Programmable Low Power Gyroscope
ADIS16250/ADIS16255
Rev. D
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FEATURES
Yaw rate gyroscope with digital range scaling
±80°/sec, ±160°/sec, and ±320°/sec settings
14-bit digital gyroscope sensor outputs
12-bit digital temperature sensor output
Calibrated sensitivity and bias
ADIS16250: +25°C
ADIS16255: −40°C to +85°C
In-system, auto-zero for bias drift calibration
Digitally controlled sample rate
Digitally controlled frequency response
Dual alarm settings with configurable operation
Embedded integration for short-term angle estimates
Digitally activated self-test
Digitally activated low power mode
Interrupt-driven wake-up
SPI®-compatible serial interface
50 Hz sensor bandwidth
Auxiliary 12-bit ADC input and 12-bit DAC output
Auxiliary digital input/output
Single-supply operation: 4.75 V to 5.25 V
2000 g powered shock survivability
APPLICATIONS
Instrumentation control
Platform control and stabilization
Motion control and analysis
Avionics instrumentation
Navigation
Image stabilization
Robotics
FUNCTIONAL BLOCK DIAGRAM
A
UX
ADC
SCLK
DIN
DOUT
CS
RST DIO0 DIO1
SPI
PORT
TEMPERATURE
SENSOR
SELF-TEST
POWER
MANAGEMENT AUXILIARY
I/O
ALARM
DIGITAL
CONTROL
SIGNAL
CONDITIONING
AND
CONVERSION
CALIBRATION
AND
DIGITAL
PROCESSING
ADIS16250/
ADIS16255
VCC
FILT
RATE
COM
AUX
DAC VREF
GYROSCOPE
SENSOR
06070-001
Figure 1.
GENERAL DESCRIPTION
The ADIS16250/ADIS16255 are complete angular rate meas-
urement systems available in a single compact package enabled
by Analog Devices, Inc. iSensor™ integration. By enhancing
Analog Devices iMEMS® sensor technology with an embedded
signal processing solution, the ADIS16250/ADIS16255 provide
factory-calibrated and tunable digital sensor data in a convenient
format that can be accessed using a simple SPI serial interface.
The ADIS16255 additionally provides an extended temperature
calibration. The SPI interface provides access to measurements
for the gyroscope, temperature, power supply, and one auxiliary
analog input. Easy access to calibrated digital sensor data
provides developers with a system-ready device, reducing
development time, cost, and program risk.
The device range can be digitally selected from three different
settings: ±80°/sec, ±160°/sec, and ±320°/sec. Unique charac-
teristics of the end system are accommodated easily through
several built-in features, including a single-command auto-zero
recalibration function, as well as configurable sample rate and
frequency response. Additional features can be used to further
reduce system complexity, including:
Configurable alarm function
Auxiliary 12-bit ADC and DAC
Two configurable digital I/O ports
Digital self-test function
System power dissipation can be optimized via the ADIS16250/
ADIS16255 power management features, including an interrupt-
driven wake-up. The ADIS16250/ADIS16255 are available in an
11 mm × 11 mm × 5.5 mm, laminate-based land grid array
(LGA) package with a temperature range of −40°C to +85°C.
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 2 of 20
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Specifications .................................................................. 5
Absolute Maximum Ratings ............................................................ 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Recommended Layout ................................................................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ...................................................................... 10
Overvie w ...................................................................................... 10
Relative Angle Estimate ............................................................. 10
Factory Calibration .................................................................... 10
Auxiliary ADC Function ........................................................... 10
Basic Operation .............................................................................. 11
Serial Peripheral Interface (SPI) ............................................... 11
Data Output Register Access .................................................... 12
Programming and Control ............................................................ 13
Control Register Overview ....................................................... 13
Control Register Structure ........................................................ 13
Calibration ................................................................................... 14
Global Commands ..................................................................... 14
Operational Control ................................................................... 15
Status and Diagnostics ............................................................... 16
Outline Dimensions ....................................................................... 20
Ordering Guide .......................................................................... 20
REVISION HISTORY
11/09—Rev. C to Rev. D
Changes to Flash Memory, Endurance Parameter, Table 1 ......... 4
Changes to Figure 16 ........................................................................ 9
Changes to Control Register Structure Section .......................... 13
11/08—Rev. B to Rev. C
Deleted Temperature Sensor Parameter, Table 1 .......................... 3
Added Logic Inputs Conditions and Digital Outputs
Conditions ......................................................................................... 4
3/07—Rev. A to Rev. B
Changes to Table 2 and Figure 2 ..................................................... 5
Changes to Table 8 .......................................................................... 13
Changes to Table 9 and Table 11 ................................................... 14
Changes to Table 24 ........................................................................ 16
Changes to Data-Ready I/O Indicator Section ........................... 17
Changes to Self-Test Section ......................................................... 17
2/07—Rev. 0 to Rev. A
Added ADIS16255 .............................................................. Universal
Changes to Table 1 ............................................................................. 3
Changes to Table 2 ............................................................................. 5
Changes to Figure 2 ........................................................................... 5
Changes to Typical Performance Characteristics .......................... 8
Deleted Temperature Sensor Section ........................................... 11
Added Factory Calibration Section.............................................. 11
Changes to Table 7 .......................................................................... 12
Changes to Table 8 .......................................................................... 13
Changes to Table 11 ....................................................................... 14
Changes to Table 19 ....................................................................... 16
Changes to Flash Memory Endurance Section .......................... 18
Changes to Ordering Guide .......................................................... 20
10/06—Revision 0: Initial Version
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 3 of 20
SPECIFICATIONS
TA = −40°C to +85°C, VCC = 5.0 V, angular rate = 0°/sec, ±1 g, ±320°/sec range setting, unless otherwise noted.
Table 1.
Parameter Conditions Min Typ Max Unit
SENSITIVITY1Clockwise rotation is positive output
25°C, dynamic range = ±320°/sec2 0.07326 °/sec/LSB
25°C, dynamic range = ±160°/sec 0.03663 °/sec/LSB
25°C, dynamic range = ±80°/sec 0.01832 °/sec/LSB
Initial Tolerance 25°C, dynamic range = ±320°/sec ±0.2 ±1 %
Temperature Coefficient ADIS16250 (see Figure 8) 225 ppm/°C
ADIS16255 (see Figure 11) 25 ppm/°C
Nonlinearity Best fit straight line 0.1 % of FS
BIAS
In Run Bias Stability 25°C, 1σ 0.016 °/sec
Turn-On-to-Turn-On Bias Stability 25°C, 1σ 0.05 °/sec
Angular Random Walk 25°C, 1σ 3.6 °/√hour
Temperature Coefficient ADIS16250 (see Figure 7) 0.03 °/sec/°C
ADIS16255 (see Figure 10) 0.005 °/sec/°C
Linear Acceleration Effect Any axis 0.2 °/sec/g
Voltage Sensitivity VCC = 4.75 V to 5.25 V 1.0 °/sec/V
NOISE PERFORMANCE
Output Noise At 25°C, ±320°/sec range, no filtering 0.48 °/sec rms
At 25°C, ±160°/sec range, 4-tap filter setting 0.28 °/sec rms
At 25°C, ±80°/sec range, 16-tap filter setting 0.14 °/sec rms
Rate Noise Density At 25°C, f = 25 Hz, ±320°/sec range, no filtering 0.056 °/sec/√Hz rms
FREQUENCY RESPONSE
3 dB Bandwidth See the Analog Bandwidth section for adjustment 50 Hz
Sensor Resonant Frequency 14 kHz
SELF-TEST STATE
Change for Positive Stimulus 320°/sec dynamic range setting 439 721 1092 LSB
Change for Negative Stimulus 320°/sec dynamic range setting −439 −721 −1092 LSB
Internal Self-Test Cycle Time 20 ms
ADC INPUT
Resolution 12 Bits
Integral Nonlinearity ±2 LSB
Differential Nonlinearity ±1 LSB
Offset Error ±4 LSB
Gain Error ±2 LSB
Input Range 0 2.5 V
Input Capacitance During acquisition 20 pF
ON-CHIP VOLTAGE REFERENCE 2.5 V
Accuracy At 25°C −10 +10 mV
Temperature Coefficient ±40 ppm/°C
Output Impedance 70
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 4 of 20
Parameter Conditions Min Typ Max Unit
DAC OUTPUT 5 kΩ/100 pF to GND
Resolution 12 Bits
Relative Accuracy For Code 101 to Code 4095 4 LSB
Differential Nonlinearity 1 LSB
Offset Error ±5 mV
Gain Error ±0.5 %
Output Range 0 to 2.5 V
Output Impedance 2
Output Settling Time 10 µs
LOGIC INPUTS Internal 3.3 V Interface
Input High Voltage, VINH 2.0 V
Input Low Voltage, VINL 0.8 V
For CS signal when used to wake up from sleep mode 0.55 V
Logic 1 Input Current, IINH V
IH = 3.3 V ±0.2 ±10 µA
Logic 0 Input Current, IINL V
IL = 0 V
All except RST −40 −60 µA
RST3 −1 mA
Input Capacitance, CIN 10 pF
DIGITAL OUTPUTS Internal 3.3 V Interface
Output High Voltage, VOH I
SOURCE = 1.6 mA 2.4 V
Output Low Voltage, VOL I
SINK = 1.6 mA 0.4 V
SLEEP TIMER
Timeout Period4 0.5 128 sec
START-UP TIME
Initial 160 ms
Sleep Mode Recovery 2.5 ms
FLASH MEMORY
Endurance5 10,000 Cycles
Data Retention6TJ = 55°C 20 Years
CONVERSION RATE
Minimum Conversion Time 3.906 ms
Maximum Conversion Time 7.75 sec
Maximum Throughput Rate 256 SPS
Minimum Throughput Rate 0.129 SPS
POWER SUPPLY
Operating Voltage Range, VCC 4.75 5.0 5.25 V
Power Supply Current Normal mode at 25°C 18 mA
Fast mode at 25°C 44 mA
Sleep mode at 25°C 425 µA
1 ADIS16255 characterization data represents ±4σ to fall within the ±1% limit.
2 The sensor is capable of ±600°/sec, but the specifications herein are for ±320°/sec only.
3 The RST pin has an internal pull-up.
4 Guaranteed by design.
5 Endurance is qualified as per JEDEC Standard 22 Method A117 and measured at −40°C, +25°C, +85°C, and +125°C.
6 Retention lifetime equivalent at junction temperature (TJ) 55°C, as per JEDEC Standard 22 Method A117. Retention lifetime decreases with junction temperature.
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 5 of 20
TIMING SPECIFICATIONS
TA = −40°C to +85°C, VCC = 5.0 V, unless otherwise noted.
Table 2.
Parameter Description Min1Typ Max1Unit
fSCLK Fast mode, SMPL_PRD ≤ 0x07 (fS ≥ 64 Hz) 0.01 2.5 MHz
Normal mode, SMPL_PRD ≥ 0x08 (fS ≤ 56.9 Hz) 0.01 1.0 MHz
tDATARATE Data rate period, fast mode, SMPL_PRD ≤ 0x07 (fS ≥ 64 Hz) 32 s
Data rate period, normal mode, SMPL_PRD ≥ 0x08 (fS ≤ 56.9 Hz) 42 s
tSTALL Stall period, fast mode, SMPL_PRD ≤ 0x07 (fS ≥ 64 Hz) 9 s
Stall period, normal mode, SMPL_PRD ≥ 0x08 (fS ≤ 56.9 Hz) 12 s
tCS Chip select to clock edge 48.8 ns
tDAV Data output valid after SCLK falling edge2 100 ns
tDSU Data input setup time before SCLK rising edge 24.4 ns
tDHD Data input hold time after SCLK rising edge 48.8 ns
tDF Data output fall time 5 12.5 ns
tDR Data output rise time 5 12.5 ns
tSFS CS high after SCLK edge3
5 ns
Flash update time (power supply must be within range) 50 ms
1 Guaranteed by design; not production tested.
2 The MSB presents an exception to this parameter. The MSB clocks out on the falling edge of CS. The rest of the DOUT bits are clocked after the falling edge of SCLK and
are governed by this specification.
3 This parameter may need to be expanded to allow for proper capture of the LSB. After CS goes high, the DOUT line goes into a high impedance state.
CS
tDATARATE
SCLK
tDATASTALL
06070-026
Figure 2. SPI Chip Select Timing
CS
SCLK
DOUT
DIN
1 2 3 4 5 6 15 16
W/R A5 A4 A3 A2 D2
MSB DB14
D1 LSB
DB13 DB12 DB10DB11 DB2 LSBDB1
t
CS
t
SFS
t
DAV
t
DSU
t
DHD
*
*NOT DEFINED
06070-003
Figure 3. SPI Timing (Using SPI Settings Typically Identified as Phase = 1, Polarity = 1)
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Acceleration (Any Axis, Unpowered, 0.5 ms) 2000 g
Acceleration (Any Axis, Powered, 0.5 ms) 2000 g
VCC to COM −0.3 V to +6.0 V
Digital Input/Output Voltage to COM −0.3 V to +5.5 V
Analog Inputs to COM −0.3 V to +3.5 V
Operating Temperature Range1 −40°C to +125°C
Storage Temperature Range1 −65°C to +150°C
1 Extended exposure to temperatures outside of the specified temperature
range of −40°C to +85°C can adversely affect the accuracy of the factory
calibration. For best accuracy, store the parts within the specified operating
range of −40°C to +85°C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
RATEOUT
RATEIN
+8191 LSB
–8192 LSB
156
10
LONGITUDINAL
AXIS
RATE
AXIS
CLOCKWISE
ROTATION
LATERAL
AXIS
06070-011
Figure 4. RATEOUT Level Increase with Clockwise Rotation Increase
ESD CAUTION
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 7 of 20
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
DNC = DO NOT CONNECT
20 19 18 17 16
15
14
13
124
3
2
1
COM
11
109
876
5
DNCDNCDNCDIO1 RST
VREF COM VCC VCC
AUX
DAC
AUX
ADC
RATE
FILT
CS
DIN
DOUT
SCLK
POSITIVE OUTPUT
ROTATIONAL
DIRECTION
TOP VIEW
(Not To Scale)
ADIS16250/
ADIS16255
DNCDIO0
06070-004
Figure 5. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Type1Description
1 SCLK I SPI, Serial Clock.
2 DOUT O SPI, Data Output.
3 DIN I SPI, Data Input.
4 CS I SPI, Chip Select, Active Low.
5, 6 DIO0, DIO1 I/O Multifunction Digital Input/Output Pin.
7 RST I Reset, Active Low. This resets the sensor signal conditioning circuit and initiates a start-up sequence.
8, 9, 10, 11 DNC Do Not Connect.
12 AUX DAC O Auxiliary DAC Analog Output Voltage.
13 AUX ADC I Auxiliary ADC Analog Input Voltage.
14 RATE O Analog Rate Signal Output (Uncalibrated).
15 FILT I
Analog Amplifier Summing Junction. This is used for setting the analog bandwidth. See the Analog
Bandwidth section for more details.
16, 17 VCC S 5.0 V Power Supply.
18, 19 COM S Common. Reference point for all circuitry in the ADIS16250/ADIS16255.
20 VREF O Precision Reference Output.
1 S = supply; O = output; I = input.
RECOMMENDED LAYOUT
3.800
5.0865
0.773
16×
0.500
20×
1.127
20×
10.173
7.600
06070-010
11mm × 11mm STACKED LGA PACKAGE
Figure 6. Recommended Pad Layout (Units in Millimeters)
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 8 of 20
–50 –35 –20 –5 10 25 40 55 70 85 100
TEMPERATURE (°C)
TYPICAL PERFORMANCE CHARACTERISTICS
4
3
2
1
0
–1
–2
–3
–4
BIAS (°/s)
06070-012
–1σ
µ
+1σ
Figure 7. Bias vs. Temperature, ADIS16250
2.0
0
–2.0
–1.5
–1.0
–0.5
0.5
1.0
1.5
SENSITIVITY (%)
–50 100857055402510–5–20–35
TEMPERATURE (°C)
–1σ
µ
+1σ
06070-016
06070-013
4
3
2
1
0
–1
–2
–3
–4
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
BIAS (°/s)
TEMPERATURE (°C)
Figure 8. Sensitivity vs. Temperature, ADIS16250
4
3
2
1
0
–1
–2
–3
–4
BIAS (°/s)
MINIMUM TYPICAL MAXIMUM
SUPPLY VOLTAGE (4.75V, 5.00V, 5.25V)
Figure 9. Bias vs. Supply Voltage
µ+1σ
–1σ
06070-024
2.0
–2.0
–1.5
–1.0
–0.5
0
0.5
1.0
1.5
5035205102540557080
SENSITIVITY (%)
TEMPERATURE (°C)
Figure 10. Bias vs. Temperature, ADIS16255
+1σµ
–1σ
06070-025
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
MINIMUM TYPICAL MAXIMUM
SENSITIVITY (%)
SUPPLY VOLTAGE (4.75V, 5.00V, 5.25V)
Figure 11. Sensitivity vs. Temperature, ADIS16255
06070-017
Figure 12. Sensitivity vs. Supply Voltage
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 9 of 20
0.01
ROOT ALLAN VARIANCE (°/s)
1
0.1
13.75
13.70
13.65
13.60
13.55
13.50
13.45
13.40
13.35
0 600500400300200100
SENSITIVITY (LSB/°/s)
RATE (°/s)
0.1 1 10 100 1000
TAU (Seconds)
06070-0
44
20
22
24
26
28
30
32
34
36
38
40
42
CURRENT (mA)
14
16
18
019
06070-018
65
60
55
50
45
40
35
30
–50 –35 –20 –5 10 25 40 55 70 85 100
SELF-TEST (°/s)
TEMPERATURE (°C)
Figure 13. Root Allan Variance vs. TAU, ±320°/sec Range
–50 –35 –20 –5 10 25 40 55 70 85 100
TEMPERATURE (°C)
06070-
FAST MODE
NORMAL MODE
Figure 14. Current vs. Temperature
0.5
0
0.1
0.2
0.3
0.4
–0.3
–0.2
–0.1
BIAS (°/s)
–0.5
–0.4
0 30002500200015001000500
TIME (Minutes)
06070-015
Figure 15. Bias vs. Time
Figure 16. Sensitivity vs. Angular Rate, ±320°/sec Range
06070-020
Figure 17. Positive Self-Test vs. Temperature
30
–35
–40
–45
–50
–55
–60
–65
–70
SELF-TEST (°/s)
–50 –35 –20 –5 10 25 40 55 70 85 100
TEMPERATURE (°C)
06070-022
Figure 18. Negative Self-Test vs. Temperature
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 10 of 20
THEORY OF OPERATION
OVERVIEW
The core angular rate sensor integrated inside the ADIS16250/
ADIS16255 is based on the Analog Devices iMEMS technology.
This sensor operates on the principle of a resonator gyroscope.
Two polysilicon sensing structures each contain a dither frame
electrostatically driven to resonance. This provides the necessary
velocity element to produce a Coriolis force during rotation. At
two of the outer extremes of each frame, orthogonal to the
dither motion, are movable fingers placed between fixed fingers to
form a capacitive pickoff structure that senses Coriolis motion.
The resulting signal is fed to a series of gain and demodulation
stages that produce the electrical rate signal output.
The base sensor output signal is sampled using an ADC, and then
the digital data is fed into a proprietary digital calibration circuit.
This circuit contains calibration coefficients from the factory
calibration, along with user-defined calibration registers that can
be used to calibrate system-level errors.
The calibrated gyroscope data (GYRO_OUT) is made available
through output data registers along with temperature, power
supply, auxiliary ADC, and relative angle output calculations.
RELATIVE ANGLE ESTIMATE
The ANGL_OUT register offers the integration of the
GYRO_OUT data. In order for this information to be useful,
the reference angle must be known. This can be accomplished
by reading the register contents at the initial time, before starting
the monitoring, or by setting its contents to zero. This number
is reset to zero when the NULL command is used, after a RESET
command is used, and during power-up. This function can be
used to estimate change in angle over a period. The user is
cautioned to fully understand the stability requirements and
the time period over which to use this estimated relative angle
position.
FACTORY CALIBRATION
The ADIS16250/ADIS16255 provide a factory calibration that
includes correction for initial tolerance and power supply
variation. In addition, the ADIS16255 provides correction for
temperature variation. This calibration includes individual
sensor characterization and custom correction coefficient
calculation.
AUXILIARY ADC FUNCTION
The auxiliary ADC function integrates a standard 12-bit ADC
into the ADIS16250/ADIS16255 to digitize other system-level
analog signals. The output of the ADC can be monitored
through the AUX_ADC control register, as defined in Table 6.
The ADC is a 12-bit successive approximation converter. The
output data is presented in straight binary format with the full-
scale range extending from 0 V to 2.5 V. The 2.5 V upper limit
is derived from the on-chip precision internal reference.
Figure 19 shows the equivalent circuit of the analog input
structure of the ADC. The input capacitor (C1) is typically 4 pF
and can be attributed to parasitic package capacitance. The two
diodes provide ESD protection for the analog input. Care must
be taken to ensure that the analog input signals never exceed
the range of −0.3 V to +3.5 V. This causes the diodes to become
forward-biased and to start conducting. The diodes can handle
10 mA without causing irreversible damage. The resistor is a
lumped component that represents the on resistance of the
switches. The value of this resistance is typically 100 .
Capacitor C2 represents the ADC sampling capacitor and is
typically 16 pF.
V
C2
C1
R1
DD
D
D
06070-005
Figure 19. Equivalent Analog Input Circuit
Conversion Phase: Switch Open
Track Phase: Switch Closed
For ac applications, it is recommended to remove high frequency
components from the analog input signal by using a low-pass
filter on the analog input pin.
In applications where harmonic distortion and signal-to-noise
ratio are critical, the analog input must be driven from a low
impedance source. Large source impedances significantly affect
the ac performance of the ADC. This can necessitate the use of
an input buffer amplifier. When no input amplifier is used to drive
the analog input, the source impedance should be limited to
values lower than 1 k.
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 11 of 20
BASIC OPERATION
The ADIS16250/ADIS16255 are designed for simple integration
into industrial system designs, requiring only a 5.0 V power
supply and a 4-wire, industry standard serial peripheral interface
(SPI). All outputs and user-programmable functions are handled
by a simple register structure. Each register is 16 bits in length
and has its own unique bit map. The 16 bits in each register
consist of an upper (D8 to D15) byte and a lower (D0 to D7)
byte, each of which has its own 6-bit address.
SERIAL PERIPHERAL INTERFACE (SPI)
The ADIS16250/ADIS16255 serial peripheral interface (SPI)
port includes four signals: chip select (CS), serial clock (SCLK),
data input (DIN), and data output (DOUT). The CS line enables
the ADIS16250/ADIS16255 SPI port and frames each SPI event,
which consists of single or multiple data frames. When this signal is
high, the DOUT lines are in a high impedance state and the signals
on DIN and SCLK have no impact on operation. A complete
data frame contains 16 clock cycles. Because the SPI port operates
in full duplex mode, it supports simultaneous, 16-bit receive (DIN)
and transmit (DOUT) functions during the same data frame.
Refer to Table 2, Figure 2, and Figure 3 for detailed timing and
operation of the SPI port.
Writing to Registers
Figure 20 displays a typical data frame for writing a command
to a control register. In this case, the first bit of the DIN sequence is
a 1, followed by a 0, the 6-bit address, and the 8-bit data command.
Because each write command covers a single byte of data, two
data frames are required when writing the entire 16-bit space of a
register.
Reading from Registers
Reading the contents of a register requires a modification to the
sequence in Figure 20. In this case, the first two bits in the DIN
sequence are 0, followed by the address of the register. Each register
has two addresses (upper, lower), but either one can be used to
access its entire 16 bits of data. The final eight bits of the DIN
sequence are irrelevant and can be counted as don’t cares during a
read command. During the next data frame, the DOUT sequence
contains the register’s 16-bit data, as shown in Figure 21.
Although a single read command requires two separate data
frames, the full duplex mode minimizes this overhead, requiring
only one extra data frame when continuously sampling.
CS
SCL
K
DIN
06070-006
W/R A5 A4 A3 A2 A1 A0 DC7 DC6 DC5 DC4 DC3 DC2 DC1 DC0
DATA FRAME
WRITE = 1
READ = 0
REGISTER ADDRESS DATA FOR WRITE COMMANDS
DON’T CARE FOR READ COMMANDS
Figure 20. DIN Bit Sequence
ADDRESS DON’T CARE NEXT COMMAND
BASED ON PREVIOUS COMMAND 16-BIT REGISTER CONTENTS
DATA FRAME
SCLK
DIN
DON’T
CARE
DON’T
CARE
ZERO
CS
DOUT
DATA FRAME
W
/R BIT
06070-007
Figure 21. SPI Sequence for Read Commands
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 12 of 20
DATA OUTPUT REGISTER ACCESS
The ADIS16250/ADIS16255 provide access to calibrated
rotation measurements, relative angle estimates, power supply
measurements, temperature measurements, and an auxiliary
12-bit ADC channel. This output data is continuously updating
internally, regardless of user read rates. The following bit map
describes the structure of all output data registers, except
ENDURANCE, in the ADIS16250/ADIS16255.
Table 5. Register Bit Map
MSB LSB
ND EA D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
The MSB holds the new data (ND) indicator. When the output
registers are updated with new data, the ND bit goes to a 1 state.
After the output data is read, it returns to a 0 state. The EA bit is
used to indicate a system error or an alarm condition that can
result from a number of conditions, such as a power supply that
is out of the specified operating range. See the Status and
Diagnostics section for more details. The output data is either
12 bits or 14 bits in length. For all of the 12-bit output data,
Bit D13 and Bit D12 are assigned dont care status.
The output data register map is located in Table 6 and provides
all of the necessary details for accessing each register’s data.
Table 7 displays the output coding for the GYRO_OUT register.
Figure 22 provides an example SPI read cycle for this register.
Table 6. Data Output Register Information
Name Function Address Resolution (Bits) Data Format Scale Factor (per LSB)
ENDURANCE Flash Memory Write Counter 0x01, 0x00 16 Binary 1 count
SUPPLY_OUT Power Supply Data 0x03, 0x02 12 Binary 1.8315 mV
GYRO_OUT Gyroscope Data 0x05, 0x04 14 Twos Complement 0.07326°/sec1
AUX_ADC Auxiliary Analog Input Data 0x0B, 0x0A 12 Binary 0.6105 mV
TEMP_OUT Sensor Temperature Data 0x0D, 0x0C 12 Twos Complement 0.1453°C
ANGL_OUT Angle Output 0x0F, 0x0E 14 Binary 0.03663°
1 Assumes that the scaling is set to 320°/sec.
Table 7. Output Coding Example, GYRO_OUT1, 2
Rate of Rotation
±320°/sec Range ±160°/sec Range ±80°/sec Range Binary Output Hex Output Decimal
600°/sec 300°/sec 150°/sec 01 1111 1111 1111 0x1FFF 8191
320°/sec 160°/sec 80°/sec 01 0001 0001 0000 0x1110 4368
80°/sec 40°/sec 20°/sec 00 0100 0100 0100 0x0444 1092
40°/sec 20°/sec 10°/sec 00 0010 0010 0010 0x0222 546
0.07326°/sec 0.03663°/sec 0.018315°/sec 00 0000 0000 0001 0x0001 1
0°/sec 0°/sec 0°/sec 00 0000 0000 0000 0x0000 0
−0.07326°/sec −0.03663°/sec −0.018315°/sec 11 1111 1111 1111 0x3FFF −1
−40°/sec −20°/sec −10°/sec 11 1101 1101 1110 0x3DDE −546
−80°/sec −40°/sec −20°/sec 11 1011 1011 1100 0x3BBC −1092
−320°/sec −160°/sec −80°/sec 10 1110 1111 0000 0x2EF0 −4368
−600°/sec −300°/sec −150°/sec 10 0000 0000 0000 0x2000 −8192
1 Two MSBs have been masked off and are not considered in the coding.
2 Nominal sensitivity and zero offset null performance are assumed.
CS
SCLK
DIN
DOUT
ADDRESS = 000101
DATA = 1011 1101 1101 1110
NEW DATA, NO ALARM, GYRO_OUT = –40°/SECOND
W
/R BIT = 0
0
6070-008
Figure 22. Example Read Cycle, ±320°/sec Setting
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 13 of 20
PROGRAMMING AND CONTROL
CONTROL REGISTER OVERVIEW
The ADIS16250/ADIS16255 offer many programmable features
controlled by writing commands to the appropriate control
registers using the SPI. Table 8 provides a summary of these
control registers, which controls the operation of the following
parameters:
Calibration
Global commands
Operational control
Sample rate
Power management
Digital filtering
Dynamic range
DAC output
Digital I/O
Operational status and diagnostics
Self-test
Status conditions
Alarms
CONTROL REGISTER STRUCTURE
The ADIS16250/ADIS16255 uses a temporary, RAM-based
memory structure to facilitate the control registers displayed in
Table 8. The start-up configuration is stored in a flash memory
structure that automatically loads into the control registers during
the start-up sequence. Each nonvolatile register has a correspond-
ing flash memory location, for storing the latest configuration
contents. Since flash memory has endurance limitations, the
contents of each nonvolatile register must be manually stored
to flash (note that the contents of the control register contents
are only nonvolatile when they are stored to flash). The manual
flash update command, made available in the COMMAND
register, provides this function. The ENDURANCE register
provides a counter that allows for memory reliability manage-
ment against the write cycle specification.
Table 8. Control Register Memory Map
Register Name Type Volatility Address Bytes Function Reference Table
GYRO_OFF R/W Nonvolatile 0x15, 0x14 2 Gyroscope bias offset factor Table 9, Table 10
GYRO_SCALE R/W Nonvolatile 0x17, 0x16 2 Gyroscope scale factor Table 11, Table 12
0x18 to 0x1F 8 Reserved
ALM_MAG1 R/W Nonvolatile 0x21, 0x20 2 Alarm 1 amplitude threshold and polarity Table 31, Table 32
ALM_MAG2 R/W Nonvolatile 0x23, 0x22 2 Alarm 2 amplitude threshold and polarity Table 35, Table 36
ALM_SMPL1 R/W Nonvolatile 0x25, 0x24 2 Alarm 1 sample period Table 33, Table 34
ALM_SMPL2 R/W Nonvolatile 0x27, 0x26 2 Alarm 2 sample period Table 37, Table 38
ALM_CTRL R/W Nonvolatile 0x29, 0x28 2 Alarm control register Table 39, Table 40
0x2A to 0x2F 6 Reserved
AUX_DAC R/W Volatile 0x31, 0x30 2 Auxiliary DAC data Table 21, Table 22
GPIO_CTRL R/W Volatile 0x33, 0x32 2 Auxiliary digital I/O control register Table 23, Table 24
MSC_CTRL R/W Nonvolatile10x35, 0x34 2 Miscellaneous control register Table 26, Table 27
SMPL_PRD R/W Nonvolatile 0x37, 0x36 2 ADC sample period control Table 15, Table 16
SENS/AVG R/W Nonvolatile 0x39, 0x38 2
Defines the dynamic range (sensitivity setting)
and the number of taps for the digital filter
Table 19, Table 20
SLP_CNT R/W Volatile 0x3B, 0x3A 2
Counter used to determine length of power-
down mode
Table 17, Table 18
STATUS R Volatile 0x3D, 0x3C 2 System status register Table 28, Table 29
COMMAND W N/A 0x3F, 0x3E 2 System command register Table 13, Table 14
1 The contents of the upper byte are nonvolatile; the contents of the lower byte are volatile.
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 14 of 20
CALIBRATION
The ADIS16250/ADIS16255 are factory-calibrated for
sensitivity and bias. It also provides several user calibration
functions for simplifying field-level corrections. The calibra-
tion factors are stored in nonvolatile memory and are applied
using the following linear calibration equation:
y = mx + b
where:
y is the calibrated output data.
x is the precalibration data.
m is the sensitivity scale factor.
b is the offset scale factor.
There are three options for system-level calibrations of the
bias in the ADIS16250/ADIS16255: auto-null, factory
calibration restore, and manual calibration updates. The
auto-null and factory reset options are described in the
Global Commands section. Optional field-level calibrations
use the preceding equation and require two steps:
1. Characterize the behavior of the ADIS16250/ADIS16255
at predefined critical operating conditions.
2. Use this characterization data to calculate and load the
contents of GYRO_OFF (b) and GYRO_SCALE (m).
The GYRO_OFF provides a calibration range of ±37.5°/sec,
and its contents are nonvolatile. The GYRO_SCALE register
provides a calibration range of 0 to 1.9995, and its contents
are also nonvolatile.
Table 9. GYRO_OFF Register Definition
Address Scale1 Default Format Access
0x15,
0x14
0.018315°/sec 0x0000 Twos
complement
R/W
1 Scale is the weight of each LSB.
Table 10. GYRO_OFF Bit Descriptions
Bit Description
15:12 Not used
11:0 Data bits
Table 11. GYRO_SCALE Register Definition
Address Scale1 Default2 Format Access
0x17, 0x16 0.0487% 0x0800 Binary R/W
1 Scale is the weight of each LSB.
2 Equates to a scale factor of one.
Table 12. GYRO_SCALE Bit Descriptions
Bit Description
15:12 Not used
11:0 Data bits
GLOBAL COMMANDS
The ADIS16250/ADIS16255 provide global commands for common
operations such as auto-null, factory calibration restore, manual
flash update, auxiliary DAC latch, and software reset. Each of these
global commands has a unique control bit assigned to it in the
COMMAND register and is initiated by writing a 1 to its assigned bit.
The auto-null function does two things: it resets the contents of the
ANGL_OUT register to zero, and it adjusts the GYRO_OUT register
to zero. This automated adjustment takes two steps:
1. Read GYRO_OUT.
2. Write the opposite of this value into the GRYO_OFF register.
Sensor noise influences the accuracy of this step.
For optimal calibration accuracy, set the number of filtering taps to
its maximum, wait for the appropriate number of samples to
process through the filter, and then exercise this option.
The factory calibration restore command sets the contents of
GYRO_OFF to 0x0000 and GYRO_SCALE to 0x0800, erasing any
field-level calibration contents. The manual flash update writes the
contents of each nonvolatile register into flash memory for storage.
This process takes approximately 50 ms and requires the power
supply voltage to be within specification for the duration of the
event. It is worth noting that this operation also automatically
follows the auto-null and factory reset commands.
The DAC latch command loads the contents of AUX_DAC into the
DAC latches. Since the AUX_DAC contents must be updated one
byte at a time, this command ensures a stable DAC output voltage
during updates. Finally, the software reset command sends the
ADIS16250/ADIS16255 digital processor into a restart sequence,
effectively doing the same thing as the RST line.
Table 13. COMMAND Register Definition
Address Default Format Access
0x3F, 0x3E N/A N/A Write only
Table 14. COMMAND Bit Descriptions
Bit Description
15:8 Not used
7 Software reset command
6:4 Not used
3 Manual flash update command
2 Auxiliary DAC data latch
1 Factory calibration restore command
0 Auto-null command
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 15 of 20
OPERATIONAL CONTROL
Internal Sample Rate
The internal sample rate defines how often data output
variables are updated, independent of the rate at which they
are read out on the SPI port. The SMPL_PRD register controls
the ADIS16250/ADIS16255 internal sample rate and has two
parts: a selectable time base and a multiplier. The sample
period can be calculated using the following equation:
TS = TB × (NS + 1)
where:
TS is the sample period.
TB is the time base.
NS is the increment setting.
The default value is the maximum 256 samples per second,
and the contents of this register are nonvolatile.
Table 15. SMPL_PRD Register Definition
Address Default Format Access
0x37, 0x36 0x0001 N/A R/W
Table 16. SMPL_PRD Bit Descriptions
Bit Description
15:8 Not used
7 Time base, 0 = 1.953 ms, 1 = 60.54 ms
6:0 Multiplier
The following is an example calculation of the sample period
for the ADIS16250/ADIS16255:
If SMPL_PRD = 0x0007, B7B0 = 00000111
B7 = 0  TB = 1.953 ms
B6B0 = 000000111  NS = 7
TS = TB × (NS + 1) = 1.953 ms × (7 + 1) = 15.624 ms
fS = 1TS = 64 SPS
The sample rate setting has a direct impact on the SPI data
rate capability. For sample rates of 64 SPS and above, the SPI
SCLK can run at a rate up to 2.5 MHz. For sample rates
below 64 SPS, the SPI SCLK can run at a rate up to 1 MHz.
The sample rate setting also affects the power dissipation.
When the sample rate is set below 64 SPS, the power dissipation
reduces by a factor of 60%. The two different modes of
operation offer a system-level trade-off between performance
(sample rate, serial transfer rate) and power dissipation.
Power Management
In addition to offering two different performance modes for
power optimization, the ADIS16250/ADIS16255 offer a
programmable shutdown period. Writing the appropriate
sleep time to the SLP_CNT register shuts the device down
for the specified time. The following example provides an
illustration of this relationship:
B7B0 = 00000110
Sleep period = 3 sec
After completing the sleep period, the ADIS16250/ADIS16255 return
to normal operation. If measurements are required before sleep
period completion, the ADIS16250/ADIS16255 can be awakened
by putting the CS line in a zero logic state. Otherwise, the CS line
must be kept high to maintain sleep mode.
Table 17. SLP_CNT Register Definition
Address Scale1 Default Format Access
0x3B, 0x3A 0.5 sec 0x0000 Binary R/W
1 Scale is the weight of each LSB.
Table 18. SLP_CNT Bit Descriptions
Bit Description
15:8 Not used
7:0 Data bits
Analog Bandwidth
The analog bandwidth of the ADIS16250/ADIS16255 is 50 Hz.
This bandwidth can be reduced by placing an external capacitor
across the RATE and FILT pins. In this case, the analog bandwidth
can be calculated using the following equation:
fOUT = 1/(2 × π × ROUT × (COUT + 0.068 µF))
where:
ROUT = 45.22 kΩ.
COUT is the external capacitance.
Digital Filtering
The ADIS16250/ADIS16255 GYRO_OUT signal path has a nominal
analog bandwidth of 50 Hz. The ADIS16250 provides a Bartlett
Window FIR filter for additional noise reduction on all of the output
data registers. The SENS/AVG register stores the number of taps in
this filter in seven power-of-two step sizes (that is, 2M = 1, 2, 4, 16,
32, 64, and 128). Filter setup requires one simple step: write the
appropriate M factor to the assigned bits in the SENS/AVG register.
The bit assignments are listed in Table 20 . The following equation
offers a frequency response relationship for this filter:
)sin(
)sin(
)()()( 2
S
S
AA
BtfN
tfN
fHfHfH ××π×
×π
==
0
–160
–140
–120
–100
–80
–60
–40
–20
0.001 0.01 0.1 1
MAGNITUDE (dB)
FREQUENCY (f/fs)
N = 128
N = 16
N = 2
N = 4
06070-009
Figure 23. Bartlett Window FIR Frequency Response
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 16 of 20
Dynamic Range
The ADIS16250/ADIS16255 provide three dynamic range
settings: ±80°/sec, ±160°/sec, and ±320°/sec. The lower
dynamic range settings (80, 160) limit the minimum filter
tap sizes in order to maintain the resolution as the maximum
rate measurements decrease. The recommended order for
programming the SENS/AVG register is (1) dynamic range
and then (2) filtering response. The contents of the
SENS/AVG register are nonvolatile.
Table 19. SENS/AVG Register Definition
Address Default Format Access
0x39, 0x38 0x0402 Binary R/W
Table 20. SENS/AVG Bit Descriptions
Bit Value Description
15:11 Not used
10:8 Sensitivity selection bits
100 320°/sec (default condition)
010 160°/sec, filter taps ≥ 4 (Bits[3:0] ≥ 0x02)
001 80°/sec, filter taps ≥16 (Bits[3:0] ≥ 0x04)
7:4 Not used
3:0 Filter tap setting, M = binary number
(number of taps, N = 2M)
Auxiliary DAC
The auxiliary DAC provides a 12-bit level adjustment
function. The AUX_DAC register controls the operation of
this feature. It offers a rail-to-rail buffered output that has a
range of 0 V to 2.5 V. The DAC can drive its output to within
5 mV of the ground reference when it is not sinking current.
As the output approaches ground, the linearity begins to
degrade (100 LSB beginning point). As the sink current
increases, the nonlinear range increases. The DAC output
latch function, contained in the COMMAND register,
provides continuous operation while writing each byte of
this register. The contents of this register are volatile, which
means that the desired output level must be set after every
reset and power cycle event.
Table 21. AUX_DAC Register Definition
Address Default Format Access
0x31, 0x30 0x0000 Binary R/W
Table 22. AUX_DAC Bit Descriptions
Bit Description
15:12 Not used
11:0 Data bits
General-Purpose I/O
The ADIS16250/ADIS16255 provide two general-purpose pins
that enable digital I/O control using the SPI. The GPIO_CTRL
control register establishes the configuration of these pins and
handles the SPI-to-pin controls. Each pin provides the flexibility of
both input (read) and output (write) operations. For example,
writing a 0x0202 to this register establishes Line 0 as an output and
sets its level as a one. Writing 0x0000 to this register establishes both
lines as inputs, and their status can be read through Bit 0 and Bit 1
of this register.
The digital I/O lines are also available for data-ready and alarm/error
indications. In the event of conflict, the following priority structure
governs the digital I/O configuration:
1. MSC_CTRL
2. ALM_CTRL
3. GPIO_CTRL
Table 23. GPIO_CTRL Register Definition
Address Default Format Access
0x33, 0x32 0x0000 N/A R/W
Table 24. GPIO_CTRL Bit Descriptions
Bit Description
15:10 Not used
9 General-purpose I/O Line 1 polarity
1 = high
0 = low
8 General-purpose I/O Line 0 polarity
1 = high
0 = low
7:2 Not used
1 General-purpose I/O Line 1, data direction control
1 = output
0 = input
0 General-purpose I/O Line 0, data direction control
1 = output
0 = input
STATUS AND DIAGNOSTICS
The ADIS16250/ADIS16255 provide a number of status and
diagnostic functions. Table 25 provides a summary of these
functions, along with their appropriate control registers.
Table 25. Status and Diagnostic Functions
Function Register
Data-ready I/O indicator MSC_CTRL
Self-test, mechanical check for MEMS sensor MSC_CTRL
Status, check for predefined error conditions STATUS
Flash memory endurance ENDURANCE
Alarms, configure and check for user-
specific conditions
ALM_MAG1/2
ALM_SMPL1/2
ALM_CTRL
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 17 of 20
Data-Ready I/O Indicator
The data-ready function provides an indication of updated
output data. The MSC_CTRL register provides the opportu-
nity to configure either of the general-purpose I/O pins (DIO0
and DIO1) as a data-ready indicator signal. After each output
register update, the digital I/O changes states, then returns to its
original state, creating a pulsed waveform. The duty cycle of that
waveform is in between 15% and 35%.
Table 26. MSC_CTRL Register Definition
Address Default Format Access
0x35, 0x34 0x0000 N/A R/W
Table 27. MSC_CTRL Bit Descriptions
Bit Description
15:11 Not used
10 Internal self-test enable
1 = enabled
0 = disabled
9 External negative rotation self-test enable
1 = enabled
0 = disabled
8 External positive rotation self-test enable
1 = enabled
0 = disabled
7:3 Not used
2 Data-ready enable
1 = enabled
0 = disabled
1 Data-ready polarity
1 = active high
0 = active low
0 Data-ready line select
1 = DIO1
0 = DIO0
Self-Test
The MSC_CTRL register also provides a self-test function,
which verifies the MEMS sensor’s mechanical integrity.
There are two different self-test options: (1) internal self-test
and (2) external self-test. The internal test provides a simple,
two-step process for checking the MEMS sensor: (1) start
the process by writing a 1 to Bit 10 in the MSC_CTRL
register and (2) check the result by reading Bit 5 of the
STATUS register, after 35 ms.
The external self-test is a static condition that can be enabled
and disabled. In this test, both positive and negative MEMS
sensor movements are available. After writing to the appropri-
ate control bit, the GYRO_OUT register reflects the changes
after a delay that reflects the sensor signal chain response time.
For example, the standard 52 Hz bandwidth reflects an exponential
response with a time constant of 3.2 ms. If the bandwidth is reduced
externally (capacitor across RATE and FILT) or internally (increasing
the number of filter taps, SENS/AVG), this time constant increases.
For the internal self-test option, increasing the delay can produce
false alarms, since the internal timing for this function is optimized
for maximum bandwidth. The appropriate bit definitions for self-
test are listed in Table 26 and Table 27.
Status Conditions
The STATUS register contains the following error-condition flags:
Alarm conditions, self-test status, angular rate over range, SPI
communication failure, control register update failure, and power
supply out of range. See Table 28 and Table 29 for the appropriate
register access and bit assignment for each flag.
The bits assigned for checking power supply range and angular rate
over range automatically reset to 0 when the error condition no
longer exists. The remaining error-flag bits in the STATUS register
require a read in order to return them to 0. Note that a STATUS
register read clears all of the bits to 0.
Table 28. STATUS Register Definition
Address Default Format Access
0x3D, 0x3C 0x0000 N/A Read-only
Table 29. STATUS Bit Descriptions
Bit Description
15:10 Not used
9 Alarm 2 status
1 = active
0 = inactive
8 Alarm 1 status
1 = active
0 = inactive
7:6 Not used
5 Self-test diagnostic error flag
1 = error condition
0 = normal operation
4 Angular rate over range
1 = error condition
0 = normal operation
3 SPI communications failure
1 = error condition
0 = normal operation
2 Control register update failed
1 = error condition
0 = normal operation
1 Power supply above 5.25 V
1 = above 5.25 V
0 = below 5.25 V (normal)
0 Power supply below 4.75 V
1 = below 4.75 V
0 = above 4.75 V (normal)
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 18 of 20
Flash Memory Endurance
The ENDURANCE register maintains a running count of writes
to the flash memory. It provides up to 32,768 counts. Note that
if this count is exceeded, the register wraps around, and goes
back to zero, before beginning to increment again.
Table 30. ENDURANCE Register Definition
Address Default Format Access
0x01, 0x00 N/A Binary Read-only
Alarms
The ADIS16250/ADIS16255 provide two independent alarm
options for event detection. Event detections occur when output
register data meets the configured conditions. Configuration
options are:
All output data registers are available for monitoring as the
source data.
The source data can be filtered or unfiltered.
Comparisons can be static or dynamic (rate of change).
The threshold levels and times are configurable.
Comparison can be greater than or less than.
The ALM_MAG1 register and the ALM_MAG2 register both
establish the threshold level for detecting events. They take on the
format of the source data and provide a bit for establishing the
greater than/less than comparison direction. When making
dynamic comparisons, the ALM_SMPL1 register and the
ALM_SMPL2 register establish the number of averages taken for
the source data as a reference for comparison. In this configuration,
each subsequent source data sample is subtracted from the previous
one, establishing an instantaneous delta. The ALM_CTRL register
controls the source data selection, static/dynamic selection, filtering
selection, and digital I/O usage for the alarms.
The rate of change calculation is
?oris
)()1(
1
1
CC
n
DS
C
MYalarmchangeofRate
nyny
N
Y
DS
<>
+=
=
N
where:
NDS is the number of samples in ALM_SMPL1/2.
y(n) is the sampled output data.
MC is the magnitude for comparison in ALM_MAG1/2.
YC is the factor to be compared with MC.
> or < is determined by the MSB in ALM_MAG1/2.
Table 31. ALM_MAG1 Register Definition
Address Default Format Access
0x21, 0x20 0x0000 N/A R/W
Table 32. ALM_MAG1 Bit Descriptions
Bit Description
15 Comparison polarity: 1 = greater than, 0 = less than
14 Not used
13:0 Data bits: format matches source data format
Table 33. ALM_SMPL1 Register Definition
Address Default Format Access
0x25, 0x24 0x0000 Binary R/W
Table 34. ALM_SMPL1 Bit Descriptions
Bit Description
15:8 Not used
7:0 Data bits
Table 35. ALM_MAG2 Register Definition
Address Default Format Access
0x23, 0x22 0x0000 N/A R/W
Table 36. ALM_MAG2 Bit Descriptions
Bit Description
15 Comparison polarity
1 = greater than
0 = less than
14 Not used
13:0 Data bits: format matches source data format
Table 37. ALM_SMPL2 Register Definition
Address Default Format Access
0x27, 0x26 0x0000 Binary R/W
Table 38. ALM_SMPL2 Bit Designations
Bit Description
15:8 Not used
7:0 Data bits
Table 39. ALM_CTRL Register Definition
Address Default Format Access
0x29, 0x28 0x0000 N/A R/W
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 19 of 20
Table 40. ALM_CTRL Bit Descriptions
Bit Value Description
15 Rate of change (ROC) enable for Alarm 2
1 = rate of change
0 = static level
14:12 Alarm 2 source selection
000 Disable
001 Power supply output
010 Gyroscope output
011 Inactive
100 Inactive
101 Auxiliary ADC output
110 Temperature sensor output
111 Inactive
11 Rate of change (ROC) enable for Alarm 1
1 = rate of change
0 = static level
10:8 Alarm 1 source selection
000 Disable
001 Power supply output
010 Gyroscope output
011 Inactive
100 Inactive
101 Auxiliary ADC output
110 Temperature sensor output
111 Inactive
7:5 Not used
4 Filtered data comparison
1 = filtered data
0 = unfiltered data
3 Not used
2 Alarm output enable
1 = enabled
0 = disabled
1 Alarm output polarity
1 = active high
0 = active low
0 Alarm output line select
1 = DIO1
0 = DIO0
OBSOLETE
ADIS16250/ADIS16255
Rev. D | Page 20 of 20
022007
OUTLINE DIMENSIONS
-B
SIDE VIEW
TOP VIEW BOTTOM VIEW
PIN 1
INDICATOR
1.000 BSC
(20×)
5.50
MAX
11.00
TYP
1
5
610
11
15
16 20
11.15
MAX
7.600
BSC
(4×)
3.800
BSC
(8×)
7.00
TYP
10.173
BSC
(2×)
0.200
MIN
(ALL SIDES)
0.900 BSC
(16×)
0.373 BSC
(20×)
Figure 24. 20-Terminal Stacked Land Grid Array [LGA]
(CC-20-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADIS16250ACCZ1−40°C to +85°C 20-Terminal Stacked Land Grid Array [LGA] CC-20-1
ADIS16255ACCZ1
−40°C to +85°C 20-Terminal Stacked Land Grid Array [LGA] CC-20-1
ADIS16250/PCBZ1
Evaluation Board for the ADIS16250
ADIS16255/PCBZ1
Evaluation Board for the ADIS16255
1 Z = RoHS Compliant Part.
©2006–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06070-0-11/09(D)
OBSOLETE