Motorola Master Selection Guide Logic: Standard, Special and Programmable3.0–1
Logic: Standard, Special
and Programmable
In Brief . . . Page
Motorola Programmable Arrays (MPA) 3.1–1. . . . . . . . . . . .
Selection by Function
Logic Functions 3.1–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device Index 3.1–36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Information 3.1–46. . . . . . . . . . . . . . . . . . . . . . . . . . .
Case Outlines 3.1–50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packaging Information 3.1–83. . . . . . . . . . . . . . . . . . . . . . . . .
Surface Mount 3.1–83. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Conversion Tables 3.1–83. . . . . . . . . . . . . . . . . . . . . . .
Tape and Reel 3.1–84. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
This selector guide is a quick reference to Motorola’s vast
offering of standard logic integrated circuits. In TTL, popular
due to its ease of use, low cost, medium–to–high speed
operation and good output drive capability, Motorola offers
both LS and FAST. Motorola’s CMOS portfolio includes
MC14000B standard CMOS series devices, High–Speed
CMOS consisting of a full line of products that are pinout–
compatible with many LSTTL and MC14000B standard
CMOS logic devices which offers designers a solution to the
long–standing combined barrier — high speed and low
power. Motorola’s Emitter Coupled Logic (MECL) is a
non–saturated form of digital logic which eliminates
transistor storage time permitting very high speed operation.
Motorola offers five versions of MECL: MECL 10K, MECL
10H, MECL III, and the recently introduced families ECLinPS
(ECL in picoseconds) and ECLinPS Lite. Also included are
timing solution products such as clock drivers, clock
generators and programmable delay chips, high
performance and communications products such as VCO’s,
prescalers, and synthesizers, and a wide variety of
translators, low–voltage bus interface and serial data
transmission devices. Field programmable logic and in
particular, field programmable arrays, have become the
solution of choice for logic design implementation in
applications where time to market is a critical product
development factor. In addition, reconfigurable arrays have
been used to enhance Customer product flexibility in ways
that no other technology can match.
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–1
INTRODUCTION TO
MOTOROLA PROGRAMMABLE ARRAYS
AND THE MPA DESIGN SYSTEM
Field programmable logic and in particular, field
programmable arrays, have become the solution of choice
for logic design implementation in applications where time
to market is a critical product development factor. In
addition, reconfigurable arrays have been used to enhance
Customer product flexibility in ways that no other
technology can match.
Programmable logic not only vastly reduces the time
necessary to implement a static design, but significant
product feature benefits can be realized when hardware can
be dynamically altered as easily as software.
The reconfigurable Motorola Programmable Array (MPA)
and MPA design system maximize application flexibility and
minimize time to market by delivering a gate level, push
button, programmable logic solution.
Design Capture
Logic system designers have two basic options when
selecting a method for capturing their designs. For smaller
or very regular designs, schematic capture continues to be
a popular design entry vehicle. With the increasing size
and complexity of today’s designs coupled with decreasing
design cycle time requirements, many designers are turning
to Hardware Description Languages (HDLs).
The MPA family was designed from the outset to be well
suited to both methodologies. The output of logic synthesis
compilers maps effortlessly and efficiently onto the MPA
architecture. Unlike other FPGA offerings, the MPA poses
no significant architectural limitations for which the designer
might otherwise have to adjust his schematic design
techniques for.
Push Button Design Implementation
The MPA design system minimizes training investment
and automatically generates design implementations which
meet timing constraints.
The gate level logic and abundant hierarchical routing
resources of the MPA device present a rich implementation
media for design implementation. MPA design tools
understand and optimally utilize the MPA device resources
so there are no elaborate rules to learn or design
modifications required to begin design capture. Staying
focused on end product design rather than implementation
tools or device architecture gets the design done faster and,
unlike other programmable solutions, without programmable
logic device specificity to impede future design migration
efforts. The combination of automatic tools and gate level
architecture is ideal for traditional schematic driven or high
level language based design capture methods. In fact, logic
synthesis tools were originally designed for and produce the
most efficient results for targeting gate level devices.
A design is analyzed, optimized, transformed into MPA
cells, partitioned, placed and routed based on timing
constraints for all paths in the design – automatically. A
netlist from one of the popular design capture systems or an
existing XNF or LPM netlist is imported into the MPA design
system. The logic is mapped to a series of MPA cells and
the entire resulting netlist is optimized and checked. Based
on a simple clock specification, the MPA design system
generates timing constraints for all paths in the design.
During automatic partitioning, placement and routing path
slack time is constantly redistributed insuring only the
resources required to meet timing requirements are
consumed. Because MPA tools implement the design
according to constraints, tool induced design iterations are
virtually eliminated. Completed layouts can be transformed
into device configurations, as well as annotated simulation
netlists. A layout browser is also available.
The MPA design system also includes complete on–line,
hypermedia, help covers the device, the design system and
the integration kits. Integration kits for Viewlogic, Exemplar,
VHDL (1076 and SDF), Verilog (OVI and SDF) and OrCAD
are included (contact your vendor for additional kits).All
these features add up to a powerful yet extremely easy to
use design implementation engine for the MPA product
family.
Design Importation
Designs can be captured using schematics, a high level
language, or a combination of these entry methods using
commercially available design capture and logic synthesis
software and the appropriate interface kit. Alternatively,
existing designs can be retargeted from other
programmable logic devices to the MPA device using
commercial logic synthesis tools or the powerful retargetting
capabilities provided with MPA design system.
Design importation begins with a netlist and an optional
clock specification file. The clock specification file provides
a mechanism for the user or design capture tools to
document system level timing requirements. In addition, a
rich set of attributes can be attached to specific components
or nets within the design to specify timing and design pinout
constraints.
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–2
A retargetting rules file is read and the input netlist is
transformed into a series of MPA cells and associated
interconnections. Rules files provide a mechanism to
perform attribute mapping, cell mapping and macro
expansion. By creating custom rule files, the user can
extend the importation process from arbitrary sources. The
MPA design system comes with rules for it’s native
library/EDIF. The resulting netlist is optimized to clip unused
logic and remove redundant logic. For example: each MPA
cell has programmable input inversion capability. All
Inverters or non–inverting buffers can be removed from the
netlist and replaced with signal sense information attached
to each input.
A series of design rule checks are performed to insure
design integrity before the layout process begins.
Constraint Generation
Timing constraints, the optimized MPA netlist and static
timing analysis is used to generate path slack constraints
for all paths in the design. Each unique signal pathway
between a register output and a register input throughout
the design are enumerated. The total logic and estimated or
real wire delays along the path are summed. The time
between the active upstream register clock edge and the
next active downstream clock edge minus the downstream
register setup time is subtracted from the total path delay.
This difference is called path slack. If any path in the design
has a negative slack value, the implementation will not
function at the required clock rate(s).
Path constraints are utilized throughout the layout
process to insure that a design implementation which meets
timing constraints is automatically generated. If no clock or
timing specifications are provided, the MPA design system
uses the fastest possible clock based on very small net
delay estimates to generate the path constraints. This
usually results in the best possible implementation, but may
take longer than the time required to generate a satisfactory
rather than best possible result.
Contrast this to other programmable logic design tools
which only provide manual net constraint annotation or net
criticality assignment. In these cases significant effort is
necessary to generate constraints and many costly
iterations are required to tune these constraints for a given
design. If any changes are made to the design, another
costly round of iterations is required.
Autolayout
The autolayout process makes use of the hierarchical
organization of the MPA device to minimize run time and
deliver implementations that meet timing requirements.
Designs which have diverse timing requirements are ideally
implemented because path slack estimates are refined
throughout the autolayout process insuring only the
resources required to meet timing requirements are
consumed.
The process begins by flattening the design and
partitioning it into small component groups of approximately
the same size called clusters. A cluster boundary delay
estimation is applied to pull the most tightly constrained
paths into a minimum number of clusters. The clusters are
then assigned to zones talking into account zonal boundary
delay cost and relative zone placement delay costs. Other
costs like total number of port connections per zone and are
also considered. As assignment proceeds, cluster and zone
boundary delay costs are added to each path and slack is
recomputed.
Next global placement and routing is done. Global routes
begin and end on either I/O cells or port cells. Intrazone
placement and routing is deferred to a later phase. During
global routing all the port cell and I/O cell locations are fixed
and the connections between them established. High fanout
nets are constructed in a highly regular manner to insure
efficient resource utilization. As in partitioning, slack
estimates are refined throughout global routing.
Finally the intrazonal placement and routing is done.
Cells assigned to a particular zone are placed and routed to
other zone cells or zone port cells. Port cells and core cells
are constructed to allow port swapping. Core cells can be
routed through if necessary. Allowing core cells to act as
routing cells allows dynamic adjustment of routing
resources within the zone. Dynamic resource adjustment is
a powerful design specific adaptation mechanism.
This process produces a layout from which device
configurations, delay back annotations, and chipviews can
be generated.
Incremental Design Support
When specification changes necessitate design
iterations, simply push the button again. Constraints are
automatically recalculated and autolayout only reworks
those portions of the design which have changed. Full
incremental design support means simple design changes
to facilitate design verification can be made quickly and
easily.
Delay Back Annotation
Designs can be verified through numerous methods. One
particularly useful method is the annotation of device and
implementation specific delays back into the original
simulation environment to improve system or device level
simulation accuracy. A MPA device layout can be
transformed into an appropriately formatted delay
annotation file or annotated netlist quickly and easily. The
annotated delay information represents the worst case
delays for a given device speed grade.
Chipview
While the MPA design system provides a rich set of
reports describing the implementation of a design, a
graphical view of the implementation can be indispensable
for reviewing overall layout quality. Chipview provides a
graphical view of a completed layout. Chipview can be
useful during initial design iterations to visually verify I/O pin
placements before commencing PCB layout, for example.
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–3
Configuration
A layout can be transformed into a device configuration
which, when loaded into the appropriate MPA device,
produces a physical design realization. Many formatting
options are available. The MPA download pod can be used
to emulate a serial PROM. Using the pod, device
configuration files can be downloaded to a device directly
from the PC or workstation development environment.
Integration Kits
The MPA design system can be used with a large number
of commercial electronic design automation software. For
each supported vendor, an integration kit is provided which
facilitates MPA design within that vendors’ environment.
Many of these kits are available from Motorola and included
at no charge on the MPA design system CDROM. Other kits
can be acquired directly from the vendor. Refer to the MPA
Design System Product List for more information.
Low Cost, Easy Access
MPA Design systems are easy to use, competitively
priced and widely available. Copies of MPA design system
software supporting up to 8000 gates can be downloaded
from the World Wide Web (WWW) at URL:
http://sps.motorola.com/fpga
Complete kits including download pod, evaluation board,
MPA device, CDROM and documentation can be ordered
from your local authorized Motorola distributor or Motorola
sales representative.
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–4
The Motorola Programmable Array (MPA) design system is a bridge between a design capture environment and Motorola
field programmable arrays. The MPA design system automatically transforms designs into device configurations to realize a
design, when loaded into an MPA device. A design is automatically analyzed, optimized, transformed into MPA cells,
partitioned, placed and routed based on timing constraints for every path in the design. MPA design tools understand and
optimally utilize the MPA device architecture; this eliminates the need to learn a new set of rules and makes these tools ideally
suited for use with logic synthesis. Full incremental design support reduces design implementation time and powerful library
retargeting capabilities allow you to reuse designs which may have been implemented on less capable devices. The MPA
design system operates on existing hardware platforms and supports design capture and simulation tools from more than 10
vendors. All these features plus on–line, hypermedia, help make the MPA design system a powerful, yet extremely easy to
use, design implementation engine.
Features
•Push Button Implementation
•Optimal Use of MPA Device Resources
•Optimal Results with Gate Level Design Input
•Library of Common MSI Functions
•Design Flow Manager
•Design Retargeter
•Timing Driven with Integrated Static Timing Analysis
•Layout Delay extraction for post layout simulation
•Layout viewer
•Incremental design support
•On–line, hypermedia, documentation
•Supports all popular design capture and simulation tools
•Lowest cost FPGA development systems.
•Instant access; Downloading via the internet (WWW, ftp).
•Supports multiple speed grades
Timing Driven Autolayout
•Partition Design Into Clusters
•Assign Clusters to Zones
•Global Place & Route
•Zonal Place & Route
•Continuous Slack
Redistribution
Design Importation
•Read Appropriate Rules File
•Retarget to MPA Primitives
•Macro Expansion
•Design Optimization
•Design Rule Checks
Constraint Generation
•Read User Constraints
•Path Enumeration
•Path Constraint Generation
MPA
Device
Chipview
•Read Stored Layout
•Construct Graphical
Representation
Delay Annotation
•Read Stored Layout
•Construct Annotated
Netlist
Configuration
•Read Stored Layout
•Construct Bitstream
MPA Family Overview
SEMICONDUCTOR TECHNICAL DATA
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–5
Motorola Programmable Array (MPA) products are a high density, high
performance, low cost, solution for your reconfigurable logic needs.
When used with our automatic high performance design tools, MPA
delivers custom logic solutions in minutes rather than weeks. And the low
cost keeps those solutions competitive throughout the product lifecycle.
The MPA architecture has solved the historical problems associated
with fine grain devices without sacrificing re–programmability, reliability,
or cost. MPA1000 devices are reprogrammable SRAM based products
manufactured on a standard 0.43µ Leff CMOS process with logic
capacities from 3,500 to more than 22,000 equivalent FPGA gates. MPA
Logic resources hold a single gate or storage element providing a highly
efficient, adaptable, design implementation medium. Gate level logic
resources, abundant hierarchical interconnection resources and
automatic, timing driven, tools work together to quickly provide design
implementations that meet timing constraints without sacrificing device
utilization.
Staying focused on end product design rather than implementation
tools or device architecture gets the design done faster and, unlike other
programmable solutions, without programmable logic device specificity to
impede future design migration efforts. The combination of automatic
tools and gate level architecture is ideal for traditional schematic driven or
high level language based design methodologies. In fact, logic synthesis
tools were originally designed for and produce the most efficient results
when targeting gate level devices.
High MPA1000 register count and controlled clock skew is ideal for
designs employing pipelining techniques such as communications. The
unique set of MPA1000 I/O programming options make these devices
suitable for industrial and computer interfacing circuits.
MPA1000 Family Members
FPGA
Gates* Part No. Logic
Cells Internal
Flip–Flops I/O Cell
Flip–Flops Avail
I/O Pins Packages Availability
3500 MPA1016FN
MPA1016DD 1600 400 122
160 61
80 84 PLCC
128 PQFP NOW
NOW
8000 MPA1036FN
MPA1036DD
MPA1036DH
MPA1036HI
3600 900 122
160
240
240
61
80
120
120
84 PLCC
128 PQFP
160 PQFP
181 PGA
NOW
NOW
NOW
NOW
14200 MPA1064DH
MPA1064DK
MPA1064KE
MPA1064BG
6400 1600 240
320
320
320
120
160
160
160
160 PQFP
208 PQFP
224 PGA
256 PBGA
NOW
NOW
NOW
3Q97
22000 MPA1100DK
MPA1100HV
MPA1100BG
10000 2500 320
400
400
160
200
200
208 PQFP
299 PGA
256 PBGA
NOW
NOW
3Q97
* Equivalent to Industry Standards, as supplied by most manufacturers.
PROGRAMMABLE ARRAY
3,500 to 22,000 GATES
•Multiple I/O from 80–200 I/O Pins
•Programmable 3V/5V I/O at Any Site
•Multiple Packaging Options
•Fine Grain Structure Is Optimized for
Logic Synthesis
•Programmable Output Drive,
4/6mA @ 5.0V and 3.3V
•High Register Count, with 560–2,900
Flip–Flops
•IEEE 1149.1 JTAG Boundary Scan
•Eight Low–Skew (<1ns) Clocks
MPA Family Overview
SEMICONDUCTOR TECHNICAL DATA
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–6
The MPA17128, MPA1765 serial OTP EPROMs provide a compact,
low pin count, non–volatile configuration store for MPA1000 devices.
MPA17000 devices can be cascaded for increased memory capacity
when needed. They are available in the standard 8–pin plastic DIP (N
suffix), 8–pin SOIC (D suffix) and 20–pin PLCC (FN suffix) packages.
•Configuration EPROM for MPA1000 Devices
•Voltage Range — 4.5 to 6.0V
•Maximum Read Current of 10mA
•Standby Current of 10µA, Typical
•Industry Standard Synchronous Serial Interface
•Full Static Operation
•10MHz Maximum Clock Rate at 5.0V
•Programmable Polarity on Hardware Reset
•Programs With Industry Standard Programmers
•Electrostatic Discharge Protection > 2000 Volts
•8–Pin PDIP and SOIC; 20–Pin PLCC Packages
•Commercial (0 to +70°C) and Industrial (–40 to +85°C)
81
72
63
54
VCC
Vpp
CEO
Vss
DATA
CLK
RESET/OE
CE
VCC
DATA
Vpp CEO
Vss
CLK RESET/
OE CE
19 18 13
17 16 15 14
12
11
10
9
45678
20
1
2
3
8–Lead Pinouts
(Top View)
20–Lead Pinout
(Top View)
NC
NC
NC
NC
NC NC NC
NC NC
NC
NC
NC
128K, 64K SERIAL EPROM
FN SUFFIX
PLCC PACKAGE
CASE 775–02
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
1
8
1
8
348
19
PIN NAMES
Function
Data I/O
Clock
Reset Input and Output Enable
Chip Enable Input
Ground
Chip Enable Output
Programming V oltage Supply
+4.5 to 6.0V Power Supply
Not Connected
Pins
DATA
CLK
RESET/OE
CE
VSS
CEO
VPP
VCC
NC
MPA Family Overview
SEMICONDUCTOR TECHNICAL DATA
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–7
The MPA17C256 is an easy to use and cost effective serial
configuration memory ideally suited for use with today’s popular SRAM
based FPGAs. The MPA17C256 is available in 8–pin PDIP and 20–pin
SOIC and PLCC packages, adhering to industry standard pinouts. The
device interfaces downstream FPGA(s) with a very simple enable, clock
and data interface. The MPA17C256 is reprogrammable with no need for
a higher programming “super voltage”; it may even be reprogrammed on
board. The MPA17C256 also has user programmable RESET/OE
polarity.
•EE Programmable 262,144 x 1 bit Serial Memories Designed to Store
Configuration Programs for FPGAs
•Simple Interface to SRAM FPGAs
•Cascadable to Support Additional Configurations or Future Higher
Density FPGAs
•Low Power CMOS EEPROM Process
•Programmable Reset Polarity
•Available in Space Efficient 8–Pin PDIP , 20–Pin SOIC and 20–Pin PLCC
Packages
•In–System Programmable via 2–Wire Bus
Controlling the MPA17C256 Serial EEPROM
Most connections between the FPGA device and the Serial EEPROM
are simple and self–explanatory:
•The DATA output of the MPA17C256 drives DIN of the FPGA devices
•The master FPGA DCLK output drives the CLK input of the MPA17C256
•The CEO output of the first MP A17C256 drives the CE input of the next
MPA17C256 in a cascade chain of EEPROMs.
•SER_EN must be connected to VCC
•CE enables the chip and is required to enable the DATA output pin
•RESET/OE is chip reset and is part of the DA T A output enable structure
This document contains information on a new product. Specifications and information herein are subject to
change without notice.
PIN NAMES
Function
Data I/O
Clock
Reset Input and Output Enable
Chip Enable Input
Ground
Chip Enable Output
Programming Enable
+4.5 to 6.0V Power Supply
Not Connected
Pins
DATA
CLK
RESET/OE
CE
VSS
CEO
SER_EN
VCC
NC
MPA17C256
FN SUFFIX
20–LEAD PLCC PACKAGE
CASE 775–02
DW SUFFIX
20–LEAD PLASTIC SOIC WIDE PACKAGE
CASE 751D–04
P SUFFIX
8–LEAD PLASTIC PACKAGE
CASE 626–05
MPA Family Overview
SEMICONDUCTOR TECHNICAL DATA
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–8
Selection by Function
In order to better serve our customers, we have made some modifications to the Selection by Function portion of the Logic
Selector Guide. For easy selection of Logic’s newer, more complex functions, as well as standard family functions, refer to the
subject index below. Within the Selection by Function tables on the next 27 pages, you will find functions sorted by these broad
subjects, and then broken down alphabetically into more precise functions.
Logic Functions
AMPLIFIER 3.1–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ARITHMETIC OPERATORS 3.1–9. . . . . . . . . . . . . . . . . .
BOUNCE ELIMINATOR 3.1–9. . . . . . . . . . . . . . . . . . . . . .
BUFFERS 3.1–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BUFFERS, 3–STATE 3.1–9. . . . . . . . . . . . . . . . . . . . . . . . .
BUS INTERFACE 3.1–10. . . . . . . . . . . . . . . . . . . . . . . . . . .
CBM 3.1–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CLOCK DISTRIBUTION CHIPS 3.1–12. . . . . . . . . . . . . .
CLOCK DRIVERS 3.1–12. . . . . . . . . . . . . . . . . . . . . . . . . .
COAX CABLE DRIVERS 3.1–13. . . . . . . . . . . . . . . . . . . .
COMP ARATORS 3.1–14. . . . . . . . . . . . . . . . . . . . . . . . . . .
CONVERTERS 3.1–14. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COUNTERS 3.1–14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DECODER/DEMUL TIPLEXERS 3.1–16. . . . . . . . . . . . . .
DETECTORS 3.1–17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DISPLAY DECODE DRIVERS 3.1–17. . . . . . . . . . . . . . . .
DIVIDERS 3.1–17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DRIVER 3.1–17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EDACs 3.1–17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ENCODERS 3.1–17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ENCODER/DECODERS 3.1–18. . . . . . . . . . . . . . . . . . . . .
EXP ANDERS 3.1–18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FIELD PROGRAMMABLE GATE ARRAYS 3.1–18. . . . .
FLIP–FLOPS 3.1–18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GATES, AND/NAND 3.1–21. . . . . . . . . . . . . . . . . . . . . . . .
GATES, COMPLEX 3.1–22. . . . . . . . . . . . . . . . . . . . . . . . .
GATES, EXCLUSIVE OR/EXCLUSIVE NOR 3.1–23. . .
GATES, NOR 3.1–24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GATES, OR 3.1–24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
INDUSTRIAL CONTROL UNIT 3.1–25. . . . . . . . . . . . . . .
INVERTERS 3.1–25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
INVERTER/BUFFERS, 2–STATE 3.1–25. . . . . . . . . . . . .
LA TCHES 3.1–26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MEMORY SUPPORT 3.1–27. . . . . . . . . . . . . . . . . . . . . . .
MISCELLANEOUS 3.1–27. . . . . . . . . . . . . . . . . . . . . . . . .
MULTIPLEXER/DATA SELECTORS 3.1–27. . . . . . . . . . .
MUL TIVIBRAT ORS 3.1–29. . . . . . . . . . . . . . . . . . . . . . . . .
OSCILLA T ORS 3.1–29. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OSCILLA T OR/TIMERS 3.1–30. . . . . . . . . . . . . . . . . . . . . .
PARITY CHECKERS 3.1–30. . . . . . . . . . . . . . . . . . . . . . . .
PHASE–LOCKED LOOP 3.1–30. . . . . . . . . . . . . . . . . . . .
PRESCALERS 3.1–30. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PROGRAMMABLE DELAY CHIPS 3.1–31. . . . . . . . . . . .
RAMs 3.1–31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RECEIVERS 3.1–31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
REGISTERS 3.1–32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
REGISTER FILES 3.1–32. . . . . . . . . . . . . . . . . . . . . . . . . .
SCHMITT TRIGGERS 3.1–32. . . . . . . . . . . . . . . . . . . . . . .
SCSI BUS TERMINATORS 3.1–32. . . . . . . . . . . . . . . . . .
SERIAL EPROMs 3.1–32. . . . . . . . . . . . . . . . . . . . . . . . . .
SHIFT REGISTERS 3.1–32. . . . . . . . . . . . . . . . . . . . . . . . .
SYNTHESIZERS 3.1–34. . . . . . . . . . . . . . . . . . . . . . . . . . .
TRANSCEIVERS 3.1–34. . . . . . . . . . . . . . . . . . . . . . . . . . .
TRANSLA T ORS 3.1–34. . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCO 3.1–35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–9
Selection by Function
Description Tech. Device(s) Pins DIP SM
AMPLIFIER
Fiber Optic Post Amplifier ECL MC10SX1125 – 16 D
ARITHMETIC OPERATORS
4–Bit Arithmetic Logic Unit TTL MC74F181 – 24 N DW
TTL MC74F381 – 20 N DW
TTL MC74F382 – 20 N DW
4–Bit Arithmetic Logic Unit/Function Generator ECL MC10H181 – 24 P,L,
PW,
LW
FN
ECL MC10181 – 24 P,L
4–Bit Binary Full Adder With Fast Carry TTL MC74F283 – 16 N D
TTL SN54LS83A SN74LS83A 14 N,J D
TTL SN54LS283 SN74LS283 16 N,J D
4–Bit Full Adder CMOS MC14008B – 16 P,L D
9’s Complementer CMOS MC14561B – 14 P D
BCD Rate Multiplier CMOS MC14527B – 16 P DW
Carry Lookahead Generator TTL MC74F182 – 16 N D
Dual 2–Bit Adder/Subtractor ECL MC10H180 – 16 P,L FN
ECL MC10180 – 16 P,L
Look Ahead Carry Block ECL MC10H179 – 16 P,L FN
NBCD Adder CMOS MC14560B – 16 P,L D
T riple Serial Adder (Negative Logic) CMOS MC14038B – 16 L
BOUNCE ELIMINATOR
Hex Contact Bounce Eliminator CMOS MC14490 – 16 P,L DW
BUFFERS
1:2 Differential Fanout Buf fer ECL MC100LVEL11 – 8 D
2:8 Differential Fanout Buf fer ECL MC100LVE310 MC100E310 28 FN
Dual 1:3 Fanout Buffer ECL MC100LVEL13 MC100EL13 20 DW
Expandable Buffer DTL MC832 – 14 P,L
Low Voltage Dual 1:4, 1:5 Dif ferential Fanout Buf fer, ECL/PECL
Compatible ECL MC100LVE210 MC100E210 28 FN
BUFFERS, 3–STA TE
Low–Voltage CMOS 16–Bit Buffer, 3–State, Inverting With
5V Tolerant Inputs and Outputs CMOS MC74LCX16240A – 20 DW,M,
DT
Low–Voltage CMOS 16–Bit Buffer, 3–State, Non–Inverting With
5V Tolerant Inputs and Outputs CMOS MC74LCX16244 – 20 DW,M,
DT
Low–Voltage CMOS Octal Buffer, 3–State, Non–Inverting With
5V Tolerant Inputs and Outputs CMOS MC74LCX244 – 20 DW,M,
DT
Low–Voltage CMOS Octal Buffer, 3–State, Inverting With 5V
Tolerant Inputs and Outputs CMOS MC74LCX240 – 20 DW,M,
DT
Low–Voltage CMOS Octal Buffer Flow Through Pinout, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs CMOS MC74LCX541 – 20 DW,M,
DT
Low–Voltage CMOS Octal Buffer Flow Through Pinout, 3–State,
Inverting With 5V Tolerant Inputs and Outputs CMOS MC74LCX540 – 20 DW,M,
DT
Low–Voltage CMOS Quad Buffer, 3–State, Inverting With 5V
Tolerant Inputs and Outputs CMOS MC74LCX125 – 20 DW,M,
DT
Low–Voltage Quiet CMOS Octal Buffer CMOS MC74LVQ541 – 20 D,M,
SD,DT
Low–Voltage Quiet CMOS Octal Buffer, 3–State, Non–Inverting CMOS MC74LVQ244 – 20 DW,M,
SD,DT
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–10
Selection by Function
Description SMDIPPinsDevice(s)Tech.
BUFFERS, 3–STA TE
Low–Voltage Quiet CMOS Octal Buffer, 3–State, Inverting CMOS MC74LVQ240 – 20 DW,M,
SD,DT
Low–Voltage Quiet CMOS Quad Buffer, 3–State, Non–Inverting CMOS MC74LVQ125 – 14 D,M,
SD,DT
BUS INTERFACE
10–Bit Buffer/Line Driver (Inverting), With 3–State Outputs TTL MC74F828 – 24 N DW
10–Bit Buffer/Line Driver (Non–Inverting), With 3–State Outputs TTL MC74F827 – 24 N DW
3–Bit Registered Bus T ransceiver, 25Ω Cutoff Outputs ECL MC10E336 MC100E336 28 FN
3–Bit Scannable Registered Bus T ransceiver ECL MC10E337 MC100E337 28 FN
32–Bit to 32/16/8–Bit Dynamic READ/WRITE Bus Sizer CMOS MC68150*33 – 68 FN
CMOS MC68150*40 – 68 FN
9–Bit Bus Interface, NINV, 3 State Outputs TTL MC74F823 – 24 N DW
Dual Bus Driver/Receiver With 4–to–1 Output Multiplexer (25Ω) ECL MC10H332 – 20 P,L FN
Hex 3–State Inverting Buffer With Common Enables CMOS MC54HC366 MC74HC366 16 N,J
Hex 3–State Inverting Buffer With Separate 2–Bit and 4–Bit
Sections CMOS MC74HC368 – 16 N
Hex 3–State Non–Inverting Buffer With Common Enables CMOS MC54HC365 MC74HC365 16 N,J DT
Hex 3–State Non–Inverting Buffer With Separate 2–Bit and 4–Bit
Sections CMOS MC54HC367 MC74HC367 16 N,J
Hex Buffer 4/2–Bit/Inverting With 3–State Outputs TTL SN54LS368A SN74LS368A 16 N,J D
Hex Buffer 4/2–Bit/Non–Inverting With 3–State Outputs TTL SN54LS367A SN74LS367A 16 N,J D
Hex Buffer Driver, 4+2–Bit, Inverting, With 3–State Outputs TTL MC74F368 – 16 N D
Hex Buffer Gated Enable Inverting With 3–State Outputs TTL SN54LS366A SN74LS366A 16 N,J D
Hex Buffer Gated Enable Non–Inverting With 3–State Outputs TTL SN54LS365A SN74LS365A 16 N,J D
Hex Buffer/Driver Gated Enable Inverting, With 3–State Outputs TTL MC74F366 – 16 N D
Hex Buffer/Driver Gated Enable Non–Inverting, With 3–State
Outputs TTL MC74F365 – 16 N D
Hex Buffer/Driver, 4+2–Bit, Non–Inverting, With 3–State Outputs TTL MC74F367 – 16 N D
Hex With 3–State Outputs Buffer (Non–Inverting) CMOS MC14503B – 16 P,L D
Octal 3–State Non–Inverting Bus T ransceiver With LSTTL
Compatible Inputs CMOS MC54HCT245A MC74HCT245A 20 N,J DW,
SD,DT
Octal Bidirectional T ransceiver With 3–State Inputs/Outputs CMOS MC74AC245 – 20 N DW
CMOS MC74ACT245 – 20 N DW
Octal Bidirectional T ransceiver With 3–State Outputs CMOS MC74AC620 – 20 N DW
CMOS MC74ACT620 – 20 N DW
CMOS MC74AC623 – 20 N DW
CMOS MC74ACT623 – 20 N DW
CMOS MC74AC640 – 20 N DW
CMOS MC74ACT640 – 20 N DW
CMOS MC74AC643 – 20 N DW
CMOS MC74ACT643 – 20 N DW
TTL MC74F245 – 20 N DW
Octal Bidirectional T ransceiver With 8–Bit Parity Generator
Checker With 3 State O tp ts
TTL MC74F657A – 24 N DW
y
Checker, With 3–State Outputs TTL MC74F657B – 24 N DW
Octal Bidirectional T ransceiver, With 3–State Inputs/Outputs TTL MC74F1245 – 20 N DW
Octal Buffer With 3–State Outputs (81LS95) TTL SN54LS795 SN74LS795 20 N,J DW
(81LS96) TTL SN54LS796 SN74LS796 20 N,J DW
(81LS97) TTL SN54LS797 SN74LS797 20 N,J DW
(81LS98) TTL SN54LS798 SN74LS798 20 N,J DW
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–11
Selection by Function
Description SMDIPPinsDevice(s)Tech.
BUS INTERFACE
Octal Buffer/Line Driver With 3–State Outputs TTL SN54LS244 SN74LS244 20 N,J DW
TTL MC74F240 – 20 N DW
TTL MC74F241 – 20 N DW
TTL MC74F244 – 20 N DW
TTL SN54LS240 SN74LS240 20 N,J DW
TTL SN54LS241 SN74LS241 20 N,J DW
TTL SN54LS540 SN74LS540 20 N,J DW
TTL SN54LS541 SN74LS541 20 N,J DW
CMOS MC74AC241 – 20 N DW
CMOS MC74AC244 – 20 N DW
CMOS MC74ACT244 – 20 N DW
CMOS MC74AC540 – 20 N DW
CMOS MC74ACT540 – 20 N DW
CMOS MC74AC541 – 20 N DW
CMOS MC74ACT541 – 20 N DW
CMOS MC74AC240 – 20 N DW
CMOS MC74ACT240 – 20 N DW
CMOS MC74ACT241 – 20 N DW
Octal Bus T ransceiver TTL SN54LS245 SN74LS245 20 N,J DW
TTL SN54LS623 SN74LS623 20 N,J DW
Octal Bus Transceiver, With 3–State Outputs TTL MC74F623 – 20 N DW
Octal Bus T ransceiver/Inverting With 3–State Outputs TTL SN54LS640 SN74LS640 20 N,J DW
TTL MC74F620 – 20 N DW
TTL MC74F640 – 20 N DW
Octal Bus Transceiver/Non–Inverting With 3–State Outputs TTL SN54LS645 SN74LS645 20 N,J DW
Octal Bus Transceiver/Register With 3–State Outputs
Non–Inverting CMOS MC74AC652 – 24 N DW
CMOS MC74ACT652 – 24 N DW
Octal Registered T ransceiver Inverting, With 3–State Outputs TTL MC74F544 – 24 N DW
Octal Transceiver/Register With 3–State Outputs Non–Inverting CMOS MC74AC646 – 24 N DW
CMOS MC74ACT646 – 24 N DW
Octal Transceiver/Register With 3–State Outputs Inverting CMOS MC74AC648 – 24 N DW
CMOS MC74ACT648 – 24 N DW
Octal Transceiver/Register, With 3–State Outputs TTL MC74F646 – 24 N DW
Octal With 3–State Non–Inverting Buffer/Line Driver/Line Receiver CMOS MC54HC241A MC74HC241A 20 N,J DW
Octal With 3–State Non–Inverting Buffer/Line Driver/Line Receiver
With LSTTL Compatible Inputs
CMOS MC54HCT241A MC74HCT241A 20 N,J DW
g
With LSTTL Compatible Inputs CMOS MC54HCT244A MC74HCT244A 20 N,J DW,
SD,DT
Octal With 3–State Outputs Inverting Buffer/Line Driver/Line
Receiver CMOS MC54HC240A MC74HC240A 20 N,J DW,
DT
CMOS MC54HC540A MC74HC540A 20 N,J DW
Octal With 3–State Outputs Inverting Buffer/Line Driver/Line
Receiver With LSTTL Compatible Inputs CMOS MC74HCT240A – 20 N DW,
SD,DT
Octal With 3–State Outputs Inverting Bus T ransceiver CMOS MC54HC640A MC74HC640A 20 N,J DW
Octal With 3–State Outputs Non–Inverting Buffer/Line Driver/Line
Receiver CMOS MC54HC541A MC74HC541A 20 N,J DW
CMOS MC74VHC541 – 20 DW,
DT,M
Octal With 3–State Outputs Non–Inverting Buffer/Line Driver/Line
Receiver With LSTTL Compatible Inputs CMOS MC74HCT541A – 20 N DW
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–12
Selection by Function
Description SMDIPPinsDevice(s)Tech.
BUS INTERFACE
Octal With 3–State Outputs Non–Inverting Buffer/Line Driver/Line
Receiver CMOS MC54HC244A MC74HC244A 20 N,J DW,
SD,DT
CMOS MC74VHC244 – 20 DW,
DT,M
Octal With 3–State Outputs Non–Inverting Bus T ransceiver CMOS MC54HC245A MC74HC245A 20 N,J DW
CMOS MC74VHC245 – 20 DW
DT,M
Octal With 3–State Outputs Non–Inverting Bus T ransceiver & D
Flip–Flop CMOS MC54HC646 MC74HC646 24 N,J DW
Quad Buffers With 3–State Outputs TTL SN54LS125A SN74LS125A 14 N,J D
Quad 3–State Non–Inverting Buffers CMOS MC74HC125A – 14 N D,DT
CMOS MC74VHC125 – 14 D,
DT,M
CMOS MC74HC126A – 14 N D,DT
Quad Buffer With 3–State Outputs CMOS MC74AC125 – 14 N D
CMOS MC74ACT125 – 14 N D
CMOS MC74AC126 – 14 N D
CMOS MC74ACT126 – 14 N D
TTL MC74F125 – 14 N D
TTL MC74F126 – 14 N D
TTL SN54LS126A SN74LS126A 14 N,J D
Quad Bus Driver ECL MC10192 – 16 P,L FN
Quad Bus Driver/Receiver With 2–to–1 Output Multiplexer (25Ω) ECL MC10H330 – 24 P,L FN
Quad Bus Driver/Receiver With T ransmit & Receiver Latches
(25Ω)ECL MC10H334 – 20 P,L FN
Quad Bus Transceiver/Inverting With 3–State Outputs TTL SN54LS242 SN74LS242 14 N,J D
Quad Bus T ransceiver/Non–Inverting With 3–State Outputs TTL SN54LS243 SN74LS243 14 N,J D
Quad Bus Transceivers With 3–State Outputs TTL MC74F242 – 14 N D
TTL MC74F243 – 14 N D
Quad With 3–State Outputs Inverting Bus T ransceiver CMOS MC74HC242 – 14 N
T riple 3–Input Bus Driver With Enable (25Ω) ECL MC10H423 – 16 P,L FN
T riple 4–3–3 Input Bus Driver (25Ω) ECL MC10H123 – 16 P,L FN
ECL MC10123 – 16 P,L FN
CBM
CBM – Carrier Band Modem SXLG MC68194 – 52 *FJ
CLOCK DISTRIBUTION CHIPS
1:4 Clock Distribution Chip ECL MC10EL15 MC100EL15 16 D
1:5 Clock Distribution Chip ECL MC100LVEL14 MC100EL14 20 DW
1:6 Differential Clock Distribution Chip ECL MC10E211 MC100E211 28 FN
Low Voltage 1:12 Clock Distribution Chip SXLG MPC948 – 32 FA
SXLG MPC948L – 32 FA
Low Voltage 1:9 Clock Distribution Chip SXLG MPC947 – 32 FA
Low Voltage 1:9 ECL/PECL Clock Distribution Chip ECL MC100LVE11 1 – 28 FN
CLOCK DRIVERS
1:2 Differential Clock Driver ECL MC10EL11 MC100EL11 8 D
1:6 PCI Clock Generator/Fanout Buffer CMOS MPC903 – 16 D
CMOS MPC904 – 16 D
CMOS MPC905 – 16 D
1:9 Differential Clock Driver With Low Skew, Enable, Vbb ECL MC10E111 MC100E111 28 FN
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–13
Selection by Function
Description SMDIPPinsDevice(s)Tech.
CLOCK DRIVERS
1:9 Differential ECL/PECL RAMBus Clock Buffer ECL MC10E411 – 28 FN
1:9 TTL/TTL Clock Distribution Chip ECL MC10H645 – 28 FN
3.3/5.0V Fully Integrated PLL Clock Driver CMOS MPC974 – 52 FA
50 MHz Low Skew CMOS PLL Clock Driver With µP Power Down CMOS MC88920 – 20 DW
66 MHz Low Skew CMOS PLL Clock Driver With µP
Power–Down/Power–Up Feature CMOS MC88921 – 20 DW
68030/040 PECL/TTL Clock Driver ECL MC10H640 MC100H640 28 FN
ECL MC10H642 MC100H642 28 FN
ECL MC10H644 MC100H644 20 FN
Clock Driver Quad D–T ype Flip–Flop w/ Matched Propagation
Delays TTL MC74F1803 – 14 N D
TTL MC74F803 – 14 N D
CMOS PLL Clock Driver Programmable Frequency, Low Skew,
High Fan–Out CMOS MC88PL117 – 52 FN
Dual 3.3V PLL Clock Generator CMOS MPC980 – 52 FA
Dual Supply ECL/TTL 1:8 Clock Driver ECL MC10H643 MC100H643 28 FN
High Frequency PLL Clock Generator ECL MC12429 – 28 FN
ECL MC12430 – 28 FN
ECL MC12439 – 28 FN
Low Skew CMOS Clock Driver CMOS MC88913 – 14 N D
Low Skew CMOS Clock Driver With Reset CMOS MC88914 – 14 N D
Low Skew CMOS PLL 68060 Clock Driver CMOS MC88LV926 – 20 DW
Low Skew CMOS PLL Clock Driver CMOS MC88915*55 – 28 FN
CMOS MC88915*70 – 28 FN
Low Skew CMOS PLL Clock Driver With Processor Reset CMOS MC88916*70 – 20 DW
CMOS MC88916*80 – 20 DW
Low Skew CMOS PLL Clock Driver 160 MHz Version CMOS MC88915T*160 – 28 FN
133 MHz Version CMOS MC88915T*133 – 28 FN
100 MHz Version CMOS MC88915T*100 – 28 FN
70 MHz Version CMOS MC88915T*70 – 28 FN
55 MHz Version CMOS MC88915T*55 – 28 FN
Low Voltage 1:10 CMOS Clock Driver CMOS MPC946 – 32 FA
Low V oltage 1:15 Differential ÷1/2 ECL/PECL Clock Driver ECL MC100LVE222 – 52 FA
Low Voltage 1:15 PECL to CMOS Clock Driver CMOS MPC949 – 52 FA
Low Voltage 1:9 Differential ECL/HSTL to HSTL Clock Driver CMOS MPC911 – 28 FN
Low Voltage PECL PLL Clock Driver CMOS MPC992 – 32 FA
Low Voltage PLL Clock Driver CMOS MPC930 MPC931 32 FA
CMOS MPC950 MPC951 32 FA
CMOS MPC956 – 32 FA
CMOS MPC970 – 52 FA
CMOS MPC972 MPC973 52 FA
CMOS MPC990 MPC991 52 FA
Low Voltage Wide Fanout PLL Clock Driver CMOS MPC952 – 32 FA
PECL/TTL to TTL 1: 8 Clock Distribution Chip ECL MC10H646 MC100H646 28 FN
Single Supply PECL/TTL 1:9 Clock Distribution Chip ECL MC10H641 MC100H641 28 FN
÷2, ÷4/6 Clock Generation Chip (3.3V) ECL MC100LVEL38 MC100EL38 20 DW
÷2/4, ÷4/6 Clock Generation Chip ECL MC100LVEL39 MC100EL39 20 DW
÷2,4,8 Differential Clock Driver ECL MC10EL34 MC100EL34 16 D
COAX CABLE DRIVERS
Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit SDX MC10SX1189 – 16 D
300 MBit/s LED Driver for FDDI and Fibre Channel SDX MC10SX1130 – 16 D
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–14
Selection by Function
Description SMDIPPinsDevice(s)Tech.
COMPARATORS
4–Bit Magnitude Comparator TTL MC74F85 – 16 N D
CMOS MC74HC85 – 16 N DT
TTL SN54LS85 SN74LS85 16 N,J D
CMOS MC14585B – 16 P,L D
5–Bit Magnitude Comparator ECL MC10H166 – 16 P,L FN
ECL MC10166 – 16 P,L FN
8–Bit Equality Comparator CMOS MC54HC688 MC74HC688 20 N,J DW
8–Bit Identity Comparator CMOS MC74ACT521 – 20 N
TTL MC74F521 – 20 N DW
8–Bit Magnitude Comparator TTL SN54LS682 SN74LS682 20 N,J DW
TTL SN54LS684 SN74LS684 20 N,J DW
TTL SN54LS688 SN74LS688 20 N,J DW
9–Bit Magnitude Comparator ECL MC10E166 MC100E166 28 FN
Dual Analog Comparator With Latch ECL MC10E1651 – 16,20 L FN
Dual Analog Comparator With Latch (Hi–Perf MC1651) ECL MC10E1652 – 16,20 L FN
CONVERTERS
4–Bit Parallel to Serial Converter ECL MC10E446 MC100E446 28 FN
4–Bit Serial to Parallel Converter ECL MC10E445 MC100E445 28 FN
Dual A/D Converter ECL MC1650 – 16 L
ECL MC1651 – 16 L
COUNTERS
12–Bit Binary Counter CMOS MC14040B – 16 P,L D
12–Stage Binary Ripple Counter CMOS MC54HC4040A MC74HC4040A 16 N,J D,DT
CMOS MC74AC4040 – 16 N D
14–Bit Binary Counter CMOS MC14020B – 16 P,L D
14–Bit Binary Counter and Oscillator CMOS MC14060B – 16 P,L D
14–Stage Binary Ripple Counter CMOS MC74HC4020A – 16 N D,DT
CMOS MC74AC4020 – 16 N D
14–Stage Binary Ripple Counter With Oscillator CMOS MC54HC4060 MC74HC4060 16 N,J DT
CMOS MC54HC4060A MC74HC4060A 16 N,J D,DT
3–Digit BCD Counter CMOS MC14553B – 16 P DW
4–Bit BCD Decade Counter, Asynchronous Reset TTL SN54LS160A SN74LS160A 16 N,J D
TTL SN54LS162A SN74LS162A 16 N,J D
4–Bit Bidirectional Binary Counter, With 3–State Outputs TTL MC74F569 – 20 N DW
4–Bit Bidirectional Decade Counter, With 3–State Outputs TTL MC74F568 – 20 N DW
4–Bit Binary Counter TTL SN54LS93 SN74LS93 14 N,J D
TTL SN54LS293 SN74LS293 14 N,J D
ECL MC10H16 – 16 P,L FN
4–Bit Binary Counter, Synchronous Presettable CMOS MC14161B – 16 P D
CMOS MC14163B – 16 P D
4–Bit Binary Counter, Synchronous Reset TTL SN54LS161A SN74LS161A 16 N,J D
TTL SN54LS163A SN74LS163A 16 N,J D
4–Bit Up/Down Counter With 3–State Outputs TTL SN54LS569A SN74LS569A 20 N,J DW
4–Stage Presettable Ripple Counters TTL SN54LS196 SN74LS196 14 N,J D
TTL SN54LS197 SN74LS197 14 N,J D
4–Stage Synchronous Bidirectional Counter TTL MC74F168 – 16 N D
TTL MC74F169 – 16 N D
5 Cascaded BCD Counters CMOS MC14534B – 24 P,L DW
6–Bit Universal Counter, (Lookahead Carry) ECL MC10E136 MC100E136 28 FN
7–Stage Ripple Counter CMOS MC14024B – 14 P,L D
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–15
Selection by Function
Description SMDIPPinsDevice(s)Tech.
COUNTERS
8–Bit Bidirectional Binary Counter TTL MC74F269 – 24 N DW
8–Bit Bidirectional Binary Counter, With 3–State Outputs TTL MC74F579 – 20 N DW
TTL MC74F779 – 16 N D
8–Bit Ripple Counter ECL MC10E137 MC100E137 28 FN
8–Bit Synchronous Binary Up Counter ECL MC10E016 MC100E016 28 FN
BCD Decade Counter, Synchronous Presettable TTL MC74F160A – 16 N D
TTL MC74F162A – 16 N D
BCD Decade Synchronous Bidirectional Counter TTL SN54LS168 SN74LS168 16 N,J D
Bi–Quinary Counter ECL MC10138 – 16 P,L FN
Binary Counter ECL MC10154 – 16 P,L
ECL MC10178 – 16 P,L FN
Binary Counter, Synchronous Presettable, 4–Bit TTL MC74F161A – 16 N D
TTL MC74F163A – 16 N D
Counter Control Logic ECL MC12014 – 16 P,L
Decade Counter TTL SN54LS90 SN74LS90 14 N,J D
TTL SN54LS290 SN74LS290 14 N,J D
CMOS MC14017B – 16 P,L D
CMOS MC74HC4017 – 16 N D
Divide By 12 Counter TTL SN54LS92 SN74LS92 14 N,J D
Dual 4–Stage Binary Counter TTL SN54LS393 SN74LS393 16 N,J D
Dual 4–Stage Binary Ripple Counter CMOS MC54HC393 MC74HC393 14 N,J D
Dual 4–Stage Binary Ripple Counter W ÷2, ÷5 Sections CMOS MC54HC390 MC74HC390 16 N,J D
Dual BCD Up Counter CMOS MC14518B – 16 P,L DW
Dual Binary Up Counter CMOS MC14520B – 16 P,L DW
Dual Decade Counter TTL SN54LS390 SN74LS390 16 N,J D
TTL SN54LS490 SN74LS490 16 N,J D
Industrial T ime Base Generator CMOS MC14566B – 16 P D
Modulo 16 Binary Synchronous Bidirectional Counter TTL SN54LS169 SN74LS169 16 N,J D
Octal Counter CMOS MC14022B – 16 P,L D
Phase Comparator and Programmable Counter CMOS MC14568B – 16 P,L D
Presettable 4–Bit BCD Down Counter CMOS MC14522B – 16 P DW
Presettable 4–Bit Binary Down Counter CMOS MC14526B – 16 P,L DW
Presettable 4–Bit Binary Up/Down Counter TTL SN54LS191 SN74LS191 16 N,J D
TTL SN54LS193 SN74LS193 16 N,J D
Presettable BCD Up/Down Counter CMOS MC14510B – 16 P D
Presettable BCD/Decade Up/Down Counter TTL SN54LS190 SN74LS190 16 N,J D
TTL SN54LS192 SN74LS192 16 N,J D
Presettable Binary Up/Down Counter CMOS MC14516B – 16 P,L D
Presettable Binary/BCD Up/Down Counter CMOS MC14029B – 16 P,L D
Presettable Counter CMOS MC54HC160 MC74HC160 16 N,J D
CMOS MC54HC161A MC74HC161A 16 N,J D
CMOS MC54HCT161A MC74HCT161A 16 N,J D
CMOS MC54HC162 MC74HC162 16 N,J D
CMOS MC54HC163A MC74HC163 16 N,J D
CMOS MC54HCT163A MC74HCT163A 16 N,J D
Presettable Divide–by–N Counter CMOS MC14018B – 16 P D
Programmable Dual Binary/BCD Counter CMOS MC14569B – 16 P,L DW
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–16
Selection by Function
Description SMDIPPinsDevice(s)Tech.
COUNTERS
Programmable Modulo–N Counters (N=0–9) ECL MC4016 – 16 P,L
ECL MC4018 – 16 P,L
ECL MC4316 – 16 P,L
Synchronous 4–Bit Up/Down Counter TTL SN54LS669 SN74LS669 16 N,J D
Synchronous Presettable Binary Counter CMOS MC74AC161 – 16 N D
CMOS MC74ACT161 – 16 N D
Synchronous Presettable Binary Counter CMOS MC74AC163 – 16 N D
CMOS MC74ACT163 – 16 N D
Synchronous Presettable Binary–Coded–Decimal Decade Counter CMOS MC74AC160 – 16 N D
CMOS MC74ACT160 – 16 N D
CMOS MC74AC162 – 16 N D
CMOS MC74ACT162 – 16 N D
Universal Decade Counter ECL MC10137 – 16 P,L
Universal Hexadecimal Counter ECL MC10H136 – 16 P,L FN
ECL MC10136 – 16 P,L FN
Up/Down Counter With Preset and Ripple Clock CMOS MC74AC190 – 16 N D
DECODER/DEMULTIPLEXERS
1–of–10 Decoder CMOS MC74HC42 – 16 N D
TTL SN54LS42 SN74LS42 16 N,J D
1–of–10 Decoder/Driver Open–Collector TTL SN54LS145 SN74LS145 16 N,J D
1–of–10 Decoder, With 3–State Outputs TTL MC74F537 – 20 N DW
1–of–16 Decoder/Demultiplexer CMOS MC54HC154 MC74HC154 24 N,J DW
1–of–16 Decoder/Demultiplexer With Address Latch CMOS MC74HC4514 – 24 N DW
1–of–4 Decoder, With 3–State Outputs TTL MC74F539 – 20 N DW
1–of–8 Decoder, With 3–State Outputs TTL MC74F538 – 20 N DW
1–of–8 Decoder/Demultiplexer CMOS MC74AC138 – 16 N D
CMOS MC74ACT138 – 16 N D
TTL MC74F138 – 16 N D
CMOS MC54HC138A MC74HC138A 16 N,J D
CMOS MC74VHC138 – 16 D,DT,
M
CMOS MC74HCT138A – 16 N D,DT
TTL SN54LS138 SN74LS138 16 N,J D
1–of–8 Decoder/Demultiplexer With Address Latch CMOS MC74HC137 – 16 N D
CMOS MC74HC237 – 16 N D
3–Line to 8–Line Decoders/Demultiplexers With Address Latches TTL SN54LS137 SN74LS137 16 N,J D
4–Bit Transparent Latch/4–to–16 Line Decoder (High) CMOS MC14514B – 24 P,L DW
4–Bit Transparent Latch/4–to–16 Line Decoder (Low) CMOS MC14515B – 24 P,L DW
8–Bit Addressable Latch/1–of–8 Decoder CMOS MC54HC259 MC74HC259 16 N,J D
BCD–to–Decimal Decoder/Binary–to–Octal Decoder CMOS MC14028B – 16 P,L D
Binary to 1–4 Decoder (Low) ECL MC10171 – 16 P,L FN
Binary to 1–8 Decoder, (High) ECL MC10H162 – 16 P,L FN
ECL MC10162 – 16 P,L FN
Binary to 1–8 Decoder, (Low) ECL MC10H161 – 16 P,L FN
ECL MC10161 – 16 P,L FN
Dual 1–of–4 Decoder TTL SN54LS155 SN74LS155 16 N,J D
Dual 1–of–4 Decoder Open–Collector TTL SN54LS156 SN74LS156 16 N,J D
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–17
Selection by Function
Description SMDIPPinsDevice(s)Tech.
DECODER/DEMULTIPLEXERS
Dual 1–of–4 Decoder/Demultiplexer CMOS MC74AC139 – 16 N D
CMOS MC74ACT139 – 16 N D
TTL MC74F139 – 16 N D
Dual 1–of–4 Decoder/Demultiplexer CMOS MC54HC139A MC74HC139A 16 N,J D
TTL SN54LS139 SN74LS139 16 N,J D
Dual Binary to 1–4 Decoder (High) ECL MC10H172 – 16 P,L FN
ECL MC10172 – 16 P,L FN
Dual Binary to 1–4 Decoder (Low) ECL MC10H171 – 16 P,L FN
Dual Binary to 1–of–4 Decoder (Active High Outputs) CMOS MC14555B – 16 P D
Dual Binary to 1–of–4 Decoder (Active Low Outputs) CMOS MC14556B – 16 P D
Low–Voltage CMOS 1–of–8 Decoder/Demultiplexer With 5V
Tolerant Inputs and Outputs CMOS MC74LCX138 – 16 D,DT
Low–Voltage Quiet CMOS 1–of–8 Decoder/Demultiplexer CMOS MC74LVQ138 – 16 D,M,
SD,DT
DETECTORS
Analog Mixer ECL MC12002 – 14 P,L
Phase–Frequency Detector ECL MC4044 – 14 P,L D
ECL MC4344 – 14 P,L
ECL MC12040 – 14 P,L FN
ECL MCH12140 MCK12140 8 D
DISPLAY DECODE DRIVERS
BCD–to–Seven Segment Decoder TTL SN54LS48 SN74LS48 16 N,J D
CMOS MC14558B – 16 P,L D
BCD–to–Seven Segment Decoder/Driver TTL SN54LS47 SN74LS47 16 N,J D
TTL SN54LS247 SN74LS247 16 N,J D
TTL SN54LS248 SN74LS248 16 N,J D
TTL SN54LS249 SN74LS249 16 N,J D
BCD–to–Seven Segment Latch/Decoder/Display Driver CMOS MC74HC4511 – 16 N D
BCD–to–Seven Segment Latch/Decoder/Driver CMOS MC14511B – 16 P,L D,DW
BCD–to–Seven Segment Latch/Decoder/Driver for Liquid Crystals CMOS MC14543B – 16 P,L D
BCD–to–Seven Segment Latch/Decoder/Driver With Ripple
Blanking
CMOS MC14544B – 18 P,L
gpp
Blanking CMOS MC14513B – 18 P
High Current BCD–to–Seven Segment Decoder/Driver CMOS MC14547B – 16 P,L DW
DIVIDERS
÷ 2 Divider ECL MC10EL32 MC100EL32 8 D
ECL MC100LVEL32 – 8 D
÷ 4 Divider ECL MC10EL33 MC100EL33 8 D
ECL MC100LVEL33 – 8 D
DRIVER
Coaxial Cable Driver ECL MC10EL89 – 8 D
300MBit/s LED Driver for FDDI and Fibre Channel ECL MC10SX1130 – 16 D
EDACs
Error Detection–Correction Circuit (IBM Code) ECL MC10163 – 16 P,L
Error Detection–Correction Circuit (Motorola Code) ECL MC10193 – 16 P,L
ENCODERS
10–Line to 4–Line Priority Encoder TTL SN54LS147 SN74LS147 16 N,J D
8–Bit Priority Encoder CMOS MC14532B – 16 P,L D
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–18
Selection by Function
Description SMDIPPinsDevice(s)Tech.
ENCODERS
8–Input Priority Encoder TTL SN54LS348 SN74LS348 16 N,J D
ECL MC10H165 – 16 P,L FN
ECL MC10165 – 16 P,L FN
8–Input Priority Encoder (Glitchless) TTL SN54LS848 SN74LS848 16 N,J D
8–Line to 3–Line Priority Encoder TTL MC74F148 – 16 N D
TTL SN54LS148 SN74LS148 16 N,J D
TTL SN54LS748 SN74LS748 16 N,J D
Decimal–to–BCD Encoder CMOS MC74HC147 – 16 N D
ENCODER/DECODERS
CMI Encoder/Decoder ECL MC100SX1230 – 28 FN
EXPANDERS
Dual 4–Iput Expander HTL MC669 – 14 P,L
Expandable Dual 4–Input Gate (Active Pullup) HTL MC660 – 14 P,L
Expandable Dual 4–Input Gate (Passive Pullup) HTL MC661 – 14 P,L
Expandable Dual 4–Input Line Driver HTL MC662 – 14 P,L
Expandable Dual Power Gate DTL MC844 – 14 P,L
DTL MC944 – 14 P,L
FIELD PROGRAMMABLE GATE ARRAY
14,200–Gate Programmable Array With Up to 160 User I/Os CMOS MPA1064 – 160,
224 DH,
KE
22,000–Gate Programmable Array With Up to 200 User I/Os CMOS MPA1100 – 229 HV
3,500–Gate Programmable Array With Up to 80 User I/Os CMOS MPA1016 – 84,
128 FN,
DD
8,000–Gate Programmable Array With Up to 120 User I/Os CMOS MPA1036 – 84,
128,
160,
181
FN,
DD,
DH,
HI
FLIP–FLOPS
3–Bit Differential Flip–Flop ECL MC10E431 MC100E431 28 FN
4–Bit D Flip–Flop Individual Clock, Reset Differential Output ECL MC10E131 MC100E131 28 FN
4–Bit D Flip–Flop With Enable TTL SN54LS379 SN74LS379 16 N,J D
4–Bit D–Type Register With With 3–State Outputs TTL SN54LS173A SN74LS173A 16 N,J D
5–Bit Differential Register ECL MC10E452 MC100E452 28 FN
6–Bit 2:1 Mux–Register With Common Clock, Asynchronous
Master Reset Single Ended ECL MC10E167 MC100E167 28 FN
6–Bit D Register With Common Clock, Asynchronous Master
Reset, Differential Outputs ECL MC10E151 MC100E151 28 FN
6–Bit D Register, With Dif ferential Inputs, (Data & Clock) , VBB,
Common Reset ECL MC10E451 MC100E451 28 FN
6–Bit Parallel D Register With Enable CMOS MC74AC378 – 16 N D
CMOS MC74ACT378 – 16 N D
9–Bit Hold Register, 700MHz, With Asynchronous Master Reset ECL MC10E143 MC100E143 28 FN
Clocked Flip–Flop DTL MC845 – 14 P,L
Clocked Flip–Flop DTL MC945 – 14 P,L
D Flip–Flop With Set & Reset ECL MC10EL31 MC100EL31 8 D
Differential Clock D Flip–Flop ECL MC10EL51 MC100EL51 8 D
ECL MC100LVEL51 – 8 D
Differential Data & Clock D Flip–Flop ECL MC10EL52 MC100EL52 8 D
Dual D Flip–Flop CMOS MC74AC74 – 14 N D
CMOS MC74ACT74 – 14 N D
CMOS MC14013B – 14 P,L D
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–19
Selection by Function
Description SMDIPPinsDevice(s)Tech.
FLIP–FLOPS
Dual D Flip–Flop With Set and Reset CMOS MC54HC74A MC74HC74A 14 N,J D,DT
CMOS MC74VHC74 – 14 D,
DT,M
Dual D Flip–Flop With Set and Reset With LSTTL Compatible
Inputs CMOS MC74HCT74A – 14 N D
Dual D–Type Positive Edge–Triggered Flip–Flop TTL MC74F74 – 14 N D
TTL SN54LS74A SN74LS74A 16 N,J D
Dual Differential Data and Clock D Flip–Flop With Set and Reset ECL MC100LVEL29 MC100EL29 20 DW
Dual J–K Negative Edge–T riggered Flip–Flop TTL SN54LS112A SN74LS112A 16 N,J D
TTL SN54LS113A SN74LS113A 14 N,J D
TTL SN54LS114A SN74LS114A 14 N,J D
Dual J–K Positive Edge–T riggered Flip–Flop TTL SN54LS109A SN74LS109A 16 N,J D
Dual J–K Flip–Flop HTL MC663 – 14 P,L
TTL SN54LS107A SN74LS107A 14 N,J D
Dual J–K Flip–Flop (Common Clock and CD Separate SD) DTL MC952 – 14 P,L
Dual J–K Flip–Flop (Separate Clock and SD, No CD) DTL MC953 – 14 P,L
Dual J–K Flip–Flop Negative Edge T rigger CMOS MC74AC112 – 16 N D
CMOS MC74ACT112 – 16 N D
Dual J–K Flip–Flop Negative Edge T rigger CMOS MC74AC113 – 14 N D
CMOS MC74ACT113 – 14 N D
Dual J–K Flip–Flop With Set and Clear TTL SN54LS76A SN74LS76A 16 N,J D
Dual J–K Flip–Flop With Set and Reset CMOS MC74HC112 – 16 N D,DT
Dual J–K Flip–Flop CMOS MC14027B – 16 P,L D
Dual J–K Flip–Flop With Reset CMOS MC74HC73 – 14 N D
CMOS MC74HC107 – 14 N D
Dual J–K Flip–Flop With Set and Reset CMOS MC74HC76 – 16 N D
Dual J–K Master–Slave Flip–Flop ECL MC10135 – 16 P,L FN
ECL MC10H135 – 16 P,L FN
Dual J–K Negative Edge–T riggered Flip–Flop TTL MC74F112 – 16 N D
TTL SN54LS73A SN74LS73A 14 N,J D
Dual J–K Positive Edge–T riggered Flip–Flop With Set & Clear CMOS MC74AC109 – 16 N D
CMOS MC74ACT109 – 16 N D
Dual J–K Flip–Flop With Set and Reset CMOS MC74HC109 – 16 N D
Dual J–K Positive Edge–T riggered Flip–Flop TTL MC74F109 – 16 N D
Dual T ype–D Master–Slave Flip–Flop ECL MC10131 – 16 P,L FN
ECL MC10H131 – 16 P,L FN
Hex D Flip–Flop TTL SN54LS174 SN74LS174 16 N,J D
CMOS MC14174B – 16 P,L D
Hex D Flip–Flop With Enable TTL SN54LS378 SN74LS378 16 N,J D
Hex D Flip–Flop With Master Reset CMOS MC74AC174 – 16 N D
TTL MC74F174 – 16 N D
CMOS MC74ACT174 – 16 N D
Hex D Flip–Flop With Common Clock & Reset CMOS MC54HC174A MC74HC174A 16 N,J D
CMOS MC74HCT174A – 16 N D
Hex D Master–Slave Flip–Flop ECL MC10H176 – 16 P,L FN
ECL MC10176 – 16 P,L FN
Hex D Master–Slave Flip–Flop With Reset ECL MC10H186 – 16 P,L FN
ECL MC10186 – 16 P,L FN
High Speed Dual D Master–Slave Flip–Flop ECL MC10231 – 16 P,L FN
J–K Flip–Flop ECL MC10EL35 MC100EL35 8 D
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–20
Selection by Function
Description SMDIPPinsDevice(s)Tech.
FLIP–FLOPS
Low–Voltage CMOS Octal D–Type Flip–Flop With Set and Reset,
3–State, Non–Inverting With 5V Tolerant Inputs CMOS MC74LCX74 – 14 D,DT
Low–Voltage CMOS 16–Bit D–Type Flip–Flop, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs CMOS MC74LCX16374 – 20 DW,M,
DT
Low–Voltage CMOS Octal D–Type Flip–Flop, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs CMOS MC74LCX374 – 20 DW,M,
DT
Low–Voltage CMOS Octal D–T ype Flip–Flop Flow Through Pinout,
3–State, Non–Inverting With 5V Tolerant Inputs and Outputs CMOS MC74LCX574 – 20 DW,M,
DT
Low Voltage D Flip–Flop With Set & Reset ECL MC100LVEL31 – 8 D
Low–Voltage Quiet CMOS Octal D–Type Flip–Flop CMOS MC74LVQ374 – 20 DW,M,
SD,DT
Low–Voltage Quiet CMOS Octal D–Type Flip–Flop Flow Through
Pinout CMOS MC74LVQ574 – 20 DW,M,
SD,DT
Master–Slave Flip–Flop ECL MC1670 – 16 L
Master–Slave R–S Flip–Flop HTL MC664 – 14 P,L
Octal 3–State Inverting D Flip–Flop CMOS MC54HC534A MC74HC534A 20 N,J DW
Octal 3–State Non–Inverting D Flip–Flop With LSTTL Compatible
Inputs CMOS MC54HCT374A MC74HCT374A 20 N,J DW,
SD,DT
Octal D Flip Flop, With 3–State Outputs TTL MC74F374 – 20 N DW
Octal D Flip–Flop CMOS MC74AC273 – 20 N DW
CMOS MC74ACT273 – 20 N DW
Octal D Flip–Flop With 3–State Outputs/Broadside Pinout, F374 TTL MC74F574 – 20 N DW
Octal D Flip–Flop With Clear TTL SN54LS273 SN74LS273 20 N,J DW
Octal D Flip–Flop With Clock Enable CMOS MC74AC377 – 20 N DW
CMOS MC74ACT377 – 20 N DW
Octal D Flip–Flop With Common Clock & Reset CMOS MC54HC273A MC74HC273A 20 N,J DW,
DT
Octal D Flip–Flop With Common Clock and Reset With LSTTL
Compatible Inputs CMOS MC74HCT273A – 20 N DW
Octal D Flip–Flop With Enable TTL MC74F377 – 20 N DW
Octal D Flip–Flop With Enable/ Non–Inverting TTL SN54LS377 SN74LS377 20 N,J DW
Octal D Type Flip–Flop With 3–State Outputs CMOS MC74AC374 – 20 N DW
CMOS MC74ACT374 – 20 N DW
TTL MC74F534 – 20 N DW
TTL SN54LS374 SN74LS374 20 N,J DW
CMOS MC74AC534 – 20 N DW
CMOS MC74ACT534 – 20 N DW
Octal D–Type Latch With 3–State Outputs CMOS MC74AC564 – 20 N DW
CMOS MC74ACT564 – 20 N DW
CMOS MC74AC574 – 20 N DW
CMOS MC74ACT574 – 20 N DW
Octal With 3–State Outputs Inverting D Flip–Flop CMOS MC74HC564A – 20 N DW
Octal With 3–State Outputs Non–Inverting D Flip–Flop CMOS MC54HC374A MC74HC374A 20 N,J DW,
SD,DT
CMOS MC74VHC374 – 20 DW,
DT,M
CMOS MC54HC574A MC74HC574A 20 N,J DW
CMOS MC74VHC574 – 20 DW,
DT,M
Octal With 3–State Outputs Non–Inverting D Flip–Flop With LSTTL
Compatible Inputs CMOS MC54HCT574A MC74HCT574A 20 N,J DW
Quad D Flip–Flop CMOS MC74AC175 – 16 N D
CMOS MC74ACT175 – 16 N D
TTL MC74F175 – 16 N D
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–21
Selection by Function
Description SMDIPPinsDevice(s)Tech.
FLIP–FLOPS
Quad D Flip–Flop TTL SN54LS175 SN74LS175 16 N,J D
CMOS MC14175B – 16 P,L D
Quad D Flip–Flop With Common Clock & Reset CMOS MC54HC175 MC74HC175 16 N,J D
CMOS MC54HC175A MC74HC175A 16 N,J D,SD
Quad D–Type Register With 3–State Outputs CMOS MC14076B – 16 P,L D
Quad Parallel Register With Enable TTL MC74F379 – 16 N D
Quad With 3–State Outputs D Flip–Flop With Common Clock &
Reset CMOS MC74HC173 – 16 N D
T riple D Flip–Flop With Set and Reset ECL MC100LVEL30 MC100EL30 20 DW
GATES, AND/NAND
13–Input NAND Gate CMOS MC74HC133 – 16 N D
TTL SN54LS133 SN74LS133 16 N,J D
8–Input NAND Gate CMOS MC74HC30 – 14 N D
TTL SN54LS30 SN74LS30 14 N,J D
CMOS MC14068B – 14 P D
Dual 4–Input AND Gate TTL MC74F21 – 14 N D
TTL SN54LS21 SN74LS21 14 N,J D
CMOS MC14082B – 14 P,L D
Dual 4–Input NAND Buffer TTL MC74F40 – 14 N D
TTL SN54LS40 SN74LS40 14 N,J D
Dual 4–Input NAND Gate CMOS MC74AC20 – 14 N D
CMOS MC74ACT20 – 14 N D
TTL MC74F20 – 14 N D
CMOS MC74HC20 – 14 N D
TTL SN54LS20 SN74LS20 14 N,J D
TTL SN54LS22 SN74LS22 14 N,J D
CMOS MC14012B – 14 P,L D
Dual 4–Input NAND Gate (Unbuffered) CMOS MC14012UB – 14 P,L D
Expandable NAND Gate DTL MC830 – 14 P,L
Hex AND Gate ECL MC10197 – 16 P,L FN
Low–Voltage CMOS Quad 2–Input AND Gate, 5V–Tolerant Inputs CMOS MC74LCX08 – 14 D,DT
Low–Voltage CMOS Quad 2–Input NAND Gate, 5V–Tolerant
Inputs CMOS MC74LCX00 – 14 D,DT
Low–Voltage Quiet CMOS Quad 2–Input NAND Gate CMOS MC74LVQ00 – 14 D,M,
DT,SD
Quad 2–Input AND Gate CMOS MC74AC08 – 14 N D
CMOS MC74ACT08 – 14 N D
TTL MC74F08 – 14 N D
CMOS MC54HC08A MC74HC08A 14 N,J D,DT
CMOS MC74VHC08 – 14 D,
DT,M
TTL SN54LS08 SN74LS08 14 N,J D
TTL SN54LS09 SN74LS09 14 N,J D
ECL MC10H104 – 16 P,L FN
ECL MC10104 – 16 P,L FN
CMOS MC14081B – 14 P,L D
Quad 2–Input AND Gate With LSTTL–Compatible Inputs CMOS MC54HCT08A MC74HCT08A 14 N,J D
Quad 2–Input NAND Buffer TTL MC74F37 – 14 N D
TTL SN54LS26 SN74LS26 14 N,J D
TTL SN54LS37 SN74LS37 14 N,J D
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–22
Selection by Function
Description SMDIPPinsDevice(s)Tech.
GATES, AND/NAND
Quad 2–Input NAND Buffer Open–Collector TTL MC74F38 – 14 N D
Quad 2–Input NAND Buffer Open–Collector TTL SN54LS38 SN74LS38 14 N,J D
Quad 2–Input NAND Gate DTL MC846 – 14 P,L
DTL MC946 – 14 P,L
CMOS MC74AC00 – 14 N D
CMOS MC74ACT00 – 14 N D
TTL MC74F00 – 14 N D
CMOS MC54HC00A MC74HC00A 14 N,J D,DT
CMOS MC74VHC00 – 14 D,
DT,M
TTL SN54LS00 SN74LS00 14 N,J D
TTL SN54LS01 SN74LS01 14 N,J D
TTL SN54LS03 SN74LS03 14 N,J D
CMOS MC14011B – 14 P,L D
Quad 2–Input NAND Gate (Unbuffered) CMOS MC14011UB – 14 P,L D
Quad 2–Input NAND Gate With LSTTL–Compatible Inputs CMOS MC54HCT00A MC74HCT00A 14 N,J D
Quad 2–Input NAND Gate With Open–Drain Outputs CMOS MC74HC03A – 14 N D,DT
T riple 3–Input AND Gate CMOS MC74AC11 – 14 N D
CMOS MC74ACT11 – 14 N D
TTL MC74F11 – 14 N D
CMOS MC74HC11 – 14 N D
TTL SN54LS11 SN74LS11 14 N,J D
TTL SN54LS15 SN74LS15 14 N,J D
CMOS MC14073B – 14 P,L D
T riple 3–Input NAND Gate CMOS MC74AC10 – 14 N D
CMOS MC74ACT10 – 14 N D
TTL MC74F10 – 14 N D
CMOS MC74HC10 – 14 N D
TTL SN54LS10 SN74LS10 14 N,J D
TTL SN54LS12 SN74LS12 14 N,J D
CMOS MC14023B – 14 P,L D
T riple 3–Input NAND Gate (Unbuffered) CMOS MC14023UB – 14 P,L D
GATES, COMPLEX
2–Input AND/NAND Gate ECL MC10EL04 MC100EL04 8 D
2–Input Differential AND/NAND Gate ECL MC10EL05 MC100EL05 8 D
ECL MC100LVEL05 – 8 D
2–Input XOR/NOR Gate ECL MC10EL07 MC100EL07 8 D
2–Wide, 2–Input/2–Wide, 3–Input AND–NOR Gate CMOS MC74HC51 – 14 N D
2–Wide, 2–Input/2–Wide, 3–Input AND–OR Gate CMOS MC74HC58 – 14 N D
2–Wide, 4–Input AND/OR Invert Gate TTL SN54LS55 SN74LS55 14 N,J D
3–2–2–3–Input AND/OR Invert Gate TTL SN54LS54 SN74LS54 14 N,J D
4–2–3–2 Input AND–OR–Invert Gate TTL MC74F64 – 14 N D
4–Bit AND/OR Selector CMOS MC14519B – 16 P D
4–Input OR/NOR Gate ECL MC10EL01 MC100EL01 8 D
ECL MC100LVEL01 – 8 D
4–Wide 4–3–3–3 Input OR–AND Gate ECL MC10H119 – 16 P,L FN
4–Wide OR–AND/OR–AND–Invert Gate ECL MC10H121 – 16 P,L FN
4–Wide OR–AND/OR–AND–Invert Gate ECL MC10121 – 16 P,L FN
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–23
Selection by Function
Description SMDIPPinsDevice(s)Tech.
GATES, COMPLEX
8–Input NOR/OR Gate CMOS MC74HC4078 – 14 N D
Dual 2 Wide 2–Input/3–Input AND/OR Invert Gate TTL SN54LS51 SN74LS51 14 N,J D
Dual 2–Wide 2–3–Input OR–AND/OR–AND–Invert Gate ECL MC10117 – 16 P,L FN
ECL MC10H117 – 16 P,L FN
Dual 2–Wide 2–Input, 2–Wide 3–Input AND–OR–Invert Gate TTL MC74F51 – 14 N D
Dual 2–Wide 3–Input OR–AND Gate ECL MC10H118 – 16 P,L FN
Dual 4–5 Input OR/NOR Gate ECL MC10H109 – 16 P,L FN
ECL MC10109 – 16 P,L FN
ECL MC10H209 – 16 P,L FN
Dual 4–Input NAND, 2–Input NOR/OR, 8–Input AND/NAND Gate
(Unbuffered) CMOS MC14501UB – 16 P D
Dual 4–Input OR/NOR Gate ECL MC1660 – 16 L
Dual 5–Input Majority Logic Gate CMOS MC14530B – 16 P D
Dual Expandable AND OR Invert Gate (Unbuffered) CMOS MC14506UB – 16 L
Hex NAND/NOR/Invert Gate (Unbuffered) CMOS MC14572UB – 16 P D
High Speed Dual 3–Input 3–Output OR/NOR Gate ECL MC10212 – 16 P
Quad 4–Input OR/NOR Gate ECL MC10E101 MC100E101 28 FN
Quad Differential AND/NAND Gate ECL MC10E404 MC100E404 28 FN
Quad OR/NOR Gate ECL MC10H101 – 16 P,L FN
ECL MC10101 – 16 P,L FN
Quint 2–Input AND/NAND Gate ECL MC10E104 MC100E104 28 FN
Quint 2–Input XOR/XNOR Gate ECL MC10E107 MC100E107 28 FN
T riple 2–3–2 Input OR/NOR Gate ECL MC10H105 – 16 P,L FN
ECL MC10105 – 16 P,L FN
T riple 2–Input Exclusive OR/Exclusive NOR Gate ECL MC10H107 – 16 P,L FN
ECL MC10107 – 16 P,L FN
GATES, EXCLUSIVE OR/EXCLUSIVE NOR
Low–Voltage CMOS Quad 2–Input Exclusive OR Gate With 5V
Tolerant Inputs CMOS MC74LCX86 – 14 D,M
SD,DT
Quad 2–Input Exclusive NOR Gate CMOS MC74AC810 – 14 N DW
CMOS MC74ACT810 – 14 N DW
CMOS MC74HC7266 – 14 N D
CMOS MC74HC7266A – 14 N D,DT
TTL SN54LS266 SN74LS266 14 N,J D
Quad Exclusive NOR Gate CMOS MC14077B – 14 P,L D
Quad 2–Input Exclusive OR Gate CMOS MC74AC86 – 14 N D
CMOS MC74ACT86 – 14 N D
TTL MC74F86 – 14 N D
CMOS MC54HC86 MC74HC86 14 N,J D
CMOS MC54HC86A MC74HC86A 14 N,J D,DT
TTL SN74LS136 – 14 N,J D
TTL SN54LS386 SN74LS386 14 N,J D
Quad Exclusive OR Gate TTL SN54LS86 SN74LS86 14 N,J D
ECL MC10H113 – 16 P,L FN
ECL MC10113 – 16 P,L FN
CMOS MC14070B – 14 P,L D
T riple 2–Input Exclusive–OR Gate ECL MC1672 – 16 L
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–24
Selection by Function
Description SMDIPPinsDevice(s)Tech.
GATES, NOR
8–Input NOR Gate CMOS MC14078B – 14 P D
Dual 3–Input 3–Output NOR Gate ECL MC10111 – 16 P,L FN
ECL MC10H211 – 16 P,L FN
ECL MC10211 – 16 P,L FN
Dual 4–Input NOR Gate CMOS MC74HC4002 – 14 N D
CMOS MC14002B – 14 P,L D
Dual 4–Input NOR Gate (Unbuffered) CMOS MC14002UB – 14 P,L D
Dual 5–Input NOR Gate TTL SN54LS260 SN74LS260 14 N,J D
Low–Voltage CMOS Quad 2–Input NOR Gate, 5V–Tolerant Inputs CMOS MC74LCX02 – 14 D,DT
Quad 2–Input NOR Buffer TTL SN54LS28 SN74LS28 14 N,J D
TTL SN54LS33 SN74LS33 14 N,J D
Quad 2–Input NOR Gate CMOS MC74AC02 – 14 N D
CMOS MC74ACT02 – 14 N D
TTL MC74F02 – 14 N D
CMOS MC54HC02A MC74HC02A 14 N,J D,DT
CMOS MC74VHC02 – 14 D,
DT,M
TTL SN54LS02 SN74LS02 14 N,J D
ECL MC10H102 – 16 P,L FN
ECL MC10102 – 16 P,L FN
ECL MC1662 – 16 L
CMOS MC14001B – 14 P,L D
Quad 2–Input NOR Gate (Unbuffered) CMOS MC14001UB – 14 P,L D
Quad 2–Input NOR Gate With strobe ECL MC10H100 – 16 P,L FN
T riple 3–Input NOR Gate CMOS MC54HC27 MC74HC27 14 N,J D
TTL SN54LS27 SN74LS27 14 N,J D
CMOS MC14025B – 14 P,L D
T riple 3–Input NOR Gate (Unbuffered) CMOS MC14025UB – 14 P,L D
T riple 4–3–3 Input NOR Gate ECL MC10H106 – 16 P,L FN
ECL MC10106 – 16 P,L FN
GATES, OR
Dual 3–Input 3–Output OR Gate ECL MC10110 – 16 P,L FN
ECL MC10H210 – 16 P,L FN
ECL MC10210 – 16 P,L FN
Dual 4–Input OR Gate CMOS MC14072B – 14 P D
Low–Voltage CMOS Quad 2–Input OR Gate, 5V–Tolerant Inputs CMOS MC74LCX32 – 14 D,DT
Low–Voltage Quiet CMOS Quad 2–Input OR Gate, 5V–Tolerant
Inputs CMOS MC74LVQ32 – 14 D,M
SD,DT
Quad 2–Input OR Gate CMOS MC74AC32 – 14 N D
CMOS MC74ACT32 – 14 N D
TTL MC74F32 – 14 N D
CMOS MC54HC32A MC74HC32A 14 N,J D,DT
CMOS MC74VHC32 – 14 D,
DT,M
CMOS MC54HCT32A MC74HCT32A 14 N,J D
TTL SN54LS32 SN74LS32 14 N,J D
ECL MC10H103 – 16 P,L FN
ECL MC10103 – 16 P,L FN
CMOS MC14071B – 14 P,L D
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–25
Selection by Function
Description SMDIPPinsDevice(s)Tech.
GATES, OR
T riple 3–Input OR Gate CMOS MC74HC4075 – 14 N D
CMOS MC14075B – 14 P,L D
INDUSTRIAL CONTROL UNIT
Industrial Control Unit CMOS MC14500B – 16 P DW
INVERTERS
Hex Inverter DTL MC836 – 14 P
DTL MC837 – 14 P
DTL MC936 – 14 P,L
DTL MC937 – 14 P,L
Hex Inverter (Without Input Diodes) DTL MC840 – 14 P
INVERTER/BUFFERS, 2–STATE
9–Bit Buf fer ECL MC10E122 MC100E122 28 FN
Driver ECL MC10EL12 MC100EL12 8 D
ECL MC100LVEL12 – 8 D
Dual Complementary Pair Plus Inverter (Unbuffered) CMOS MC14007UB – 14 P D
Hex Buffer With Enable ECL MC10H188 – 16 P,L FN
ECL MC10188 – 16 P,L FN
Hex Buffer/Non–Inverting CMOS MC14050B – 16 P,L D
Hex Inverter CMOS MC74AC04 – 14 N D
CMOS MC74ACT04 – 14 N D
TTL MC74F04 – 14 N D
CMOS MC54HC04A MC74HC04A 14 N,J D,SD,
DT
CMOS MC74VHC04 – 14 D,
DT,M
TTL SN54LS04 SN74LS04 14 N,J D
TTL SN54LS05 SN74LS05 14 N,J D
Hex Inverter Gate (Unbuffered) CMOS MC14069UB – 14 P,L D
Hex Inverter With Enable ECL MC10H189 – 16 P,L FN
ECL MC10189 – 16 P,L FN
Hex Inverter With LSTTL Compatible Inputs CMOS MC74HCT04A – 14 N D,DT
Hex Inverter With open Drain Outputs CMOS MC74AC05 – 14 N D
CMOS MC74ACT05 – 14 N D
Hex Inverter With Strobe (Active Pullup) HTL MC677 – 14 P,L
Hex Inverter With Strobe (Without Output Resistors) HTL MC678 – 14 P,L
Hex Inverter/Buffer ECL MC10195 – 16 P,L FN
CMOS MC14049B – 16 P D
Hex Inverter/Buffer (Unbuf fered) CMOS MC14049UB – 16 P,L D
Hex Inverting Buffer/Logic–Level Down Converter CMOS MC54HC4049 MC74HC4049 16 N,J D
Hex Non–Inverting Buffer/Logic–Level Down Converter CMOS MC54HC4050 MC74HC4050 16 N,J D
Hex Unbuffered Inverter CMOS MC74HCU04 – 14 N D
CMOS MC74HCU04A – 14 N D,DT
Low–Voltage CMOS Hex Inverter, With 5V–Tolerant Inputs CMOS MC74LCX04 – 14 D,DT
Low–Voltage Quiet CMOS Hex Inverter CMOS MC74LVQ04 – 14 D,M,
SD,DT
Quad 2–Input Gate (Active Pullup) HTL MC672 – 14 P,L
Quad 2–Input Gate (Passive Pullup) HTL MC668 – 14 P,L
Quad Driver ECL MC10E112 MC100E112 28 FN
Strobed Hex Inverter/Buffer CMOS MC14502B – 16 P,L DW
T riple 3–Input Gate (Active Pullup) HTL MC671 – 14 P,L
T riple 3–Input Gate (Passive Pullup) HTL MC670 – 14 P,L
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–26
Selection by Function
Description SMDIPPinsDevice(s)Tech.
LATCHES
3–Bit 4:1 Mux–Latch (Integrated E156 & E171) ECL MC10E256 MC100E256 28 FN
3–Bit 4:1 Mux–Latch, With Common Enable, Asynchronous Master
Reset, Differential Output ECL MC10E156 MC100E156 28 FN
4–Bit D Latch TTL SN54LS75 SN74LS75 16 N,J D
TTL SN54LS77 SN74LS77 14 N,J D
TTL SN54LS375 SN74LS375 16 N,J D
5–Bit 2:1 Mux–Latch, With Common Enable, Asynchronous Master
Reset Differential Output ECL MC10E154 MC100E154 28 FN
6–Bit 2:1 Mux–Latch, With Common Enable, Asynchronous Master
Reset Single Ended ECL MC10E155 MC100E155 28 FN
6–Bit D Latch ECL MC10E150 MC100E150 28 FN
8–Bit Addressable Latch CMOS MC74AC259 – 16 N D
CMOS MC74ACT259 – 16 N D
TTL MC74F259 – 16 N D
TTL SN54LS259 SN74LS259 16 N,J D
CMOS MC14099B – 16 P DW
CMOS MC14599B – 18 P
8–Bit Bus Compatible Addressable Latch CMOS MC14598B – 18 P,L
9–Bit Latch, With Parity ECL MC10E175 MC100E175 28 FN
Dual Latch ECL MC10H130 – 16 P,L FN
Dual 2–Bit T ransparent Latch CMOS MC74HC75 – 16 N D
Dual 4–Bit Addressable Latch CMOS MC74AC256 – 16 N DW
CMOS MC74ACT256 – 16 N DW
TTL MC74F256 – 16 N D
TTL SN54LS256 – 16 N,J D
Dual 4–Bit Latch CMOS MC14508B – 24 P,L DW
Dual Latch ECL MC10130 – 16 P,L FN
Low–Voltage CMOS Octal Transparent Latch, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs CMOS MC74LCX373 – 20 DW,M,
DT
Low–Voltage CMOS 16–Bit Transparent Latch, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs CMOS MC74LCX16373 – 48 DT
Low–Voltage CMOS Octal Transparent Latch Flow Through
Pinout, 3–State, Non–Inverting With 5V Tolerant Inputs and
Outputs
CMOS MC74LCX573 – 20 DW,M,
SD,DT
Low–Voltage Quiet CMOS Octal Transparent Latch CMOS MC74LVQ373 – 20 DW,M,
SD,DT
Low–Voltage Quiet CMOS Octal Transparent Latch Flow Through
Pinout CMOS MC74LVQ573 – 20 DW,M,
SD,DT
Octal 3–State Non–Inverting T ransparent Latch With LSTTL
Compatible Inputs CMOS MC54HCT373A MC74HCT373A 20 N,J DW,
SD,DT
Octal D Latch With 3–State Outputs CMOS MC74AC563 – 20 N DW
CMOS MC74ACT563 – 20 N DW
CMOS MC74AC573 – 20 N DW
CMOS MC74ACT573 – 20 N DW
Octal Transparent Latch With 3–State Outputs CMOS MC74AC373 – 20 N DW
CMOS MC74ACT373 – 20 N DW
TTL SN54LS373 SN74LS373 20 N,J DW
TTL MC74F373 – 20 N DW
TTL MC74F533 – 20 N DW
CMOS MC74AC533 – 20 N DW
CMOS MC74ACT533 – 20 N DW
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–27
Selection by Function
Description SMDIPPinsDevice(s)Tech.
LATCHES
Octal With 3–State Outputs Inverting T ransparent Latch CMOS MC54HC533A MC74HC533A 20 N,J DW
CMOS MC54HC563A MC74HC563A 20 N,J DW,DT
Octal With 3–State Outputs Non–Inverting T ransparent Latch CMOS MC54HC373A MC74HC373A 20 N,J DW,
DT,SD
CMOS MC74VHC373 – 20 DW,
DT,M
CMOS MC54HC573A MC74HC573A 20 N,J DW
CMOS MC74VHC573 – 20 DW,
DT,M
Octal With 3–State Outputs Non–Inverting T ransparent Latch With
LSTTL Compatible Inputs CMOS MC74HCT573A – 20 N DW
Quad Latch ECL MC10133 – 16 P,L FN
ECL MC10153 – 16 P,L FN
Quad NAND R–S Latch CMOS MC14044B – 16 P D
Quad NOR R–S Latch CMOS MC14043B – 16 P,L D
Quad Set/Reset Latch TTL SN54LS279 SN74LS279 16 N,J D
Quad T ransparent Latch CMOS MC14042B – 16 P,L D
Quint Latch ECL MC10H175 – 16 P,L FN
ECL MC10175 – 16 P,L FN
MEMORY SUPPORT
4–Bit ECL–TTL Load Reducing DRAM Driver ECL MC10H660 MC100H660 28 FN
MISCELLANEOUS
Data Separator ECL MC10E197 – 28 FN
MULTIPLEXER/DATA SELECTORS
1–of–8 Decoder/Demultiplexer CMOS MC74AC151 – 16 N D
CMOS MC74ACT151 – 16 N D
16–Channel Analog Multiplexer/Demultiplexer CMOS MC14067B – 24 P DW
16:1 Multiplexer ECL MC10E164 MC100E164 28 FN
2–Bit 8:1 Multiplexer ECL MC10E163 MC100E163 28 FN
2:1 Multiplexer ECL MC10EL58 MC100EL58 8 D
3–Bit 4:1 Multiplexer, With Split Select Differential Output ECL MC10E171 MC100E171 28 FN
4:1 Differential Multiplexer ECL MC10EL57 MC100EL57 16 D
5–Bit 2:1 Multiplexer, With Differential Output ECL MC10E158 MC100E158 28 FN
8–Channel Analog Multiplexer/Demultiplexer With Address Latch CMOS MC54HC4351 MC74HC4351 20 N,J DW
8–Channel Analog Multiplexer/Demultiplexer CMOS MC54HC4051 MC74HC4051 16 N,J D, DW
,DT
CMOS MC14051B – 16 P,L D
8–Channel Data Selector CMOS MC14512B – 16 P,L D
8–Input Data Selector/Multiplexer CMOS MC74HC151 – 16 N D
8–Input Data Selector/Multiplexer With 3–State Outputs CMOS MC54HC251 MC74HC251 16 N,J D
8–Input Multiplexer TTL MC74F151 – 16 N D
TTL SN54LS151 SN74LS151 16 N,J D
8–Input Multiplexer With 3–State Outputs TTL SN54LS251 SN74LS251 16 N,J D
TTL MC74F251 – 16 N D
CMOS MC74AC251 – 16 N D
CMOS MC74ACT251 – 16 N D
8–Input Data Selector/Multiplexer With Data and Address Latchs
and With 3–State Outputs CMOS MC54HC354 MC74HC354 20 N,J DW
8–Line Multiplexer ECL MC10H164 – 16 P,L FN
ECL MC10164 – 16 P,L FN
Analog Multiplexer/Demultiplexer With Injection Current Effect
Control Automotive Customized
CMOS MC74HC4851A MC74HC4852A 16 N D,DW,
DT
gp p j
Control, Automotive Customized MC74HC4853A – DT
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–28
Selection by Function
Description SMDIPPinsDevice(s)Tech.
MULTIPLEXER/DATA SELECTORS
Dual 4–Channel Analog Data Selector CMOS MC14529B – 16 P D
Dual 4–Channel Analog Multiplexer/Demultiplexer CMOS MC74HC4052 – 16 N D, DW
CMOS MC14052B – 16 P,L D
Dual 4–Channel Data Selector/Multiplexer CMOS MC14539B – 16 P D
Dual 4–Input Data Selector/Multiplexer CMOS MC74HC153 – 16 N D
Dual 4–Input Data Selector/Multiplexer With 3–State Outputs CMOS MC74HC253 – 16 N D
Dual 4–Input Multiplexer CMOS MC74AC153 – 16 N D
CMOS MC74ACT153 – 16 N D
CMOS MC74AC352 – 16 N DW
CMOS MC74ACT352 – 16 N DW
TTL MC74F153 – 16 N D
TTL MC74F352 – 16 N D
TTL SN54LS153 SN74LS153 16 N,J D
TTL SN54LS352 SN74LS352 16 N,J D
Dual 4–Input Multiplexer With 3–State Outputs CMOS MC74AC253 – 16 N DW
CMOS MC74ACT253 – 16 N DW
CMOS MC74AC353 – 16 N D
CMOS MC74ACT353 – 16 N D
TTL SN54LS253 SN74LS253 16 N,J D
TTL SN54LS353 SN74LS353 16 N,J D
TTL MC74F253 – 16 N D
TTL MC74F353 – 16 N D
Dual 4–to–1 Multiplexer ECL MC10H174 – 16 P,L FN
ECL MC10174 – 16 P,L FN
Dual Differential 2:1 Multiplexer (3.3V) ECL MC100LVEL56 MC100EL56 20 DW
Dual Multiplexer With Latch ECL MC10134 – 16 P,L FN
Low V oltage 16:1 Multiplexer ECL MC100LVE164 – 32 FA
Low–Voltage CMOS Quad 2–Input, Non–Inverting With 5V Tolerant
Inputs and Outputs CMOS MC74LCX157 – 16 M,D,
SD,DT
Quad 2–Input Multiplexer With Latch ECL MC10H173 – 16 P,L FN
Quad 2–Channel Analog Multiplexer/Demultiplexer CMOS MC14551B – 16 P D
Quad 2–Input Data Selector/Multiplexer CMOS MC54HC158 MC74HC158 16 N,J D
CMOS MC74HC158A – 16 N,J D,DT
Quad 2–Input Data Selector/Multiplexer With 3–State Outputs CMOS MC74HC257 – 16 N D
Quad 2–Input Data Selectors/Multiplexers CMOS MC54HC157A MC74HC157A 16 N,J D,DT
CMOS MC74VHC157 – 16 D,
DT,M
Quad 2–Input Data Selector/Multiplexer With LSTTL Compatible
Inputs CMOS MC74HCT157A – 16 N D
Quad 2–Input Multiplexer TTL MC74F157A – 16 N D
TTL MC74F158A – 16 N D
TTL SN54LS157 SN74LS157 16 N,J D
TTL SN54LS158 SN74LS158 16 N,J D
Quad 2–Input Multiplexer (Inverting) ECL MC10159 – 16 P,L FN
Quad 2–Input Multiplexer (Non–Inverting) ECL MC10158 – 16 P,L FN
Quad 2–Input Multiplexer Inverting With 3–State Outputs CMOS MC74AC258 – 16 N DW
CMOS MC74ACT258 – 16 N DW
Quad 2–Input Multiplexer Non–Inverting With 3–State Outputs CMOS MC74ACT257 – 16 N D
CMOS MC74AC257 – 16 N D
Quad 2–Input Multiplexer With 3–State Outputs TTL SN54LS257B SN74LS257B 16 N,J D
Quad 2–Input Multiplexer With Storage TTL SN54LS298 SN74LS298 16 N,J D
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–29
Selection by Function
Description SMDIPPinsDevice(s)Tech.
MULTIPLEXER/DATA SELECTORS
Quad 2–Input Multiplexer, Inverting CMOS MC74AC158 – 16 N D
CMOS MC74ACT158 – 16 N D
Quad 2–Input Multiplexer , Inverting Output ECL MC10H159 – 16 P,L FN
Quad 2–Input Multiplexer, Inverting, With 3–State Outputs TTL SN54LS258B SN74LS258B 16 N,J D
Quad 2–Input Multiplexer , Non–Inverting CMOS MC74AC157 – 16 N D
CMOS MC74ACT157 – 16 N D
Quad 2–Input Multiplexer , Non–Inverting Output ECL MC10H158 – 16 P,L FN
Quad 2–Input Multiplexer, With 3–State Outputs TTL MC74F257A – 16 N D
TTL MC74F258A – 16 N D
Quad 2–Input Multiplexer/Latch ECL MC10173 – 16 P,L FN
Quad 2–Port Register TTL MC74F398 – 20 N DW
TTL MC74F399 – 16 N D
TTL SN54LS398 SN74LS398 20 N,J DW
TTL SN54LS399 SN74LS399 16 N,J D
Quad 2:1 Mux, Individual–Select ECL MC10E157 MC100E157 28 FN
Quad Analog Switch/Multiplexer CMOS MC14016B – 14 P,L D
CMOS MC14066B – 14 P,L D
Quad Analog Switch/Multiplexer/Demultiplexer CMOS MC54HC4016 MC74HC4016 14 N,J D
CMOS MC54HC4066 MC74HC4066 14 N,J D,DT
Quad Analog Switch/Multiplexer/Demultiplexer With Separate
Analog/Digital Power Supplies CMOS MC74HC4316 – 16 N D
T riple 2–Channel Analog Multiplexer/Demultiplexer CMOS MC54HC4053 MC74HC4053 16 N,J D, DW
CMOS MC14053B – 16 P,L D
T riple 2–Channel Analog Multiplexer/Demultiplexer With Address
Latch CMOS MC54HC4353 MC74HC4353 20 N,J DW
T riple 2:1 Multiplexer ECL MC100EL59 – 20 DW
T riple 2:1 Multiplexer (3.3V) ECL MC100LVEL59 – 20 DW
T riple Differential 2:1 Multiplexer ECL MC100E457 – 28 FN
ECL MC10E457 – 28 FN
MULTIVIBRATORS
130MHz V oltage Controlled Multivibrator ECL MC12101 – 20 P FN
200 MHz Voltage Controlled Multivibrator ECL MC12100 – 20 P FN
Dual Monostable Multivibrator HTL MC667 – 14 P,L
CMOS MC14528B – 16 P,L D
Dual Monstable Multivibrators With Schmitt T rigger Inputs TTL SN54LS221 SN74LS221 16 N,J D
Dual Precision Monostable Multivibrator Retriggerable, Resettable) CMOS MC54HC4538A MC74HC4538A 16 N,J D
Dual Precision Monostable Multivibrator CMOS MC14538B – 16 P,L D, DW
Dual Voltage–Controlled Multivibrator ECL MC4024 – 14 P,L
Monostable Multivibrator DTL MC951 – 14 P,L
ECL MC10198 – 16 P,L FN
Retriggerable Monostable Multivibrators TTL SN54LS122 SN74LS122 14 N,J D
TTL SN54LS123 SN74LS123 14 N,J D
V oltage Controlled Multivibrator ECL MC1658 – 16 P,L D,FN
OSCILLATORS
7–Stage Binary Ripple Counter CMOS MC74HC4024 – 14 N D
Crystal Oscillator ECL MC12061 – 16 P,L
Dual Voltage–Controlled Multivibrator ECL MC4324 – 14 P,L
Low Power Voltage Controlled Oscillator ECL MC12148 – 8 D,SD
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–30
Selection by Function
Description SMDIPPinsDevice(s)Tech.
OSCILLATORS
Voltage Controlled Oscillator ECL MC1648 – 14 P,L D,FN
OSCILLATOR/TIMERS
24–Stage Frequency Divider CMOS MC14521B – 16 P,L D
Programmable Oscillator T imer CMOS MC14541B – 14 P,L D
Programmable T imer CMOS MC14536B – 16 P,L DW
Quad Precision T imer/Driver CMOS MC14415 – 16 P,L DW
PARITY CHECKERS
12–Bit Parity Generator/Checker ECL MC10H160 – 16 P,L FN
ECL MC10160 – 16 P,L FN
12–Bit Parity Generator/Checker, Register–Shiftable, Dif f Output ECL MC10E160 MC100E160 28 FN
12–Bit Parity T ree CMOS MC14531B – 16 P D
9 + 2–Bit Parity Generator–Checker ECL MC10170 – 16 P,L FN
9–Bit Odd/Even Parity Generator/Checker CMOS MC74HC280 – 14 N D
TTL SN54LS280 SN74LS280 14 N,J D
9–Bit Parity Generator/Checker TTL MC74F280 – 14 N D
Error Detection and Correction Circuit ECL MC10E193 MC100E193 28 FN
PHASE–LOCKED LOOP
Phase–Locked Loop CMOS MC14046B – 16 P,L DW
PRESCALERS
1.1GHz ÷10/20/40/80 Prescaler ECL MC12080 – 8 P D
1.1GHz ÷126/128, ÷254/256 Low Power Dual Modulus Prescaler ECL MC12058 – 8 D,SD
1.1GHz ÷127/128, ÷255/256 Low Power Dual Modulus Prescaler ECL MC12038A – 8 P D
1.1GHz ÷8/9, ÷16/17 Dual Modulus Prescaler ECL MC12026A – 8 P D
ECL MC12026B – 8 P D
1.1GHz ÷2 Low Power Prescaler With Stand–By Mode ECL MC12083 – 8 P D
1.1GHz ÷2/4/8 Low Power Prescaler With Stand–By Mode ECL MC12093 – 8 P D,SD
1.1GHz ÷256 Prescaler ECL MC12074 – 8 P D
1.1GHz ÷32/33, ÷64/65 Dual Modulus Prescaler ECL MC12028A – 8 P D
1.1GHz ÷32/33, ÷64/65 Dual Modulus Prescaler ECL MC12028B – 8 P D
1.1GHz ÷64 Prescaler ECL MC12073 – 8 P D
1.1GHz ÷64/65, ÷128/129 Dual Modulus Prescaler ECL MC12022A – 8 P D
ECL MC12022B – 8 P D
ECL MC12022SLA – 8 P D
ECL MC12022SLB – 8 P D
ECL MC12022TSA – 8 P D
ECL MC12022TSB – 8 P D
1.1GHz ÷64/65, ÷128/129 Dual Modulus Prescaler With Stand–By
Mode
ECL MC12036A – 8 P D
y
Mode ECL MC12036B – 8 P D
1.1GHz ÷64/65, ÷128/129 Low Voltage Dual Modulus Prescaler ECL MC12022LVA – 8 P D
ECL MC12022LVB – 8 P D
ECL MC12022TVA – 8 P D
ECL MC12022TVB – 8 P D
1.1GHz ÷64/65, ÷128/129 Super Low Power Dual Modulus
Prescaler ECL MC12052A – 8 D,SD
1.1GHz ÷64/65, ÷128/129 Super Low Power Dual Modulus
Prescaler With Stand–By Mode ECL MC12053A – 8 D,SD
1.3GHz ÷64 Prescaler ECL MC12075 – 8 P D
1.3GHz ÷64/256 Prescaler ECL MC12066 – 8 D
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–31
Selection by Function
Description SMDIPPinsDevice(s)Tech.
PRESCALERS
1.3GHz ÷256 Prescaler ECL MC12076 – 8 P D
ECL MC12078 – 8 P D
2.0GHz ÷32/33, ÷64/65 Dual Modulus Prescaler ECL MC12034A – 8 P D
ECL MC12034B – 8 P D
2.0GHz ÷32/33, ÷64/65 Low Voltage Dual Modulus Prescaler ECL MC12033A – 8 P D
ECL MC12033B – 8 P D
2.0GHz ÷64/65, ÷128/129 Dual Modulus Prescaler ECL MC12032A – 8 P D
ECL MC12032B – 8 P D
2.0GHz ÷64/65, ÷128/129 Low V oltage Dual Modulus Prescaler ECL MC12031A – 8 P D
ECL MC12031B – 8 P D
2.0GHz ÷64/65, ÷128/129 Super Low Power Dual Modulus
Prescaler ECL MC12054A – 8 D,SD
2.5GHz ÷2, ÷4 Low Power Prescaler With Satnd–By Mode ECL MC12095 – 8 D,SD
2.5GHz ÷8192 Prescaler ECL MC12098 – 8 D
2.8GHz ÷64/128/256 Prescaler ECL MC12079 – 8 P D
ECL MC12089 – 8 P D
225MHz ÷20/21 Dual Modulus Prescaler ECL MC12019 – 8 P,L D
225MHz ÷32/33 Dual Modulus Prescaler ECL MC12015 – 8 P,L D
225MHz ÷40/41 Dual Modulus Prescaler ECL MC12016 – 8 P,L D
225MHz ÷64 Prescaler ECL MC12023 – 8 P D
225MHz ÷64/65 Dual Modulus Prescaler ECL MC12017 – 8 P,L D
480MHz ÷5/6 Dual Modulus Prescaler ECL MC12009 – 16 P,L
520MHz ÷128/129 Dual Modulus Prescaler ECL MC12018 – 8 P,L D
520MHz ÷64/65 Dual Modulus Prescaler ECL MC12025 – 8 P D
550MHz ÷10/11 Dual Modulus Prescaler ECL MC12013 – 16 P,L
550MHz ÷8/9 Dual Modulus Prescaler ECL MC12011 – 16 P,L
750MHz ÷2 UHF Prescaler ECL MC12090 – 16 P,L
PROGRAMMABLE DELAY CHIPS
Programmable Delay Chip (Dig 80ps Anal. 1.6 Ps/mv) ECL MC10E196 MC100E196 28 FN
Programmable Delay Chip (Digitally Selectable 20ps Res) ECL MC10E195 MC100E195 28 FN
RAMs
1024 X 1–Bit Random Access Memory ECL MCM10146 – 16 L
256 X 1–Bit Random Access Memory ECL MCM10152 – 16 L
RECEIVERS
Differential Receiver ECL MC10EL16 MC100EL16 8 D
ECL MC100LVEL16 – 8 D
High Speed T riple Line Receiver ECL MC10216 – 16 P,L FN
Low–Voltage Quad Differential Line Receiver ECL MC100LVEL17 MC100EL17 20 DW
Quad Bus Receiver ECL MC10129 – 16 L
Quad Line Receiver ECL MC10H115 – 16 P,L FN
ECL MC10115 – 16 P,L FN
ECL MC1692 – 16 L
Quint Differential Line Receiver ECL MC10E116 MC100E116 28 FN
ECL MC10E416 MC100E416 28 FN
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–32
Selection by Function
Description SMDIPPinsDevice(s)Tech.
RECEIVERS
T riple Line Receiver ECL MC10H116 – 16 P,L D,FN
ECL MC10114 – 16 P,L FN
ECL MC10116 – 16 P,L FN
REGISTERS
4 X 4 Multiport Register CMOS MC14580B – 24 P,L D
Hex Parallel D Register With Enable TTL MC74F378 – 16 N D
REGISTER FILES
16 X 4–Bit Register File (RAM) ECL MC10H145 – 16 P,L FN
4 X 4 Register File Open Collector TTL SN54LS170 SN74LS170 16 N,J D
4 X 4 Register File With 3–State Outputs TTL SN54LS670 SN74LS670 16 N,J D
64–Bit Register File (RAM) ECL MCM10145 – 16 L
8 X 2 Multiport Register File (RAM) ECL MCM10143 – 24 L
SCHMITT TRIGGERS
Dual 4–Input NAND Schmitt Trigger TTL MC74F13 – 14 N D
TTL SN54LS13 SN74LS13 14 N,J D
Dual Schmitt T rigger CMOS MC14583B – 16 P D
Hex Inverter Schmitt T rigger CMOS MC74AC14 – 14 N D
CMOS MC74ACT14 – 14 N D
TTL MC74F14 – 14 N D
TTL SN54LS14 SN74LS14 14 N,J D
Hex Schmitt T rigger CMOS MC14106B – 14 P,L D
CMOS MC14584B – 14 P,L D
Hex Schmitt T rigger Inverter CMOS MC54HC14A MC74HC14A 14 N,J D,DT
CMOS MC74VHC14 – 14 D,
DT,M
CMOS MC54HCT14A MC74HCT14A 14 N,J D
Quad 2–Input NAND Gate With Schmitt T rigger Inputs CMOS MC54HC132A MC74HC132A 14 N,J D
Quad 2–Input NAND Schmitt T rigger CMOS MC74AC132 – 14 N D
CMOS MC74ACT132 – 14 N D
TTL MC74F132 – 14 N D
CMOS MC14093B – 14 P,L D
Quad 2–Input Schmitt T rigger NAND Gate TTL SN54LS132 SN74LS132 14 N,J D
SCSI BUS TERMINATORS
9–Bit Switchable Active SCSI–2 Bus Term (110Ω) with Volt Reg CMOS MCCS142237 – 16,20 DW,
DT
9–Bit Switchable SCSI Bus Term (220Ω & 330Ω: Passive) CMOS MCCS142233 – 20 FN
18–Bit Active SCSI Bus Terminator
(*Also Available in 32–Pin QFP Package) CMOS MCCS142235 – 24,32 DW,
*FA
18–Bit Switchable Active SCSI–2 Bus Term (110Ω) with Volt Reg CMOS MCCS142236 – 28 DW
18–Bit Switchable Active SCSI–2 Bus Term (110Ω) with Volt Reg
Plus Inverted Disconnect CMOS MCCS142238 – 28 DW
9–Bit Switchable Active SCSI Bus Terminator (110Ω) with Volt Reg CMOS MCCS142239 – 16 D,DW
SERIAL EPROMs
Serial EPROM for MPA1016: 8–Pin DIP and SOIC; 20–Pin PLCC CMOS MPA1765 – 8,20 N D,FN
Serial EPROM for MPA1036: 8–Pin DIP and SOIC; 20–Pin PLCC CMOS MPA17128 – 8,20 P D,FN
SHIFT REGISTERS
1–to–64–Bit Variable Length Shift Register CMOS MC14557B – 16 P,L DW
128–Bit Static Shift Register CMOS MC14562B – 14 P,L
18–Bit Static Shift Register CMOS MC14006B – 14 P,L D
3–Bit Scannable Registered Address Driver, ECL ECL MC10E212 MC100E212 28 FN
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–33
Selection by Function
Description SMDIPPinsDevice(s)Tech.
SHIFT REGISTERS
4–Bit Bidirectional Universal Shift Register CMOS MC74AC194 – 16 N D
CMOS MC74ACT194 – 16 N D
TTL MC74F194 – 16 N D
CMOS MC74HC194 – 16 N
TTL SN54LS194A SN74LS194A 16 N,J D
4–Bit Shift Register TTL MC74F195 – 16 N D
TTL SN54LS95B SN74LS95B 14 N,J D
CMOS MC14035B – 16 P,L D
4–Bit Shift Register With 3–State Outputs TTL SN74LS395 – 16 N,J D
4–Bit Shifter With 3–State CMOS MC74AC350 – 16 N D
CMOS MC74ACT350 – 16 N D
4–Bit Shifter, With 3–State Outputs TTL MC74F350 – 16 N D
4–Bit Universal Shift Register CMOS MC74HC195 – 16 N
ECL MC10H141 – 16 P,L FN
ECL MC10141 – 16 P,L FN
CMOS MC14194B – 16 P,L D
8–Bit Bidirectional Universal Shift Register With parallel I/O CMOS MC74HC299 – 20 N DW
8–Bit Parallel–to–Serial Shift Register TTL SN54LS165 SN74LS165 16 N,J D
8–Bit Scannable Register ECL MC10E241 MC100E241 28 FN
8–Bit Serial In–Serial Out Shift Register TTL MC74F164 – 14 N D
8–Bit Serial or Parallel–Input/Serial–Output Shift Register CMOS MC54HC165 MC74HC165 16 N,J D
8–Bit Serial or Parallel–Input/Serial–Output Shift Register
With 3 State O tp ts
CMOS MC54HC589 MC74HC589 16 N,J D
ppg
With 3–State Outputs CMOS MC54HC589A MC74HC589A 16 N,J D,SD
DT
8–Bit Serial or Parallel–Input/Serial–Output Shift Register With
Inp t Latch
CMOS MC54HC597 MC74HC597 16 N,J D
ppg
Input Latch CMOS MC54HC597A MC74HC597A 16 N,J D,DT
8–Bit Serial–In/Parallel–Out Shift Register TTL SN54LS164 SN74LS164 14 N,J D
8–Bit Serial–Input/Parallel–Output Shift Register CMOS MC54HC164 MC74HC164 14 N,J D
CMOS MC54HC164A MC74HC164A 14 N,J D,DT
8–Bit Serial–Input/Serial or Parallel–Output Shift Register With
Latched 3–State Outputs CMOS MC54HC595A MC74HC595A 16 N,J D,DT
CMOS MC74VHC595 – 16 D,
DT,M
8–Bit Shift Register ECL MC10E141 MC100E141 28 FN
TTL SN54LS166 SN74LS166 16 N,J D
8–Bit Shift Registers With Sign Extend TTL SN54LS322A SN74LS322A 20 N,J DW
8–Bit Shift/Storage Register With 3–State Outputs TTL SN54LS299 SN74LS299 20 N,J DW
TTL SN54LS323 SN74LS323 20 N,J DW
8–Bit Static Shift Register CMOS MC14014B – 16 P,L D
CMOS MC14021B – 16 P,L D
8–Input Shift/Storage Register W/Synchronous Reset and
Common I/O Pins TTL MC74F323 – 20 N DW
8–Input Universal Shift/Storage Register With Common Parallel I/O
Pins With 3 State O tp ts
CMOS MC74AC299 – 20 N DW
pgg
Pins: With 3–State Outputs CMOS MC74ACT299 – 20 N DW
8–Input Universal Shift/Storage Register With Syn Reset/Common
Parallel I/O Pins With 3 State O tp ts
CMOS MC74AC323 – 20 N DW
pggy
Parallel I/O Pins: With 3–State Outputs CMOS MC74ACT323 – 20 N DW
8–Input Universal Shift/Storage Register, W/Common Parallel I/O
Pins TTL MC74F299 – 20 N DW
8–Stage Shift/Store Register With 3–State Outputs CMOS MC14094B – 16 P,L D
9–Bit Shift Register, 700MHz, With Asynchronous Master Reset ECL MC10E142 MC100E142 28 FN
Dual 5–Bit Shift Register CMOS MC14015B – 16 P,L D
Motorola Master Selection GuideLogic: Standard, Special and Programmable 3.1–34
Selection by Function
Description SMDIPPinsDevice(s)Tech.
SHIFT REGISTERS
Dual 64–Bit Static Shift Register CMOS MC14517B – 16 P DW
Successive Approximation Register CMOS MC14549B – 16 P,L DW
CMOS MC14559B – 16 P,L DW
Universal 4–Bit Shift Register TTL SN54LS195A SN74LS195A 16 N,J D
SYNTHESIZERS
1.1GHz Serial Input Synthesizer With ÷64/65, ÷128/129 Prescaler ECL MC12202 – 16,20 D,M,
DT
125–1000MHz Frequency Synthesizer With Parallel Programming
Interface ECL MC12181 – 16 DT
2.0GHz Serial Input Synthesizer With ÷64/65, ÷128/129 Prescaler ECL MC12206 – 16,20 D,DT
2.5GHz Serial Input Synthesizer With ÷32/33, ÷64/65 Prescaler ECL MC12210 – 16,20 D,DT
2.7GHz Frequency Synthesizer ECL MC12179 – 8 D
TRANSCEIVERS
25Ω Octal Bidirectional Transceiver w/ 3–State Inputs and Outputs ECL MC74F2245 – 20 DW,SD
4–Bit Differential ECL Bus/TTL Bus Transceiver ECL MC10H680 MC100H680 28 FN
Dual Supply Octal T ranslating Transceiver CMOS MC74LVX4245 – 24 DW,DT
ECL/TTL Inverting Bidirectional T ransceivers With Latch (4–Bit) ECL MC10804 – 16 L
ECL/TTL Inverting Bidirectional T ransceivers With Latch (5–Bit) ECL MC10805 – 20 L
Hex ECL/TTL T ransceiver With Latches ECL MC10H681 MC100H681 28 FN
Low–Voltage CMOS 16–Bit Latching Transceiver, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs CMOS MC74LCX16543A – 56 DT
Low–Voltage CMOS 16–Bit Transceiver, 3–State, Non–Inverting
With 5V Tolerant Inputs and Outputs CMOS MC74LCX16245 – 48 DT
Low–Voltage CMOS 18–Bit Universal Bus Transceiver, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs CMOS MC74LCX16500 – 56 DT
CMOS MC74LCX16501 – 56 DT
Low–Voltage CMOS Octal Registered Transceiver With Dual
Output and Clock Enables, With 5V Tolerant Inputs and Outputs CMOS MC74LCX2952 – 24 DW,
SD,DT
Low–Voltage CMOS Octal Transceiver, 3–State, Non–Inverting
With 5V Tolerant Inputs and Outputs CMOS MC74LCX245 – 20 M,DW,
DT
Low–Voltage Quiet CMOS Octal Transceiver, 3–State,
Non–Inverting CMOS MC74LVQ245 – 20 M,DW,
SD,DT
Low–Voltage CMOS Octal Transceiver/Registered Transceiver
With 5V Tolerant Inputs and Outputs CMOS MC74LCX646 – 24 DW,
SD,DT
Low–Voltage CMOS Octal Transceiver/Registered Transceiver
With Dual Enable, With 5V Tolerant Inputs and Outputs CMOS MC74LCX652 – 24 DW,
DT
Low–Voltage Quiet CMOS Octal Transceiver/Registered
Transceiver CMOS MC74LVQ646 – 24 DW,
SD,DT
Low–Voltage Quiet CMOS Octal Transceiver/Registered
Transceiver CMOS MC74LVQ652 – 24 DW,
SD,DT
Octal Bus Transceiver/Inverting With Open Collector TTL SN54LS642 SN74LS642 20 N,J DW
Octal Bus Transceiver/Non–Inverting With Open Collector TTL SN54LS641 SN74LS641 20 N,J DW
Quad Futurebus Backplane T ransceiver, With 3–State Outputs and
Open Collector TTL MC74F3893A – 20 FN
TRANSLATORS
9–Bit ECL/TTL T ranslator ECL MC10H601 MC100H601 28 FN
9–Bit Latch ECL/TTL T ranslator ECL MC10H603 MC100H603 28 FN
9–Bit Latch TTL/ECL T ranslator ECL MC10H602 MC100H602 28 FN
9–Bit TTL/ECL T ranslator ECL MC10H600 MC100H600 28 FN
Differential ECL/TTL Translator ECL MC10ELT25 MC100ELT25 8 D
Differential PECL/TTL Translator ECL MC10ELT21 MC100ELT21 8 D
Dual Differential PECL/TTL T ranslator ECL MC100ELT23 – 8 D
Dual LVTTL/LVCMOS to Differential PECL Translator ECL MC100LVELT22 – 8 D
Dual TTL/Differential PECL Translator ECL MC10ELT22 MC100ELT22 8 D
Motorola Master Selection Guide Logic: Standard, Special and Programmable3.1–35
Selection by Function
Description SMDIPPinsDevice(s)Tech.
TRANSLATORS
ECL/TTL T ranslator (Single P.S. @+ 5.0V) ECL MC10H350 – 16 P,L FN
Hex ECL/MST T ranslator ECL MC10191 – 16 P,L
Hex TTL OR CMOS/CMOS Hex Level Shifter CMOS MC14504B – 16 P,L D
Quad CMOS/ECL T ranslator (Single P.S. @+ 5.0V) ECL MC10H352 – 20 P,L FN
Quad MECL/TTL T ranslator ECL MC10H125 – 16 P,L FN
ECL MC10125 – 16 P,L FN
Quad MST/ECL T ranslator ECL MC10190 – 16 P
Quad TTL/ECL T ranslator (ECL Strobe) ECL MC10H424 – 16 P,L FN
Quad TTL/MECL T ranslator ECL MC10124 – 16 P,L FN
Quad TTL/MECL T ranslator, With TTL Strobe Input ECL MC10H124 – 16 P,L FN
Quad TTL/NMOS–to–PECL T ranslator (Single P.S. @+ 5.0V) ECL MC10H351 – 20 P,L FN
Registered Hex ECL/TTL T ranslator ECL MC10H605 MC100H605 28 FN
Registered Hex PECL/TTL T ranslator ECL MC10H607 MC100H607 28 FN
Registered Hex TTL/ECL T ranslator ECL MC10H604 MC100H604 28 FN
Registered Hex TTL/PECL T ranslator ECL MC10H606 MC100H606 28 FN
T riple MECL/NMOS Translator ECL MC10177 – 16 L
T riple ECL to PECL Translator ECL MC100LVEL90 MC100EL90 20 DW
T riple PECL to LVPECL T ranslator ECL MC100LVEL92 – 20 DW
T riple PECL to ECL Translator ECL MC100LVEL91 – 20 DW
TTL/Dif ferential ECL Translator ECL MC10ELT24 MC100ELT24 8 D
TTL/Dif ferential PECL Translator ECL MC10ELT20 MC100ELT20 8 D
TTL to Differential PECL/Differential PECL to TTL Translator ECL MC10ELT28 MC100ELT28 8 D
VCO
Phase–Locked–Loop With VCO CMOS MC74HC4046A – 16 N D
Low Power V oltage Controlled Oscillator Buf fer CMOS MC12147 – 8 D,SD
Low Power V oltage Controlled Oscillator Buf fer CMOS MC12149 – 8 D,SD
Device Index
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–36
MC100E016 3.1–15
MC100E101 3.1–23
MC100E104 3.1–23
MC100E107 3.1–23
MC100E111 3.1–12
MC100E112 3.1–25
MC100E116 3.1–31
MC100E122 3.1–25
MC100E131 3.1–18
MC100E136 3.1–14
MC100E137 3.1–15
MC100E141 3.1–33
MC100E142 3.1–33
MC100E143 3.1–18
MC100E150 3.1–26
MC100E151 3.1–18
MC100E154 3.1–26
MC100E155 3.1–26
MC100E156 3.1–26
MC100E157 3.1–29
MC100E158 3.1–27
MC100E160 3.1–30
MC100E163 3.1–27
MC100E164 3.1–27
MC100E166 3.1–14
MC100E167 3.1–18
MC100E171 3.1–27
MC100E175 3.1–26
MC100E193 3.1–30
MC100E195 3.1–31
MC100E196 3.1–31
MC100E210 3.1–9
MC100E211 3.1–12
MC100E212 3.1–32
MC100E241 3.1–33
MC100E256 3.1–26
MC100E310 3.1–9
MC100E336 3.1–10
MC100E337 3.1–10
MC100E404 3.1–23
MC100E416 3.1–31
MC100E431 3.1–18
MC100E445 3.1–14
MC100E446 3.1–14
MC100E451 3.1–18
MC100E452 3.1–18
MC100E457 3.1–29
MC100EL01 3.1–22
MC100EL04 3.1–22
MC100EL05 3.1–22
MC100EL07 3.1–22
MC100EL11 3.1–12
MC100EL12 3.1–25
MC100EL13 3.1–9
MC100EL14 3.1–12
MC100EL15 3.1–12
MC100EL16 3.1–31
MC100EL17 3.1–31
MC100EL29 3.1–19
MC100EL30 3.1–21
MC100EL31 3.1–18
MC100EL32 3.1–17
MC100EL33 3.1–17
MC100EL34 3.1–13
MC100EL35 3.1–19
MC100EL38 3.1–13
MC100EL39 3.1–13
MC100EL51 3.1–18
MC100EL52 3.1–18
MC100EL56 3.1–28
MC100EL57 3.1–27
MC100EL58 3.1–27
MC100EL59 3.1–29
MC100EL90 3.1–35
MC100ELT20 3.1–35
MC100ELT21 3.1–34
MC100ELT22 3.1–34
MC100ELT23 3.1–34
MC100ELT24 3.1–35
MC100ELT25 3.1–34
MC100ELT28 3.1–35
MC100H600 3.1–34
MC100H601 3.1–34
MC100H602 3.1–34
MC100H603 3.1–34
MC100H604 3.1–35
MC100H605 3.1–35
MC100H606 3.1–35
MC100H607 3.1–35
MC100H640 3.1–13
MC100H641 3.1–13
MC100H642 3.1–13
MC100H643 3.1–13
MC100H644 3.1–13
MC100H646 3.1–13
MC100H660 3.1–27
MC100H680 3.1–34
MC100H681 3.1–34
MC100LVE11 1 3.1–12
MC100LVE164 3.1–28
MC100LVE210 3.1–9
MC100LVE222 3.1–13
MC100LVE310 3.1–9
MC100LVEL01 3.1–22
MC100LVEL05 3.1–22
MC100LVEL11 3.1–9
MC100LVEL12 3.1–25
MC100LVEL13 3.1–9
MC100LVEL14 3.1–12
MC100LVEL16 3.1–31
MC100LVEL17 3.1–31
MC100LVEL29 3.1–19
MC100LVEL30 3.1–21
MC100LVEL31 3.1–20
MC100LVEL32 3.1–17
MC100LVEL33 3.1–17
MC100LVEL38 3.1–13
MC100LVEL39 3.1–13
MC100LVEL51 3.1–18
MC100LVEL56 3.1–28
MC100LVEL59 3.1–29
MC100LVEL90 3.1–35
MC100LVEL91 3.1–35
MC100LVEL92 3.1–35
MC100LVELT22 3.1–34
MC100SX1230 3.1–18
MC10101 3.1–23
MC10102 3.1–24
MC10103 3.1–24
MC10104 3.1–21
MC10105 3.1–23
MC10106 3.1–24
MC10107 3.1–23
MC10109 3.1–23
MC10110 3.1–24
MC10111 3.1–24
MC10113 3.1–23
MC10114 3.1–32
MC10115 3.1–31
MC10116 3.1–32
MC10117 3.1–23
MC10121 3.1–22
MC10123 3.1–12
MC10124 3.1–35
MC10125 3.1–35
MC10129 3.1–31
MC10130 3.1–26
MC10131 3.1–19
MC10133 3.1–27
MC10134 3.1–28
MC10135 3.1–19
MC10136 3.1–16
MC10137 3.1–16
Device Index
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–37
MC10138 3.1–15
MC10141 3.1–33
MC10153 3.1–27
MC10154 3.1–15
MC10158 3.1–28
MC10159 3.1–28
MC10160 3.1–30
MC10161 3.1–16
MC10162 3.1–16
MC10163 3.1–17
MC10164 3.1–27
MC10165 3.1–18
MC10166 3.1–14
MC10170 3.1–30
MC10171 3.1–16
MC10172 3.1–17
MC10173 3.1–29
MC10174 3.1–28
MC10175 3.1–27
MC10176 3.1–19
MC10177 3.1–35
MC10178 3.1–15
MC10180 3.1–9
MC10181 3.1–9
MC10186 3.1–19
MC10188 3.1–25
MC10189 3.1–25
MC10190 3.1–35
MC10191 3.1–35
MC10192 3.1–12
MC10193 3.1–17
MC10195 3.1–25
MC10197 3.1–21
MC10198 3.1–29
MC10210 3.1–24
MC10211 3.1–24
MC10212 3.1–23
MC10216 3.1–31
MC10231 3.1–19
MC10804 3.1–34
MC10805 3.1–34
MC10E016 3.1–15
MC10E101 3.1–23
MC10E104 3.1–23
MC10E107 3.1–23
MC10E111 3.1–12
MC10E112 3.1–25
MC10E116 3.1–31
MC10E122 3.1–25
MC10E131 3.1–18
MC10E136 3.1–14
MC10E137 3.1–15
MC10E141 3.1–33
MC10E142 3.1–33
MC10E143 3.1–18
MC10E150 3.1–26
MC10E151 3.1–18
MC10E154 3.1–26
MC10E155 3.1–26
MC10E156 3.1–26
MC10E157 3.1–29
MC10E158 3.1–27
MC10E160 3.1–30
MC10E163 3.1–27
MC10E164 3.1–27
MC10E1651 3.1–14
MC10E1652 3.1–14
MC10E166 3.1–14
MC10E167 3.1–18
MC10E171 3.1–27
MC10E175 3.1–26
MC10E193 3.1–30
MC10E195 3.1–31
MC10E196 3.1–31
MC10E197 3.1–27
MC10E211 3.1–12
MC10E212 3.1–32
MC10E241 3.1–33
MC10E256 3.1–26
MC10E336 3.1–10
MC10E337 3.1–10
MC10E404 3.1–23
MC10E411 3.1–13
MC10E416 3.1–31
MC10E431 3.1–18
MC10E445 3.1–14
MC10E446 3.1–14
MC10E451 3.1–18
MC10E452 3.1–18
MC10E457 3.1–29
MC10EL01 3.1–22
MC10EL04 3.1–22
MC10EL05 3.1–22
MC10EL07 3.1–22
MC10EL11 3.1–12
MC10EL12 3.1–25
MC10EL15 3.1–12
MC10EL16 3.1–31
MC10EL31 3.1–18
MC10EL32 3.1–17
MC10EL33 3.1–17
MC10EL34 3.1–13
MC10EL35 3.1–19
MC10EL51 3.1–18
MC10EL52 3.1–18
MC10EL57 3.1–27
MC10EL58 3.1–27
MC10EL89 3.1–17
MC10ELT20 3.1–35
MC10ELT21 3.1–34
MC10ELT22 3.1–34
MC10ELT24 3.1–35
MC10ELT25 3.1–34
MC10ELT28 3.1–35
MC10H100 3.1–24
MC10H101 3.1–23
MC10H102 3.1–24
MC10H103 3.1–24
MC10H104 3.1–21
MC10H105 3.1–23
MC10H106 3.1–24
MC10H107 3.1–23
MC10H109 3.1–23
MC10H113 3.1–23
MC10H115 3.1–31
MC10H116 3.1–32
MC10H117 3.1–23
MC10H118 3.1–23
MC10H119 3.1–22
MC10H121 3.1–22
MC10H123 3.1–12
MC10H124 3.1–35
MC10H125 3.1–35
MC10H130 3.1–26
MC10H131 3.1–19
MC10H135 3.1–19
MC10H136 3.1–16
MC10H141 3.1–33
MC10H145 3.1–32
MC10H158 3.1–29
MC10H159 3.1–29
MC10H16 3.1–14
MC10H160 3.1–30
MC10H161 3.1–16
MC10H162 3.1–16
MC10H164 3.1–27
MC10H165 3.1–18
MC10H166 3.1–14
MC10H171 3.1–17
MC10H172 3.1–17
MC10H173 3.1–28
MC10H174 3.1–28
MC10H175 3.1–27
MC10H176 3.1–19
MC10H179 3.1–9
MC10H180 3.1–9
Device Index
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–38
MC10H181 3.1–9
MC10H186 3.1–19
MC10H188 3.1–25
MC10H189 3.1–25
MC10H209 3.1–23
MC10H210 3.1–24
MC10H211 3.1–24
MC10H330 3.1–12
MC10H332 3.1–10
MC10H334 3.1–12
MC10H350 3.1–35
MC10H351 3.1–35
MC10H352 3.1–35
MC10H423 3.1–12
MC10H424 3.1–35
MC10H600 3.1–34
MC10H601 3.1–34
MC10H602 3.1–34
MC10H603 3.1–34
MC10H604 3.1–35
MC10H605 3.1–35
MC10H606 3.1–35
MC10H607 3.1–35
MC10H640 3.1–13
MC10H641 3.1–13
MC10H642 3.1–13
MC10H643 3.1–13
MC10H644 3.1–13
MC10H645 3.1–13
MC10H646 3.1–13
MC10H660 3.1–27
MC10H680 3.1–34
MC10H681 3.1–34
MC10SX1125 3.1–9
MC10SX1130 3.1–13, 3.1–17
MC10SX1189 3.1–13
MC12002 3.1–17
MC12009 3.1–31
MC12011 3.1–31
MC12013 3.1–31
MC12014 3.1–15
MC12015 3.1–31
MC12016 3.1–31
MC12017 3.1–31
MC12018 3.1–31
MC12019 3.1–31
MC12022A 3.1–30
MC12022B 3.1–30
MC12022LVA 3.1–30
MC12022LVB 3.1–30
MC12022SLA 3.1–30
MC12022SLB 3.1–30
MC12022TSA 3.1–30
MC12022TSB 3.1–30
MC12022TVA 3.1–30
MC12022TVB 3.1–30
MC12023 3.1–31
MC12025 3.1–31
MC12026A 3.1–30
MC12026B 3.1–30
MC12028A 3.1–30
MC12028B 3.1–30
MC12031A 3.1–31
MC12031B 3.1–31
MC12032A 3.1–31
MC12032B 3.1–31
MC12033A 3.1–31
MC12033B 3.1–31
MC12034A 3.1–31
MC12034B 3.1–31
MC12036A 3.1–30
MC12036B 3.1–30
MC12038A 3.1–30
MC12040 3.1–17
MC12052A 3.1–30
MC12053A 3.1–30
MC12054A 3.1–31
MC12058 3.1–30
MC12061 3.1–29
MC12066 3.1–30
MC12073 3.1–30
MC12074 3.1–30
MC12075 3.1–30
MC12076 3.1–31
MC12078 3.1–31
MC12079 3.1–31
MC12080 3.1–30
MC12083 3.1–30
MC12089 3.1–31
MC12090 3.1–31
MC12093 3.1–30
MC12095 3.1–31
MC12098 3.1–31
MC12100 3.1–29
MC12101 3.1–29
MC12147 3.1–35
MC12148 3.1–29
MC12149 3.1–35
MC12179 3.1–34
MC12181 3.1–34
MC12202 3.1–34
MC12206 3.1–34
MC12210 3.1–34
MC12429 3.1–13
MC12430 3.1–13
MC12439 3.1–13
MC14001B 3.1–24
MC14001UB 3.1–24
MC14002B 3.1–24
MC14002UB 3.1–24
MC14006B 3.1–32
MC14007UB 3.1–25
MC14008B 3.1–9
MC14011B 3.1–22
MC14011UB 3.1–22
MC14012B 3.1–21
MC14012UB 3.1–21
MC14013B 3.1–18
MC14014B 3.1–33
MC14015B 3.1–33
MC14016B 3.1–29
MC14017B 3.1–15
MC14018B 3.1–15
MC14020B 3.1–14
MC14021B 3.1–33
MC14022B 3.1–15
MC14023B 3.1–22
MC14023UB 3.1–22
MC14024B 3.1–14
MC14025B 3.1–24
MC14025UB 3.1–24
MC14027B 3.1–19
MC14028B 3.1–16
MC14029B 3.1–15
MC14035B 3.1–33
MC14038B 3.1–9
MC14040B 3.1–14
MC14042B 3.1–27
MC14043B 3.1–27
MC14044B 3.1–27
MC14046B 3.1–30
MC14049B 3.1–25
MC14049UB 3.1–25
MC14050B 3.1–25
MC14051B 3.1–27
MC14052B 3.1–28
MC14053B 3.1–29
MC14060B 3.1–14
MC14066B 3.1–29
MC14067B 3.1–27
MC14068B 3.1–21
MC14069UB 3.1–25
MC14070B 3.1–23
MC14071B 3.1–24
MC14072B 3.1–24
MC14073B 3.1–22
Device Index
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–39
MC14075B 3.1–25
MC14076B 3.1–21
MC14077B 3.1–23
MC14078B 3.1–24
MC14081B 3.1–21
MC14082B 3.1–21
MC14093B 3.1–32
MC14094B 3.1–33
MC14099B 3.1–26
MC14106B 3.1–32
MC14161B 3.1–14
MC14163B 3.1–14
MC14174B 3.1–19
MC14175B 3.1–21
MC14194B 3.1–33
MC14415 3.1–30
MC14490 3.1–9
MC14500B 3.1–25
MC14501UB 3.1–23
MC14502B 3.1–25
MC14503B 3.1–10
MC14504B 3.1–35
MC14506UB 3.1–23
MC14508B 3.1–26
MC14510B 3.1–15
MC14511B 3.1–17
MC14512B 3.1–27
MC14513B 3.1–17
MC14514B 3.1–16
MC14515B 3.1–16
MC14516B 3.1–15
MC14517B 3.1–34
MC14518B 3.1–15
MC14519B 3.1–22
MC14520B 3.1–15
MC14521B 3.1–30
MC14522B 3.1–15
MC14526B 3.1–15
MC14527B 3.1–9
MC14528B 3.1–29
MC14529B 3.1–28
MC14530B 3.1–23
MC14531B 3.1–30
MC14532B 3.1–17
MC14534B 3.1–14
MC14536B 3.1–30
MC14538B 3.1–29
MC14539B 3.1–28
MC14541B 3.1–30
MC14543B 3.1–17
MC14544B 3.1–17
MC14547B 3.1–17
MC14549B 3.1–34
MC14551B 3.1–28
MC14553B 3.1–14
MC14555B 3.1–17
MC14556B 3.1–17
MC14557B 3.1–32
MC14558B 3.1–17
MC14559B 3.1–34
MC14560B 3.1–9
MC14561B 3.1–9
MC14562B 3.1–32
MC14566B 3.1–15
MC14568B 3.1–15
MC14569B 3.1–15
MC14572UB 3.1–23
MC14580B 3.1–32
MC14583B 3.1–32
MC14584B 3.1–32
MC14585B 3.1–14
MC14598B 3.1–26
MC14599B 3.1–26
MC1648 3.1–30
MC1650 3.1–14
MC1651 3.1–14
MC1658 3.1–29
MC1660 3.1–23
MC1662 3.1–24
MC1670 3.1–20
MC1672 3.1–23
MC1692 3.1–31
MC4016 3.1–16
MC4018 3.1–16
MC4024 3.1–29
MC4044 3.1–17
MC4316 3.1–16
MC4324 3.1–29
MC4344 3.1–17
MC54HC00A 3.1–22
MC54HC02A 3.1–24
MC54HC04A 3.1–25
MC54HC08A 3.1–21
MC54HC132A 3.1–32
MC54HC138A 3.1–16
MC54HC139A 3.1–17
MC54HC14A 3.1–32
MC54HC154 3.1–16
MC54HC157A 3.1–28
MC54HC158 3.1–28
MC54HC160 3.1–15
MC54HC161A 3.1–15
MC54HC162 3.1–15
MC54HC163A 3.1–15
MC54HC164 3.1–33
MC54HC164A 3.1–33
MC54HC165 3.1–33
MC54HC174A 3.1–19
MC54HC175 3.1–21
MC54HC175A 3.1–21
MC54HC240A 3.1–11
MC54HC241A 3.1–11
MC54HC244A 3.1–12
MC54HC245A 3.1–12
MC54HC251 3.1–27
MC54HC259 3.1–16
MC54HC27 3.1–24
MC54HC273A 3.1–20
MC54HC32A 3.1–24
MC54HC354 3.1–27
MC54HC365 3.1–10
MC54HC366 3.1–10
MC54HC367 3.1–10
MC54HC373A 3.1–27
MC54HC374A 3.1–20
MC54HC390 3.1–15
MC54HC393 3.1–15
MC54HC4016 3.1–29
MC54HC4040A 3.1–14
MC54HC4049 3.1–25
MC54HC4050 3.1–25
MC54HC4051 3.1–27
MC54HC4053 3.1–29
MC54HC4060 3.1–14
MC54HC4060A 3.1–14
MC54HC4066 3.1–29
MC54HC4351 3.1–27
MC54HC4353 3.1–29
MC54HC4538A 3.1–29
MC54HC533A 3.1–27
MC54HC534A 3.1–20
MC54HC540A 3.1–11
MC54HC541A 3.1–11
MC54HC563A 3.1–27
MC54HC573A 3.1–27
MC54HC574A 3.1–20
MC54HC589 3.1–33
MC54HC589A 3.1–33
MC54HC595A 3.1–33
MC54HC597 3.1–33
MC54HC597A 3.1–33
MC54HC640A 3.1–11
MC54HC646 3.1–12
MC54HC688 3.1–14
MC54HC74A 3.1–19
MC54HC86 3.1–23
Device Index
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–40
MC54HC86A 3.1–23
MC54HCT00A 3.1–22
MC54HCT08A 3.1–21
MC54HCT14A 3.1–32
MC54HCT161A 3.1–15
MC54HCT163A 3.1–15
MC54HCT241A 3.1–11
MC54HCT244A 3.1–11
MC54HCT245A 3.1–10
MC54HCT32A 3.1–24
MC54HCT373A 3.1–26
MC54HCT374A 3.1–20
MC54HCT574A 3.1–20
MC660 3.1–18
MC661 3.1–18
MC662 3.1–18
MC663 3.1–19
MC664 3.1–20
MC667 3.1–29
MC668 3.1–25
MC669 3.1–18
MC670 3.1–25
MC671 3.1–25
MC672 3.1–25
MC677 3.1–25
MC678 3.1–25
MC68150*33 3.1–10
MC68150*40 3.1–10
MC68194 3.1–12
MC74AC00 3.1–22
MC74AC02 3.1–24
MC74AC04 3.1–25
MC74AC05 3.1–25
MC74AC08 3.1–21
MC74AC10 3.1–22
MC74AC109 3.1–19
MC74AC11 3.1–22
MC74AC112 3.1–19
MC74AC113 3.1–19
MC74AC125 3.1–12
MC74AC126 3.1–12
MC74AC132 3.1–32
MC74AC138 3.1–16
MC74AC139 3.1–17
MC74AC14 3.1–32
MC74AC151 3.1–27
MC74AC153 3.1–28
MC74AC157 3.1–29
MC74AC158 3.1–29
MC74AC160 3.1–16
MC74AC161 3.1–16
MC74AC162 3.1–16
MC74AC163 3.1–16
MC74AC174 3.1–19
MC74AC175 3.1–20
MC74AC190 3.1–16
MC74AC194 3.1–33
MC74AC20 3.1–21
MC74AC240 3.1–11
MC74AC241 3.1–11
MC74AC244 3.1–11
MC74AC245 3.1–10
MC74AC251 3.1–27
MC74AC253 3.1–28
MC74AC256 3.1–26
MC74AC257 3.1–28
MC74AC258 3.1–28
MC74AC259 3.1–26
MC74AC273 3.1–20
MC74AC299 3.1–33
MC74AC32 3.1–24
MC74AC323 3.1–33
MC74AC350 3.1–33
MC74AC352 3.1–28
MC74AC353 3.1–28
MC74AC373 3.1–26
MC74AC374 3.1–20
MC74AC377 3.1–20
MC74AC378 3.1–18
MC74AC4020 3.1–14
MC74AC4040 3.1–14
MC74AC533 3.1–26
MC74AC534 3.1–20
MC74AC540 3.1–11
MC74AC541 3.1–11
MC74AC563 3.1–26
MC74AC564 3.1–20
MC74AC573 3.1–26
MC74AC574 3.1–20
MC74AC620 3.1–10
MC74AC623 3.1–10
MC74AC640 3.1–10
MC74AC643 3.1–10
MC74AC646 3.1–11
MC74AC648 3.1–11
MC74AC652 3.1–11
MC74AC74 3.1–18
MC74AC810 3.1–23
MC74AC86 3.1–23
MC74ACT00 3.1–22
MC74ACT02 3.1–24
MC74ACT04 3.1–25
MC74ACT05 3.1–25
MC74ACT08 3.1–21
MC74ACT10 3.1–22
MC74ACT109 3.1–19
MC74ACT11 3.1–22
MC74ACT112 3.1–19
MC74ACT113 3.1–19
MC74ACT125 3.1–12
MC74ACT126 3.1–12
MC74ACT132 3.1–32
MC74ACT138 3.1–16
MC74ACT139 3.1–17
MC74ACT14 3.1–32
MC74ACT151 3.1–27
MC74ACT153 3.1–28
MC74ACT157 3.1–29
MC74ACT158 3.1–29
MC74ACT160 3.1–16
MC74ACT161 3.1–16
MC74ACT162 3.1–16
MC74ACT163 3.1–16
MC74ACT174 3.1–19
MC74ACT175 3.1–20
MC74ACT194 3.1–33
MC74ACT20 3.1–21
MC74ACT240 3.1–11
MC74ACT241 3.1–11
MC74ACT244 3.1–11
MC74ACT245 3.1–10
MC74ACT251 3.1–27
MC74ACT253 3.1–28
MC74ACT256 3.1–26
MC74ACT257 3.1–28
MC74ACT258 3.1–28
MC74ACT259 3.1–26
MC74ACT273 3.1–20
MC74ACT299 3.1–33
MC74ACT32 3.1–24
MC74ACT323 3.1–33
MC74ACT350 3.1–33
MC74ACT352 3.1–28
MC74ACT353 3.1–28
MC74ACT373 3.1–26
MC74ACT374 3.1–20
MC74ACT377 3.1–20
MC74ACT378 3.1–18
MC74ACT521 3.1–14
MC74ACT533 3.1–26
MC74ACT534 3.1–20
MC74ACT540 3.1–11
MC74ACT541 3.1–11
MC74ACT563 3.1–26
MC74ACT564 3.1–20
MC74ACT573 3.1–26
Device Index
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–41
MC74ACT574 3.1–20
MC74ACT620 3.1–10
MC74ACT623 3.1–10
MC74ACT640 3.1–10
MC74ACT643 3.1–10
MC74ACT646 3.1–11
MC74ACT648 3.1–11
MC74ACT652 3.1–11
MC74ACT74 3.1–18
MC74ACT810 3.1–23
MC74ACT86 3.1–23
MC74F00 3.1–22
MC74F02 3.1–24
MC74F04 3.1–25
MC74F08 3.1–21
MC74F10 3.1–22
MC74F109 3.1–19
MC74F11 3.1–22
MC74F112 3.1–19
MC74F1245 3.1–10
MC74F125 3.1–12
MC74F126 3.1–12
MC74F13 3.1–32
MC74F132 3.1–32
MC74F138 3.1–16
MC74F139 3.1–17
MC74F14 3.1–32
MC74F148 3.1–18
MC74F151 3.1–27
MC74F153 3.1–28
MC74F157A 3.1–28
MC74F158A 3.1–28
MC74F160A 3.1–15
MC74F161A 3.1–15
MC74F162A 3.1–15
MC74F163A 3.1–15
MC74F164 3.1–33
MC74F168 3.1–14
MC74F169 3.1–14
MC74F174 3.1–19
MC74F175 3.1–20
MC74F1803 3.1–13
MC74F181 3.1–9
MC74F182 3.1–9
MC74F194 3.1–33
MC74F195 3.1–33
MC74F20 3.1–21
MC74F21 3.1–21
MC74F2245 3.1–34
MC74F240 3.1–11
MC74F241 3.1–1 1
MC74F242 3.1–12
MC74F243 3.1–12
MC74F244 3.1–11
MC74F245 3.1–10
MC74F251 3.1–27
MC74F253 3.1–28
MC74F256 3.1–26
MC74F257A 3.1–29
MC74F258A 3.1–29
MC74F259 3.1–26
MC74F269 3.1–15
MC74F280 3.1–30
MC74F283 3.1–9
MC74F299 3.1–33
MC74F32 3.1–24
MC74F323 3.1–33
MC74F350 3.1–33
MC74F352 3.1–28
MC74F353 3.1–28
MC74F365 3.1–10
MC74F366 3.1–10
MC74F367 3.1–10
MC74F368 3.1–10
MC74F37 3.1–21
MC74F373 3.1–26
MC74F374 3.1–20
MC74F377 3.1–20
MC74F378 3.1–32
MC74F379 3.1–21
MC74F38 3.1–22
MC74F381 3.1–9
MC74F382 3.1–9
MC74F3893A 3.1–34
MC74F398 3.1–29
MC74F399 3.1–29
MC74F40 3.1–21
MC74F51 3.1–23
MC74F521 3.1–14
MC74F533 3.1–26
MC74F534 3.1–20
MC74F537 3.1–16
MC74F538 3.1–16
MC74F539 3.1–16
MC74F544 3.1–11
MC74F568 3.1–14
MC74F569 3.1–14
MC74F574 3.1–20
MC74F579 3.1–15
MC74F620 3.1–11
MC74F623 3.1–1 1
MC74F64 3.1–22
MC74F640 3.1–11
MC74F646 3.1–1 1
MC74F657A 3.1–10
MC74F657B 3.1–10
MC74F74 3.1–19
MC74F779 3.1–15
MC74F803 3.1–13
MC74F823 3.1–10
MC74F827 3.1–10
MC74F828 3.1–10
MC74F85 3.1–14
MC74F86 3.1–23
MC74HC00A 3.1–22
MC74HC02A 3.1–24
MC74HC03A 3.1–22
MC74HC04A 3.1–25
MC74HC08A 3.1–21
MC74HC10 3.1–22
MC74HC107 3.1–19
MC74HC109 3.1–19
MC74HC11 3.1–22
MC74HC112 3.1–19
MC74HC125A 3.1–12
MC74HC132A 3.1–32
MC74HC133 3.1–21
MC74HC137 3.1–16
MC74HC138A 3.1–16
MC74HC139A 3.1–17
MC74HC147 3.1–18
MC74HC14A 3.1–32
MC74HC151 3.1–27
MC74HC153 3.1–28
MC74HC154 3.1–16
MC74HC157A 3.1–28
MC74HC158 3.1–28
MC74HC158A 3.1–28
MC74HC160 3.1–15
MC74HC161A 3.1–15
MC74HC162 3.1–15
MC74HC163 3.1–15
MC74HC164 3.1–33
MC74HC164A 3.1–33
MC74HC165 3.1–33
MC74HC173 3.1–21
MC74HC174A 3.1–19
MC74HC175 3.1–21
MC74HC175A 3.1–21
MC74HC194 3.1–33
MC74HC195 3.1–33
MC74HC20 3.1–21
MC74HC237 3.1–16
MC74HC240A 3.1–11
MC74HC241A 3.1–11
MC74HC242 3.1–12
Device Index
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–42
MC74HC244A 3.1–12
MC74HC245A 3.1–12
MC74HC251 3.1–27
MC74HC253 3.1–28
MC74HC257 3.1–28
MC74HC259 3.1–16
MC74HC27 3.1–24
MC74HC273A 3.1–20
MC74HC280 3.1–30
MC74HC299 3.1–33
MC74HC30 3.1–21
MC74HC32A 3.1–24
MC74HC354 3.1–27
MC74HC365 3.1–10
MC74HC366 3.1–10
MC74HC367 3.1–10
MC74HC368 3.1–10
MC74HC373A 3.1–27
MC74HC374A 3.1–20
MC74HC390 3.1–15
MC74HC393 3.1–15
MC74HC4002 3.1–24
MC74HC4016 3.1–29
MC74HC4017 3.1–15
MC74HC4020A 3.1–14
MC74HC4024 3.1–29
MC74HC4040A 3.1–14
MC74HC4046A 3.1–35
MC74HC4049 3.1–25
MC74HC4050 3.1–25
MC74HC4051 3.1–27
MC74HC4052 3.1–28
MC74HC4053 3.1–29
MC74HC4060 3.1–14
MC74HC4060A 3.1–14
MC74HC4066 3.1–29
MC74HC4075 3.1–25
MC74HC4078 3.1–23
MC74HC42 3.1–16
MC74HC4316 3.1–29
MC74HC4351 3.1–27
MC74HC4353 3.1–29
MC74HC4511 3.1–17
MC74HC4514 3.1–16
MC74HC4538A 3.1–29
MC74HC4851A 3.1–27
MC74HC4852A 3.1–27
MC74HC4853A 3.1–27
MC74HC51 3.1–22
MC74HC533A 3.1–27
MC74HC534A 3.1–20
MC74HC540A 3.1–11
MC74HC541A 3.1–11
MC74HC563A 3.1–27
MC74HC564A 3.1–20
MC74HC573A 3.1–27
MC74HC574A 3.1–20
MC74HC58 3.1–22
MC74HC589 3.1–33
MC74HC589A 3.1–33
MC74HC595A 3.1–33
MC74HC597 3.1–33
MC74HC597A 3.1–33
MC74HC640A 3.1–11
MC74HC646 3.1–12
MC74HC688 3.1–14
MC74HC7266 3.1–23
MC74HC7266A 3.1–23
MC74HC73 3.1–19
MC74HC74A 3.1–19
MC74HC75 3.1–26
MC74HC76 3.1–19
MC74HC85 3.1–14
MC74HC86 3.1–23
MC74HC86A 3.1–23
MC74HCT00A 3.1–22
MC74HCT04A 3.1–25
MC74HCT08A 3.1–21
MC74HCT138A 3.1–16
MC74HCT14A 3.1–32
MC74HCT157A 3.1–28
MC74HCT161A 3.1–15
MC74HCT163A 3.1–15
MC74HCT174A 3.1–19
MC74HCT240A 3.1–11
MC74HCT241A 3.1–11
MC74HCT244A 3.1–11
MC74HCT245A 3.1–10
MC74HCT273A 3.1–20
MC74HCT32A 3.1–24
MC74HCT373A 3.1–26
MC74HCT374A 3.1–20
MC74HCT541A 3.1–11
MC74HCT573A 3.1–27
MC74HCT574A 3.1–20
MC74HCT74A 3.1–19
MC74HCU04 3.1–25
MC74HCU04A 3.1–25
MC74LCX00 3.1–21
MC74LCX02 3.1–24
MC74LCX04 3.1–25
MC74LCX08 3.1–21
MC74LCX125 3.1–9
MC74LCX138 3.1–17
MC74LCX157 3.1–28
MC74LCX16240A 3.1–9
MC74LCX16244 3.1–9
MC74LCX16245 3.1–34
MC74LCX16373 3.1–26
MC74LCX373 3.1–26
MC74LCX16374 3.1–20
MC74LCX16500 3.1–34
MC74LCX16501 3.1–34
MC74LCX16543A 3.1–34
MC74LCX240 3.1–9
MC74LCX244 3.1–9
MC74LCX245 3.1–34
MC74LCX2952 3.1–34
MC74LCX32 3.1–24
MC74LCX374 3.1–20
MC74LCX540 3.1–9
MC74LCX541 3.1–9
MC74LCX573 3.1–26
MC74LCX574 3.1–20
MC74LCX652 3.1–34
MC74LCX86 3.1–23
MC74LVQ00 3.1–21
MC74LVQ04 3.1–25
MC74LVQ125 3.1–10
MC74LVQ138 3.1–17
MC74LVQ240 3.1–10
MC74LVQ244 3.1–9
MC74LVQ245 3.1–34
MC74LVQ32 3.1–24
MC74LVQ373 3.1–26
MC74LVQ374 3.1–20
MC74LVQ541 3.1–9
MC74LVQ573 3.1–26
MC74LVQ574 3.1–20
MC74LVQ646 3.1–34
MC74LVQ652 3.1–34
MC74LVX4245 3.1–34
MC74VHC02 3.1–24
MC74VHC04 3.1–25
MC74VHC08 3.1–21
MC74HC126A 3.1–12
MC74VHC125 3.1–12
MC74VHC138 3.1–16
MC74VHC14 3.1–32
MC74VHC157 3.1–28
MC74VHC244 3.1–12
MC74VHC245 3.1–12
MC74VHC32 3.1–24
MC74VHC373 3.1–27
MC74VHC374 3.1–20
MC74VHC541 3.1–11
Device Index
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–43
MC74VHC573 3.1–27
MC74VHC574 3.1–20
MC74VHC595 3.1–33
MC74VHC74 3.1–19
MC830 3.1–21
MC832 3.1–9
MC836 3.1–25
MC837 3.1–25
MC840 3.1–25
MC844 3.1–18
MC845 3.1–18
MC846 3.1–22
MC88913 3.1–13
MC88914 3.1–13
MC88915*55 3.1–13
MC88915*70 3.1–13
MC88915T*100 3.1–13
MC88915T*133 3.1–13
MC88915T*160 3.1–13
MC88915T*55 3.1–13
MC88915T*70 3.1–13
MC88916*70 3.1–13
MC88916*80 3.1–13
MC88920 3.1–13
MC88921 3.1–13
MC88LV926 3.1–13
MC88PL117 3.1–13
MC936 3.1–25
MC937 3.1–25
MC944 3.1–18
MC945 3.1–18
MC946 3.1–22
MC951 3.1–29
MC952 3.1–19
MC953 3.1–19
MCCS142233 3.1–32
MCCS142235 3.1–32
MCCS142236 3.1–32
MCCS142237 3.1–32
MCCS142238 3.1–32
MCCS142239 3.1–32
MCH12140 3.1–17
MCK12140 3.1–17
MCM10143 3.1–32
MCM10145 3.1–32
MCM10146 3.1–31
MCM10152 3.1–31
MPA1016 3.1–18
MPA1036 3.1–18
MPA1064 3.1–18
MPA1100 3.1–18
MPA17128 3.1–32
MPA1765 3.1–32
MPC903 3.1–12
MPC904 3.1–12
MPC905 3.1–12
MPC911 3.1–13
MPC930 3.1–13
MPC931 3.1–13
MPC946 3.1–13
MPC947 3.1–12
MPC948 3.1–12
MPC948L 3.1–12
MPC949 3.1–13
MPC950 3.1–13
MPC951 3.1–13
MPC952 3.1–13
MPC956 3.1–13
MPC970 3.1–13
MPC972 3.1–13
MPC973 3.1–13
MPC974 3.1–13
MPC980 3.1–13
MPC990 3.1–13
MPC991 3.1–13
MPC992 3.1–13
SN54LS00 3.1–22
SN54LS01 3.1–22
SN54LS02 3.1–24
SN54LS03 3.1–22
SN54LS04 3.1–25
SN54LS05 3.1–25
SN54LS08 3.1–21
SN54LS09 3.1–21
SN54LS10 3.1–22
SN54LS107A 3.1–19
SN54LS109A 3.1–19
SN54LS11 3.1–22
SN54LS112A 3.1–19
SN54LS113A 3.1–19
SN54LS114A 3.1–19
SN54LS12 3.1–22
SN54LS122 3.1–29
SN54LS123 3.1–29
SN54LS125A 3.1–12
SN54LS126A 3.1–12
SN54LS13 3.1–32
SN54LS132 3.1–32
SN54LS133 3.1–21
SN54LS137 3.1–16
SN54LS138 3.1–16
SN54LS139 3.1–17
SN54LS14 3.1–32
SN54LS145 3.1–16
SN54LS147 3.1–17
SN54LS148 3.1–18
SN54LS15 3.1–22
SN54LS151 3.1–27
SN54LS153 3.1–28
SN54LS155 3.1–16
SN54LS156 3.1–16
SN54LS157 3.1–28
SN54LS158 3.1–28
SN54LS160A 3.1–14
SN54LS161A 3.1–14
SN54LS162A 3.1–14
SN54LS163A 3.1–14
SN54LS164 3.1–33
SN54LS165 3.1–33
SN54LS166 3.1–33
SN54LS168 3.1–15
SN54LS169 3.1–15
SN54LS170 3.1–32
SN54LS173A 3.1–18
SN54LS174 3.1–19
SN54LS175 3.1–21
SN54LS190 3.1–15
SN54LS191 3.1–15
SN54LS192 3.1–15
SN54LS193 3.1–15
SN54LS194A 3.1–33
SN54LS195A 3.1–34
SN54LS196 3.1–14
SN54LS197 3.1–14
SN54LS20 3.1–21
SN54LS21 3.1–21
SN54LS22 3.1–21
SN54LS221 3.1–29
SN54LS240 3.1–11
SN54LS241 3.1–11
SN54LS242 3.1–12
SN54LS243 3.1–12
SN54LS244 3.1–11
SN54LS245 3.1–11
SN54LS247 3.1–17
SN54LS248 3.1–17
SN54LS249 3.1–17
SN54LS251 3.1–27
SN54LS253 3.1–28
SN54LS256 3.1–26
SN54LS257B 3.1–28
SN54LS258B 3.1–29
SN54LS259 3.1–26
SN54LS26 3.1–21
SN54LS260 3.1–24
SN54LS266 3.1–23
Device Index
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–44
SN54LS27 3.1–24
SN54LS273 3.1–20
SN54LS279 3.1–27
SN54LS28 3.1–24
SN54LS280 3.1–30
SN54LS283 3.1–9
SN54LS290 3.1–15
SN54LS293 3.1–14
SN54LS298 3.1–28
SN54LS299 3.1–33
SN54LS30 3.1–21
SN54LS32 3.1–24
SN54LS322A 3.1–33
SN54LS323 3.1–33
SN54LS33 3.1–24
SN54LS348 3.1–18
SN54LS352 3.1–28
SN54LS353 3.1–28
SN54LS365A 3.1–10
SN54LS366A 3.1–10
SN54LS367A 3.1–10
SN54LS368A 3.1–10
SN54LS37 3.1–21
SN54LS373 3.1–26
SN54LS374 3.1–20
SN54LS375 3.1–26
SN54LS377 3.1–20
SN54LS378 3.1–19
SN54LS379 3.1–18
SN54LS38 3.1–22
SN54LS386 3.1–23
SN54LS390 3.1–15
SN54LS393 3.1–15
SN54LS398 3.1–29
SN54LS399 3.1–29
SN54LS40 3.1–21
SN54LS42 3.1–16
SN54LS47 3.1–17
SN54LS48 3.1–17
SN54LS490 3.1–15
SN54LS51 3.1–23
SN54LS54 3.1–22
SN54LS540 3.1–11
SN54LS541 3.1–11
SN54LS55 3.1–22
SN54LS569A 3.1–14
SN54LS623 3.1–11
SN54LS640 3.1–11
SN54LS641 3.1–34
SN54LS642 3.1–34
SN54LS645 3.1–11
SN54LS669 3.1–16
SN54LS670 3.1–32
SN54LS682 3.1–14
SN54LS684 3.1–14
SN54LS688 3.1–14
SN54LS73A 3.1–19
SN54LS748 3.1–18
SN54LS74A 3.1–19
SN54LS75 3.1–26
SN54LS76A 3.1–19
SN54LS77 3.1–26
SN54LS795 3.1–10
SN54LS796 3.1–10
SN54LS797 3.1–10
SN54LS798 3.1–10
SN54LS83A 3.1–9
SN54LS848 3.1–18
SN54LS85 3.1–14
SN54LS86 3.1–23
SN54LS90 3.1–15
SN54LS92 3.1–15
SN54LS93 3.1–14
SN54LS95B 3.1–33
SN74LS00 3.1–22
SN74LS01 3.1–22
SN74LS02 3.1–24
SN74LS03 3.1–22
SN74LS04 3.1–25
SN74LS05 3.1–25
SN74LS08 3.1–21
SN74LS09 3.1–21
SN74LS10 3.1–22
SN74LS107A 3.1–19
SN74LS109A 3.1–19
SN74LS11 3.1–22
SN74LS112A 3.1–19
SN74LS113A 3.1–19
SN74LS114A 3.1–19
SN74LS12 3.1–22
SN74LS122 3.1–29
SN74LS123 3.1–29
SN74LS125A 3.1–12
SN74LS126A 3.1–12
SN74LS13 3.1–32
SN74LS132 3.1–32
SN74LS133 3.1–21
SN74LS136 3.1–23
SN74LS137 3.1–16
SN74LS138 3.1–16
SN74LS139 3.1–17
SN74LS14 3.1–32
SN74LS145 3.1–16
SN74LS147 3.1–17
SN74LS148 3.1–18
SN74LS15 3.1–22
SN74LS151 3.1–27
SN74LS153 3.1–28
SN74LS155 3.1–16
SN74LS156 3.1–16
SN74LS157 3.1–28
SN74LS158 3.1–28
SN74LS160A 3.1–14
SN74LS161A 3.1–14
SN74LS162A 3.1–14
SN74LS163A 3.1–14
SN74LS164 3.1–33
SN74LS165 3.1–33
SN74LS166 3.1–33
SN74LS168 3.1–15
SN74LS169 3.1–15
SN74LS170 3.1–32
SN74LS173A 3.1–18
SN74LS174 3.1–19
SN74LS175 3.1–21
SN74LS190 3.1–15
SN74LS191 3.1–15
SN74LS192 3.1–15
SN74LS193 3.1–15
SN74LS194A 3.1–33
SN74LS195A 3.1–34
SN74LS196 3.1–14
SN74LS197 3.1–14
SN74LS20 3.1–21
SN74LS21 3.1–21
SN74LS22 3.1–21
SN74LS221 3.1–29
SN74LS240 3.1–11
SN74LS241 3.1–11
SN74LS242 3.1–12
SN74LS243 3.1–12
SN74LS244 3.1–11
SN74LS245 3.1–11
SN74LS247 3.1–17
SN74LS248 3.1–17
SN74LS249 3.1–17
SN74LS251 3.1–27
SN74LS253 3.1–28
SN74LS257B 3.1–28
SN74LS258B 3.1–29
SN74LS259 3.1–26
SN74LS26 3.1–21
SN74LS260 3.1–24
SN74LS266 3.1–23
SN74LS27 3.1–24
SN74LS273 3.1–20
Device Index
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–45
SN74LS279 3.1–27
SN74LS28 3.1–24
SN74LS280 3.1–30
SN74LS283 3.1–9
SN74LS290 3.1–15
SN74LS293 3.1–14
SN74LS298 3.1–28
SN74LS299 3.1–33
SN74LS30 3.1–21
SN74LS32 3.1–24
SN74LS322A 3.1–33
SN74LS323 3.1–33
SN74LS33 3.1–24
SN74LS348 3.1–18
SN74LS352 3.1–28
SN74LS353 3.1–28
SN74LS365A 3.1–10
SN74LS366A 3.1–10
SN74LS367A 3.1–10
SN74LS368A 3.1–10
SN74LS37 3.1–21
SN74LS373 3.1–26
SN74LS374 3.1–20
SN74LS375 3.1–26
SN74LS377 3.1–20
SN74LS378 3.1–19
SN74LS379 3.1–18
SN74LS38 3.1–22
SN74LS386 3.1–23
SN74LS390 3.1–15
SN74LS393 3.1–15
SN74LS395 3.1–33
SN74LS398 3.1–29
SN74LS399 3.1–29
SN74LS40 3.1–21
SN74LS42 3.1–16
SN74LS47 3.1–17
SN74LS48 3.1–17
SN74LS490 3.1–15
SN74LS51 3.1–23
SN74LS54 3.1–22
SN74LS540 3.1–11
SN74LS541 3.1–11
SN74LS55 3.1–22
SN74LS569A 3.1–14
SN74LS623 3.1–11
SN74LS640 3.1–11
SN74LS641 3.1–34
SN74LS642 3.1–34
SN74LS645 3.1–11
SN74LS669 3.1–16
SN74LS670 3.1–32
SN74LS682 3.1–14
SN74LS684 3.1–14
SN74LS688 3.1–14
SN74LS73A 3.1–19
SN74LS748 3.1–18
SN74LS74A 3.1–19
SN74LS75 3.1–26
SN74LS76A 3.1–19
SN74LS77 3.1–26
SN74LS795 3.1–10
SN74LS796 3.1–10
SN74LS797 3.1–10
SN74LS798 3.1–10
SN74LS83A 3.1–9
SN74LS848 3.1–18
SN74LS85 3.1–14
SN74LS86 3.1–23
SN74LS90 3.1–15
SN74LS92 3.1–15
SN74LS93 3.1–14
SN74LS95B 3.1–33
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–46
Ordering Information
Device Nomenclatures
LS – Low Power Schottky
Standard Prefix
Temperature Range
•74 Series (0 to +70°C)
•54 Series (–55 to +125°C)
Family
•LS = Low Power Schottky
Package Type
•N for Plastic (74 Series Only)
•J for Ceramic
•D for 150 mil Plastic SOIC (74 Series Only)
•DW for 300 mil Plastic SOIC (74 Series Only)
Function Type
SN VV WW XXXX Y
FAST
Motorola
Circuit Identifier
Temperature Range
•74 Series (0 to +70°C)
Family
•F = FAST
Package Type
•N for Plastic (74 Series Only)
•D for 150 mil Plastic SOIC (74 Series Only)
•DW for 300 mil Plastic SOIC (74 Series Only)
•SD for Plastic SSOP
Function Type
MC VV W XXXX Y
MECL 10K, MECL 10H/100H
Motorola
Circuit Identifier
Temperature Range
•10 = 10K (–30 to +85°C)
•10H = 10H (0 to +75°C)
•100H = 100K Compatible (0 to +85°C)
Package Type
•P for Plastic
•L for Ceramic
•FN for PLCC
Function Type
MC WWW XXX YY
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–47
ECLinPS, ECLinPS
Lite
XXX
Motorola
Circuit Identifier
Compatibility Identifier
•10 = 10H Compatible (0 to +85°C)
•100 = 100K Compatible (0 to +85°C)
Package Type
•FN = PLCC
•D = Plastic SOIC
•L = Ceramic DIP
•P = Plastic DIP
Function Type
MC WWW YYY ZZ
ECLinPS Family Identifier
•YYY = 3–Digits for ECLinPS
•YY= 2–Digits for ECLinPS Lite
•E = ECLinPS
•EL = ECLinPS Lite
•ELT = ECLinPS Lite Translator
•LVE = Low V oltage ECLinPS
•LVEL = Low V oltage ECLinPS Lite
•MC = Fully Qualified Circuit
•XC = Non Reliability Qualified
Metal Gate 14000 Series CMOS
MC 14XXX ZZYY
Motorola Circuit Identifier Package and Temperature Range
•CL for Ceramic –55 to +125°C
•CP for Plastic –55 to +125°C
•D/DW for Small Outline Package (Plastic) –55 to +125°C
•DT for Plastic TSSOP
Function Type
Identifier (per JEDEC Standard)
•B (or Blank)= Buffered Outputs
•UB = Unbuffered Outputs
High–Speed CMOS
Motorola
Circuit Identifier
Temperature Range
•74 Series (–55 to +125°C)
•54 Series (–55 to +125°C)
High–Speed CMOS
Specification Identifier
•HC = Buffered High–Speed CMOS
•HCU = Unbuffered High–Speed CMOS*
•HCT = High–Speed CMOS TTL Compatible
*Not Available On All Devices
Package Type
•N for Plastic (74 Series Only)
•J for Ceramic (54 Series Only)
•D for 150 mil Plastic SOIC (74 Series Only)
•DW for 300 mil Plastic SOIC (74 Series Only)
•SD for Plastic SSOP
•DT for Plastic TSSOP
Function Type
•XX(X) Same Function and Pin Configuration as
LSTTL
•4XXX Same Function and Pin Configuration as
CMOS 14000
•7XX(X) Variation of LSTTL or CMOS 14000
Device
MC VV WWW XXXX Y
FACT
Motorola
Circuit Identifier
Temperature Range Family
•74AC = FACT (–40 to +85°C)
•74ACT = TTL Compatible (–40 to +85°C)
Package Type
•N for Plastic
•D for Narrow SOIC
•DW for Wide SOIC
•SD for Plastic SSOP
•DT for Plastic TSSOP
Function Type
MC WWWWW XXX YY
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–48
Other Logic Circuits
•N for Plastic
•D for Narrow SOIC
•FN for PLCC
•FJ for CLCC
Motorola
Circuit Identifier
Function Type
Package Type
Option Type
MC/MCCS WWWWWW X YY ZZ
Option Suffix Indicator
•MC = Standard Circuit Identifier
•MCCS = Circuit Chip–Set Identifier
MECL III/HTL/DTL
Motorola
Circuit Identifier
Package Type
•P for Plastic
•L for Ceramic
•D for Narrow SOIC
•FN for PLCC
Function Type
MC XXXX Y
LCX Products
Motorola
Circuit Identifier
Temperature Range
•74 = –40 to +85°C
Family Identifier
•LCX = 5V–Tolerant Low–Voltage CMOS
Package Type
•D for Plastic Narrow JEDEC SOIC
•DW for Plastic Wide JEDEC SOIC
•M for Plastic EIAJ SOIC
•SD for Plastic SSOP
•DT for Plastic TSSOP
Function Type
MC 74 LCX YYYYY ZZ
LVQ Products
Motorola
Circuit Identifier
Temperature Range
•74 = –40 to +85°C
Family Identifier
•LVQ =Low–V oltage Quiet CMOS
Package Type
•D for Plastic Narrow JEDEC SOIC
•DW for Plastic Wide JEDEC SOIC
•M for Plastic EIAJ SOIC
•SD for Plastic SSOP
•DT for Plastic TSSOP
Function Type
MC 74 LVQ YYYY ZZ
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–49
Motorola Programmable Arrays (MPA)
PROM Type
•Blank = EPROM
•C = EEPROM
Motorola
Programmable Array
(First Series)
Circuit Identifier
MPA1 XXX YY I
Number of Core Cells
Physical Number of Cells in 100’s
•016 = 1,600 Cells
•036 = 3,600 Cells
•064 = 6,400 Cells
•100 = 10,000 Cells
Package Type
•FN = 84 PLCC
•DD = 128 PQFP
•DH = 160 PQFP
•DK = 208 PQFP
•HI = 181 CPGA
•KE = 224 CPGA
•HV = 299 CPGA
•BG = 256 PBGA
Speed Grade
Temperature Grade
•Blank = Commercial
•I = Industrial
Z
FPGA Nomenclature
EPROM/EEPROM Nomenclature
Motorola
EPROM/EEPROM
Circuit Identifier
MPA17 XXX YY I
Number of Memory
Bits (in K)
Package Type
•D = SOIC
•P = PDIP
•FN = PLCC
Temperature Grade
•Blank = Commercial
•I = Industrial
C
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–50
Case Outlines
8–Pin Packages P SUFFIX
PLASTIC DIP PACKAGE
CASE 626–05
ISSUE K
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14
58
F
NOTE 2 –A–
–B–
–T–
SEATING
PLANE
H
J
GDK
N
C
L
M
M
A
M
0.13 (0.005) B M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.40 10.16 0.370 0.400
B6.10 6.60 0.240 0.260
C3.94 4.45 0.155 0.175
D0.38 0.51 0.015 0.020
F1.02 1.78 0.040 0.070
G2.54 BSC 0.100 BSC
H0.76 1.27 0.030 0.050
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L7.62 BSC 0.300 BSC
M––– 10 ––– 10
N0.76 1.01 0.030 0.040
__
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
ISSUE S
SEATING
PLANE
14
58
A0.25 MCBSS
0.25 MBM
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A1.35 1.75
A1 0.10 0.25
B0.35 0.49
C0.18 0.25
D4.80 5.00
E1.27 BSCe3.80 4.00
H5.80 6.20
h
0 7
L0.40 1.25
q
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
EH
A
Be
B
A1
CA
0.10
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–51
8–Pin Packages SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940–03
ISSUE B
DIM
AMIN MAX MIN MAX
INCHES
2.87 3.13 0.113 0.123
MILLIMETERS
B5.20 5.38 0.205 0.212
C1.73 1.99 0.068 0.078
D0.05 0.21 0.002 0.008
F0.63 0.95 0.024 0.037
G0.65 BSC 0.026 BSC
H0.44 0.60 0.017 0.023
J0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
H
A
B
85
41
F
M
K8X REF
S
U
M
0.12 (0.005) V S
T
L
L/2
PIN 1
IDENT
S
U
M
0.20 (0.008) T
–V– –U–
D
C
0.076 (0.003)
G
–T–
SEATING
PLANE
DETAIL E
DETAIL E
–W–
N
N
0.25 (0.010)
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉ
ÉÉÉ
K
JJ1
K1
SECTION N–N
L7.65 7.90 0.301 0.311
M0 8 0 8
14–Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.94
B0.245 0.280 6.23 7.11
C0.155 0.200 3.94 5.08
D0.015 0.020 0.39 0.50
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
J0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
C
14 PLDGFN
K
14 PLJM
L
S
B
M
0.25 (0.010) T
S
A
M
0.25 (0.010) T
–T–
SEATING
PLANE
17
14 9
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–52
14–Pin Packages P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE M
17
14 8
B
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.715 0.770 18.16 18.80
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
F0.040 0.070 1.02 1.78
G0.100 BSC 2.54 BSC
H0.052 0.095 1.32 2.41
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L
M––– 10 ––– 10
N0.015 0.039 0.38 1.01
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
HG D
K
C
SEATING
PLANE
N
–T–
14 PL
M
0.13 (0.005)
L
M
J
0.290 0.310 7.37 7.87
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P7 PL
14 8
71 M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
–T–
F
RX 45
SEATING
PLANE
D14 PL K
C
J
M
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
____
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–53
14–Pin Packages M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
HE
A1
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
––– 1.42 ––– 0.056
A1
HE
Q1
LE
_
10
_
0
_
10
_
LEQ1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0.46 ( 0.018).
0.13 (0.005) M0.10 (0.004)
D
Z
E
1
14 8
7
eA
b
VIEW P
c
L
DETAIL P
M
A
b
c
D
E
e
0.50
M
Z
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940A–03
ISSUE B
DIM
AMIN MAX MIN MAX
INCHES
6.07 6.33 0.238 0.249
MILLIMETERS
B5.20 5.38 0.205 0.212
C1.73 1.99 0.068 0.078
D0.05 0.21 0.002 0.008
F0.63 0.95 0.024 0.037
G0.65 BSC 0.026 BSC
H1.08 1.22 0.042 0.048
J0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
H
A
B
14 8
71
F
M
K14X REF
S
U
M
0.12 (0.005) V S
T
L
L/2
PIN 1
IDENT
S
U
M
0.20 (0.008) T
–V– –U–
D
C
0.076 (0.003)
G
–T–
SEATING
PLANE
DETAIL E
DETAIL E
–W–
N
N
0.25 (0.010)
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
K
JJ1
K1
SECTION N–N
L7.65 7.90 0.301 0.311
M0 8 0 8
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–54
14–Pin Packages DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L–U–
SEATING
PLANE
0.10 (0.004)
–T–
ÇÇÇ
ÇÇÇ
SECTION N–N
DETAIL E
JJ1
K
K1
ÉÉ
ÉÉ
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
16–Pin Packages L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C––– 0.200 ––– 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
16 9
18
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–55
16–Pin Packages P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–56
16–Pin Packages
DW SUFFIX
PLASTIC WIDE SOIC PACKAGE
CASE 751G–02
ISSUE A
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 966–01
ISSUE O
K
C
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A10.15 10.45 0.400 0.411
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.50 0.90 0.020 0.035
G1.27 BSC 0.050 BSC
J0.25 0.32 0.010 0.012
K0.10 0.25 0.004 0.009
M0 7 0 7
P10.05 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
M
B
M
0.010 (0.25)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSIOM D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–B– P8X
G14X
D16X
SEATING
PLANE
–T–
S
A
M
0.010 (0.25) B S
T
16 9
81
F
J
RX 45
_
____
M
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
––– 0.78 ––– 0.031
A1
HE
Q1
LE
_
10
_
0
_
10
_
LEQ1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005) 0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–57
16–Pin Packages
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940B–03
ISSUE B
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
16 9
81
K16X REF
S
U
M
0.12 (0.005) V S
T
A
B
L
L/2
PIN 1
IDENT
S
U
M
0.20 (0.008) T
–V– –U–
H
D
C
0.076 (0.003)
G
–T–
SEATING
PLANE
F
M
DETAIL E
DETAIL E
–W–
N
N
0.25 (0.010)
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
K
JJ1
K1
SECTION N–N
DIM
AMIN MAX MIN MAX
INCHES
6.07 6.33 0.238 0.249
MILLIMETERS
B5.20 5.38 0.205 0.212
C1.73 1.99 0.068 0.078
D0.05 0.21 0.002 0.008
F0.63 0.95 0.024 0.037
G0.65 BSC 0.026 BSC
H0.73 0.90 0.028 0.035
J0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.15 (0.006) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K
DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM
PLANE –W–.
L7.65 7.90 0.301 0.311
M0 8 0 8
ÇÇ
ÇÇ
ÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.18 0.28 0.007 0.011
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE
ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE –W–.
____
SECTION N–N
SEATING
PLANE
IDENT.
PIN 1
18
16 9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
ÉÉ
ÉÉ
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–58
18–Pin Packages
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 707–02
ISSUE C
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 726–04
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F FOR FULL LEADS. HALF
LEADS OPTIONAL AT LEAD POSITIONS 1,
9, 10, AND 18.
1
SEATING
PLANE
10
9
18
M
K
C
N
FG
D
L
–A–
–B–
18 PL J18 PL
–T–
S
A
M
0.25 (0.010) T S
B
M
0.25 (0.010) T
OPTIONAL LEAD
CONFIGURATION (1, 9, 10, 18)
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A22.35 23.110.880 0.910
B6.10 7.490.240 0.295
C––– 5.08––– 0.200
D0.38 0.530.015 0.021
G2.54 BSC0.100 BSC
J0.20 0.300.008 0.012
K3.18 4.320.125 0.170
L7.62 BSC0.300 BSC
M0 15 0 15
N0.51 1.020.020 0.040
____
F1.40 1.780.055 0.070
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
1
SEATING
PLANE
10
9
18
M
A
B
K
C
N
F
GD
H
J
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A22.22 23.24 0.875 0.915
B6.10 6.60 0.240 0.260
C3.56 4.57 0.140 0.180
D0.36 0.56 0.014 0.022
F1.27 1.78 0.050 0.070
G2.54 BSC 0.100 BSC
H1.02 1.52 0.040 0.060
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L7.62 BSC 0.300 BSC
M0 15 0 15
N0.51 1.02 0.020 0.040
__ __
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–59
20–Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 732–03
ISSUE E
P,N SUFFIX
PLASTICC DIP PACKAGE
CASE 738–03
ISSUE E
DW SUFFIX
PLASTIC WIDE SOIC PACKAGE
CASE 751D–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25) B S
T
D20X
M
B
M
0.010 (0.25)
P10X
J
F
G
18X K
C
–T–
SEATING
PLANE
M
RX 45
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A12.65 12.95 0.499 0.510
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.50 0.90 0.020 0.035
G1.27 BSC 0.050 BSC
J0.25 0.32 0.010 0.012
K0.10 0.25 0.004 0.009
M0 7 0 7
P10.05 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
J20 PL
M
B
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A25.66 27.171.010 1.070
B6.10 6.600.240 0.260
C3.81 4.570.150 0.180
D0.39 0.550.015 0.022
G2.54 BSC0.100 BSC
J0.21 0.380.008 0.015
K2.80 3.550.110 0.140
L7.62 BSC0.300 BSC
M0 15 0 15
N0.51 1.010.020 0.040
____
E1.27 1.770.050 0.070
1
11
10
20
–A–
SEATING
PLANE
K
N
FG
D20 PL
–T–
M
A
M
0.25 (0.010) T
E
B
C
F1.27 BSC0.050 BSC
NOTES:
1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A23.88 25.15 0.940 0.990
B6.60 7.49 0.260 0.295
C3.81 5.08 0.150 0.200
D0.38 0.56 0.015 0.022
F1.40 1.65 0.055 0.065
G2.54 BSC 0.100 BSC
H0.51 1.27 0.020 0.050
J0.20 0.30 0.008 0.012
K3.18 4.06 0.125 0.160
L7.62 BSC 0.300 BSC
M0 15 0 15
N0.25 1.02 0.010 0.040
____
A
20
110
11
B
FC
SEATING
PLANE
D
HGK
NJM
L
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–60
20–Pin Packages
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940C–03
ISSUE B
20 11
101
H
A
B
F
M
K20X REF
S
U
M
0.12 (0.005) V S
T
L
L/2
PIN 1
IDENT
S
U
M
0.20 (0.008) T
–V– –U–
D
C
0.076 (0.003)
G
–T–
SEATING
PLANE
DETAIL E
N
N
0.25 (0.010)
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
K
JJ1
K1
SECTION N–N
DIM
AMIN MAX MIN MAX
INCHES
7.07 7.33 0.278 0.288
MILLIMETERS
B5.20 5.38 0.205 0.212
C1.73 1.99 0.068 0.078
D0.05 0.21 0.002 0.008
F0.63 0.95 0.024 0.037
G0.65 BSC 0.026 BSC
H0.59 0.75 0.023 0.030
J0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
L7.65 7.90 0.301 0.311
M0 8 0 8
DETAIL E
–W–
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
12.35 12.80 0.486 0.504
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
––– 0.81 ––– 0.032
A1
HE
Q1
LE
_
10
_
0
_
10
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0.46 ( 0.018).
HE
A1
LEQ1
_
c
A
ZD
E
20
110
11
b
M
0.13 (0.005)
e
0.10 (0.004)
VIEW P
DETAIL P
M
L
A
b
c
D
E
e
L
M
Z
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–61
20–Pin Packages
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
DIM
AMIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B4.30 4.50 0.169 0.177
C1.20 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.27 0.37 0.011 0.015
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25
(0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
ÍÍÍ
ÍÍÍ
ÍÍÍ
110
1120
PIN 1
IDENT
A
B
–T–
0.100 (0.004)
C
DGH
SECTION N–N
K
K1
JJ1
N
N
M
F
–W–
SEATING
PLANE
–V–
–U–
S
U
M
0.10 (0.004) V S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
––– –––
S
U0.15 (0.006) T
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–62
20–Pin Packages
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–63
24–Pin Packages
NOTES:
1. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
2. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION (WHEN FORMED
PARALLEL).
112
24 13
B
A
SEATING
PLANE
F
D
GK
N
C
MJ
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A31.24 32.77 1.230 1.290
B12.70 15.49 0.500 0.610
C4.06 5.59 0.160 0.220
D0.41 0.51 0.016 0.020
F1.27 1.52 0.050 0.060
G2.54 BSC 0.100 BSC
J0.20 0.30 0.008 0.012
K3.18 4.06 0.125 0.160
L15.24 BSC 0.600 BSC
M0 15 0 15
N0.51 1.27 0.020 0.050
____
C
N
K
F
G
B
1
24
12
13
L P
J
SEATING
PLANE
DIM
AMIN MAX MIN MAX
MILLIMETERS
1.240 1.285 31.50 32.64
INCHES
B0.285 0.305 7.24 7.75
C0.160 0.200 4.07 5.08
D0.015 0.021 0.38 0.53
F0.045 0.062 1.14 1.57
G0.100 BSC 2.54 BSC
J0.008 0.013 0.20 0.33
K0.100 0.165 2.54 4.19
L0.300 0.310 7.62 7.87
N0.020 0.050 0.51 1.27
P0.360 0.400 9.14 10.16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
0.25 (0.010) MTAM
D 24 PL
–T–
–A–
J SUFFIX
CERAMIC DIP PACKAGE
CASE 758–02
ISSUE A
L,J,JW SUFFIX
CERAMIC DIP PACKAGE
CASE 623–05
ISSUE M
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–64
24–Pin Packages
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A31.50 32.13 1.240 1.265
B13.21 13.72 0.520 0.540
C4.70 5.21 0.185 0.205
D0.38 0.51 0.015 0.020
F1.02 1.52 0.040 0.060
G2.54 BSC 0.100 BSC
H1.65 2.16 0.065 0.085
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L14.99 15.49 0.590 0.610
M––– 10 ––– 10
N0.51 1.02 0.020 0.040
P0.13 0.38 0.005 0.015
Q0.51 0.76 0.020 0.030
_
N SUFFIX
PLASTIC DIP PACKAGE
CASE 709–02
ISSUE C
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 724–03
ISSUE D
P,N,PW SUFFIX
PLASTIC DIP PACKAGE
CASE 649–03
ISSUE D
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A31.37 32.13 1.235 1.265
B13.72 14.22 0.540 0.560
C3.94 5.08 0.155 0.200
D0.36 0.56 0.014 0.022
F1.02 1.52 0.040 0.060
G2.54 BSC 0.100 BSC
H1.65 2.03 0.065 0.080
J0.20 0.38 0.008 0.015
K2.92 3.43 0.115 0.135
L15.24 BSC 0.600 BSC
M0 15 0 15
N0.51 1.02 0.020 0.040
____
112
1324
B
H
A
FD
G
K
SEATING
PLANE
N
C
MJ
L
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
–A–
–B–
24 13
12
1
–T–
SEATING
PLANE
24 PL
K
EF
N
C
D
G
M
A
M
0.25 (0.010) T
24 PLJ
M
B
M
0.25 (0.010) T
L
M
NOTE 1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.230 1.265 31.25 32.13
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.020 0.38 0.51
E0.050 BSC 1.27 BSC
F0.040 0.060 1.02 1.52
G0.100 BSC 2.54 BSC
J0.007 0.012 0.18 0.30
K0.110 0.140 2.80 3.55
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
SEATING
PLANE
112
24 13
J
G
FC
K
B
H
N
Q
PA
DM
L
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–65
24–Pin Packages
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A15.25 15.54 0.601 0.612
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.41 0.90 0.016 0.035
G1.27 BSC 0.050 BSC
J0.23 0.32 0.009 0.013
K0.13 0.29 0.005 0.011
M0 8 0 8
P10.05 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
____
DW SUFFIX
PLASTIC WIDE SOIC PACKAGE
CASE 751E–04
ISSUE E
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940D–03
ISSUE B
–A–
–B– P12X
D24X
12
1324
1
M
0.010 (0.25) B M
S
A
M
0.010 (0.25) B S
T
–T–
G
22X
SEATING
PLANE
K
C
RX 45
_
M
F
J
24 13
121
DIM
AMIN MAX MIN MAX
INCHES
8.07 8.33 0.317 0.328
MILLIMETERS
B5.20 5.38 0.205 0.212
C1.73 1.99 0.068 0.078
D0.05 0.21 0.002 0.008
F0.63 0.95 0.024 0.037
G0.65 BSC 0.026 BSC
H0.44 0.60 0.017 0.024
J0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
L7.65 7.90 0.301 0.311
M0 8 0 8
F
M
DETAIL E
N
N
0.25 (0.010)
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
K
JJ1
K1
SECTION N–N
A
B
K24X REF
S
U
M
0.12 (0.005) V S
T
L
L/2
PIN 1
IDENT
S
U
M
0.20 (0.008) T
–V– –U–
H
D
C
0.076 (0.003)
G
–T–
SEATING
PLANE
DETAIL E
–W–
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–66
24–Pin Packages
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948H–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A7.70 7.90 0.303 0.311
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.27 0.37 0.011 0.015
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L–U–
SEATING
PLANE
0.10 (0.004)
–T–
ÇÇÇ
ÇÇÇ
ÇÇÇ
SECTION N–N
DETAIL E
J
J1
K
K1
ÉÉ
ÉÉ
ÉÉ
DETAIL E
F
M
–W–
0.25 (0.010)
13
24
12
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
24X REFK
N
N
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–67
28–Pin Packages
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
–N–
–M–
–L–
V
WD
D
Y BRK
28 1
VIEW S
S
L–M
S
0.010 (0.250) N S
T
S
L–M
M
0.007 (0.180) N S
T
0.004 (0.100)
G1
GJ
C
ZR
E
A
SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
–T–
B
S
L–M
S
0.010 (0.250) N S
T
S
L–M
M
0.007 (0.180) N S
T
U
S
L–M
M
0.007 (0.180) N S
T
Z
G1X
VIEW D–D
S
L–M
M
0.007 (0.180) N S
T
K1
VIEW S
H
K
F
S
L–M
M
0.007 (0.180) N S
T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.485 0.495 12.32 12.57
B0.485 0.495 12.32 12.57
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.450 0.456 11.43 11.58
U0.450 0.456 11.43 11.58
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.410 0.430 10.42 10.92
K1 0.040 ––– 1.02 –––
____
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–68
32–Pin Package
FA SUFFIX
PLASTIC TQFP PACKAGE
CASE 873A–02
ISSUE A
ÉÉ
ÉÉ
ÉÉ
DETAIL Y
A
S1
VB
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
N
J
DF
METAL
SECTION AE–AE
G
SEATING
PLANE
R
Q
_
WK
X
0.250 (0.010)
GAUGE PLANE
E
C
H
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
AMIN MAX MIN MAX
INCHES
7.000 BSC 0.276 BSC
MILLIMETERS
B7.000 BSC 0.276 BSC
C1.400 1.600 0.055 0.063
D0.300 0.450 0.012 0.018
E1.350 1.450 0.053 0.057
F0.300 0.400 0.012 0.016
G0.800 BSC 0.031 BSC
H0.050 0.150 0.002 0.006
J0.090 0.200 0.004 0.008
K0.500 0.700 0.020 0.028
M12 REF 12 REF
N0.090 0.160 0.004 0.006
P0.400 BSC 0.016 BSC
Q1 5 1 5
R0.150 0.250 0.006 0.010
V9.000 BSC 0.354 BSC
V1 4.500 BSC 0.177 BSC
__
____
DETAIL AD
A1
B1 V1
4X
S
4X
B1 3.500 BSC 0.138 BSC
A1 3.500 BSC 0.138 BSC
S9.000 BSC 0.354 BSC
S1 4.500 BSC 0.177 BSC
W0.200 REF 0.008 REF
X1.000 REF 0.039 REF
9
–T–
–Z–
–U–
T–U0.20 (0.008) ZAC
T–U0.20 (0.008) ZAB
0.10 (0.004) AC
–AC–
–AB–
M
_
8X
–T–, –U–, –Z–
T–U
M
0.20 (0.008) ZAC
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–69
40–Pin Packages N SUFFIX
PLASTIC DIP PACKAGE
CASE 711–03
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
1 20
40 21
B
AC
SEATING
PLANE
DFGH K
N
M
J
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A51.69 52.45 2.035 2.065
B13.72 14.22 0.540 0.560
C3.94 5.08 0.155 0.200
D0.36 0.56 0.014 0.022
F1.02 1.52 0.040 0.060
G2.54 BSC 0.100 BSC
H1.65 2.16 0.065 0.085
J0.20 0.38 0.008 0.015
K2.92 3.43 0.115 0.135
L15.24 BSC 0.600 BSC
M0 15 0 15
N0.51 1.02 0.020 0.040
__ __
48–Pin Packages
J SUFFIX
CERAMIC DIP PACKAGE
CASE 740–03
ISSUE B
DIM
AMIN MAX MIN MAX
MILLIMETERS
2.376 2.424 60.36 61.56
INCHES
B0.576 0.604 14.64 15.34
C0.120 0.127 3.05 4.31
D0.015 0.021 0.381 0.533
E0.050 BSC 1.27 BSC
F0.030 0.055 0.762 1.397
G0.100 BSC 2.54 BSC
J0.008 0.013 0.204 0.330
K0.100 0.165 2.54 4.19
L0.600 BSC 15.24 BSC
M
N0.040 0.060 1.016 1.524
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
C
10 10 0 0
48 25
1 24
D48 PL
K
N
E
G
F
SEATING
PLANE
0.25 (0.010) T B M
M
0.25 (0.010) T A M
M
J48 PL
°° °°
L
M
–A–
–B–
–T–
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–70
48–Pin Packages N SUFFIX
PLASTIC DIP PACKAGE
CASE 767–02
ISSUE B
–A–
–B–
48 25
1 24
–T–
SEATING
PLANE
FGDETAIL X
32 PLD48 PLJ
S
B
M
0.25 (0.010) T
S
A
M
0.51 (0.020) T
N
C
K
48 PLM
DETAIL X
L
TIP TAPER
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A2.415 2.445 61.34 62.10
B0.540 0.560 13.72 14.22
C0.155 0.200 3.94 5.08
D0.014 0.022 0.36 0.55
F0.040 0.060 1.02 1.52
G0.100 BSC 2.54 BSC
H0.070 BSC 1.79 BSC
J0.008 0.015 0.20 0.38
K0.115 0.150 2.92 3.81
L0.600 BSC 15.24 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1201–01
ISSUE A
ÇÇÇ
ÇÇÇ
S
U
M
0.12 (0.005) V S
T
S
U
M
0.254 (0.010) T
–V–
B
A
L
K
–U–
48X REF
PIN 1
IDENT.
124
2548
0.076 (0.003)
SEATING
D
–T–
PLANE
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A12.40 12.60 0.488 0.496
B6.00 6.20 0.236 0.244
C––– 1.10 ––– 0.043
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.50 BSC 0.0197 BSC
H0.37 ––– 0.015 –––
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.17 0.27 0.007 0.011
K1 0.17 0.23 0.007 0.009
L7.95 8.25 0.313 0.325
M0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
ÉÉÉ
ÉÉÉ
C
GH
–W–
DETAIL E
J
K1
K
J1
SECTION N–N
M
0.25 (0.010)
F
DETAIL E
N
N
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–71
52–Pin Packages
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 778–02
ISSUE C
–L–
YBRK
W
D
D
V
52 1
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE
TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED
AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
B
U
Z
G1
X
VIEW D–D
H
K1
KF
VIEW S
M
0.007 (0.18) L–M S
TS
N
M
0.007 (0.18) L–M S
TS
N
0.004 (0.100)
–T–
SEATING
PLANE
M
0.007 (0.18) L–M S
TS
N
M
0.007 (0.18) L–M S
TS
N
A
R
G
G1
C
Z
J
E
VIEW S
–M–
–N–
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.785 0.795 19.94 20.19
B0.785 0.795 19.94 20.19
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.750 0.756 19.05 19.20
U0.750 0.756 19.05 19.20
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.710 0.730 18.04 18.54
K1 0.040 ––– 1.02 –––
____
M
0.007 (0.18) L–M S
TS
N
M
0.007 (0.18) L–M S
TS
N
S
0.010 (0.25) L–M S
TS
N
S
0.010 (0.25) L–M S
TS
N
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–72
52–Pin Packages
FA SUFFIX
PLASTIC TQFP PACKAGE
CASE 848D–03
ISSUE D
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS
COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE
PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED AT DATUM
PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING
PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER
SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION.
DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH
TO EXCEED 0.46 (0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR PROTRUSION 0.07
(0.003).
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
VIEW AA
AB
AB
VIEW Y
SECTION AB–AB
ROTATED 90
_
CLOCKWISE
DIM
AMIN MAX MIN MAX
INCHES
10.00 BSC 0.394 BSC
MILLIMETERS
A1 5.00 BSC 0.197 BSC
B10.00 BSC 0.394 BSC
B1 5.00 BSC 0.197 BSC
C––– 1.70 ––– 0.067
C1 0.05 0.20 0.002 0.008
C2 1.30 1.50 0.051 0.059
D0.20 0.40 0.008 0.016
E0.45 0.030
F0.22 0.35 0.009 0.014
G0.65 BSC
0.75 0.018
0.026 BSC
J0.07 0.20 0.003 0.008
K0.50 REF 0.020 REF
R1 0.08 0.20 0.003 0.008
S12.00 BSC 0.472 BSC
S1 6.00 BSC 0.236 BSC
U0.09 0.16 0.004 0.006
V12.00 BSC 0.472 BSC
V1 6.00 BSC 0.236 BSC
W0.20 REF 0.008 REF
Z1.00 REF 0.039 REF
C
L
–X–
X=L, M, N
1
13
14 26
27
39
4052
4X 13 TIPS
4X
N0.20 (0.008) H L–M N0.20 (0.008) T L–M
SEATING
PLANE
C
0.10 (0.004) T
4X
q
3
4X
q
2
S
0.05 (0.002)
0.25 (0.010)
GAGE PLANE
C2
C1
W
K
E
Z
S
L–M
M
0.13 (0.005) N S
T
PLATING BASE METAL
D
JU
B V
B1
A
S
V1
A1
S1
–L–
–N–
–M–
–H–
–T–
q
1
q
G
θ
1
θ
θ
3
θ
2
07
__
12
_
07
__
0
_
0
_
––– –––
REF 12
_
REF
3X VIEW Y
VIEW AA
2X R R1
12
_
REF 12
_
REF
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–73
56–Pin Packages
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1202–01
ISSUE A
S
U
M
0.12 (0.005) V S
T
S
U
M
0.254 (0.010) T
–V–
B
A
L
K
–U–
56X REF
PIN 1
IDENT.
128
2956
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A13.90 14.10 0.547 0.555
B6.00 6.20 0.236 0.244
C––– 1.10 ––– 0.043
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.50 BSC 0.0197 BSC
H0.12 ––– 0.005 –––
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.17 0.27 0.007 0.011
K1 0.17 0.23 0.007 0.009
L7.95 8.25 0.313 0.325
M0 8 0 8
ÇÇÇÇ
ÇÇÇÇ
ÉÉ
ÉÉ
–W–
DETAIL E
J
K1
K
J1
SECTION N–N
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
0.076 (0.003)
SEATING
D
–T–
PLANE
C
GH
M
0.25 (0.010)
F
DETAIL E
N
N
____
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–74
68–Pin Package
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 779–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF
LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS
R AND U ARE DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
–N–
–L– –M–
BRKY
W
V
D
D
68 1
A
R
G
G1
E
J
VIEW S
C
Z
S
L–M
S
0.010 (0.25) N S
T
S
L–M
M
0.007 (0.18) N S
T
S
L–M
M
0.007 (0.18) N S
T
0.004 (0.10)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.18) N S
T
S
L–M
M
0.007 (0.18) N S
T
S
L–M
S
0.010 (0.25) N S
T
S
L–M
M
0.007 (0.18) N S
T
S
L–M
M
0.007 (0.18) N S
T
X
Z
G1
VIEW D–D
U
B
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.985 0.995 25.02 25.27
B0.985 0.995 25.02 25.27
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.950 0.956 24.13 24.28
U0.950 0.956 24.13 24.28
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.910 0.930 23.12 23.62
K1 0.040 ––– 1.02 –––
____
K1
K
F
H
VIEW S
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–75
Programmable Array
84–Pin Package
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 780A–01
ISSUE A
NOTES:
1. DATUMS –L–, –M–, –N–, AND –P–
DETERMINED WHERE TOP OF LEAD
SHOULDER EXITS PACKAGE BODY AT GLASS
PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
GLASS PROTRUSION. ALLOWABLE GLASS
PROTRUSION IS 0.25 (0.010) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
–L– –M–
–P–
–N– YBRK
W
D
D
V
84 1
S
L
M
0.18 (0.007) –M S
TS
N–P
S
S
L
M
0.18 (0.007) –M S
TS
N–P
S
A
R
G
G1
S
L
S
0.25 (0.010) –M S
TS
N–P
S
C
Z
J
E
DETAIL S
0.100 (0.004)
–T–
SEATING
PLANE
S
N
M
0.25 (0.010) –P S
TS
L–M
S
S
L
M
0.18 (0.007) –M S
TS
N–P
S
S
N–P
SM
0.18 (0.007) T S
L–M
S
S
N–P
SM
0.18 (0.007) T S
L–M
S
B
U
Z1
G1
X
DETAIL D–D
S
N–P
SM
0.18 (0.007) T S
L–M
S
H
K1
KF
DETAIL S
S
L
M
0.18 (0.007) –M S
TS
N–P
S
S
N–P
SM
0.18 (0.007) T S
L–M
S
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.185 1.195 30.10 30.35
B1.185 1.195 30.10 30.35
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.021 0.33 0.53
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R1.150 1.156 29.21 29.36
U1.150 1.156 29.21 29.36
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 1.110 1.130 28.20 28.70
K1 0.040 ––– 1.02 –––
Z1 2 10 2 10
____
____
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–76
Programmable Array
128–Pin Package
DD SUFFIX
PLASTIC QFP PACKAGE
CASE 862A–02
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A27.90 28.10 1.098 1.106
B27.90 28.10 1.098 1.106
C––– 4.07 ––– 0.160
D0.30 0.45 0.012 0.018
E3.17 3.67 0.125 0.144
F0.30 0.40 0.012 0.016
G0.80 BSC 0.032 BSC
H0.25 0.35 0.010 0.014
J0.13 0.23 0.005 0.009
K0.65 0.95 0.026 0.037
L24.80 REF 0.976 REF
M5 16 5 16
N0.13 0.17 0.005 0.007
P0.40 BSC 0.016 BSC
Q0 7 0 7
R0.13 0.30 0.005 0.012
S30.95 31.45 1.219 1.238
T0.13 ––– 0.005 –––
U0 ––– 0 –––
V30.95 31.45 1.219 1.238
W0.40 ––– 0.016 –––
X1.60 REF 0.063 REF
Y1.60 REF 0.063 REF
Z1.60 REF 0.063 REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D–TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OF THE
FOOT.
–B–
_
_
_
_
_
_
_
_
_
_
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
S
A–B
M
0.20 (0.008) D S
C
N
F
D
J
DETAIL B
–A–, –B–, –D–
P
DETAIL A
–H–
K
X
DETAIL C
W
T
R
U
Q
DATUM
PLANE
–A–
L
Y
LB
S
A
M
96
97 64
65
128
132
33
0.05 (0.002) A–B
0.10 (0.004)
0.05 (0.002) D
–D–
Z
V
DETAIL A
SEATING
DATUM
PLANE
PLANE
E
C
H
G
DETAIL C
–C–
DETAIL B
–H–
M
BASE
METAL
S
A–B
M
0.20 (0.008) D S
C
S
A–B
M
0.20 (0.008) D S
C
S
A–B
M
0.20 (0.008) D S
H
S
A–B
M
0.20 (0.008) D S
H
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–77
Programmable Array
160–Pin Package
DH SUFFIX
PLASTIC QFP PACKAGE
CASE 864A–03
ISSUE C
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
DETAIL C
–H–
–B–
–A–
–D–
LY
DETAIL A
BV
L
Z
A
S
S
A–B
M
0.20 (0.008) D S
H
A–B0.20 (0.008)
S
A–B
M
0.20 (0.008) D S
C
S
A–B
M
0.20 (0.008) D S
H
S
A–B
M
0.20 (0.008) D S
C
DETAIL A
G
P
–A–, –B–, –D–
B
B
–H–
–C–
E
C
M
U
WK
X
Q
R
T
H
SEATING
PLANE
_
_
_
0.10 (0.004)
S
A–B
M
0.13 (0.005) D S
C
D
N
F
J
BASE
METAL
SECTION B–B
DETAIL C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OR THE FOOT.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A27.90 28.10 1.098 1.106
B27.90 28.10 1.098 1.106
C3.35 3.85 0.132 0.152
D0.22 0.38 0.009 0.015
E3.20 3.50 0.126 0.138
F0.22 0.33 0.009 0.013
G0.65 BSC 0.026 REF
H0.25 0.35 0.010 0.014
J0.11 0.23 0.004 0.009
K0.70 0.90 0.028 0.035
L25.35 REF 0.998 REF
M5 16 5 16
N0.11 0.19 0.004 0.007
P0.325 BSC 0.013 BSC
Q0 7 0 7
R0.13 0.30 0.005 0.012
S31.00 31.40 1.220 1.236
T0.13 ––– 0.005 –––
U0 ––– 0 –––
V31.00 31.40 1.220 1.236
W0.40 ––– 0.016 –––
X1.60 REF 0.063 REF
Y1.33 REF 0.052 REF
Z1.33 REF 0.052 REF
____
____
__
A–B0.20 (0.008)
TOP &
BOTTOM
1
160
40
41
80
81120
121
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–78
Programmable Array
181–Pin Package
HI SUFFIX
CERAMIC PGA PACKAGE
CASE 768N–01
ISSUE O
PIN 1 INDENTIFICATION
A
BM
CK
F
N
L
SEATING
PLANE B0.030 (0.76) MTASS
0.015 (0.38) MT
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
AMIN MAX MIN MAX
MILLIMETERS
1.555 1.595 39.50 40.51
INCHES
B1.555 1.595 39.50 40.51
C0.102 0.124 2.59 3.15
D0.016 0.020 0.41 0.51
F0.040 0.060 1.02 1.52
G0.100 BSC 2.54 BSC
K0.110 0.150 2.79 3.81
L0.043 0.057 1.09 1.45
M0.655 0.675 16.64 17.15
N0.090 0.110 2.29 2.79
G
G
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
181 PLD
–T–
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–79
Programmable Array
208–Pin Package
DK SUFFIX
PLASTIC QFP PACKAGE
CASE 872A–01
ISSUE O
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
DIM
AMIN MAX MIN MAX
INCHES
27.90 28.10 1.098 1.106
MILLIMETERS
B27.90 28.10 1.098 1.106
C3.45 4.10 0.136 0.161
D0.14 0.30 0.005 0.012
E3.20 3.60 1.126 0.142
F0.14 0.26 0.005 0.010
G0.50 BSC 0.020 BSC
H0.25 0.35 0.010 0.014
J0.09 0.20 0.003 0.008
K0.70 0.90 0.027 0.036
L25.50 REF 1.004 REF
M5
N0.09 0.18 0.003 0.007
P0.25 BSC 0.010 BSC
Q
R0.13 0.30 0.005 0.012
S31.00 31.40 1.220 1.236
T0.13 ––– 0.005 –––
U––– –––
V31.00 31.40 1.220 1.236
W0.40 ––– 0.016 –––
X1.60 REF 0.063 REF
Y1.25 REF 0.049 REF
Z1.25 REF 0.049 REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.38 (0.015).
_
9
_
5
_
9
_
0
_
7
_
0
_
7
_
0
_
0
_
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
0.05 (0.002) A–B
D0.20 (0.008) MC A–B SS
BV
DETAIL A
152
53
104
105
156
157
208
Z
A
S
A–B0.20 (0.008) MHD
SS
0.05 (0.002) A–B
D0.20 (0.008) MC A–B SS
M
M
0.10 (0.004)
DETAIL C
DATUM
PLANE
D0.06 (0.002) MC A–B SS
P
U
Q
T
R
W
K
X
B
B
N
F
D
J
BASE METAL
L
Y
SECTION B–B
DETAIL A DETAIL C
–A–
–B–
–D–
L
–A–, –B–, –D–
ROTATED 7 CCW
_
–H–
–C–
SEATING
PLANE
C
H
E
GDETAIL B
DETAIL B
–H–
DATUM
PLANE
D0.20 (0.008) MH A–B SS
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–80
Programmable Array
224–Pin Package
KE SUFFIX
PIN GRID ARRAY PACKAGE
CASE 860F–01
ISSUE O
NOTES:
1. DIMENSIONS ARE IN INCHES.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. MINIMUM SPACING BETWEEN CONDUCTORS
SHALL BE 0.020.
DIM MIN MAX
INCHES
A0.070 0.145
D1.740 1.780
E1.740 1.780
L0.100 0.200
Q0.045 0.075
C
B
A
SEATING
PLANE
224X
M
0.010 C
M
0.030 C M
AM
B
0.008 C
L
E
D
A
Q
0.020
0.016
1716151413121110987654321
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
16X 0.100
16X 0.100
0.080 MAX
0.080 MAX
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–81
Programmable Array
256–Pin Package
BG SUFFIX
PLASTIC BGA PACKAGE
CASE 1208A–01
ISSUE O
2120181716151413121110987654321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
DIM MIN MAX
MILLIMETERS
A1.92 2.32
A1 0.50 0.70
A2 0.36 REF
A3 1.12 1.22
b0.60 0.90
D27.00 BSC
E27.00 BSC
F24.00 24.70
G24.00 24.70
e1.27 BSC
S0.635 BSC
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
3
X
X0.25 YZ
_
A
ROTATED 90 CLOCKWISE
D
FM
M
Y
Z
G
E
0.20
4
DETAIL K
20X e
S
DETAIL K
256X b
20X e
S
VIEW M–M
0.15 Z
0.35 Z
A3
A2
A1
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–82
Programmable Array
299–Pin Package
HV SUFFIX
PIN GRID ARRAY PACKAGE
CASE 861B–01
ISSUE O
NOTES:
1. DIMENSIONS ARE IN INCHES.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. MINIMUM SPACING BETWEEN CONDUCTORS
SHALL BE 0.020.
DIM MIN MAX
INCHES
A0.070 0.145
D2.040 2.080
E2.040 2.080
L0.100 0.200
Q0.045 0.075
C
B
A
SEATING
PLANE
224X
M
0.010 C
M
0.030 C M
AM
B
0.008 C
L
E
D
A
Q
0.020
0.016
1716151413121110987654321
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
16X 0.100
16X 0.100
0.080 MAX
0.080 MAX
S0.050 BSC
V
W
Y
181920
Motorola Master Selection Guide TTL, ECL, CMOS and Special Logic Circuits3.1–83
Packaging Information
Surface Mount
Why Surface Mount?
Surface Mount Technology is utilized to offer answers to
many problems that have been created in the use of insertion
technology.
Limitations have been reached with insertion packages
and PC board technology. Surface Mount Technology
offers the opportunity to continue to advance the state–
of–the–art designs that cannot be accomplished with
Insertion Technology.
Surface Mount Packages allow more optimum device
performance with the smaller Surface Mount configuration.
Internal lead lengths, parasitic capacitance and inductance
that placed limitations on chip performance have been
reduced.
The lower profile of Surface Mount Packages allows more
boards to be utilized in a given amount of space. They are
stacked closer together and utilize less total volume than
insertion populated PC boards.
Printed circuit costs are lowered with the reduction of the
number of board layers required. The elimination or reduction
of the number of plated through holes in the board, contributes
significantly to lower PC board prices.
Automatic placement equipment is available that can place
Surface Mount components at the rate of a few thousand per
hour to hundreds of thousands of components per hour.
Surface Mount Technology is cost effective, allowing the
manufacturer the opportunity to produce smaller units and/or
offer increased functions with the same size product.
Surface Mount assembly does not require the preparation
of components that are common on insertion technology lines.
Surface Mount components are sent directly to the assembly
line, eliminating an intermediate step.
Pin Conversion Tables
Dual–in–Line Package to PLCC Pin Conversion Data
The following table gives the equivalent I/O pinouts of Dual–In–Line Package (DIP) configuration and Plastic Leaded Chip
Carrier (PLCC) packages.*
Conversion Tables
8 PIN DIP 1 2 3 4 5 6 7 8
20 PIN PLCC 2 5 7 10 12 15 17 20
14 PIN DIP 1 2 3 4 5 6 7 8 9 10 11 12 13 14
20 PIN PLCC 2 3 4 6 8 9 10 12 13 14 16 18 19 20
16 PIN DIP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
20 PIN PLCC 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20
20 PIN DIP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
20 PIN PLCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
24 PIN DIP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
28 PIN PLCC 2 3 4 5 6 7 9 10 11 12 13 14 16 17 18 19 20 21 23 24 25 26 27 28
* The MC1648 has a Non–Standard Conversion Table. For more information, refer to the Motorola MECL Data Book, DL122/D.
Motorola Master Selection GuideTTL, ECL, CMOS and Special Logic Circuits 3.1–84
Tape and Reel
Logic Integrated Circuits
Motorola’s tape and reel packaging fully conforms to the latest EIA RS–481A specification. The antistatic embossed tape pro-
vides a secure cavity sealed with a peel–back cover tape.
Mechanical Polarization
PLCC Devices
General Information
— Reel Size 13 inch (330 mm) Suffix: R2 — Units/Reel 500 to 5000 (see table)
— Tape Width 12 mm to 24 mm (see table)
Ordering Information
To order devices which are to be delivered in Tape and Reel, add the suffix R2 to the device number being ordered.
SOIC Devices
Linear direction of travel
PIN 1
View from
tape side
Typical
Linear direction of travel
View from
tape side
Typical
Tape and Reel Data
Device Type Tape Width
(mm) Device/Reel Reel Size
(inch) Min Lot Size Per Part No.
Tape and Reel
PLCC–20
PLCC–28
SO–8
SO–14
SO–16
SO–16 Wide
SO–20 Wide
16
24
12
16
16
16
24
1,000
500
2,500
2,500
2,500
1,000
1,000
13
13
13
13
13
13
13
3,000
500
5,000
5,000
5,000
5,000
5,000
