Ceramic Discriminators Notice
69
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!Note • Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specification or transact the approval sheet for product specification before ordering.
■ CDBCB Series Notice (Handling)
1. The component will be damaged when an excessive
stress is applied.
2. In the case that the component is cleaned, confirm
no reliability degradation is created.
3. In case of covering filter with over coat,
conditions such as material of resin, cure
temperature, and so on should be evaluated well.
4. Do not use strong acidity flux, more than 0.2wt%
chlorine content, in re-flow soldering.
5. The product, packed in the moisture-proof bag (dry
pack), is sensitive to moisture.
The following treatment is required before applying
re-flow soldering, to avoid package cracks or
reliability degradation caused by thermal stress.
When unpacked, store the component in an atmosphere
of below 25C. and below 65%R.H., and solder within
48 hours.
■ CDBLA/CDBLB Series Notice (Handling)
1. Do not use this product with bend. The component
may be damaged if excess mechanical stress is
applied to it mounted on the printed circuit board.
2. The component will be damaged when an excessive
stress is applied.
3. All kinds of re-flow soldering must not be applied
on the component.
4. Do not clean or wash the component as it is not
hermetically sealed.
5. Do not use strong acidity flux, more than 0.2wt%
chlorine content, in flow soldering.
6. In case of covering discriminator with over coat,
conditions such as material of resin, cure
emperature, and so on should be evaluated well.
■ CDSCA Series Notice (Handling)
1. The component mounted on the PCB may be damaged if
excess mechanical stress is applied.
2. Layout the components on the PCB to minimize the
stress imposed by the warp or flexure of the board.
3. After installing components, if solder is excessively
applied to the circuit board, mechanical stress will cause
destruction resistance characteristics to be lower. To
prevent this, be extremely careful in determining shape
and dimension before designing the circuit board diagram.
4. When the positioning claw or pick up nozzle are worn, the
excess load is applied to the components while
positioning or placing are performed. Careful checking
and maintenance are necessary to prevent unexpected
trouble.
5. When correcting component's position with a soldering
iron, the tip of the soldering iron should not directly touch
the chip component. Depending on the soldering
conditions, the effective area of terminations may be
reduced. The use of solder containing Ag should be
considerd to prevent the electrode erosion.
6. Do not clean or wash the component as it is not
hermetically sealed.
7. In case of overcoating the part, coating conditions such
as material, curing temperature, and so on must be
evaluated deeply.
8. Accurate test circuit values are required to measure
electrical characteristics.
It may be a cause of mis-correlation if there is any
deviation, especially stray capacitance, from the test
circuit in the specification.
[Component direction]
[Component layout close to board]
Put the
component
laterally to the
direction in
which stress
acts.
Susceptibility to
stress is in the order
of : A>C>B
B
AC
Slit
Perforation
Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specification or to transact the approval sheet for product specificaion before ordering.
!Note P05E11.pdf 02.9.2