This is information on a product in full production.
October 2014 DocID026812 Rev 1 1/9
DLPF-GP-01D3
Dual differential filter with integrated matching for
GreenPeak transceiver
Datasheet - production data
Features
•Nominal Input / conjugate match to GreenPeak
•Low loss dual-channel differential filter
•Low loss dual-channel common-mode filter
•Small footprint < 1.2 x 3.4 mm²
•Very low profile (< 560 µm after reflow)
•High RF performance
•RF BOM and area reduction
Applications
•2.45 GHz impedance matched dual-differential
filter
•Optimized for GreenPeak GP540 and GP561
circuits
Description
The DLPF-GP-01D3 is an ultra miniature dual
differential filter tailored for GreenPeak
Zigbee/RF4CE RF transceivers.
The DLPF-GP-01D3 integrates also matching
network and replaces 16 SMD components.
Matching impedance has been customized for
GreenPeak Zigbee/RF4CE RF transceivers. It is
using STMicroelectronics IPD technology on non-
conductive Glass substrate which optimize RF
performances.
Figure 1. Reference sch em atic (a)
RF1P
GND1
RF1N
RF2P
GND2
RF2N
VCM
ANT1P
ANT1N
ANT2P
ANT2N
Bump view
a. Courtesy of GreenPeak.
*3
www.st.com
Absolute maxi mum rati ng s D LPF-GP-01D3
2/9 DocID026812 Rev 1
1 Absolute maximum ratings
Table 1. Absolute maxim um ratings (limiting value)
Symbol Parameter Value Unit
Min. Typ. Max.
PIN Input Power RFIN 20 dBm
VESD
ESD Ratings MIL STD883C (HBM:C=100 pF, R=1.5 kΩ, Air
discharge) 800 V
ESD ratings machine model (MM: C=200 pF, R=25 Ω,
L=500 nH) 550 V
TOP Operating temperature -40 +80 ºC
DocID026812 Rev 1 3/9
DLP F-GP-01D3 Electrical characteri stics
9
2 Electrical characteristics
Tabl e 2. Im pedances
Symbol Parameter Value Unit
Min. Typ. Max.
ZOUT Nominal differential output impedance -
Conjugate
match to
GreenPeak IC
-Ω
ZIN Nominal differential input impedance - 100 - Ω
Table 3. RF performance
Symbol Parameter Test condition Value Unit
Min. Typ. Max.
TOP Operating temperature - -40 +80 °C
f Frequency range (bandwidth) - 2400 2500 MHz
ILInsertion loss in bandwidth
Tj = 25 °C
-1.45 -1.7 dB
RL_ANT Return loss in bandwidth -16 -11 dB
RL_IC Return loss in bandwidth -15 -10.5 dB
2f0 2f0 attenuation -41 -37 dB
3f0 3f0 attenuation -34 -28 dB
Electri cal character istics DLPF-GP-01D3
4/9 DocID026812 Rev 1
2.1 RF measurements (on board)
Figure 2. Differential transmission Figure 3. DIFF mode insertion loss (dB)
Figure 4. DIFF mode - 2f0 second harmonic (dB) Figure 5. DIFF mode - 3f0 third harmonic (dB)
Figure 6. Return loss on ANT side (dB) Figure 7. Return loss on IC side (dB)
DocID026812 Rev 1 5/9
DLP F-GP-01D3 Packag e mecha nical da ta
9
3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 8. Mechanical specifications (bump view)
$173
$171
$173
$171
5)3
*1'
5)1
9&0
5)3
*1'
5)1
5)3
*1'
5)1
5)3
*1'
5)1
9&0
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$173
$171
PP
PP
P
Pack age mech ani cal data D LPF-GP-01D3
6/9 DocID026812 Rev 1
Figure 9. Layout recommendations
No extra components required thanks to DLPF-GP-01D3.
Dimensions (distances) from center pad to center pad (filter GP chip) shall be respected as
much as possible in order to avoid any deviation in performances.
Figu re 10 . Footpri nt - non s ol der mas k
defined Figure 1 1 . Footprint - solder mask defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Solder stencil opening:
220 µm recommended
Line to connect copper pad on solder mask opening
shopuld be smaller than copper pad diameter
Solder mask opening :
220 µm recommended
180 µm minimum
260 µm maximum
Copper pad diameter :
320 µm recommended
300 µm minimum
Solder stencil opening :
220 µm recommended
DocID026812 Rev 1 7/9
DLP F-GP-01D3 Packag e mecha nical da ta
9
Figure 14. Tape and reel speci fication
Not e : The dimen s ions s ho w n o n this propos e d d ra w in g a re for illustr ativ e p ur po s e. D im e ns ion s
from actual carrier may vary slightly
More information is available in the applicat ion notes AN2348: “Flip Chip: Package
description and recommendations for use”.
Figure 12. Marking specification Figure 13. Footprint coordinates
X Z Z
Y W W
$173
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$173
$171
5)3
*1'
5)1
9&0
5)3
*1'
5)1
5)1
*1'
5)3
5)1
*1'
5)3
9&0
$171
$173
$171
$173
O rderin g inf orm at i on D LP F- GP -0 1D 3
8/9 DocID026812 Rev 1
4 Ordering information
5 Revision history
Table 4. Ordering information
Part number Marking Weight Base qty Delivery mode
DLPF-GP-01D3 SW 4.43 mg 5000 Tape and reel
Table 5. Document revision history
Date Revision Changes
10-Oct-2014 1 Initial release.
DocID026812 Rev 1 9/9
DLPF-GP-01D3
9
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