Applications
• Computers and peripherals
• HDTV Equipment
• DVD Players
• A/V Equipment
• Satellite radio
• Cell phones
• PDAs
• Digital still cameras
• Digital camcorders
• MP3/Multimedia players
• Set top boxes
• External storage
• DSL Modems
• High speed data ports
• USB 2.0/3.0
• IEEE 1394b
• HDMI 1.3
• DVI
• High speed ethernet
• Infiniband®
Part Numbering System: 0402 ESDA MLP 1
Package Size
Product Family
Form Designation
Designation for Dip Termination
Packaging
• 10,000 suppressors on paper tape in seven inch (178mm) plastic reel
per EIA Standard 481-1.
Ordering Information
MLP1 ESD Suppressor
PolySurg™0402ESDA-MLP1
1010 BU-SB101153 Page 1 of 2 Data Sheet 4367
Surface Mount Device
Description
The Cooper Bussmann PolySurg™0402ESDA-MLP1 ESD Suppressors
protect valuable high-speed data circuits from ESD damage without distorting
data signals as a result of its ultra-low (0.05pF typical) capacitance.
Features
• Halogen free
• RoHS compliant for global applications
• Lead free
• Ultra-low capacitance (0.05pF typ.) ideal for high speed data
applications
• Provides ESD protection with fast response time (<1ns) allowing
equipment to pass IEC 61000-4-2 level 4 test
• Single-line, bi-directional device for placement flexibility
• Low profile 0402/1005 design for board space savings
• Low leakage current (<0.1nA typ.) reduces power consumption
• (Sn) Tin-plated version available
HALOGEN
HF
FREE
Pb
Catalog Number Description
0402ESDA-MLP1 10,000 pieces on paper tape on 7" (178mm) reel - tin plating
Specifications
Characteristic Value
Rated Voltage 30Vdc maximum
Clamping Voltage135V typical
Trigger Voltage2300V typical
Capacitance (@1MHz) 0.05pF typical, 0.15pF maximum
Attenuation Change (0-6GHz) -0.2dB typical
Leakage Current (@12Vdc) <0.1nA typical
ESD Capability
• IEC61000-4-2 Direct Discharge 8kV typical
• IEC61000-4-2 Air Discharge 15kV typical
ESD Pulse Withstand3>1000 typical
1 Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A) measured 30ns after initiation of pulse.
2 Trigger measurement made using Transmission Line Pulse (TLP) method.
3 Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate
Design Considerations
The location in the circuit for the MLP series has to be carefully determined.
For better performance, the device should be placed as close to the signal
input as possible and ahead of any other component. Due to the high current
associated with an ESD event, it is recommended to use a “0-stub” pad
design (pad directly on the signal/data line and second pad directly on
common ground).
© 2010 Cooper Bussmann
www.cooperbussmann.com
1010 BU-SB101153 Page 2 of 2 Data Sheet 4367
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-
tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-
port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
Time (seconds)
Temperature (°C)
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 10 sec. max.
- Wave Solder = 260°C max. for 10 sec. max.
• Recommended IR Reflow Profile:
Tape and Reel Specifications - mm
10,000 pieces in paper tape on 7 inch (178mm) plastic reel per EIA Standard 481-1
Environmental Specifications
Characteristic Value
Load Humidity 12Vdc per EIA/IS-772 Para. 4.4.2,
+85°C, 85% RH for 1000 hours
Thermal Shock EIA/IS-722 Para 4.6, Air-to-Air
-55°C to +125°C, 5 cycles
Moisture Resistance Test MIL-STD-202G Method 106G, 10 cycles
Mechanical Shock EIA/IS-722 Para. 4.9
Vibration EIA/IS-722 Para. 4.10
Resistance to Solvent EIA/IS-722 Para. 4.11
Operating Temperature Range -55°C to +125°C
Storage Temperature Range -55°C to +125°C
Dimensions - in (mm)
0.021 ± 0.003
(0.530 ± 0.076)
0.014 ± 0.003
(0.360 ± 0.076)
0.043 ± 0.004
(1.100 ± 0.100)
0.010 ± 0.004
(0.250 ± 0.100)
0.016
(0.40)
0.028
(0.70)
0.087
(2.20)
Recommended Pad Layout - in (mm)
Carrier Dimensions
AB DE
1E2FGP
1P2P3TW
0.75 1.25 1.50 1.75 6.25 3.50 0.75 4.00 2.00 4.00 0.43 8.00
±0.05 ±0.05 ±0.10 ±0.10 ±0.30 ±0.05 min. ±0.10 ±0.05 ±0.05 ±0.05 ±0.20
