High Speed InGaAs p-i-n Photodiode Sheet 1 of 3 13PD75-TO The 13PD75-TO, an InGaAs photodiode with a 75m-diameter photosensitive region packaged in a TO-46 header, is intended for high speed and low noise applications. The diameter of the photosensitive region is sufficiently small to enable operation at low dark current and low capacitance and yet large enough to allow efficient coupling to multi-mode fiber. Planar semiconductor design and dielectric passivation provide very low noise performance. Reliability is assured by hermetic sealing and 100% purge burn-in (200C, 15 hours, Vr = 20V). Headers are available with either a lensed or flat window cap. Chips can also be attached and wire bonded to customer-supplied or other specified packages. Features: * Planar Structure * Dielectric Passivation * 100% Purge Burn-in * High Responsivity DEVICE CHARACTERISTICS Parameters Test Conditions Operating Voltage Dark Current Capacitance Responsivity Rise/Fall Frequency Response -5V -5V 1300nm Minimum 0.8 Typical 0.2 0.7 0.9 Maximum Units -20 2 0.9 Volts nA pF A/W ns GHz 0.5 (-3dB) 1.5 ABSOLUTE MAXIMUM RATINGS Reverse Voltage Forward Current Reverse Current Operating Temperature Storage Temperature Soldering Temperature 30 Volts 10mA 5mA -40C to +85C -40C to +85C 250C Sheet 1 of 3 829 Flynn Road, Camarillo, CA 93012 * Phone: (805) 445-4500 * Fax: (805) 445-4502 Email: customerservice@telcomdevices.com * Website: www.telcomdevices.com Mechanical Specifications TO-46 Header Packages Sheet 2 of 3 Standard TO-46 Lens 0.210 0.184 LENS 0.030 CHIP 0.144 1.00 0.017 3X CATHODE (BIAS +) 0.050 ANODE (BIAS -) CASE 22.5 0.040 0.040 Custom packaging is also available. 829 Flynn Road, Camarillo, CA 93012 * Phone: (805) 445-4500 * Fax: (805) 445-4502 Email: customerservice@telcomdevices.com * Website: www.telcomdevices.com Sheet 2 of 3 Mechanical Specifications TO-46 Header Packages Sheet 3 of 3 TO-46 Ultra Flat Window 0.100 [2.54] 0.185 [4.70] 0.212 [5.38] 0.125 [3.17] A 0.011 [0.28] 0.015 [0.38] TYP. 0.019 MAX 0.011 [0.28] -ANOT TO SCALE CHIP 1.0 [25.4] 0.015 [0.38] TYP. 0.019 MAX. WINDOW SURFACE TO CHIP SURFACE 45 CASE/GND CATHODE (BIAS +) ANODE(BIAS -) 0.040 [1.02] 0.05 [1.27] 0.049 [1.25] REF. 0.017 [0.43] 3X 0.05 [1.27] Custom packaging is also available. 829 Flynn Road, Camarillo, CA 93012 * Phone: (805) 445-4500 * Fax: (805) 445-4502 Email: customerservice@telcomdevices.com * Website: www.telcomdevices.com Sheet 3 of 3