High CMR, High Speed TTL
Compatible Optocouplers
Technical Data
6N137
HCNW137
HCNW2601
HCNW2611
HCPL-0600
HCPL-0601
HCPL-0611
HCPL-0630
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Features
• 5 kV/µs Minimum Common
Mode Rejection (CMR) at
V
CM = 50 V for HCPL-X601/
X631, HCNW2601 and
10 kV/µs Minimum CMR at
V
CM = 1000 V for HCPL-
X611/X661, HCNW2611
• High Speed: 10 MBd Typical
• LSTTL/TTL Compatible
• Low Input Current
Capability: 5 mA
• Guaranteed ac and dc
Performance over Temper-
ature: -40°C to +85°C
• Available in 8-Pin DIP,
SOIC-8, Widebody Packages
• Strobable Output (Single
Channel Products Only)
• Safety Approval
UL Recognized - 3750 V rms
for 1 minute and 5000 V rms*
for 1 minute per UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved with
VIORM = 630 V peak for
HCPL-2611 Option 060 and
VIORM = 1414 V peak for
HCNW137/26X1
• MIL-PRF-38534 Hermetic
Version Available (HCPL-
56XX/66XX)
Functional Diagram
*5000 V rms/1 Minute rating is for HCNW137/26X1 and Option 020 (6N137, HCPL-2601/11/30/31, HCPL-4661) products only.
HCPL-0631
HCPL-0661
HCPL-2601
HCPL-2611
HCPL-2630
HCPL-2631
HCPL-4661
Applications
• Isolated Line Receiver
• Computer-Peripheral
Interfaces
• Microprocessor System
Interfaces
• Digital Isolation for A/D,
D/A Conversion
• Switching Power Supply
• Instrument Input/Output
Isolation
• Ground Loop Elimination
• Pulse Transformer
Replacement
• Power Transistor Isolation
in Motor Drives
• Isolation of High Speed
Logic Systems
Description
The 6N137, HCPL-26XX/06XX/
4661, HCNW137/26X1 are
optically coupled gates that
combine a GaAsP light emitting
diode and an integrated high gain
photo detector. An enable input
allows the detector to be strobed.
The output of the detector IC is
A 0.1
µ
F bypass capacitor must be connected between pins 5 and 8.
1
2
3
4
8
7
6
5
CATHODE
ANODE
GND
V
V
CC
O
1
2
3
4
8
7
6
5
ANODE
2
CATHODE
2
CATHODE
1
ANODE
1
GND
V
V
CC
O2
V
E
V
O1
6N137, HCPL-2601/2611
HCPL-0600/0601/0611 HCPL-2630/2631/4661
HCPL-0630/0631/0661
NC
NC
LED
ON
OFF
ON
OFF
ON
OFF
ENABLE
H
H
L
L
NC
NC
OUTPUT
L
H
H
H
L
H
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
OUTPUT
L
H
TRUTH TABLE
(POSITIVE LOGIC)
SHIELD SHIELD
2
an open collector Schottky-
clamped transistor. The internal
shield provides a guaranteed
common mode transient
immunity specification of 5,000
V/µs for the HCPL-X601/X631
and HCNW2601, and 10,000 V/µs
for the HCPL-X611/X661 and
HCNW2611.
This unique design provides
maximum ac and dc circuit
isolation while achieving TTL
compatibility. The optocoupler ac
and dc operational parameters
are guaranteed from -40°C to
+85°C allowing troublefree
system performance.
The 6N137, HCPL-26XX, HCPL-
06XX, HCPL-4661, HCNW137,
and HCNW26X1 are suitable for
high speed logic interfacing,
input/output buffering, as line
receivers in environments that
conventional line receivers
cannot tolerate and are recom-
mended for use in extremely high
ground or induced noise
environments.
Selection Guide
Widebody
Minimum CMR 8-Pin DIP (300 Mil) Small-Outline SO-8 (400 Mil) Hermetic
Input Single
On- Single Dual Single Dual Single and Dual
dV/dt V
CM Current Output Channel Channel Channel Channel Channel Channel
(V/µs) (V) (mA) Enable Package Package Package Package Package Packages
NA NA 5 YES 6N137 HCPL-0600 HCNW137
NO HCPL-2630 HCPL-0630
5,000 50 YES HCPL-2601 HCPL-0601 HCNW2601
NO HCPL-2631 HCPL-0631
10,000 1,000 YES HCPL-2611 HCPL-0611 HCNW2611
NO HCPL-4661 HCPL-0661
1,000 50 YES HCPL-2602[1]
3, 500 300 YES HCPL-2612[1]
1,000 50 3 YES HCPL-261A[1] HCPL-061A[1]
NO HCPL-263A[1] HCPL-063A[1]
1,000[2] 1,000 YES HCPL-261N[1] HCPL-061N[1]
NO HCPL-263N[1] HCPL-063N[1]
1,000 50 12.5 [3] HCPL-193X[1]
HCPL-56XX[1]
HCPL-66XX[1]
Notes:
1. Technical data are on separate Agilent publications.
2. 15 kV/µs with VCM = 1 kV can be achieved using Agilent application circuit.
3. Enable is available for single channel products only, except for HCPL-193X devices.
3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2611#XXXX
020 = 5000 V rms/1 minute UL Rating Option*
060 = IEC/EN/DIN EN 60747-5-2 VIORM = 630 Vpeak Option**
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact Agilent sales representative or authorized distributor for information.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use “-”
*For 6N137, HCPL-2601/11/30/31 and HCPL-4661 (8-pin DIP products) only.
**For HCPL-2611 only. Combination of Option 020 and Option 060 is not available.
†Gull wing surface mount option applies to through hole parts only.
Schematic
SHIELD
8
6
5
2+
3
VF
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 5).
–
IFICC VCC
VO
GND
IO
VE
IE7
6N137, HCPL-2601/2611
HCPL-0600/0601/0611
HCNW137, HCNW2601/2611
SHIELD
8
7
+
2
V
F1
–
I
F1
I
CC
V
CC
V
O1
I
O1
1
SHIELD
6
5
–
4
V
F2
+
I
F2
V
O2
GND
I
O2
3
HCPL-2630/2631/4661
HCPL-0630/0631/0661
4
Package Outline Drawings
8-pin DIP Package** (6N137, HCPL-2601/11/30/31, HCPL-4661)
8-pin DIP Package with Gull Wing Surface Mount Option 300
(6N137, HCPL-2601/11/30/31, HCPL-4661)
**JEDEC Registered Data (for 6N137 only).
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5° TYP. 0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
OPTION CODE*
UL
RECOGNITION
UR
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010) 12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
5
Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61)
8-Pin Widebody DIP Package (HCNW137, HCNW2601/11)
XXX
YWW
8765
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003) 1.270
(0.050)BSC
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005) 1.524
(0.060)
45° X 0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
7°
PIN ONE
0 ~ 7°
*
*
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
1.78 ± 0.15
(0.070 ± 0.006)
5.10
(0.201)MAX.
1.55
(0.061)
MAX.
2.54 (0.100)
TYP.
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
7° TYP. 0.254 + 0.076
- 0.0051
(0.010+ 0.003)
- 0.002)
11.00
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
MAX.
10.16 (0.400)
TYP.
A
HCNWXXXX
YYWW
DATE CODE
TYPE NUMBER
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
3.10 (0.122)
3.90 (0.154)
6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300
(HCNW137, HCNW2601/11)
Solder Reflow Temperature Profile
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°CPEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
1.00 ± 0.15
(0.039 ± 0.006)
7° NOM.
12.30 ± 0.30
(0.484 ± 0.012)
0.75 ± 0.25
(0.030 ± 0.010)
11.00
(0.433)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
9.00 ± 0.15
(0.354 ± 0.006)
1.3
(0.051)
13.56
(0.534)
2.29
(0.09)
LAND PATTERN RECOMMENDATION
1.78 ± 0.15
(0.070 ± 0.006)
4.00
(0.158)MAX.
1.55
(0.061)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254 + 0.076
- 0.0051
(0.010+ 0.003)
- 0.002)
MAX.
7
Regulatory Information
The 6N137, HCPL-26XX/06XX/
46XX, and HCNW137/26XX have
been approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition Program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Insulation and Safety Related Specifications
8-pin DIP Widebody
(300 Mil) SO-8 (400 Mil)
Parameter Symbol Value Value Value Units Conditions
Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals
Air Gap (External to output terminals, shortest
Clearance) distance through air.
Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals
Tracking (External to output terminals, shortest
Creepage) distance path along body.
Minimum Internal 0.08 0.08 1.0 mm Through insulation distance,
Plastic Gap conductor to conductor, usually
(Internal Clearance) the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal NA NA 4.0 mm Measured from input terminals
Tracking (Internal to output terminals, along
Creepage) internal cavity.
Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group IIIa IIIa IIIa Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Recommended Pb-free IR Profile
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 and HCNW only)
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERA TURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
8
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics
(HCPL-2611 Option 060 Only)
Description Symbol Characteristic Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤300 V rms I-IV
for rated mains voltage ≤450 V rms I-III
Climatic Classification 55/85/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage VIORM 630 V peak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, VPR 1181 V peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and sample test, VPR 945 V peak
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec) VIOTM 6000 V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 16, Thermal Derating curve.)
Case Temperature TS175 °C
Input Current IS,INPUT 230 mA
Output Power PS,OUTPUT 600 mW
Insulation Resistance at TS, VIO = 500 V RS≥109Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN
60747-5-2, for a detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics(HCNW137/2601/2611 Only)
Description Symbol Characteristic Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤600 V rms I-IV
for rated mains voltage ≤1000 V rms I-III
Climatic Classification (DIN IEC 68 part 1) 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage VIORM 1414 V peak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, VPR 2651 V peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and sample test, VPR 2121 V peak
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec) VIOTM 8000 V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 16, Thermal Derating curve.)
Case Temperature TS150 °C
Input Current IS,INPUT 400 mA
Output Power PS,OUTPUT 700 mW
Insulation Resistance at TS, VIO = 500 V RS≥109Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN
60747-5-2, for a detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
9
Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter Symbol Package** Min. Max. Units Note
Storage Temperature TS-55 125 °C
Operating Temperature†TA-40 85 °C
Average Forward Input Current IFSingle 8-Pin DIP 20 mA 2
Single SO-8
Widebody
Dual 8-Pin DIP 15 1, 3
Dual SO-8
Reverse Input Voltage VR8-Pin DIP, SO-8 5 V 1
Widebody 3
Input Power Dissipation PIWidebody 40 mW
Supply Voltage VCC 7V
(1 Minute Maximum)
Enable Input Voltage (Not to VESingle 8-Pin DIP VCC + 0.5 V
Exceed VCC by more than Single SO-8
500 mV) Widebody
Enable Input Current IE5mA
Output Collector Current IO50 mA 1
Output Collector Voltage VO7V1
Output Collector Power POSingle 8-Pin DIP 85 mW
Dissipation Single SO-8
Widebody
Dual 8-Pin DIP 60 1, 4
Dual SO-8
Lead Solder Temperature TLS 8-Pin DIP 260°C for 10 sec.,
(Through Hole Parts Only) 1.6 mm below seating plane
Widebody 260°C for 10 sec.,
up to seating plane
Solder Reflow Temperature SO-8 and See Package Outline
Profile (Surface Mount Parts Only) Option 300 Drawings section
*JEDEC Registered Data (for 6N137 only).
**Ratings apply to all devices except otherwise noted in the Package column.
†0°C to 70°C on JEDEC Registration.
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Input Current, Low Level IFL* 0 250 µA
Input Current, High Level[1] IFH** 5 15 mA
Power Supply Voltage VCC 4.5 5.5 V
Low Level Enable Voltage†VEL 0 0.8 V
High Level Enable Voltage†VEH 2.0 VCC V
Operating Temperature TA-40 85 °C
Fan Out (at RL = 1 kΩ)[1] N 5 TTL Loads
Output Pull-up Resistor RL330 4 k Ω
*The off condition can also be guaranteed by ensuring that VFL ≤0.8 volts.
**The initial switching threshold is 5 mA or less. It is recommended that 6.3 mA to 10 mA be used for best performance and to permit
at least a 20% LED degradation guardband.
†For single channel products only.
10
Electrical Specifications
Over recommended temperature (TA = -40°C to +85°C) unless otherwise specified. All Typicals at VCC = 5 V,
TA = 25°C. All enable test conditions apply to single channel products only. See note 5.
Parameter Sym. Package Min. Typ. Max. Units Test Conditions Fig. Note
High Level Output IOH* All 5.5 100 µAV
CC = 5.5 V, VE = 2.0 V, 1 1, 6,
Current V
O = 5.5 V, IF = 250 µA19
Input Threshold ITH Single Channel 2.0 5.0 mA V
CC = 5.5 V, VE = 2.0 V, 2, 3 19
Current Widebody VO = 0.6 V,
Dual Channel 2.5 IOL (Sinking) = 13 mA
Low Level Output VOL* 8-Pin DIP 0.35 0.6 V V
CC = 5.5 V, VE = 2.0 V, 2, 3, 1, 19
Voltage SO-8 IF = 5 mA, 4, 5
Widebody 0.4 IOL (Sinking) = 13 mA
High Level Supply ICCH Single Channel 7.0 10.0* mA VE = 0.5 V VCC = 5.5 V 7
Current 6.5 VE = VCC IF = 0 mA
Dual Channel 10 15 Both
Channels
Low Level Supply ICCL Single Channel 9.0 13.0* mA VE = 0.5 V VCC = 5.5 V 8
Current 8.5 VE = VCC IF = 10 mA
Dual Channel 13 21 Both
Channels
High Level Enable IEH Single Channel -0.7 -1.6 mA V
CC = 5.5 V, VE = 2.0 V
Current
Low Level Enable IEL* -0.9 -1.6 mA VCC = 5.5 V, VE = 0.5 V 9
Current
High Level Enable VEH 2.0 V 19
Voltage
Low Level Enable VEL 0.8 V
Voltage
Input Forward VF8-Pin DIP 1.4 1.5 1.75* V TA = 25°CI
F = 10 mA 6, 7 1
Voltage SO-8 1.3 1.80
Widebody 1.25 1.64 1.85 TA = 25°C
1.2 2.05
Input Reverse BV
R* 8-Pin DIP 5 V IR = 10 µA1
Breakdown SO-8
Voltage Widebody 3 IR = 100 µA, TA = 25°C
Input Diode ∆VF/ 8-Pin DIP -1.6 mV/°C IF = 10 mA 7 1
Temperature ∆TASO-8
Coefficient Widebody -1.9
Input Capacitance CIN 8-Pin DIP 60 pF f = 1 MHz, VF = 0 V 1
SO-8
Widebody 70
*JEDEC registered data for the 6N137. The JEDEC Registration specifies 0°C to +70°C. HP specifies -40°C to +85°C.
11
Switching Specifications (AC)
Over Recommended Temperature (T
A = -40°C to +85°C), VCC = 5 V, IF = 7.5 mA unless otherwise specified.
All Typicals at TA = 25°C, VCC = 5 V.
Parameter Sym. Package** Min. Typ. Max. Units Test Conditions Fig. Note
Propagation Delay tPLH 20 48 75* ns TA = 25°CR
L = 350 Ω8, 9, 1, 10,
Time to High 100 CL = 15 pF 10 19
Output Level
Propagation Delay tPHL 25 50 75* ns TA = 25°C 1, 11,
Time to Low 100 19
Output Level
Pulse Width |tPHL - tPLH| 8-Pin DIP 3.5 35 ns 8, 9, 13, 19
Distortion SO-8 10,
Widebody 40 11
Propagation Delay tPSK 40 ns 12, 13,
Skew 19
Output Rise tr24 ns 12 1, 19
Time (10-90%)
Output Fall tf10 ns 12 1, 19
Time (90-10%)
Propagation Delay tELH Single Channel 30 ns RL = 350 Ω, 13, 14
Time of Enable CL = 15 pF, 14
from VEH to VEL VEL = 0 V, VEH = 3 V
Propagation Delay tEHL Single Channel 20 ns 15
Time of Enable
from VEL to VEH
*JEDEC registered data for the 6N137.
**Ratings apply to all devices except otherwise noted in the Package column.
Parameter Sym. Device Min. Typ. Units Test Conditions Fig. Note
Logic High |CMH| 6N137 10,000 V/µs|V
CM| = 10 V VCC = 5 V, IF = 0 mA, 15 1, 16,
Common HCPL-2630 VO(MIN) = 2 V, 18, 19
Mode HCPL-0600/0630 RL = 350 Ω, TA = 25°C
Transient HCNW137
Immunity HCPL-2601/2631 5,000 10,000 |VCM| = 50 V
HCPL-0601/0631
HCNW2601
HCPL-2611/4661 10,000 15,000 |VCM| = 1 kV
HCPL-0611/0661
HCNW2611
Logic Low |CML| 6N137 10,000 V/µs|V
CM| = 10 V VCC = 5 V, IF = 7.5 mA, 15 1, 17,
Common HCPL-2630 VO(MAX) = 0.8 V, 18, 19
Mode HCPL-0600/0630 RL = 350 Ω, TA = 25°C
Transient HCNW137
Immunity HCPL-2601/2631 5,000 10,000 |VCM| = 50 V
HCPL-0601/0631
HCNW2601
HCPL-2611/4661 10,000 15,000 |VCM| = 1 kV
HCPL-0611/0661
HCNW2611
12
Package Characteristics
All Typicals at TA = 25°C.
Parameter Sym. Package Min. Typ. Max. Units Test Conditions Fig. Note
Input-Output II-O* Single 8-Pin DIP 1 µA 45% RH, t = 5 s, 20, 21
Insulation Single SO-8 VI-O = 3 kV dc, T
A = 25°C
Input-Output VISO 8-Pin DIP, SO-8 3750 V rms RH ≤ 50%, t = 1 min, 20, 21
Momentary With- Widebody 5000 TA = 25°C 20, 22
stand Voltage** OPT 020†5000
Input-Output RI-O 8-Pin DIP, SO-8 1012 ΩVI-O = 500 V dc 1, 20,
Resistance Widebody 1012 1013 T
A = 25°C23
1011 T
A = 100°C
Input-Output CI-O 8-Pin DIP, SO-8 0.6 pF f = 1 MHz, TA = 25°C 1, 20,
Capacitance Widebody 0.5 0.6 23
Input-Input II-I Dual Channel 0.005 µA RH ≤ 45%, t = 5 s, 24
Insulation VI-I = 500 V
Leakage Current
Resistance RI-I Dual Channel 1011 Ω24
(Input-Input)
Capacitance CI-I Dual 8-Pin DIP 0.03 pF f = 1 MHz 24
(Input-Input) Dual SO-8 0.25
*JEDEC registered data for the 6N137. The JEDEC Registration specifies 0°C to 70°C. Agilent specifies -40°C to 85°C.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table
(if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-Output
Endurance Voltage.”
†For 6N137, HCPL-2601/2611/2630/2631/4661 only.
Notes:
1. Each channel.
2. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does
not exceed 20 mA.
3. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does
not exceed 15 mA.
4. Derate linearly above 80°C free-air temperature at a rate of 2.7 mW/°C for the SOIC-8 package.
5. Bypassing of the power supply line is required, with a 0.1 µF ceramic disc capacitor adjacent to each optocoupler as illustrated in
Figure 17. Total lead length between both ends of the capacitor and the isolator pins should not exceed 20 mm.
6. The JEDEC registration for the 6N137 specifies a maximum IOH of 250 µA. Agilent guarantees a maximum IOH of 100 µA.
7. The JEDEC registration for the 6N137 specifies a maximum ICCH of 15 mA. Agilent guarantees a maximum ICCH of 10 mA.
8. The JEDEC registration for the 6N137 specifies a maximum ICCL of 18 mA. Agilent guarantees a maximum ICCL of 13 mA.
9. The JEDEC registration for the 6N137 specifies a maximum IEL of –2.0 mA. Agilent guarantees a maximum IEL of -1.6 mA.
10. The tPLH propagation delay is measured from the 3.75 mA point on the falling edge of the input pulse to the 1.5 V point on the
rising edge of the output pulse.
11. The tPHL propagation delay is measured from the 3.75 mA point on the rising edge of the input pulse to the 1.5 V point on the
falling edge of the output pulse.
12. tPSK is equal to the worst case difference in tPHL and/or tPLH that will be seen between units at any given temperature and specified
test conditions.
13. See application section titled “Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew” for more information.
14. The tELH enable propagation delay is measured from the 1.5 V point on the falling edge of the enable input pulse to the 1.5 V
point on the rising edge of the output pulse.
15. The tEHL enable propagation delay is measured from the 1.5 V point on the rising edge of the enable input pulse to the 1.5 V point
on the falling edge of the output pulse.
16. CMH is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state
(i.e., VO > 2.0 V).
17. CML is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state
(i.e., VO < 0.8 V).
18. For sinusoidal voltages, (|dVCM | / dt)max = πfCMVCM(p-p).
13
IOH – HIGH LEVEL OUTPUT CURRENT – µA
-60
0
TA – TEMPERATURE – °C
100
10
15
-20
5
20
VCC = 5.5 V
VO = 5.5 V
VE = 2.0 V*
IF = 250 µA
60
-40 0 40 80
* FOR SINGLE
CHANNEL
PRODUCTS
ONLY
19. No external pull up is required for a high logic state on the enable input. If the VE pin is not used, tying VE to VCC will result in
improved CMR performance. For single channel products only.
20. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together.
21. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for one second
(leakage detection current limit, II-O ≤ 5 µA). This test is performed before the 100% production test for partial discharge
(Method b) shown in the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table, if applicable.
22. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for one second
(leakage detection current limit, II-O ≤ 5 µA). This test is performed before the 100% production test for partial discharge
(Method b) shown in the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table, if applicable.
23. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. For dual channel products
only.
24. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. For dual channel products only.
Figure 2. Typical Output Voltage vs. Forward Input Current.
Figure 3. Typical Input Threshold Current vs. Temperature.
Figure 1. Typical High Level Output
Current vs. Temperature.
1
6
2
3
4
5
123456
I
F
– FORWARD INPUT CURRENT – mA
R
L
= 350 Ω
R
L
= 1 KΩ
R
L
= 4 KΩ
00
V
CC
= 5 V
T
A
= 25 °C
V
O
– OUTPUT VOLTAGE – V
8-PIN DIP, SO-8
1
6
2
3
4
5
123456
I
F
– FORWARD INPUT CURRENT – mA
R
L
= 350 Ω
R
L
= 1 KΩ
R
L
= 4 KΩ
00
V
CC
= 5 V
T
A
= 25 °C
V
O
– OUTPUT VOLTAGE – V
WIDEBODY
V
CC
= 5.0 V
V
O
= 0.6 V
6
3
-60 -20 20 60 100
T
A
– TEMPERATURE – °C
2
80400-40
0
I
TH
– INPUT THRESHOLD CURRENT – mA
R
L
= 350 Ω
1
4
5
R
L
= 1 KΩ
R
L
= 4 KΩ
WIDEBODY
VCC = 5.0 V
VO = 0.6 V
6
3
-60 -20 20 60 100
TA – TEMPERATURE – °C
2
80400-40
0
ITH – INPUT THRESHOLD CURRENT – mA
RL = 350 Ω
1
4
5
RL = 1 KΩ
RL = 4 KΩ
8-PIN DIP, SO-8
14
I
F
– FORWARD CURRENT – mA
1.2
0.001
V
F
– FORWARD VOLTAGE – V
1.0
1000
1.4
0.01
1.61.3 1.5
0.1
10
100
WIDEBODY
I
F
+
–
V
F
1.7
T
A
= 25 °C
V
CC
= 5.0 V
V
E
= 2.0 V*
V
OL
= 0.6 V
70
60
-60 -20 20 60 100
T
A
– TEMPERATURE – °C
50
80400-40
20
I
OL
– LOW LEVEL OUTPUT CURRENT – mA
40
I
F
= 10-15 mA
I
F
= 5.0 mA
* FOR SINGLE
CHANNEL
PRODUCTS ONLY
0.8
0.4
-60 -20 20 60 100
T
A
– TEMPERATURE – °C
0.2
80400-40
0
V
OL
– LOW LEVEL OUTPUT VOLTAGE – V
I
O
= 16 mA
0.1
0.5
0.7
I
O
= 6.4 mA
WIDEBODY
V
CC
= 5.5 V
V
E
= 2.0 V
I
F
= 5.0 mA
0.3
0.6
I
O
= 12.8 mA
I
O
= 9.6 mA
Figure 7. Typical Temperature Coefficient of Forward Voltage vs. Input Current.
Figure 4. Typical Low Level Output Voltage vs. Temperature. Figure 5. Typical Low Level Output
Current vs. Temperature.
Figure 6. Typical Input Diode Forward Characteristic.
0.8
0.4
-60 -20 20 60 100
TA – TEMPERATURE – °C
0.2
80400-40
0
VOL – LOW LEVEL OUTPUT VOLTAGE – V
IO = 16 mA
0.1
0.5
0.7
IO = 6.4 mA
8-PIN DIP, SO-8
VCC = 5.5 V
VE = 2.0 V*
IF = 5.0 mA
0.3
0.6
IO = 12.8 mA
IO = 9.6 mA
* FOR SINGLE
CHANNEL
PRODUCTS ONLY
I
F
– FORWARD CURRENT – mA
1.1
0.001
V
F
– FORWARD VOLTAGE – V
1.0
1000
1.3
0.01
1.51.2 1.4
0.1
T
A
= 25 °C
10
100
8-PIN DIP, SO-8
I
F
+
–
V
F
1.6
dVF/dT – FORWARD VOLTAGE
TEMPERATURE COEFFICIENT – mV/°C
0.1 1 10 100
IF – PULSE INPUT CURRENT – mA
-1.4
-2.2
-2.0
-1.8
-1.6
-1.2
-2.4 8-PIN DIP, SO-8
dV
F
/dT – FORWARD VOLTAGE
TEMPERATURE COEFFICIENT – mV/°C
0.1 1 10 100
I
F
– PULSE INPUT CURRENT – mA
-1.9
-2.2
-2.1
-2.0
-1.8
-2.3 WIDEBODY
15
V
CC
= 5.0 V
I
F
= 7.5 mA
40
30
-20 20 60 100
T
A
– TEMPERATURE – °C
20
80400-40
PWD – PULSE WIDTH DISTORTION – ns
10 R
L
= 350 Ω
R
L
= 1 kΩ
R
L
= 4 kΩ
0
-60
-10
Figure 8. Test Circuit for tPHL and tPLH.
Figure 9. Typical Propagation Delay
vs. Temperature.
Figure 10. Typical Propagation Delay
vs. Pulse Input Current.
Figure 11. Typical Pulse Width
Distortion vs. Temperature.
Figure 12. Typical Rise and Fall Time
vs. Temperature.
V
CC
= 5.0 V
T
A
= 25°C
105
90
5913
I
F
– PULSE INPUT CURRENT – mA
75
15117
30
t
P
– PROPAGATION DELAY – ns
60
45
t
PLH
, R
L
= 4 KΩ
t
PLH
, R
L
= 1 KΩ
t
PLH
, R
L
= 350 Ω
t
PHL
, R
L
= 350 Ω
1 KΩ
4 KΩ
OUTPUT V
MONITORING
NODE
O
+5 V
7
5
6
8
2
3
4
1
PULSE GEN.
Z = 50 Ω
t = t = 5 ns
O
f
I
F
L
R
R
M
CC
V
0.1µF
BYPASS
*C
L
GND
INPUT
MONITORING
NODE
r
SINGLE CHANNEL
OUTPUT V
MONITORING
NODE
O
+5 V
7
5
6
8
2
3
4
1
PULSE GEN.
Z = 50 Ω
t = t = 5 ns
O
f
I
F
L
R
R
M
CC
V
0.1µF
BYPASS
C
L
*
GND
INPUT
MONITORING
NODE
r
DUAL CHANNEL
1.5 V
t
PHL
t
PLH
I
F
INPUT
O
V
OUTPUT
I = 7.50 mA
F
I = 3.75 mA
F
*C
L
IS APPROXIMATELY 15 pF WHICH INCLUDES
PROBE AND STRAY WIRING CAPACITANCE.
V
CC
= 5.0 V
I
F
= 7.5 mA
100
80
-60 -20 20 60 100
T
A
– TEMPERATURE – °C
60
80400-40
0
t
P
– PROPAGATION DELAY – ns
40
20
t
PLH
, R
L
= 4 KΩ
t
PLH
, R
L
= 1 KΩ
t
PLH
, R
L
= 350 Ω
t
PHL
, R
L
= 350 Ω
1 KΩ
4 KΩ
t
r
, t
f
– RISE, FALL TIME – ns
-60
0
T
A
– TEMPERATURE – °C
100
300
-20
40
20 60-40 0 40 80
60
290
20
V
CC
= 5.0 V
I
F
= 7.5 mA
R
L
= 4 kΩ
R
L
= 1 kΩ
R
L
= 350 Ω, 1 kΩ, 4 kΩ
t
RISE
t
FALL
R
L
= 350 Ω
16
OUTPUT V
MONITORING
NODE
O
1.5 V
tEHL tELH
VE
INPUT
O
V
OUTPUT
3.0 V
1.5 V
+5 V
7
5
6
8
2
3
4
1
PULSE GEN.
Z = 50 Ω
t = t = 5 ns
O
f
IFL
R
CC
V
0.1 µF
BYPASS
*CL
*C IS APPROXIMATELY 15 pF WHICH INCLUDES
PROBE AND STRAY WIRING CAPACITANCE.
L
GND
r
7.5 mA
INPUT VE
MONITORING NODE
Figure 13. Test Circuit for tEHL and tELH.
Figure 14. Typical Enable Propagation
Delay vs. Temperature.
Figure 15. Test Circuit for Common Mode Transient Immunity and Typical Waveforms.
V
O
0.5 V
O
V (MIN.)
5 V
0 V SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 7.5 mA
F
CM
V
H
CM
CM
L
O
V (MAX.)
CM
V (PEAK)
V
O
tE – ENABLE PROPAGATION DELAY – ns
-60
0
TA – TEMPERATURE – °C
100
90
120
-20
30
20 60-40 0 40 80
60
VCC = 5.0 V
VEH = 3.0 V
VEL = 0 V
IF = 7.5 mA
tELH, RL = 4 kΩ
tELH, RL = 1 kΩ
tEHL, RL = 350 Ω, 1 kΩ, 4 kΩ
tELH, RL = 350 Ω
+5 V
7
5
6
8
2
3
4
1
CC
V
0.1 µF
BYPASS
GND
OUTPUT V
MONITORING
NODE
O
PULSE
GENERATOR
Z = 50 Ω
O
+
I
F
B
A
V
FF
CM
V
–
R
L
SINGLE CHANNEL
+5 V
7
5
6
8
2
3
4
1
CC
V
0.1 µF
BYPASS
GND
OUTPUT V
MONITORING
NODE
O
PULSE
GENERATOR
Z = 50 Ω
O
+
I
F
B
A
V
FF
CM
V
–
R
L
DUAL CHANNEL
17
Figure 16. Thermal Derating Curve, Dependence of Safety Limiting Value with
Case Temperature per IEC/EN/DIN EN 60747-5-2.
Figure 17. Recommended Printed Circuit Board Layout.
OUTPUT POWER – PS, INPUT CURRENT – IS
0
0
TS – CASE TEMPERATURE – °C
17550
400
12525 75 100 150
600
800
200
100
300
500
700
PS (mW)
IS (mA)
HCNWXXXX
GND BUS (BACK)
V
CC
BUS (FRONT)
ENABLE
0.1µF
10 mm MAX.
(SEE NOTE 5)
OUTPUT
NC
NC
SINGLE CHANNEL
DEVICE ILLUSTRATED.
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
T
S
– CASE TEMPERATURE – °C
20050
400
12525 75 100 150
600
800
200
100
300
500
700 P
S
(mW)
I
S
(mA)
HCPL-2611 OPTION 060
175
18
V
CC1
5 V
GND 1
D1*
SHIELD
DUAL CHANNEL DEVICE
CHANNEL 1 SHOWN
8
7
5
390 Ω
0.1 µF
BYPASS
1
2
+
–
5 V
GND 2
V
CC2
2
470 Ω
1
I
F
V
F
*DIODE D1 (1N916 OR EQUIVALENT) IS NOT REQUIRED FOR UNITS WITH OPEN COLLECTOR OUTPUT.
V
CC1
5 V
GND 1
D1*
IF
VF
SHIELD
SINGLE CHANNEL DEVICE
8
6
5
390 Ω
0.1 µF
BYPASS
2
3
+
–
5 V
GND 2
V
CC2
2
470 Ω
17
V
E
Figure 18. Recommended TTL/LSTTL to TTL/LSTTL Interface Circuit.
19
Propagation Delay, Pulse-
Width Distortion and
Propagation Delay Skew
Propagation delay is a figure of
merit which describes how
quickly a logic signal propagates
through a system. The propaga-
tion delay from low to high (tPLH)
is the amount of time required for
an input signal to propagate to
the output, causing the output to
change from low to high.
Similarly, the propagation delay
from high to low (tPHL) is the
amount of time required for the
input signal to propagate to the
output causing the output to
change from high to low (see
Figure 8).
Pulse-width distortion (PWD)
results when tPLH and tPHL differ in
value. PWD is defined as the
difference between tPLH and tPHL
and often determines the
maximum data rate capability of a
transmission system. PWD can be
expressed in percent by dividing
the PWD (in ns) by the minimum
pulse width (in ns) being
transmitted. Typically, PWD on
the order of 20-30% of the
minimum pulse width is tolerable;
the exact figure depends on the
particular application (RS232,
RS422, T-l, etc.).
Propagation delay skew, tPSK, is
an important parameter to
consider in parallel data applica-
tions where synchronization of
signals on parallel data lines is a
concern. If the parallel data is
being sent through a group of
optocouplers, differences in
propagation delays will cause the
data to arrive at the outputs of the
optocouplers at different times. If
this difference in propagation
delays is large enough, it will
determine the maximum rate at
which parallel data can be sent
through the optocouplers.
Propagation delay skew is defined
as the difference between the
minimum and maximum
propagation delays, either tPLH or
tPHL, for any given group of
optocouplers which are operating
under the same conditions (i.e.,
the same drive current, supply
voltage, output load, and
operating temperature). As
illustrated in Figure 19, if the
inputs of a group of optocouplers
are switched either ON or OFF at
the same time, tPSK is the
difference between the shortest
propagation delay, either tPLH or
tPHL, and the longest propagation
delay, either tPLH or tPHL.
As mentioned earlier, tPSK can
determine the maximum parallel
data transmission rate. Figure 20
is the timing diagram of a typical
parallel data application with both
the clock and the data lines being
sent through optocouplers. The
figure shows data and clock
signals at the inputs and outputs
of the optocouplers. To obtain the
maximum data transmission rate,
both edges of the clock signal are
being used to clock the data; if
only one edge were used, the
clock signal would need to be
twice as fast.
Propagation delay skew repre-
sents the uncertainty of where an
edge might be after being sent
through an optocoupler. Figure
20 shows that there will be
uncertainty in both the data and
the clock lines. It is important
that these two areas of uncertainty
not overlap, otherwise the clock
signal might arrive before all of
the data outputs have settled, or
some of the data outputs may
start to change before the clock
signal has arrived. From these
considerations, the absolute
minimum pulse width that can be
sent through optocouplers in a
parallel application is twice tPSK. A
cautious design should use a
slightly longer pulse width to
ensure that any additional
uncertainty in the rest of the
circuit does not cause a problem.
The tPSK specified optocouplers
offer the advantages of
guaranteed specifications for
propagation delays, pulsewidth
distortion and propagation delay
skew over the recommended
temperature, input current, and
power supply ranges.
Figure 19. Illustration of Propagation
Delay Skew - tPSK.
Figure 20. Parallel Data Transmission
Example.
50%
1.5 V
I
F
V
O
50%I
F
V
O
t
PSK
1.5 V
DATA
t
PSK
INPUTS
CLOCK
DATA
OUTPUTS
CLOCK
t
PSK
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0302EN
December 29, 2004
5989-2126EN