2001 Apr 27 Rev.2 6 www.phycomp-components.com
Phycomp Product specification
High-precision chip resistors
sizes 1206, 0805 and 0603 RC04H/RC14H/RC24H
0.25%
TESTS AND REQUIREM ENTS
Essent iall y all tes ts are ca rri ed out in acc orda nce with the
schedule of “IEC publication 60115-8”, category
55/125/56 (rated temperatur e range −55 to +125 °C;
damp heat, long term, 56 days).
The testing also covers the requirements specified by
EIA and EIAJ .
The tests are carried out in accordance with
IEC publication 60068, “Recommended basic clima t ic
and mechanical robustness testing procedure for
electronic components” and under sta nda rd atmosphe ri c
condi tions in acco rdance with “IEC 60068-1”,
subclause 5.3.
Unless otherwise specified the following values apply:
Temperatur e: 15 °Cto35°C
Relative humidity: 45% to 75%
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
In Table 4 the tests and requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8 and 60068”; a short
description of the test procedure is also given. In some
instanc es deviations fro m the IEC recommenda tions were
necessary for our method of specifying.
All solder ing tes ts are per formed with mil dly acti vated fl ux.
Table 4 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1 visual
examination no holes; clean surface;
no visible damage
4.5 resistance applied voltage (0 to −10%): R - Rnom: max. ±0.25%
100 Ω≤R<1kΩ: 1 V
1kΩ≤R<10 kΩ: 3 V
10 kΩ≤R<100 kΩ: 10 V
100 kΩ≤R<1MΩ: 25 V
R≥1MΩ: 50 V
4.17 20 (Ta) solderability unmounted chips compl etely immersed f or
2±0.5 s in a solder bath at 235 ±2 °Cgood tinning (≥95% covered);
no visible damage
4.18 20 (Tb) resistance to
solde ring heat unmounted chips; 10 ±1s;260±5°C no visible damage
∆R/R max.: ±(0.25% + 0.05 Ω)
4.13 short time
overload room temperature; dissipation = 6.25 ×Pn;
5 s (voltage not more than 2 ×Vmax)∆R/R max.: ±(0.5% + 0.05 Ω)
4.33 bending resistors mounted on a 90 mm glass
epoxy resin PCB (FR4),
bending:
3 mm for 1206; 5 m m for 0805 and 0603
no visible damage
∆R/R max.: ±(0.25% + 0.05 Ω)
4.19 14 (Na) rapid change of
temperature 30 minutes at LCT and
30 minutes at UCT; 5 cycles no visible damage
∆R/R max.: ±(0.25% + 0.05 Ω)
4.6.1.1 insulation
resistance voltage (DC) after 1 minute, metal block
method; 100 V Rins min . : 100 0 MΩ
4.24.2 3 (Ca) damp heat
(steady state) 56 days; 40 ±2°C; 93 +2/−3% RH;
loaded with 0.01 Pn:
R≤1MΩ∆R/R max.: ±(1.0% + 0.1 Ω)