TDA7253L 6W AMPLIFIER WITH MUTING PRODUCT PREVIEW WIDE SUPPLY VOLTAGE RANGE 6W @ VS = 20V, R L = 8, THD=10% MUTE FACILITY (POP FREE) WITH LOW CONSUMPTION AC SHORT CIRCUIT PROTECTION THERMAL OVERLOAD PROTECTION (150C SIP10 ORDERING NUMBER: TDA7253L DESCRIPTION The TDA7253L is class AB audio power amplifier assembled in the Single in Line 10 pins Package. TEST AND APPLICATION CIRCUIT +VS R7 820 = MUTE SW C4 0.1F CSVR 100F 9 3 C2 IN (L) C5 470F TDA7253L 5 C11 1000F 7 100nF 27K 4 6 CF 47F R3 1.5K R4 47 C9 0.1F RL R6 4.7 D02AU1429 June 2003 1/7 TDA7253L ABSOLUTE MAXIMUM RATINGS Symbol Value Unit VS Supply Voltage 30 V IO Output Peak Current (repetitive f >20Hz) 1.7 A IO Output Peak Current (non repetitive, t = 100s) 2 A Ptot Total Power Dissipation (Tcase = 70C) 8 W Top Operating Temperature Range Tstg,Tj Parameter Storage & Junction Temperature 0 to 70 C -40 to 150 C THERMAL DATA Symbol Rth j-case Parameter Thermal resistance junction to case Value Unit 9 C/W Max PIN CONNECTION (Top view) 10 N.C. 9 +VS 8 N.C. 7 OUTPUT 6 GND 5 NON INVERTING INPUT 4 INVERTING INPUT 3 SVR/MUTING 2 N.C. 1 N.C. D02AU1430 Figure 1. Block Diagram CFCOUP1 RFI 27K ININ+ 4 - 5 + 7 L OUT RF1 SVR 3 MUTE SC PROTECTION RF2 VS 9 REFERENCES Tj TURN-ON AND OFF TH PROTECTION 6 GND D02AU1431 2/7 TDA7253L ELECTRICAL CHARACTERISTCS (Refer to the test and application circuit, VS = 20V; RL = 8; Gv = 30dB; f = 1KHz; Tamb = 25C unless otherwise specified). Symbol Parameter VS Supply Voltage VO Quiescent Output Voltage Iq Total Quiescent Current PO Output Power Test Condition Min. d = 10% d = 1% d Total Harmonic Distortion RI Input Resistance fL Low Frequency Roll-off (-3dB) fH High Frequency Roll-off (-3dB) eN Total Input Noise Voltage PO = 1W 100 A Curve; RS = 10K Supply Voltage Rejection RS = 10K; f = 100Hz; Vr = 0.5V Mute Threshold VTPLAY Play Threshold 5 Mute Attenuation 80 AM Unit 24 V 11.5 V 40 mA 6 W 5 W 0.03 % 200 K 40 Hz 80 KHz Quiescent Current Mute mV 2.5 VTMUTE IqMUTE Max. 2 f = 22Hz to 22KHz; RS = 10K SVR Typ. 10 V 10 60 dB 0.8 V V 100 dB 7 10 mA CF -1 Note: to avoid pop-on noise ------------C S VR Figure 2. Output Power vs. Supply Voltage POUT (W) D02AU1432 Figure 4. Distortion vs Output Power d%10 5 f = 1KHz RL = 8 2 12 1 0.5 8 f =15KHz 0.2 d = 10% 0.1 d = 1% 0.05 4 f =1KHz 0.02 0 0.01 100m 8 12 16 20 VS(V) 200m 300m 500m700m 1 Pout (W) 2 3 4 5 6 78 Figure 3. Quiescent Current vs. Supply Voltage Iq (mA) D02AU1433 45 40 35 30 25 20 8 12 16 20 VS(V) 3/7 TDA7253L Figure 5. PC Board Component Layout Figure 6. Evaluation Board Top Layer Layout Figure 7. Evaluation Board Bottom Layer Layout 4/7 TDA7253L HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150C, it is important the dimensioning of the Heat Sinker RTh (C/W). The parameters that influence the dimensioning are: - Maximum dissipated power for the device (Pdmax) - Max thermal resistance Junction to case (RTh j-c) - Max. ambient temperature Tamb max - Quiescent current Iq (mA) Example: VCC = 20V, Rload = 8ohm, RTh j-c = 9 C/W , Tamb max = 50C 2 Pdmax = (N channels) * 2V c c ------------------------- + Iq Vc c 2 Rloa d Pdmax = 1 * ( 2.5 ) + 0.5 = 3W 150 - T amb max 150 - 50 - 9 = 24.3 C/W - - RTh j-c = ---------------------(Heat Sinker) RTh c-a = --------------------------------------6 P d max In figure 8 is shown the Power derating curve for the device. Figure 8. Power derating curve 10 8 a) (a) Pd (W) 6 (c) (b) Infinite Heatsink b) 10 C/ W c) 15 C/ W d) 20 C/ W 4 (d) 2 0 0 40 80 120 160 Tamb (C) 5/7 TDA7253L mm DIM. MIN. inch TYP. A MAX. MIN. TYP. 7.1 a1 2.7 3 B 0.280 0.106 0.118 24.8 b1 0.976 0.5 b3 0.020 0.85 1.6 0.033 0.063 C 3.3 0.130 c1 0.43 0.017 c2 1.32 D 0.052 23.7 0.933 d1 14.5 0.571 e 2.54 0.100 e3 22.86 L OUTLINE AND MECHANICAL DATA MAX. 0.900 3.1 0.122 L1 3 0.118 L2 17.6 0.693 L3 0.25 0.010 L4 0.254 0.010 M 3.2 0.126 N 1 0.039 P 0.15 SIP10 0.006 C D L1 L3 c2 N P 1 0 1 L L4 a1 L2 A d1 M b1 b3 e c1 e3 B SIP10 6/7 TDA7253L Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. STMicroelectronics acknowledges the trademarks of all companies referred to in this document. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 7/7