202
CM1000HA-24H
Single IGBTMOD™ H-Series Module
1000 Amperes / 1200 Volts
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Ratings Symbol CM1000HA-24H Units
Junction Temperature Tj–40 to +150 °C
Storage Temperature Tstg –40 to +125 °C
Collector-Emitter Voltage (G-E SHORT) VCES 1200 Volts
Gate-Emitter V oltage VGES ±20 Volts
Collector Current IC1000 Amperes
Peak Collector Current ICM 2000* Amperes
Diode Forward Current IF1000 Amperes
Diode Forward Surge Current IFM 2000* Amperes
Power Dissipation Pd5800 Watts
Max. Mounting Torque M8 Terminal Screws – 95 in-lb
Max. Mounting Torque M6 Mounting Screws – 26 in-lb
Module Weight (Typical) – 1600 Grams
V Isolation VRMS 2500 Volts
* Pulse width and repetition rate should be such that device junction temperature does not exceed the device rating.
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current ICES VCE = VCES, VGE = 0V – – 6 mA
Gate Leakage Current IGES VGE = VGES, VCE = 0V – – 0.5
µ
A
Gate-Emitter Threshold Voltage VGE(th) IC = 100mA, VCE = 10V 4.5 6.0 7.5 Volts
Collector-Emitter Saturation Voltage VCE(sat) IC = 1000A, VGE = 15V – 2.7 3.6** Volts
IC = 1000A, VGE = 15V, Tj = 150°C – 2.4 – Volts
Total Gate Charge QGVCC = 600V, IC = 1000A, VGS = 15V – 5000 – nC
Diode Forward Voltage VFM IE = 1000A, VGS = 0V – – 3.5 Volts
** Pulse width and repetition rate should be such that device junction temperature rise is negligible.
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance Cies – – 200 nF
Output Capacitance Coes VGE = 0V, VCE = 10V, f = 1MHz – – 70 nF
Re verse Transfer Capacitance Cres – – 40 nF
Resistive Turn-on Delay Time td(on) – – 600 ns
Load Rise Time trVCC = 600V, IC = 1000A, – – 1500 ns
Switching Turn-off Delay Time td(off) VGE1 = V GE2 = 15V, RG = 3.3Ω– – 1200 ns
Time F all Time tf– – 350 ns
Diode Reverse Recovery Time trr IE = 1000A, diE/dt = –2000A/
µ
s – – 250 ns
Diode Reverse Recovery Charge Qrr IE = 1000A, diE/dt = –2000A/
µ
s – 7.4 –
µ
C
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case Rth(j-c) Per IGBT – – 0.022 °C/W
Thermal Resistance, Junction to Case Rth(j-c) Per FWDi – – 0.050 °C/W
Contact Thermal Resistance Rth(c-f) Per Module, Thermal Grease Applied – – 0.018 °C/W