I/O Products
Amphenol
High Speed Interconnects
Now you’re connected
Amphenol
Now you’re connected
Amphenol High Speed Interconnects
2
THE COMPANY
Amphenol is a global provider of interconnect solutions to the designers and manufacturers
of worldwide networking systems. With our design creativity and cost eectiveness,
Amphenol leads the way in interconnect development for internet equipment,
infrastructure, enterprise networks, and appliances. Whether industry standard or specic
designs are required, Amphenol provides customers with products capable of performing at
the leading edge of today’s high speed technology. Our expertise in understanding and
supporting our customers’ various design needs has earned Amphenol a reputation of
excellence and quality among the world’s leading users of high speed components.
HIGH SPEED CONNECTORS
Amphenol oers a full range of high speed connectors with data rates ranging from 1 Gbps
to 240 Gbps and beyond, meeting our customers’ various high speed connector
requirements. Products include the ExpressPort™ Series (SFP+, QSFP+, CXP), SFP, QSFP,
Mini-SAS, Mini-SAS HD, XFP, CFP2, and CFP4.
BENEFITS
• Increased platform density for scaling improved performance in a dened physical
space
• Servers that can scale I/O and processing power independently
• Racks of servers that can be managed as one autonomous unit
• Servers that can share I/O resources
• True “plug-and-play” I/O connectivity
• Extensive range of SFP/IPF connector and cage solutions to support Fiber Channel,
Inniband, Ethernet, and Gigabit technology
• Next generation ExpressPort™ connectors provide premium level performance for
SFP+, CXP, and QSFP+ interfaces
• Data speeds of ExpressPort™ connectors can reach up to 40 Gbps per channel
SERVERS STORAGE TELECOM
NETWORKING
Table of Contents
ExpressPort SFP+ Series
XFP Series
Mini-SAS HD
Mini-SAS
CXP Series
ExpressPort QSFP+ / E-Series / H-Series / QSFP Series
SFP Series
1xN Connector
1xN Cage
2xN Combo
1xN Connector
1xN Cage
2xN Combo
CXP Combo
Connector
Cage
HD Combo
Connector
Cage
4
4
6
8
8
10
12
12
14
18
18
22
22
16
20
1xN Connector
1xN Cage
2xN Combo
UE76 Series
UE77 Series
UE86 Series
UE75 Series
U77 Series
UE78/UE86 Series
FS1 Series
U90 Series
U90 Series
U92 Series
U91 Series
FS1 Series
FSX Series
UE75 Series
U79 Series
3
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
CFP2 / CFP4
U99 Series
U98 Series
Connector
Cage
24
24
4
ExpressPortTM SFP+ 1xN
Amphenol’s ExpressPortTM SFP+ 1xN connector, when combined with the ExpressPortTM SFP+ cage,
provides data transfer speeds of up to 25 Gbps. The design of the ExpressPortTM SFP+ connector
minimizes impedance discontinuities and reections at high data rates, and provides a 10 to 20 dB
improvement in Near-End Crosstalk.
Amphenol’s unique ExpressPortTM SFP+ cage construction features EMI shielding available in the form of
metal spring ngers or elastomeric gaskets. These cages also eliminate ventilation holes near the front
of the cage to prevent potential catch points for the mating module EMI springs. Additional features
available include lightpipes (which can be purchased with cages or separately), heat sinks, and other
custom features.
General Characteristics
• RoHS Compliant
• Industry Standard Footprint
• Industry Standard EIA-364
Mechanical Characteristics
• Accepts Multiple Transceivers per SFF-8431
• Compliant Press-Fit Pins or Solder Tails (for 1x1
Cages)
• Durability: 250 Mating Cycles min
Electrical Characteristics
• Hot Swappable
• Operating Voltage: 3.3 V
• Operating Current: 0.5 A
• Differential Impedance: 100 Ω +/- 10 Ω
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
• Contact Resistance: 70 mΩ max
Packaging
• Tape and Reel Packaging: Connector or 1x1 Cage
• Tray Packaging: Cage of all Sizes
• Bulk Packaging: Dust Cover
Materials
• Cage
o Base Material: Copper Alloy
o Plating: Nickel or Tin
o Light Pipe: Optical Grade Polycarbonate
o Heat Sink: Aluminum Alloy
o Heat Sink Clip: Stainless Steel
o Dust Cover: Thermoplastic
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area, Gold
or Matte Tin on Termination
o Housings: Glass Reinforced, Lead-Free Solder
Reow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
• Operating Temperature: -55°C to +85°C
• Storage Temperature: -55°C to +105°C
Congurations (Rows x Ports per Row)
• 1x1 • 1x2
• 1x3 • 1x4
• 1x6
Options
• Dust Cover
• Round Light Pipe
• Heat Sink
• EMI Shielding
o Metal Spring Fingers
o Conductive Elastomeric Gasket
Specication Highlights
The interconnect system is comprised of a cage
assembly which is used with 20-position SFP+
connectors complying with SFF-8081 and SFF-8083.
Ganged cages comply with industry standard
SFF-8433.
UE76-A20-3010T
U77-A441M-2081 U77-C261M-2081U77-C1419-2001
Ordering Information
UE76-A20-3000
ExpressPort
TM
UE76 -A 20 -XXXXX
SFP+ Connector
UE76 SERIES DESIGNATION (RoHS)
PACKAGING X
J - Tape and Reel Packaging (480 per Reel)
A STYLE
T - Tape and Reel Packaging (500 per Reel)
A - R/A Single Surface Mount Connector
LUBRICANT OPTION X
20 NUMBER OF POSITIONS
0 - Non Lubricated
20 - 20 Positions
1 - Lubricant Added
X CONTACT PLATING
OPTION 2 X
2 - 30 µ" Gold Plating on Mating Area; Gold Flash on Termination
0 - Standard
3 - 30 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination
1 - Resonance Cancelation Features
5 - 15 µ" Gold Plating on Mating Area; Gold Flash on Termination
6 - 15 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination
OPTION 1 X
0 - Standard
6 - 25 Gbps
ExpressPort U77 -X X X X X -X X X X
TM
SFP+ Cage
U77 SERIES DESIGNATION (RoHS) PACKAGING X
1 - Tray Packaging (ACC Re-Packed)
X STYLE T - Tape and Reel Packaging (for 1x1 Only)
A - One Row
C - One Row Cage; Light Pipe Combo (on Top) OPTION 1 X
E - One Row Cage; Heat Sink Combo (Fin) 0 - Standard
F - One Row Cage; 1 degree Angle (1x1 Only) 7 - Cage with Extra Bottom Spring Fingers,
No Bottom Mid G-Pins
X NUMBER OF PORTS IN ROW 8 - Cage with Half-Moon Mid G-Pins
1 - Single in Row 9 - Cage with Extra Bottom Spring Fingers
2 - Inline 1x2 and Half Moon Mid G-Pins
3 - Inline 1x3
4 - Inline 1x4 DUST COVER OPTION X
6 - Inline 1x6 0 - Without Dust Cover
D - With Dust Cover (Shipped Loose)
X CHASSIS GROUNDING
3 - Metal Spring Fingers (No Bottom Latch Cover) PLATING X
4 - Elastomeric Gasket 1 - Bright Tin (for Wave Solder)
6 - Metal Spring Fingers (1 Piece Design Bottom Latch Cover) 2 - Nickel
3 - Matte Tin (for Reflow 245 degrees)
X HEAT SINK / LIGHT PIPE OPTION
1 - No Heat Sink / Light Pipe Option PCB MOUNTING OPTION X
2 - Heat Sink Option X - Various Options Available
3 - Light Pipe Option (for 1xN Cage Only) Consult Sales or Website for Details
U77-C461M-2081
5
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
6
ExpressPortTM SFP+ 2xN
Amphenol’s ExpressPortTM SFP+ 2xN Combo provides data transfer speeds of up to 25 Gbps per port.
ExpressPortTM SFP+ 2xN Combos consist of an integrated stacked connector system and a cage with
compliant press-t pins.
Amphenol’s unique ExpressPortTM SFP+ cage construction features EMI shielding available in the form of
an elastomeric gasket or metal spring ngers. These cages also eliminate ventilation holes near the front
of the cage to prevent potential catch points for the mating module EMI springs.
General Characteristics
• RoHS Compliant
• Press-t Cage and Connector Combo for min
1.57 +/- 10% mm (0.0625”) PCB Thickness
• Industry Standard EIA-364
Mechanical Characteristics
• Card Entry Slot Accepts 1.0 mm Thick
Integrated Circuit Cards
• Durability: 250 Mating Cycles min
Electrical Characteristics
• Hot Swappable
• Operating Voltage: 3.3 V
• Operating Current: 0.5 A
• Differential Impedance: 100 Ω +/- 10 Ω
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
• Contact Resistance: 70 mΩ max
Packaging
• Tray Packaging: Cage and Connector
Assembly
• Bulk Packaging: Dust Cover
Materials
• Cage
o Base Material: Copper Alloy
o Plating: Nickel or Tin
o Light Pipe: Optical Grade Polycarbonate
o Dust Cover: Thermoplastic
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area,
Matte Tin on Termination
o Housings: Glass Reinforced, Lead-Free Solder
Reow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
• Operating Temperature: -55°C to +85°C
• Storage Temperature: -55°C to +105°C
Congurations (Rows x Ports per Row)
• 2x1 • 2x2
• 2x4 • 2x5
• 2x6 • 2x8
Options
• Dust Cover
• Light Pipe
o 4 Light Pipes per 2x1
o 2 Inner Light Pipes per 2x1
o 2 Outer Light Pipes per 2x1
• EMI Shielding
o Metal Spring Fingers
o Conductive Elastomeric Gasket
Specication Highlights
The interconnect system is comprised of a 2-row stacked,
20-position, 0.8 mm pitch SFP+ connector and cage
assembly as one unit with all press-t construction.
UE86-D2527-20321
UE86-K8427-20321 UE86-D4627-10321
UE86-D1427-10321
Ordering Information
UE86-K442C-20321
ExpressPort™
SFP+ UE86 -XXXXX-X X X X 1
2xN Combo
(Cage / Connector)
UE86
SERIES DESIGNATION PACKAGING
1
1 - Tray Packaging (Stacked)
UE86 - RoHS SFP+ Cage and Connector (Lead Free)
PLATING OPTION: CAGE
X
X
STYLE
B - 2xN, No Light Pipe
D - 2xN, Small Light Pipe Openings
K - 2xN, Large Light Pipe Openings
L - 2xN, Low Profile Combo (No Light Pipe)
Consult Sales or Website for Details
X
NUMBER OF PORTS IN ROW
1 - 2x1
X
2 - 2x2
4 - 2x4
LIGHT PIPE OPTION
X
5 - 2x5
6 - 2x6
8 - 2x8
X
CHASSIS GROUNDING
4 - Elastomeric Gasket
5 - Elastomeric Gasket, Bottom Mylar Tape
6 - Metal Spring Fingers
X
MOUNTING TYPE: CONNECTOR
2 - Standard Press Fit Pins (12 Gbps)
5 - Small Press Fit Pins for High Speed Termination (16 Gbps)
UE86-K2427-10321
7
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
1 - 4 Light Pipes per 2x1
0 - No Light Pipe
DUST COVER OPTION
C - Enhanced EMI Cage
7 - Standard 2xN Cage
MOUNTING TYPE: CAGE
3 - 2 Outer Light Pipes per 2x1
2 - 2 Inner Light Pipes per 2x1
- Without Dust Cover
- With Dust Cover (Shipped Loose)
X
X
- Various Options AvailableX
PLATING OPTION: CONNECTOR
3 - Matte Tin
2 - Nickel
1 - Bright Tin
0
D
8
SFP 1xN
Amphenol’s SFP interconnect system consists of a 20-position connector enclosed in a metal cage
mounted to a host PCB.
Amphenol’s single port SFP connectors are rated up to 6 Gbps. The connector accepts multiple
transceivers per INF-8074i and combines, transmits, and receives functions in a low cost, compact, and
exible format. The cages have a two-piece construction with enhanced transceiver mating tabs
available in a press-t version or a solder tail version. Longer and shorter pins are available as custom
options. Single row versions (1xN) consist of SMT connectors used with a separate single row cage
(press-t or solder tail).
General Characteristics
• RoHS Compliant
• Industry Standard Footprint
• Industry Standard EIA-364
Mechanical Characteristics
• Accepts Multiple Transceivers per INF-8074i
• Compliant Press-Fit Pins or Solder Tails (1x1
Cages)
• Durability: 250 Mating Cycles min
Electrical Characteristics
• Hot Swappable
• Operating Voltage: 3.3 V
• Operating Current: 0.5 A
• Differential Impedance: 100 Ω +/- 10 Ω
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
• Contact Resistance: 70 mΩ max
• Spring Fingers for Superior EMI Grounding
Packaging
• Tape and Reel Packaging: Connector or Cage
• Tray Packaging: Cage of all Sizes
• Bulk Packaging: Dust Cover
Materials
• Cage
o Base Material: Copper Alloy
o Plating: Nickel or Tin
o Light Pipe: Optical Grade Polycarbonate
o Heat Sink: Aluminum Alloy
o Heat Sink Clip: Stainless Steel
o Dust Cover: Thermoplastic
o EMI Ground Tabs: Stainless Steel
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area, Gold
or Matte Tin on Termination
o Housings: Glass Reinforced, Lead-Free Solder
Reow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
• Operating Temperature: -55°C to +85°C
• Storage Temperature: -55°C to +105°C
Congurations (Rows x Ports per Row)
• 1x1 • 1x2
• 1x4 • 1x6
Options
• Dust Cover
• Light Pipe
• Heat Sink (Standard Fin for Final Cage Combo)
• Enhanced EMI Performance Cage
Specication Highlights
The interconnect system is comprised of a cage
assembly which is used with 20-position SFP
connectors complying with MSA Agreement INF-8074i.
U77-A2114-2001 U77-A4114-2001
UE75-A20-3000T
U77-A4113-0100
Ordering Information
U77-E1128-2001
SFP Connector UE75 -A 20 -X 0 0 X X
UE75 SERIES DESIGNATION (RoHS) PACKAGING X
J - Tape and Reel Packaging (480 per Reel)
A STYLE
T - Tape and Reel Packaging (500 per Reel)
A - R/A Single Surface Mount Connector
LUBRICANT OPTION X
20 NUMBER OF POSITIONS
0 - Non Lubricated
20 - 20 Positions 1 - Lubricant Added
X CONTACT PLATING
0 - Standard
0
2 - 30 µ" Gold Plating on Mating Area; Gold Flash on Termination
3 - 30 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination
OPTION 1 0
5 - 15 µ" Gold Plating on Mating Area; Gold Flash on Termination 0 - Standard
6 - 15 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination
SFP Cage U77 -X X X X X -X X X X
U77
SERIES DESIGNATION PACKAGING
X
1 - Tray Packaging (ACC Re-Packed)
X
STYLE
T - Tape and Reel Packaging (for 1x1 Only)
A - One Row
C - One Row Cage; Light Pipe Combo (on Top)
OPTION 1
X
E - One Row Cage; Heat Sink Combo 0 - Standard
F - One Row Cage; 1 degree Angle (For 1x1 Only) 1 - Cage With Light Pipe on Top
8 - Cage with Half Moon Mid G-Pins
X
NUMBER OF PORTS IN ROW
1 - Single in Row
DUST COVER OPTION
X
2 - Inline 1x2 0 - Without Dust Cover
4 - Inline 1x4 D - With Dust Cover (Shipped Loose)
6 - Inline 1x6
PLATING
X
X
CHASSIS GROUNDING
1 - Bright Tin (for Wave Solder)
1 - Metal Grounding Tabs 2 - Nickel
2 - Inner and Outer Flexible Spring Fingers 3 - Matte Tin (for Reflow 245 degrees)
X
HEAT SINK / LIGHT PIPE OPTION PCB MOUNTING OPTION
X
1 - No Heat Sink / Light Pipe X - Various Options Available
2 - Heat Sink Consult Sales or Website for Details
3 - Light Pipe (for 1xN Cage Only)
U77-C6114-2011
9
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
10
SFP 2xN
Amphenol’s SFP interconnect system consists of a 20-position connector enclosed in a metal cage
mounted to a host PCB.
Amphenol’s stacked SFP combos are rated up to 6 Gbps. The connector accepts multiple transceivers
per INF-8074i and combines, transmits, and receives functions in a low cost, compact, and exible
format. The cages have a two-piece construction with enhanced transceiver mating tabs available in a
press-t version or a solder tail version. Longer and shorter pins are available as custom options. Stacked
versions (2xN) consist of a 2-row cage with integrated 2-row connectors.
General Characteristics
• RoHS Compliant
• Industry Standard Footprint
• Industry Standard EIA-364
Mechanical Characteristics
• Accepts Multiple Transceivers per INF-8074i
• Compliant Press-Fit Pins or Solder Tails (1x1
Cages)
• Durability: 250 Mating Cycles min
Electrical Characteristics
• Hot Swappable
• Operating Voltage: 3.3 V
• Operating Current: 0.5 A
• Differential Impedance: 100 Ω +/- 10 Ω
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
• Contact Resistance: 70 mΩ max
• Spring Fingers for Superior EMI Grounding
Packaging
• Tape and Reel Packaging: Connector or Cage
• Tray Packaging: Cage of all Sizes
• Bulk Packaging: Dust Cover
Materials
• Cage
o Base Material: Copper Alloy
o Plating: Nickel or Tin
o Light Pipe: Optical Grade Polycarbonate
o Heat Sink: Aluminum Alloy
o Heat Sink Clip: Stainless Steel
o Dust Cover: Thermoplastic
o EMI Ground Tabs: Stainless Steel
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area, Gold
or Matte Tin on Termination
o Housings: Glass Reinforced, Lead-Free Solder
Reow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
• Operating Temperature: -55°C to +85°C
• Storage Temperature: -55°C to +105°C
Congurations (Rows x Ports per Row)
• 2x1 • 2x2
• 2x4 • 2x5
• 2x6 • 2x8
Options
• Dust Cover
• Light Pipe
• Heat Sink (Standard Fin for Final Cage Combo)
• Enhanced EMI Performance Cage
Specication Highlights
The interconnect system is comprised of a cage
assembly which is used with 20-position SFP
connectors complying with MSA Agreement INF-8074i.
UE78-B2127-00321
UE78-L1126-00321
UE78-B8126-00321
Ordering Information
UE78-B4127-00321
SFP 2xN Combo UEXX -X X X 2 X -X X X X 1
(Cage / Connector)
PACKAGING 1
1 - Tray Packaging (Stacked)
PLATING OPTION: CAGE X
1 - Bright Tin (for Wave Soldering)
2 - Nickel
X STYLE
3 - Matte Tin (for SMT Soldering)
B - Stacked Connector and Cage Combo (UE78 Series)
D - 2xN, Small Light Pipe Openings (UE86 Series)
PLATING OPTION: CONNECTOR X
K - 2xN, Large Light Pipe Openings (UE86 Series) X - Various Options Available
L - 2xN,
Low Profile Combo (No Light Pipe)
(UE78 Series) Consult Sales or Website for Details
X NUMBER OF PORTS IN ROW DUST COVER OPTION X
1 - 2x1 0 - Without Dust Cover
2 - 2x2 D - With Dust Cover (Shipped Loose)
4 - 2x4
5 - 2x5
HEAT SINK / LIGHT PIPE OPTION X
6 - 2x6 0 - No Heat Sink or Light Pipe
8 - 2x8 X - Various Options Available
Consult Sales or Website for Details
XEMI SHIELDING
1 - Standard
7 - Standard
X
2 - Bottom Mylar Tape, No Mid Ground Pins
X - Various Customer Specific Options Available
3 - No Mid Ground Pins
Consult Sales or Website for Details
2
2 - Standard
11
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
UE86-K2127-10321
PCB MOUNTING OPTION
UE86 - Standard SFP Cage and Connector with Light Pipes (RoHS)
UE78 - Standard SFP Cage and Connector (RoHS)
SERIES DESIGNATION
UEXX
UE78 Series Footprint UE86 Series Footprint
12
ExpressPortTM QSFP+ / QSFP
The ExpressPort™ QSFP+/QSFP interconnect system is comprised of a 38-position 0.8 mm pitch SMT
connector, and a press-t cage designed to comply with the Quad Small Form-factor Pluggable (QSFP)
Transceiver intended for external connections. High speed serial interconnect applications include
clusters, servers, and storage devices.
The ExpressPort™ QSFP+ E-Series and H-Series connector families are rated to 28 Gbps and 40 Gbps
respectively per channel (4x28), featuring a stamped and formed contact design providing improved
mechanical durability. This connector features an integrated grounding structure and resonance
dampening features for superior crosstalk performance. The contact design is optimized for a smooth
impedance prole resulting in improved SI performance.
Mechanical Characteristics
• Cage is Keyed According to QSFP MSA
o QSFP+: SFF-8436
o E-Series: SFF-8672
o H-Series: TBD
• Durability: 250 Mating Cycles min
• Connector Insertion Force: 40 N max
• Connector Withdrawal Force: 30 N max
Electrical Characteristics
• Hot Swappable
• Operating Voltage: 30 V
• Operating Current: 0.5 A
• Differential Impedance: 100 Ω +/- 10 Ω
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
• Contact Resistance: 70 mΩ max
Packaging
• Tape and Reel Packaging: Connector
or 1x1 Cage
• Tray Packaging: Cage of all Sizes
• Bulk Packaging: Dust Cover
Temperature Rating
• Operating Temperature: -40°C to +85°C
• Storage Temperature: -40°C to +85°C
Congurations (Rows x Ports per Row)
• 1x1 • 1x2 • 1x3 • 1x4 • 1x6
Options
• Dust Cover
• Light Pipe
o Round 1.4 mm
o Square 2.6x2.6 mm
• Heat Sink
• Cage Design
o Through or Behind the Bezel
Specication Highlights
The QSFP interconnect system is comprised of a
press-t cage assembly which is used with
38-position connectors complying with QSFP
Transceiver Specications.
U90-C101-3000
Materials
• Cage
o Base Material: Copper Alloy
o Plating: Nickel or Tin
o Light Pipe: Optical Grade Polycarbonate
o Heat Sink: Aluminum Alloy
o Heat Sink Clip: Stainless Steel
o Dust Cover: Thermoplastic
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area, Matte Tin
on Terminations and Grounding Tabs
o Housings: Glass Reinforced, Lead-Free Solder
Reow Process Compatible Thermoplastic,
UL94V-0 Rated
Signal Integrity Characteristics
QSFP, ExpressPort™ QSFP+
• Return Loss: -12 dB
• Near-End Isolation: -30 dB (frequencies up to 3 GHz)
• Insertion Loss: -1 dB max
• Rise Time for Impedance Measurement: 35 ps
• Within Pair Skew: 1 ps
• NEXT: ≤ 2%
ExpressPort™ QSFP+ E-Series Connector
• Return Loss: -12 dB max (frequencies up to 14 GHz)
• Insertion Loss: 1.4 dB max (frequencies up to 14 GHz)
• Common Mode Conversion: -24 dB max (up to 14 GHz)
• Integrated Crosstalk Noise: 3 mV rms
- Assumes 3 Nearest-Neighbour (most detrimental)
Aggressor Parameters and Receiver Parameters:
o Near- and Far-End Aggressors’ Peak Dierential
Amplitude: 600 mV
o Near- & Far-End Aggressors’ 20-80% Risetime: 9.6 ps
o 3 dB Reference Receiver Bandwidth: 18.75 GHz
o Range of Integration: 10 MHz to 40 GHz
o MDNEXT: 1 mV rms; MDFEXT: 2.8 mV rms
ExpressPort™ QSFP+ H-Series Connector
• Return Loss: < -20 dB to 12GHz, -12 dB to 20GHz
• Near End Isolation: -40 to 20 GHz
• Insertion Loss: -1dB up to 20GHz
• Differential Impedance:100 +/- 5 Ω at 35 ps
• Within pair skew: <1 ps
Ordering Information
U90-G351-101A FS1-R38-2000
13
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: sales@amphenol-highspeed.com
All specications are subject to change without notice.
Cages: U90-X X X 1 -1 X X X
QSFP
ExpressPort™ QSFP+
PACKAGING
X
1 - Tray Packaging
X
T - Tape and Reel Packaging (1x1 Only)
A - Tray Packaging Heat Sink and Clip
D - One Row Cage 0°, Hybrid with Elastomeric Gasket or Light Pipe Shipped Assembled
G - One Row Cage 0°, Behind the Bezel
H - One Row Cage 0°, Through the Bezel with Optional Light Pipe
LIGHT PIPE OPTION
X
K - One Row Cage 0°, Through the Bezel with No Heat Sink Opening 0 - Without Light Pipe
L - One Row Cage 0°, No Pins on Back Wall 1 - Round 1.4 mm Outlet Light Pipe,
P - One Row Cage 0°, Behind the Bezel with Low Profile Heat Sink and Clip No EMI gasket
R - One Row Cage 0°, Through the Bezel with Low Profile Heat Sink 3 - Square 2.6x2.6 mm Outlet Light Pipe,
T - One Row Cage 0°, Through the Bezel with Low Profile Heat Sink and Clip No EMI gasket
and Optional Light Pipe
DUST COVER OPTION
X
X
NUMBER OF PORTS IN ROW
0 - Without Dust Cover
1 - 1x1 D - With Dust Cover (Shipped Loose)
3 - 1x3
4 - 1x4
PLATING
1
6 - 1x6 1 - Nickel
X
HEAT SINK OPTION APPLICATION
1
1 - No Heat Sink or Clip Shipped 1 - Press Fit Pins (2.5 mm Long)
2 - Fin Style (Black Oxide) Heat Sink and Clip (H = 6.5 mm)
3 - Fin Style (Black Oxide) Heat Sink and Clip (H = 4.2 mm)
4 - Fin Style (Black Oxide) Heat Sink and Clip (H = 13.5 mm)
5 - Pin Style (Nickel Plated) Heat Sink and Clip (H = 6.5 mm)
6 - Pin Style (Nickel Plated) Heat Sink and Clip (H = 4.2 mm)
7 - Pin Style (Nickel Plated) Heat Sink and Clip (H = 13.5 mm)
D - Pin-Fin Style (Black Oxide) Heat Sink and Clip (H = 6.5 mm)
E - Pin-Fin Style (Black Oxide) Heat Sink and Clip (H = 4.2 mm)
F - Pin-Fin Style (Black Oxide) Heat Sink and Clip (H = 13.5 mm)
N - Pin-Fin Style (Nickel Plated) Heat Sink and Clip (H = 6.5 mm)
P - Pin-Fin Style (Nickel Plated) Heat Sink and Clip (H = 4.2 mm)
R - Pin-Fin Style (Nickel Plated) Heat Sink and Clip (H = 13.5 mm)
Connectors: FS1
-
X38
-
X 0 XX
-
XX
QSFP
ExpressPort™ QSFP+
ExpressPort™ QSFP+ E-Series
ExpressPort™ QSFP+ H-Series
SPECIAL XX
QSFP+ (12 Gbps and Up)
00 - No Resonance Dampening, No Hold Down Tabs
FS1 SERIES DESIGNATION
(RoHS)
01 - No Resonance Dampening, Hold Down Tabs
QSFP+ (16 Gbps)
X38
R38 - 38 Position Connector (QSFP 10G, ExpressPort™ QSFP+ 12G+ & 16G) 10 - Resonance Dampening, No Hold Down Tabs
E38 - 38 Position Connector (ExpressPort™ QSFP+ E-Series 28G) 11 - Resonance Dampening, Hold Down Tabs
H38 - 38 Position Connector (ExpressPort™ QSFP+ H-Series 40G) E-Series (28 Gbps) / H-Series (40 Gbps)
10 - Resonance Dampening, No Hold Down Tabs
X PLATING
2 - 30 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination
OPTIONS XX
3 - 15 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination 00 - QSFP Connector
0A - Connector with Hold Down Tabs
0
0 - Standard A2 - QSFP+ Connector
M0 - E-Series Connector
HX - H-Series Connector
SERIES DESIGNATION (RoHS)
U90
X
STYLE
A - One Row Cage 0°, Through the Bezel (No Light Pipe)
C - One Row Cage 1°, Through the Bezel (1x1 Only, No Light Pipe)
14
ExpressPortTM QSFP+ (Stacked)
The QSFP+ Stacked Combo interconnect system consists of a 2-row, 38 position, 0.8 mm pitch
connector designed to be compatible with the Quad Small Form-factor Pluggable (QSFP) Transceiver
Specications. The connector system is capable of data rates up to 25 Gbps per channel (four channels)
and is intended for external connections (38 positions per port). High speed serial interconnect
applications include clusters, servers, and storage devices.
General Characteristics
• RoHS Compliant
• Industry Standard Footprint
• Press-t Cage and Connector Combo for min
1.57 mm (0.0625’’) PCB thickness
Mechanical Characteristics
• Durability: 250 Mating Cycles min
• Insertion Force: 40 N max
• Withdrawal Force: 30 N max
Electrical Characteristics
• Operating Voltage: 30 V
• Operating Current: 0.5 A
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
• Contact Resistance: 80 mΩ max
Packaging
• Tray Packaging: Cage of all Sizes
Materials
• Cage
o Base Material: Copper Alloy
o Plating: Nickel
o Light Pipe: Optical Grade Polycarbonate
o Heat Sink: Aluminum Alloy
o Heat Sink Clip: Stainless Steel
o Dust Cover: Thermoplastic
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area,
Matte Tin on Terminations and Grounding
Tabs
o Housings: Glass Reinforced, Lead-Free Solder
Reow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
• Operating Temperature: -40°C to +85°C
• Storage Temperature: -40°C to +85°C
Congurations (Rows x Ports per Row)
• 2x1 • 2x2
• 2x3 • 2x4
• 2x6
Options
• Dust Cover • Heat Sink
• Light Pipe • EMI Shielding
Specication Highlights
The interconnect system is comprised of a 2-row,
38-position, 0.8 mm pitch connector and cage
assembly as one unit complying with SFF-8436.
U90-B105-2061-120 U90-B105-2061-120
(front view)
Ordering Information
15
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: sales@amphenol-highspeed.com
All specications are subject to change without notice.
Stacked QSFP+ -B X X X -4 X X 1 -X X 0
U90 SERIES DESIGNATION (RoHS) CONNECTOR FOOT PRINT X
0 - Standard
B STYLE
B - Standard VENT HOLES AND EMI COVER X
0 - With Large Vent Holes and EMI Cover
XNUMBER OF PORTS IN ROW 1 - With Large Vent Holes, No EMI Cover
1 - 2x1 2 - With Small Vent Holes and EMI Cover
2 - 2x2 3 - With Small Vent Holes, No EMI Cover
3 - 2x3 4 - With Rectangular Vent Holes and EMI Cover
4 - 2x4 5 - With Rectangular Vent Holes, No EMI Cover
6 - 2x6 6 - With Large Vent Holes and Heat Sink
X
HEAT SINK OPTION EMI GASKET X
0 - No Heat Sink or Clip Shipped 1 - Chomerics 1273 Conductive Elastomer
X - Options Available Upon Request 2 - Chomerics S6305 Conductive Elastomer
Contact Sales for Details 3 - Through the Bezel
X APPLICATION PACKAGING 1
5 - Press Fit Pins (2 mm Long) 1 - Tray Packaging
X - Options Available Upon Request
Contact Sales for Details LIGHT PIPES OPTION
X
6 - With Light Pipes (Triangular Outlet); Left Arrow Pointing
4 CAGE AND CONNECTOR CONTACT PLATING
Bottom Outlet and Right Arrow Pointing Top Port
7 - Without Light Pipes
8 - With Light Pipes; Left Arrow Pointing Top Port and
Right Arrow Pointing Bottom Port
4 - 0.76 µm Min. Gold over 1.27-3.81 µm of Nickel on Mating Area;
0.381-1.52 µm of Matte Tin Over 1.27-3.81 µm of Nickel on
Press Fit Tail Area; Nickel Plating for Cage
X DUST COVER OPTION
0 - Without Dust Cover
D - With Dust Cover (Shipped Loose)
U90
16
CXP
Amphenol’s CXP connector comes in a one-piece press-t assembly system with twelve channels of up
to 20 Gbps, resulting in 240 Gbps of total bandwidth – the fastest and most dense I/O on the market
today. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3ba and the Inniband
CXP12x QDR standards. It also enables pluggable copper or optical cables to increase the exibility of
system-level hardware for end users. The CXP interconnect system is ideal for network switches, routers,
servers, and storage devices.
General Characteristics
• RoHS Compliant
• Industry Standard Footprint
• Industry Standard EIA-364
Mechanical Characteristics
• Insertion Force for an MSA Compliant
Transceiver: 150 N max
• Unmating Force: 50 N max
• Durability: 250 Mating Cycles min
Electrical Characteristics
• Hot Swappable
• Operating Voltage: 30 V
• Operating Current: 0.5 A
• Differential Impedance: 100 Ω +/- 10 Ω
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
Packaging
• Tray Packaging: Cage and Connector
Assembly
• Bulk Packaging: Dust Cover
Materials
• Cage
o Base Material: Zinc Alloy
o Plating: Nickel
o Heat Sink: Aluminum Alloy
o Heat Sink Clip: Stainless Steel
o Cage Cover: Stainless Steel
o Mounting Screw: AISI 1010 Steel
o Dust Cover: Thermoplastic
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area,
Matte Tin on Termination
o Housings: Glass Reinforced, Lead-Free Solder
Reow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
• Operating Temperature: -40°C to +85°C
• Storage Temperature: -55°C to +105°C
Congurations
• 1x1
• Custom Solutions Available
Options
• Dust Cover
• Heat Sink
• EMI Shielding
o Conductive Elastomeric Gasket
o Metal Spring Fingers
• Keying
o Key #1 (Left) InniBand™
o Key #2 (Right) Ethernet
Specication Highlights
The CXP interconnect system is comprised of an 84
position, 2-row press-t connector, and a cage
assembly as one unit complying with SFF-8642.
U91-A1A1-100A-10
U91-A121-100A-10
(bottom view)
U91-A121-100A-10
U91-A111-1001-10
Ordering Information
Dust Cover
CXP Combo U91-X 1 X X -1 X X X -3 X
(Cage / Connector)
U91
SERIES DESIGNATION (RoHS) MOUNTING SCREWS
X
0 - No Screws
X
STYLE 1 - With Mounting Screws (Standard Length of
A - One Row 0°, Standard Footprint M2 x 0.4, 6 mm long)
D - One Row 0°, Enhanced Footprint
CONTACT PLATING
3
X
K - Round Pin (Chromate Passivation) Heat Sink, and Clip
X
X
17
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: sales@amphenol-highspeed.com
All specications are subject to change without notice.
F - One Row 0°, Short Connector, Belly-to-Belly Application
Consult Sales or Website for Details
1 - Nickel
CAGE PLATING
1
2 - Key #2 (Right) Ethernet
1 - Key #1 (Left) InfiniBand™
0 - No Key
KEYING
X
HEAT SINK OPTION
X
G - Square Pin (Chromate Passivation) Heat Sink, and Clip
D - Round Pin (Nickel Plated) Heat Sink, and Clip
A - Square Pin (Nickel Plated) Heat Sink, and Clip
5 - Round Pin (Black Oxide) Heat Sink, and Clip
2 - Square Pin (Black Oxide) Heat Sink, and Clip
1 - No Heat Sink or Clip Shipped
1
1 - 1x1
NUMBER OF PORTS IN ROW
E - One Row 0°, Long Connector, Belly-to-Belly Application
X
PACKAGING
1 - Tray Packaging
A - Tray Packaging: Heat Sink and Clip
Shipped Assembled
3 - Mating Area Plating 0.76 μm Gold Over 1.27 μm
to 3.81 μm of Nickel; Press Fit Tail Area Plating
0.381 μm to 1.52 μm of Matte Tin Over 1.27 μm
to 3.81μm of Nickel
X
LIGHT PIPE OPTION
0 - Without Light Pipe
X - Various Options Available
DUST COVER OPTION
0 - Without Dust Cover
D - With Dust Cover (Shipped Loose)
18
Mini-SAS
The Mini-SAS external I/O connector system consists of a die-cast metal cage and a Compact MultiLane
SMT Connector, featuring proven “cut edge” style contacts. Providing four serial send/receive channels
per port, this connector system is designed to satisfy the needs for gigabit serial data transmission
applications with signal speeds across the connector interface of 6 Gbps per channel.
The cage is mounted separately to the body so that the stress imposed by insertion and removal of the
cable plug does not aect the signal/body solder joints. The connector is available with unique solder
hold-down tabs designed to provide additional mechanical robustness in demanding applications.
Mechanical Characteristics
• Co-Planarity Specication: 0.1 mm
• Connector Insertion Force: 55.5 N max
• Connector Withdrawal Force: 49.0 N max
• Durability: 250 Mating Cycles min
• Reverse Keying for Active Copper Cables per
SAS 2.0
Electrical Characteristics
• Operating Voltage: 30 V
• Operating Current: 0.5 A
• Differential Impedance: 100 Ω +/- 10 Ω
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
• Contact Resistance: 80 mΩ max
• Near-End Isolation: -40 dB (frequencies up to 3
GHz)
• Insertion Loss: 1.0 dB max (frequencies up to
1.6 GHz)
• Rise Time for Impedance Measurement: 50 ps
• Within Pair Skew: 5 ps
Packaging
• Tape and Reel Packaging: Connector
• Tray Packaging: Cage
• Bulk Packaging: Mounting Screw or Dust Cover
Materials
• Cage
o Base Material: Zinc Alloy
o Plating: Nickel
o Mounting Screw: AISI 1010 Steel
o Light Pipe: Optical Grade Polycarbonate
o Dust Cover: Thermoplastic
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area, Matte
Tin on Termination
o Housings: Glass Reinforced, Lead-Free Solder
Reow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
• Operating Temperature: -55°C to +85°C
• Storage Temperature: -55°C to +85°C
Congurations (Rows x Ports per Row)
• 1x1 • 1x2
• 1x4
Options
• Dust Cover
• Light Pipe
• EMI Shielding
o Conductive Elastomeric Gasket
o Soft Shield Foam Gasket
o Stainless Steel Gasket
• Cage Inclination from Printed Circuit Board
o 0 degree Angle
o 1 degree Angle (PCI Applications)
• Keying
Specication Highlights
The Mini-SAS interconnect system is comprised of a
cage assembly which is used with 26-position, 0.8mm
pitch connectors complying with SFF-8086 and
SFF-8088.
FS2-SF2-16C1
FS1-SF4-14E1 FS1-S02-14E2-LP
FS2-S02-14F1
Ordering Information
FS1-R26-2000
Mini-SAS Connector FS1 -R26 -X 0 0 X
FS1 SERIES DESIGNATION (RoHS) OPTIONS X
0 - Standard Connector
R26 STYLE
1 - Connector with Hold Down Tabs
R26 - 26 position connector
0 - Standard
0
X PLATING
2 - 30 µ" Gold in Mating Area; 100 µ" Matte Tin on Tails over Nickel Underplate 0 - Standard
0
3 - 15 µ" Gold in Mating Area; 100 µ" Matte Tin on Tails over Nickel Underplate
Mini-SAS Cage
FSX -S XX -1 X XX -XX
FSX SERIES DESIGNATION LIGHT PIPE OPTION XX
FS1 - Standard Blank - No Light Pipe
FS2 - With SAS 2.0 Guide Keyway LP - 2 Barrel Light Pipes (1 Light Pipe per Port)
FSA - With SAS 2.1 Guide Keyway
OPTIONS XX
SS - Shell C1 - Conductive Elastomer Gasket, 8 mm Long Mounting
Screw, No Lock Washer
XX SIZE C2 - Conductive Elastomer Gasket, No Mounting Screw
01 - 1x, 1 degree C3 - Conductive Elastomer Gasket, 10 mm Long Mounting
F1 - 1x, 0 degree Screw with Lock Washer
02 - 2x, 1 degree E1 - Stainless Steel Gasket, 8 mm Long Mounting Screw,
F2 - 2x, 0 degree No Lock Washer
F4 - 4x, 0 degree E2 - Stainless Steel Gasket, No Mounting Screw
E3 - Stainless Steel Gasket, 10 mm Long Mounting Screw
1 PLATING with Lock Washer
1 - Nickel (RoHS) F1 - Foam Gasket, 8 mm Long Mounting Screw,
No Lock Washer
XKEYING F2 - Foam Gasket, No Mounting Screw
0 - No Key F3 - Foam Gasket, 10 mm Long Mounting Screw with
1 - Key #1 Lock Washer
4 - Key #4 Universal SAS Port
7 - Key #7
24 - Key #2 and #4 (SAS Out)
46 - Key #4 and #6 (SAS In)
D22 - Left Port Key #2 & #4 / Right Port Key #2 & #4
D66 - Left Port Key #4 & #6 / Right Port Key #4 & #6
D26 - Left Port Key #2 & #4 / Right Port Key #4 & #6
D62 - Left Port Key #4 & #6 / Right Port Key #2 & #4
FS2-SF1-12C1
19
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
20
Mini-SAS HD
Amphenol’s Mini-SAS High Density Interconnect is the next generation SAS system, with 4x, 8x, and 16x
cable-plugging options to provide faster data transmission and more bandwidth for end users. The
Mini-SAS HD connector system has a 2-row, right-angle connector with 12 Gbps per channel. Each
connector handles 4 lanes of data for up to 48 Gbps of total bandwidth. Ganged options are also
available up to a 1x4 conguration for up to 192 Gbps of total bandwidth. This connector will mate with
active copper and optical cable assemblies, as well as active pluggable modules for extended-length
applications in data centers. Main applications for Mini-SAS HD include HBA Servers, storage devices,
switches, and rack-mounted computers.
General Characteristics
• RoHS Compliant
• Industry Standard Footprint
• Industry Standard EIA-364
Mechanical Characteristics
• Durability: 250 Mating Cycles min
Electrical Characteristics
• Hot Swappable
• Operating Voltage: 30 V
• Operating Current: 0.5 A
• Differential Impedance: 100 Ω +/- 10 Ω
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
• EMI Spring Fingers for Superior EMI
Performance
Packaging
• Tray Packaging: Cage and Connector Assembly
• Bulk Packaging: Dust Cover or Mounting Screw
Specication Highlights
The Mini-SAS HD interconnect system is comprised of a
36-position, 2-row press-t connector, and a stamped
and formed cage assembly as one unit complying with
SFF-8644.
U92-A410-1001-30
U92-A110-1001-10
U92-A150-1D0A-10
U92-A210-1001-10
Materials
• Cage
o Base Material: Copper Alloy
o Plating: Nickel
o Heat Sink: Aluminum Alloy
o Heat Sink Clip: Stainless Steel
o Dust Cover: Thermoplastic
o Mounting Screw: AISI 1010 Steel
o EMI Spring Finger: Copper Alloy with Nickel
Plating
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area,
Matte Tin on Termination
o Housings: Glass Reinforced, Lead-Free
Solder Reow Process Compatible
Thermoplastic, UL94V-0 Rated
Temperature Rating
• Operating Temperature: -40°C to +85°C
• Storage Temperature: -55°C to +105°C
Congurations (Rows x Ports per Row)
• 1x1 • 1x2
• 1x4
Options
• Dust Cover
• Heat Sink
• Light Pipe
Ordering Information
U92-A410-1001-20
21
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
Mini-SAS HD Combo U92 -A X X X -1 X X X -3 X
(Cage / Connector)
U92
SERIES DESIGNATION (RoHS) MOUNTING SCREWS
X
0 - No Screws
A
STYLE
1 - Mounting Screws (Standard Length of
A - One Row Cage 0 degrees M2 x 0.4, 4.3 mm Long)
X
NUMBER OF PORTS IN ROW CONTACT PLATING
3
1 - 1x1 3 - Mating Area Plating 0.76 µm Gold Over 1.27 μm to
2 - 1x2 3.81 μm of Nickel; Press Fit Tail Area Plating
4 - 1x4 0.381 μm to 1.52 μm of Matte Tin Over 1.27 μm to
3.81μm of Nickel
X HEAT SINK OPTION
1 - No Heat Sink or Clip Shipped
2 - Fin Style (Black Oxide) Heat Sink and Clip
5 - Pin Style (Nickel Plated) Heat Sink and Clip
A - Fin Style (Nickel Plated) Heat Sink and Clip
D - Pin-Fin Style (Black Oxide) Heat Sink and Clip
G - Pin Style (Black Oxide) Heat Sink and Clip
K - Pin Style (Chromate Passivation) Heat Sink and Clip
N - Pin-Fin Style (Nickel Plated) Heat Sink and Clip
X
0 - Standard EMI Fingers
1 - Extended EMI Fingers
DUST COVER OPTION
X
0 - Without Dust Cover
1
CAGE PLATING
D - With Dust Cover (Shipped Loose)
1 - Nickel
X
PACKAGING
1 - Tray Packaging
T - Tape and Reel Packaging
A - Tray Packaging Heat Sink and Clip or Light Pipe
Shipped Assembled
X
0 - Standard
2 - 2 Round Light Pipes Per Port, on Top of the Cage
LIGHT PIPE OPTION
EMI Shielding
22
XFP
The XFP interconnect system is capable of a 10 Gbps data rate and is intended for external I/O
connections. High speed serial interconnect applications include clusters, servers, and storage
devices. Its single row cage conguration requires less space and is a lower cost alternative to
parallel-optics VSR. XFP also requires less than one-third the power and physical space of an MSA
interconnect with parallel interface. It has a single footprint for all links, and is hot-pluggable.
The ExpressPort™ XFP+ Connector is designed to extend performance to 14 Gbps. Several EMI
shielding options such as an elastomeric gasket or mylar tape are also available.
Mechanical Characteristics
• Insertion Force: 40 N max (Cage and
Connector)
• Withdrawal Force: 30 N max (Cage and
Connector)
• Cage Retention: 180 N min (Latch Strength)
• Durability: 250 Mating Cycles min
Electrical Characteristics
• Operating Voltage: 30 V
• Operating Current: 0.5 A
• Differential Impedance: 100 Ω +/- 5 Ω
• DWV: 300 V AC
• Insulation Resistance: 1000 MΩ min
• Contact Resistance: 70 mΩ max
• Near-End Isolation: -40 dB
• Insertion Loss: 1.0 dB max
Packaging
• Tape and Reel Packaging: Connector or Cage
• Tray Packaging: Cage
• Bulk Packaging: Dust Cover
Materials
• Cage
o Base Material: Copper Alloy
o Plating: Nickel
o Front Flange: Zinc Alloy
o Heat Sink: Aluminum Alloy
o Heat Sink Clip: Stainless Steel
o Dust Cover: Thermoplastic
• Connector
o Contact Base Material: Copper Alloy
o Contact Plating: Gold on Mating Area,
Gold or Matte Tin on Termination
o Housings: Glass Reinforced, Lead-Free
Solder Reow Process Compatible
Thermoplastic, UL94V-0 Rated
Temperature Rating
• Operating Temperature: -40°C to +85°C
• Storage Temperature: -40°C to +85°C
Options
• Heat Sink
• Dust Cover
• EMI Shielding
o Conductive Elastomeric Gasket at Back
of Cage
o Mylar Tape
Specication Highlights
The XFP interconnect system is comprised of a press-t
cage assembly which is used with 30-position, 0.8 mm
pitch SMT connectors complying with INF-8077i.
U79-A141-2D01
U79-A1G1-2001
UE75-A30-3000T
Ordering Information
XFP Connector UE7X -A 30 -X 0 0 X T
UE7X SERIES DESIGNATION (RoHS) PACKAGING T
UE75 - Standard XFP Connector T - Tape and Reel Packaging (500 per Reel)
UE76 - ExpressPort™ XFP+ Connector
LUBRICANT OPTION X
A STYLE 0 - Non Lubricated
A - R/A Single Surface Mount Connector 1 - Lubricant Added
30 NUMBER OF POSITIONS 0 - Standard 0
30 - 30 Positions (Single XFP)
OPTION 1 0
X CONTACT PLATING 0 - Standard
2 - 30 µ" Gold Plating on Mating Area; Gold Flash on Termination
3 - 30 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination
5 - 15 µ" Gold Plating on Mating Area; Gold Flash on Termination
6 - 15 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination
XFP Cage U79 -A 1 X 1 -2 X X X
U79 SERIES DESIGNATION PACKAGING X
1 - Tray Packaging (Heat Sink and Clip Shipped Separately)
A STYLE T - Tape and Reel (Heat Sink and Clip Shipped Separately)
A - 1 Row B - Tray Packaging (Clip Shipped Assembled to Cage)
1 NUMBER OF PORTS IN ROW OPTION 1 X
1 - Single in Row 0 - Standard
1 - High Conductivity Rear Lower EMI Gasket
X HEAT SINK OPTION 2 - Mylar Tape Attached to Bottom Cage Wall
0 - No Heat Sink, Only Clip is Shipped
1 - No Heat Sink or Clip Shipped DUST COVER OPTION X
2 - Standard Height Fin Heat Sink (7 mm) and Clip 0 - Without Dust Cover
3 - PCI Height Fin Heat Sink (4.2 mm) and Clip D - With Dust Cover (Shipped Loose)
4 - Tall Fin Heat Sink (13.5 mm) and Clip
PLATING 2
11 - Standard
2 - Nickel
23
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
X
G - 45
°
Standard Height Fin Heat Sink (7mm) and Clip
24
CFP2 / CFP4
The CFP2 and CFP4 (surface mount receptacle connector) are considered as a candidate of future
generation of multi hundred Gbps system. Both are 0.6mm pitch with the CFP2 having 104 positions
and the CFP4 having 56 positions. They are rated for 28 Gbps per channel with resonance dampening
for improved signal integrity. Both the CFP2 and CFP4 have a plug connector on the mating interface
that improves accuracy and aids in achieving high speed performance.
Current Mechanical Characteristics
CFP2 CFP4
• RSS Tolerance 0.19mmMin
• Host Depth (mm) 84.5 67
• Host Height (mm) 12.9 10
• Ports in 365(445)mm Faceplate 8(10) 16(19)
• Max Insertion Force with Heat-sink: 6N
• Max Insertion Force without Heat-sink: 4.5N
• Max Withdrawal Force with Heat-sink: 5.4N 4.0N
• Max Withdrawal Force without Heat-sink: 3.9N 2.5N
Electrical Characteristics
• Operating Voltage: 3.3 V
Materials
• Cage
o Base Material: Copper Alloy
o Heat Sink: Aluminum Alloy
Options
• Heat Sink
• Dust Cover
• Connector Cover
• EMI Gasket
Specication Highlights
The CFP2 and CFP4 interconnect systems are comprised of insert molding assemblies for
top side contacts and press-t cage assemblies.
CFP2 CFP4
Ordering Information
25
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
CFP2/CFP4
Host Connector
U99 SERIES DESIGNATION
X STYLE
PACKAGING T
T - Tape and Reel Packaging
XXX NUMBER OF POSITIONS
OPTION 2 0
0 - Standard
1
CONTACT PLATING
OPTION 1 0
0 - Standard
--
2 - 30 μ" Gold Plating on Mating Area; Matte Tin
Plating on Termination
B - CFP2 Connector
C - CFP4 Connector
U98 SERIES DESIGNATION PACKAGING X
C - CFP4 single row CONNECTOR COVER X
1 - Tray Packaging
X STYLE
A - Tray Packaging; Heat Sink and Clip
B - CFP2 single row
or Light Pipe Shipped Assembled
0 - With Connector Cover and Kickout Springs
OPTIONAL DUST COVER X
0 - Without Dust Cover
D - With Dust Cover (Ship Loose)
XNUMBER OF PORT IN ROW
1 - Nx1 ports
2 - Nx2 ports
3- Nx3 ports (To be Tooled)
4 - Nx4 ports (To be Tooled)
6 - Nx6 ports (To be Tooled)
XHEAT SINK OPTION PLATING X
1 - No Heat Sink and No Clip Shipped 1 - Nickel
2 - Fin Style (Black Oxide) Heat Sink and Clip (H=10.75mm)2 - Matte Tin
APPLICATION 1
1 - Press Fit Pins - 2.5 mm Long
CFP2/CFP4 Cage
-1XX
-
XX 0 0 T
XXX
U99
104 - CFP2 Connector
056 - CFP4 Connector (To be Tooled)
3 -
15 µ" Gold Plating on Mating Area; Matte Tin
Plating on Termination
U98 X0 0
XX0
*Other custom heat sink options are available.
CFP2/CFP4
Plug Connector
U56 SERIES DESIGNATION
X STYLE
PACKAGING T
T - Tape and Reel Packaging
XXX NUMBER OF POSITIONS
OPTION 2 0
0 - Standard
1
CONTACT PLATING
OPTION 1 0
0 - Standard
--
2 - 30 μ" Gold Plating on Mating Area; Matte Tin
Plating on Termination
B - CFP2 Connector
C - CFP4 Connector
XX 0 0 T
XXX
U56
104 - CFP2 Connector
056 - CFP4 Connector (To be Tooled)
3 -
15 µ" Gold Plating on Mating Area; Matte Tin
Plating on Termination
C - With Connector Cover, no Kickout Springs
Notes
26
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
Notes
27
Telephone: (416)-291-4401 Website: www.amphenol-highspeed.com Email: cages@amphenol-highspeed.com
All specications are subject to change without notice.
CONTACT US
For more information about any of our products, please contact
your local Amphenol Sales Representative at:
Phone: +1-416-291-4401
Fax: +1-416-292-0647
Email: cages@amphenol-highspeed.com
www.amphenol-highspeed.com
North America
World Headquarters
Asia
Europe
Phone: +852-2699-2663
Fax: +852-2691-1774
Email: enquiry@amphenol.com.hk
Phone: +31-30-635-8000
Fax: +31-30-637-7034
Email: customerservice@amphenol-nl.com
Phone: +1-203-265-8900
Fax: +1-203-268-8516
Email: info@amphenolacp.com
www.amphenol.com
Now you’re connected
Amphenol
Now you’re connected
Amphenol
High Speed Interconnects