a ee == Features e@ 256 x9, 512 x 9, 1,024 x 9, 2048 x 9, and 4096 x 9 FIFO buffer memory Dual-port RAM cell Asynchronous read/write High-speed 50.0-MHz read/write independent of depth/width Low operating power Iccy = 35 mA Half Full flag in standalone Empty and Full flags Retransmit in standalone Expandable in width and depth Parallel cascade minimizes bubble-through SV + 10% supply 300-mil DIP packaging 7x7 TQFP 300-mil SOJ packaging TTL compatible Three-state outputs Pin compatible and functional equivalent to IDT7200, IDT7201, IDT7202, IDT7203, and IDT7204 CYPRESS CY7C419/21/25/29/33 256 x 9,512 x9, 1K x9, 2K x9, 4K x 9 Cascadable FIFO Functional Description The CY7C419, CY7C420/L, CY7C424/5, CY7C428/9, and CY7C432/3 are first-in first-out (FIFO) memories offered in 600-mil wide and 300-mil wide packages. They are, respectively, 256, 512, 1,024, 2,048, and 4,096 words by 9-bits wide. Each FIFO memory is organized such that the data is read in the same sequential or- der that it was written. Full and Empty flags are provided to prevent overrun and underrun. Three additional pins are also provided to facilitate unlimited expansion in width, depth, or both. The depth expan- sion technique steers the control signals from one device to another in parallel, thus eliminating the serial addition of propaga- tion delays, so that throughput is not re- duced. Data issteered ina similar manner. The read and write operations may be asynchronous: each can occur at a rate of 50.0 MHz. The write operation occurs when the write (W) signal is LOW. Read occurs when read (R) goes LOW. The nine data outputs go to the high-impedance state when R is HIGH. A Half Full (HF) output flag is provided that is valid in the standalone and width ex- pansion configurations. In the depth ex- pansion configuration, this pin provides the expansion out (XO) information that is used to tell the next FIFO that it will be ac- tivaled, In the standalone and width expansion configurations, a LOW on the retransmit (RT) input causes the FIFOs to retransmit the data. Read enable (R) and write en- able (W) must both be HIGH during re- transmit, and then R is used to access the data, The CY7C419, CY7C420, CY7C421, CY7C424, CY7C425, CY7C428, CY7C429, CY7C432, and CY7C433 are fabricated using an advanced 0.65-micron P-well CMOS technology. Input ESD pro- tection is greater than 2000V and latch-up is prevented by careful layout and guard rings. Logic Block Diagram DATA INPUTS Pin Configurations (Dg ~Dg) PLCC/LCC DIP Top View Top View LITE TTT g See 2 oe? WRITE 4.3 2! 323130 W*) CONTROL +t RAM? ARAY 29 x9 12x9 28 WRITE tozax9 | READ 27 24 POINTER 2048x9 [\p4 POINTEA 70419 4096 x 9 70419 26 7C420/1 76421159 25 7C424/5, 70433 oA 704289 =< 33 7049213 THREE- 22 sTaTe \ Jeee > 14 21 BUFFERS Lh 14 15 1617 181920 DATA OUTPUTS SPAS HH (Qp-Qp) RESET ft MR 420-2 READ LOGIC. bg FLAT Ro CONTROL | fag = 4 EF q Loaic FF EXPANSION Xi w logic [OU . yojHF 420.1 5-15CY7C419/21/25/29/33 CYPRESS Selection Guide 256x9 7C419-10 | 7C4i9-15 | 7C419-20 | 7C419-25 | 7C419-30 | 7C41940 | 7C419-65 S12 x 9 (600-mil only) 7C420-20 | 70420-25 | 7C420-30 | 7C420-40 | 70420-65 S12x9 7C421-10 | 7C421-15 | 7C42120 | 7042125 | 7C421-30 | 7C42140 | 70421-65 1K x (600-mil only) 7CA2420 | 7C42425 | 7C424-30 | 7C42440 | 70424-65 IKx9 7C42510 | 7C425~15 | 7C42520 | 7C425-25 | 7C42530 | 70425-40 | 7C42565 2K x 9 (600-mil only) 7C42820 | 7C428-25 | 7C428-30 | 7C428-40 | 7C428-65 2K x9 7C429-10 | 70429-15 | 7429-20 | 70429-25 | 7C429-30 | 70429-40 | 7C042965 4K x 9 (600-mil only) 70432-2585 | 7C43230 | 7C43240 | 70432-65 4K x9 7C433-10 | 7C433-15 | 70433-20 | 7C433-25 | 7C433-30 | 7433-40 | 70433-65 Frequency (MHz) 50 40 33.3 28.5 25 20) 12.5 Maximum Access Time (ns) 10 [5 20 25 30 40 6S lec. (mA) 38 35 35 35 35 34 38 Pin Configurations (continued) Maximum Rating (Above which the useful life may be impaired, For user guidelines, TQFP hot tested.) Top View Storage Temperature oo... ee 68C to + 150C S8ae22ace Ambient Temperature with : | | | | Power Applied oo... 0006 eee ~S8"C to + 125C dy Hj | I Supply Voltage to Ground Potential... 0... -O.5V to +7.0V Dy! I, FF 0 8 28 aT 20S (Oy. in Heh Sta te Outputs ee -0.5V to +7.0V ne 2 234 a DC Input Voltage o.oo ee -0.5V to +7.0V NC! 4 eoneg 2 NC Power Dissipation . 0000... eee Tow nl 2 70433 a wa Output Current, into Outputs (LOW) .2 0006. 20mA Qo 17 18 | XOUHF. Statie Discharge Voltage... 0... ee >2000V a, g 7 |, (per MIL.-STID-883, Method 3015) 91011 1215141516 | Latch-Up Current: 220.000. >200 mA | 420.45 Operating Range eee z woo Range Temperature! Vee Commercial OPC to + 70C SV + 10% Industrial -40C to +88C SV + 10%. Military S8"C to +125"C SV + 10% Electrical Characteristics Over the Operating Rangel?! 7C41910, 15, 20, 25, 30, 40, 65 7C420/1-10, 15, 20, 25, 30, 40, 65 7C424/5 10, 15, 20, 25, 30, 40, 65 7C428/9 10, 15, 20, 25, 30, 40, 65 7C432/3~10, 15, 20, 25, 30, 40, 65 Parameter Description Test Conditions Min. Max. Unit Vou Output HIGH Voltage Voo = Min. oy = -2.0mA 24 Vv Vo. Output LOW Voltage Voc = Min. [op = 8.0 mA 0.4 Vv Vin Input HIGH Voltage Con] 2.0 Veco Vv Mil/Ind 22 Voc Vib Input LOW Voltage Note 3 0.8 v Tix Input Leakage Current GND < Vi < Voce 10 +10 WA loz. Output Leakage Current R > Vin, GND < Vo < Veo -10 +10 WA los Output Short Circuit Current!4l | Voc = Max. Vour = GND -90) mA 5-16CY7C419/21/25/29/33 CYPRESS Electrical Characteristics Over the Operating Rangel?! (continued) 7C419-10 | 7C419-15 | 7C419-20 | 7C419-25 7C420-20 | 7C420-25 7C421-10 | 70421-15 | 7C421-20 | 70421-25 7C424~20 | 7C42425 7C425-10 | 70425-15 | 7C42520 | 70425-25 7C42820 | 70428-25 7C0429-10 7C429-15 | 7C429-20 | 7C42925 7C432~-25 7C433~-10 | 7C433-15 | 7C433-20 | 70433-25 Parameter Description Test Conditions Min. | Max. | Min. | Max. | Min. | Max. | Min. | Max. | Unit lec Operating Current Voc = Max. |Com'l 85 65 55 SO {mA lout = OmA f= f MAX Mil/Ind 100 90 80 loc Operating Current Vec = Max, |Coml as 35 35 35 | mA lour = 0mA F = 20 MHz Ispy Standby Current All Inputs = | Com] 10 10 10 10 | mA Ving Min. 7 Mil/Ind IS 15 15 Ip? Power-Down Current All Inputs > | Com'l 4 5 5 5 mA Veco 0.2V - Mil/Ind 8 8 8 Electrical Characteristics Over the Operating Rangell (continued) 7C41930 7C419-40 7C41965 7C42030 7C42040 70420--65 7C421-30 7C421-40 70421 -65 7C424-30 70424-40 70424-65 7C425-30 7425-40 7C42565 7C428-30 7C42840 7C428-65 7C42930 7C429-40 71C429-65 7C43230 7C432-40 7C432-65 7C43330 7C433-40 70433 -65 Parameter Description Test Conditions Min. | Max. | Min. | Max. | Min. | Max. | Units lec Operating Current Voc = Max., Com! 40 35 35 mA lout =QmA tf = fmax Mil/Ind 75 70 65 leci Operating Current Veco = Max, Com'l 35 35 35 mA lout =(0mA F = 20 MHz Isp Standby Current All Inputs = Comt 10 10 10 mA Vin Min. - Mil 15 15 15 Isp2 Power-Down Current All Inputs > Com 5 5 5 mA Veo 0.2V - Mil 8 8 8 Capacitancel*! Parameter Description Test Conditions Max. Unit Cin Input Capacitance Ta = 28C, f = 1 MHz, 6 pF CouT Output Capacitance Voc = 4.5 6 pF Notes: 1. Ty is the instant on" case temperature. 2. See the last page of this specification for Group A subgroup testing in- formation. 3) Vii (Min.) = 2.0 for pulse durations of less than 20 ns. 4. For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds. Tested initially and after any design or process changes that may affect these parameters. 5-17a CYPRESS CY7C419/21/25/29/33 AC Test Loads and Waveforms R1 50082 SV 500 5v OUTPUT 4 OUTPUT 30 pF R2 I 33302 INCLUDING a+ INCLUDING JIG AND = C4206 JIG AND 5 pF SCOPE (a) SCOPE Equivalent to: THEVENIN EQUIVALENT 20022 OUTPUT o_-+_-10 2V R1 50002 1 i (b) R2 33382 C420.7 Switching Characteristics Over the Operating Rangel 1 ALL INPUT PULSES GND 7C419-10 7C419-15 FCAL920 7C41925 7C420- 20 7C42025 7C421-10 7C424-15 7C421-20 7C421-25 7424-20 FCA24 25 7C425-10 7C425-15 7C425 20 7CA2525 7C42820 7C42825 7C429-10 7C429-15 7429-20 7C42925 7C432-25 70433 -10 7C43315 70433 20 7C43325 Parameter Description Min. | Max. | Min. | Max. | Min. | Max. | Min. | Max. | Unit tre Read Cycle Time 20 2s 30 35 ns ta Access Time 10 {Ss 20 25 ns tRR Read Recavery Time 10 10 10 10 ns tpr Read Pulse Width 10 15 20 25 ns trea?) Read LOW to Low 7 3 3 3 3 ns tove9) | Data Valid After Read HIGH 5 5 5 5 ns tuzre el | Read HIGH to High Z 15 15 15 18 ns two Write Cycle Time 20 2s 30 38 ns tpw Write Pulse Width 10 15 20 25 ns tw] | Write HIGH to Low Z 5 5 5 5 ns twr Write Recovery Time 10 10 10 10 ns tsp Data Set-Up Time 6 8 12 15 ns THD Data Hold Time 0 i 0 0 ns IMRSC MR Cycle Time 20 25 30 38 ns tpMR MR Pulse Width 10 1S 20 25 ns tRMR MR Recovery Time 10 10 10 10 ns tRew Read HIGH to MR HIGH 10 15 20 25 ns twew Write HIGH to MR HIGH 10 1s 20 25 ns tric Retransmit Cycle Time 20 25 30) 35 ns tprt Retransmit Pulse Width 10 Is 20 25 ns trRre Retransmit Recovery Time 10 10 10 10 ns Notes: 6. Test conditions assume signal (ransition time of 3 ns or less, liming ref 8. typyig transition is measured at +200. mV fram Vo) and 200mV from erence levels of 1.5V and outpul loading of the specified Loy opp and 30) pF load capacitance, as in part (a) of AC Test Load and Waveforms, unless otherwise specified. 7, See the last page of this specification for Group A subgroup testing in- formation. S18 Vor. love transition is measured at the ESV level. try and ty zp transition is measured at + 100 mV from the steady state. hizk and toy use capacitance loading as in part (b) of AC Test Load and WaveformsCY7C419/21/25/29/33 CYPRESS Switching Characteristics Over the Operating Rangel. 7l (continued) 7C419-10 7C419-15 7C41920 IC41925 7C420-20 7C420-25 7C421-10 | 7C421-18 | 7421-20 | 7C421-25 7C424-20 7C42425 70425-10 7C425-15 7042520 7C425-25 7C428-20 7C42825 70429-10 7C429-15 70429-20 7C429-25 7C43225 7C433-10 7C43315 7C43320 7C43325 Parameter Description Min. | Max. | Min. | Max. | Min. | Max. | Min. | Max. | Unit (EFL MR to EF LOW 20 25 30 35 ns tHrH MR to HF HIGH 20 25 30 35 ns teFH MR to FF HIGH 20 25 30 35 ns tREE Read LOW to EF LOW 10 15 20 25 ns tRFF Read HIGH to FF HIGH 10 15 20 25 ns twer Write HIGH to EF HIGH 10 15 20 25 ns twrr Write LOW to FF LOW 10 [5 20 25 ns tWHE Write LOW to HF LOW 10 15 20 25 ns trHE Read HIGH to HF HIGH 10 15 20 25 ns IRAE Effective Read from Write HIGH 10 15 20 25 ns trpE Effective Read Pulse Width After EF HIGH | 10 [5 20 25 ns tWAF Effective Write from Read HIGH 10 15 20 25 ns twpr Effective Write Pulse Width After FF HIGH | 10 15 20 25 ns {xo1. Expansion Out LOW Delay from Clock 10 15 20 25 ns txon Expansion Out HIGH Delay from Clock 10 15 20 25 ns 5-19CY7C419/21/25/29/33 Switching Characteristics Over the Operating Rangel 7} (continued) 7C419-30 7CA19-40 IC419-65 70-420-30 7C420-40 7C 420-65 7C421-30 7C421-40 7C421~65 70-42430 7C42440 7C 424-65 70425 30 7C42540 7C42565 7C42830 7C428~40 70428 ~65 7C429-30 7C429-40 70429-65 7C43230 7C43240 70432 -65 7C43330 7C43340 710433 65 Parameter Description Min. Max. Min. Max, Min. Max, Unit tre Read Cycle Time 40 50 80 ns ta Access Time 30 4 65 ns trR Read Recovery Time 10 10 15 ns IpR Read Pulse Width 30 40 65 ns terol Read LOW to Low Z 3 3 3 ns toyReel Data Valid After Read HIGH 5 5 5 ns tiizRP 8] Read HIGH to High Z Ww 20 20 ns two Write Cycle Time 40 50 80 ns tpw Write Pulse Width 30 40 65 ns thwzl sl Write HIGH to Low Z 5 5 5 ns twr Write Recovery Time 10 0 15 ns tsp Data Set-Up Time 18 20 30 ns tip Data Hold Time 0 0 0 ns IMRSC MR Cycle Time 40) 50 80 ns IpMR MR Pulse Width 30 40 AS ns tRMR MR Recovery Time 10 10 1s ns trew Read HIGH to MR HIGH 30 40 65 ns twew Write HIGH to MR HIGH 30) 40 65 ns tric Retransmit Cyele Time 40 40) x0 ns tper Retransmit Pulse Width 30 40 65 ns (RTR Retransmit Recovery Time 10 10 IS ns tert MR to FF LOW 40 50 RO ns land MR to HF HIGH 40 50 x0) ns lerH MR to FF HIGH 40 50 80 ns tREE Read LOW to EF LOW 30 35 60) ns tree Read HIGH to FF HIGH 30 35 00 ns tWhe Write HIGH to EF HIGH 30 35 60 ns twee Write LOW to FF LOW 30 35 fil) ns tw Write LOW to HF LOW 30 35 fit) ns teup Read HIGH to HF HIGH 30 35 60 ns tRAE [ffective Read from Write HIGH 30 34 60 ns Irpr Effective Read Pulse Width After EP HIGH 30 40 65 ns twat Effective Write from Read HIGH 30 35 60 ns twee Effective Write Pulse Width After FF HIGH 30 40 65 ny tor Expansion Out LOW Delay from Clock 30 40 65 ns thon Expansion Out HIGH Delay from Clock 30 40 65 ns 5-20J CYPRESS CY7C419/21/25/29/33 Switching Waveforms Asynchronous Read and Write tac ter - ts > tan *y* ta A 7 * ti2AR tovr tHzA Qo-Os K DATA VALID DATA VALID x~e twe tpw twr y ke tsp >* tHD Do-Dg DATA VALID DATA VALID 420-9 Master Reset tursol"1] tp MR FR, W110) teFL EF {HEH HF teFH re LLL LLL LLL _ Half-Fuil Flag HALF FULL HALF FULL +1 HALF FULL Wm tRHF | f*# R be L tWHF AF = am 420-11 Notes: _ 10. Wand R > Vjy; around the rising edge of MR. Il. tmrsc = tpme + tame:CY7C419/21/25/29/33 7 CYPRESS Switching Waveforms (continued) Last Write to First Read Full Flag ADDITIONAL LAST WRITE FIRST READ READS FIRST WRITE \ Ff TX / \_/T twee - RFF fe 0420-12 Last Read to First Write Empty Flag ADDITIONAL LAST READ FIRST WRITE WRITES FIRST READ . \_y TT __/ \__/ *tReF | lWer . { | F ta VY VY VV Y para out t- {QAI KYPOKY) 420-13 Retransmit! !] tarcl"9) tprt FLU/RT 7 RW ry lata C420-14 Notes: 12. EF HF and FF may change state during retransmitasaresulloftheoff- 13. tere = tprp t+ terre: set of the read and write pointers, but flags will be valid at tare. 5-22= ye CY7C419/21/25/29/33 CYPRESS Switching Waveforms (continued) Empty Flag and Read Data Flow-Through Mode DATA IN "a w | \ Mt taac F QAR fF \__ ; if = twer | ta tHwz DATA OUT XXX Data vauio XXX) 420-15 Full Flag and Write Data Flow-Through Mode Ry y KY * twar PP twee *J Ww AMAA y tare + wer J FF DATA IN tHo DATA VALID e ta # tsp | oaracur KKK ona vaio XXX 420-16CY7C419/21/25/29/33 2 J CYPRESS Switching Waveforms (continued) Expansion Timing Diagrams WRITE TO LAST PHYSICAL WRITE TO FIRST PHYSICAL LOCATION OF DEVICE 1 LOCATION OF DEVICE 2 Ww [_ txor txou XO, (X1)1"4) typ tp co-0s RRRKRRKKERKROK PATA KERRRRRRROKonTTACO C420-17 READ FROM LAST PHYSICAL READ FROM FIRST PHYSICAL LOCATION OF DEVICE 1 LOCATION OF DEVICE 2 Fo fStSYY f~ N j= trR h A tro txoH XO (X1g)147 tHzR Qo-Qg 420-18 Note: 14, Expansion Out of device 1 (XOj) is connected to Expansion In of de- vice 2 (XT).SP oypress CY7C419/21/25/29/33 Architecture The CY7C419, CY7C420/1, CY7C424/5, CY7C428/9, CY7C432/3 FIFOs consist of an array of 256, 512, 1024, 2048, 4096 words of 9 bits each (implemented by an array of dual-port RAM cells), a read pointer, a write pointer, control signals (W, R, XI, XO, FL, RF, MR), and Full, Half Full, and Empty flags. Dual-Port RAM The dual-port RAM architecture refers to the basic memory cell used in the RAM. The cell itself enables the read and write opera- tions to he independent of each other, which is necessary to achieve truly asynchronous operation of the inputs and outputs. A second benefit is that the time required to increment the read and write pointers is much less than the time that would be required for data propagation through the memory, which would be the case if the memory were implemented using the conventional register array architecture. Resetting the FIFO Upon power-up, the FIFO must be reset witha Master Reset (MR) cycle. This causes the FIFO to enter the empty condition signified by the Empty flag (EF) being LOW, and both the Half Full (HF) and Full flags (FF) being HIGH, Read (R)} and write (W) must be HIGH tppwi'twew before and tye after the rising edge of MR for a valid reset cycle. If reading from the FIFO after a reset cycle is attempted, the outputs will all be in the high-impedance state. Writing Data to the FIFO The availability of at least one empty location is indicated by a HIGH FF. The falling edge of W initiates a write cycle. Data ap- pearing at the inputs (Dy - Dg) tsp before and typ after the rising edge of W will be stored sequentially in the FIFO. The EF LOW-to-HIGH transition occurs twer after the first LOW-to-HIGH transition of W for an empty FIFO. HF gocs LOW tw after the falling edge of W following the FIFO actually being Half Full. Therefore, the HF is active once the FIFO is filled to half its capacity plus one word. HF will remain LOW while less than one half of total memory is available for writing. The LOW-to-HIGH transition of HF occurs tay after the rising edge of R when the FIFO goes from half full +1 to half full. HF is available in stand- alone and width expansion modes. FF goes LOW twyp after the falling edge of W, during the cycle in which the last available loca- tion is filled. Internal logic prevents overrunning a full FIFO. Writes to a full FIFO are ignored and the write pointer is not in- cremented. FF goes HIGH tggy after a read from a full FIFO. Reading Data from the FIFO The falling edge of R initiates a read cycle if the EF is not LOW. Data outputs (Qy- Ox) are ina high-impedance condition between read operations (R HIGH), when the FIFO is empty, or when the FIFO is not the active device in the depth expansion mode. When one word is in the FIFO, the falling edge of R initiates a HIGH-to-LOW transition of EF. The rising edge of R causes the data outpuls to go to the high-impedance state and remain such un- til a write is performed. Reads to an empty FIFO are ignored and do not increment the read pointer. From the empty condition, the FIFO can be read tyre after a valid write. The retransmit feature is beneficial when transferring packets of data. It enables the receipt of data to be acknowledged by the re- ceiver and retransmitted if necessary. The Retransmit (RT) input isactive in the standalone and width ex- pansion modes. The retransmil feature is intended for use when a number of writes equal to or less than the depth of the FIFO have occurred since the last MR cycle. A LOW pulse on RT resets the internal read pointer to the first physical location of the FIFO, R and W must both be HIGH while and tere after retransmit is LOW. With every read cycle after retransmit, previously accessed data as well as not previously accessed data is read and the read pointer is incremented until it is equal to the write pointer. Full, Half Full, and Empty flags are governed by the relative locations of the read and wrile pointers and are updated during a retransmit cycle. Data written to the FIFO after activation of RT are trans- mitted also. Up to the full depth of the FIFO can be repeatedly retransmitted. Standalone/Width Expansion Modes Standalone and width expansion modes are set by grounding Ex- pansion In (XJ) and tying First Load (FL) to Vcc. FIFOs can be expanded in width to provide word widths greater than nine in in- crements of nine. During widthexpansion mode, all control line in- puts are common to all devices, and flag outputs from any device can be monitored. Depth Expansion Mode (see Figure /) Depth expansion mode isentered when, during a MR cycle, Expan- sion Out (XO) of one device is connected to Expansion In (XT) of the next device, with XO of the last device connected to XT of the first device. In the depth expansion mode the First Load (FL) in- put, when grounded, indicates that this part is the first to be loaded. All other devices must have this pin HIGH. To enable the correct FIFO, XO is pulsed LOW when the last physical location of the previous FIFO is written to and pulsed LOW again when the last physical location is read. Only one FIFO is enabled for read and one for write at any given time. All other devices are in standby. FIFOs can also be expanded simultancously in depth and width. Consequently, any depth or width FIFO can be created of word widths in increments of 9, When expanding in depth, a composite FF must be created by ORing the FFs together. Likewise, a com- posite EF is created hy ORing the EFs together. HF and RT fune- tions are not available in depth expansion mode. Use of the Empty and Full Flags In order to achieve the maximum frequency, the flags must be valid at the beginning of the next cycle. However, because they can be updated by cither edge of the read of write signal, they must be val- id by one-half of a cycle. Cypress FIFOs meet this requirement; some competitors FIFOs do not. The reason why the flags are required to be valid by the next cycle is fairly complex. It has to do with the effective pulse width viola- tion phenomenon, which can occurat the fullund empty boundary conditions, if the flags are not properly used. The empty flag must be used to prevent reading from an empty FIFO and the full flag must he used to prevent writing into a full FIFO. For example, consider an empty FIFO that is receiving read pulses. Because the FIFO is empty, the read pulses are ignored by the FIFO, and nothing happens. Next, a single word is written into the FIFO, with a signal that is asynchronous to the read signal. The (in- ternal) state machine in the FIFO goes from empty to empty+!. However, it does this asynchronously with respect to the read sig- nal, so that it cannot be determined what the effective pulse width of the read signal is, hecause the state machine does not look at the read signal until it goes to the empty+ | state. In a similar manner, the minimum write pulse width may be violated by attempting to write into a full FIFO, and asynchronously performing a read. The empty and full flags are used to avoid these effective pulse width violations, but in order ta do this and operate at the maximum fre- quency, the flag must be valid at the beginning of the next cycle.CY7C419/21/25/29/33 CY7C419 CY7C420/1 CY7C424/5 CY7C428/9 CY7C432/3 Voc CY7C419 CY7C420/1 CY7C424/5 CY7C428/9 CY7C432/3 CY7C419 CY7C420/1 CY7C424/5 CY7C428/9 CY7C432/3 * FIRST DEVICE 420-19 Figure 1. Depth Expansion= : CYPRESS CY7C419/21/25/29/33 Ordering Information Speed Ordering Code renee Package Type ORaeee 10 CY7C419- 10AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C419 10IC J65 32-Lead Plastic Leaded Chip Carrier CY7C419 10PC P2I 28-Lead (300-Mil) Molded DIP CY7C4AI910VC V21 28-Lead (300-Mil) Molded SOJ 15 CY7ICHI9-1SAC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C4HI9=15IC JOS 32-Lead Plastic Leaded Chip Carrier CY7C419 1SPC P2l 28-Lead (300-Mil) Molded DIP CY7C419 1SVC V21 28-Lead (300-Mil} Molded SOJ CY7C419 151 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C419 I5PI P21 28-Lead (300-Mil) Molded DIP CY7C419 15V1 V21 28-Lead (3Ut-Mil) Molded SOJ CY7C419- 1SDMB D22 28-Lead (300-Mil) CerDIP Military CY7C419- 15LMB L55 32-Pin Rectangular Leadless Chip Carrier 20 CY7TC4H19=20AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7ICHIY=20IC J65 32-Lead Plastic Leaded Chip Carrier CY7C41920PC P21 28-Lead (300-Mil) Molded DIP CYTCALY = 20VC V21 28-Lead (300-Mil) Molded SOJ CY7C419 2051 Jos 32-Lead Plastic Leaded Chip Carrier Industrial CY7C41920PI P2I 28-Lead (300-Mil) Molded DIP CY7C41920V1 V21 28-Lead (300-Mil) Molded SOJ CY7C41920DMB D22 28-Lead (300-Mil) CerDIP Military CY7C41920LMB LSS 32-Pin Rectangular Leadless Chip Carrier 2s CY7IC41925AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C419 25JC Jos 32-Lead Plastic Leaded Chip Carrier CY7C419 25PC P21 28-Lead (300-Mil) Molded DIP CY7TC41925VC V2i 28-Lead (300-Mil) Molded SOJ CY7IC419~ 2551 Jos 32-Lead Plastic Leaded Chip Carrier Industrial CY7C41925PI P21 28-Lead (300-Mil) Molded DIP CY7C419~ 25V1 V21 28-Lead (300-Mil) Molded SOJ CY7C419-25DMB D22 28-Lead (300-Mil) CerDIP Military CY7C4319-25LMB LSS 32-Pin Rectangular Leadless Chip Carrier 30 CY7ICII9~ 30AC AZ 32-Pin Thin Plastic Quad Flatpack Commercial CY7C4I19 = 305C J65 32-Lead Plastic Leaded Chip Carrier CY7C41930PC P21 28-Lead (300-Mil) Molded DIP CY7CS19-30VC V2) 28-Lead (300-Mil) Molded SOJ CY7C41930I1 Jos 32-Lead Plastic Leaded Chip Carrier Industrial CY7C419~30PI P21 28-Lead (300-Mil) Molded DIP CY7C41930VI V21 28-Lead (300-Mil) Molded SOJ CY7C419-30DMB D22 28-Lead (300-Mil) CerDIP Military CY7C419-30LMB L55 32-Pin Rectangular Leadless Chip Carrier 40 CY7C419-40AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7ICH19-40IC Jos 32-Lead Plastic Leaded Chip Carrier CY7C419~40PC P2t 28-Lead (300-Mil) Molded DIP CY7TCH194OVCE V2i 28-Lead (300-Mil) Molded SOJCY7C419/21/25/29/33 J CYPRESS Ordering Information (continued) Ordering Code Pe Package Type ORaaeee CY7C41940J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C41940PI P21 28-Lead (300-Mil) Molded DIP CY7C41940V} v2i 28-Lead (300-Mil) Molded SOJ CY7C419-40DMB D22 28-Lead (300-Mil} CerDIP Military CY7C41940LMB L55 32-Pin Rectangular Leadless Chip Carrier 65 CY7C419-65AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C4196553C J65 32-Lead Plastic Leaded Chip Carrier CY7C41965PC P21 28-Lead (300-Mil) Molded DIP CY7C419-65VC V21 28-Lead (300-Mil) Molded SOJ CY7C41965J1 Jos 32-Lead Plastic Leaded Chip Carrier Industrial CY7C419-65PI P21 28-Lead (300-Mil) Molded DIP CY7C41965V1 v2) 28-Lead (300-Mil) Molded SOJ CY7C419-65DMB D22 28-Lead (300-Mil) CerDIP Military CY7C419-65LMB LSS 32-Pin Rectangular Leadless Chip Carrier Ordering Information (continued) Speed Ordering Code eae Package Type id 20 CY7C42020PC P15 28-Lead (6(0-Mil) Molded DIP Commercial 25 CY7C42025PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C42025PI PIS 28-Lead (600-Mil) Molded DIP [Industrial CY7C420-25DMB D16 28-Lead (600-Mil) CerDIP Military 30) CY7C420-30PC Pi5 28-Lead (600-Mil) Molded DIP Commercial CY7C42030PI PiS 28-Lead (600-Mil} Molded DIP Industrial CY7C420--30DMB Dl6 28-Lead (600-Mil) CerDIP Military 40 CY7C420~40PC PIS 28-Lead (600-Mil) Molded DIP Commerical CY7C420- 40PI PIS 28-Lead (600-Mil) Molded DIP Industry CY7C420-40DMB D16 28-Lead (600-Mil) CerDIP Military 65 CY7C420-65PC PIS 28-Lead (600-Mil) Molded DIP Commerical CY7C42065PI Pls 28-Lead (600-Mil} Molded DIP Industrial CY7C420-65SDMB D16 28-Lead (600-Mil) CerDIP Military=p. CYPRESS CY7C419/21/25/29/33 Ordering Information (continued) He Ordering Code Pee Package Type Oe 10 CY7C421-10AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421-10IC J65 32-Lead Plastic Leaded Chip Carrier CY7C421 10PC P21 28-Lead (300-Mil) Molded DIP CY7C42110VC V2i 28-Lead (300-Mil) Molded SOJ Is CY7C421-15AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421- 15JC J65 32-Lead Plastic Leaded Chip Carrier CY7C42115PC P2l 28-Lead (300-Mil) Molded DIP CY7C421-15VC V2i 28-Lead (300-Mil) Molded SOJ CY7C421-15J] J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C421-I5PI P21 28-Lead (300-Mil) Molded DIP CY7C421-15VI V21 28-Lead (300-Mil) Molded SOJ CY7C42115DMB D22 28-Lead (300-Mil) CerlDIP Military CY7C421-15LMB LS5 32-Pin Rectangular Leadless Chip Carrier 20 CY7C421-20AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421 20IC Jas 32-Lead Plastic Leaded Chip Carrier CY7C421 20PC P2l 28-Lead (3(4)-Mil) Molded DIP CY7C42120VC V21 28-Lead (300-Mil) Molded SOJ CY7C421 -20I1 J6S 32-Lead Plastic Leaded Chip Carrier Industrial CY7C421 ~ 20 PI P21 28-Lead (300-Mil) Molded DIP CY7C421-20VI V21 28-Lead (300-Mil) Molded SOJ CY7C421-20DMB D22 28-Lead (300-Mil) CerDIP Military CY7C421-20LMB LSS 32-Pin Rectangular Leadless Chip Carrier 25 CY7C421 ~25AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421-25JC J65 32-Lead Plastic Leaded Chip Carrier CY7C421 25PC P21 28-Lead (300-Mil) Molded DIP CY7C421-25VC V2) 28-Lead (300-Mil) Molded SOJ CY7C421-25]1 Jos 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42125PI P21 28-Lead (300-Mil) Molded DIP CY7C42125V1 V21 28-Lead (300-Mil) Molded SOJ CY7C421-25DMB D22 28-Lead (300-Mil) CerDIP Military CY7C421 ~25LMB LS5 32-Pin Rectangular Leadless Chip Carrier 30 CY7C421-30AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421 305C J65 32-Lead Plastic Leaded Chip Carrier CY7C421 - 30PC P2t 28-Lead (300-Mil) Molded DIP CY7C421 + 30VC V2 28-Lead (300-Mil) Molded SOJ CY7C421 -3051 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42! 30PI P2l 28-Lead (300-Mil) Molded DIP CY7C421 30VI V21 28-Lead (300-Mil) Molded SOJ CY7C421-30DMB D22 28-Lead (300-Mil) CerDIP Military CY7C421-30LMB L55 32-Pin Rectangular Leadless Chip Carrier a 29CY7C419/21/25/29/33 J CYPRESS Ordering Information (continued) rane Ordering Code ice Package Type fae 40 CY7C421-40AC A32 32-Pin Thin Plastic Quad Flatpack Cammercial CY7C421 - 40IC J65 32-Lead Plastic Leaded Chip Carrier CY7C421 40PC P21 28-Lead (300-Mil) Molded DIP CY7C421-40VC V21 28-Lead (300-Mil) Molded SOJ CY7C421-4051 J6s 32-Lead Plastic Leaded Chip Carrier Industrial CY7C421~-40PI P21 28-Lead (300-Mil) Molded DIP CY7C421-40V1 V21 28-Lead (300-Mil) Molded SOJ CY7C421-40DMB D22 28-Lead (300-Mil) CerDIP Military CY7C421-40LMB LSS 32-Pin Rectangular Leadless Chip Carrier 65 CY7C421-65AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421-40IC J65 32-Lead Plastic Leaded Chip Carrier CY7C421-65PC P2l 28-Lead (300-Mil) Molded DIP CY7C421-65VC V2) 28-Lead (3()-Mil) Molded SOJ CY7C421-6551 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C421-65P1 P2t 28-Lead (3(-Mil) Molded DIP CY7C421-65V1 V21 28-Lead (300-Mil) Molded SOJ CY7C421-65DMB 1D22 28-Lead (300-Mil) CerDIP Military CY7C421 -65LMB L55 32-Pin Rectangular Leadless Chip Carrier Ordering Information (continued) ; >, F Ordering Code ae Package Type Range? 20 CY7C424 20PC P15 28-Lead (600-Mil) Molded DIP Commercial 25 CY7C424 25PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C42425PI P15 28-Lead (600-Mil) Molded DIP Industrial CY7C424-25DMB D16 28-Lead (600-Mil) CerDIP Military 30) CY7C42430PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C42430PE P15 28-Lead (600-Mil) Molded DIP Industrial CY7C424~30DMB D16 28-Lead (600-Mil) CerDIP Military 40 CY7C42440PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C42440PI PI5 28-Lead (600-Mil) Molded DIP Industrial CY7C42440DMB DI6o 28-Lead (600-Mil) CerDIP Military 65 CY 7C42465PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C42465P] PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C424-65DMB DI6 28-Lead (604-Mil) CerDIP Military 4-30CY7C419/21/25/29/33 CYPRESS Ordering Information (continued) Spec Ordering Code eee Package Type Rn 10 CY7C425- LOAC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425 LOC J6S 32-Lead Plastic Leaded Chip Carrier CY7C425 LOPC P21 28-Lead (300-Mil} Molded DIP CY7C425 LOVE V21 28-Lead (300-Mil) Molded SOJ 15 CY7C425-15AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425155C Jos 32-Lead Plastic Leaded Chip Carrier CY7C425 15PC P21 28-Lead (300-Mil) Molded DIP CY7C42515VC V21 28-Lead (300-Mil) Molded SOJ CY7C42515J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42515P] P21 28-Lead (300-Mil) Molded DIP CY7C425 ISVI V21 28-Lead (300-Mil) Molded SOJ CY7C425~ 15DMB D22 28-Lead (300-Mil) CerDIP Military CY7C425 15LMB LSS 32-Pin Rectangular Leadless Chip Carrier 20 CY7C425 20AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425 -20JC J65 32-Lead Plastic Leaded Chip Carrier CY7C425 20PC P21 28-Lead (300-Mil) Molded DIP CY7C42520VC V21 28-Lead (31KI-Mil) Molded SOJ CY7C425 ~~ 20J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42520PI P21 28-Lead (300-Mil) Molded DIP CY7C425 20V1 V2i 28-Lead (300-Mil) Molded SOJ CY7C425~20DMB D22 28-Lead (300-Mil) CerDIP Military CY7C42520LMB L55 32-Pin Rectangular Leadless Chip Carrier 25 CY 70425 25AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425 255C Jos 32-Lead Plastic Leaded Chip Carrier CY7C425 25PC P21 28-Lead (300-Mil) Molded DIP CY7C425 25VC v2) 28-Lead (300-Mil} Molded SOJ CY7C425 - 2531 Jo5 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42525P1 P2l 28-Lead (300-Mil) Molded DIP CY7C42525VI1 V2 28-Lead (300-Mil) Molded SOJ CY7C425-25DMB D22 28-Lead (300-Mil) CerDIP Military CY7C425~25LMB LSS 32-Pin Rectangular Leadless Chip Carrier 30 CY7C425 30AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425305C Jos 32-Lead Plastic Leaded Chip Carrier CY7C42530PC P21 28-Lead (300-Mil) Molded DIP CY7C42530VC V21 28-Lead (300-Mil) Molded SOJ CY7C425 301 Jas 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42530PI P21 28-Lead (300-Mil) Molded DIP CY7C425 30V1 V21 28-Lead (300-Mil) Molded SOJ CY7C42530DMB D22 28-Lead (300-Mil) CerDIP Military CY7C425 -30LMB L545 32-Pin Rectangular Leadless Chip CarrierCY7C419/21/25/29/33 J CYPRESS Ordering Information (continued) _ Ordering Code ree Package Type OF aee 40 CY7C425 -40AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425 405C Jos 32-Lead Plastic Leaded Chip Carrier CY7C425 40PC P2t 28-Lead (300-Mil) Molded DIP CY7C425-40VC V21 28-Lead (300-Mil) Molded SOJ CY7C42540J1 Jo5 32-Lead Plastic Leaded Chip Currier Industrial CY7C425~40PI1 P2l 28-Lead (300-Mil) Molded DIP CY7C42540VI V2i 28-Lead (300-Mil) Molded SOJ CY7C42540DMB D22 28-Lead (300-Mil) CerDIP Military CY7C42540LMB 155 32-Pin Rectangular Leadless Chip Carrier 65 CY7C425~65AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425 65)C Jos 32-Lead Plastic Leaded Chip Carrier CY7C425~O5PC P21 28-Lead (300-Mil) Molded DIP CY7C425 65VC V2i 28-Lead (300-Mil) Molded SOJ CY7C425 05/1 Jos 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42565P] P2l 28-Lead (3(4-Mil) Molded DIP CY7C425H5V1 V21 28-Lead (300-Mil) Molded SOJ CY7C42565DMB D22 28-Lead (300-Mil) CerDIP Military CY7C425 651.MB LSS 32-Pin Rectangular Leadless Chip Carrier Ordering Information (continued) _ Ordering Code rte Package Type ORnane 20 CY7CI28 20PC PIs 28-Lead (600-Mil) Molded DIP Commercial 25 CY7C428 2SPC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C428 25P1 PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C42825DMB Dio 28-Lead (60(-Mil) CerDIP Military 30) CY 7C428 30PC PIS 28-Lead (604-Mil) Molded DIP Commercial CY7C428 30P] PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C428 -30DMB Dio 28-Lead (600-Mil) CerDIP Military 40 CY 7C42840PC PIS 28-Lead (600-Mil} Molded DIP Commercial CY7C42840PI PIS 28-Lead (600-Mil) Malded DIP Industrial CY7C42840DMB D116 28-Lead (600-Mil) CerDIP Military 65 CY7C428 65PC PIs 28-Lead (600-Mil) Molded DIP Commercial CY7C428-65PI PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C428-65DMB D16 28-Lead (600-Mil) CerDIP Military 4-32=p. CYPRESS CY7C419/21/25/29/33 Ordering Information (continued) _ Ordering Code ree Package Type Ofraeine 1 CY7C429 WAC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429 10IC J6S 32-Lead Plastic Leaded Chip Carrier CY7C429 1OPC P21 28-Lead (300-Mil) Molded DIP CY7C429 10VC V21 28-Lead (30(-Mil) Molded SOJ 15 CY7C429- [SAC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429 15JIC J6s 32-Lead Plastic Leaded Chip Carrier CY7C429 1SPC P21 28-Lead (300-Mil) Molded DIP CY7C42915VC V21 28-Lead (300-Mil) Molded SOJ CY7C429~ 15] J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C429- 15PI P21 28-Lead (30-Mil) Molded DIP CY7C429 15VI V21 28-Lead (300-Mil) Molded SOJ CY7C429 1SDMB D22 28-Lead (300-Mil) CerDIP Military CY7C429 ISLMB Lss 32-Pin Rectangular Leadless Chip Carrier 20 CY7C429-20AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429 2051C J6S 32-Lead Plastic Leaded Chip Carrier CY7C42920PC P2l 28-Lead (300-Mil) Molded DIP CY7C42920VC V2) 28-Lead (300-Mil) Molded SOF CY7C42920J1 Jas 32-Lead Plastic Leaded Chip Carrier [ndustrial CY7C42920PI P21 28-Lead (300-Mil) Molded DIP CY7C42920V1 V2) 28-Lead (300-Mil) Molded SOJ CY7C42920DMB D22 28-Lead (300-Mil) CerDIP Military CY7C429~20LMB L355 32-Pin Rectangular Leadless Chip Carrier 25 CY7C429-25AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429 25IC J65 32-Lead Plastic Leaded Chip Carrier CY7C42925PC P21] 28-Lead (300-Mil) Molded DIP CY7C42925VC V21 28-Lead (300-Mil) Molded SOJ CY7C42925J1 J6S 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42925PI P21 28-Lead (300-Mil) Molded DIP CY7C429-25V1 V21 28-Lead (300-Mil) Molded SOJ CY7C429-25DMB D22 28-Lead (300-Mil} CerDIP Military CY7C42925LMB Lss 32-Pin Rectangular Leadless Chip Carrier 30 CY7C429-30AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429 ~ 31IC J65 32-Lead Plastic Leaded Chip Carrier CY7C429 3UPC P21 28-Lead (300-Mil) Molded DIP CY7C42930VC V21 28-Lead (300-Mil) Molded SOJ CY7C429 30J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42930P1 P2l 28-Lead (300-Mil) Molded DIP CY7C42930V1 V2 28-Lead (300-Mil) Molded SOJ CY7C42930DMB D22 28-Lead (300-Mil) CerDIP Military CY7C42930LMB LSS 32-Pin Rectangular Leadless Chip Carrier 40 CY7C42940AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429 = 405C J65 32-Lead Plastic Leaded Chip Carrier CY7C429 40PC P2l 28-Lead (HHE-Mil) Molded DIP CY7C42940VC V2 28-Lead (3040)-Mil) Molded SOJCY7C419/21/25/29/33 CYPRESS Ordering Information (continued) 5 Pooks 1 Speed Ordering Code yee Package Type i 40 CY7C429 40J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C429 40PI p21 28-Lead (300-Mil) Molded DIP CY7C4294OVI v2 28-Lead (300-Mil) Molded SOJ CY7C429 40D MB 122 28-Lead (300-Mil) CerDIP Military CY7C429 40 MB LS5 32-Pin Rectangular Leadless Chip Carrier 65 CY7C429-65AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C42965IC J65 32-Lead Plastic Leaded Chip Carrier CY7C42905PC P2l 28-Lead (300-Mil) Molded DIP CY7C4295VC V2I 28-Lead (300-Mil) Molded SOJ CY7C42965I1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42965P1 P21 28-Lead (300-Mil) Molded DIP CY7C42905 V1 V2) 28-Lead (300-Mil) Molded SOJ CY7C429 -65DMB D22 28-Lead (300-Mil) CerDIP Military CY7C42965LMB LSS 32-Pin Rectangular Leadless Chip Carrier Ordering Information (continued) an Ordering Code ON Package Type a nee 25 CY7C43225PC P15 28-Lead (600-Mil} Molded DIP. Commercial 3) CY7C43230PC PLS 28-Lead (600-Mil) Molded DIP Commerical CY7C43230PI PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C432-30DMB Di6 28-Lead (600-Mil) CerDIP Military 40 CY7C43240PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C43240PL PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C432-40DMB D16 28-Lead (600-Mil) CerDIP Military 65 CY7C432-65PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C432-65P1 PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C43265DMB Di6 28-Lead (600-Mil) CerDIP Military Ordering Information (continued) ne Ordering Code Nae Package Type Roe 10 CY7C433-10AC A322 32-Pin Thin Plastic Quad Flatpack Commercial CY7C43310IC Jos 32-Lead Plastic Leaded Chip Carrier CY7C43310PC P21 28-Lead (300-Mil) Molded DIP CY 7C43310VC V21 28-Lead (300-Mil) Malded SO! Is CY7C43315AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C433 15IC Jos 32-Lead Plastic Leaded Chip Carrier CY7C433 15PC P21 28-Lead (300-Mil) Molded DIP CY7C433 [SVC V21 28-Lead (300-Mil) Molded SOJ CY7C433-1SJI Jos 32-Lead Plastic Leaded Chip Carrier Industrial CY7C433~ 15PI P21 28-Lead (300-Mil) Molded DIP CY7C433-15V1 Vv2i 28-Lead (300-Mil) Molded SOJ CY7C433- 1SDMB 122 28-Lead (300-Mil) CerDIP Military CY7C433 ISLMB 155 32-Pin Rectangular Leadiess Chip Carrier 5-344= : CYPRESS CY7C419/21/25/29/33 Ordering Information (continued) : Pe ok es i oe Ordering Code oes Package Type OFuaee 20 CY7C43320AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C43320IC J65 32-Lead Plastic Leaded Chip Carrier CY7C43320PC P2I 28-Lead (300-Mil) Molded DIP CY7C43320VC V2I 28-Lead (300-Mil) Molded SOJ CY7C433 20H J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C43320P] p2t 28-Lead (300-Mil) Molded DIP CY7C43320V1 V2 28-Lead (300-Mil) Molded SOJ CY7C433201DMB p22 28-Lead (300-Mil) CerDEIP Military CY7C433 20.MB L55 32-Pin Rectangular Leadless Chip Carrier 25 CY7C433 -25AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C433 2530 J65 32-Lead Plastic Leaded Chip Carrier CY7C43325PC P21 28-Lead (300-Mil) Molded DIP CY7C433 -25VC V2) 28-Lead (300-Mil) Molded SOJ CY7C433 2551 Jos 32-Lead Plastic Leaded Chip Carrier Industrial CY7C43325P] P21 28-Lead (300-Mil) Molded DIP CY7C43325V1 V21 28-Lead (300-Mil) Molded SOJ CY7C43325DMB 122 28-Lead (300-Mil) CerDIP Military CY7C43325LMB LSS 32-Pin Rectangular Leadless Chip Carrier 30 CY7C433 30AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C433305C Jos 32-Lead Plastic Leaded Chip Carrier CY7C433 30PC P21 28-Lead (300-Mil) Molded DIP CY7C433 30VC V21 28-Lead (300-Mil) Molded SOJ CY7C433~30J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C43330PI] P21 28-Lead (300-Mil) Molded DIP CY7C433-30V1 V2) 28-Lead (300-Mil) Molded SOJ CY7C433 -30DMB D22 28-Lead (300-Mil) CerDIP Military CY7C4333ULMB L55 32-Pin Rectangular Leadless Chip Carrier 40 CY7C433~-40AC A322 32-Pin Thin Plastic Quad Flatpack Commercial CY7C433-40IC Jos 32-Lead Plastic Leaded Chip Carrier CY7C43340PC P21 28-Lead (300-Mil) Molded DIP CY7C43340VC V2I 28-Lead (300-Mil) Molded SOJ CY7C43340I1 Jas 32-Lead Plastic Leaded Chip Carrier Industrial CY7C43340PI P21 28-Lead (300-Mil) Molded DIP CY7C43340V1 V21 28-Lead (300-Mil) Molded SOJ CY7C433-40DMB 122 28-Lead (300-Mil) CerDIP Military CY7C43340LMB LSS 32-Pin Rectangular Leadless Chip Carrier 65 CY7C433-65AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C433 ~655C Jos 32-Lead Plastic Leaded Chip Carrier CY7C43365PC P2l 28-Lead (3UU-Mil) Molded DIP CY7C433-65VC Vil 28-Lead (300-Mil) Molded SOJ CY7C 433-651 Jos 32-Lead Plastic Leaded Chip Carrier Industrial CY7C433-O65PE P21 28-Lead (300-Mil) Molded DIP CY7C433-65V1 V21 28-Lead (300-Mil) Molded SOS CY7C433 -6SDMB p22 28-Lead (300-Mil) CerDIP Military CY7C433-63LMB L55 32-Pin Rectangular Leadless Chip Carrier3 CYPRESS MILITARY SPECIFICATIONS CY7C419/21/25/29/33 Group A Subgroup Testing DC Characteristics Parameters Subgroups Vou 1,2,3 VoL 1, 2,3 Vin 1,2,3 Vir Max. 1.2.3 lix 1,2,3 Ice 1,2,3 lec 1,2,3 Ispi 1, 2,3 Isp 1,2,3 los 1,2,3 Switching Characteristics Parameters Subgroups tre 9, 10, 11 ta 9,10, 11 tre 9,10, 11 tpr 9,10, 11 tpver 9,10, 11 twce 9,10, 11 tpw 9,10, 11 twR 9.10, 11 tsp 9,10, 11 typ 9, 10, 1h tmrsc 9, 10, 11 tpMR 9, 10. 11 'RMR 9, 10, LI trew 9, 10, LH iwpw 9,10, LL trTc 9,10, 11 tprr 9,10, 11 trTR 9,10, 1 {EEL 9, 10,11 tHEH 9, 10, 14 {FFH 910,01 tREEF 9, 10,11 tRFF 9,10, 12 tWEF 9, 10, 41 tWEE 9, 10, $1 tWHE 9,10, 11 tRHE 9,10, 11 (RAE 9, 10, 11 (RPE 9,10, 14 (WAF 9,10, 11 twpeF 9,10, 11 txon 9,10, 11 txou 9,10, 11 Document #: 3800079-L