PIN FUNCTIONS
Powerdip SO20 NAME DESCRIPTION
11 12 COMP E/A output to be used for frequency compensation
10 11 INH A logic signal (active high) disables the device (sleep mode operation).
If not used it must be connected to GND; if floatingthe device is disabled.
9 10 BOOT A capacitor connected between this pin and the output allows to drive the
internal D-MOS.
18 20 SYNC Input/Output synchronization.
7,8 8,9 Vcc Unregulated DC input voltage
2,3 2,3 OUT Stepdown regulator output.
12 13 VFB Stepdown feedback input. Connecting the output directly to this pin results
in an output voltage of 3.3V for the L4973V3.3 and 5.1V. An external
resistive divider is required for higher output voltages. For output voltage
less than 3.3V, seenote ** and Figure 32.
16 18 V5.1 Reference voltage externally available.
4,5,6
13,14,15 4,5,6,7
14,15,16,17 GND Signal ground
1 1 OSC An external resistor connected between the unregulated inputvoltage and
Pin 1 and a capacitor connected from Pin 1 to ground fixes the switching
frequency. (Linefeed forward is automatically obtained)
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
DIP-18 S0-20
V7,V8V9,V8Input voltage 58 V
V2,V3V2,V3Output DC voltage
Output peak voltage at t = 0.1µs f=200KHz -1
-5 V
V
I2,I3I2,I3Maximum output current int. limit.
V9-V8V10-V814 V
V9V10 Bootstrap voltage 70 V
V11 V12 Analogs input voltage (VCC = 24V) 12 V
V17 V19 Analogs input voltage (VCC = 24V) 13 V
V12 V13 (VCC = 20V) 6
-0.3 V
V
V18 V20 (VCC = 20V) 5.5
-0.3 V
V
V10 V11 Inhibit Vcc
-0.3 V
V
Ptot Power dissipation a Tpins ≤90°C
(Tamb =70°C no copper area)
(Tamb =70°C 4cm copper area on PCB)
DIP
12+3+3 5
1.3
2
W
W
W
Power dissipation a Tpins =90°C SO20 4 W
TJ,TSTG Junction and storagetemperature -40 to 150 °C
THERMAL DATA
Symbol Parameter Powerdip SO20 Unit
Rth(j-pin) Thermal Resistance Junction to pin Max. 12 15 °C/W
Rth(j-amb) Thermal Resistance to Ambient Max. 60 (*) 80 (*) °C/W
(*) Package mounted on board.
L4973V3 - L4973V5 - L4973D3 - L4973D5
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