4N35S-TA - LITE-ON ELECTRONICS

Features

x High brightness

x Small size

x Industrial standard footprint

x Diused optics

x Top emitting or right angle emitting

x Compatible with IR soldering

x Compatible for use with light piping

x Available in 8 mm tape on 7" diameter reel

xReel sealed in zip locked moisture barrier bags

Applications

x LCD backlighting

x Pushbutton backlighting

x Front panel indicator

x Symbol indicator

x Microdisplays

x Small message panel signage

Description

These small chip-type LEDs utilize high efficient

InGaN/SiC material to deliver competitively priced high

performance blue and green. These 525 nm green and

470 nm blue are unique hues which provide color dif-

ferentiation to a product.

These ChipLEDs come in either top emitting packages

(HSMx-C170, C190, C191, and C150) or in a side emitting

package (HSMx-C110 and HSMX-C120). The side emit-

ting package is especially suitable for LCD backlight-

ing application. The top emitting packages with their

wide viewing angle are suitable for direct backlight-

ing application or being used with light pipes. In order

to facilitate pick and place operation, these ChipLEDs

are shipped in tape and reel with 4000 units per reel

for HSMx-C120, C170, C190, and C191 packages, and

3000 units per reel for HSMx-C110 and C150 packages.

All packages are compatible with IR soldering and binned

by both color and intensity.

Device Selection Guide

Package Dimension (mm) [1], [2] Ingan Green Ingan Blue Package Description

3.2 (L) x 1.5 (W) x 1.0 (H) HSMM-C110 HSMN-C110 Untinted, Non-diused

1.6 (L) x 1.0 (W) x 0.6 (H) HSMM-C120 HSMN-C120 Untinted, Nondiused

3.2 (L) x 1.6 (W) x 1.1 (H) HSMM-C150 HSMN-C150 Untinted, Diused

2.0 (L) x 1.25 (W) x 0.8 (H) HSMM-C170 HSMN-C170 Untinted, Diused

1.6 (L) x 0.8 (W) x 0.8 (H) HSMM-C190 HSMN-C190 Untinted, Diused

1.6 (L) x 0.8 (W) x 0.6 (H) HSMN-C191 Untinted, Diused

Notes:

1. Dimensions in mm.

2. Tolerance ± 0.1 mm unless otherwise noted.

CAUTION: HSMM-C1xx and HSMN-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate

precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.

HSMM-C110/C120/C150/C170/C190

HSMN-C110/C120/C150/C170/C190/C191

SMT ChipLEDs

Data Sheet

Package Dimensions

2.0 (0.079 )

0.3 (0.012)

0.4 ± 0.15

(0.016 ± 0.006)

0.3 (0.012)

POLARITY

CATHODE

MARK

0.8 (0.031)

0.4 ± 0.15

(0.016 ± 0.006)

1.4

(0.055)

DIFFUSED

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.25 (0.049)

HSMx-C170

CATHODE LINE

HSMx-C190

1.6

(0.063 )

0.3 (0.012)

0.3 ± 0.15

(0.012 ± 0.006)

0.3 (0.012)

POLARITY

CATHODE

MARK

0.8 (0.031)

0.3 ± 0.15

(0.012 ± 0.006)

1.0

(0.039)

DIFFUSED EPOXY

PC BOARD

SOLDERING

TERMINAL

0.8 (0.031)

0.7 (0.028) MIN.

CATHODE LINE

3.2 (0.126 )

0.5 (0.020)

0.8 (0.031)

POLARITY

CATHODE

LINE

1.5 (0.059)

LED DIE

CLEAR

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.0 (0.039)

2.6 (0.102 )

1.6 (0.063 )

CATHODE LINE

HSMx-C110

3.2 (0.126 )

1.6 (0.063)

0.5 (0.020)

POLARITY

CATHODE M ARK

1.0 (0.039)

3 – 0.3 (0.012)

1.2 (0.047)

0.3 (0.012)

LED DIE

CLEAR EPO XY

PC BOARD

SO LDERING

TER M INAL

0.6 (0.024)

CATHODE LINE

HSM x-C 120

Package Dimensions, continued

Absolute Maximum Ratings at TA = 25˚C

HSMM-C110/C120/C170/C190/C150

Parameter HSMN-C110/C120/C170/C190/C191/C150 Units

DC Forward Current [1] 20 mA

Power Dissipation 78 mW

Reverse Voltage (IR = 100 μA) 5 V

Led Junction Temperature 95 ˚C

Operating Temperature Range –40 to +85 ˚C

Storage Temperature Range –40 to +85 ˚C

Soldering Temperature See reow soldering prole (Figure 7)

Note:

1. Derate linearly as shown in Figure 4.

Electrical Characteristics at TA = 25˚C

Forward Voltage Reverse Breakdown Capacitance C Thermal

F (Volts) VR (Volts) (pF), VF = 0, Resistance

@ IF = 20 mA @ IR = 100 μA f = 1 MHz RTJ–PIN (˚C/W)

Part Number Typ. Max. Min. Typ. Typ.

HSMM-C110/C150 3.3 3.9 5 70 450

HSMN-C110/C150 3.3 3.9 5 70 450

HSMM-C120 3.3 3.9 5 45 450

HSMN-C120 3.3 3.9 5 45 450

HSMM-C170/C190 3.3 3.9 5 70 300

HSMN-C170/C190/C191 3.3 3.9 5 70 300

VF Tolerance: ±0.1 V.

HSMx-C150

3.2 (0.126 )

0.5 (0.020)

0.50 ± 0.2

(0.020 ± 0.008)

0.6 (0.024)

POLARITY

CATHODE

MARK

1.1 (0.043)

0.50 ± 0.2

(0.020 ± 0.008)

2.0 (0.079)

DIFFUSED

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.6 (0.063)

CATHODE LINE

NOTES:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.

HSMx-C191

1.6

(0.063 )

0.3 (0.012)

0.3 ± 0.15

(0.012 ± 0.006)

0.3 (0.012)

POLARITY

CATHODE

MARK

0.6 (0.023)

0.3 ± 0.15

(0.012 ± 0.006)

1.0

(0.039)

DIFFUSED EPOXY

PC BOARD

SOLDERING

TERMINAL

0.8 (0.031)

CATHODE LINE

0.7 (0.028) MIN.

Optical Characteristics at TA = 25˚C

Luminous Color, Viewing Luminous

Intensity Peak Dominant Angle Ecacy

V (mcd) Wavelength Wavelength 2 T1/2 KV

@ 20 mA[1] Opeak (nm) Od[2] (nm) Degrees[3] (lm/w)

Part Number Color Min. Typ. Typ. Typ. Typ. Typ.

HSMM-C110 Green 45 126 523 525 130 490

HSMM-C120 Green 45 120 523 525 155 490

HSMM-C170/C190/ Green 45 120 523 525 170 490

/C150

HSMN-C110 Blue 11.2 39 468 470 130 77

HSMN-C120 Blue 11.2 35 468 470 155 80

HSMN-C170/C190/ Blue 11.2 35 468 470 170 77

C191/C150

Notes:

1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.

2. The dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.

3. T1/2 is the o-axis angle where the luminous intensity is 1/2 the peak intensity.

Color Bin Limits[1] Light Intensity (Iv) Bin Limits[1]

Intensity (mcd) Intensity (mcd)

Bin ID Min. Max. Bin ID Min. Max.

A 0.11 0.18 N 28.50 45.00

B 0.18 0.29 P 45.00 71.50

C 0.29 0.45 Q 71.50 112.50

D 0.45 0.72 R 112.50 180.00

E 0.72 1.10 S 180.00 285.00

F 1.10 1.80 T 285.00 450.00

G 1.80 2.80 U 450.00 715.00

H 2.80 4.50 V 715.00 1125.00

J 4.50 7.20 W 1125.00 1800.00

K 7.20 11.20 X 1800.00 2850.00

L 11.20 18.00 Y 2850.00 4500.00

M 18.00 28.50

Note:

1. Bin categories are established for classication of products. Products may not be available in all

categories. Please contact your Avago representative for information on currently available bins.

2. The Iv binning specication set-up is for lowest allowable Iv binning only. There is no upper Iv bin

limits.

Note:

1. Bin categories are established for class-

ication of products. Products may not be

available in all categories. Please contact

your Avago representative for information

on currently available bins.

Blue Color Bins[1]

Dom. Wavelength (nm)

Bin ID Min. Max.

A 460.0 465.0

B 465.0 470.0

C 470.0 475.0

D 475.0 480.0

Tolerance: ± 1 nm

InGaN Green

Color Bins[1]

Dom. Wavelength (nm)

Bin ID Min. Max.

A 515.0 520.0

B 520.0 525.0

C 525.0 530.0

D 530.0 535.0

Tolerance: ± 1 nm

Tolerance: ± 15%

020 60 80 100

F MAX.

- MAXIMUM FORWARD CURRENT - mA

- AMBIENT TEMPERATURE -

Rθ

J-A

= 800

C/W

Rθ

J-A

= 600

C/W

05 15

IF - FORWARD CURRENT - mA

0.4

1.0

LUMINOUS INTENSITY

(NORMALIZED AT 20 mA)

0.6

0.2

0.8

10 25

1.2

Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage.

Figure 3. Luminous intensity vs. forward current.

Figure 4. Maximum forward current vs.

ambient temperature.

Figure 5. Relative intensity vs. angle for HSMx-C110.

100

0.12.0 2.5 3.5 4.0

FORWARD VOLTAGE V

IF FORWARD CURRENT mA

3.0

WAVELENGTH nm

RELATIVE INTENSITY %

1.0

0.5

0500 550 600 650

BLUE GREEN

450400350

RELATIVE INTENSITY - %

1.00

ANGLE

0.80

0.60

0.50

0.70

0.20

0.10

0.30

0.40

0.90

-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80

RELATIVE INTENSITY - %

1.00

ANGLE

0.80

0.60

0.50

0.70

0.20

0.10

0.30

0.40

0.90

-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80

Figure 7. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.

RELATIVE INTENSITY - %

1.00

ANGLE

0.80

0.60

0.50

0.70

0.20

0.10

0.30

0.40

0.90

-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80

100

RELATIVE INTENSITY

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

ANGLE

100

RELATIVE INTENSITY

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

ANGLE

Figure 6. Relative intensity vs. angle for HSMx-C120

Figure 10. Recommended soldering pattern for HSMx-C110. Figure 11. Recommended soldering pattern for HSMx-C120.

Figure 8. Recommended reow soldering prole. Figure 9. Recommended Pb-free reow soldering prole.

5.0 (0.200)

1.0 (0.039)

1.5

(0.059)

1.5

(0.059)

2.0

(0.079)

0.9 (0.035)

0.2 (0.008)

0.9 (0.035)

CENTERING

BOARD

1.2 (0.047)

1.2

(0.047)

0.9

(0.035)

1.2

(0.047)

0.8 (0.031)

0.8

(0.031) 0.7

(0.028)

0.8

(0.031)

NOTE:

1. All dimensions in millimeters (inches).

Figure 12. Recommended soldering pattern for HSMx-C170. Figure 13. Recommended soldering pattern for HSMX-C190/C191

230°C MAX.

10 SEC. MAX.

4°C/SEC.

MAX.

OVER 2 MIN.

TIME

TEMPERATURE

4°C/SEC. MAX.

140-160°C

3°C/SEC. MAX.

217 °C

200 °C

60 - 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

150 °C

255 - 260 °C

60 SEC. MAX.

10 SEC. MAX.

TIME

TEMPERATURE

0.7 (0.028)

0.8

(0.031)

0.8

(0.031)

1.2

(0.047)

0.4 (0.016)

0.15 (0.006)

0.4 (0.016)

CENTERING

BOARD

Figure 15. Reeling orientation.

Figure 16. Reel dimensions.

Figure 14. Recommended soldering pattern for HSMx-C150.

1.5 (0.059)

1.5

(0.059)

1.5

(0.059)

2.0

(0.079)

CATHODE SIDE

PRINTED LABEL

USER FEED DIRECTION

10.50 ± 1.0 (0.413 ± 0.039)

59.60 ± 1.00

(2.346 ± 0.039)

∅

20.20 MIN.

(

∅

0.795 MIN.)

178.40 ± 1.00

(7.024 ± 0.039)

3.0 ± 0.5

(0.118 ± 0.020)

4.0 ± 0.5

(0.157 ± 0.020)

5.0 ± 0.5

(0.197 ± 0.020)

∅

13.1 ± 0.5

(

∅

0.516 ± 0.020)

8.0 ± 1.0 (0.315 ± 0.039)

NOTE:

1. All dimensions in millimeters (inches).

Figure 17. Tape dimensions.

Figure 18. Tape leader and trailer dimensions.

Reow Soldering:

For more information on reow solder-

ing, refer to Application Note AN-1060,

Surface Mounting SMT LED Indicator

Components.

Storage Condition:

5 to 30°C @ 60%RH max.

Baking is required before mounting, if:

1. Humidity Indicator Card is > 10% when

read at 23 ± 5°C.

2. Device expose to factory conditions

<30°C/60%RH more than 672 hours.

Recommended baking condition:

60±5°C for 20 hours.

8.00 ± 0.30

(0.315 ± 0.012)

USER FEED

DIRECTION

DIM. A

(SEE TABLE 1)

3.50 ± 0.05

(0.138 ± 0.002)

1.75 (0.069)

DIM. C

(SEE TABLE 1)

0.20 ± 0.05

(0.008 ± 0.002)

CARRIER TAPE

COVER TAPE

DIM. B

(SEE TABLE 1)

4.00 (0.157)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157)

1.50 (0.059)

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

CATHODE

DIM. A

± 0.10 (± 0.004)

DIM. B

± 0.10 (± 0.004)PART NUMBER

DIM. C

± 0.10 (± 0.004)

HSMx-C170 SERIES 2.30 (0.091) 1.45 (0.057) 0.95 (0.037)

HSMx-C190 SERIES 1.75 (0.069) 0.90 (0.035) 0.90 (0.035)

HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)

HSMx-C191 SERIES 1.85 (0.073) 0.88 (0.035) 0.85 (0.033)

HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050)

HSMx-C110/120

POSITION IN

CARRIER TAPE

DIM. B

(SEE TABLE 1)

DIM. A

(SEE TABLE 1)

R 1.0 ± 0.05

(0.039 ± 0.002)

FOR HSMx-C110

R 0.5 ± 0.05

(0.020 ± 0.002)

FOR HSMx-C120

HSMx-C120 SERIES 1.90 (0.075) 1.15 (0.045) 0.75 (0.030)

END START

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MOUNTED WITH

COMPONENTS

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MINIMUM OF

230 mm

(9.05 INCH)

MAY CONSIST

OF CARRIER

AND/OR

COVER TAPE.

NOTES:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-0592EN - May 5, 2010