SMLP36RGB2W3R - ROHM Semiconductor

Data Sheet

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SMLP36 Series

PICOLEDTM-RGB

lFeatures

lOutline

•

Low height contributes to the improvement of color mixture

lSize

lDimensions lRecommended Solder Pattern

lSpecifications

Typ.

IFMax. VRMin.*4Typ. Max.*4IFMin. Typ. IF

(V) (mA) (mA) (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA)

2.1 619 624 629 14 35

3.1 520 527 535 56 110

3.0 465 470 475 14 35

*1 : Total power dissipation in case of lighting several colors.

*2 : The avobe absolute maximum ratings are valid for the case of lighting a single color.

When lighting two colors at the same time, each of the figures in the absolute maximum ratings should be reduced down to 50% of it.

When lighting three colors, it will be reduced down to 30% of it.

*3 : Duty≦1/20, 1ms

*4 : Reference

※ : The value is based on the die destruction optical endurance; characteristics are not considered.

*PICOLEDTM is ROHM's pending trademark.

-40 to +100

Blue

Red

Green

-40 to +85

Reverse

Operating Temp.

Storage Temp.

Reverse Current IR

The smallest class 3 color type LED in the world PICOLEDTM-RGB

6pin type

Forward Voltag VF

Forward*2

Electrical and Optical Characteristics (Ta=25ºC)

Emitting

Power*1

Peak Forward*3

Dominant Wavelength lD

Luminous Intensity IV

Topr(ºC)

Tstg(ºC)

Part No.

Chip

Structure

Absolute Maximum Ratings (Ta=25ºC) ※

Color

IFP(mA)

Current

VR(V)

Voltage

Dissipation

Current

PD(mW)

IF(mA)

SMLP36RGB2W (R)

AIGaInP

InGaN

Tolerance : 0.1

(unit : mm)

6pin type

1510 (0604)

1.5×1.0mm (t=0.2mm)

Color

Type

1/7

2014.11 - Rev.I

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Data Sheet

SMLP36 Series

lElectrical Characteristics Curves

0.4

0.6

0.8

1.2

1.4

1.6

-40 -20 0 20 40 60 80 100

100

1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4

0.5

1.5

0 2 4 6 8 10

-40 -20 0 20 40 60 80 100

SMLP36RGB2W (R) (R)

SMLP36RGB2W (R) (G)

SMLP36RGB2W (R) (B)

SMLP36RGB2W (R) (R)

SMLP36RGB2W (R) (G)

SMLP36RGB2W (R) (B)

Fig.1 Forward Current - Forward Voltages

FORWARD CURRENT : IF [mA]

FORWARD VOLTAGE : VF [V]

Fig.2 Luminous Intensity -

Atmosphere Temperature

RELATIVE LUMINOUS INTENSITY [a.u.]

ATMOSPHERE TEMPERATURE : Ta [ºC]

Fig.3 Luminous Intensity - Forward Current

RELATIVE LUMINOUS INTENSITY [a.u.]

FORWARD CURRENT : IF [mA]

Fig.4 Derating

MAXIMUM FORWARD CURRENT : [mA]

AMBIENT TEMPERATURE : Ta [ºC]

Ta=25ºC

IF=5mA

SMLP36RGB2W (R) (R)

SMLP36RGB2W (R) (G)

SMLP36RGB2W (R) (B)

SMLP36RGB2W (R) (R)

SMLP36RGB2W (R) (G)

SMLP36RGB2W (R) (B)

(Note) In case of lighting a single color.

*The value is based on the die destruction endurance;

optical characteristics are NOT considered..

2/7

2014.11 - Rev.I

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Data Sheet

SMLP36 Series

lViewing Angle

lRank Reference of Brightness

SCANNING ANGLE (deg)

RELATIVE INTENSITY

SCANNING ANGLE (deg)

RELATIVE INTENSITY

(Ta=25ºC, IF＝5mA)

14 to 28 28 to 56 14 to 28 28 to 56 14 to 28 28 to 56 14 to 28 28 to 56 14 to 28 28 to 56 14 to 28 28 to 56

SMLP36RGB2W (R)

56 to 90

90 to 140

140 to 220

28 to 56

14 to 28

Emitting

Color

Rank

Iv (mcd)

Blue

Green

Red

56 to 90

90 to 140

SMLP36RGB2W (R) (R)

SMLP36RGB2W (R) (G)

SMLP36RGB2W (R) (B)

SMLP36RGB2W (R) (R)

SMLP36RGB2W (R) (G)

SMLP36RGB2W (R) (B)

3/7

2014.11 - Rev.I

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Data Sheet

SMLP36 Series

lTaping

lPart No. Construction

lPacking Specification

ROHM LED products are being shipped with desiccant (silica gel) concluded in moisture-proof bags.

Pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card

inside the bag is available upon request.

Please contact the nearest sales office or distributer if necessary.

(Unit : mm)

(note) Tolerance is within 0.1mm unless otherwise specified.

←

↑↑

A A'

Descri pti on

φ13

φ1. 5 +0 .1

4±0. 1

1. 65 ±0. 05

±1

11 .4

2±0. 05

1. 75 ±0. 1

1. 15 ±0 .0 5

0. 28 + 0. 04

-0 .03

2±0. 05

3. 5 ±0. 0 5

φ0. 5 ±0. 05

φ18 0 0

-3

φ60 0

Packing quantity

5,000pcs/reel

Pull

direction

B-B

cross s e c ti onal vie w

A-A

cross s s e ct ional vi e w

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2014.11 - Rev.I

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Data Sheet

SMLP36 Series

2014.11 - Rev.I

5/7

lPrecaution (Surface Mount Device)

1.Storage

If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand

which will influence the performance of the product. Therefore, the package is waterproof. Please use the

product following the conditions:

• Using Conditions

Classification Temperature Humidity Expiration Date Remark

1 Before using 5 to 30ºC 30 to 70%RH Within 1 year

from Receiving Storage with waterproof package

2 After opening

package 5 to 30ºC Below 70%RH Within 168h Please storing in the airtight container with

our desiccant (silica gel)

• Baking

Bake the product in case of below:

1 The expiration date is passed.

2 The color of indicator (silica gel) turned from blue to colorless or from green to pink.

(Even if the product is within the expiration date.)

• Baking Conditions

Temperature Time Humidity

60±3ºC 12 to 24h Below 20%RH

Remark

• Bake products in reel.

• Reel and embossed tape are easy to be deformed when baking, so please try not to

apply stress on it.

• Recommend bake once.

2.Application Methods

2-1. Precaution for Drive System and Off Mode

Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that applies on the

products. If drive by constant voltage, it may cause current deviation of the LED and result in deviation of

luminous intensity, so we recommend to drive by constant current. (Deviation of VF Value will cause deviation of

current in LED.) Furthermore, for off mode, please do not apply voltage neither forward nor reverse. Especially,

for the products with the Ag-paste used in the die bonding, there’s high possibility to cause electro migration and

result in function failure.

2-2. Operation Life Span

There’s possibility for intensity of light drop according to working conditions and environments (applied current,

surrounding temperature and humidity, corrosive gases), please call our Sales staffs for inquiries about the

concerned application below.

1 Longtime intensity of light life

2 On mode all the time

2-3.Applied Stress on Product

The top of the LED is very soft, which the silicon resin is used as sealing resin. Therefore, please pay attention

to the overstress on it which may influence its reliability.

2-4.Usage

The Product is LED. We are not responsible for the usage as the diode such as Protection Chip, Rectifier,

Switching and so on.

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Data Sheet

SMLP36 Series

2014.11 - Rev.I

6/7

3. Others

3-1. Surrounding Gas

Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it

may result in low soldering ability (caused by the change in quality of the plating surface ) or optical

characteristics changes (light intensity, chrominance) and change in quality of die bonding (Ag-paste) materials.

All of the above will cause function failure of the products.

Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of

the surrounding parts of the products and the atmospheric environment).

3-2. Electrostatic Damage

The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the

electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and

earthing of production equipment. The resistance values of electrostatic discharge (actual values) vary with

products, therefore, please call our Sales staffs for inquiries.

3-3. Electromagnetic Wave

Please concern the influence on LED in case of application with strong electromagnetic wave such as IH

(Induction heating).

4.Mounting

4-1. Soldering

• No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion

and moisture absorption at humidity will cause heat stress during soldering process and finally has bad

influence on the product’s reliability.

• The product is not for flow soldering.

• Do not expose the product in the environment of high temperature (over 100ºC) or rapid temperature shift

(within 3ºC of temperature gradient) during the flow soldering of surrounding parts.

• Please set appropriate reflow temperature based on our product usage conditions and specification.

• The max for reflowing is 2 times, please finish the second flow soldering and flow soldering with other parts

within the usage limitation after open the moistureproof package.

• Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the

discoloration of the resin.

4-2. Automatic Mounting

4-2-1.Silicon Resin Sealing Product

The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress directly

on the sealing section.

4-2-2.Mini Package (Smaller than 1006 size)

Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top

cover tape. Therefore, the magnet should be set on parts feeder cassette of the mounter to control the product

stabilization. In addition, it is recommended to set ionizer to prevent electrostatic charge.

4-3. Mounting Location

The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or

damage of LED internal junction, therefore, please concern the mounting direction and position to avoid bending

or screwing with great stress of the circuit board.

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Data Sheet

0.45

0.25 0.25

0.450.45

0.450.4

0.4

Mask open area ratio : 80%

Mask thickness : 80 to 100μm

Reference

SMLP36 Series

2014.11 - Rev.I

7/7

4-5. Soldering Pattern for Recommendation

We recommend the soldering pattern that shows on the right. It

will be different according to mounting situation of circuit board,

therefore, please concern before designing.

*The product has adopted the electrode structure that it should

solder with back electrode of the product. Thus, please be

informed that the shape of electrode pin of solder fillet formation

is not guaranteed.

4-6. Reflow Profile

For reflow profile, please refer to the conditions below:(*)

• Meaning of marks, Conditions

Mark Meanings Conditions

Tsmax Maximum of pre-heating temperature 180ºC

Tsmin Minimum of pre-heating temperature 140ºC

Ts Time from Tsmin to Tsmax Over 60sec.

TLReference temperature 230 to 260ºC

tLRetention time for TLWithin 40sec.

TPPeak temperature 260ºC(Max)

tPTime for peak temperature Within 10sec.

ΔTR/Δt Temperature rising rate Under 3ºC/sec.

ΔTD/Δt Temperature decreasing rate Over -3ºC/sec.

*Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces

before using, because stress from circuit boards and temperature variations of reflow furnaces vary by

customer’s own conditions.

4-7. Cleaning after Soldering

Please follow the conditions below if the cleaning is necessary after soldering.

Solvent We recommend to use alcohols solvent such as, isopropyl alcohols

Temperature Under 30ºC within 3 minutes

Ultrasonic Cleaning 15W / Below 1 liter (capacity of tank)

Drying Under 100ºC within 3 minutes

Stress strength according to

the mounting position:

A>B>C>D

4-4. Mechanical Stress after Mounting

The mechanical stress may damage the LED after Circuit Mounting, so please pay attention to the touch on

product.

R1102

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Notice

ROHM Customer Support System

http://www.rohm.com/contact/

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

Notes

The information contained herein is subject to change without notice.

Before you use our Products, please contact our sales representative

and verify the latest specifica-

tions :

Although ROHM is continuously working to improve product reliability and quality, semicon-

ductors can break down and malfunction due to various factors.

Therefore, in order to prevent personal injury or fire arising from failure, please take safety

measures such as complying with the derating characteristics, implementing redundant and

fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no

responsibility for any damages arising out of the use of our Poducts beyond the rating specified by

ROHM.

Examples of application circuits, circuit constants and any other information contained herein are

provided only to illustrate the standard usage and operations of the Products. The peripheral

conditions must be taken into account when designing circuits for mass production.

The technical information specified herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,

any license to use or exercise intellectual property or other rights held by ROHM or any other

parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of

such technical information.

The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-

cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in

this document.

The Products specified in this document are not designed to be radiation tolerant.

For use of our Products in applications requiring a high degree of reliability (as exemplified

below), please contact and consult with a ROHM representative : transportation equipment (i.e.

cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety

equipment, medical systems, servers, solar cells, and power transmission systems.

Do not use our Products in applications requiring extremely high reliability, such as aerospace

equipment, nuclear power control systems, and submarine repeaters.

ROHM shall have no responsibility for any damages or injury arising from non-compliance with

the recommended usage conditions and specifications contained herein.

ROHM has used reasonable care to ensur the accuracy of the information contained in this

document. However, ROHM does not warrants that such information is error-free, and ROHM

shall have no responsibility for any damages arising from any inaccuracy or misprint of such

information.

Please use the Products in accordance with any applicable environmental laws and regulations,

such as the RoHS Directive. For more details, including RoHS compatibility, please contact a

ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting

non-compliance with any applicable laws or regulations.

When providing our Products and technologies contained in this document to other countries,

you must abide by the procedures and provisions stipulated in all applicable export laws and

regulations, including without limitation the US Export Administration Regulations and the Foreign

Exchange and Foreign Trade Act.

This document, in part or in whole, may not be reprinted or reproduced without prior consent of

ROHM.

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