supplied to both

connectors, the higher voltage powers the board. When external power is not supplied, the internal Li-ion battery

contained in the case powers the board.

Power switch SW2 turns the board ON and OFF by enabling/disabling the main voltage regulator outputs of 3.3V,

2.5V, and 1.2V. Green LED D9 lights up when the 3.3V rail is active and indicates that the board is powered ON.

Figure 2.1. Power Block Diagram

2.2. Current Measurement Test Points

Each of the four FPGAs have six 1Ω resistors in series with their power inputs to allow easy current measurements

using a voltmeter and to ease reworking VCCIO voltage rails. See Appendix A. iCE40 UltraPlus Mobile Development

Board Schematics for details.

2.3. Battery Management and 4.2 V Regulator

Chip BQ24232 U15 provides automatic battery management and the board's 4.2V regulated voltage rail. The 4.2V rail

(VSUPPLY) is used to generate all of the board's other voltages. The management chip is always ON (not controlled by

power switch SW2).

When external power is not available, the management chip uses the 250 mAH Li-ion battery internal to MDP case to

generate the 4.2V rail.

When external 5V is supplied (4.6V to 6.0V), the battery is automatically charged as required. The Green LED D6 lights

during charging and turns OFF when charging is complete. Additionally, external power is used to generate the 4.2V

rail. The BQ24232 battery charging is configured with external resistors.

Default resistor configuration:

 500 mA input current limit

 200 mA charging current

 25 mA end of charging termination current threshold

 5-hour fast charge time and 30-minute pre-charge

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FPGA-EB-02007-1.0 9

3. Clock Sources

A 27 MHz oscillator is built on the Mobile Development Platform board. External clock input can also be provided to

this board depending on the J23 settings.

There are six devices sharing the same clock source that are available at the same time. These include four

iCE40UP5K(U1~U4) devices that are responsible for various demos, U43 which is a stereo audio DAC with direct drive

headphone amplifier, and U39 which is an ultra-compact size 640 x 480 image sensor.

Short Pins 2-3 leads the onboard 27 MHz clock to these devices and provides external clock source through Pin 2 and

Pin 3 (GND).

U14

On Board

27 MHz

External

Clock

Source

U1 ICE40UP5K – A

(Display Demo)

U2 ICE40UP5K – B

(Audio Demo)

U3 ICE40UP5K – C

(Sensor Demo)

U4 ICE40UP5K – D

(Camera Demo)

U43 Max9850

(Audio DAC&Amplifier, Audio Demo)

U39 OVM7692

(Image Sensor, Camera Demo)

Figure 3.1. Clock Sources for the iCE40 UltraPlus MDP Board

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10 FPGA-EB-02007-1.0

4. Software Requirements

Install the following software before you begin developing designs for the board:

 Lattice iCEcube2 2017.01 (or higher)

Used for developing your own custom designs for the iCE40 UltraPlus FPGA.

 Diamond Programmer® 3. 8 (or higher)

Used to program the iCE40 UltraPlus FPGA.

These software programs are available at the www.latticesemi.com/software. Make sure you log in to

www.latticesemi.com, otherwise these software downloads will not be visible.

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FPGA-EB-02007-1.0 11

5. Demonstrations

Four iCE40UP5K-30WLCSP (U1-U4) devices are used on the Mobile Development Platform board. The devices are

responsible for specific demonstrations. Lattice provides separate user guides that describe each demo in detail. The

documents cover board configuration and step-by-step instructions. Please refer to the relevant documents for more

details.

The following sections describe the Mobile Development Platform board demos.

5.1. Mobile Display Demonstration on U1

This demo showcases the ability of iCE40 UltraPlus to drive a small wearable display and buffer one full image frame.

Key components for this demo include:

 U1 iCE40UP5K-30WLCSP

 J2 Display connector for MIPI LCD display (MIPI LCD Display, 1.4” LH154Q01 is included in the kit.)

 U11 Display backlight driver

 U13 1.8V and 3.0V voltage regulator

Note:

Be careful with the LCD display ribbon, it is fragile and can be damaged!

5.2. Audio Microphone Demonstrations on U2

FPGA U2 is optimized for microphone related demonstrations, such as audio beam. The board contains two I2S

microphones, two PDM microphones, a 3.5 mm audio jack driven by a MAX9850 headphone audio amplifier, and an

expansion connector allowing up to seven microphones used in an array. This demo shows the capability of picking up

human voice and driving the output on the speaker with the same quality, irrespective of where the voice is originating

from within a room.

Key components for this demo include:

 U2 iCE40UP5K-30WLCSP

 U12/U19 I2S omnidirectional microphone with Bottom Port and Analog Output

 U94/U95 PDM omnidirectional microphone with Bottom Port and Analog Output

 U43 Audio DAC with headphone amplifier.

 J34 3.5 mm audio jack for analog output

 J15 Expansion connector supporting up to seven microphones.

 J25 Header used to configure FPGA to microphone connections

5.3. RGB LED Demonstration on U3

This demo showcases the capability of ICE40-UltraPlus to control and drive an RGB LED. A mobile app software GUI tool

is provided to allow a user to remotely control the LED via a phone or tablet over Bluetooth. The features of the demo

include:

 Ability to control the color of the LED from a color palette.

 Ability to control the brightness of the LED.

 Ability to control the ON/OFF time of the LED – thereby creating a pulsating breathing effect.

Key components for this demo include:

 U3 iCE40UP5K-30WLCSP

 D13 RGB LED

 U30 Bluetooth Module used for remote control

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12 FPGA-EB-02007-1.0

It is recommended to download the RGB LED software GUI which interfaces with the MDP. This GUI allows you to

control the RGB LED for color, brightness, blinking and ‘breathing’. Download the PC or MAC version of the GUI at

www.latticesemi.com/ice40ultraplusmdp.

5.4. Sensor Demonstrations on U3

This demo showcases the capability of iCE40 UltraPlus to act as a sensor hub.

Key components for this demo include:

 U3 iCE40UP5K-30WLCSP.

 U22 Digital barometric pressure sensor

 U35 High performance e-compass 3D accelerometer and 3D magnetometer

 U36 3D accelerometer and 3D gyroscope

 U38 3-axis "pico" accelerometer

5.5. Face Recognition Demonstration on U4

This demo showcases the capability of ICE40-UltraPlus to detect and react to a general human face.

Key components for this demo include:

 U4 iCE40UP5K-30WLCSP.

 U39 Image Sensor OVM7692.

 U16 Camera Expansion Connector.

 U44 1.5V and 2.8V voltage regulator.

This demo uses the VGA (640 x 480) sensor OVM7692 U39 or the camera expansion connector U16. The default

interface uses CSI2, however, the interface can be configured for 3.3 V parallel video interface to support the facial

recognition demo with the following rework:

1. Remove resistors: R15, R29, R30, R47, R73, R90, R91, R100, R125, R126, R127, R142, R143, R149, R150, R154,

R155.

2. Install 0 Ω resistors (or short with solder blob): R31, R32, R43, R52, R53, R54, R55, R56.

3. Verify resistors installed: R22, R159, R160.

4. If using Xtal U14 as clock source Jumper J23-2 and 3 else J23-2 should be open.

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FPGA-EB-02007-1.0 13

Figure 5.1 shows the resistors of the rework. Resistors highlighted in red rectangle need to be removed; resistors

highlighted in green rectangle need to install 0 Ω resistors; blue highlights show the resistors needing installation

verification.

Figure 5.1. Rework Resistor Positions Described in Parallel Video Bus Configuration

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14 FPGA-EB-02007-1.0

6. Board Configuration and Programming

The iCE40 UltraPlus Mobile Development Board has four iCE40 devices. Each device serves specific demo purposes. As there

is only one USB to SPI bridge chip used onboard, programming different iCE40 devices can be completed using combinations

of jumper and switch settings. The installed jumpers used on the MDP board have a 2 mm pin-pitch, not the standard 100-mil

style.

6.1. Jumpers and Switches

The iCE40 UltraPlus Mobile Development Board has the following jumpers:

 J19

Set these for either SPI Flash programing (both vertical) or SRAM (iCE40) programming (both horizontal), per the

silkscreen markings on the board.

 J17

To program the iCE40 UltraPlus device U1, short pins 1-2. To program any other device on the board, short pins 9-

10.

Note: Follow the silkscreen markings on the board, pins 1-2 are at the top of this header bank.

 J25

To program the iCE40 UltraPlus device U2, short pins 1-2. To program any other device on the board, short pins 9-

10.

Note: Follow the silkscreen markings on the board, pins 1-2 are at the bottom of this header bank.

 J26

To program the iCE40 UltraPlus device U3, short pins 1-2. To program any other device on the board, short pins 9-

10.

Note: follow the silkscreen markings on the board, pins 1-2 are at the bottom of this header bank.

 J28

If you are doing SPI Flash programming, short pins 1-2. Otherwise, leave all pins open.

The iCE40 UltraPlus Mobile Development Board has the following switches:

 SW5

This selects the target iCE40 UltraPlus device. Refer to Table 6.1 to select the correct device.

Table 6.1. iCE40 UltraPlus Device Selection

iCE40 UltraPlus

FPGA

Key Supported Features

SW5 (2,1)

Reference Image

Display frame buffer: 240x240 display 18-bit color (R6,G6,B6),

MIPI DSI interface

OFF, OFF

On-board stereo microphones (I2S & PDM): 7-microphone

expansion connector, headphone amp, audio output jack

OFF, ON

Sensors: RGB LED, Pressure Sensor, Gyroscope,

Accelerometer, Compass

ON, OFF

640x480 VGA Camera, MIPI CSI interface, expansion connector

utilizing single MIPI data lane

ON, ON

Use the marking on switch to determine SW5-1 and SW5-2 orientations, including the ‘ON’ direction

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FPGA-EB-02007-1.0 15

 SW9

This switch is used to add/remove the BLE module from the SPI bus. It is recommended that the BLE module be

removed from the SPI bus when the module is not in demo use.

Figure 6.1 shows the setting of jumpers and switches while trying to program iCE40 device “U1”directly.

Figure 6.1. Board Configuration for Programming iCE40 UltraPlus Device “U1”

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16 FPGA-EB-02007-1.0

6.2. Programming the iCE40 Devices Configuration Memory (CRAM)

To program iCE40 UltraPlus devices’ CRAM in Diamond Programmer:

1. Set board jumpers on J19 vertically for CRAM programming.

2. Remove board jumper J28: 1-2 for CRAM programming.

3. Use Diamond Programmer 3.8 or later.

4. Connect the iCE40 UltraPlus Mobile Development Platform board via the USB cable to a PC or MAC.

5. Start Diamond Programmer.

6. Set Device Family to iCE40 UltraPlus” and Device to “iCE40UP5K”. Refer Figure 6.2 below.

7. Be sure to perform the “Program, Verify” operation. If you select only the “Program” operation, you may get a false

positive that the device has programmed.

8. Field Programming Speed Settings should be set to “Use customer Clock Divider” and appropriate value “5” should

be set in the text box below.

9. Open the Device Properties dialog. Apply the settings highlighted.

10. Access mode: set to “CRAM programming” to allow directly programming iCE40 devices.

11. Operation: set to “Fast Program” mode.

12. Programming File: load bit stream file for demo.

13. Click OK to exit Device Properties dialog.

14. Click the Program button in Diamond Programmer to download the bit stream file.

Figure 6.2. Programming iCE40 Devices on Board

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FPGA-EB-02007-1.0 17

6.3. Programming Onboard SPI Flash

To program SPI flash in Diamond Programmer:

1. Set board jumpers on J19 horizontally for SPI Flash programming.

2. Install board jumper J28: 1-2 for SPI Flash programming.

3. Start Diamond Programmer.

4. Set Device Family to iCE40 UltraPlus” and Device to “iCE40UP5K”.

5. Be sure to do the “Program, Verify” operation. If you select only the “Program” operation, you may get a false

positive that the device has programmed.

6. Field Programming Speed Settings should be set to “Use customer Clock Divider” and appropriate value “5” should

be set in the text box below.

7. Open the Device Properties dialog. Apply the settings highlighted.

Access mode: set to “SPI Flash Programming”.

Operation: set to “SPI Flash Erase, Program, Verify” mode.

Programming File: load bit stream file for demo.

SPI Flash Options: select correct Flash chip as shown in Figure 8.3 blow.

Load from File button should be used to refresh fields such as “Data file size” and “End address(Hex)”.

8. Click OK to exit Device Properties dialog.

9. Click the Program button in Diamond Programmer to download the bit stream file.

Figure 6.3. Programming SPI Flash on Board

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18 FPGA-EB-02007-1.0

The main differences between programming ICE40 UltraPlus devices and programming SPI Flash are:

1. Board jumpers on J19: Vertical for CRAM programming and horizontal for SPI Flash programming.

2. Board jumpers J28: 1-2: Remove for CRAM programming and install for SPI Flash programming.

3. The settings in “Device Properties” dialog in Diamond Programmer.

For more information on Diamond Programmer, please refer to its user guide.

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FPGA-EB-02007-1.0 19

7. Communication Channels

To enable communication with external tools, devices or Apps on Smart phone, this board features a number of

communication channels.

7.1. USB

A USB cable from PC needs to be connected to J5 on board. This communication channel through U9 (FT2232H) is

mainly used for programing the SPI flash on board, or program the ICE devices directly depends on settings on jumper

J19.

7.2. Bluetooth

This board features a Bluetooth module U30 to enable wireless communication with external devices like smart

phones, which is very useful while need to run some APPs on smart phone in demos. This Bluetooth provide UART

channel to communicate with ICE40 devices on board.

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20 FPGA-EB-02007-1.0

8. Ordering Information

Description

Ordering Part Number

China RoHS Environment- Friendly Use Period (EFUP)

iCE40 UltraPlus Mobile Development Platform

iCE40UP5K-MDP-EVN

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FPGA-EB-02007-1.0 21

References

Standards Documents

The standards used in this document and their abbreviations are listed on the table below.

Abbreviation

Standards Publication, Organization, and Date

MIPI

MIPI Alliance, Mobile Industry Processor Interface

CSI2

MIPI Alliance, Camera Serial Interface

For more information on the specifications that are applied in this document, contact the responsible standards groups

listed on the table below.

Standards Group

Web URL

MIPI Alliance

http://www.mipi.org

Lattice Semiconductor Documents

Related documents available from your Lattice Semiconductor sales representative are listed on the table below.

Document

Title

Data Sheet DS1056

iCE40 UltraPlus Family Data Sheet

Technical Support Assistance

Submit a technical support case through www.latticesemi.com/techsupport.

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22 FPGA-EB-02007-1.0

Appendix A. iCE40 UltraPlus Mobile Development Board Schematics

Figure A.8.1. Block Diagram

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FPGA-EB-02007-1.0 23

Figure A.8.2. iCE40UP5K FPGA A - Display

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24 FPGA-EB-02007-1.0

Figure A.8.3. iCE40UP5K FPGA B - Audio

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FPGA-EB-02007-1.0 25

Figure A.8.4. iCE40UP5K FPGA C - Sensor

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26 FPGA-EB-02007-1.0

Figure A.8.5. iCE40UP5K FPGA D - Camera

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FPGA-EB-02007-1.0 27

Figure A.8.6. Common Components- SPI

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28 FPGA-EB-02007-1.0

Figure A.8.7. Display Circuitry

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-EB-02007-1.0 29

Figure A.8.8. Audio Circuitry

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

30 FPGA-EB-02007-1.0

Figure A.8.9. Sensor & RGB Circuitry

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-EB-02007-1.0 31

Figure A.8.10. Camera Circuitry

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

32 FPGA-EB-02007-1.0

Figure A.8.11. USB Programming

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-EB-02007-1.0 33

Figure A.8.12. Power Supplies

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

34 FPGA-EB-02007-1.0

Figure A.8.13. Common Components

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-EB-02007-1.0 35

Figure A.8.14. Battery Connector & Charger

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

36 FPGA-EB-02007-1.0

Appendix B. iCE40 UltraPlus Mobile Development Board Bill of

Materials

Item

Reference

Qty

Part

PART_NUMBER

Manufacturer

Description

C1, C6, C9, C12, C88,

C98, C102, C106,

C108, C111, C115,

C117, C119, C122,

C124, C127

10n

GRM033R61C10

3KA12D

Murata

CAP CER 10000PF 16V 10% X5R

0201

C2, C5, C8, C10, C13,

C34, C78, C81, C83,

C89, C99, C101, C105,

C109, C110, C114,

C120, C121, C126,

C133

0.1u

GRM033R61A10

4KE15D

Murata

CAP CER 0.1UF 10V X5R 0201

C3, C4, C11, C14, C35,

C53, C54, C55, C57,

C59, C61, C79, C80,

C82, C84, C93, C97,

C103, C107, C112,

C116, C118, C123,

C128

885012105012

Wurth

CAP CER 1UF 10V X5R 0402

C7, C73, C104, C113,

C125

10u

CL05A106MP5N

UNC

Samsung

CAP CER 10UF 10V X5R 0402

C15

1uF

C1005X5R1C105

K050BC

TDK

CAP CER 1UF 16V 10% X5R

0402

C16

100n

885012205037

Wurth

CAP CER 0.1UF 16V X7R 0402

C17, C19, C20, C22,

C24, C25, C26, C28,

C29, C32, C33, C36,

C38, C39, C44, C47,

C48, C49, C56, C60,

C62, C63, C75, C76,

C77, C85, C86, C87,

C92, C100, C134,

C135, C313, C409,

C412, C414, C417,

C418

0.1u

885012105010

Wurth

CAP CER 0.1UF 10V X5R 0402

C18, C410

47u

TCJB476M010R

0070

AVX

CAP TANT POLY 47UF 10V 1210

C21, C27, C31, C40,

C45, C400

10u

CL10A106MQ8N

NNC

Samsung

CAP CER 10UF 6.3V X5R 0603

C23, C37

33p

885012005058

Wurth

CAP CER 33PF 50V NP0 0402

C30, C43, C64

4.7u

CC0603KRX5R6B

B475

Yageo

CAP CER 4.7UF 10V X5R 0603

C41, C42, C407

10u

CL10X106MP8N

RNC

Samsung

CAP CER 10UF 10V X6S 0603

C46, C413

0.1u

885012105010

Wurth

CAP CER 0.1UF 10V X5R 0402

C50

10u

CL10X106MP8N

RNC

Samsung

CAP CER 10UF 10V X6S 0603

C51

2.2u

C1005X5R1C225

K050BC

TDK

CAP CER 2.2UF 16V 10% X5R

0402

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-EB-02007-1.0 37

Item

Reference

Qty

Part

PART_NUMBER

Manufacturer

Description

C52, C91, C129, C130

0.47u

C1005X5R1E474

K050BB

CAP CER 0.47UF 25V X5R 0402

C58, C94, C96

0.1uF

885012105016

Wurth

CAP CER 0.1UF 16V X5R 0402

C65

0.22u

885012206048

Wurth

CAP CER 0.22UF 16V X7R 0603

C66

0.1uF

885012105016

Wurth

CAP CER 0.1UF 16V X5R 0402

C67, C68, C69

1uF

GRM155R61C10

5KE01D

Murata

CAP CER 1UF 16V 10% X5R

0402

C70

1uF

885012208093

Wurth

CAP CER 1UF 50V X7R 1206

C71

1uF

GRM155R61C10

5KE01D

Murata

CAP CER 1UF 16V 10% X5R

0402

C72

100nF

885012105016

Wurth

CAP CER 0.1UF 16V X5R 0402

C74

100n

885012105016

Wurth

CAP CER 0.1UF 16V X5R 0402

C90, C95

4.7uF

C1005X5R1A475

K050BC

TDK

CAP CER 4.7UF 10V 10% X5R

0402

C168, C169, C170

0.1uF

885012105016

Wurth

CAP CER 0.1UF 16V X5R 0402

C415, C416

10u

CL10X106MP8N

RNC

Samsung

CAP CER 10UF 10V X6S 0603

D1, D11, D12, D14

GREEN

150060GS75000

Wurth

LED GREEN CLEAR 0603 SMD

Green

150060GS75000

Wurth

LED GREEN CLEAR 0603 SMD

D3, D4

PMEG201

0AEH

PMEG2010AEH,

115

NXP

Semiconductor

DIODE SCHOTTKY 20V 1A

SOD123F

YELLOW

150060YS75000

Wurth

LED YELLOW RECT CLEAR 0603

GREEN

150060GS75000

Wurth

LED SMARTLED GREEN 570NM

0603

Red

150060SS75000

Wurth

LED RED CLEAR 0603 SMD

D8, D9

Green

150060VS75000

Wurth

LED SUPER GREEN CLEAR 0603

SMD

D13

150141M

173100

150141M17310

Wurth

LED RGB CLEAR 1411 SMD

503548-

1220

5035481220

Molex Inc

CONN RCPT BTB 12POS DL

VERT SMD

J3, J11, J12

GND

608001162100

Wurth

USB PWR

65100516121

Wurth

CONN COM TYPE B MINI USB

SMD 5P

PMOD

Connecto

CONN HEADER .100 DUAL STR

10POS

J13, J15

2x5

HEADER

61001021121

Wurth

CONN HEADER VERT DUAL

10POS 2.54

J16

INTERCO

NNECT

62101021921

Wurth

2.00 mm SMT Dual Pin Header

J17, J26, J27

iCEA

Control

62101021921

Wurth

2.00 mm SMT Dual Pin Header

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

38 FPGA-EB-02007-1.0

Item

Reference

Qty

Part

PART_NUMBER

Manufacturer

Description

J18

BLE

PROG SEL

62000311121

Wurth

2.00 mm THT Pin Header

J19

A3A-

04PA-

2SV(71)

A3A-4PA-

2SV(71)

Hirose

CONN HEADER 2mm DUAL STR

4POS SMT

J23

Clock

Source

Sel

62000311121

Wurth

2.00 mm THT Pin Header

J25

iCEA

Control

57202-G52-06LF

Amphenol FCI

12 Positions Header,

Unshrouded Connector

0.079" (2.00mm) Surface

Mount Gold, GXT™

J28

Common

Control

62101021921

Wurth

2.00 mm SMT Dual Pin Header

J30, J32

CON24A

—

J31, J33

CON24A

—

J34

CUI_sj-

3524-

SMT

SJ-3524-SMT-TR

CUI Inc.

CONN AUDIO JACK 3.5MM

STEREO SMD

L1, L2, L3

600 ohm,

500 mA

MMZ1608R601

TDK

FERRITE BEAD 600 OHM 0603

1LN

22uH

AIML-0805HC-

220M-T

Abracon

Corporation

HIGH CURRENT CHIP IND

22.0UH 20%

R1, R84, R85, R86

100

RC1005J101CS

Samsung

RES 100 OHM 1/16W 5% 0402

R2, R49, R69, R70

2k2

RC1005J222CS

Samsung

RES 2.2K OHM 1/16W 5% 0402

10K

ERJ-2RKF1002X

Panasonic

RES 10K OHM 1/10W 1% 0402

SMD

R4, R6, R7, R8, R12,

R62, R63, R65, R200

10k

ERJ-2RKF1002X

Panasonic

RES 10K OHM 1/10W 1% 0402

SMD

ERJ-3GEY0R00V

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0603

DNP

—

R10

2k2

RC1005J222CS

Samsung

RES 2.2K OHM 1/16W 5% 0402

R11, R14, R79, R97,

R166, R167

10k

ERJ-2RKF1002X

Panasonic

RES 10K OHM 1/10W 1% 0402

SMD

R13, R29, R35, R37,

R40, R76, R77, R205,

R206, R224

ERJ-2GE0R00X

Panasonic

RES 0.0 OHM 1/10W 0402 SMD

R15, R19, R22, R30,

R47, R56, R59, R60,

R81, R83, R96, R141,

R142, R143, R147,

R148, R149, R150,

R152, R153, R154,

R155, R157, R158,

R159, R160, R168,

R169, R170, R171,

R172, R173, R174,

ERJ-3GEY0R00V

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0603

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-EB-02007-1.0 39

Item

Reference

Qty

Part

PART_NUMBER

Manufacturer

Description

R175, R176, R213,

R218, R221, R222

R16, R17

RC1005J100CS

Samsung

RES 10 OHM 1/16W 5% 0402

R18

12k

RC1005F123CS

Samsung

RES 12K OHM 1/16W 1% 0402

R20, R50, R145, R146

RC1005J102CS

Samsung

RES 1K OHM 1/16W 5% 0402

R21, R24, R25, R26,

R27, R28

RC1005J000CS

Samsung

RES 0.0 OHM 1/16W JUMP

0402

R23

470

RC1005J471CS

Samsung

RES 470 OHM 1/16W 5% 0402

R31

ERJ-2GE0R00X

Panasonic

RES 0.0 OHM 1/10W 0402 SMD

R32, R43, R52, R53,

R54, R55, R107, R108,

R110, R132, R133,

R134, R135, R136,

R137, R138, R139,

R140, R162, R163,

R164, R165

ERJ-3GEY0R00V

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0603

R33, R36, R72

ERJ-1GEJ300C

Panasonic

RES 30 OHM 1/20W 5% 0201

SMD

R34, R38, R39, R71

ERJ-1GEF1001C

Panasonic

RES SMD 1K OHM 1% 1/20W

0201

R41

10k

ERJ-2GEJ103X

Panasonic

RES SMD 10K OHM 5% 1/10W

0402

R42

ERJ-2GEJ180X

Panasonic

RES SMD 18 OHM 5% 1/10W

0402

R44

ERJ-2GE0R00X

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0402

R45, R48, R67, R68,

R75, R223

ERJ-2GE0R00X

Panasonic

RES 0.0 OHM 1/10W 0402 SMD

R46

ERJ-1GEJ300C

Panasonic

RES 30 OHM 1/20W 5% 0201

SMD

R51

ERJ-2GEJ102X

Panasonic

RES SMD 1K OHM 5% 1/10W

0402

R57, R58

470

ERJ-3GEYJ471V

Panasonic

RES SMD 470 OHM 5% 1/10W

0603

R61

0.1

RUT1005FR100C

Samsung

RES SMD 0.1 OHM 1% 1/10W

0402

R64

ERJ-2GEJ202X

Panasonic

RES SMD 2K OHM 5% 1/10W

0402

R66, R87, R203

100k

RC1005J104CS

Samsung

RES SMD 100K OHM 5% 1/16W

0402

R73, R100

100

ERJ-1GEF1000C

Panasonic

RES SMD 100 OHM 1% 1/20W

0201

R74, R78, R98, R99

4.7K

ERJ-3EKF4701V

Panasonic

RES SMD 4.7K OHM 1% 1/10W

0603

R80, R82

ERJ-3GEY0R00V

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0603

R88, R89, R101, R102

4.7k

ERJ-2RKF4701X

Panasonic

RES SMD 4.7K OHM 1% 1/10W

0402

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

40 FPGA-EB-02007-1.0

Item

Reference

Qty

Part

PART_NUMBER

Manufacturer

Description

R90, R91

510k

ERJ-2RKF5103X

Panasonic

RES SMD 510K OHM 1% 1/10W

0402

R92

4.32K

ERJ-2RKF4321X

Panasonic

RES SMD 4.32K OHM 1%

1/10W 0402

R93

2.94K

ERJ-2RKF2941X

Panasonic

RES SMD 2.94K OHM 1%

1/10W 0402

R94

3.57K

ERJ-2RKF3571X

Panasonic

RES SMD 3.57K OHM 1%

1/10W 0402

R95

DNL

—

R103, R104

0.5

RL0603FR-

070R5L

Yageo

RES SMD 0.5 OHM 1% 1/10W

0603

R105, R106

4.7k

ERJ-3EKF4701V

Panasonic

RES SMD 4.7K OHM 1% 1/10W

0603

R109, R111, R113,

R115, R116

ERJ-3GEY0R00V

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0603

R112, R114

ERJ-3GEY0R00V

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0603

R117, R118, R120,

R121, R122, R123,

R124, R125, R126,

R127, R128, R129,

R130, R131

ERJ-3GEY0R00V

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0603

R119

10k

ERJ-3EKF1002V

Panasonic

RES SMD 10K OHM 1% 1/10W

0603

R178, R179, R180,

R181, R182, R183,

R184, R185, R186,

R187, R188, R189,

R190, R191, R192,

R193, R194, R195,

R196, R197, R198,

R199, R201, R202

ERJ-3GEYJ1R0V

Panasonic

RES SMD 1 OHM 5% 1/10W

0603

R207, R208

ERJ-2GE0R00X

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0402

R219, R220

ERJ-3GEY0R00V

Panasonic

RES SMD 0.0 OHM JUMPER

1/10W 0603

100

SW2

PWR

EG1218

E-Switch

SWITCH SLIDE SPDT 30V.2A PC

MNT

101

SW4, SW6, SW7

TL1015AF160QG

E-Switch

SWITCH TACTILE SPST-NO

0.05A 12V

102

SW5, SW8

SW_SPST

416131160802

Wurth

DIP SWITCH 1.27MM PITCH

2POL 24V

103

SW9

SW_SPST

416131160806

Wurth

DIP SWITCH 1.27MM PITCH

6POL 24V

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-EB-02007-1.0 41

Item

Reference

Qty

Part

PART_NUMBER

Manufacturer

Description

104

TP1, TP2, TP3, TP26,

TP27, TP28, TP29,

TP30, TP31, TP32,

TP33, TP34, TP35,

TP36, TP37, TP38,

TP39, TP40, TP41,

TP42, TP43, TP44,

TP45, TP46, TP47,

TP48, TP49, TP50,

TP51, TP52, TP53,

TP54, TP55, TP56,

TP57, TP58, TP59,

TP60, TP61, TP62,

TP63, TP64, TP65,

TP66, TP67, TP68,

TP69, TP70, TP71,

TP72, TP73, TP74,

TP75, TP76, TP77,

TP78, TP79, TP80,

TP81, TP82, TP83,

TP84, TP85, TP86,

TP87, TP88, TP89,

TP90, TP91, TP92

T POINT

—

105

TP12, TP13

80_MIL_

PAD

—

TEST POINT PC MINIATURE

SMT

106

TP22, TP23, TP24,

TP25

T POINT

—

107

U1, U2, U3, U4

iCE5UP5K

WLCSP30

iCE5UP5K-

UWG30

Lattice

—

108

93LC56BT

-I/OT

93LC56BT-I/OT

Microchip

Technology

IC EEPROM 2KBIT 2MHZ

SOT23-6

109

XC6222B

331MR-G

XC6222B331MR

-G

Torex

Semiconductor

Ltd

IC REG LDO 3.3V 0.7A SOT25

110

FT2232H

FT2232HL

FTDI

IC USB HS DUAL UART/FIFO 64-

LQFP

111

U10

AP7312-

1218W6-

AP7312-

1218W6-7

Diodes Inc

IC REG LDO 1.2V/1.8V 0.15A

SOT26

112

U11

TPS61061

TPS61061DRBR

IC LED DRIVER WHITE BCKLGT

8SON

113

U12, U19

INMP441

INMP441ACEZ

Invensense

Omnidirectional Microphone

with bottom port and I2S

digital port

114

U13

MIC5320

MIC5320-

PGYMT TR

Micrel Inc

IC REG LDO 3V/1.8V 0.15A

6TMLF

115

U14

ASFLMB-

27.000M

HZ-LC-T

ASFLMB-

27.000MHZ-LC-T

ABRACON

OSC MEMS 27.000MHZ CMOS

SMD

116

U15

BQ24232

BQ24232RGTT

IC LI+ CHARGER PWR MGMT

16QFN

117

U16

Hirose -

FX12 - 40

Pos

FX12B-40P-

0.4SV

Hirose

CONN PLUG 40POS 0.4MM

SMD SHIELD

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

42 FPGA-EB-02007-1.0

Item

Reference

Qty

Part

PART_NUMBER

Manufacturer

Description

118

U22

BMP180

Bosch

SENSOR PRESSURE ABS

119

U30

SeeedBLE

113050012

Seeed

Low cost ARM cortex-m0 based

module for Bluetooth module

120

U35

LSM303D

LHC

LSM303DLHC

ST Micro

ACCELEROMETER/MAGNETOM

ETER 14LGA

121

U36

LSM330D

LSM330DLC

ST Micro

ACCELEROMETER/MAGNETOM

ETER 28LGA

122

U37

M25P80

M25P80-

VMW6G

Micron

IC FLASH 8MBIT 75MHZ 8SOW

123

U38

LIS2DS12

LIS2DS12TR

STMicroelectro

nics

MEMS DIGITAL OUTPUT

MOTION SENSO

124

U39

OVM769

OVM7692-RAAA

OmniVision

SENSOR IMAGE

125

U41, U42

DG409LD

Q-T1-E3

DG409LDQ-T1-

Vishay

2 Circuit IC Switch 4:1 29 Ohm

16-TSSOP

126

U43

MAX9850

MAX9850ETI+T

Maxim

Integrated

IC AMP AUDIO .095W STER

28TQFN

127

U44

AP7346D

1528FS6-

AP7346D-

1528FS6-7

Diodes

IC REG LDO 1.5V/2.8V X2-

DFN1212

128

U90

MIC5335-

SJYMT

MIC5335-SJYMT

Micrel

IC REG LDO 3.3V/2.5V 0.3A

6TMLF

129

U93

ESDR050

ESDR0502NMUT

ON Semi

TVS DIODE 5.5VWM 6UDFN

130

U94, U95

MP34DB

MP34DB01

STMicroelectro

nics

20Hz ~ 20kHz Digital, PDM

Microphone MEMS (Silicon)

1.8V Omnidirectional (-26dB

±3dB @ 94dB SPL) Solder Pads

131

VCC_P, VCC_N

TP_S_40_

—

Square test point, 40mil inner

diameter, 63mil outer

diameter

132

12MHz

ABM3-

12.000MHZ-B2-

Abracon Corp

CRYSTAL 12MHZ 18PF SMD

133

iCE40UP Mobile

Development

Platform Board PCB

—

305-PD-16-0605

PACTRON

—

Accessories

Item

Reference

Quantity

Per Board

Recommended

Purchase source

PART_NUMBER

Manufacturer

Description

LCD Display

www.vcdisplays.

com - David

Fontano /

david@vcdisplay

s.com

LH154Q01-TD01

http://vcdisplays.com/in

dex.php/inventory/lg-

display/lh154q01-td01-

detail

Battery

http://www.eba

y.com/itm/2517

66536585?_trksi

S107-19 or

652030

Syma

3.7V 240mAh Li-Po

Battery for SYMA S026

RC Remote Quadcopter

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-EB-02007-1.0 43

p2057872.m274

9.l2649&ssPage

Name=STRK%3A

MEBIDX%3AIT

J17, J19,

J25, J26,

J27, J28

SPN02SXCN-RC

Sullins

Connector

Solutions

CONN JUMPER

SHORTING 2MM GOLD

iCE40 UltraPlus Mobile Development Platform

Evaluation Board User Guide

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

44 FPGA-EB-02007-1.0

Revision History

Date

Version

Change Summary

May 2017

1.0

Initial release.

7th Floor, 111 SW 5th Avenue

Portland, OR 97204, USA

T 503.268.8000