DAC081C085CIMMX/NOPB - NATIONAL SEMICONDUCTOR

DAC081C081,DAC081C085

DAC081C081/ DAC081C085 8-Bit Micro Power Digital-to-Analog Converter with

an I2C-Compatible Interface

Literature Number: SNAS449C

April 16, 2008

DAC081C081/ DAC081C085

8-Bit Micro Power Digital-to-Analog Converter with an

I2C-Compatible Interface

General Description

The DAC081C081 is an 8-bit, single channel, voltage-output

digital-to-analog converter (DAC) that operates from a +2.7V

to 5.5V supply. The output amplifier allows rail-to-rail output

swing and has an 4.5µsec settling time. The DAC081C081

uses the supply voltage as the reference to provide the widest

dynamic output range and typically consumes 132µA while

operating at 5.0V. It is available in 6-lead TSOT and LLP

packages and provides three address options (pin se-

lectable).

As an alternative, the DAC081C085 provides nine I2C ad-

dressing options and uses an external reference. It has the

same performance and settling time as the DAC081C081. It

is available in an 8-lead MSOP.

The DAC081C081 and DAC081C085 use a 2-wire, I2C-com-

patible serial interface that operates in all three speed modes,

including high speed mode (3.4MHz). An external address

selection pin allows up to three DAC081C081 or nine

DAC081C085 devices per 2-wire bus. Pin compatible alter-

natives to the DAC081C081 are available that provide addi-

tional address options.

The DAC081C081 and DAC081C085 each have a 16-bit reg-

ister that controls the mode of operation, the power-down

condition, and the output voltage. A power-on reset circuit

ensures that the DAC output powers up to zero volts. A power-

down feature reduces power consumption to less than a

microWatt. Their low power consumption and small packages

make these DACs an excellent choice for use in battery op-

erated equipment. Each DAC operates over the extended

industrial temperature range of −40°C to +125°C.

The DAC081C081 and DAC081C085 are each part of a fam-

ily of pin compatible DACs that also provide 12 and 10 bit

resolution. For 12-bit DACs see the DAC121C081 and

DAC121C085. For 10-bit DACs see the DAC101C081 and

DAC101C085.

Features

■Guaranteed Monotonicity to 8-bits

■Low Power Operation: 156 µA max @ 3.3V

■Extended power supply range (+2.7V to +5.5V)

■I2C-Compatible 2-wire Interface which supports standard

(100kHz), fast (400kHz), and high speed (3.4MHz) modes

■Rail-to-Rail Voltage Output

■Very Small Package

Key Specifications

■Resolution 8 bits

■INL ±0.6 LSB (max)

■DNL ±0.1 LSB (max)

■Settling Time 4.5 µs (max)

■Zero Code Error +10 mV (max)

■Full-Scale Error −0.7 %FS (max)

■Supply Power

—Normal 380 µW (3V) / 730 µW (5V) typ

—Power Down 0.5 µW (3V) / 0.9 µW (5V) typ

Applications

■Industrial Process Control

■Portable Instruments

■Digital Gain and Offset Adjustment

■Programmable Voltage & Current Sources

■Test Equipment

Pin-Compatible Alternatives

All devices are fully pin and function compatible.

Resolution TSOT-6 and LLP-6

Packages

MSOP-8 Package w/

External Reference

12-bit DAC121C081 DAC121C085

10-bit DAC101C081 DAC101C085

8-bit DAC081C081 DAC081C085

Connection Diagrams

30052301 30052302 30052310

I2C® is a registered trademark of Phillips Corporation.

DAC081C081/ DAC081C085 8-Bit Micro Power Digital-to-Analog Converter with an

I2C-Compatible Interface

Ordering Information

Order Code Temperature Range Package Top Mark

DAC081C081CIMK −40°C ≤ TA ≤ +125°C TSOT X86C

DAC081C081CIMKX −40°C ≤ TA ≤ +125°C TSOT Tape-and-Reel X86C

DAC081C081CISD −40°C ≤ TA ≤ +125°C LLP X89

DAC081C081CISDX −40°C ≤ TA ≤ +125°C LLP Tape-and-Reel X89

DAC081C085CIMM −40°C ≤ TA ≤ +125°C MSOP X92C

DAC081C085CIMMX −40°C ≤ TA ≤ +125°C MSOP Tape-and-Reel X92C

DAC081C08XEB Evaluation Board

Block Diagram

30052303

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DAC081C081/ DAC081C085

Pin Descriptions

Symbol Type Equivalent Circuit Description

VOUT Analog Output Analog Output Voltage.

VASupply

Power supply input. For the TSOT and LLP versions, this

supply is used as the reference. Must be decoupled to

GND.

GND Ground Ground for all on-chip circuitry.

SDA Digital

Input/Output

Serial Data bi-directional connection. Data is clocked into

or out of the internal 16-bit register relative to the clock

edges of SCL. This is an open drain data line that must be

pulled to the supply (VA) by an external pull-up resistor.

SCL Digital Input Serial Clock Input. SCL is used together with SDA to

control the transfer of data in and out of the device.

ADR0 Digital Input,

three levels

Tri-state Address Selection Input. Sets the two Least

Significant Bits (A1 & A0) of the 7-bit slave address. (see

Table 1)

ADR1 Digital Input,

three levels

Tri-state Address Selection Input. Sets Bits A6 & A3 of the

7-bit slave address. (see Table 1)

VREF Supply

Unbufferred reference voltage. For the MSOP-8, this

supply is used as the reference. VREF must be free of noise

and decoupled to GND.

PAD

(LLP only) Ground

Exposed die attach pad can be connected to ground or left

floating. Soldering the pad to the PCB offers optimal

thermal performance and enhances package self-

alignment during reflow.

Package Pinouts Problem COL4

VOUT VAGND SDA SCL ADR0 ADR1 VREF PAD (LLP only)

TSOT 1 2 3 4 5 6 N/A N/A N/A

LLP 6 5 4 3 2 1 N/A N/A 7

MSOP-8 86543127 N/A

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DAC081C081/ DAC081C085

Absolute Maximum Ratings

(Notes 1, 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage, VA−0.3V to +6.5V

Voltage on any Input Pin −0.3V to +6.5V

Input Current at Any Pin (Note 3) ±10 mA

Package Input Current (Note 3) ±20 mA

Power Consumption at TA = 25°C See (Note 4)

ESD Susceptibility (Note 5)

VA, GND, VREF, VOUT,

ADR0, ADR1 pins:

Human Body Model

Machine Model

Charged Device Model (CDM)

SDA, SCL pins:

Human Body Model

Machine Model

Charged Device Model (CDM)

2500V

250V

1000V

5000V

350V

1000V

Junction Temperature +150°C

Storage Temperature −65°C to +150°C

Operating Ratings (Notes 1, 2)

Operating Temperature Range −40°C ≤ TA ≤ +125°C

Supply Voltage, VA+2.7V to 5.5V

Reference Voltage, VREFIN +1.0V to VA

Digital Input Voltage (Note 7) 0.0V to 5.5V

Output Load 0 to 1500 pF

Package Thermal Resistances

Package θJA

6-Lead TSOT 250°C/W

6-Lead LLP 190°C/W

8-Lead MSOP 240°C/W

Soldering process must comply with National

Semiconductor's Reflow Temperature Profile specifications.

Refer to www.national.com/packaging. (Note 6)

Electrical Characteristics

Values shown in this table are design targets and are subject to change before product release.

The following specifications apply for VA = +2.7V to +5.5V, VREF = VA, CL = 200 pF to GND, input code range 3 to 252. Boldface

limits apply for TMIN ≤ TA ≤ TMAX and all other limits are at TA = 25°C, unless otherwise specified.

Symbol Parameter Conditions Typical

(Note 9)

Limits

(Note 9)

Units

(Limits)

STATIC PERFORMANCE

Resolution 8Bits (min)

Monotonicity 8Bits (min)

INL Integral Non-Linearity +0.14 +0.6 LSB (max)

−0.14 −0.6 LSB (min)

DNL Differential Non-Linearity +0.04 +0.1 LSB (max)

−0.02 −0.1 LSB (min)

ZE Zero Code Error IOUT = 0 +1.1 +10 mV (max)

FSE Full-Scale Error IOUT = 0 −0.1 −0.7 %FSR (max)

GE Gain Error All ones Loaded to DAC register −0.2 −0.7 %FSR (max)

ZCED Zero Code Error Drift −20 µV/°C

TC GE Gain Error Tempco VA = 3V −0.7 ppm FSR/°C

VA = 5V −1.0 ppm FSR/°C

ANALOG OUTPUT CHARACTERISTICS (VOUT)

Output Voltage Range(Note 10)

DAC081C085 0

VREF

V (min)

V (max)

DAC081C081 0

V (min)

V (max)

ZCO Zero Code Output VA = 3V, IOUT = 200 µA 1.3 mV

VA = 5V, IOUT = 200 µA 7.0 mV

FSO Full Scale Output VA = 3V, IOUT = 200 µA 2.984 V

VA = 5V, IOUT = 200 µA 4.989 V

IOS

Output Short Circuit Current

(ISOURCE)

VA = 3V, VOUT = 0V, Input Code = FFFh. 56 mA

VA = 5V, VOUT = 0V, Input Code = FFFh. 69 mA

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DAC081C081/ DAC081C085

Symbol Parameter Conditions Typical

(Note 9)

Limits

(Note 9)

Units

(Limits)

IOS

Output Short Circuit Current

(ISINK)

VA = 3V, VOUT = 3V, Input Code = 000h. −52 mA

VA = 5V, VOUT = 5V, Input Code = 000h. −75 mA

Continuous Output

Current (Note 10) Available on the DAC output 11 mA (max)

CLMaximum Load Capacitance RL = ∞1500 pF

RL = 2kΩ1500 pF

ZOUT DC Output Impedance 7.5 Ω

REFERENCE INPUT CHARACTERISTICS- (DAC081C085 only)

VREF

Input Range Minimum 0.2 1.0 V (min)

Input Range Maximum VAV (max)

Input Impedance 120 kΩ

LOGIC INPUT CHARACTERISTICS (SCL, SDA)

VIH Input High Voltage 0.7 x VAV (min)

VIL Input Low Voltage 0.3 x VAV (max)

IIN Input Current ±1 µA (max)

CIN Input Pin Capacitance (Note 10) 3pF (max)

VHYST Input Hysteresis 0.1 x VAV (min)

LOGIC INPUT CHARACTERISTICS (ADR0, ADR1)

VIH Input High Voltage VA- 0.5V V (min)

VIL Input Low Voltage 0.5 V (max)

IIN Input Current ±1 µA (max)

LOGIC OUTPUT CHARACTERISTICS (SDA)

VOL Output Low Voltage ISINK = 3 mA 0.4 V (max)

ISINK = 6 mA 0.6 V (max)

IOZ

High-Impedence Output

Leakage Current ±1 µA (max)

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DAC081C081/ DAC081C085

Symbol Parameter Conditions Typical

(Note 9)

Limits

(Note 9)

Units

(Limits)

POWER REQUIREMENTS

Supply Voltage Minimum 2.7 V (min)

Supply Voltage Maximum 5.5 V (max)

Normal -- VOUT set to midscale. 2-wire interface quiet (SCL = SDA = VA). (output unloaded)

IST_VA-1 VA DAC081C081 Supply Current VA = 2.7V to 3.6V 105 156 µA (max)

VA = 4.5V to 5.5V 132 214 µA (max)

IST_VA-5 VA DAC081C085 Supply Current VA = 2.7V to 3.6V 86 118 µA (max)

VA = 4.5V to 5.5V 98 152 µA (max)

IST_VREF

VREF Supply Current

(DAC081C085 only) VA = 2.7V to 3.6V 37 43 µA (max)

VA = 4.5V to 5.5V 53 61 µA (max)

PST

Power Consumption

(VA & VREF for DAC081C085) VA = 3.0V 380 µW

VA = 5.0V 730 µW

Continuous Operation -- 2-wire interface actively addressing the DAC and writing to the DAC register. (output unloaded)

ICO_VA-1 VA DAC081C081 Supply Current

fSCL=400kHz VA = 2.7V to 3.6V 134 220 µA (max)

VA = 4.5V to 5.5V 192 300 µA (max)

fSCL=3.4MHz VA = 2.7V to 3.6V 225 320 µA (max)

VA = 4.5V to 5.5V 374 500 µA (max)

ICO_VA-5 VA DAC081C085 Supply Current

fSCL=400kHz VA = 2.7V to 3.6V 101 155 µA (max)

VA = 4.5V to 5.5V 142 220 µA (max)

fSCL=3.4MHz VA = 2.7V to 3.6V 193 235 µA (max)

VA = 4.5V to 5.5V 325 410 µA (max)

ICO_VREF

VREF Supply Current

(DAC081C085 only) VA = 2.7V to 3.6V 33.5 55 µA (max)

VA = 4.5V to 5.5V 49.5 71.4 µA (max)

PCO

Power Consumption

(VA & VREF for DAC081C085)

fSCL=400kHz VA = 3.0V 480 µW

VA = 5.0V 1.06 mW

fSCL=3.4MHz VA = 3.0V 810 µW

VA = 5.0V 2.06 mW

Power Down -- 2-wire interface quiet (SCL = SDA = VA) after PD mode written to DAC register. (output unloaded)

IPD

Supply Current

(VA & VREF for DAC081C085)

All Power Down

Modes

VA = 2.7V to 3.6V 0.13 1.52 µA (max)

VA = 4.5V to 5.5V 0.15 3.25 µA (max)

PPD

Power Consumption

(VA & VREF for DAC081C085)

All Power Down

Modes

VA = 3.0V 0.5 µW

VA = 5.0V 0.9 µW

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DAC081C081/ DAC081C085

A.C. and Timing Characteristics

Values shown in this table are design targets and are subject to change before product release.

The following specifications apply for VA = +2.7V to +5.5V, VREF = VA, RL = Infinity, CL = 200 pF to GND. Boldface limits apply

for TMIN ≤ TA ≤ TMAX and all other limits are at TA = 25°C, unless otherwise specified.

Symbol Parameter Conditions (Note 13) Typical

(Note 9)

Limits

(Notes 9,

13)

Units

(Limits)

Output Voltage Settling Time

(Note 10)

40h to C0h code change

RL = 2kΩ, CL = 200 pF 34.5 µs (max)

SR Output Slew Rate 1 V/µs

Glitch Impulse Code change from 80h to 7Fh 12 nV-sec

Digital Feedthrough 0.5 nV-sec

Multiplying Bandwidth(Note 12) VREF = 2.5V ± 0.1Vpp 160 kHz

Total Harmonic Distortion(Note 12) VREF = 2.5V ± 0.1Vpp

input frequency = 10kHz 70 dB

tWU Wake-Up Time VA = 3V 0.8 µsec

VA = 5V 0.5 µsec

DIGITAL TIMING SPECS (SCL, SDA)

fSCL Serial Clock Frequency

Standard Mode

Fast Mode

High Speed Mode, Cb = 100pF

High Speed Mode, Cb = 400pF

100

400

3.4

1.7

kHz (max)

MHz (max)

tLOW SCL Low Time

Standard Mode

Fast Mode

High Speed Mode, Cb = 100pF

High Speed Mode, Cb = 400pF

4.7

1.3

160

320

µs (min)

ns (min)

tHIGH SCL High Time

Standard Mode

Fast Mode

High Speed Mode, Cb = 100pF

High Speed Mode, Cb = 400pF

4.0

0.6

120

µs (min)

ns (min)

tSU;DAT Data Setup Time

Standard Mode

Fast Mode

High Speed Mode

250

100

ns (min)

tHD;DAT Data Hold Time

Standard Mode 0

3.45

µs (min)

µs (max)

Fast Mode 0

0.9

µs (min)

µs (max)

High Speed Mode, Cb = 100pF 0

ns (min)

ns (max)

High Speed Mode, Cb = 400pF 0

150

ns (min)

ns (max)

tSU;STA

Setup time for a start or a repeated

start condition

Standard Mode

Fast Mode

High Speed Mode

4.7

0.6

160

µs (min)

ns (min)

tHD;STA

Hold time for a start or a repeated start

condition

Standard Mode

Fast Mode

High Speed Mode

4.0

0.6

160

µs (min)

ns (min)

tBUF

Bus free time between a stop and start

condition

Standard Mode

Fast Mode 4.7

1.3

µs (min)

tSU;STO Setup time for a stop condition

Standard Mode

Fast Mode

High Speed Mode

4.0

0.6

160

µs (min)

ns (min)

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DAC081C081/ DAC081C085

Symbol Parameter Conditions (Note 13) Typical

(Note 9)

Limits

(Notes 9,

13)

Units

(Limits)

trDA Rise time of SDA signal

Standard Mode 1000 ns (max)

Fast Mode 20+0.1Cb

300

ns (min)

ns (max)

High Speed Mode, Cb = 100pF 10

ns (min)

ns (max)

High Speed Mode, Cb = 400pF 20

160

ns (min)

ns (max)

tfDA Fall time of SDA signal

Standard Mode 250 ns (max)

Fast Mode 20+0.1Cb

250

ns (min)

ns (max)

High Speed Mode, Cb = 100pF 10

ns (min)

ns (max)

High Speed Mode, Cb = 400pF 20

160

ns (min)

ns (max)

trCL Rise time of SCL signal

Standard Mode 1000 ns (max)

Fast Mode 20+0.1Cb

300

ns (min)

ns (max)

High Speed Mode, Cb = 100pF 10

ns (min)

ns (max)

High Speed Mode, Cb = 400pF 20

ns (min)

ns (max)

trCL1

Rise time of SCL signal after a

repeated start condition and after an

acknowledge bit.

Standard Mode 1000 ns (max)

Fast Mode 20+0.1Cb

300

ns (min)

ns (max)

High Speed Mode, Cb = 100pF 10

ns (min)

ns (max)

High Speed Mode, Cb = 400pF 20

160

ns (min)

ns (max)

tfCL Fall time of a SCL signal

Standard Mode 300 ns (max)

Fast Mode 20+0.1Cb

300

ns (min)

ns (max)

High Speed Mode, Cb = 100pF 10

ns (min)

ns (max)

High Speed Mode, Cb = 400pF 20

ns (min)

ns (max)

Capacitive load for each bus line (SCL

and SDA) 400 pF (max)

tSP

Pulse Width of spike suppressed

(Notes 11, 10)

Fast Mode

High Speed Mode 50

ns (max)

toutz SDA output delay (see Section 1.9) Fast Mode

High Speed Mode

270

ns (max)

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.

Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified.

Note 3: When the input voltage at any pin exceeds 5.5V or is less than GND, the current at that pin should be limited to 10 mA. The 20 mA maximum package

input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two.

Note 4: The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the

junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / θJA. The values

for maximum power dissipation will be reached only when the device is operated in a severe fault condition (e.g., when input or output pins are driven beyond

the operating ratings, or the power supply polarity is reversed).

Note 5: Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is a 220 pF capacitor discharged through 0 Ω. Charge

device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged.

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DAC081C081/ DAC081C085

Note 6: Reflow temperature profiles are different for lead-free packages.

Note 7: The inputs are protected as shown below. Input voltage magnitudes up to 5.5V, regardless of VA, will not cause errors in the conversion result. For

example, if VA is 3V, the digital input pins can be driven with a 5V logic device.

30052304

Note 8: To guarantee accuracy, it is required that VA and VREF be well bypassed.

Note 9: Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are guaranteed to National's AOQL (Average Outgoing Quality

Level).

Note 10: This parameter is guaranteed by design and/or characterization and is not tested in production.

Note 11: Spike suppression filtering on SCL and SDA will supress spikes that are less than 50ns for standard-fast mode and less than 10ns for hs-mode.

Note 12: Applies to the Multiplying DAC configuration. In this configuration, the reference is used as the analog input. The value loaded in the DAC Register will

digitally attenuate the signal at Vout.

Note 13: Cb refers to the capacitance of one bus line. Cb is expressed in pF units.

Specification Definitions

DIFFERENTIAL NON-LINEARITY (DNL) is the measure of

the maximum deviation from the ideal step size of 1 LSB,

which is VREF / 256 = VA / 256.

DIGITAL FEEDTHROUGH is a measure of the energy inject-

ed into the analog output of the DAC from the digital inputs

when the DAC output is not updated. It is measured with a

full-scale code change on the data bus.

FULL-SCALE ERROR is the difference between the actual

output voltage with a full scale code (FFFh) loaded into the

DAC and the value of VA x 255 / 256.

GAIN ERROR is the deviation from the ideal slope of the

transfer function. It can be calculated from Zero and Full-

Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE

is Full-Scale Error and ZE is Zero Error.

GLITCH IMPULSE is the energy injected into the analog out-

put when the input code to the DAC register changes. It is

specified as the area of the glitch in nanovolt-seconds.

INTEGRAL NON-LINEARITY (INL) is a measure of the de-

viation of each individual code from a straight line through the

input to output transfer function. The deviation of any given

code from this straight line is measured from the center of that

code value. The end point method is used. INL for this product

is specified over a limited range, per the Electrical Tables.

LEAST SIGNIFICANT BIT (LSB) is the bit that has the small-

est value or weight of all bits in a word. This value is

LSB = VREF / 2n

where VREF is the supply voltage for this product, and "n" is

the DAC resolution in bits, which is 8 for the DAC081C081.

MAXIMUM LOAD CAPACITANCE is the maximum capaci-

tance that can be driven by the DAC with output stability

maintained.

MONOTONICITY is the condition of being monotonic, where

the DAC has an output that never decreases when the input

code increases.

MOST SIGNIFICANT BIT (MSB) is the bit that has the largest

value or weight of all bits in a word. Its value is 1/2 of VA.

MULTIPLYING BANDWIDTH is the frequency at which the

output amplitude falls 3dB below the input sine wave on

VREFIN with a full-scale code loaded into the DAC.

POWER EFFICIENCY is the ratio of the output current to the

total supply current. The output current comes from the power

supply. The difference between the supply and output cur-

rents is the power consumed by the device without a load.

SETTLING TIME is the time for the output to settle to within

1/2 LSB of the final value after the input code is updated.

TOTAL HARMONIC DISTORTION (THD) is the measure of

the harmonics present at the output of the DACs with an ideal

sine wave applied to VREFIN. THD is measured in dB.

WAKE-UP TIME is the time for the output to exit power-down

mode. This time is measured from the rising edge of SCL

during the ACK bit of the lower data byte to the time the output

voltage deviates from the power-down voltage of 0V.

ZERO CODE ERROR is the output error, or voltage, present

at the DAC output after a code of 000h has been entered.

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DAC081C081/ DAC081C085

Transfer Characteristic

30052305

FIGURE 1. Input / Output Transfer Characteristic

Timing Diagrams

30052360

FIGURE 2. Serial Timing Diagram

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DAC081C081/ DAC081C085

Typical Performance Characteristics VREF = VA, fSCL = 3.4MHz, TA = 25°C, Input Code Range 3 to 252,

unless otherwise stated.

INL

30052320

DNL

30052321

INL/DNL vs Temperature at VA = 3.0V

30052322

INL/DNL vs Temperature at VA = 5.0V

30052323

INL/DNL vs VREFIN at VA = 3.0V

30052324

INL/DNL vs VREFIN at VA = 5.0V

30052325

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DAC081C081/ DAC081C085

INL/DNL vs VA

30052326

Zero Code Error vs. VA

30052327

Zero Code Error vs. Temperature

30052328

Full Scale Error vs. VA

30052336

Full Scale Error vs. Temperature

30052329

Total Supply Current vs. VA

30052330

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DAC081C081/ DAC081C085

VREF Supply Current vs. VA

30052331

Total Supply Current vs. Temperature @ VA = 3V

30052332

Total Supply Current vs. Temperature @ VA = 5V

30052333

5V Glitch Response

30052334

Power-On Reset

30052335

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DAC081C081/ DAC081C085

1.0 Functional Description

1.1 DAC SECTION

The DAC081C081 is fabricated on a CMOS process with an

architecture that consists of switches and resistor strings that

are followed by an output buffer.

For simplicity, a single resistor string is shown in Figure 3.

This string consists of 256 equal valued resistors with a switch

at each junction of two resistors, plus a switch to ground. The

code loaded into the DAC register determines which switch is

closed, connecting the proper node to the amplifier. The input

coding is straight binary with an ideal output voltage of:

VOUT = VREF x (D / 256)

where D is the decimal equivalent of the binary code that is

loaded into the DAC register. D can take on any integer value

between 0 and 255. This configuration guarantees that the

DAC is monotonic.

30052307

FIGURE 3. DAC Resistor String

1.2 OUTPUT AMPLIFIER

The output amplifier is rail-to-rail, providing an output voltage

range of 0V to VA when the reference is VA. All amplifiers,

even rail-to-rail types, exhibit a loss of linearity as the output

approaches the supply rails (0V and VA, in this case). For this

reason, linearity is specified over less than the full output

range of the DAC. However, if the reference is less than VA,

there is only a loss in linearity in the lowest codes. The output

capabilities of the amplifier are described in the Electrical Ta-

bles.

The output amplifiers are capable of driving a load of 2 kΩ in

parallel with 1500 pF to ground or to VA. The zero-code and

full-scale outputs for given load currents are available in the

Electrical Characteristics Table.

1.3 REFERENCE VOLTAGE

The DAC081C081 uses the supply (VA) as the reference.

With that said, VA must be treated as a reference. The Analog

output will only be as clean as the reference (VA). It is rec-

ommended that the reference be driven by a voltage source

with low output impedance.

The DAC081C085 comes with an external reference supply

pin (VREF). For the DAC081C085, it is important that VREF be

kept as clean as possible.

The Applications section describes a handful of ways to drive

the reference appropriately. Refer to Section 2.1 for details.

www.national.com 14

DAC081C081/ DAC081C085

1.4 SERIAL INTERFACE

The I2C-compatible interface operates in all three speed

modes. Standard mode (100kHz) and Fast mode (400kHz)

are functionally the same and will be referred to as Standard-

Fast mode in this document. High-Speed mode (3.4MHz) is

an extension of Standard-Fast mode and will be referred to

as Hs-mode in this document. The following diagrams de-

scribe the timing relationships of the clock (SCL) and data

(SDA) signals. Pull-up resistors or current sources are re-

quired on the SCL and SDA busses to pull them high when

they are not being driven low. A logic zero is transmitted by

driving the output low. A logic high is transmitted by releasing

the output and allowing it to be pulled-up externally. The ap-

propriate pull-up resistor values will depend upon the total bus

capacitance and operating speed.

1.4.1 Basic I2C Protocol

The I2C interface is bi-directional and allows multiple devices

to operate on the same bus. To facilitate this bus configura-

tion, each device has a unique hardware address which is

referred to as the "slave address." To communicate with a

particular device on the bus, the controller (master) sends the

slave address and listens for a response from the slave. This

response is referred to as an acknowledge bit. If a slave on

the bus is addressed correctly, it Acknowledges (ACKs) the

master by driving the SDA bus low. If the address doesn't

match a device's slave address, it Not-acknowledges

(NACKs) the master by letting SDA be pulled high. ACKs also

occur on the bus when data is being transmitted. When the

master is writing data, the slave ACKs after every data byte

is successfully received. When the master is reading data, the

master ACKs after every data byte is received to let the slave

know it wants to receive another data byte. When the master

wants to stop reading, it NACKs after the last data byte and

creates a Stop condition on the bus.

All communication on the bus begins with either a Start con-

dition or a Repeated Start condition. The protocol for starting

the bus varies between Standard-Fast mode and Hs-mode.

In Standard-Fast mode, the master generates a Start condi-

tion by driving SDA from high to low while SCL is high. In Hs-

mode, starting the bus is more complicated. Please refer to

section 1.4.3 for the full details of a Hs-mode Start condition.

A Repeated Start is generated to either address a different

device, or switch between read and write modes. The master

generates a Repeated Start condition by driving SDA low

while SCL is high. Following the Repeated Start, the master

sends out the slave address and a read/write bit as shown in

Figure 4. The bus continues to operate in the same speed

mode as before the Repeated Start condition.

All communication on the bus ends with a Stop condition. In

either Standard-Fast mode or Hs-Mode, a Stop condition oc-

curs when SDA is pulled from low to high while SCL is high.

After a Stop condition, the bus remains idle until a master

generates a Start condition.

Please refer to the Phillips I2C® Specification (Version 2.1

Jan, 2000) for a detailed description of the serial interface.

30052311

FIGURE 4. Basic Operation.

1.4.2 Standard-Fast Mode

In Standard-Fast mode, the master generates a start condi-

tion by driving SDA from high to low while SCL is high. The

Start condition is always followed by a 7-bit slave address and

a Read/Write bit. After these eight bits have been transmitted

by the master, SDA is released by the master and the

DAC081C081 either ACKs or NACKs the address. If the slave

address matches, the DAC081C081 ACKs the master. If the

address doesn't match, the DAC081C081 NACKs the master.

For a write operation, the master follows the ACK by sending

the upper eight data bits to the DAC081C081. Then the

DAC081C081 ACKs the transfer by driving SDA low. Next,

the lower eight data bits are sent by the master. The

DAC081C081 then ACKs the transfer. At this point, the DAC

output updates to reflect the contents of the 16-bit DAC reg-

ister. Next, the master either sends another pair of data bytes,

generates a Stop condition to end communication, or gener-

ates a Repeated Start condition to communicate with another

device on the bus.

For a read operation, the DAC081C081 sends out the upper

eight data bits of the DAC register. This is followed by an ACK

by the master. Next, the lower eight data bits of the DAC reg-

ister are sent to the master. The master then produces a

NACK by letting SDA be pulled high. The NACK is followed

by a master-generated Stop condition to end communication

on the bus, or a Repeated Start to communicate with another

device on the bus.

15 www.national.com

DAC081C081/ DAC081C085

1.4.3 High-Speed (Hs) Mode

For Hs-mode, the sequence of events to begin communica-

tion differ slightly from Standard-Fast mode. Figure 5 de-

scribes this in further detail. Initially, the bus begins running

in Standard-Fast mode. The master generates a Start condi-

tion and sends the 8-bit Hs master code (00001XXX) to the

DAC081C081. Next, the DAC081C081 responds with a

NACK. Once the SCL line has been pulled to a high level, the

master switches to Hs-mode by increasing the bus speed and

generating a Repeated Start condition (driving SDA low while

SCL is pulled high). At this point, the master sends the slave

address to the DAC081C081, and communication continues

as shown above in the "Basic Operation" Diagram (see Figure

4).

When the master generates a Repeated Start condition while

in Hs-mode, the bus stays in Hs-mode awaiting the slave ad-

dress from the master. The bus continues to run in Hs-mode

until a Stop condition is generated by the master. When the

master generates a Stop condition on the bus, the bus must

be started in Standard-Fast mode again before increasing the

bus speed and switching to Hs-mode.

30052312

FIGURE 5. Beginning Hs-Mode Communication

1.4.4 I2C Slave (Hardware) Address

The DAC has a seven-bit I2C slave address. For the MSOP-8

version of the DAC, this address is configured by the ADR0

and ADR1 address selection inputs. For the DAC081C081,

the address is configured by the ADR0 address selection in-

put. ADR0 and ADR1 can be grounded, left floating, or tied to

VA. If desired, the address selection inputs can be set to VA/

2 rather than left floating. The state of these inputs sets the

address the DAC responds to on the I2C bus (see Table 1).

In addition to the selectable slave address, there is also a

broadcast address (1001000) for all DAC081C081's and

DAC081C085's on the 2-wire bus. When the bus is addressed

by the broadcast address, all the DAC081C081's and

DAC081C085's will respond and update synchronously. Fig-

ure 6 and Figure 7 describe how the master device should

address the DAC via the I2C-Compatible interface.

Keep in mind that the address selection inputs (ADR0 and

ADR1) are only sampled until the DAC is correctly addressed

with a non-broadcast address. At this point, the ADR0 and

ADR1 inputs TRI-STATE and the slave address is "locked".

Changes to ADR0 and ADR1 will not update the selected

slave address until the device is power-cycled.

TABLE 1. Slave Addresses

Slave Address

[A6 - A0]

DAC081C085 (MSOP-8)

DAC081C081

(TSOT & LLP) *

ADR1 ADR0 ADR0

0001100 Floating Floating Floating

0001101 Floating GND GND

0001110 Floating VAVA

0001000 GND Floating ---------------

0001001 GND GND ---------------

0001010 GND VA---------------

1001100 VAFloating ---------------

1001101 VAGND ---------------

1001110 VAVA---------------

1001000 --------------- Broadcast Address ---------------

* Pin-compatible alternatives to the DAC081C081 options are available with additional address options.

www.national.com 16

DAC081C081/ DAC081C085

1.4.5 Writing to the DAC Register

To write to the DAC, the master addresses the part with the

correct slave address (A6-A0) and writes a "zero" to the

read/write bit. If addressed correctly, the DAC returns an ACK

to the master. The master then sends out the upper data byte.

The DAC responds by sending an ACK to the master. Next,

the master sends the lower data byte to the DAC. The DAC

responds by sending an ACK again. At this point, the master

either sends the upper byte of the next data word to be con-

verted by the DAC, generates a Stop condition to end com-

munication, or generates a Repeated Start condition to begin

communication with another device on the bus. Until gener-

ating a Stop condition, the master can continuously write the

upper and lower data bytes to the DAC register. This allows

for a maximum DAC conversion rate of 188.9

kilo-conversions per second in Hs-mode.

30052364

FIGURE 6. Typical Write to the DAC Register

1.4.6 Reading from the DAC Register

To read from the DAC register, the master addresses the part

with the correct slave address (A6-A0) and writes a "one" to

the read/write bit. If addressed correctly, the DAC returns an

ACK to the master. Next, the DAC sends out the upper data

byte. The master responds by sending an ACK to the DAC to

indicate that it wants to receive another data byte. Then the

DAC sends the lower data byte to the master. Assuming only

one 16-bit data word is read, the master sends a NACK after

receiving the lower data byte. At this point, the master either

generates a Stop condition to end communication, or a Re-

peated Start condition to begin communication with another

device on the bus.

30052363

FIGURE 7. Typical Read from the DAC Register

17 www.national.com

DAC081C081/ DAC081C085

1.5 DAC REGISTER

The DAC register, Figure 8, has sixteen bits. The first two bits

are always zero. The next two bits determine the mode of

operation (normal mode or one of three power-down modes).

The final twelve bits of the shift register are the data bits. The

data format is straight binary (MSB first, LSB last), with twelve

0's corresponding to an output of 0V and twelve 1's corre-

sponding to a full-scale output of VA - 1 LSB. When writing to

the DAC Register, VOUT will update on the rising edge of the

ACK following the lower data byte.

30052308

FIGURE 8. DAC Register Contents

1.6 POWER-ON RESET

The power-on reset circuit controls the output voltage of the

DAC during power-up. Upon application of power, the DAC

The output remains at 0V until a valid write sequence is made

to the DAC.

When resetting the device, it is crutial that the VA supply be

lowered to a maximum of 200mV before the supply is raised

again to power-up the device. Dropping the supply to within

200mV of GND during a reset will ensure the ADC performs

as specified.

1.7 SIMULTANEOUS RESET

The broadcast address allows the I2C master to write a single

word to multiple DACs simultaneously. Provided that all of the

DACs exist on a single I2C bus, every DAC will update when

the broadcast address is used to address the bus. This fea-

ture allows the master to reset all of the DACs on a shared

I2C bus to a specific digital code. For instance, if the master

writes a power-down code to the bus with the broadcast ad-

dress, all of the DACs will power-down simultaneously.

1.8 POWER-DOWN MODES

The DAC081C081 has three power-down modes. In power-

down mode, the supply current drops to 0.13µA at 3V and

0.15µA at 5V (typ). The DAC081C081 is put into power-down

mode by writing a one to PD1 and/or PD0. The outputs can

be set to high impedance, terminated by 2.5 kΩ to GND, or

terminated by 100 kΩ to GND (see Figure 8).

The bias generator, output amplifier, resistor string, and other

linear circuitry are all shut down in any of the power-down

modes. When the DAC081C081 is powered down, the value

written to the DAC register, including the power-down bits, is

saved. While the DAC is in power-down, the saved DAC reg-

ister contents can be read back. When the DAC is brought out

of power-down mode, the DAC register contents will be over-

written and VOUT will be updated with the new 8-bit data value.

The time to exit power-down (Wake-Up Time) is typically

0.8µsec at 3V and 0.5µsec at 5V.

1.9 ADDITIONAL TIMING INFORMATION: toutz

The toutz specification is provided to aid the design of the I2C

bus. After the SCL bus is driven low by the I2C master, the

SDA bus will be held for a short time by the DAC081C081.

This time is referred to as toutz. The following figure illustrates

the relationship between the fall of SCL, at the 30% threshold,

to the time when the DAC begins to transition the SDA bus.

The toutz specification only applies when the DAC is in control

of the SDA bus. The DAC is only in control of the bus during

an ACK by the DAC081C081 or a data byte read from the

DAC (see Figure 7).

30052365

FIGURE 9. Data Output Timing

The toutz specification is typically 87nsec in Standard-Fast

Mode and 38nsec in Hs-Mode.

www.national.com 18

DAC081C081/ DAC081C085

2.0 Applications Information

2.1 USING REFERENCES AS POWER SUPPLIES

While the simplicity of the DAC081C081 implies ease of use,

it is important to recognize that the path from the reference

input (VA for the DAC081C081 & VREF for the DAC081C085)

to VOUT will have essentially zero Power Supply Rejection

Ratio (PSRR). Therefore, it is necessary to provide a noise-

free supply voltage to the reference. In order to use the full

dynamic range of the DAC081C085, the supply pin (VA) and

VREF can be connected together and share the same supply

voltage. Since the DAC081C081 consumes very little power,

a reference source may be used as the supply voltage. The

advantages of using a reference source over a voltage regu-

lator are accuracy and stability. Some low noise regulators

can also be used. Listed below are a few reference and power

supply options for the DAC081C081. When using the

DAC081C081, it is important to treat the analog supply (VA)

as the reference.

2.1.1 LM4132

The LM4132, with its 0.05% accuracy over temperature, is a

good choice as a reference source for the DAC081C081. The

4.096V version is useful if a 0 to 4.095V output range is de-

sirable or acceptable. Bypassing the LM4132 VIN pin with a

0.1µF capacitor and the VOUT pin with a 2.2µF capacitor will

improve stability and reduce output noise. The LM4132

comes in a space-saving 5-pin SOT23.

30052313

FIGURE 10. The LM4132 as a power supply

2.1.2 LM4050

Available with accuracy of 0.44%, the LM4050 shunt refer-

ence is also a good choice as a reference for the

DAC081C081. It is available in 4.096V and 5V versions and

comes in a space-saving 3-pin SOT23.

30052314

FIGURE 11. The LM4050 as a power supply

The minimum resistor value in the circuit of Figure 11 must

be chosen such that the maximum current through the

LM4050 does not exceed its 15 mA rating. The conditions for

maximum current include the input voltage at its maximum,

the LM4050 voltage at its minimum, and the DAC081C081

drawing zero current. The maximum resistor value must allow

the LM4050 to draw more than its minimum current for regu-

lation plus the maximum DAC081C081 current in full opera-

tion. The conditions for minimum current include the input

voltage at its minimum, the LM4050 voltage at its maximum,

the resistor value at its maximum due to tolerance, and the

DAC081C081 draws its maximum current. These conditions

can be summarized as

R(min) = ( VIN(max) − VZ(min) ) /IZ(max)

and

R(max) = ( VIN(min) − VZ(max) ) / ( (IDAC(max) + IZ(min) )

where VZ(min) and VZ(max) are the nominal LM4050 output

voltages ± the LM4050 output tolerance over temperature, IZ

(max) is the maximum allowable current through the LM4050,

IZ(min) is the minimum current required by the LM4050 for

proper regulation, and IDAC(max) is the maximum

DAC081C081 supply current.

19 www.national.com

DAC081C081/ DAC081C085

2.1.3 LP3985

The LP3985 is a low noise, ultra low dropout voltage regulator

with a 3% accuracy over temperature. It is a good choice for

applications that do not require a precision reference for the

DAC081C081. It comes in 3.0V, 3.3V and 5V versions,

among others, and sports a low 30 µV noise specification at

low frequencies. Since low frequency noise is relatively diffi-

cult to filter, this specification could be important for some

applications. The LP3985 comes in a space-saving 5-pin

SOT23 and 5-bump micro SMD packages.

30052315

FIGURE 12. Using the LP3985 regulator

An input capacitance of 1.0µF without any ESR requirement

is required at the LP3985 input, while a 1.0µF ceramic ca-

pacitor with an ESR requirement of 5mΩ to 500mΩ is required

at the output. Careful interpretation and understanding of the

capacitor specification is required to ensure correct device

operation.

2.1.4 LP2980

The LP2980 is an ultra low dropout regulator with a 0.5% or

1.0% accuracy over temperature, depending upon grade. It is

available in 3.0V, 3.3V and 5V versions, among others.

30052316

FIGURE 13. Using the LP2980 regulator

Like any low dropout regulator, the LP2980 requires an output

capacitor for loop stability. This output capacitor must be at

least 1.0µF over temperature, but values of 2.2µF or more will

provide even better performance. The ESR of this capacitor

should be within the range specified in the LP2980 data sheet.

Surface-mount solid tantalum capacitors offer a good combi-

nation of small size and ESR. Ceramic capacitors are attrac-

tive due to their small size but generally have ESR values that

are too low for use with the LP2980. Aluminum electrolytic

capacitors are typically not a good choice due to their large

size and have ESR values that may be too high at low tem-

peratures.

2.2 BIPOLAR OPERATION

The DAC081C081 is designed for single supply operation and

thus has a unipolar output. However, a bipolar output may be

obtained with the circuit in Figure 14. This circuit will provide

an output voltage range of ±5 Volts. A rail-to-rail amplifier

should be used if the amplifier supplies are limited to ±5V.

30052317

FIGURE 14. Bipolar Operation

The output voltage of this circuit for any code is found to be

VO = (VA x (D / 256) x ((R1 + R2) / R1) - VA x R2 / R1)

where D is the input code in decimal form. With VA = 5V and

R1 = R2,

VO = (10 x D / 256) - 5V

A list of rail-to-rail amplifiers suitable for this application are

indicated in Table 2.

TABLE 2. Some Rail-to-Rail Amplifiers

AMP PKGS Typ VOS Typ ISUPPLY

LMP7701 SOT23-5 37 uV 0.79 mA

LMV841 SC70-5 50 uV 1 mA

LMC7111 SOT23-5 0.9 mV 25 µA

LM7301 SO-8

SOT23-5 0.03 mV 620 µA

LM8261 SOT23-5 0.7 mV 1 mA

www.national.com 20

DAC081C081/ DAC081C085

2.3 DSP/MICROPROCESSOR INTERFACING

Interfacing the DAC081C081 to microprocessors and DSPs

is quite simple. The following guidelines are offered to simplify

the design process.

2.3.1 Interfacing to the 2-wire Bus

Figure 15 shows a microcontroller interfacing to the

DAC081C081 via the 2-wire bus. Pull-up resistors (Rp)

should be chosen to create an appropriate bus rise time and

to limit the current that will be sunk by the open-drain outputs

of the devices on the bus. Please refer to the I2C Specification

for further details. Typical pull-up values to use in Standard-

Fast mode bus applications are 2kΩ to 10kΩ. SCL and SDA

series resisters (RS) near the DAC081C081 are optional. If

high-voltage spikes are expected on the 2-wire bus, series

resistors should be used to filter the voltage on SDA and SCL.

The value of the series resistance must be picked to ensure

the VIL threshold can be achieved. If used, RS is typically

51Ω.

30052309

FIGURE 15. Serial Interface Connection Diagram

2.3.2 Interfacing to a Hs-mode Bus

Interfacing to a Hs-mode bus is very similar to interfacing to

a Standard-Fast mode bus. In Hs-mode, the specified rise

time of SCL is shortened. To create a faster rise time, the

master device (microcontroller) can drive the SCL bus high

and low. In other words, the microcontroller can drive the line

high rather than leaving it to the pull-up resistor. It is also pos-

sible to decrease the value of the pull-up resistors or increase

the pull-up current to meet the tighter timing specs. Please

refer to the I2C Specification for further details.

2.4 LAYOUT, GROUNDING, AND BYPASSING

For best accuracy and minimum noise, the printed circuit

board containing the DAC081C081 should have separate

analog and digital areas. The areas are defined by the loca-

tions of the analog and digital power planes. Both of these

planes should be located on the same board layer. There

should be a single ground plane. A single ground plane is

preferred if digital return current does not flow through the

analog ground area. Frequently a single ground plane design

will utilize a "fencing" technique to prevent the mixing of ana-

log and digital ground current. Separate ground planes should

only be utilized when the fencing technique is inadequate.

The separate ground planes must be connected in one place,

preferably near the DAC081C081. Special care is required to

guarantee that digital signals with fast edge rates do not pass

over split ground planes. They must always have a continu-

ous return path below their traces.

The DAC081C081 power supply should be bypassed with a

4.7µF and a 0.1µF capacitor as close as possible to the device

with the 0.1µF right at the device supply pin. The 4.7µF ca-

pacitor should be a tantalum type and the 0.1µF capacitor

should be a low ESL, low ESR type. The power supply for the

DAC081C081 should only be used for analog circuits.

Avoid crossover of analog and digital signals and keep the

clock and data lines on the component side of the board.

These clock and data lines should have controlled

impedances.

21 www.national.com

DAC081C081/ DAC081C085

Physical Dimensions inches (millimeters) unless otherwise noted

6-Lead TSOT

Order Numbers DAC081C081CIMK

NS Package Number MK06A

6-Lead LLP

Order Numbers DAC081C081CISD

NS Package Number SDB06A

www.national.com 22

DAC081C081/ DAC081C085

8-Lead MSOP

Order Numbers DAC081C085CIMM

NS Package Number MUA08A

23 www.national.com

DAC081C081/ DAC081C085

Notes

DAC081C081/ DAC081C085 8-Bit Micro Power Digital-to-Analog Converter with an

I2C-Compatible Interface

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