NLU1GT04 Single Inverter, TTL Level LSTTL-Compatible Inputs The NLU1GT04 MiniGatet is an advanced CMOS high-speed inverting buffer in ultra-small footprint. The device input is compatible with TTL-type input thresholds and the output has a full 5.0 V CMOS level output swing. The NLU1GT04 input and output structures provide protection when voltages up to 7 V are applied, regardless of the supply voltage. www.onsemi.com MARKING DIAGRAMS Features * * * * High Speed: tPD = 3.8 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25C TTL-Compatible Input: VIL = 0.8 V; VIH = 2.0 V CMOS-Compatible Output: VOH > 0.8 VCC; VOL < 0.1 VCC @ Load Power Down Protection Provided on inputs Balanced Propagation Delays Ultra-Small Packages These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant UDFN6 MU SUFFIX CASE 517AA N * * * * M 1 UDFN6 MU SUFFIX CASE 517AQ PM 1 N or P M = Device Marking = Date Code PIN ASSIGNMENT NC 1 IN A 6 2 5 3 GND 4 VCC NC 1 June, 2016 - Rev. 3 2 IN A 3 GND 4 OUT Y 5 NC 6 VCC FUNCTION TABLE A Y L H H L OUT Y ORDERING INFORMATION Figure 2. Logic Symbol (c) Semiconductor Components Industries, LLC, 2016 NC OUT Y Figure 1. Pinout (Top View) IN A 1 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. 1 Publication Order Number: NLU1GT04/D NLU1GT04 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V DC Output Voltage -0.5 to +7.0 V VIN < GND -20 mA VOUT < GND 20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current 12.5 mA ICC DC Supply Current Per Supply Pin 25 mA IGND DC Ground Current per Ground Pin 25 mA TSTG Storage Temperature Range -65 to +150 C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 C TJ Junction Temperature Under Bias 150 C MSL FR VESD ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V-0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125 C (Note 5) > 2000 > 200 N/A V 500 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22-A114-A. 3. Tested to EIA / JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V -55 +125 C 0 0 100 20 ns/V VOUT TA Operating Free-Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 NLU1GT04 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VIH Low-Level Input Voltage VIL VOH VOL Conditions Low-Level Input Voltage High-Level Output Voltage Low-Level Output Voltage TA = 25 5C TA = +855C TA = -555C to +1255C Min Min VCC (V) Min 1.8 1.2 1.2 1.2 3.0 1.4 1.4 1.4 4.5 to 5.5 2.0 2.0 2.0 Typ Max Max Max V 1.8 0.3 0.3 0.3 3.0 0.53 0.53 0.53 4.5 to 5.5 0.8 0.8 0.8 VIN = VIH or VIL IOH = -50 mA 3.0 4.5 2.9 4.4 VIN = VIH or VIL IOH = -2 mA IOH = -4 mA IOH = -8 mA 1.8 3.0 4.5 1.40 2.58 3.94 VIN = VIH or VIL IOL = 50 mA 3.0 4.5 VIN = VIH or VIL IOL = 2 mA IOL = 4 mA IOL = 8 mA 3.0 4.5 0 0 2.9 4.4 2.9 4.4 1.38 2.48 3.80 1.37 2.34 3.66 Unit V V 0.1 0.1 0.1 0.1 0.1 0.1 1.8 3.0 4.5 0.36 0.36 0.36 0.44 0.44 0.44 0.52 0.52 0.52 V IIN Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 0.1 1.0 1.0 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 1.0 20 40 mA ICCT Quiescent Supply Current VIN = 3.4 V 5.5 1.35 1.50 1.65 mA IOPD Output Leakage Current VOUT = 5.5 V 0.0 0.5 5.0 10 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y CIN Input Capacitance CPD Power Dissipation Capacitance (Note 6) TA = 25 5C TA = +855C TA = -555C to +1255C VCC (V) Test Condition Typ Max Max Unit 3.0 to 3.6 CL = 15 pF 5.0 10.0 11.0 13.0 ns CL = 50 pF 6.2 13.5 15.0 17.5 4.5 to 5.5 CL = 15 pF 3.8 6.7 7.5 8.5 CL = 50 pF 4.2 7.7 8.5 9.5 5 10 10 10.0 Min 5.0 10 Min Max Min pF pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD * VCC * fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD * VCC2 * fin + ICC * VCC. www.onsemi.com 3 NLU1GT04 VCC A or B 50% GND tPLH Y tPHL 50% VCC Figure 3. Switching Waveforms OUTPUT INPUT CL* *Includes all probe and jig capacitance. A 1-MHz square input wave is recommended for propagation delay tests. Figure 4. Test Circuit ORDERING INFORMATION Package Shipping NLU1GT04MUTCG UDFN6 (Pb-Free) 3000 / Tape & Reel NLU1GT04AMUTCG UDFN6 (Pb-Free) 3000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 4 NLU1GT04 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA ISSUE D EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C L1 EE EE E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C EEE EEE A3 DETAIL B Side View (Optional) 5X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X 6X 0.42 C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 NLU1GT04 PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. L1 PIN ONE REFERENCE 0.10 C EEE EEE DETAIL A E OPTIONAL CONSTRUCTIONS EE EE EXPOSED Cu TOP VIEW 0.10 C DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 --- 0.15 MOUNTING FOOTPRINT 0.05 C A1 A2 SIDE VIEW e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 www.onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NLU1GT04/D