HLMP-WL02, HLMP-WG02 High Intensity AlInGaP LED Lamps Data Sheet Description Features This 5 mm LED lamps is specially designed for applications requiring higher levels of intensity than is achieved with a standard lamp. The 5 mm lamp is available with 65 degree viewing angle. * * * * * * Package Dimensions 5.00 0.20 (0.197 0.008) 8.71 0.20 (0.343 0.008 1.14 0.20 (0.045 0.008) 2.35 (0.093) MAX. 31.60 (1.244) MIN. 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) 0.50 0.10 SQ. TYP. (0.020 0.004) 5.80 0.20 (0.228 0.008) CATHODE FLAT 2.54 0.38 (0.100 0.015) T-1 3/4 (5 mm) General Purpose LED Lamps AlInGaP SunPower Intensity High Light Output Tinted Diffused Lens Amber and Red Available on Tape and Reel Applications * General Purpose * Consumer Goods * Indicator Lights Device Selection Guide T-1 3/4 (5 mm) Lamp Color Part Number Luminous Intensity Min. mcd, If @ 20 mA Viewing Angle 2q1/2 (Degrees) Amber HLMP-WL02 35 65 Red HLMP- WG02 26 65 Notes: 1. Dominant Wavelength, d, is derived from the CIE Chromaticity Diagram, and represents the color of the lamp. 2. 1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 3. The luminous intensity is measured on the mechanical axis of the lamp package. 4. The optical axis is closely aligned with the package mechanical axis. Absolute Maximum Ratings at TA = 25C Parameter 5 mm DC Forward Current [1,2,3] 50 mA Peak Pulsed Forward Current 70 mA Average Forward Current 30 mA Reverse Voltage (IR = 100 mA) 5V LED Junction Temperature 130C Operating Temperature -40C to + 100C Storage Temperature -40C to + 100C Notes: 1. Derate linearly as shown in Figure 4. 2. For long term performance with minimal light output degradation, drive currents between 10 and 30 mA are recommended. 3. Please contact your Avago Technologies sales representative about operating currents below 10 mA. Electrical/Optical Characteristics at TA = 25C Parameter Symbol Forward Voltage Amber (ld = 590 nm) Red (ld = 626 nm) VF Reverse Voltage VR Peak Wavelength Amber Red lPEAK Spectral Halfwidth Dl1/2 Speed of Response Units Test Conditions V IF = 20 mA V IR = 100 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA 17 nm Wavelength Width at Spectral Distribution 1/2 Power point at IF = 20 mA ts 20 ns Exponential Time Constant, e-t/ts Capacitance C 40 pF VF = 0, f = 1 MHz Thermal Resistance RqJ-PIN 240 C/W LED Junction-to-Cathode Lead Luminous Efficacy [1] hv lm/W Emitted Luminous Power/Emitted RadiantPower Amber Red Min. 5 Typ. Max. 2.02 1.90 2.4 20 592 635 500 155 Note: 1. The radiant intensity, Ie, in watts per steridian, may be found from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. 2 1.0 AMBER RELATIVE INTENSITY RED 0.5 0 550 600 650 700 WAVELENGTH - nm Figure 1. Relative Intensity vs. Peak Wavelength. 70 AMBER CURRENT - mA 50 40 30 RED 20 10 0 1.0 1.5 2.0 2.5 2.0 1.5 1.0 0.5 0 3.0 V F - FORWARD VOLTAGE - V NORMALIZED INTENSITY - % Figure 2. Forward Current vs. Forward Voltage. 0 20 40 IF - DC FORWARD CURRENT - mA Figure 3. Relative Luminous Intensity vs. Forward Current. 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -100 -80 -60 -40 -20 0 20 40 ANGULAR DISPLACEMENT - DEGREES Figure 5. Representative Spatial Radiation Pattern for 65 3 50 2.5 IF - FORWARD CURRENT - mA 60 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 3.0 60 80 100 60 40 RqJA = 585 C/W 30 RqJA = 780 C/W 20 10 0 0 40 80 20 60 100 T A - AMBIENT TEMPERATURE - C Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on TJMAX = 130C. Precautions: Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. * For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. * If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: * Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. * LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm * ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. * Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 C Max. - Preheat time 60 sec Max - Peak temperature 250 C Max. 260 C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. * Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 4 CATHODE AllnGaP Device Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. * Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. * At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. * If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. * Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm 0.636 mm (0.018x 0.018 inch) (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm 0.707 mm (0.020x 0.020 inch) (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) * Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 Flux: Rosin flux Solder bath temperature: 245C 5C (maximum peak temperature = 250C) TEMPERATURE (C) 200 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 50 PREHEAT 0 10 20 30 40 50 TIME (SECONDS) 60 70 80 Figure 6. Recommended wave soldering profile Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin 5 Lamps Baby Label RoHS Compliant e3 max temp 250C 90 100 DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin "VB" only) (ii) Color bin incorporate with VF Bin OR (ii) Color bin incorporated with VF Bin BIN: 2VB (Applicable for part number that have both color bin and VF bin) VB: VF bin "VB" 2: Color bin 2 only DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-4369EN AV02-1532EN - August 20, 2014