JN5168-001-M03Z - NXP Semiconductors

Data Sheet: JN5168-001-Myy

JenNet

-IP, ZigBee PRO and IEEE802.15.4 Module

JN-DS-JN5168-001-Myy © NXP Laboratories UK 2013

Features: Module

• 2.4GHz IEEE 802.15.4, JenNet -IP,

ZigBee Light Link, ZigBee Smart Energy

and RF4CE compatible

• JN5168-001-M00/03

up to 1km range (Ext antenna)

M00: integral antenna 16x30mm

M03: uFl connector 16x21mm

o TX power +2.5dBm

o Receiver sensiti vity –95dBm

o TX current 15.3mA

o RX current 17mA

o 2.0-3.6V operation

• JN5168-001-M05

up to 2km range (Ext 2dBi Antenna)

o 9.5 dBm TX Power

o Receiver sensiti vity -96dBm

o uFl connector

o TX current 35mA

o RX current 22mA

o 16x30mm

o 2.0-3.6V operation

• JN5168-001-M06

up to 6km range (Ext 2 dBi Antenna)

o 22dBm TX Power

o Receiver sensiti vity -100dBm

o uFl connector

o TX current 175mA

o RX current 22mA

o 16x30mm

o 2.0-3.6V operation

Features: Microcontroller

• 32-bit RISC CPU, up to 32MIPs with low

power

• Data EEPROM with guaranteed 100k

write operations

• RF4CE, JenNet-IP, ZigBee Smart

Energy stacks

• JTAG debug interface

• 4-input 10-bit ADC, 1 comparator

• 5 x PWM (4 x timer, 1 x timer/counter)

• 2 UARTs

• SPI Master & Slave port with 3 selects

• 2-wire serial interfac e

• Battery and Temperature Sensor

• Watchdog timer and BOR

• Up to 20 DIO

Industrial temp (-40°C to +85°C)

Lead-free and RoHS compliant

Overview

The JN5168-001-Myy family is a range of ultra low power, high performance surface mount

modules targeted at IEEE 802.15.4, JenNet-IP, ZigBee Light Link, ZigBee Smart Energy and

RF4CE networking applications, enabling users to realise products with minimum time to

market and at the lowest cost. They remove the need for expensive and lengthy development

of custom RF board designs and test suites. The modules use NXP’s JN5168 wireless

microcontroller to provide a comprehensive solution with large memory, high CPU and radio

performance and all RF components included. All that is required to develop and manufacture

wireless control or sensing products is to connect a power supply and peripherals such as

switches, actuators and sensors, considerably simplifying product development.

Four module variants are avail able: JN5168-001-M00 with an integrated antenna, JN5168-001-

M03 with an antenna connector and the JN5168-001-M05 and M06 with an antenna connector,

power amplifier and LNA for extended range. The JN5168-001-M05 output power has been

optimised for use in Europe and Asia.

Module Block Diagram

Benefits

• M icrominia ture mod ule so luti o ns

• Ready to use in products

• Minimises product development

time

• No RF test required for systems

• Compliant with

o FCC 47CFR Pa r t 15C

o IC Canada RSS 210 Issue 8 -

Annex 8,

o ETSI EN 300-328 V1.7.1

o EN 301-489-17 V2.1.1

o EN60950-1-2006 +A1, A11, A12

Applications

• Robust and secure low power wireless

applications

• ZigBee and JenNet-IP networks

• Home and commercial building

automation

• Utilities metering (e.g. AMR)

• Location Aware services (e.g. Asset

Tracking)

• Toys and gaming peripherals

• Industrial systems

• Telemetry

• Remote Control

4xPWM + Timers

2x UART

4 Chan 10-bit ADC

Battery and Temp

Sensor

2-Wire Serial

(Master/Slave)

SPI Master & Slave

RAM

8/32K

128-bit AES

Encryption

Accelerator

2.4GHz

Radio

Including

Diversity

Flash

64/160/256K

32 -Bit

RISC CPU

Power

Management

XTAL

O-QPSK

Modem

IEEE802.15.4

MAC

Accelerator

Power

Matching

uFl

Connector

Matching

Integrated Antenna

Matching

uFl

Connector PA / LNA

External

Antenna

M00 Option

M03 Option

M05/M06 Option

20 DIO

Sleep Counter

4kB

EEPROM

Watchdog

Timer

Voltage

Brownout

ii JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

Contents

1. Introduction 3

1.1. Variants 3

1.2. Regulatory Approvals 3

2. Specifications 4

2.1. JN5168 Single Chip Wireless Microcontroller 5

3. Pin Configurations 6

3.1. Pin Assignment 7

3.2. Pin Descriptions 8

3.2.1 Power Supplies 8

4. Electrical Characteristics 9

4.1. Maximum Rating s 9

4.2. Operating Conditions 9

Appendix A Additional Information 10

A.1 Outline Drawing 10

A.2 Module PCB Footprint 13

A.3 Optimal PCB placement of the JN5168-001-M00 Module 14

A.4 JN5168-001-M00 Antenna Radiation Pattern 15

A.5 Manufacturing 19

A.5.1 Reflow Profile 19

A.5.2 Soldering Paste and Cleaning 20

A.6 Tape and Reel Information 20

A.6.1 Tape Orientation and dimensions 20

A.6.2 Reel Dimensions 21

A.6.3 Cover tape details 22

A.6.4 Leader and Trailer 22

A.7 Related Documents 22

A.8 Ordering Information 23

A.9 Federal Communication Commission Interference Statement 24

A.9.1 Antennas approved by FCC for use with JN5168 modules 25

A.9.2 High Power Module usage limitation 25

A.9.3 FCC End Product Labelling 25

A.10 Industr y Canada Statement 26

A.10.1 Industry Canada End Product Labelling 26

A.11 European R & TTE Directive 1999/5/EC Statement 26

A.12 RoHS Complian c e 27

Status Information 27

Disclaimers 28

Trademarks 28

Version Control 28

Contact Details 29

1. Introduction

The JN5168-001-My y module family provides designers with a ready-made co mpo nent t hat prov ides a fully

integrated solution for applications, using the IEEE802.15.4 standard in the 2.4-2.5GHz ISM frequency band [1],

including JenNet -IP and ZigBee Smart Energy, and can be quickly and easily included in product designs. The

modules integrate all of the RF components required, removing the need to perform expensive RF design and test.

Products can be designed by simply connecting sensors and switches to the module IO pins. The modules use

NXP’s single chip IEEE802.15.4 Wireless Microcontroller, allowing designers to make use of the extensive chip

development support material. Hence, this range of modules allows designers to bring wireless applications to

market in the minimum time with significantly reduced development effort and cost.

Four varia nts are av aila ble: JN5168-001-M00, JN5168-001-M03, JN5168-001-M05 and JN5168-001-M06. All

modules have FCC and Industry Canada modular approva ls. All modules other than the JN5168-001-M06 are also

CE compliant and subject to a Notified Body Opinion.

The variants availa ble are des cribe d below.

1.1. Variants

1.2. Regula tor y Appr ovals

The JN5168-001-M00, M03 and M05 have been tested against the requirements of the following European

standards.

• Radio EN 300 328 v1.7.1.

• EMC, EN 301 489-17 v2.1.1

• Basic Safety Assessment (BSA) EN 60950-1:2006

A Notified Body statement of opi nion for this standard is available on request.

The High Power module with M06 suffix is not approved for use in Europe, in stea d the JN5168-001-M05 module may

be used with an antenna with up to 2.2dBi; 10mW/MHz power spectral density e.i.r.p is the maximum permitted in

Europe.

Additionally, all module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC part 15

regulatio ns and in accordance to FCC Public noti c e DA00-1407. Appendix 0 contains detail s on the conditions

applying to this modul ar approval. The modules are approved for use with a range of different antennas; further

details of which can be found in s ection Appendix A.9.1. The modular approvals notice and test reports are available

on request.

All modules are compliant with Industry Canada RSS210 (Issue 8, Annex 8) and have Industry Canada mod ular

approval.

The JN5168-001-M06 module is subject to user proximity restrictions under FCC and Industry Canada regulations;

more specific infor mat ion is av aila ble in A.9.2.

Variant Description FCCID Industry Canada ID

JN5168-001-M00 Standard Power, integrated antenna TYOJN5168M0 7438A-CYO5168M0

JN5168-001-M03 Standard Power, uFL connector TYOJN5168M3 7438A-CYO5168M3

JN5168-001-M05 Medium Power, uFL connector TYOJN5168M5 7438A-CYO5168M5

JN5168-001-M06 High Power, uFL connector TYOJN5168M6 7438A-CYO5168M6

4 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

2. Specifications

Most specification parameters for the modules are specified in the chip datasheet – JN-DS-JN5168 Wireless

Microcontroller Datasheet [2]. Where there are differences, the parameters are defined here.

VDD=3.0V @ +25°C

Typical DC Characteristics

Notes

JN5168-001-

M00/03

JN5168-001-

M06

JN5168-001-

M05

Deep sleep current

100nA

Sleep current

0.70uA

With active sleep timer

Radio transmit

current

15.3mA 175mA 35mA CPU in doze, radio transmitting

Radio receive

current

17mA 22mA 22mA CPU in doze, radio receiving

Centre frequency

accuracy

+/-25ppm +/-25ppm +/-25ppm

Additional +/-15ppm allowance for

temperature and ageing

Typical RF Characteristics

Notes

Receive sensit iv ity -95dBm -100dBm -96dBm

Nominal for 1% PER, as per 802.15.4

section 6.5.3.3 (Note 1)

Transmit pow er

2.5dBm

22dBm

9.5 dBm

Nominal

Maximum input

signal

10dBm 5dBm 10dBm For 1% PER, m easured as sensitivity

RSSI range

-95 to

-10dBm

-105 to

-20dBm

-102 to

-17dBm

RF Port impedance

– uFL connector

50 ohm 50 ohm 50 ohm 2.4 - 2.5GHz

Rx Spurious

Emissions

-61dBm -69dBm -69dBm Measured conducted into 50ohms

Tx Spurious

Emissions

-40dBm -49dBm -45dBm Measured conducted into 50ohms

VSWR (max)

2:1

2.4 - 2.5GHz

Peripherals

Notes

Master SPI port

3 selects

250kHz - 16MHz

Slave SPI port



250kHz - 4MHz

Two UARTs



16550 compatible

Two-wire serial I/F

(compatible with

SMbus & I

   Up to 400kHz

5 x PWM (4 x timer,

1 x timer/counter)

   16MHz clock

Two programmable

Sleep Timers

   32kHz clock

Digital IO lines

(multiplexed with

UARTs, timers and

20 18 18 DIO2 & DIO3 not available on JN5168-001-

M05 and JN5168-001-M06 modules

SPI selects)

Four channel

Analogue-to-Digital

converter

   10-bit, up to 100ks/s

Programmable

analogue

comparators

   Ultra low power mode for sleep

Internal

temperature sensor

and battery monitor

  

The performance of all peripherals is defined in the JN-DS-JN5168 Wireless Microcontroller Datasheet [2].

Note 1: Sensitivity is defined for conducted measurements on connectorised modules. Modules with an integrated

antenna have approximately 1.5 dB less e.i.r.p and reciprocal receive sensitivity.

NXP s uppl ies all the development tool s and networking stacks needed to enable end-product development to occur

quickly and efficiently. These are all freely available from the NXP Wirele ss Conn ect iv ity TechZo ne:

www.nxp.com/techzones/wireless-connectivity. A range of evaluation/developer kits is also available, allowing

products to be quickly bread boarded. Efficient devel opment of software applications is enabled by the provi sion of a

complete, unlimited, software developer kit. Together with the available libraries for the IEEE802.15.4 MAC and the

JenNet-IP and ZigBee PRO network stacks, thi s package provides everything required to develop application code

and to trial it with hardware representative of the final module.

The modules can be user programmed both in development and in production using software supplied by NXP.

Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This

information is available on the NXP support website, together with many example applications, user guides, reference

manuals and application notes.

2.1. JN5168 Single Chip Wireless Microcontroller

The JN5168-001-Myy series is constructed around the JN5168-001 single chip wireless microcontroller, which

includes the radio system, a 32-bit RISC CPU, Flash, RAM & EEPROM memory and a range of analogue and digital

peripherals.

The chip is described ful ly in JN-DS-JN5168 Wireless Microcontroller Datasheet [2].

6 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

3. Pin Conf i gurations

ADC1

DO0

DO1

DIO18

DIO19

DIO0

DIO1

DIO2

DIO3

DIO4

DIO5

DIO6

DIO7

DIO8

DIO9

DIO10

VDD

GND

VREF/ADC2

DIO17

DIO16

DIO15

DIO14

DIO13

RESETN

DIO12

DIO11

11 12 13 14 15 16 17 18

Figure 1: Pin Configuration (top view)

Note that the s ame basic pin configuration applies for all module designs. However, DIO3 (pin 9) and DIO2 (pin 8)

are not available on the JN5168-001-M05 and JN5168-001-M06.

3.1. Pin As s ignment

Pin Functions

Signal

Type Description

Primary

Alternate Functions

ADC1

3.3V

Analogue to Digital Input

2 DO0 SPICLK PWM2 CMOS SPI Master Cl ock Output or

PWM2 Output

3 DO1 SPIMISO PWM3 CMOS SPI Master I n Slave Out Input or

PWM3 Output

4 DIO18 SPIMOSI CMOS SPI Master Out Slave In Output

DIO19

SPISEL0

CMSO

SPI Master Select Output 0

6 DIO0 SPISEL1 ADC3 CMOS DIO0, SPI Master Select Output 1

or ADC input 3

7 DIO1 SPISEL2 ADC4 PC0 CMOS DIO1, SPI Master Select Output

2, ADC input 4 or Pulse Counter

0 Input

8 DIO2* RFRX TIM0CK_GT CMOS DIO2, Radio Receive Control

Output or Timer0 Clock/Gate

Input

DIO3*

RFTX

TIM0CAP

CMOS

DIO3, Radio Transmit Control

Output or Timer0 Capture Input

10 DIO4 CTS0 JTAG_TCK TIM0OUT PC0 CMOS DIO4, UART 0 Clear To Send

Input, JTAG CLK Input, Timer0

PWM Output, or Pulse Counter 0

input

DIO5

RTS0

JTAG_TMS

PWM1

PC1

CMOS

DIO5, UART 0 Request To Send

Output, JTAG Mode Select Input,

PWM1 Output or Pulse Counter 1

Input

12 DIO6 TXD0 JTAG_TDO PWM2 CMOS DIO6, UART 0 Transmit Data

Output, JTAG Data Output or

PWM2 Output

13 DIO7 RXD0 JTAG_TDI PWM3 CMOS DIO7, UART 0 Receive Data

Input, JTAG Data Input or PWM 3

Output

14 DIO8 TIM0CK_GT PC1 PWM4 CMOS DIO8, Timer0 Clock/Gate Input,

Pulse Counter1 Input or PWM 4

Output

15 DIO9 TIM0CAP 32KXTALIN RXD1 32KIN CMOS DIO9, Tim er0 Capture Input, 32K

External Crystal I nput, UART 1

Receive Data Input or 32K

external clock Input

DIO10

TIM0OUT

32KXTALOUT

CMOS

DIO10, Timer0 PWM Output or

32K External Crystal Out put

VDD

3.3V

Supply Voltage

GND

Digital Ground

19 DIO11 PWM1 TXD1

CMOS DIO11, PWM1 Output or UART 1

Transmit Data Output

DIO12 PWM2 CTS0 JTAG_TCK ADO or

SPISMOSI

CMOS

DIO12, PWM2 Output, UART 0

Clear To Send Input, JTAG CLK

Input, Antenna Diversity Odd

Output or SPI Slave Master Out

Slave In Input

21 DIO13 PWM3 RTS0 JTAG_TMS ADE or

SPISMISO

CMOS DIO13, PWM3 Output, UART 0

Request To Send Output, JTAG

Mode Select Input, Antenna

Diversity Even output or SPI

Slave Master In Slave Out Output

RESETN

CMOS

Reset input

DIO14

SIF_CLK

TXD0 TXD1

JTAG_TDO

SPISEL1 or

CMOS

DIO14, Serial Interface Clock,

8 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

SPISSEL

UART 0 Transmit Data Output,

UART 1 Transmit Data Output,

JTAG Data Output, SPI Master

Select Output 1 or SPI Slave

Select Input

24 DIO15 SIF_D RXD0 RXD1 JTAG_TDI SPISEL2 CMOS DIO15, Serial Interface Data or

Intelligent Peripheral Data Out

DIO16 COMP1P SIF_CLK SPISMOSI

CMOS

DIO16, Comparator Positive

Input, Serial Interf ace clock or

SPI Slave Master Out Slave In

Input

DIO17

COMP1M

PWM4

I2C DATA

SPISIMO

CMOS

DIO17, Comparator Negative

Input, Serial Interf ace Data or SPI

Slave Master In Slave Out Output

VREF/ADC2

3.3V

Analogue peripheral ref erence

voltage or ADC input 2

* These two pins are not connected for JN5168-001-M05 & JN5168-001-M06 modules.

3.2. Pin Descript ions

All pins behave as descri bed i n the JN-DS-JN5168 Wireless Microcontroller Datasheet [2], with the exception of the

following:

3.2.1 Power Supplies

A single power supply pin, VDD is provided.

4. Electrical Char acter i st i cs

In most cases, the Electrical Characteristics are the same for both module and chip. They are described in detail in

the chip datas heet. Where there are differences, they are detailed below.

4.1. Maximum Rati ngs

Exceeding thes e conditions wi ll result in damage to the device.

Parameter Min Max

Device supply voltage VDD

-0.3V

3.6V

All Pins

-0.3V

VDD + 0.3V

Storage temperature

-40ºC

150ºC

4.2. Operating Conditions

Supply Min Max

VDD 2.0V 3.6V

Ambient temperature range -40ºC 85ºC

10 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

Appendix A Additiona l Informat ion

A.1 Outline Drawing

30.0mm

16mm

3.30

2.54

1.27

Thickness: 3.5mm

Figure 2: JN5168-001-M00 Outline Drawing

21mm

16mm

3.30

2.54

2.59

9.72mm

1.27

Thickness: 3.5mm

Figure 3: JN5168-001-M03 Outline Drawing

12 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

30mm

16mm

.3.30

2.54

1.27

2.54

2.81mm

8.0mm

Thickness: 3.5mm

Figure 4: JN5168-001-M05 and JN5168-001-M06 Outline Drawing

A.2 Module PCB Footprint

All dimensions are in mm.

3.30

2.54

1.27

16.00

1.5

Ø1

Note: All modules have the same footprint

Figure 5: Module PCB footprint

14 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

A.3 Optimal PCB placement of the JN5168-001-M00 Module

The JN5168-001-M00 module features an optimised, low cost, integrated, inverted F, printed PCB antenna. The

antenna has a vertically polarised near omnidirectional radi ation pattern and up to 1.6 dBi of peak gain. The PCB

design has been elongated in order to increase the ground plane area whic h increases the antenna efficiency. This

allows stand alone operation without any additional ground plane however care must be taken when mounting this

module onto another PCB. The area around the antenna must be kept clear of conductors or other metal objec ts for

an absolute minimum of 20 mm. This is true for all layers of the PCB and not just the top layer. Any conductive

objects close to the antenna could severely disrupt the antenna pattern resulting in deep nulls and high directivity in

some directions.

The diagrams below show various possib le scenarios. The top 3 scenarios are correct; grou ndpla ne may be placed

beneath JN516 8-001-M00 module as long as it does not protrude beyond the edge of the top layer ground plane on

the module PCB.

The bottom 3 scenarios are incorrect; the left hand side example because there is groundplane underneath the

antenna, the middle example because there is insufficient clearance around the antenna (it is best to have no

conductors anywhere near the antenna), finally the right hand exampl e has a battery’s metal casing in the

recommended keep out area.

Figure 6: PCB placement of t he JN5168-001-M00 Module

A.4 JN5168-001-M 00 Antenna Radiation Pattern

Figure 7, Figure 8 & Figure 9 are simulated 3D radiation plots of the JN5168-001-M00. They are provided here to

help the user orientate the module in end equipment in an optimal way. These visualisations are an accurate

representation of the antenna r adiat ion patt er n in the 3D space.

The 2D XZ plots for each channel are shown in

dBuV

104

JN 5168-001-M 00 R adiation Plots @ 3 meters (XZ O rientation)

CH11 CH18 CH26

Mkr Trace X-Ax is Value

CH11 40.0 deg 101.04 dBuV

CH18 40.0 deg 100.67 dBuV

CH26 40.0 deg 101.26 dBuV

Figure 10. These are actual measurements in an anechoic chamber with the JN5168-001-M00 mounted on a

DR1174 carrier board from the J N516x-EK001 Evaluation kit. The device under test and the antenna height was 1m

and the values are in dBuV/m at a distance of 3m.

Figure 11 is a plot of the peak field strengths for a JN5168-001-M00, JN5148-001-M00 and JN5168-001-M03. The

M03 is used with a λ/2 vertical antenna. Figure 11 shows that the new integrated antenna is 1.5-3dB better than the

JN5148-001-M00 and is within 1.5 dB of a JN5168-001-M03 λ/2 vertical.

16 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

Figure 7: 3D radiation plot JN5168-001-M00 XY Orientation (simulation)

Figure 8: 3D radiation plot JN5168-001-M00 XZ Orientation (simulation)

Figure 9: 3D radiation plot JN5168-001-M00 YZ Orientation (simulation)

18 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

dBuV

104

JN 5168-001-M 00 R adiation Plots @ 3 meters (XZ Orientation)

CH11 CH18 CH26

Mkr Trace X-Ax is Value

1 CH11 40.0 deg 101.04 dBuV

2 CH18 40.0 deg 100.67 dBuV

3 CH26 40.0 deg 101.26 dBuV

Figure 10: Actual radiation plot of JN5168-001-M00 Mounted on a carrier PCB – XZ orientation

Figure 11: Peak Field Strengths for various modules optimised for height and azimuth

A.5 Manufacturing

A.5.1 Reflow Profile

For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste

manufacturer’s guidelines on peak flow temperature, soak times, time above liquid and ramp rates.

Figure 12: Recommended solder reflow profile

98.0

98.5

99.0

99.5

100.0

100.5

101.0

101.5

102.0

102.5

103.0

103.5

104.0

11 18 26

dBuV/m @ 3m

Channel

Module Peak Field Strengths

JN5168-001-M03 with

vertical

JN5168-001-M00

JN5148-001-M00

Temperature 25~160 ºC 160~190 ºC > 220º C 230~Pk. Pk. Temp

(235ºC)

Target Time (s) 90~130 30~60 20~50 10~15 150~270

20 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

A.5.2 Soldering Paste and Cleaning

NXP does not recommend use of a solder paste that requires the module and PCB assembly to be cleaned (rinsed in

water) for the following reasons:

Solder flux residues and water can be trapped by the PCB, can or c omponents and result in short circuits.

The module label could be damaged or removed.

NXP recom m ends use of a 'no clean' solder paste for all its module products.

A.6 Tape and Reel Information

A.6.1 Tape Orientation and dimensions

All dimensions are in mm.

Module type A B W F E P0 P1 P2 T Cover Tape

width (W)

JN5168-001-M00 16.6 30.6 44 20.2 1.75 4.0 24.0 2.0 3.7 44.0

JN5168-001-M03 16.6 21.6 44 20.2 1.75 4.0 24.0 2.0 3.7 44.0

JN5168-001-M05 16.6 30.6 44 20.2 1.75 4.0 24.0 2.0 3.7 44.0

JN5168-001-M06 16.6 30.6 44 20.2 1.75 4.0 24.0 2.0 3.7 44.0

Tolerance ±0.1 ±0.1 ±0.3 ±0.15 +0.1 ±0.1 ±0.1 ±0.15 ±0.1 ±0.3

A.6.2 Reel Dimensions

All dimensions are in mm.

Module

W2 (Max)

JN5168-001-MYY

330 ±2.0

2.0±0.5

181.3±0.2

45.0 +1.4/-0.6

50.4

22 JN-DS-JN5168-001-Myy 1v4 © NXP Laboratories UK 2013

A.6.3 Cover tape details

Thickness (T) 0.06 ± 0.005mm

Width (W) 37.5 ± 0.1mm

Surface resistivity (component s ide) 105 to 1011 Ohms/sq

Surface resistivity (component s ide) Non-conductive

Backing type: Polyester

Adhesive type: PSA

Sealing: Room ambient

A.6.4 Leader and Trailer

A.7 Related Documents

[1] IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control

(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)

[2] JN-DS-JN5168 Wireless Microcontroller Datasheet

Vacant

Quantity/400PCS

>500 MM

>500mm

A.8 Ordering Information

Ordering Code Format:

Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or

Prototypes.

Part Number Description

JN5168-001-M00

Shipped in tape mounted 400 piece ree l

JN5168-001-M03

JN5168-001-M05

JN5168-001-M06

Line

Content

Format

Options

Sample

NXP Logo

B& W outline logo

JN5168-001-M00

NNNNN

FCC ID:TYOJN5168M0

IC:7438A-CYO5168M0

ZSDYWW

Coding

2D Matrix

Symbology, squ are

data matrix ECC-200

with 0.5mm cell size

Part ID

JN5168-001-M0x

x is module type, 0,

3, 5 or 6

Serial No.

NNNNN

Serial number from

test

SSMC

APK

RoHs

Compliant

Year

Week

FCC ID

FCCID:TYOJN5168Mx

x is module type

0,3,5 or 6

IC ID

IC:7438A-

CYO5168Mx

x is module type

0,3,5 or 6

Note :- The 2-D barc ode in lin e 1 is used only for product ion purposes.

JN5168-001-MYY

Module Type (YY)

00 Standard Power, Integral antenna

03 Standard Power, uFl connector

05 Medium Power, uFL connector

06 High Power, uFl connector

Figure 13: Example module labelling

A.9 Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15

of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates , uses, and can radiate radio frequency energy and, if not installed

and used in accordance with the i nstructions, may cause harmful interference to radio communications. However,

there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful

interference to radio or television reception, which can be determined by turning the equipment off and on, the user is

encouraged to try to c orrect the interference by one of the following m easures:

- Reorient or relocate the receiving antenna.

- Increase the s eparation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interferenc e, and (2) this device must accept any interference recei ved, including

interference that may cause undes ir ed oper atio n.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

WARNING!

FCC Radiation Exposure Statement:

This portable equipment with its antenna complies with FCC’s RF radiation exposure limits set forth for an

uncontrolled environment. To maintain compliance follow the instructions below;

1. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

2. Avoid direct contact to the antenna, or keep it to a minimum while using this equipment.

This transmitter module is authorized to be used in other devices only by OEM integrators under the

following condition:

The transmitter modul e must not be co-located with any other antenna or transmitter.

As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is

still responsible for testing their end product for any additional compliance requirements required with this module

installed (for example, digital device emissions, PC peripheral requirements, etc.).

This applies to the JN5168-001-M00, JN5168-001-M03 and JN5168-001-M05 devices, the JN5168-001-M06 is a

mobile device (see section A.9.2)

A.9.1 Antennas approved by FCC for use with JN5168 modules

Brand Model Number Description Gain (dBi)

Connector type

Antenna Factor

ANT-2.4-CW-RCT-RP

Vertical - knuckle antenna

2.2

RP-SMA

Antennova

2010B6090-01

Vertical - knuckle antenna

2.2

RP-SMA

3 Hyperlink Technology HG2402RD-RSF Vertical - knuckle antenna 2.2 RP-SMA

4 Aveslink Technology, Inc E-0005-AC Vertical- flying lead 2 RP-SMA

Aveslink Technology, Inc

E-2411-GC

Vertical - swivel

RP-SMA

Aveslink Technology, Inc

E-2410-CA

Vertical - bulkhead- flying lead

uFL

Aveslink Technology, Inc

E-2410-GC

Vertical - swivel

RP-SMA

Aveslink Technology, Inc

E-2820-CA

Vertical - bulkhead- flying lead

uFL

9 Aveslink Technology, Inc E-2820-GC Vertical - swivel 2 RP-SMA

Embedded Antenna Design

FBKR35068-RS-KR Vertical - knuckle antenna 2 RP-SMA

Nearson S131CL-L-PX-2450S Vertical - knuckle-flying lead 2 uFL

Laird Technologies

WRR2400-IP04

Vertical - knuckle-flying lead

1.5

uFL

Laird Technologies

WRR2400-RPSMA

Vertical - knuckle-flying lead

1.3

RP-SMA

Aveslink Technology, Inc

E-6170-DA

Vertical - right angle

uFL

Laird Technologies

WCR2400-SMRP

Vertical - knuckle antenna

RP-SMA

This device has been designed to operate with the antennas listed above, and having a maxi m um gain of 2.2 dBi.

Alternative vertical antennas may be used provided that the gain does not exceed 2.2 dBi. Antennas having a gain

greater than 2.2 dBi are strictly prohibited for use with this device.

The required antenna impedance is 50 ohms.

A.9.2 High Power Module usage limitation

The high power module variants are classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used

at a distance of < 20 cm (8”) from any people. This applies to the JN5168-001-M06 module type (TYOJN5168M6).

IMPORTANT NOTE: In the event that these conditions cannot be met (for certa in conf igur ations or co-location with

another transmitter), then the FCC authorization is no longer c onsidered valid and the FCC ID can not be used on the

final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product

(including the transmitter) and obtaining a separate FCC authorization.

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this

RF module in the user manual of the end produc t.

The user manual for the end product must i nclude the following information in a prominent location;

“To comply with FCC’s RF radiation expos ure requirements, the antenna(s) used for this transmitter must not be co-

located or operating in conjunction with any other antenna or transmitter.”

A.9.3 FCC End Product Labelling

The final ‘end product’ should be l abelled in a visible area with the following:

“Contains TX FCC ID: TYOJN5168M0, TYOJN5168M3, TYOJN5168M5 or TYOJN5168M6” to reflect the version of

the module being used inside the product.

A.10 Industry Canada Statement

This device complies with Industry Canada licence-

exempt RSS standard(s). Operation is subject

to the following two conditions: (1) this device may

not cause interference, and (2) this device must

accept any interference, including interference that

may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie

Canada applic abl es aux appareils radio

exempts de licence. L'exploitation est autorisée aux

deux conditions suivantes : (1) l'appareil ne

doit pas produire de broui lla ge , et (2) l'utilis ateur de

l'appareil doit accepter tout brouillage

radioélectrique subi, même si le brouillage est

susceptible d'en compromettre le fonctionnement.

To reduce potential radio interference to other users, the antenna type and its gain should be so chose n that th e

equivalent isot r opi c ra diat ed power (e.i.r.p.) is not more than that per m itted for succe ssf ul c omm uni cat ion.

These modules have been designed to operate with antennas having a maximum gai n of 2.2 dBi. Antennas having a

gain greater than 2.2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.

As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is

still responsible for testing their end-product for any additional compliance requirements required with this module

installed (for example, digital device emissions, PC peripheral requirements, etc).

A.10.1 Industry Canada End Product Labelling

For Industry Canada purposes the following should be used.

“Contains Industry Canada ID IC: 7438A-CYO5168M0, IC: 7438A-CYO5168M3, IC: 7438A-CYO5168M5 or IC:

7438A-CYO5168M6” to reflect the version of the module being us ed inside the produc t.

A.11 European R & TTE Directive 1999/5/EC Statement

All modules listed in this datasheet with the exception of the JN5168-001-M06 are compliant with ETSI EN 300 328

V1.7.1 (2006-10), EMC, EN 301 489-17 v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN 60950-1:2006

(2006-06) and are subject to a Notified Body Opinion.

The modules are approved for use with the antennas listed in the following table. The JN5168-001-M06 module is not

approved for use in Europe, instead use the JN5168-001-M05 which produces the maximum permitted power.

Alternativ e vertical antenna s may be used provided that the gain does not exceed 2.2 dBi.

Brand Model Number Description Gain (dBi)

Connector type

Antenna Factor

ANT-2.4-CW-RCT-SMA

Vertical - knuckle antenna

2.2

SMA

Antennova

B6090

Vertical - knuckle antenna

2.2

RP-SMA

Hyperlink Technology

HG2402RD-RSF

Vertical - knuckle antenna

2.2

RP-SMA

Aveslink Technology, Inc

E-0005-AC

Vertical- flying lead

RP-SMA

5 Aveslink Technology, Inc E-2411-GC Vertical - swivel 2 RP-SMA

6 Aveslink Technology, Inc E-2410-CA Vertical - bulkhead- flying lead 2 uFL

Aveslink Technology, Inc

E-2410-GC

Vertical - swivel

RP-SMA

Aveslink Technology, Inc

E-2820-CA

Vertical - bulkhead- flying lead

uFL

Aveslink Technology, Inc

E-2820-GC

Vertical - swivel

RP-SMA

Embedded Antenna Design

FBKR35068-RS-KR

Vertical - knuckle antenna

RP-SMA

Nearson S131CL-L-PX-2450S Vertical - knuckle-flying lead 2 uFL

Laird Technologies WRR2400-IP04 Vertical - knuckle-flying lead 1.5 uFL

Laird Technologies WRR2400-RPSMA Vertical - knuckle-flying lead 1.3 RP-SMA

Aveslink Technology, Inc

E-6170-DA

Vertical - right angle

uFL

Laird Technologies

WCR2400-SMRP

Vertical - knuckle antenna

RP-SMA

A.12 RoHS Compliance

JN5168-001-Myy modules meet the requirements of Directive 2002/95/EC of the European Parliament and of the

Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006

which came into force on 1st M ar ch 2007 .

Status Information

The status of this Data Sheet is Production.

NXP products progress according to the following format:

Advanced

The Data Sheet shows the specification of a product in planning or in development.

The functionality and electrical performance specifications are target values and may be used as a guide to the final

specification.

NXP reserves the right to make changes to the product specification at anytim e without notice.

Preliminary

The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified.

The functionality of the product is final. The electrical performance specifications are target values and may be used

as a guide to the final specification. NXP reserves the right to make changes to the product specific atio n at anytim e

without notice.

Production

This is the production Data Sheet for the product.

All functional and electrical performance specifications, where included, including min and max values are derived

from detailed product characterization.

This Data Sheet supersedes all previous document versions.

NXP reserves the right to make changes to the product specification at anytim e.

Disclaimers

Limited w arranty an d liabilit y — Inform ation in this doc ument is believe d to be accur ate and reli able. How ever, N XP Semic onduct ors does not gi ve

any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the

consequences of use of suc h informa tion. NXP Semicondu ctors tak es no respon sibility for the cont ent in this document if provid ed by an information

source outside of NXP Semiconductors.

In no ev ent shall NXP Sem iconduc tors be li able fo r any in direct, i ncident al, puni tive, speci al or co nsequ ential d amages (includin g - without limitation -

lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such

damages are based o n tort (includi ng n egligence), warranty, breach of contract or any other legal theory.

Notwit hstanding a ny dam ages that c ustom er might i ncur for an y reason whatsoev er, NXP Sem iconduc tors’ ag gregat e and cumul ative li abilit y towards

customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without

limit ation specification s a nd pr od uc t de sc riptions, at a n y tim e an d wit ho ut noti ce. T his doc um en t s upe rs e de s a nd re places al l information supplied pri or

to the public ati on he re of .

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to

result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion

and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no

repres ent ati on or w ar ra nt y that such ap pl icat i ons w il l be sui tabl e for the specified use with out fur th er testing or modi fication.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP

Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine

whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned

application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks

associated with their applications and products.

NXP Sem iconduc tors doe s not acc ept any lia bility rel ated to a ny defaul t, dam age, cost s or problem which i s based on any we akness or d efault in t he

customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all nec essary

testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the

products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Limit in g v al ues — Stress above one or more limiting values (as defined in the Absolute Ma xi m um Rati ngs System of IEC 60 13 4) will cause

permanent damage to the device. Li m iti ng valu es are str ess rati ngs onl y and (prop er ) ope ration of the dev ice at thes e or an y other conditions abov e

those given in the Operating Condi ti on s secti on or the Electrical Characteristics sections of this document is not warranted. Constant or repeated

exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

AEC unqualified products — This produ ct has not been qualified t o the appropriate Automotive Electronics Cou ncil (AEC) standard Q100 or Q101

and should not be used in automotive applications, including but not limited to applications where failure or malfunction of an NXP Semiconductors

produc t can reason ably be e xpected t o result in p ersonal inj ury, deat h or seve re propert y or environm ental d amage. N XP Semicondu ctors acc epts no

liabilit y for in clusion and/or use o f NXP S emiconduc tors products i n such equipm ent or applic ations an d theref ore s uch inc lusion and/or use is for the

customer’s o wn ri s k.

Product specification — The i nformation a nd data prov ided in a Pr oduct data s heet shall defi ne the speci fication of the product as agreed between

NXP Sem iconductors a nd its customer, unl ess NXP Sem iconductors and customer have explicitl y agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the

Product data sheet

All products are sold subject to NXP Semiconductors’ terms and conditions of sale, supplied at the time of order acknowledgment and published at

http://www.nxp.com/profile/terms.

Trademarks

All trademarks are the property of their respective owners.

“JenNet” and “JenNet-IP” are trademarks of NXP B.V..

Version Control

Version Notes

1.0

Initial release

1.1

Additional clarification of RF expos ure conditions added to FCC Section A8 and minor corrections made

1.2 Revision of key param eters. Module footprint dimension updated

1.3 Tape and reel information added

1.4

Updated pin config uration and assignments. M odule lab elling and reel di mensions updated.

Contact Details

NXP Labora t ories UK Ltd

Furnival Street

Sheffield

S1 4QT

United Kingdom

Tel: +44 (0)114 281 2655

Fax: +44 (0) 114 281 2951

For the contact details of your local NXP office or distributor, refer to the NXP web site:

www.nxp.com

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

NXP:

JN5168-001-M00Z JN5168-001-M03Z JN5168-001-M05Z JN5168-001-M06Z