LM317M, NCV317MA, NCV317M
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2
MAXIMUM RATINGS (TA = 25°C, unless otherwise noted.)
Rating Symbol Value Unit
Input−Output Voltage Differential VI−VO40 Vdc
Power Dissipation (Package Limitation) (Note 1)
Plastic Package, T Suffix, Case 221A
TA = 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Plastic Package, DT Suffix, Case 369C
TA = 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Plastic Package, ST Suffix, Case 318E
TA = 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
PD
qJA
qJC
PD
qJA
qJC
PD
qJA
qJC
Internally Limited
70
5.0
Internally Limited
92
5.0
Internally Limited
245
15
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Maximum Junction Temperature TJMAX +150 °C
Storage Temperature Range Tstg −65 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. Figure 25 provides thermal resistance versus PC board pad size.
ELECTRICAL CHARACTERISTICS (VI − VO = 5.0 V; IO = 0.1 A, TJ = Tlow to Thigh (Note 2), unless otherwise noted.)
Characteristics Figure Symbo
LM317M/LM317MB/NCV317MB
Unit
Min Typ Max
Line Regulation (Note 3) (TA = 25°C, 3.0 V ≤ VI − VO ≤ 40 V) 3 Regline − 0.01 0.04 %/V
Load Regulation (Note 3)
TA = 25°C, 10 mA ≤ IO ≤ 0.5 A
VO ≤ 5.0 V
VO ≥ 5.0 V
4 Regload
−
−5.0
0.1 25
0.5 mV
% VO
Adjustment Pin Current 5 IAdj − 50 100 mA
Adjustment Pin Current Change
2.5 V ≤ VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax 3, 4 DIAdj − 0.2 5.0 mA
Reference Voltage
3.0 V ≤VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax 5 Vref 1.20 1.25 1.30 V
Line Regulation 3.0 V ≤VI−VO ≤ 40 V (Note 3) 3 Regline − 0.02 0.07 %/V
Load Regulation 10 mA ≤IO ≤0.5 A (Note 3)
VO ≤5.0 V
VO ≥ 5.0 V
4 Regload −
−20
0.3 70
1.5 mV
% VO
Temperature Stability (Tlow ≤TJ ≤Thigh) 5 TS− 0.7 − % VO
Minimum Load Current to Maintain Regulation (VI − VO = 40 V) 5 ILmin − 3.5 10 mA
Maximum Output Current
VI − VO ≤ 15 V, PD ≤ Pmax
VI − VO = 40 V, PD ≤Pmax, TA = 25°C
5 Imax 0.5
0.15 0.9
0.25 −
−
A
RMS Noise, % of VO (TA = 25°C, 10 Hz ≤f ≤10 kHz) − N − 0.003 − % VO
Ripple Rejection, VO = 10 V, f = 120 Hz (Note 4)
Without CAdj
CAdj = 10 mF
6 RR −
66 65
80 −
−
dB
Thermal Shutdown (Note 5) − − − 180 − °C
Long−Term Stability, TJ = Thigh (Note 6)
TA= 25°C for End−point Measurements 5 S − 0.3 1.0 %/1.0
kHrs.
2. Tlow to Thigh = 0° to +125°C for LM317M Tlow to Thigh = −40° to +125°C for LM317MB, NCV317MB.
3. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
4. CAdj, when used, is connected between the adjustment pin and ground.
5. Thermal characteristics are not subject to production test.
6. Since Long−Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot−to−lot.