AP5321GM-HF Halogen-Free Product Advanced Power Electronics Corp. DUAL N-CHANNEL ENHANCEMENT MODE POWER MOSFET Lower Gate Charge BVDSS 100V Simple Drive Requirement RDS(ON) 150m Fast Switching Characteristic ID 2.5A Halogen Free & RoHS Compliant Product D2 D2 D1 Description D1 Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, ultra low on-resistance and cost-effectiveness. G2 S2 G1 SO-8 S1 D2 D1 G2 G1 S1 S2 Absolute Maximum Ratings Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25 ID@TA=70 Rating Units 100 V +20 V 3 2.5 A 3 2 A Continuous Drain Current Continuous Drain Current 1 IDM Pulsed Drain Current 10 A PD@TA=25 Total Power Dissipation 2 W TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Rthj-a Parameter Value Unit Maximum Thermal Resistance, Junction-ambient 3 62.5 /W Data and specifications subject to change without notice 1 201003171 AP5321GM-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units 100 - - V BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA RDS(ON) Static Drain-Source On-Resistance2 VGS=10V, ID=2A - - 150 m VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 V gfs Forward Transconductance VDS=10V, ID=2A - 2.8 - S IDSS Drain-Source Leakage Current VDS=80V, VGS=0V - - 10 uA IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA ID=2A - 10 16 nC 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=80V - 2 - nC Qgd Gate-Drain ("Miller") Charge VGS=10V - 4 - nC VDS=50V - 6.5 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=2A - 7 - ns td(off) Turn-off Delay Time RG=3.3 - 14 - ns tf Fall Time VGS=10V - 3.5 - ns Ciss Input Capacitance VGS=0V - 420 672 pF Coss Output Capacitance VDS=25V - 60 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 40 - pF Min. Typ. IS=1.5A, VGS=0V - - 1.3 V Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage 2 Test Conditions Max. Units trr Reverse Recovery Time IS=2A, VGS=0V - 40 - ns Qrr Reverse Recovery Charge dI/dt=100A/s - 75 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 135 /W when mounted on Min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP5321GM-HF 20 12 o 6.0V 12 10V 8.0V 7.0V 6.0V 10 ID , Drain Current (A) 16 ID , Drain Current (A) T A = 150 o C 10V 8.0V 7.0V T A = 25 C 8 8 V G = 5.0V 6 4 V G = 5.0V 4 2 0 0 0 1 2 3 4 5 6 0 Fig 1. Typical Output Characteristics 4 6 8 10 Fig 2. Typical Output Characteristics 300 2.4 ID=2A V G =10V ID=2A T A =25 260 2.0 Normalized RDS(ON) RDS(ON) (m) 2 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) 220 180 140 1.6 1.2 0.8 100 0.4 4 5 6 7 8 9 10 -50 0 50 100 150 T j , Junction Temperature ( o C) V GS , Gate-to-Source Voltage (V) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 1.4 8 Normalized VGS(th) (V) 1.2 IS(A) 6 4 T j =150 o C T j =25 o C 1.0 0.8 2 0.6 0 0.4 0 0.2 0.4 0.6 0.8 1 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.2 -50 0 50 100 150 o T j , Junction Temperature ( C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP5321GM-HF f=1.0MHz 600 500 8 ID=2A C iss 400 V DS = 80V C (pF) VGS , Gate to Source Voltage (V) 10 6 300 4 200 2 100 C oss C rss 0 0 0 2 4 6 8 10 1 12 5 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 100 1 Normalized Thermal Response (Rthja) Duty factor=0.5 10 ID (A) Operation in this area limited by RDS(ON) 100us 1 1ms 10ms 100ms 0.1 0.01 1s DC o T A =25 C Single Pulse 0.2 0.1 0.1 0.05 0.02 PDM t 0.01 0.01 T Single Pulse Duty factor = t/T Peak Tj = PDM x Rthja + T a Rthja = 135/W 0.001 0.001 0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.1 1 10 100 1000 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 10V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4