1
3
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
1
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▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
62
INDUCTORS
／
STANDARD INDUCTORS
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PARTS NUMBER
L B M 2 0 1 6 T 1 0 0 J △△＝Blank space
① ② ③ ④ ⑤ ⑥
①Series name
Code Series name
LBM Wound chip inductor for signal line
②Dimensions（L×W）
Code Dimensions（L×W）［mm］
2016 2.0×1.6
③Packaging
Code Packaging
T Taping
④Nominal inductance
Code
（example） Nominal inductance［μH］
R12 0.12
1R0 1.00
100 10
101 100
※R＝Decimal point
⑤Inductance tolerance
Code Inductance tolerance
J ±5％
⑥Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering only.
Type A B C
LBM2016 0.6 1.0 1.8
Unit：mm
Standard quantity [pcs]
Type L W T e Paper tape Embossed tape
LBM2016 2.0±0.2
（0.08±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
0.5±0.2
（0.02±0.008） － 2000
Unit：mm（inch）
■PARTS NUMBER
●LBM2016 type
LBM 2016TR12J RoHS 0.12 ±5％30 600 0.13 610 25.2
LBM 2016TR15J RoHS 0.15 ±5％30 550 0.15 570 25.2
LBM 2016TR18J RoHS 0.18 ±5％30 500 0.15 560 25.2
LBM 2016TR22J RoHS 0.22 ±5％30 450 0.20 520 25.2
LBM 2016TR27J RoHS 0.27 ±5％30 425 0.21 510 25.2
LBM 2016TR33J RoHS 0.33 ±5％30 400 0.21 490 25.2
LBM 2016TR39J RoHS 0.39 ±5％30 375 0.26 440 25.2
LBM 2016TR47J RoHS 0.47 ±5％30 350 0.26 430 25.2
LBM 2016TR56J RoHS 0.56 ±5％30 300 0.29 410 25.2
LBM 2016TR68J RoHS 0.68 ±5％30 270 0.32 400 25.2
LBM 2016TR82J RoHS 0.82 ±5％30 250 0.34 390 25.2
LBM 2016T1R0J RoHS 1.0 ±5％30 220 0.38 385 7.96
LBM 2016T1R2J RoHS 1.2 ±5％30 180 0.41 370 7.96
LBM 2016T1R5J RoHS 1.5 ±5％30 135 0.47 350 7.96
LBM 2016T1R8J RoHS 1.8 ±5％30 100 0.48 345 7.96
LBM 2016T2R2J RoHS 2.2 ±5％30 75 0.54 340 7.96
LBM 2016T2R7J RoHS 2.7 ±5％30 55 0.59 310 7.96
LBM 2016T3R3J RoHS 3.3 ±5％30 48 0.68 290 7.96
LBM 2016T3R9J RoHS 3.9 ±5％30 43 0.74 275 7.96
LBM 2016T4R7J RoHS 4.7 ±5％30 40 0.78 270 7.96
LBM 2016T5R6J RoHS 5.6 ±5％25 36 0.88 255 7.96
LBM 2016T6R8J RoHS 6.8 ±5％25 33 0.97 240 7.96
LBM 2016T8R2J RoHS 8.2 ±5％25 30 1.1 225 7.96
LBM 2016T100J RoHS 10 ±5％25 27 1.2 215 2.52
LBM 2016T120J RoHS 12 ±5％25 23 1.4 200 2.52
LBM 2016T150J RoHS 15 ±5％25 20 1.5 190 2.52
LBM 2016T180J RoHS 18 ±5％25 18 2.5 150 2.52
LBM 2016T220J RoHS 22 ±5％25 17 2.8 140 2.52
LBM 2016T270J RoHS 27 ±5％25 16 3.2 130 2.52
LBM 2016T330J RoHS 33 ±5％25 15 3.6 125 2.52
LBM 2016T390J RoHS 39 ±5％20 14 3.9 120 2.52
LBM 2016T470J RoHS 47 ±5％20 13 4.1 115 2.52
LBM 2016T560J RoHS 56 ±5％20 12 5.9 95 2.52
LBM 2016T680J RoHS 68 ±5％20 11 7.0 90 2.52
LBM 2016T820J RoHS 82 ±5％20 10 7.7 85 2.52
LBM 2016T101J RoHS 100 ±5％15 9.0 8.0 80 0.796
Rated current
［mA］（max.）
Measuring
frequency
［MHz］
Q
（min.）
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（±30％）
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
REFLOW
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-01
WIRE-WOUND CHIP INDUCTORS (LB SERIES)，
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)，
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PACKAGING
①Minimum Quantity
Type Standard Quantity ［pcs］
Paper Tape Embossed Tape
LB C3225
CB C3225 － 1000
LB 3218 － 2000
LB R2518
LB C2518
LB 2518
CB 2518
CB C2518
－ 2000
LBM2016
LB C2016
LB 2016
CB 2016
CB C2016
－ 2000
LB 2012
LB C2012
LB R2012
CB 2012
CB C2012
－ 3000
CB L2012 4000 －
LB 1608 4000 －
LBMF1608
CBMF1608 － 3000
②Tape material
●Embossed tape
③Taping Dimensions
●Embossed Tape （0.315 inches wide）
●Card board carrier tape（ 0.315 inches wide）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-01
Type Chip cavity Insertion pitch Tape thickness
A B F T K
LBM2016 1.75±0.1
（0.069±0.004）
2.1±0.1
（0.083±0.004）
4.0±0.1
（0.157±0.004）
0.3±0.05
（0.012±0.002）
1.9max.
（0.075max.）
LB C3225
CB C3225
2.8±0.1
（0.110±0.004）
3.5±0.1
（0.138±0.004）
4.0±0.1
（0.157±0.004）
0.3±0.05
（0.012±0.002）
4.0max.
（0.157max.）
LB 3218 2.1±0.1
（0.083±0.004）
3.5±0.1
（0.138±0.004）
4.0±0.1
（0.157±0.004）
0.3±0.05
（0.012±0.002）
2.2max.
（0.087max.）
LB 2518
CB 2518
LB C2518
CB C2518
LB R2518
2.15±0.1
（0.085±0.004）
2.7±0.1
（0.106±0.004）
4.0±0.1
（0.157±0.004）
0.3±0.05
（0.012±0.002）
2.2max.
（0.087max.）
LB 2016
CB 2016
LB C2016
CB C2016
1.75±0.1
（0.069±0.004）
2.1±0.1
（0.083±0.004）
4.0±0.1
（0.157±.004）
0.3±0.05
（0.012±0.002）
1.9max.
（0.075max.）
LB 2012
CB 2012
LB C2012
CB C2012
LB R2012
1.45±0.1
（0.057±0.004）
2.25±0.1
（0.089±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.010±0.002）
1.45max.
（0.057max.）
CB L2012 1.55±0.1
（0.061±0.004）
2.3±0.1
（0.091±0.004）
4.0±0.1
（0.157±0.004）
1.1max.
（0.043max.）
1.1max.
（0.043max.）
LB 1608 1.0±0.1
（0.039±0.004）
1.8±0.1
（0.071±0.004）
4.0±0.1
（0.157±0.004）
1.1max.
（0.043max.）
1.1max.
（0.043max.）
LBMF1608
CBMF1608
1.1±0.1
（0.043±0.004）
1.9±0.1
（0.075±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.010±0.002）
1.2max.
（0.047max.）
Unit：mm（inch）
④Leader and Blank Portion
⑤Reel Size
⑥Top Tape Strength
The top tape requires a peel-off force 0.2 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-01
WIRE-WOUND CHIP INDUCTORS (LB SERIES),
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES),
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■RELIABILITY DATA
1.Operating temperature Range
Specified Value
LB, LBC, LBR, LBMF Series
－40～＋105℃（Including self-generated heat）
CB, CBC, CBL, CBMF Series
LBM Series
2. Storage Temperature Range（after soldering）
Specified Value
LB, LBC, LBR, LBMF Series
－40～＋85℃ CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
LB, CB Series：
Please refer the term of "7. storage conditions" in precautions.
3.Rated Current
Specified Value
LB, LBC, LBR, LBMF Series
Within the specified tolerance CB, CBC, CBL, CBMF Series
LBM Series
4.Inductance
Specified Value
LB, LBC, LBR, LBMF Series
Within the specified tolerance CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBMF・CBMF・LBM Series
Measuring equipmet ：LCR Mater（HP4285A or its equivalent）
5.Q
Specified Value
LB, LBC, LBR, LBMF Series －
CB, CBC, CBL, CBMF Series
LBM Series Within the specified tolerance
Test Methods and
Remarks
LBM Series
Measuring equipment : LCR Mater（HP4285A or its equivalent）
6.DC Resisitance
Specified Value
LB, LBC, LBR, LBMF Series
Within the specified tolerance CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks Measuring equipment : DC Ohmmeter （HIOKI 3227 or its equivalent）
7.Self-Resonant Frequency
Specified Value
LB, LBC, LBR, LBMF Series
Within the specified tolerance CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks Measuring equipment : Impedance analyzer （HP4291A or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-01
8.Temperature Characteristic
Specified Value
LBM2016 Inductance change : Within±5％
LB1608 LB2012 LBR2012 CB2012 Inductance change : Within±20％
CBL2012 LB2016 CB2016 LB2518
LBR2518 CB2518 LBC3225 CBC3225
LBMF1608 CBMF1608 LBC2016 CBC2016 Inductance change : Within±25％
LBC2518 CBC2518 LB3218
LBC2012 CBC2012 Inductance change : Within±35％
Test Methods and
Remarks
Change of maximum inductance deviation in step 1-5
Step Temperature（℃）
LB, CB Series
1 20
2 －40
3 20（Reference temperature）
4 ＋85（Maximum operating temperature）
5 20
9.Rasistance to Flexure of Substrate
Specified Value
LB, LBC, LBR, LBMF Series
No damage. CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
Warp : 2mm（LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF Series）
Test substrate : Board according to JIS C0051
Thickness : 0.8mm（LB・LBMF・CBMF1608）
: 1.0ｍｍ（Others）
10.Body Strength
Specified Value
LB, LBC, LBR, LBMF Series
No damage. CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM
Applied force : 10N
Duration : 10sec.
LB1608・LBMF1608・CBMF1608
Applied force : 5N
Duration : 10sec.
11.Adhesion of terminal electrode
Specified Value
LB, LBC, LBR, LBMF Series
No abnormality. CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF
Applied force : 10N to X and Y directions
Duration : 5 sec.
Test substrate : Printed board
LB1608・CBMF1608・LBMF1608
Applied force : 5N toX and Y directions
Dration : 5 sec.
Test substrate : Printed board
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-01
12.Resistance to vibration
Specified Value
LB, LBC, LBR, LBMF Series Inductance change : Within±10％
No significant abnormality in appearance.
CB, CBC, CBL, CBMF Series
LBM Series Inductance change : Within±5％
No significant abnormality in appearance.
Test Methods and
Remarks
LB・LBR・LBC・CB・CBC・CBL・LBM・LBMF・CBMF : According to JIS C5102 clause 8.2.
Vibration type : A
Directions : 2 hrs each in X, Y and Z directions. Total：6 hrs
Freuency range : 10 to 55 to 10 Hz（1min.）
Amplitude : 1.5mm
Mounting method : Soldering onto printed board
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48
hs.
13.Drop test
Specified Value
LB, LBC, LBR, LBMF Series
－
CB, CBC, CBL, CBMF Series
LBM Series
14.Solderability
Specified Value
LB, LBC, LBR, LBMF Series
At least 90％ of surface of terminal electrode is covered by new CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF：
Solder temperature : 245±5℃
Duration : 5±0.5sec
Flux : Methanol solution with 25％ of colophony
15.Resistance to soldering
Specified Value
LB, LBC, LBR, LBMF Series Inductance change : Within±10％
CB, CBC, CBL, CBMF Series
LBM Series Inductance change : Within±5％
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF：
3 times of reflow oven at 230℃ MIN for 40sec. with peak temperature at 260 ℃ for 5sec.
16.Resisitance to solvent
Specified Value
LB, LBC, LBR, LBMF Series
No significant abnormality in appearance CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
Solvent temperature : Room temperature
Type of solvent : Isopropyl alcohol
Cleaning conditions : 90s. Immersion and cleaning.
17.Thermal shock
Specified Value
LB, LBC, LBR, LBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF：－40～＋85℃, maintain times 30min. ,100 cycle
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-01
18.Damp heat life test
Specified Value
LB, LBC, LBR, LBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
Temperature : 60±2℃
Humidity : 90～95％RH
Duration : 1000 hrs
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
19.Loading under damp heat life test
Specified Value
Test Methods and
Remarks
LB, LBC, LBR, LBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
CB, CBC, CBL, CBMF Series
LBM Series
Temperature : 60±2℃
Humidity : 90～95％RH
Duration : 1000 hrs
Applied current : Rated current
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
20.High temperature life test
Specified Value
LB, LBC, LBR, LBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
Temperature : 85±2℃
Duration : 1000 hrs
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
21.Loading at high temperature life test
Specified Value
LB, LBC, LBR, LBMF Series
Inductance change : Within±10％
（LBC3225 Series : Within±20％）
No significant abnormality in appearance.
CB, CBC, CBL, CBMF Series －
LBM Series
Test Methods and
Remarks
Temperature : 85±2℃
Duration : 1000 hrs
Applied current : Rated current
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
22.Low temperature life test
Specified Value
LB, LBC, LBR, LBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
Temperature : －40±2℃
Duration : 1000 hrs
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
23.Standard condition
Specified Value
LB, LBC, LBR, LBMF Series Standard test conditions
Unless specified, Ambient temperature is 20±15℃ and the Relative
humidity is 65±20％. If there is any doubt about the test results, further
measurement shall be had within the following limits:
Ambient Temperature: 20±2℃
Relative humidity: 65±5％
Inductance value is based on our standard measurement systems.
CB, CBC, CBL, CBMF Series
LBM Series
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-01
WIRE-WOUND CHIP INDUCTORS (LB SERIES)，
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)，
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PRECAUTIONS
1．Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2．PCB Design
Precautions ◆Land pattern design
1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications.
Technical
considerations
PRECAUTIONS
【Recommended Land Patterns】
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to those products is reflow soldering only.
3．Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
considerations 1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4．Soldering
Precautions
◆Reflow soldering（ LB and CB Types）
1. For reflow soldering with either leaded or lead-free solder, the profile specified in "point for controlling" is recommended.
◆Recommended conditions for using a soldering iron
1. Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The soldering iron
should not come in contact with inductor directly.
Technical
considerations
◆Reflow soldering（ LB and CB Types）
1. Reflow profile
◆Recommended conditions for using a soldering iron
1. Components can be damaged by excessive heat where soldering conditions exceed the specified range.
5．Cleaning
Precautions ◆Cleaning conditions
Washing by supersonic waves shall be avoided.
Technical
considerations
◆Cleaning conditions
If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-01
6．Handling
Precautions
◆Handling
1. Keep the inductors away from all magnets and magnetic objects.
◆Breakaway PC boards（ splitting along perforations）
1. When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the inductors any excessive mechanical shocks.
Technical
considerations
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards（ splitting along perforations）
1. Planning pattern configurations and the position of products should be carefully performed to minimize stress.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
7．Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature：0～40℃ / Humidity：Below 70% RH
The ambient temperature must be kept below 30℃ even under ideal storage conditions, solderability of products electrodes may
decrease as time passes. For this reason,
LB type：Should be used within 6 months from the time of delivery.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
