MT29AZ5A3CHHWD-18AIT
Data Sheets (1)
MT29AZ5A3CHHWD-18AIT.84F, MT29AZ5A3CHHWD-18AAT.84F
File Type: PDF Updated: 01/2017
Data Sheet
R
162-Ball NAND Flash with Automotive LPDDR2 MCP Data Sheet Automotive
Embedded Memory Solutions
Multichip Packages
NAND LPDDR2
NAND-Based MCP
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Specs
Orderable Parts for: MT29AZ5A3CHHWD-18AIT
Status Media FBGA
Code
SPD
Data
Chipset
Validation PLP Start
Date
Alternative
Part
MT29AZ5A3CHHWD-
18AIT.84F Production N/A JYA34 N/A N/A No N/A
Detailed Specifications
Part
Status
Code
Production NAND
Density 4Gb DRAM
Type LPDDR2 DRAM
Density 2Gb
Bus Width x8 Secondary
Bus Width x32 RoHS Yes Voltage 1.8V
Package VFBGA Pin Count 162-ball Clock Rate 533 MHz Operating
Temp -40C to +85C
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RoHS Certificates
RoHS Certificate of Compliance (PDF)
Part-specific certification of how this product meets the requirements of the current DIRECTIVE
2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.
File Type: (PDF) Updated: 01/2017
RoHS Certificates
MT29AZ5A3CHHWD 18AIT
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China RoHS Certificate (PDF)
Part-specific certification as required by China's Management Methods for Controlling Pollution by
Electronic Information Products.
File Type: (PDF) Updated: 01/2017
RoHS Certificates
MT29AZ5A3CHHWD 18AIT
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Documentation & Support
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Technical Notes
SEARCH (2) NAND-BASED MCP TECHNICAL NOTES
(PDF)
(TN-00-01) This technical note describes shipping procedures for preventing memory devices from
absorbing moisture and recommendations for baking devices exposed to excessive moisture.
File Type: PDF Updated: 02/14/2013
Technical Notes
TN-00-01: Moisture Sensitivity of Plastic Packages DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
DDR3L-RS
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(PDF)
(TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is
stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note
also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...
File Type: PDF Updated: 07/26/2010
Technical Notes
TN-10-08: Thermal Implications for LPDDR Die Stacks Mobile Memory Solutions
Multichip Packages
NAND-Based MCP
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Customer Service Note
Customer Service Note
(PDF)
(CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor
package design and assembly, which requires unique considerations in both the up-front design
and the manufacturing process.
File Type: PDF Updated: 05/16/2016
Customer Service Note
PoP User Guide Multichip Packages
NAND-Based MCP
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(PDF)
(CSN-16) Explanation of Micron packaging labels and procedures.
File Type: PDF Updated: 01/08/2016
Customer Service Note
Micron Component and Module Packaging Big Data
Big Data
Client SSD Storage
Cloud
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Parts with the same Data Sheet (1)
MT29AZ5A3CHHWD-18AIT
( Current )
MT29AZ5A3CHHWD-18AAT
Part Status
Code Production Production
NAND
Density 4Gb 4Gb
DRAM Type LPDDR2 LPDDR2
DRAM
Density 2Gb 2Gb
Bus Width x8 x8
Secondary
Bus Width x32 x32
RoHS Yes Yes
B
D
MT29AZ5A3CHHWD-18AIT
( Current )
Part Status
Code Production
NAND
Density 4Gb
DRAM Type LPDDR2
DRAM
Density 2Gb
Bus Width x8
Secondary
Bus Width x32
RoHS Yes
Voltage 1.8V 1.8V
Package VFBGA VFBGA
Pin Count 162-ball 162-ball
Clock Rate 533 MHz 533 MHz
Operating
Temp -40C to +85C -40C to +105C
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Americas
Where to Buy
Orderable Parts
Status Media FBGA
Code
SPD
Data
Chipset
Validation PLP Start
Date
Alternative
Part
MT29AZ5A3CHHWD-
18AIT.84F Production N/A JYA34 N/A N/A No N/A
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Voltage 1.8V
Package VFBGA
Pin Count 162-ball
Clock Rate 533 MHz
Operating
Temp -40C to +85C
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