VND5004A-E VND5004ASP30-E Double 4m high side driver with analog current sense for automotive applications Features Max transient supply voltage VCC 41V Operating voltage range VCC 4.5 to 27V Max On-State resistance (per ch.) RON 4 m Current limitation (typ) ILIMH 100A Off state supply current IS 2 A(1) PQFN - 12x12 Power lead-less MultiPowerSO-30 1. Typical value with all loads connected Application General - Inrush current active management by power limitation - Very low stand-by current - 3.0V CMOS compatible input - Optimized electromagnetic emission - Very low electromagnetic susceptibility - In compliance with the 2002/95/EC European directive All types of resistive, inductive and capacitive loads Suitable for power management applications Description Diagnostic functions - Proportional load current sense - Current sense disable - Thermal shutdown indication Protection - Undervoltage shut-down - Overvoltage clamp - Load current limitation - Thermal shut down - Self limiting of fast thermal transients - Protection against loss of ground and loss of VCC - Reverse battery protection with self switch on of the PowerMOS (see Application schematic on page 18) - Electrostatic discharge protection Table 1. The VND5004ATR-E and VND5004ASP30-E are devices made using STMicroelectronics VIPower technology. They are intended for driving resistive or inductive loads with one side connected to ground. Active VCC pin voltage clamp and load dump protection circuit protect the devices against transients on the Vcc pin (see ISO7637 transient compatibility table). These devices integrate an analog current sense which delivers a current proportional to the load current (according to a known ratio) when CS_DIS is driven low or left open. When CS_DIS is driven high, the CURRENT SENSE pin is high impedance. Output current limitation protects the devices in overload condition. In case of long duration overload, the devicesa limit the dissipated power to a safe level up to thermal shut-down intervention. Thermal shut-down with automatic restart allows the device to recover normal operation as soon as a fault condition disappears. Devices summary Order codes Package Tube Tape and Reel Tray PQFN-12x12 Power lead-less - VND5004ATR-E VND5004A-E MultiPowerSO-30 VND5004ASP30-E VND5004ASP30TR-E - December 2007 Rev 5 1/34 www.st.com 34 Contents VND5004A-E / VND5004ASP30-E Contents 1 Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 4 5 6 2/34 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 19 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1 MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.2 PQFN - 12x12 Power lead-less thermal data . . . . . . . . . . . . . . . . . . . . . . 23 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.1 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.2 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.3 PQFN - 12x12 Power lead-less mechanical data . . . . . . . . . . . . . . . . . . . 28 5.4 MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.5 PQFN - 12x12 Power lead-less packing information . . . . . . . . . . . . . . . . 31 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 VND5004A-E / VND5004ASP30-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Suggested connections for unused and n.c. pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (VCC = 13V; Tj = 25C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Current sense (8V<VCC<16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Thermal parameters for PQFN - 12x12 Power lead-less . . . . . . . . . . . . . . . . . . . . . . . . . . 25 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 PQFN - 12x12 Power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 3/34 List of figures VND5004A-E / VND5004ASP30-E List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Configuration diagram (not in scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4. Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 5. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 7. Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 10. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 11. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 12. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 13. On state resistance vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 14. On state resistance vs. VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 15. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 16. Turn-On voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 17. ILIMH vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 18. Turn-Off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 19. CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 20. CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 21. CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 22. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 23. Maximum turn off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 24. MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 25. Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) . . . . . . . 20 Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel ON) . . 21 Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30 . . . . . . . . . . . . . . . . 21 Figure 28. 12x12 Power lead-less package PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 29. Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) . . . . . . . 23 Figure 30. PQFN - 12x12 Power lead-less package thermal impedance junction ambient single pulse (one channel ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Figure 31. Thermal fitting model of a double channel HSD in PQFN - 12x12 Power lead-less . . . . . 24 Figure 32. MultiPowerSO-30 outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 33. PQFN - 12x12 Power lead-less outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure 34. MultiPowerSO-30 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 35. MultiPowerSO-30 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 36. PQFN - 12x12 Power lead-less tray shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 37. PQFN - 12x12 Power lead-less tape and reel shipment (suffix "TR"). . . . . . . . . . . . . . . . . 32 4/34 VND5004A-E / VND5004ASP30-E 1 Block diagram and pin configurations Block diagram and pin configurations Figure 1. Block diagram VCC Under voltage VCC clamp PwCLAMP DRIVER OUTPUT1 GND ILIM Reverse battery protection Overtemp. IOUT1 PwrLIM K CS_DIS INPUT1 LOGIC CURRENT SENSE1 PwCLAMP DRIVER OUTPUT2 ILIM INPUT2 Overtemp. PwrLIM CS_DIS Table 2. IOUT2 CS_DIS K CURRENT SENSE2 Pin functions Name VCC OUTPUT1,2 GND INPUT1,2 Function Battery connection Power output Ground connection Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state CURRENT SENSE1,2 Analog current sense pin, delivers a current proportional to the load current CS_DIS Active high CMOS compatible pin, to disable the current sense pins 5/34 Block diagram and pin configurations Figure 2. Configuration diagram (not in scale) PQFN -12x12 Power lead - less (bottom view) VCC NC FOR TEST ONLY NC NC GND CS_DIS CURRENT SENSE 2 CURRENT SENSE 1 INPUT 2 INPUT 1 NC FOR TEST ONLY NC VCC Table 3. 12 11 10 9 8 7 6 5 4 3 2 1 1 NC 2 NC 3 NC 4 GND 5 CS_DIS 6 CURRENT SENSE 2 7 CURRENT SENSE 1 8 INPUT 2 9 INPUT 1 10 NC 11 NC 12 NC 13 FOR TEST ONLY 14 VCC 15 OUTPUT 1 16 OUTPUT 2 15 13 14 16 1 30 VCC Heat Slug1 15 16 VCC OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 2 MultiPowerSO-30 NC (top view) OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 1 VCC Suggested connections for unused and n.c. pins Connection / Pin Current Sense N.C. Output Input CS_DIS For test only Floating N.R.(1) X X X X X To ground Through 1k resistor X N.R. Through 10k resistor Through 10k resistor N.R. 1. Not recommended. 6/34 VND5004A-E / VND5004ASP30-E VND5004A-E / VND5004ASP30-E 2 Electrical specifications Electrical specifications Figure 3. Current and voltage conventions IS VCC ICSD VCSD IIN1,2 VCC IOUT1,2 CS_DIS OUTPUT1,2 VOUT1,2 INPUT1,2 CURRENT SENSE1,2 ISENSE1,2 VSENSE1,2 GND VIN1,2 IGND 2.1 Absolute maximum ratings Stressing the device above the ratings listed in the "Absolute maximum ratings" tables may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to the conditions in this section for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4. Absolute maximum ratings Symbol Value Unit DC supply voltage 27 V Transient supply voltage (T<400ms, Rload>0.5) 41 V -VCC Reverse DC supply voltage 16 V IOUT DC output current Internally limited A 70 A DC input current -1 to 10 mA DC current sense disable input current -1 to 10 mA Vcc-41 +Vcc V V VCC VCCPK - IOUT IIN ICSD Parameter Reverse DC output current VCSENSE Current sense maximum voltage (Vcc>0V) EMAX Maximum switching energy (single pulse) (L=0.3mH; RL=0; Vbat=13.5V; Tjstart=150C; IOUT = IlimL(Typ.) ) 342 mJ VESD Electrostatic discharge (Human Body Model: R=1.5k; C=100pF) 2000 V VESD Charge device model (CDM-AEC-Q100-011) 750 V 7/34 Electrical specifications Table 4. VND5004A-E / VND5004ASP30-E Absolute maximum ratings (continued) Symbol Tj TSTG 2.2 Parameter Value Unit Junction operating temperature -40 to 150 C Storage temperature -55 to 150 C Thermal data Table 5. Thermal data Value Symbol Parameter Unit MultiPowerSO-30 12x12 PLLP Rthj-case Thermal resistance junction-case (MAX) (with one channel ON) 0.35 0.35 C/W Rthj-amb Thermal resistance junction-ambient (MAX) 58(1) 39(2) C/W 1. PCB FR4 area 58mmX58mm , PCB thickness 2mm, Cu thickness 35 m, minimum pad layout. 2. PCB FR4 area 78mmX78mm , PCB thickness 2mm, Cu thickness 35 m, minimum pad layout. 8/34 VND5004A-E / VND5004ASP30-E 2.3 Electrical specifications Electrical characteristics Values specified in this section are for 8V<VCC<24V, -40C<Tj<150 C, unless otherwise stated. Table 6. Power section Symbol Parameter VCC Operating supply voltage VUSD VUSDhyst Test conditions Min. Typ. Max. Unit 4.5 13 27 V Undervoltage shutdown 3.5 4.5 V Undervoltage shut-down hysteresis 0.5 V IOUT=15A; Tj=25C IOUT=15A; Tj=150C IOUT=15A; VCC=5V; Tj=25C 4 8 6 m m m Rdson in reverse battery condition VCC=-13V; IOUT=-15A; Tj=25C 4 m VCC clamp voltage ICC=20 mA; IOUT1,2=0A 46 52 V IS Supply current Off state; VCC=13V; Tj=25C; VIN=VOUT=VSENSE=VCSD=0V On state; VCC=13V; VIN=5V; IOUT=0A 2(2) 3.5 5(2) 6 A mA IL(off) Off-state output current(1) VIN=VOUT=0V; VCC=13V; Tj=25C VIN=VOUT=0V; VCC=13V; Tj=125C 0.01 3 5 A Max. Unit RON RON REV Vclamp On-state resistance(1) 41 0 0 1. For each channel. 2. PowerMOS leakage included. Table 7. Symbol Switching (VCC = 13V; Tj = 25C) Parameter Test conditions Min. Typ. td(on) Turn-on delay time RL=0.87 (see Figure 5.) 25 s td(off) Turn-on delay time RL=0.87 (see Figure 5.) 35 s (dVOUT/dt)on Turn-on voltage slope RL=0.87 See Figure 16. V/ s (dVOUT/dt)off Turn-off voltage slope RL=0.87 See Figure 18. V/ s WON Switching energy losses during twon RL=0.87 (see Figure 5.) 5.4 mJ WOFF Switching energy losses during twoff RL=0.87 (see Figure 5.) 2.3 mJ 9/34 Electrical specifications Table 8. VND5004A-E / VND5004ASP30-E Logic input Symbol Parameter Test conditions VIL1,2 Input low level voltage IIL1,2 Low level input current VIH1,2 Input high level voltage IIH1,2 High level input current VIN=2.1V Input clamp voltage VCSDL CS_DIS low level voltage ICSDL Low level CS_DIS current VCSDH CS_DIS high level voltage ICSDH High level CS_DIS current VCSD(hyst) CS_DIS hysteresis voltage Unit 0.9 V 1 A 2.1 V 7 V V 0.9 V -0.7 1 A 2.1 V VCSD=2.1V 10 0.25 CS_DIS clamp voltage 7 -0.7 V V Protection and diagnostics(1) IlimH Short circuit current VCC=13V 5V<VCC<24V IlimL Short circuit current during thermal cycling VCC=13V; TR<Tj<TTSD TTSD Shutdown temperature TR Reset temperature TRS Thermal reset of STATUS Test conditions Typ. Max. Unit 70 100 140 140 A A 40 150 175 TRS+1 TRS+5 A 200 135 Thermal hysteresis (TTSD-TR) Turn-off output voltage clamp Min. IOUT=2A; VIN=0; L=6mH C C C 7 C VCC-27 VCC-30 VCC-33 V 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. 10/34 A V 5.5 ICSD=1mA ICSD=-1mA A V 5.5 VCSD=0.9V Parameter VDEMAG Max. 10 IIN=1mA IIN=-1mA Symbol THYST Typ. 0.25 VICL1,2 Table 9. VIN=0.9V Input hysteresis voltage VI(hyst)1,2 VCSCL Min. VND5004A-E / VND5004ASP30-E Table 10. Symbol Electrical specifications Current sense (8V<VCC<16V) Parameter Test conditions Min. Typ. Max. Unit K1 IOUT/ISENSE IOUT=15A; VSENSE=4V; VCSD=0V; Tj=-40C Tj=25C...150C 11530 16000 19340 12730 16000 19270 K2 IOUT/ISENSE IOUT=30A; VSENSE=4V; VCSD=0V; Tj=-40C Tj=25C...150C 13430 16150 17880 14500 16150 17880 ISENSE0 Analog sense current IOUT=0A; VSENSE=0V; VCSD=5V; VIN=0V; Tj=-40C to 150C VCSD=0V; VIN=5V; Tj=-40C to 150C 0 0 VSENSE Max analog sense output voltage IOUT=45A; VCSD=0V; RSENSE=3.9k 5 VSENSEH Analog sense output voltage in overtemperature condition VCC=13V; RSENSE=3.9k 9 V ISENSEH Analog sense output current in overtemperature condition Vcc=13V; VSENSE=5V 8 mA Delay response time from falling tDSENSE1H edge of CS_DIS pin VSENSE<4V, 5A<Iout<30A ISENSE=90% of ISENSE max (see Figure 4.) 50 100 s Delay response time from rising tDSENSE1L edge of CS_DIS pin VSENSE<4V, 5A<Iout<30A ISENSE=10% of ISENSE max (see Figure 4.) 5 20 s Delay response tDSENSE2H time from rising edge of INPUT pin VSENSE<4V, 5A<Iout<30A ISENSE=90% of ISENSE max (see Figure 4.) 270 600 s Delay response tDSENSE2L time from falling edge of INPUT pin VSENSE<4V, 5A<Iout<30A ISENSE=10% of ISENSE max (see Figure 4.) 100 250 s Figure 4. 5 400 A A V Current sense delay characteristics INPUT CS_DIS LOAD CURRENT SENSE CURRENT tDSENSE2H tDSENSE1L tDSENSE1H tDSENSE2L 11/34 Electrical specifications Table 11. VND5004A-E / VND5004ASP30-E Truth table INPUTn OUTPUTn SENSEn (VCSD=0V)(1) (see Figure 3.) Normal operation L H L H 0 Nominal Overtemperature L H L L 0 VSENSEH Undervoltage L H L L 0 0 Short circuit to GND (Rsc 10 m) L H H L L L 0 0 if Tj < TTSD VSENSEH if Tj > TTSD Short circuit to VCC L H H H 0 < Nominal Negative output voltage clamp L L 0 Conditions 1. If VCSD is high, the SENSE output is at a high impedance. Its potential depends on leakage currents and the external circuit. Figure 5. Switching characteristics VOUT tWoff tWon 90% 80% dVOUT/dt(off) dVOUT/dt(on) tr 10% tf t INPUT td(on) td(off) t 12/34 VND5004A-E / VND5004ASP30-E Table 12. ISO 7637-2: 2004(E) Electrical specifications Electrical transient requirements Test levels(1) Number of pulses or test times Burst cycle/pulse repetition time Delays and Impedance Test pulse III IV 1 -75 V -100 V 5000 pulses 0.5 s 5s 2 ms, 10 2a +37 V +50 V 5000 pulses 0.2 s 5s 50 s, 2 3a -100 V -150 V 1h 90 ms 100 ms 0.1 s, 50 3b +75 V +100 V 1h 90 ms 100 ms 0.1 s, 50 4 -6 V -7 V 1 pulse 100 ms, 0.01 5b(2) +65 V +87 V 1 pulse 400 ms, 2 Test level results(1) ISO 7637-2: 2004(E) Test pulse III IV 1 C C 2a C C 3a C C 3b C C 4 C C C C 5b (2) (3) 1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b 2. Valid in case of external load dump clamp: 40V maximum referred to ground. 3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 4.: Absolute maximum ratings. Class Contents C All functions of the device are performed as designed after exposure to disturbance. E One or more functions of the device are not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. 13/34 Electrical specifications Figure 6. VND5004A-E / VND5004ASP30-E Waveforms NORMAL OPERATION INPUTn CS_DIS LOAD CURRENTn SENSE CURRENTn UNDERVOLTAGE VUSDhyst VCC VUSD INPUTn CS_DIS LOAD CURRENTn SENSE CURRENTn OUTPUT SHORT TO VCC INPUTn CS_DIS LOAD VOLTAGEn LOAD CURRENTn SENSE CURRENTn <Nominal <Nominal OVERLOAD OPERATION Tj TR TTSD TRS INPUTn CS_DIS ILIMH ILIML LOAD CURRENTn VSENSEH SENSE CURRENTn current power limitation limitation thermal cycling SHORTED LOAD 14/34 NORMAL LOAD VND5004A-E / VND5004ASP30-E 2.4 Electrical specifications Electrical characteristics curves Figure 7. Off state output current Figure 8. Iloff (uA) High level input current Iih (uA) 6 5 5.4 4.5 Off State Vcc=13V Vin=Vout=0V 4.8 4.2 Vin=2.1V 4 3.5 3.6 3 3 2.5 2.4 2 1.8 1.5 1.2 1 0.6 0.5 0 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C ) Figure 9. 50 75 100 125 150 175 100 125 150 175 Tc (C ) Input clamp voltage Figure 10. Input low level Vicl (V) Vil (V) 7 2 1.8 6.75 Iin=1mA 1.6 6.5 1.4 6.25 1.2 1 6 0.8 5.75 0.6 5.5 0.4 5.25 0.2 5 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C ) 50 75 Tc (C ) Figure 11. Input high level Figure 12. Input hysteresis voltage Vih (V) Vihyst (V) 4 1 0.9 3.5 0.8 3 0.7 2.5 0.6 2 0.5 0.4 1.5 0.3 1 0.2 0.5 0.1 0 0 -50 -25 0 25 50 75 Tc (C ) 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C ) 15/34 Electrical specifications VND5004A-E / VND5004ASP30-E Figure 13. On state resistance vs. Tcase Ron (mOhm) Figure 14. On state resistance vs. VCC Ron (mOhm) 6 6 5.4 5.4 Iout=15A Vcc=13V 4.8 Tc=150C 4.8 Tc=125C 4.2 4.2 3.6 3.6 3 3 2.4 2.4 1.8 Tc=25C Tc=-40C 1.8 -50 -25 0 25 50 75 100 125 150 175 0 4 8 12 16 Tc (C ) 20 24 28 Vcc Figure 15. Undervoltage shutdown Figure 16. Turn-On voltage slope Vusd (V) (dVout/dt)on (V/ms) 16 500 450 14 Vcc=13V RI=0.87Ohm 400 12 350 10 300 8 250 200 6 150 4 100 2 50 0 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Figure 17. ILIMH vs. Tcase 75 100 125 150 175 Figure 18. Turn-Off voltage slope Ilimh (A) (dVout/dt)off (V/ms) 150 500 140 450 Vcc=13V 130 Vcc=13V RI=0.87Ohm 400 120 350 110 300 100 250 90 200 80 150 70 100 60 50 50 0 -50 -25 0 25 50 75 Tc (C ) 16/34 50 Tc (C ) Tc (C ) 100 125 150 175 -50 -25 0 25 50 75 Tc (C ) 100 125 150 175 VND5004A-E / VND5004ASP30-E Electrical specifications Figure 19. CS_DIS high level voltage Figure 20. CS_DIS clamp voltage Vcsdh (V) Vcsdcl (V) 4 8 3.5 7.5 3 7 2.5 6.5 2 6 1.5 5.5 1 5 0.5 4.5 0 4 -50 -25 0 25 50 75 100 125 150 175 Tc (C ) -50 -25 0 25 50 75 100 125 150 175 Tc (C ) Figure 21. CS_DIS low level voltage Vcsdl (V) 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C ) 17/34 Application information 3 VND5004A-E / VND5004ASP30-E Application information Figure 22. Application schematic +5V VCC 20V Rprot CS_DIS Dld C Rprot Rprot INPUT OUTPUT CURRENT SENSE 45V RSENSE GND Cext 3.1 MCU I/Os protection When negative transients are present on the VCC line, the control pins will be pulled negative to approximately -1.5V. ST suggests the insertion of resistors (Rprot) in the lines to prevent the C I/Os pins from latching up. The values of these resistors provide a compromise between the leakage current of the C, the current required by the HSD I/Os (input levels compatibility) and the latch-up limit of the C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH) / IIHmax Calculation example: For VCCpeak= - 1.5V and Ilatchup 20mA; VOHC 4.5V 75 Rprot 240k. Recommended values: Rprot =10k, CEXT=10nF 3.2 Load dump protection Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCCPK max rating. The same applies if the device will be subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table. 18/34 VND5004A-E / VND5004ASP30-E 3.3 Application information Maximum demagnetization energy (VCC = 13.5V) Figure 23. Maximum turn off current versus inductance 100 A B C I (A) 10 1 1 L (mH) 10 100 A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t Note: Values are generated with RL = 0 . In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. 19/34 Package and PC board thermal data VND5004A-E / VND5004ASP30-E 4 Package and PC board thermal data 4.1 MultiPowerSO-30 thermal data Figure 24. MultiPowerSO-30 PC board Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m (front and back side), Copper areas: from minimum pad lay-out to 16cm2). Figure 25. Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) RTHj_amb(C/W) 60 55 50 45 40 35 0 1 2 3 PCB Cu heatsink area (cm^2) 20/34 4 5 VND5004A-E / VND5004ASP30-E Package and PC board thermal data Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel ON) ZTH (C/W) 1000 100 Footprint 4 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000 Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30 (a) a. The fitting model is a semplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. 21/34 Package and PC board thermal data VND5004A-E / VND5004ASP30-E Equation 1: pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = t p T Table 13. 22/34 Thermal parameters for MultiPowerSO-30 Area/island (cm2) Footprint R1 (C/W) 0.05 R2 (C/W) 0.3 R3 (C/W) 0.5 R4 (C/W) 1.3 R5 (C/W) 14 R6 (C/W) 44.7 R7 (C/W) 0.05 R8 (C/W) 0.3 C1 (W.s/C) 0.005 C2 (W.s/C) 0.008 C3 (W.s/C) 0.01 C4 (W.s/C) 0.3 C5 (W.s/C) 0.6 C6 (W.s/C) 5 C7 (W.s/C) 0.005 C8 (W.s/C) 0.008 4 23.7 11 VND5004A-E / VND5004ASP30-E 4.2 Package and PC board thermal data PQFN - 12x12 Power lead-less thermal data Figure 28. 12x12 Power lead-less package PC board Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 78mm x 78mm, PCB thickness=2mm, Cu thickness=35m (front and back side), Copper areas: minimum pad lay-out). Figure 29. Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) 50 45 40 35 30 25 20 0 5 10 15 20 PCB Cu heatsink area (cm^2) 23/34 Package and PC board thermal data VND5004A-E / VND5004ASP30-E Figure 30. PQFN - 12x12 Power lead-less package thermal impedance junction ambient single pulse (one channel ON) 100 Footprint 4 cm2 8 cm2 16 cm2 C/W 10 1 0,1 0,001 0,01 0,1 time (s) 1 10 100 1000 Figure 31. Thermal fitting model of a double channel HSD in PQFN - 12x12 Power leadless(b) b. The fitting model is a semplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. 24/34 VND5004A-E / VND5004ASP30-E Package and PC board thermal data Equation 2: pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = t p T Table 14. Thermal parameters for PQFN - 12x12 Power lead-less Area/island (cm2) Footprint R1 (C/W) 0.3 R2 (C/W) 0.15 R3 (C/W) 4.2 R4 (C/W) 4 8 16 9.6 9.4 9.2 9 R5 (C/W) 15.1 10.5 8.5 5.5 R6 (C/W) 16.7 12 9 6 R7 (C/W) 0.3 R8 (C/W) 0.15 C1 (W.s/C) 0.021 C2 (W.s/C) 0.015 C3 (W.s/C) 0.2 C4 (W.s/C) 1.9 2.2 2.32 2.45 C5 (W.s/C) 2.45 7.3 13.7 20 C6 (W.s/C) 11.85 22 25 30 C7 (W.s/C) 0.021 C8 (W.s/C) 0.015 25/34 Package and packing information VND5004A-E / VND5004ASP30-E 5 Package and packing information 5.1 ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. ECOPACK(R) packages are lead-free. The category of Second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. 5.2 MultiPowerSO-30 mechanical data Figure 32. MultiPowerSO-30 outline 26/34 VND5004A-E / VND5004ASP30-E Table 15. Package and packing information MultiPowerSO-30 mechanical data Millimeters Symbol Min. Typ. A Max. 2.35 A2 1.85 2.25 A3 0 0.1 B 0.42 0.58 C 0.23 0.32 D 17.1 E 18.85 E1 15.9 "e" 1 17.2 19.15 16 F6 14.3 F7 5.45 F8 0.73 L 0.8 N S 17.3 16.1 1.15 10 Deg 0 Deg 7 Deg 27/34 Package and packing information 5.3 PQFN - 12x12 Power lead-less mechanical data Figure 33. PQFN - 12x12 Power lead-less outline 28/34 VND5004A-E / VND5004ASP30-E VND5004A-E / VND5004ASP30-E Table 16. Package and packing information PQFN - 12x12 Power lead-less mechanical data Millimeters Symbol Min. Typ. Max. A 2 2.2 A1 0 0.05 b 0.35 0.47 C 0.50 D 11.90 12.10 Dh1 4.65 4.95 Dh2 10.45 10.65 Dh3 4.80 5 Dh4 4.80 5 E 11.90 12.10 Eh1 2.15 2.45 Eh2 5.15 5.45 Eh3 1.70 2 e1 0.90 e2 3.45 e3 1.10 f 0.50 f1 0.60 L 0.75 0.95 L1 1.65 1.90 L2 0.76 0.78 M 11.10 11.30 N 11.10 11.30 v 0.1 w 0.05 y 0.05 y1 0.1 29/34 Package and packing information 5.4 VND5004A-E / VND5004ASP30-E MultiPowerSO-30 packing information The devices can be packed in tube or tape and reel shipments (see the Devices summary on page 1 for packaging quantities). Figure 34. MultiPowerSO-30 tube shipment (no suffix) Tube dimension Dimension A mm 29 435 532 3.82 23.6 0.8 Base Q.ty Bulk Q.ty Tube length ( 0.5) C B A B C ( 0.13) Figure 35. MultiPowerSO-30 tape and reel shipment (suffix "TR") Reel dimension Dimension Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) D (min) G (+ 2 / -0) N (min) T (max) mm 1000 1000 330 1.5 13 20.2 32 100 38.4 Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Description Dimension mm Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.1) K (max) 32 4 24 1.5 2 14.2 2.2 End Start Top cover tape No components Components No components 500 mm min 500 mm min Empty components pockets User direction of feed 30/34 VND5004A-E / VND5004ASP30-E 5.5 Package and packing information PQFN - 12x12 Power lead-less packing information The devices can be packed in tray or tape and reel shipments (see the Devices summary on page 1 for packaging quantities). Figure 36. PQFN - 12x12 Power lead-less tray shipment (no suffix) Tray information Parameter Base Q.ty Bulk Q.ty 189 945 31/34 Package and packing information VND5004A-E / VND5004ASP30-E Figure 37. PQFN - 12x12 Power lead-less tape and reel shipment (suffix "TR") Tape dimensions Dimension mm A0 0.1 12.30 B0 0.1 12.30 K0 0.1 2.15 F 0.1 11.50 E 0.1 1.75 W 0.3 24 P2 0.1 2 P0 0.1 4 P1 0.1 16 T 0.05 D D1 (min) 0.30 1.50 1.50 Reel dimensions Dimension Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) D (min) G (+ 2 / -0) N (min) T (max) 32/34 mm 1500 1500 330 1.5 13 20.2 32 100 38.4 VND5004A-E / VND5004ASP30-E 6 Revision history Revision history Table 17. Document revision history Date Revision Changes 15-Sep-2003 1 Initial release. 21-Jun-2004 2 MultiPowerSO-30 package insertion. 22-Mar-2006 3 Major general update 02-Jul-2007 4 Document converted into new ST corporate template. Contents and lists of tables and figures added. Section 3.3: Maximum demagnetization energy (VCC = 13.5V) added. Section 5: Package and packing information updated 10-Dec-2007 5 Table 12: Electrical transient requirements - added note 3. 33/34 VND5004A-E / VND5004ASP30-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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