3.2X1.6mm SMD CHIP LED LAMP APK3216SYC Features !3.2mmX1.6mm SMT LED, 1.1mm !LOW THICKNESS. POWER CONSUMPTION. ! WIDE ! IDEAL VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE :2000PCS / REEL. SUPER BRIGHT YELLOW Description The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1148 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e APK3216SYC Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW (InGaAlP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 21/2 50 110 90 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l Par am et er D ev i c e peak Peak Wavelength Super Bright Yellow D Dominate Wavelength 1/2 Ty p . Max . Un it s Tes t Co n d it io n s 590 nm IF = 2 0 m A Super Bright Yellow 588 nm IF = 2 0 m A Spectral Line Half-width Super Bright Yellow 28 nm IF = 2 0 m A C Capacitance Super Bright Yellow 25 pF V F = 0 V; f = 1 M Hz VF Forward Voltage Super Bright Yellow 2.0 2.5 V IF = 2 0 m A IR Reverse Current Super Bright Yellow 10 uA VR = 5V Absolute Maximum Ratings at T)=25C P ar am e t e r Su p er B r ig h t Yello w Un it s Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating/Storage Temperature -40C To +85C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD1148 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 2 OF 4 Super Bright Yellow SPEC NO: DSAD1148 APPROVED:J.Lu APK3216SYC REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 3 OF 4 APK3216SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1148 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 4 OF 4