D2TO20
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Revision: 29-Mar-16 1Document Number: 51055
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Surface Mount Power Resistor
Thick Film Technology
DESIGN SUPPORT TOOLS click logo to get started
FEATURES
AEC-Q200 qualified
20 W at 25 °C case temperature
Surface mounted resistor - TO-263 (D2PAK)
style package
Wide resistance range from 0.01 to 550 k
Non inductive
Resistor isolated from metal tab
Solder reflow secure at 270 °C/10 s
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Notes
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
Power dissipation is 3.1 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 HTG, 70 μm of
copper, 39 mm x 30 mm x 1.6 mm, with thermal vias
Available
Models
DIMENSIONS in millimeters
STANDARD ELECTRICAL SPECIFICATIONS
MODEL SIZE
RESISTANCE
RANGE
RATED POWER
P25 °C
W
LIMITING ELEMENT
VOLTAGE UL
V
TOLERANCE
± %
TEMPERATURE
COEFFICIENT
± ppm/°C
CRITICAL
RESISTANCE
D2TO20 TO-263 0.01 to 550K 20 500 1, 2, 5, 10 150, 250, 700, 1100 12.5K
10.5
1.6
8.8
1.6
Tolerance: ± 0.3 mm
11.00
1.50
6.50
4.02
4.00
2.40
8.00
2.49
0.26
Footprint recommendation for
solderable contact area:
1.25 4.5
2.8
2.2
0.3
2
5.08
7.6
7.8 min.
8.7
0.2
5
15.4
8.1
5.15 1.25
10.1
4.5
MECHANICAL SPECIFICATIONS
Mechanical Protection Molded
Resistive Element Thick film
Substrate Alumina
Connections Tinned copper
Weight 2.2 g max.
ENVIRONMENTAL SPECIFICATIONS
Temperature Range -55 °C to 155 °C
Flammability
IEC 60695-11-5
2 applications 30 s
separated by 60 s
TECHNICAL SPECIFICATIONS
Power Rating and
Thermal Resistance
of the Component
20 W at 25 °C (case
temperature)
RTH (j - c): 6.5 °C/W
Temperature Coefficient See Special Feature table
Standard ± 150 ppm/°C
Dielectric Strength
IEC 60115-1
2000 VRMS - 1 min - 10 mA max.
(between terminals and board)
Insulation Resistance 106 M
Inductance 0.1 μH
DIMENSIONS
Standard Package TO-263 style
(D2PAK)
D2TO20
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Revision: 29-Mar-16 2Document Number: 51055
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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SPECIAL FEATURES
Resistance Values 0.010 0.045 0.1 0.5
Tolerances ± 1 % at ± 10 %
Requirement Temperature Coefficient (TCR)
(-55 °C +150 °C)
IEC 60115-1
± 1100 ppm/°C ± 700 ppm/°C ± 250 ppm/°C ± 150 ppm/°C
PERFORMANCE
TESTS CONDITIONS REQUIREMENTS
Momentary Overload
IEC 60115-1 §4.13
2 Pr 5 s for R < 2
1.5 Pr 5 s for R 2
US < 1.5 UL
± (0.25 % + 0.005 )
Load Life IEC 60115-1
1000 h, 90/30 Pr at +25 °C ± (1 % + 0.005 )
High Temperature Exposure
AEC-Q200 REV D conditions:
MIL-STD-202 method 108
1000 h, +175 °C, unpowered
± (0.25 % + 0.005 )
Temperature Cycling
Pre-conditioning 3 reflows according
JESTD020D
IEC 60068-2-14 test Na
1000 cycles, -55 °C/+175 °C
Dwell time - 15 min
± (0.5 % + 0.005 )
Moisture Resistance
AEC-Q200 REV D conditions:
MIL-STD-202 method 106
10 cycles, 24 h, unpowered
± (0.5 % + 0.005 )
Biased Humidity
AEC-Q200 REV D conditions:
MIL-STD-202 method 103
1000 h, 85°C, 85 % RH
± (1 % + 0.005 )
Operational Life
AEC-Q200 REV D conditions:
Pre-conditioning 3 reflows according
JESTD020D
MIL-STD-202 method 108
2000 h, 90/30, powered, +125 °C
± (1 % + 0.005 )
ESD Human Body Model
AEC-Q200 REV D conditions:
AEC-Q200-002
25 kVAD
± (0.5 % + 0.005 )
Vibration
AEC-Q200 REV D conditions:
MIL-STD-202 method 204
5 g’s for 20 min, 12 cycles
test from 10 Hz to 2000 Hz
± (0.5 % + 0.005 )
Mechanical Shock
AEC-Q200 REV D conditions:
MIL-STD-202 method 213
100 g’s, 6 ms, 3.75 m/s
3 shocks/direction
± (0.5 % + 0.005 )
Board Flex
AEC-Q200 REV D conditions:
AEC-Q200-005
Bending 2 mm/60 s
± (0.25 % + 0.01 )
Terminal Strength
AEC-Q200 REV D conditions:
AEC-Q200-006
1.8 kgf/60 s
± (0.25 % + 0.01 )
ASSEMBLY SPECIFICATIONS
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
TESTS CONDITIONS REQUIREMENTS
Resistance to Soldering Heat
IEC 60115-1
IEC 60068-2-58
Solder bath method: 270 °C/10 s
± (0.5 % + 0.005 )
Moisture Sensitivity Level (MSL) IPC/JEDEC® J-STD-020C
85 °C/85 % RH/168 h
Level: 1
+ pass requirements of TCR
overload and dielectric strength after MSL
D2TO20
www.vishay.com Vishay Sfernice
Revision: 29-Mar-16 3Document Number: 51055
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CHOICE OF THE BOARD
The user must choose the board according to the working conditions of the component (power, room temperature). Maximum
working temperature must not exceed 175 °C. The dissipated power is simply calculated by the following ratio:
P: Expressed in W
T: Difference between maximum working temperature and room temperature or fluid cooling temperature
RTH (j - c): Thermal resistance value measured between resistive layer and outer side of the resistor. It is the thermal resistance
of the component: 6.5 °C/W.
RTH (c - h): Thermal resistance value measured between outer side of the resistor and upper side of the board. This is the thermal
resistance of the solder layer.
RTH (h - a): Thermal resistance of the board.
Example:
RTH (c - h) + RTH (h - a) for D2TO20 power rating 2.5 W at ambient temperature +25 °C.
Thermal resistance RTH (j - c): 6.5 °C/W
Considering equation (1) we have:
T = 155 °C - 25 °C = 130 °C
RTH (j - c) + RTH (c - h) + RTH (h - a) = T/P = 130/2.5 = 52 °C/W
RTH (c - h) + RTH (h - a) = 52 °C/W - 6.5 °C/W = 45.5 °C/W
Single Pulse:
These informations are for a single pulse on a cold resistor at 25 °C (not already used for a dissipation) and for pulses of
100 ms maximum duration.
The formula used to calculate E is:
with:
E (J): Pulse energy
P (W): Pulse power
t (s): Pulse duration
U (V): Pulse voltage
R (W): Resistor
The energy calculated must be less than that allowed by the graph.
PT
RTH (j - c) RTH (c - h) RTH (h - a)
++
------------------------- -------------------------- --------------------------- -------------
1
=
EP x tU2
R
-------- x t==
D2TO20
www.vishay.com Vishay Sfernice
Revision: 29-Mar-16 4Document Number: 51055
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
OVERLOADS
In any case the applied voltage must be lower than the
maximum overload voltage of 750 V. The values indicated
on the graph below are applicable to resistors in air or
mounted onto a board.
ENERGY CURVE
POWER CURVE
POWER RATING
The temperature of the case should be maintained within the
limits specified.
MARKING
Model, style, resistance value (in ), tolerance (in %),
manufacturing date, Vishay Sfernice trademark
0.001
0.01
0.1
1
10
100
ENERGY IN JOULES
OVERLOAD DURATION IN s
10-7 10-6 10-5 10-4 10-3 10-2 10-1
100
1000
10 000
100 000
POWER IN W
OVERLOAD DURATION IN s
10-7 10-6 10-5 10-4 10-3 10-2 10-1
PACKAGING
Reel
•Tube
Tape dimensions (mm) for reel:
100
75
50
25
0
RATED POWER IN %
CASE TEMPERATURE IN °C
120
020 40 60 80 100 120 140 155
16
11
16.4 24
5.3
D2TO20
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Revision: 29-Mar-16 5Document Number: 51055
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ORDERING INFORMATION
D2TO 020 C 100 K± 1 % XXX e3
MODEL STYLE CONNECTIONS RESISTANCE
VALUE
TOLERANCE CUSTOM DESIGN LEAD (Pb)-FREE
F = ± 1 %
G = ± 2 %
J = ± 5 %
K = ± 10 %
Optional on request:
Shape, etc.
SAP PART NUMBERING GUIDELINES
GLOBAL
MODEL SIZE LEADS OHMIC VALUE TOLERANCE PACKAGING LEAD (Pb)-FREE
D2TO 020 C = Surface mount The first four digits are
significant figures and the
last digit specifies the
number of zeros to follow.
R designates decimal
point.
48R70 = 48.7 
48701 = 48 700 
10002 = 100 000 
R0100 = 0.01 
R6800 = 0.68 
27000 = 2700 = 2.7 k
F = 1 %
G = 2 %
J = 5 %
K = 10 %
R = Reel 500 pieces
T = Tube 50 pieces
E3 = Pure tin
020CR20 0 R 3TD O2 0KE
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 08-Feb-17 1Document Number: 91000
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