FSA1258 - Fairchild Semiconductor

March 2004

Revised January 2005

FSA1256 • FSA1257 • FSA1258 Low RON Low Voltage Dual SPST Analog Switch

FSA1256 • FSA1257 • FSA1258

Low RON Low Voltage Dual SPST Anal og Switch

General Description

The FSA1256, FSA1257, and FSA1258 are high perfor-

mance dual Single Pole/Single Throw (SPST) analog

switches. These devices feature ultra low RON of 1.1Ω

maximum at 4.5V VCC and will operate ove r the wide VCC

range of 1.65V to 5.5V. T hese devices are fabric ated with

sub-micron CMOS technology to achieve fast switching

speeds and are designed for break-before-make operation.

The select input is TTL level compatible. The FSA1256 fea-

tures two Normally Open (NO) switches. The FSA1257

features two Normally Closed (NC) switches. The

FSA1258 has one NO swi tch and one NC switch.

Features

■Maximum 1.1Ω On Resistance (RON) for 4.5V supply

■0.4Ω max RON flatness for 4.5V supply

■Space saving Pb-Free MicroPak packagin g

■Broad VCC operating range: 1.65V to 5.5V

■Fast turn-on and turn-off time

■FSA 1258 features break- before-make enable circuitry

■Over-voltage tolerant TTL compatible control input

Ordering Code:

Pb-F ree packag e per JEDE C J- ST D -020 B.

Analog Symbols

FSA1256

(Top Through View)

FSA1257

(Top Through View)

Truth Tables

H = HIGH Logic Level L = LOW Logic Le v el

MicroPak is a trad em ark of Fairchild Sem icond uc t or Corporation.

Product Packag e Desc ri pt ion Supplied AsOrder Package Code

Number Numbe r Top Mark

FSA1256L8X MAC08A EB Pb-Free 8-Lead MicroPak, 1.6 mm Wide 5K Units on Tape and Reel

FSA1257L8X MAC08A EC Pb-Free 8-Lead MicroPak, 1.6 mm Wide 5K Units on Tape and Reel

FSA1258L8X MAC08A ED Pb-Free 8-Lead MicroPak, 1.6 mm Wide 5K Units on Tape and Reel

FSA1256

Control Input(s) Function

L Disconnect

H A Connected to B

FSA1257

Control Input(s) Function

L A Connected to B

H Disconnect

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FSA1256 • FSA1257 • FSA1258

Analog Symbol

FSA1258

(Top Through View)

Truth Table

H = HIGH Logi c Level

L = LOW Logic Lev el

Pin Descriptions

FSA1258

Control Input 1S Function Control Input 2S Function

L 1A Connected to 1B L Disconnect

H Disconnect H 2A Connected to 2B

Pin Names Function

A, B Data Port s

S Control Input

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FSA1256 • FSA1257 • FSA1258

Absolute Maximum Ratings(Note 1) Recommended Operating

Conditions

Note 1: The “Abso lute Maxim um Ratings ” are those val ues beyond w hich

the saf ety of the device cannot be gu aranteed. Th e device shou ld not be

operated at these limits. The parametric values defined in the Electrical

Char ac teristics tabl es are n ot gu aranteed a t t he absolute m ax imum r atings.

The “Re comm ended Operat ing Co ndition s” table will de fine th e cond itions

for actu al device operation.

Note 2: The input and output negative voltage ratings may be exceeded if

the in put an d output diode cu rrent ratings are obser v ed.

Note 3: Unused inputs must be held HIGH or LOW. They may not float.

DC Electrical Characteristics (All typical values are @ 25°C unless otherwise specified)

Note 4: On Resistanc e is determined by t he voltage drop betw een A and B pins at the indicat ed c urrent th rough th e s w it ch .

Note 5: ∆RON = RONmax − RONmin measured at identical VCC, temper at ure, and vo lt age.

Note 6: Flatness is de f ined as the difference betwee n t he maxim um and m inimum value of On Resistance ove r th e s pecified range of conditions.

Supply Voltage (VCC)−0.5V to +6.0V

Switch Voltage (VS) (Note 2) −0.5V to VCC + 0.5V

Input Voltage (VIN) (Note 2) −0.5V to +6.0V

Input Diode Current −50 mA

Switch Current 200 mA

Peak Swit ch Current (Pulsed at

1 ms duration, <10% Duty Cycle) 400 mA

Power Dissipation @ 85°C

MicroPak 8L package 180 mW

Storage Temperature Range (TSTG)−65°C to +150°C

Maximum Junction Temperature (TJ)+150°C

Lead Temperature (TL)

Soldering, 10 seconds +260°C

ESD

Human Body Model 5.5kV

Supply Voltage (VCC) 1.65V to 5.5V

Control Input Voltage (VIN) (Note 3) 0V to VCC

Switch Input Voltage (VIN)0V to V

Operating Temperature (TA)−40°C to +85°C

Thermal Resistance (θJA) in still air

MicroPak 8L package 224°C/W

(modeled)

Symbol Parameter VCC TA = +25°CT

A= −40°C to +85°CUnits Conditions

(V) Min Typ Max Min Max

VIH Input Voltage High 2.7 to 3.6 2.0 V

4.5 to 5.5 2.4

VIL Input Voltage Low 2.7 to 3.6 0.6 V

4.5 to 5.5 0.8

IIN Control Input Leakage 2.7 to 3.6 −1.0 1.0 µAV

IN = 0V to VCC

4.5 to 5.5 −1.0 1.0

INO(OFF), OFF-Leakage Current 5.5 -2.0 2.0 −20.0 20.0 nA A = 1V, 4.5V

INC(OFF) 1B or 2B = 1V, 4.5V

RON Switch On Resistance 2.7 2.6 4.0 4.3 ΩIOUT = 100 mA, 1B or 2B = 1.5V

(Note 4) 4.5 0.95 1.18 1.3 IOUT = 100 mA, 1B or 2B = 3.5V

∆RON On Resistance Matching ΩBetween Channels 4.5 0.06 0.12 0.15 IOUT = 100 mA, 1B or 2B = 3.5V

(Note 5)

RFLAT(ON) On Resistance Flatness 2.7 1.4 ΩIOUT = 100 m A, 1 B or 2B = 0V, 0.75V, 1.5 V

(Note 6) 4.5 0.2 0.3 0.4 IOUT = 100 mA, 1B or 2B = 0V, 1V, 2V

ICC Quiescent Supply Current 3.6 0.1 0.5 1.0 µAV

IN = 0V or VCC, IOUT = 0V

5.5 0.1 0.5 1.0

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FSA1256 • FSA1257 • FSA1258

AC Electrical Characteristi cs (All typical value are @ 25°C unless otherwise specified)

Capacitance

Symbol Parameter VCC TA = +25°CT

A= −40°C to +85°CUnits Conditions Figure

(V) Min Typ Max Min Max Number

tON Turn ON Time 2.7 to 3.6 15.0 50.0 60.0 ns 1B or 2B = 1.5V, RL = 50Ω, CL = 35 pF Figure 1

4.5 to 5.5 10.0 35.0 40.0 1B or 2B = 3.0V, RL = 50Ω, CL = 35 pF

tOFF Turn OFF Time 2.7 to 3.6 4.0 20.0 30.0 ns 1B or 2B = 1.5V, RL = 50Ω, CL = 35 pF Figure 1

4.5 to 5.5 8.0 15.0 20.0 1B or 2B = 3.0V, RL = 50Ω, CL = 35 pF

tB-M Break-Before-Make 2.7 to 3.6 12.0 ns 1B or 2B = 1.5V, RL = 50Ω, CL = 35 pF Figure 2

Time 4.5 to 5.5 7.0 1B or 2B = 3.0V, RL = 50Ω, CL = 35 pF

Q Charge Injection 2.7 to 3.6 10.0 pC CL = 1.0 nF, VGEN = 0V, Figure 4

4.5 to 5.5 20.0 RGEN = 0Ω

OIRR OFF-Isolation 2.7 to 3.6 −70.0 dB f = 1MHz, RL = 50ΩFigure 3

4.5 to 5.5 −70.0

Xtalk Crosstalk 2.7 to 3.6 −100 dB f = 1MHz, RL = 50ΩFigure 6

4.5 to 5.5 −100

BW −3db Bandwidth 2.7 to 3.6 300 MHz RL = 50ΩFigure 7

4.5 to 5.5 300

THD Total Harmonic 2.7 to 3.6 0.002 %RL = 600Ω, VIN = 0.5V P.P, Figure 8

Distortion 4.5 to 5.5 0.002 f = 20Hz to 20kHz

Symbol Parameter VCC TA = +25°CT

A = 40°C to +85°CUnits Conditions

(V) Min Typ Max Min Max

CIN Control Pin Input Capacitance 0.0 3.0 pF f = 1MHz (see Figure 6)

COFF B Port OFF Capacitance 4.5 11.5 pF f = 1MHz (see Figure 6)

CON A Port ON Capacitance 4.5 27.0 pF f = 1MHz (see Figure 6)

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FSA1256 • FSA1257 • FSA1258

AC Loading and Waveforms

CL includes Fixtu re and Stray Capacitance Logic Input Waveforms Inverted

for Switches that have the Opposite Logic Sense

FIGURE 1. Turn-On/Turn-Off Timing

FIGURE 2. Break-Before-Make Timing

FIGURE 3. OFF Isolation

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FSA1256 • FSA1257 • FSA1258

AC Loading and Waveforms (Continued)

Q = (∆VOUT)(CL)

FIGURE 4. Charge Injection

FIGURE 5. Cro sst alk

FIGURE 6. ON/OFF Capacitance Measurement Setup

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FSA1256 • FSA1257 • FSA1258

AC Loading and Waveforms (Continued)

FIGURE 7. Bandwid th

FIGURE 8. Harmonic Distortion

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FSA1256 • FSA1257 • FSA1258

Tape and Reel Specification

Tape Format For Micropak

REEL DIMENSIONS inches (millimeters)

Package Tape Number Cavity Cover Tape

Designator Section Cavities Status Status

Leader (Start End) 125 (typ) Empty Sealed

L8X Carrier 5000 Filled Sealed

Trailer (Hub End) 75 (typ) Empty Sealed

Tape

Size ABCDN W1 W2 W3

8 mm 7.0 0.059 0.512 0.795 2.165 0.331 + 0.059/−0.000 0.567 W1 + 0.078/−0.039

(177.8) (1.50) (13.00) (20.20) (55.00) (8.40 + 1.50/−0.00) (14.40) (W1 + 2.00/−1.00)

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FSA1256 • FSA1257 • FSA1258 Low RON Low Voltage Dual SPST Analog Switch

Physical Dimensions inches (millimeters) unless otherwise noted

Pb-Free 8-Lead MicroPak, 1.6 mm Wide

Package Number MAC08A

Fairchild does not assume an y responsibility for u se of any circuitry descr ibed, no circuit pat ent licenses are implied and

Fairchild reserves the right at any time without notice to change said circuitry and specifications.

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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD

SEMICONDUCTOR CORPORATION. As used herein:

1. Life suppor t de vices o r syst ems are dev ic es or syste ms

which, (a) are intended for surgical implant into the

body, or (b) support or sustain life, and (c) whose failure

to perform when properly used in accordance with

instruct ions fo r use pr ovi de d in the l abe ling, can be rea-

sonably expected to result in a significant injury to the

user.

2. A crit ical componen t in any com ponen t of a life s uppor t

device or system whose failure to perform can be rea-

sonabl y e xpec ted to cause th e fa i lure of the l ife s upport

device or system, or to affect its safety or effectiveness.