CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper I.C. Handling Procedures.
Copyright © Harris Corporation 1994 1
SEMICONDUCTOR
CD54AC74/3A
CD54ACT74/3A
Dual D-Type Flip-Flop with Set and Reset
Functional Diagram
1R
1D
2R
2S
1
2
3
13
5
61Q
1Q
10
1CP
4
1S
2D 12
11
9
82Q
2Q
2CP
D
CP
R
FF 1
S
D
CP
R
FF 2
SGND = 7
VCC = 14
Description
The CD54AC74/3A and CD54ACT74/3A are dual D-types,
positive-edge-triggered flip-flops that utilize the Harris
Advanced CMOS Logic technology. These flip-flops have
independent DATA, SET, RESET and CLOCK inputs and Q
and Q outputs. The logic level present at the data input is
transferred to the output during the positive-going transition of
the clock pulse .SET and RESET are independent of the clock
and are accomplished by a low le vel at the appropriate input.
The CD54AC74/3A and CD54ACT74/3A are supplied in 14
lead dual-in-line ceramic packages (F suffix).
ACT INPUT LOAD TABLE
INPUT UNIT LOAD (NOTE 1)
D 0.53
R, S 0.58
CP 1
NOTE:
1. Unit load is ICC limit specified in DC Electrical Specifications
Table, e.g., 2.4mA Max at +25oC.
June 1997
File Number 3883
Absolute Maximum Ratings
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . .±50mA
DC Output Source or Sink Current, Per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . .±50mA
DC VCC or GND Current, ICC or IGND
For Up to 4 Outputs Per Device, Add ±25mA For Each
Additional Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±100mA
Power Dissipation Per Package, PD
TA = -55oC to +100oC (Package F) . . . . . . . . . . . . . . . . . .500mW
TA = +100oC to +125oC (Package F) . . . . . . . . Derate Linearly at
8mW/oC to 300mW
Operating Temperature Range, TA
Package Type F. . . . . . . . . . . . . . . . . . . . . . . . . .-55oC to +125oC
Storage Temperature, TSTG . . . . . . . . . . . . . . . . . .-65oC to +150oC
Lead Temperature (During Soldering)
At Distance 1/16in. ± 1/32in. (1.59mm ± 0.79mm)
From Case For 10s Max . . . . . . . . . . . . . . . . . . . . . . . . . . +265oC
Unit Inserted Into a PC Board (Min Thickness 1/16in., 1.59mm)
With Solder Contacting Lead Tips Only. . . . . . . . . . . . . . . +300oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Recommended Operating Conditions
Supply Voltage Range, VCC
Unless Otherwise Specified, All Voltages Referenced to GND
TA = Full Package Temperature Range
CD54AC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V
CD54ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO. . . . . . . . . . . . . . . . . . 0V to VCC
Operating Temperature, TA . . . . . . . . . . . . . . . . . . .-55oC to +125oC
Input Rise and Fall Slew Rate, dt/dv
at 1.5V to 3V (AC Types). . . . . . . . . . . . . . . . . . . 0ns/V to 50ns/V
at 3.6V to 5.5V (AC Types) . . . . . . . . . . . . . . . . . 0ns/V to 20ns/V
at 4.5V to 5.5V (AC Types) . . . . . . . . . . . . . . . . . 0ns/V to 10ns/V
COMING SOON!
COMPLETE DATA SHEET