IL510/IL511/IL514/IL515/IL516 Low-Cost Digital Isolators Functional Diagrams Features VOE IN1 OUT1 IL510 IN1 OUT1 IN2 OUT2 IL511 IN1 OUT1 IN2 OUT2 OUT3 IN3 VOE IL514 * * * * * * * * * * * +5 V / +3.3 V CMOS/TTL Compatible 2 Mbps Maximum Speed -40C to 85C Operating Temperature 2500 VRMS Isolation (1 min.) 10 ns Pulse Width Distortion 25 ns Propagation Delay DC-Correct 30 kV/s Typical Common Mode Rejection Low EMC Footprint 8-pin MSOP; 0.3" and 0.15" 8-pin and 16-pin SOIC Packages UL 1577 and IEC 61010-2001 Approved Applications * * * * * * * * * * * ADCs and DACs Digital Fieldbus RS-485 and RS-422 Multiplexed Data Transmission Data Interfaces Board-to-Board Communication Digital Noise Reduction Ground Loop Elimination Peripheral Interfaces Parallel Bus Logic Level Shifting Description IN1 VOE OUT1 IN2 OUT2 IN3 OUT3 IN4 OUT4 IL500-Series isolators are low cost isolators operating up to 2Mbps over an operating temperature range of -40C to 85C. The devices use NVE's patented* IsoLoop(R) spintronic Giant Magnetoresistive (GMR) technology. IL515 IN1 OUT1 IN2 OUT2 OUT3 IN3 OUT4 IN4 IL516 IsoLoop is a registered trademark of NVE Corporation. *U.S. Patent numbers 5,831,426; 6,300,617 and others. NVE Corporation 11409 Valley View Road, Eden Prairie, MN 55344-3617 REV. I Phone: (952) 829-9217 Fax: (952) 829-9189 www.IsoLoop.com (c)NVE Corporation IL510/IL511/IL514/IL515/IL516 Absolute Maximum Ratings Parameters Storage Temperature Ambient Operating Temperature(1) Supply Voltage Input Voltage Output Voltage Output Current Drive Lead Solder Temperature ESD Symbol TS TA VDD1, VDD2 VI VO IO Min. -55 -55 -0.5 -0.5 -0.5 Typ. Max. 150 150 7 VDD+0.5 VDD+0.5 10 260 Units C C V V V mA C kV Max. 85 5.5 VDD 0.8 Units C V V V Test Conditions Max. Units Test Conditions 2 Test Conditions 10 sec. HBM Recommended Operating Conditions Parameters Ambient Operating Temperature Supply Voltage Logic High Input Voltage Logic Low Input Voltage Input Signal Rise and Fall Times(10) Symbol TA VDD1, VDD2 VIH VIL tIR, tIF Min. -40 3.0 2.4 0 Symbol Min. Typ. DC-Correct Insulation Specifications Parameters Creepage Distance MSOP 0.15" SOIC (8-pin or 16-pin) 0.3" SOIC Leakage Current Barrier Impedance Typ. 3.0 4.0 8.1 mm mm mm A || pF 0.2 >1014||3 240 VRMS, 60 Hz Package Characteristics Parameters Capacitance (Input-Output)(5) Thermal Resistance MSOP 0.15" 8-pin SOIC 0.15" 16-pin SOIC 0.3" 16-pin SOIC Package Power Dissipation Symbol CI-O Min. Typ. 4 JC JC JC JC Max. 168 144 41 28 150 PPD Units pF C/W C/W C/W C/W mW Test Conditions f = 1 MHz Thermocouple at center underside of package f = 1 MHz, VDD = 5 V Safety and Approvals IEC61010-1 TUV Certificate Numbers: N1502812, N1502812-101 Classification as Reinforced Insulation Model IL5xx-1 IL5xx-3 IL5xx Package MSOP 8-pin and 16-pin 0.15" SOIC 0.3" SOIC UL 1577 Component Recognition Program File Number: E207481 Rated 2500VRMS for 1 minute Soldering Profile Per JEDEC J-STD-020C, MSL=2 2 Pollution Degree II II II Material Group III III III Max. Working Voltage 150 VRMS 150 VRMS 300 VRMS IL510/IL511/IL514/IL515/IL516 IL510 Pin Connections 1 2 VDD1 IN 3 SYNC 4 5 6 GND1 GND2 OUT 7 VOE 8 VDD2 Supply voltage Data in Internal refresh clock disable (normally enabled and internally held low with 10 k) Ground return for VDD1 Ground return for VDD2 Data out Output enable (internally held low with 100 k) Supply voltage VDD1 VDD2 IN VOE SYNC OUT GND1 GND2 IL510 IL511 Pin Connections 1 2 3 4 5 6 7 8 VDD1 IN1 IN2 GND1 GND2 OUT2 OUT1 VDD2 Supply voltage Data in, channel 1 Data in, channel 2 Ground return for VDD1 Ground return for VDD2 Data out, channel 2 Data out, channel 1 Supply voltage VDD1 8 VDD2 1 IN1 2 7 OUT1 IN2 3 6 OUT2 GND1 4 5 GND2 IL511 IL514 Pin Connections 1 VDD1 2 GND1 3 4 5 6 IN1 IN2 OUT3 NC 7 VOE 8 GND1 9 GND2 10 11 12 13 14 NC NC IN3 OUT2 OUT1 15 GND2 16 VDD2 Supply voltage 1 Ground return for VDD1 (pin 2 internally connected to pin 8) Data in, channel 1 Data in, channel 2 Data out, channel 3 No connection Output enable, channel 3 (internally held low with 100 k) Ground return for VDD1 (pin 8 internally connected to pin 2) Ground return for VDD2 (pin 9 internally connected to pin 15) No connection No connection Data in, channel 3 Data out, channel 2 Data out, channel 1 Ground return for VDD2 (pin 15 internally connected to pin 9) Supply voltage VDD1 VDD2 GND1 GND2 IN1 OUT1 IN2 OUT2 OUT3 IN3 NC NC VOE NC GND2 GND1 IL514 3 IL510/IL511/IL514/IL515/IL516 IL515 Pin Connections 1 VDD1 2 GND1 3 4 5 6 IN1 IN2 IN3 IN4 7 SYNC 8 GND1 9 GND2 10 VOE 11 12 13 14 15 OUT4 OUT3 OUT2 OUT1 GND2 16 VDD2 Supply voltage Ground return for VDD1 (pin 2 internally connected to pin 8) Data in, channel 1 Data in, channel 2 Data in, channel 3 Data in, channel 4 Internal refresh clock disable (normally enabled and internally held low with 10 k) Ground return for VDD1 (pin 8 internally connected to pin 2) Ground return for VDD2 (pin 9 internally connected to pin 15) Output enable (internally held low with 100 k) Data out, channel 4 Data out, channel 3 Data out, channel 2 Data out, channel 1 Ground return for VDD2 (pin 15 internally connected to pin 9) Supply voltage VDD1 VDD2 GND1 GND2 IN1 OUT1 IN2 OUT2 IN3 OUT3 IN4 OUT4 SYNC VOE GND1 GND2 IL515 IL516 Pin Connections 1 VDD1 2 GND1 3 4 5 6 7 IN1 IN2 OUT3 OUT4 NC 8 GND1 9 GND2 10 11 12 13 14 NC IN4 IN3 OUT2 OUT1 15 GND2 16 VDD2 Supply voltage Ground return for VDD1 (pin 2 internally connected to pin 8) Data in, channel 1 Data in, channel 2 Data out, channel 3 Data out, channel 4 No connection Ground return for VDD1 (pin 8 internally connected to pin 2) Ground return for VDD2 (pin 9 internally connected to pin 15) No connection Data in, channel 4 Data in, channel 3 Data out, channel 2 Data out, channel 1 Ground return for VDD2 (pin 15 internally connected to pin 9) Supply voltage VDD1 VDD2 GND1 GND2 IN1 OUT1 IN2 OUT2 OUT3 IN3 OUT4 IN4 NC NC GND2 GND1 IL516 4 IL510/IL511/IL514/IL515/IL516 Timing Diagrams Legend tPLH tPHL tPW tPLZ tPZH tPHZ tPZL tR tF Propagation Delay, Low to High Propagation Delay, High to Low Minimum Pulse Width Propagation Delay, Low to High Impedance Propagation Delay, High Impedance to High Propagation Delay, High to High Impedance Propagation Delay, High Impedance to Low Rise Time Fall Time Truth Tables SYNC Output Enable VI L H L H VOE L L H H VO L H Z Z SYNC 0 1 Internal Refresh Clock Enabled Disabled Note: SYNC should be left open or connected to GND to enable the internal refresh clock, or connected to VDD to disable the internal clock. 5 IL510/IL511/IL514/IL515/IL516 3.3 Volt Electrical Specifications Electrical specifications are Tmin to Tmax unless otherwise stated. Parameters Symbol Min. Typ. Max. DC Specifications Input Quiescent Supply Current 15 30 IL510, IL511, IL515 IL514 1.7 2 IDD1 IL516 3.3 4 Output Quiescent Supply Current 1.7 2 IL510 IL511, IL514, IL516 3.3 4 IDD2 IL515 6.6 8 Logic Input Current II -10 10 VDD VDD - 0.1 Logic High Output Voltage VOH 0.8 x VDD 0.9 x VDD 0 0.1 Logic Low Output Voltage VOL 0.5 0.8 Switching Specifications Maximum Data Rate 2 20 (7) Pulse Width PW 25 Propagation Delay Input to Output tPHL 25 (High to Low) Propagation Delay Input to Output 25 tPLH (Low to High) Propagation Delay Enable to Output 5 tPHZ (High to High Impedance) Propagation Delay Enable to Output tPLZ 5 (Low to High Impedance) Propagation Delay Enable to Output tPZH 5 (High Impedance to High) Propagation Delay Enable to Output 5 tPZL (High Impedance to Low) Pulse Width Distortion(2) PWD 10 Propagation Delay Skew(3) tPSK 10 Output Rise Time (10%-90%) tR 1 3 Output Fall Time (10%-90%) tF 1 3 Common Mode Transient Immunity |CM |,|CM | 20 30 H L (Output Logic High or Logic Low)(4) Channel-to-Channel Skew tCSK 3 5 SYNC Internal Clock Off Time(11) tOFF 5 Dynamic Power Consumption(6) 140 240 Magnetic Field Immunity(8) (VDD2= 3V, 3V<VDD1<5.5V) Power Frequency Magnetic Immunity HPF 1000 1500 Pulse Magnetic Field Immunity HPM 1800 2000 Damped Oscillatory Magnetic Field HOSC 1800 2000 Cross-axis Immunity Multiplier(9) KX 2.5 6 Units Test Conditions A mA mA mA mA mA A V V Mbps ns ns IO = -20 A, VI = VIH IO = -4 mA, VI = VIH IO = 20 A, VI = VIL IO = 4 mA, VI = VIL CL = 15 pF VO 50% points; SYNC=0 VO 50% points; SYNC=1 ns CL = 15 pF ns CL = 15 pF ns CL = 15 pF ns CL = 15 pF ns CL = 15 pF ns CL = 15 pF ns ns ns ns CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF kV/s ns ns A/MHz A/m A/m A/m VCM = 300 V CL = 15 pF per channel 50Hz/60Hz tp = 8s 0.1Hz - 1MHz IL510/IL511/IL514/IL515/IL516 5 Volt Electrical Specifications Electrical specifications are Tmin to Tmax unless otherwise stated. Parameters Symbol Min. Typ. Max. DC Specifications Input Quiescent Supply Current IL510, IL511, IL515 24 40 IDD1 IL514 2 3 IL516 5 6 Output Quiescent Supply Current 2 3 IL510 IL511, IL514, IL516 4 6 IDD2 IL515 9 12 Logic Input Current II -10 10 VDD - 0.1 VDD Logic High Output Voltage VOH 0.8 x VDD 0.9 x VDD 0 0.1 Logic Low Output Voltage VOL 0.5 0.8 Switching Specifications Maximum Data Rate 2 20 (7) Pulse Width PW 25 Propagation Delay Input to Output 25 tPHL (High to Low) Propagation Delay Input to Output 25 tPLH (Low to High) Propagation Delay Enable to Output tPHZ 5 (High to High Impedance) Propagation Delay Enable to Output 5 tPLZ (Low to High Impedance) Propagation Delay Enable to Output 5 tPZH (High Impedance to High) Propagation Delay Enable to Output tPZL 5 (High Impedance to Low) (2) Pulse Width Distortion PWD 10 Propagation Delay Skew(3) tPSK 10 Output Rise Time (10%-90%) tR 1 3 Output Fall Time (10%-90%) tF 1 3 Common Mode Transient Immunity 20 30 |CMH|,|CML| (Output Logic High or Logic Low)(4) Channel-to-Channel Skew tCSK 3 5 SYNC Internal Clock Off Time(11) tOFF 5 Dynamic Power Consumption(6) 200 340 Magnetic Field Immunity(8) (VDD2= 5V, 3V<VDD1<5.5V) Power Frequency Magnetic Immunity HPF 2,800 3,500 Pulse Magnetic Field Immunity HPM 4,000 4,500 Damped Oscillatory Magnetic Field HOSC 4,000 4,500 Cross-axis Immunity Multiplier(9) KX 2.5 7 Units Test Conditions A mA mA mA mA mA A V V Mbps ns ns IO = -20 A, VI = VIH IO = -4 mA, VI = VIH IO = 20 A, VI = VIL IO = 4 mA, VI = VIL CL = 15 pF VO 50% points; SYNC=0 VO 50% points; SYNC=1 ns CL = 15 pF ns CL = 15 pF ns CL = 15 pF ns CL = 15 pF ns CL = 15 pF ns CL = 15 pF ns ns ns ns CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF kV/s ns ns A/MHz A/m A/m A/m Vcm = 300 V CL = 15 pF per channel 50Hz/60Hz tp = 8 s 0.1Hz - 1MHz IL510/IL511/IL514/IL515/IL516 Notes (apply to both 3.3 V and 5 V specifications): 1. Absolute maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not guarantee performance. 2. PWD is defined as |tPHL - tPLH|. %PWD is equal to PWD divided by pulse width. 3. tPSK is the magnitude of the worst-case difference in tPHL and/or tPLH between devices at 25C. 4. CMH is the maximum common mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common mode input voltage that can be sustained while maintaining VO < 0.8 V. The common mode voltage slew rates apply to both rising and falling common mode voltage edges. 5. Device is considered a two terminal device: pins on each side of the package are shorted. 6. Dynamic power consumption is calculated per channel and is supplied by the channel's input side power supply. 7. Minimum pulse width is the minimum value at which specified PWD is guaranteed. 8. The relevant test and measurement methods are given in the Electromagnetic Compatibility section on p. 9. 9. External magnetic field immunity is improved by this factor if the field direction is "end-to-end" rather than to "pin-to-pin" (see diagram on p. 9). 10. If internal clock is used, devices will respond to DC states on inputs within a maximum of 9 s. Outputs may oscillate if the SYNC input slew rate is less than 1 V/ms. 11. toff is the maximum time for the internal refresh clock to shut down. 8 IL510/IL511/IL514/IL515/IL516 Application Information Electrostatic Discharge Sensitivity Power Supply Decoupling This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, NVE recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. Both power supplies to these devices should be decoupled with low ESR ceramic capacitors of at least 47 nF. Capacitors must be located as close as possible to the VDD pins. Electromagnetic Compatibility NVE digital isolators have the lowest EMC noise signature of any high-speed digital isolator on the market today because of the dc nature of the GMR sensors used. It is perhaps fair to include optocouplers in that dc category too, but their limited parametric performance, physically large size, and wear-out problems effectively limit side by side comparisons between NVE's isolators and isolators coupled with RF, matched capacitors, or transformers. DC Correctness, EMC, and the SYNC Function IsoLoop Isolators have the lowest EMC footprint of any isolation technology. IsoLoop Isolators' Wheatstone bridge configuration and differential magnetic field signaling ensure excellent EMC performance against all relevant standards. Additionally, on the IL510 and IL515, the internal clock can be disabled for even better EMC performance. IL500-Series isolators has an internal refresh clock which ensure the synchronization of input and output within 9 s of the supply passing the 1.5 V threshold. The IL510 and IL515 allow external control of the refresh clock through the SYNC pin thereby further lowering the EMC footprint. This can be advantageous in applications such as hi-fi, motor control and power conversion. These isolators are fully compliant with generic EMC standards EN50081, EN50082-1 and the umbrella line-voltage standard for Information Technology Equipment (ITE) EN61000. NVE has completed compliance tests in the categories below: The isolators can be used with Power on Reset (POR) circuits common in microcontroller applications, as the means of ensuring the output of the device is in the same state as the input a short time after power up. Figure 1 shows a practical Power on Reset circuit: EN50081-1 Residential, Commercial & Light Industrial Methods EN55022, EN55014 EN50082-2: Industrial Environment Methods EN61000-4-2 (ESD), EN61000-4-3 (Electromagnetic Field Immunity), EN61000-4-4 (Electrical Transient Immunity), EN61000-4-6 (RFI Immunity), EN61000-4-8 (Power Frequency Magnetic Field Immunity), EN61000-4-9 (Pulsed Magnetic Field), EN61000-4-10 (Damped Oscillatory Magnetic Field) ENV50204 Radiated Field from Digital Telephones (Immunity Test) Vdd2 Vdd1 1 8 7 SET IN Immunity to external magnetic fields is even higher if the field direction is "end-to-end" rather than to "pin-to-pin" as shown in the diagram below: POR 2 6 SYNC 3 4 5 VOE OUT IL510 Fig. 1. Typical Power On Reset Circuit for IL510 After POR, the SYNC line goes high, the internal clock is disabled, and the EMC signature is optimized. Decoupling capacitors are omitted for clarity. Cross-axis Field Direction Dynamic Power Consumption IsoLoop Isolators achieve their low power consumption from the way they transmit data across the isolation barrier. A magnetic field is created around the GMR Wheatstone bridge by detecting the edge transitions of the input logic signal and converting them to narrow current pulses. Depending on the direction of the magnetic field, the bridge causes the output comparator to switch following the input logic signal. Since the current pulses are narrow, about 2.5 ns, the power consumption is independent of mark-to-space ratio and solely dependent on frequency. This has obvious advantages over optocouplers, which have power consumption heavily dependent on mark-to-space ratio. 9 IL510/IL511/IL514/IL515/IL516 Illustrative Applications Isolated A/D Converter Bridge Bias Delta Sigma A/D CS5532 Bridge + Bridge - Iso SD Out SD OE SD Out Iso CS CS Iso SCK SCK IL514 Clock Generator OSC A delta-sigma A-D converter interfaced with the three-channel IL514. Multiple channels can easily be combined using the IL514's output enable function. 10 IL510/IL511/IL514/IL515/IL516 12-Bit D/A Converter Isolation SYNC OE D1 D2 Latch D3 D4 SYNC OE D5 Data Bus D6 Latch Vout D7 D8 SYNC OE D9 D10 Latch D11 D12 3 x IL515 12-Bit DAC RESET The IL515 four-channel isolator is ideally suited for parallel bus isolation. The circuit above uses three IL515s to isolate a 12-bit DAC. The unique SYNC function automatically synchronizes the outputs to the inputs, ensureing correct data on the isolator outputs. After the reset pulse goes high, data transfer from input to output is initiated by the leading edge of each changing data bit. Intelligent DC-DC Converter With Synchronous Rectification D 10 Vdc G MOSFET2 S D D S S MOSFET3 MOSFET1 G G IL511 Microcontroller A typical primary-side controller uses the IL511 to drive the synchronous rectification signals from primary side to secondary side. IL511 pulsewidth distortion of 10 ns minimizes MOSFET dead time and maximizes efficiency. The ultra-small MSOP package minimizes board area. 11 IL510/IL511/IL514/IL515/IL516 Package Drawings, Dimensions, and Specifications 8-pin MSOP 0.114 (2.90) 0 0.122 (3.10) 6 0.016 (0.40) 0.027 (0.70) 0.032 (0.80) 0.043 (1.10) 0.114 (2.90) 0.189 (4.80) 0.197 (5.00) 0.122 (3.10) 0.028 (0.70) 0.024 (0.60) NOTE: Pin spacing is a BASIC dimension; tolerances do not accumulate 0.005 (0.13) 0.009 (0.23) 0.010 (0.25) 0.016 (0.40) 0.002 (0.05) 0.006 (0.15) 8-pin SOIC Package Dimensions in inches (mm) 0.189 (4.8) 0 0.197 (5.0) 8 0.016 (0.40) 0.050 (1.27) 0.054 (1.37) 0.228 (5.8) 0.150 (3.8) 0.069 (1.75) 0.244 (6.2) 0.157 (4.0) 0.010 (0.25) 0.004 (0.10) 0.020 (0.50) 0.040 (1.0) 1 2 3 x45 0.060 (1.5) 0.008 (0.19) 0.013 (0.33) 0.010 (0.25) 0.020 (0.50) 12 NOTE: Pin spacing is a BASIC dimension; tolerances do not accumulate 0.010 (0.25) IL510/IL511/IL514/IL515/IL516 16-pin 0.15" SOIC Package Dimensions in inches (mm) 0.152 (3.86) 0.157 (3.99) 0.013 (0.3) 0.020 (0.5) NOM 0.016 (0.4) 0.050 (1.3) 0.007 (0.2) 0.013 (0.3) 0.386 (9.8) 0.394 (10.0) Pin 1 identified by either an indent or a marked dot 0.228 (5.8) 0.244 (6.2) 0.054 (1.4) 0.072 (1.8) 0.040 (1.02) 0.050 (1.27) 0.040 (1.0) NOTE: Pin spacing is a BASIC 0.060 (1.5) dimension; tolerances do not accumulate 0.004 (0.1) 0.012 (0.3) 16-pin 0.3" SOIC Package Dimensions in inches (mm) 0.013 (0.3) 0.020 (0.5) 0.287 (7.29) 0.300 (7.62) 0.007 (0.2) 0.013 (0.3) 0.397 (10.1) 0.413 (10.5) Pin 1 identified by either an indent or a marked dot 0.394 (10.00) 0.419 (10.64) NOM 0.016 (0.4) 0.050 (1.3) 0.092 (2.34) 0.105 (2.67) 0.08 (2.0) 0.10 (2.5) 0.040 (1.0) NOTE: Pin spacing is a BASIC 0.060 (1.5) dimension; tolerances do not accumulate 13 0.004 (0.1) 0.012 (0.3) IL510/IL511/IL514/IL515/IL516 Ordering Information IL 5 16 - 3 E TR13 Bulk Packaging Blank = Tube TR7 = 7'' Tape and Reel TR13 = 13'' Tape and Reel Package Blank = 80/20 Tin/Lead Plating E = RoHS Compliant Package Type -1 = 8-pin MSOP -3 = 0.15'' 8-pin or 16-pin SOIC (not available for IL515) Blank = 0.30'' 16-pin SOIC Channels 10 = 1 Drive Channel 11 = 2 Drive Channels 14 = 2 Drive Channels; 1 Receive Channel 15 = 4 Drive Channels 16 = 2 Drive Channels; 2 Receive Channels Base Part Number 5 = 2 Mbps, DC-Correct Product Family IL = Isolators RoHS COMPLIANT 14 IL510/IL511/IL514/IL515/IL516 ISB-DS-001-IL500-I February 2012 Changes: * Update terms and conditions. ISB-DS-001-IL500-H Changes: * Added clarification of internal ground connections (p. 4). ISB-DS-001-IL500-G Changes: * Clarified SYNC function. ISB-DS-001-IL500-F Changes: * Changed pin spacing specification on MSOP drawing. ISB-DS-001-IL500-E Changes: * Added EMC details. ISB-DS-001-IL500-D Changes: * Add Output Enable to IL515. * IEC 61010-2001 Approval (removed "pending"). * Added 12-bit DAC illustrative application. ISB-DS-001-IL500-C Production release ISB-DS-001-IL500-B July 2008 Initial release ISB-DS-001-IL500-A June 2008 Preliminary release 15 IL510/IL511/IL514/IL515/IL516 Datasheet Limitations The information and data provided in datasheets shall define the specification of the product as agreed between NVE and its customer, unless NVE and customer have explicitly agreed otherwise in writing. All specifications are based on NVE test protocols. In no event however, shall an agreement be valid in which the NVE product is deemed to offer functions and qualities beyond those described in the datasheet. Limited Warranty and Liability Information in this document is believed to be accurate and reliable. However, NVE does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NVE be liable for any indirect, incidental, punitive, special or consequential damages (including, without limitation, lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Right to Make Changes NVE reserves the right to make changes to information published in this document including, without limitation, specifications and product descriptions at any time and without notice. This document supersedes and replaces all information supplied prior to its publication. Use in Life-Critical or Safety-Critical Applications Unless NVE and a customer explicitly agree otherwise in writing, NVE products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical devices or equipment. NVE accepts no liability for inclusion or use of NVE products in such applications and such inclusion or use is at the customer's own risk. Should the customer use NVE products for such application whether authorized by NVE or not, the customer shall indemnify and hold NVE harmless against all claims and damages. Applications Applications described in this datasheet are illustrative only. NVE makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NVE products, and NVE accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NVE product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customers. Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NVE does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customers. The customer is responsible for all necessary testing for the customer's applications and products using NVE products in order to avoid a default of the applications and the products or of the application or use by customer's third party customers. NVE accepts no liability in this respect. Limiting Values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the recommended operating conditions of the datasheet is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and Conditions of Sale In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NVE hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NVE products by customer. No Offer to Sell or License Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export Control This document as well as the items described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Automotive Qualified Products Unless the datasheet expressly states that a specific NVE product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NVE accepts no liability for inclusion or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NVE's warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NVE's specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NVE for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NVE's standard warranty and NVE's product specifications. 16 IL510/IL511/IL514/IL515/IL516 An ISO 9001 Certified Company NVE Corporation 11409 Valley View Road Eden Prairie, MN 55344-3617 USA Telephone: (952) 829-9217 Fax: (952) 829-9189 www.nve.com e-mail: iso-info@nve.com (c)NVE Corporation All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. ISB-DS-001-IL500-I February 2012 17