Rev.1.00 Jan 19, 2006 page 1 of 4
RKD700KL
Silicon Schottky Barrier Diode for Backflow prevention REJ03G1337-0100
Rev.1.00
Jan 19, 2006
Features
• Low reverse current, Low capacitance.
• Extremely small Flat Lead Package (EFP) is suitable for surface mount design.
Ordering Information
Type No. Laser Mark Package Name Package Code
RKD700KL 6 EFP PXSF0002ZA-A
Pin Arrangement
12
6
−
Cathode mark
Mark
1. Cathode
2. Anode
RKD700KL
Rev.1.00 Jan 19, 2006 page 2 of 4
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Value Unit
Repetitive peak reverse voltage VRRM 30 V
Reverse voltage VR 30 V
Non-Repetitive peak for ward surge curr ent IFSM * 200 mA
Average rectified current IO 50 mA
Junction temperature Tj 125 °C
Storage temperature Tstg −55 to +125 °C
Note: 10 ms Sinewave 1 pulse
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Condition
VF1 — 0.11 0.14 IF = 1 µA
VF2 — — 0.33 IF = 1 mA
Forward voltage
VF3 — — 0.43
V
IF = 10 mA
IR1 — — 45
nA VR = 3 V Reverse current IR2 — — 1
µA VR = 30 V
Capacitance C — — 2.8 pF VR = 1 V, f = 1 MHz
Note: For EFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is
considered as unquestioned. Please kindly consider soldering n ature.
RKD700KL
Rev.1.00 Jan 19, 2006 page 3 of 4
Main Characteristic
Ta=25°C
Ta=75°C
Pulse test
1.0
0 0.80.2 0.4 0.6
0.1
10
100.1
1.0
1.0
010 304020
Forward current IF (A)
Fig.1 Forward current vs. Forward voltage
Forward voltage VF (V)
Capacitance C (pF)
Reverse current IR (A)
Fig.2 Reverse current vs. Reverse voltage
Reverse voltage VR (V)
10-8
10-7
10-6
10-5
10-4
f=1MHz
10–1
10–3
10–4
10–5
10–8
10–2
10–7
10–6
Fig.3 Capacitance vs. Reverse voltage
Reverse voltage VR (V)
Ta=75°C
Ta=25°C
RKD700KL
Rev.1.00 Jan 19, 2006 page 4 of 4
Package Dimensions
A
c
EH
E
D
b
e
1
b
Pattern of terminal position areas
φ
A
b
c
D
E
HE
e1
0.25
0.44
0.08
0.55
0.75
0.95
0.30
0.47
0.13
0.60
0.40
1.00
0.80
1.00
0.50
0.35
0.18
0.65
0.85
1.05
Dimension in Millimeters
Reference
Symbol Min Nom Max
b
φ
0.0007g
MASS[Typ.]
EFP / EFPVPXSF0002ZA-A
RENESAS CodeJEITA Package Code Previous Code
Package Name
EFP
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 205, AZIA Center, No.133 Yincheng Rd (n), Pudong District, Shanghai 200120, China
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .5.0
