ATSAMR21B18-MZ210PA
ATSAMR21 Smart Connect Module
PRELIMINARY DATASHEET
Description
The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It
integrates an ATSAMR21E18 IC together with a serial data FLASH. The design
allows a variety of mounting positions with SMT as well as TH mounting. The
extended temperature range with operation up to 125°C is a distinguishing feature.
Features
• ATSAMR21 Single-chip ARM® Cortex®-M0+ based 32 -bit Microcontroller with
Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with
256KB Flash and 16 I/O’s
– Max. operating freq. 48 MHz
– 128-bit AES crypto engine
– 32-bit MAC symbol counter
– Temperature sensor
– Automatic transmission modes
• MX25L2006EZUK-12G 2-Mbit DataFlash
• Lowest cost RF front end design with PCB antenna
• FCC / ETSI compliant harmonic filter
• Single 2.7V - 3.6V supply
• Extended industrial temperature range -40°C to 125°C
• Easy access 2mm pin header with several alternative functions
– 5 GPIO
– 1 analog input (12-bit, 350ksps Analog-to-Digital Converter)
– 4 PWM outputs
– TWI (I2C up to 3.4MHz)
– SPI
– UART
• High precision 16MHz crystal oscillator
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Table of Contents
Description 1
Features 1
Table of Contents ............................................................................................................... 2
1 Integrated Devices and Block Diagram ...................................................................... 3
1.1 Module Block Diagram .......................................................................................................................... 3
1.2 Integra ted sy ste m periph eral s ............................................................................................................... 3
1.2.1 Serial Flash interconnect .......................................................................................................... 3
1.2.2 Available UART interfaces ........................................................................................................ 3
1.3 RF front end .......................................................................................................................................... 4
2 Mechanical Description ............................................................................................... 5
2.1 Mechanical Dimensions ........................................................................................................................ 5
2.2 Footprint Recommendation ................................................................................................................... 5
2.2.1 Pin header mounting ................................................................................................................ 5
Surface solder mounting ....................................................................................................................... 7
3 Module pin assignment ............................................................................................... 8
3.1 Applicati on pin s ..................................................................................................................................... 8
3.2 Test points ............................................................................................................................................. 9
3.2.1 Top layer test points ................................................................................................................. 9
3.2.2 Bottom layer test points ............................................................................................................ 9
4 Electrical Characteristics .......................................................................................... 11
4.1 Absolute Maximum Ratings ................................................................................................................. 11
4.2 Recommended Operating Conditions ................................................................................................. 11
4.3 Power Consumption ............................................................................................................................ 11
4.4 M odule perfor man ce data ................................................................................................................... 12
5 NV Memory Information ............................................................................................ 13
6 Boot loader ................................................................................................................ 13
7 Radio Certification ..................................................................................................... 14
7.1 United States (FCC) ............................................................................................................................ 14
7.2 Europe (ETSI) ..................................................................................................................................... 14
7.3 Industry Canada (IC) Compliance statements ..................................................................................... 15
8 Ordering Information ................................................................................................. 16
9 References ................................................................................................................. 17
10 Revision History ........................................................................................................ 17
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1 Integrated Devices and Block Diagram
1.1 Module Block Diagram
The module has been optimized for minimum costs in lighting applications as a primary design goal. Therefore
the list of peripheral devices is rather short with only a serial FLASH memory. Figure 1-1 shows the block
diagram for the module.
The harmonic filter is purely capacitive and the antenna is integrated on the PCB. Beside some test points, the
module interface is providing five GPIO lines only. See section 3 for detailed information.
ATSAMR21B18-MZ210PA
ATSAMR21E18
ARM® Cortex®-M0+
MX25L2006EZUK
-12G
2-Mbit DataFlash
SPI Differential
Harmonic Filter
5 GPIO
Differential
Antenna
Figure 1-1. Module Block Diagram
1.2 Integrated system peripherals
A serial FLASH memory has been integrated to support over-the-air software upgrade functions. The memory
interface is using a SERCOM based SPI.
1.2.1 Serial Flash interconnect
DataFLASH
Signal
uC
Function uC pin Port & SERCOM Configuration
SO
MISO
22 / PA24
SI
MOSI
23 / PA25
SCK
SCK
27 / PA28
#CS
GPIO
25 / PA27
Table 1-1. Microcontroller / data FLASH connection
The signals in this table are not available as module IO. More information about the FLASH IC can be found in its
related datasheet in section 7. (Macronix)
1.2.2 Available UART interfaces
There are two UART interfaces available for external use. SERCOM2 is available at test points for debug use
while SERCOM1 is available at connector X1 for application use.
The test points for SERCOM2 are duplicated on the PCB top layer and on the bottom layer. See Table 1-2 for
detailed inf ormation.
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Table 1-2. Access to UART IO’s
1.3 RF front end
The module implements a lowest cost RF front end with a differential PCB antenna and a purely capacitive
harmonic filter as far as assembled parts are considered. This approach is saving the costs for inductive or
MLCC parts. The RF front end components are designated in Figure 1-2.
Figure 1-2. RF front end sections
The integrated antenna is the cause of a number of design constraints for the base board. Please regard the
drawings and suggestions in section 2.2 when designing the base board. The same section does also contain
more information about the ground design.
Module pin
uC
Function uC pin Port & SERCOM Configuration
TP7 & TP5
UART RX
16 / PA15
TP4 & TP6
UART TX
15 / PA14
X1.6 UART RX 2 0 / PA19 SERCOM1; MUX=C; PAD[3] RXPO=0x3
X1.5
UART TX
19 / PA18
SERCOM1; MUX=C; PAD[2] TXPO=0x1
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2 Mecha nical Descripti on
If not otherwise noted a tolerance of 0.1mm shall be considered for all dimensions.
2.1 Mechanical Dimensions
The module pins are arranged with a 2mm pitch distance. Figure 2-1 shows the actual dim ens ions and pi n
locations within the module design.
Figure 2-1. Module Bottom dimensions, seen from a CAD top perspective
The module can be solder mounted directly to a base board. Provision is made for direct SMT mounting and for
true hole mounting on a pin header with 2mm pitch. The module is delivered with true-hole pads. The pin header
is supposed to be part of the base board.
2.2 Footprint Recommendation
Since the antenna is integrated, a number of design constraints have to be considered for the base board design.
2.2.1 Pin header mounting
The module can be mounted on pin headers with 2mm pitch like the SAMTEC TMM series. This mounting
scheme requires a 7-pi n singl e row hea der a nd two si ngle pi ns ne xt to th e anten na. The pins are supposed to be
assembled on the base board in the normal top assembly process.
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It is required to mount the module at the outline of the base board and to orient the antenna towards the board
edge. See Figure 2-2 for the placement range in relation to the base board edge. The area underneath the
antenna shall not be filled with copper.
The area underneath the module plus a margin of additional six millimeters shall be filled with copper on the base
board and tied to the ground plane with additional vias.
Figure 2-2. Thru hole footprint dra wing
Best way is to install the module with the antenna area to protrude beyond the board edge. If the system design
does not allow the antenna area to stand out, the module can be positioned in line with the board edge. Installing
the module further inside may cause a degradation in performance.
The mounting distance in between the module and the base board shall be in between 1mm and 2mm. For lower
distances the design rules for the SMT mounting according to Figure 2-3 will apply.
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Surface solder mounting
For lowest cost, the module can be surface mounted to the base board. This saves the costs for the pin header.
The drawing in Fi gure 2-3 shows the recommended base board foot print.
The antenna shall not be influenced by the base board m aterial. Any metal or dielectric material as FR-4 or
similar would tune the antenna out of band. The module has to be mounted with t he antenna end to protrude
beyond the board edge. The area underneath the module shall be filled with a grounded copper fill.
As an alternative, the base board can be cut out as shown in Figure 2-3. This solution can help to keep the base
board outline by avoiding an antenna frequency deviation.
The SMT pads in the base board shall exceed the module outline at least by 0.45mm to achieve a controlled
solder result.
Figure 2-3. Base board design for SMT module mounting
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3 Module pin assignment
3.1 Application pins
The module pin assignment is shown in T able 3-1 . The Column “uC pin” is a reference to t he ATSAMR21
datasheet (SAMR21). The column “Pin function” shows a selection of alternative IO functions. Please refer to the
ATSAMR21 datasheet for the complete IO multiplexer description.
Module pin
Function
uC pin
1
Vcc
4 / 24
2 GND 3 / 6 / 11 /
14 / 28 /
paddle Ground pins
3 PA16 17
SPI SS
I2C SDA
GPIO
4 PA17 18
SPI SCK
I2C SCK
GPIO
5 PA18 19
SPI MISO
UART Tx
GPIO
6 PA19 20
SPI MOSI
UART Rx
GPIO
7 PA07 8
GPIO
Table 3-1. Modul e main connector pin assign ment
The location of pin 1 is shown with the mechanic drawings in section 2.
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3.2 Test points
For test and development use, the module is equipped with a number of test points. The bottom test points are
easy acces sible in conjunction with the module development tool. The top test points can be probed while the
module is installed on the final application board.
3.2.1 Top layer test points
The test points on top layer can be used as a debug serial interface or as GPIO. Figure 3-1 shows the test point
locations while the test point function is documented in Table 3-2.
TP reference
Signal
uC pin
TP6
PA14
15
TP7
PA15
16
Table 3-2. Top layer test points
Please refer to the ATSAMR21 datasheet for the complete IO multiplexer description for these port pins.
Figure 3-1. Top layer test point locations
3.2.2 Bottom layer test points
The bottom layer test points allow the programming interface access as well as the same UART connection as
the top layer test points.
TP reference
Signal
uC pin
TP1 #RESETN 26 Microcontroller reset
TP2
PA30
31
TP3
PA31
32
TP4 PA14 15 UART Tx, GPIO
TP5
PA15
16
Table 3-3. Top layer test points
Please refer to the ATSAMR21 datasheet for the complete IO multiplexer description.
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Figure 3-2. Bottom layer test point locations
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4 Electrical Characteristics
This section outlines the main parameters required to build applications. The module characteristics are
determined by the implemented components. Section 7 provides the required datasheet references for more
information.
4.1 Absolute Maximum Ratings
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
T
STOR
Storage Temperature
-40
+125
°C
VPIN
Pin voltage with
respect to GND and
VDD
GND
-0.3V Vcc+0.3V V
VESD ESD robustness
Module IO’s routed to ATSAMR21
Human Body Model
Charged Device Model
4
550
kV
V
PRF
Input RF level
Level at ATSAMR21 pins
+10
dBm
4.2 Recommended Operating Conditions
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
TOP
Operating
temperature range
-40 125 °C
Vcc Supply voltage
Operating range for full serial FLASH
operation. 2.7 3.6 V
4.3 Power Consumption
Vcc=3.0V
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
IcpuA Module current with
active CPU
CPU running a 48MHz while(1) loop
Transceiver in sle ep mode
FLASH disabled 3.3 mA
ISbyRTC Module current with
CPU in standby and
running RTC
CPU in sloop mode
Transceiver in sle ep mode
FLASH disabled
XOSC32k running
RTC running at 1kHz
4 uA
ISbyRTC Module current with
CPU in standby and
RTC off
CPU in sloop mode
Transceiver in sle ep mode
FLASH disabled
XOSC32k and RTC stopped
2.7 uA
ITRX_Rx
Additiona l current for
transceiver in active
receive mode
Delta in between TRX sleep and TRX rx. 11.8 mA
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Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
ITRX_Tx
Additiona l current for
transceiver in active
transmit mode.
Delta in between TRX sleep and TRX rx.
Maximum Tx power setting 13.8 mA
4.4 Module performance data
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
TOP
Operating
temperature range
-40 125°C °C
PRF RF transmit power T = 25°C, band center -1 dBm
EIRP
PSPUR_TX Transmitter s purious
emissions All operating conditions -41 dBm
EIRP
Observed 50m lin k
receive level
Operation over 50m flat grass land
1m antenna height
Result based on 50 PER measurements
1000 frames per PER measurement
No frame loss in 50 PER measurements
-85 -79 dBm
fRef_0 Reference cry stal
deviation
T = 25°C default XTAL_TRIM setting
T = 25°C NV memory XTAL_TR IM setting
-5
-5
+20
+5 ppm
fRef_T
Reference cry stal
drift over tempera-
ture -40°C <TOP< +125°C -25 +15 ppm
Figure 4-1. Distribution of average rx levels observed in 50 PER tests with 1000 frames each.
0
5
10
15
20
25
30
-86 -85 -84 -83 -82 -81 -80 -79 -78
Rx level Frequency
Rx ED level
rx lev el frequency distribution
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5 NV Memory Information
The ATSAMR21 provides a user readable NV memory space called user row in the data sheet. The base
address for the application is 0x804008. Table 5-1Error! Reference s ource not f ou nd. shows the implemented
data structure.
Addr. offset
Field name
Field description
Length
BaseAddr. + 0x 00
MIB_REVISION
Data structure revision. 0x1501
2 Byte
+ 0x02
MAC_IEEE_ADDRESS
Module specific IEEE MAC Address
8 Byte
+ 0x0a
BOARD_SERIAL
Module specific serial number
10 Byte
+ 0x14
ATMEL_PART_NO
Product specific part number
8 Bytes
+ 0x 1c
PCBA_REV
Product PCB/assembly revision
1 Byte
+ 0x1d
XTAL_TRIM
Reference crystal calibration value
1 Byte
+ 0x1e CRC16 Checksu m for thi s data stru ctu r e 2 Byte
Table 5-1. NV Memory (user row) Data
Two data fields have to be copied to radio transceiver registers. The data in MAC_IEEE_ADDRESS have to be
copied to the registers IEEE_ADDR_0 to _7.
The XTAL_TRIM value has been determined during production test and needs to be copied to the transceiver
XTAL_TRIM section inside the XOSC_CTRL register. This will reduce the absolute deviation for the 16MHz
reference crystal. See section 4.3 for detailed parameters.
6 Boot loade r
The module will be delivered with a pre flashed boot loader. Please refer to the boot loader manual for detailed
information. It is online available under the Application Note code AVR2054.
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7 Radio Certification
The module ATSAMR21B18-MZ210PA in combination with the integrated antenna has received regulatory
approvals for modular devices in the United States, Canada and European countries.
7.1 United States (FCC)
The module ATSAMR21G18-MR210UA complies with the requirements of FCC part 15. To fulfill FCC
Certification requirements, an OEM manufacturer must comply with the following regulations:
• The modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not visible
when the module is installed inside another device, then the outside of the device into which the module
is installed must also display a label referring to the enclosed module.
• This exterior label can use wording such as the following. Any similar wording that expresses the same
meaning m a y be used.
Sample Label for integration of ATSAMR21B18-MZ210PA:
Contains FCC-ID: VNR-ATSAMZ210PA-0
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
this device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation (FCC 15.19). The antenna used for this mobile
transmitter must provide a separation distance of at least 20 cm from all persons and must not be co-located or
operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for
satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF exposure
compliance, and may only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093)
requires separate equipment authorization.
Modifications not expressly approved by this company could void the user's authority to operate this equipment
(FCC section 15.21).
7.2 Europe (ETSI)
The module ATSAMR21B18-MZ210PA is conform for use in European Union countries. If the
ATSAMR21B18-MZ210PA module is incorporated into a product, the manufacturer must ensure the compliance
of the final product to the European harmonized EMC and low-voltage/safety standards. A Declaration of
Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE
Directive.
The manufacturer must maintain a copy of the ATSAMR21B18-MZ210PA module documentation and ensure the
final product does not exceed the specified power ratings, antenna specifications, and/or installation
requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a
submission must be made to a notified body for compliance testing to all required standards.
The CE marking must be affixed to a visible location at the OEM product. The CE mark shall consist of the initials
"CE" taking the following form:
• If the CE marking is reduced or enlarged, the proportions must be respected.
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• The CE marking must have a height of at least 5 mm except where this is not possible on account of the
nature of the apparatus.
• The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements can be found at "DIRECTIVE 1999/5/EC OF THE
EUR OPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12. For the operation in
Europe, there is no power setting limit.
7.3 Industry Canada (IC) Compliance statements
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de
brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20 cm between the device
and the user or bystanders.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour
un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de
distance entre le dispositif et l'utilisateur ou des tiers
CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could
void the user’s authority to operate the equipment.
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). This
Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another
device, then the device should display the label on it referring the enclosed module. In that case, the final end
product must be labelled in a visible area with the following:
“Contains Transmitter Module IC: 20266-ATSAMZ210PA0”
OR
“Contains IC: 20266-ATSAMZ210PA0”
Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est
installé à l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans
ce cas, le produit final doit être étiqueté dans un endroit visible par le texte suivant:
“Contains Transmitter Module IC: 20266-ATSAMZ210PA0”
OR
“Contains IC: 20266-ATSAMZ210PA0”
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8 Ordering Information
Module Type
Packaging(1)
Ordering Code
Package
Operational Range
ATSAMR21B18-MZ210PA
Tape&Reel ATSAMR21B18-MZ210PA-T 16.3mm x
19.7mm Industrial
(-40°C to +85°C)
Note:
1. MOQ is a reel with 200 modules.
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9 References
[1 ] Macronix. (n.d.). Macronix International Co., Ltd. Retrieved from MX25L2006E (K-Grade) Datasheet:
http://www.macronix.com
[2] Atmel SAM R21. (n.d.). www.atmel.com. Retri ev ed f rom
http://www.atmel.com/Images/Atmel-42223-SAM-R21_Datasheet.pdf
10 Revisi on History
Doc Rev.
Date
Comments
42486B 09/2015
• Updated section 6: Added reference to application note code of “AVR2054: Serial
Bootloader User Guide”.
• Added sectio n 7 Radio Certification.
• Added sectio n 8 Ordering Information.
42486A 07/2015 • Initial document release.
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