© Semiconductor Components Industries, LLC, 2003
January, 2021 − Rev. 5
1Publication Order Number:
NC7S32/D
TinyLogic HS 2-Input OR
Gate
NC7S32
Description
The NC7S32 is a single 2−Input high performance CMOS OR Gate.
Advanced Silicon Gate CMOS fabrication assures high speed and low
power circuit operation over a broad VCC range. ESD protection
diodes inherently guard both inputs and output with respect to the VCC
and GND rails. Three stages of gain between inputs and outputs
assures high noise immunity and reduced sensitivity to input edge rate.
Features
•Space Saving SC−74A and SC−88A 5−Lead Package
•Ultra Small MicroPak™ Leadless Package
•High Speed: tPD = 3.5 ns Typ
•Low Quiescent Power: ICC < 1 mA
•Balanced Output Drive: 2 mA IOL, −2 mA IOH
•Broad VCC Operating Range: 2 V – 6 V
•Balanced Propagation Delays
•Specified for 3 V Operation
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
Y
A≥1
IEEE / IEC
B
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
www.onsemi.com
SC−88A
CASE 419A−02
SIP6
CASE 127EB
TTKK
XYZ
Pin 1
SC−74A
CASE 318BQ
7S32MG
G
S32MG
G
TT, 7S32, S32 = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code Format
Z = Assembly Plant Code
M = Date Code*
*Date Code orientation and/or position may
vary depending upon manufacturing location.
NC7S32
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2
Pin Configurations
A
B
VCC
GND Y
1
2
3
5
4
Figure 2. SC−88A and SC−74A (Top View)
A 1 6 VCC
B 2 5 NC
GND 3 4 Y
Figure 3. MicroPak (Top Through View)
PIN DESCRIPTIONS
Pin Name Description
A, B Inputs
Y Output
NC No Connect
FUNCTION TABLE (Y = A + B)
Inputs Output
A B Y
L L L
L H H
H L H
H H H
H = HIGH Logic Level
L = LOW Logic Level
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
VCC Supply Voltage −0.5 6.5 V
IIK DC Input Diode Current VIN < 0 V − −20 mA
VIN > VCC −+20
VIN DC Input Voltage −0.5 VCC + 0.5 V
IOK DC Output Diode Current VOUT < 0 V − −20 mA
VOUT > VCC −+20
VOUT DC Output Voltage −0.5 VCC + 0.5 V
IOUT DC Output Source or Sink Current −±12.5 mA
ICC or IGND DC VCC or Ground Current per Output Pin −±25 mA
TSTG Storage Temperature −65 +150 °C
TJJunction Temperature −+150 °C
TLLead Temperature (Soldering, 10 Seconds) −+260 °C
PDPower Dissipation in Still Air SC−74A −390 mW
SC−88A −332
MicroPak−6−812
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
NC7S32
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3
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage 2.0 6.0 V
VIN Input Voltage 0 VCC V
VOUT Output Voltage 0 VCC V
TAOperating Temperature −40 +85 °C
tr, tfInput Rise and Fall Times VCC at 2.0 V 0 20 ns
VCC at 3.0 V 0 20
VCC at 4.5 V 0 10
VCC at 6.0 V 0 5
qJA Thermal Resistance SC−74A −320 °C/W
SC−88A −377
MicroPak−6−154
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = −40 to +85°C
Unit
Min Typ Max Min Max
VIH HIGH Level Input Voltage 2.0
3.0 − 6.0
1.50
0.7 VCC
−
−
−
−
1.50
0.7 VCC
−
−
V
VIL LOW Level Input Voltage 2.0
3.0 − 6.0
−
−
−
−
0.50
0.3 VCC
−
−
0.50
0.3 VCC
V
VOH HIGH Level Output Voltage 2.0
3.0
4.5
6.0
IOH = −20 mA
VIN = VIH or VIL
1.90
2.90
4.40
5.90
2.0
3.0
4.5
6.0
−
−
−
−
1.90
2.90
4.40
5.90
−
−
−
−
V
3.0
4.5
6.0
VIN = VIH or VIL
IOH = −1.3 mA
IOH = −2.0 mA
IOH = −2.6 mA
2.68
4.18
5.68
2.85
4.35
5.85
−
−
−
2.63
4.13
5.63
−
−
−
V
VOL LOW Level Output Voltage 2.0
3.0
4.5
6.0
IOL = 20 mA
VIN = VIH or VIL
−
−
−
−
0.0
0.0
0.0
0.0
0.10
0.10
0.10
0.10
−
−
−
−
0.10
0.10
0.10
0.10
V
3.0
4.5
6.0
VIN = VIH or VIL
IOL = 1.3 mA
IOL = 2.0 mA
IOL = 2.6 mA
−
−
−
0.1
0.1
0.1
0.26
0.26
0.26
−
−
−
0.33
0.33
0.33
V
IIN Input Leakage Current 6.0 VIN = VCC, GND − − ±0.1 −±1.0 mA
ICC Quiescent Supply Current 6.0 VIN = VCC, GND − − 1.0 −10.0 mA
NC7S32
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4
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = −40 to +85°C
Unit
Min Typ Max Min Max
tPLH,
tPHL
Propagation Delay (Figure 4, 6) 5.0 CL = 15 pF −3.5 15 − − ns
2.0
3.0
4.5
6.0
CL = 50 pF −
−
−
−
20
12
8
7
100
27
20
17
−
−
−
−
125
35
25
21
ns
tTLH,
tTHL
Output Transition Time
(Figure 4, 6)
5.0 CL = 15 pF −3.0 10 − − ns
2.0
3.0
4.5
6.0
CL = 50 pF −
−
−
−
25
16
11
9
125
35
25
21
−
−
−
−
155
45
30
26
ns
CIN Input Capacitance Open −2 10 −10 pF
CPD Power Dissipation Capacitance
(Figure 5)
5.0 (Note 2) −6− − − pF
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
Figure 4. AC Test Circuit
Figure 5. ICCD Test Circuit
Figure 6. AC Waveforms
Input = AC Waveforms;
PRR = Variable; Duty Cycle = 50%.
A
INPUT
VCC
VCC
CL
INPUT
OUTPUT
CL includes load and stray capacitance
Input PRR = 1.0 MHz; tW = 500 ns
NC7S32
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5
ORDERING INFORMATION
Part Number Top Mark Package Description Shipping†
NC7S32M5X 7S32 SC−74A 3000 / Tape & Reel
NC7S32P5X S32 SC−88A 3000 / Tape & Reel
NC7S32L6X TT SIP6, MicroPak 5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13590G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SIP6 1.45X1.0
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
SC−74A
CASE 318BQ
ISSUE B
DATE 18 JAN 2018
SCALE 2:1
GENERIC
MARKING DIAGRAM*
1
5
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM MIN MAX
MILLIMETERS
D
E1
A0.90 1.10
b0.25 0.50
e0.95 BSC
A1 0.01 0.10
c0.10 0.26
L0.20 0.60
M0 10
E2.50 3.00
123
54
E
D
E1
b
A
c
__
0.20
5X
CAB
CSEATING
PLANE
L
M
DETAIL A
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
2.40
0.70
5X
DIMENSIONS: MILLIMETERS
RECOMMENDED
0.95
PITCH
1.00
5X
e
A1
0.05
DETAIL A
XXX MG
G
XXX = Specific Device Code
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON66279G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SC−74A
© Semiconductor Components Industries, LLC, 2018 www.onsemi.com
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
−B−
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
XXXMG
G
XXX = Specific Device Code
M = Date Code
G= Pb−Free Package
GENERIC MARKING
DIAGRAM*
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
DATE 17 JAN 2013
SCALE 2:1
(Note: Microdot may be in either location)
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42984B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SC−88A (SC−70−5/SOT−353)
© Semiconductor Components Industries, LLC, 2018 www.onsemi.com
www.onsemi.com
1
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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
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designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
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literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
TECHNICAL SUPPORT
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Phone: 011 421 33 790 2910
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For additional information, please contact your local Sales Representative
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