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TDA7253L
June 2003
WIDE SUPPL Y VOLTAGE RAN GE
6W @ V
S
= 20V, R
L
= 8, THD=10%
MUTE FACILITY (POP FREE) WITH LOW
CONSUMPTION
AC SHORT CI R CUI T PRO TECTION
THERMAL OVERLOAD PROTECTION (150°C
DESCRIPTION
The TDA 7253L is class AB audio po wer amplifier
assembled in the Single in Line 10 pins Package.
SIP10
ORDER ING NUM BER: TDA7 253L
PRODUCT PREVIEW
6W AMPLIFIER WIT H MUTING
TEST AND AP PLI CATI ON CIRCUIT
=
MUTE
SW CSVR
100µF
R7 820
27K
C2
100nF
IN
(L)
5
3
TDA7253L
6
CF
47µFR4
47
R3
1.5K C9
0.1µF
R6
4.7
RL
C11 1000µF
C4
0.1µFC5
470µF
9
7
4
+VS
D02AU1429
TDA7253L
2/7
ABSOLUTE MAXIMUM RATINGS
THE RMAL DA TA
PIN CONNECTION ( Top view)
Figu re 1. Blo ck D ia gra m
Symbol Parameter Value Unit
V
S
Supply Voltage 30 V
I
O
Output Peak Current (repetitive f >20Hz) 1.7 A
I
O
Output Peak Current (non repetitive, t = 100µs) 2 A
P
tot
Total Power Dissipation (T
case
= 70°C) 8 W
T
op
Operating Temperature Range 0 to 70 °C
T
stg
,T
j
Storage & Junction Temperature -40 to 150 °C
Symbol Parameter Value Unit
R
th j-case
Ther mal resist ance juncti on to case Max 9 °C/W
1
2
3
4
5
6
7
8 N.C.
OUTPUT
GND
NON INVERTING INPUT
INVERTING INPUT
SVR/MUTING
N.C.
N.C.
9
10
+VS
N.C.
D02AU1430
IN-
IN+
SVR
VS
OUT
CFCOUP1
RFI 27K
L
RF1
RF2
MUTE
6
4
5
3
9
7-
+
D02AU1431
GND
TURN-ON
AND OFF
REFERENCES
SC
PROTECTION
TH
PROTECTION
Tj
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TDA7253L
ELECTRICAL CHARACTE RISTCS (Refer to the test and appl ication circuit, V
S
= 20V; R
L
= 8;
G
v
= 30dB; f = 1KHz; T
amb
= 25°C unless otherwise specified).
Note: to avoi d pop-on noise
Symbol Parameter Test Condition Min. Typ. Max. Unit
V
S
Supply Voltage 10 24 V
V
O
Quiescent Output Voltage 11.5 V
I
q
Total Quiescent Current 40 mA
P
O
Output Power d = 10% 6 W
d = 1% 5 W
d Total Harmonic Distortion PO = 1W 0.03 %
R
I
Input Resis tance 100 200 K
f
L
Low Frequency Roll-off (-3dB) 40 Hz
f
H
High Frequency Roll-off (-3dB) 80 KHz
e
N
Total Input Noise Voltage A Curve; R
S
= 10K2mV
f = 22Hz to 22KHz; R
S
= 10K2.5 10 µV
SVR Supply Voltage Rejection R
S
= 10K; f = 100Hz; Vr = 0.5V 60 dB
VT
MUTE
Mute Threshold 0.8 V
VT
PLAY
Play Threshold 5 V
A
M
Mute Attenuation 80 100 dB
I
qMUTE
Quiescent Current Mute 7 10 mA
CF
CSVR
-------------- 1
Figure 2. Output Power vs. Supply Voltage
Figure 3. Quiescent Current vs. Supply V oltage
Figu re 4. Dis to rti on v s Ou t pu t Power
P
OUT
(W)
08 121620V
S
(V)
4
8
12
f = 1KHz
RL = 8
d = 10%
d = 1%
D02AU1432
I
q
(mA)
20 8 121620V
S
(V)
30
25
35
45
40
D02AU1433
0.01
10
0.02
0.05
0.1
0.2
0.5
1
2
5
d%
100m 8200m 300m 500m700m 1 2 3 4 5 6 7
Pout ( W )
f =15KHz
f =1KHz
TDA7253L
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Figure 5. PC Board Component Layout
Figu re 6. E va lu at i on Board To p Layer Layout
Figure 7. Evaluation Board Bottom Layer Layout
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TDA7253L
HEAT SINK DIMENSIONING:
In order to avoid the thermal protection inter vention, that is placed approximati vely at T
j
= 150°C, it is important
the dimensioning of the Heat Sinker R
Th
(°C/W).
The parameters that influence the dimensioning are:
Maximum dissipated powe r for the device (Pdmax)
M ax thermal resistance Junction to case (RTh j-c)
Max. ambi ent temperature Tamb max
Qui es cent current Iq (mA)
Example:
V
CC
= 20V, R
load
= 8ohm, R
Th j-c
= 9 °C/W , T
am b max
= 50°C
P
dmax
= (N° channels) ·
P
dmax
= 1 · ( 2.5 ) + 0.5 = 3W
(Heat Sinker)
In figure 8 is shown the Power derating curve for the device.
Figure 8. Power derating curve
2Vcc2
Π2Rload
-------------------------- IqVcc
+
RTh c-a 150 Tamb max
Pd max
---------------------------------------- RTh j-c
150 50
6
---------------------- 924.3°C/W===
a) I nfinite Heatsink
b) 10 °C/ W
c) 15 °C/ W
d) 20 °C/ W
(d)
(a)
(b)
(c)
0
2
4
6
8
10
04080120160
Tamb (°C)
Pd (W)
a) I nfinite Heatsink
b) 10 °C/ W
c) 15 °C/ W
d) 20 °C/ W
(d)
(a)
(b)
(c)
0
2
4
6
8
10
04080120160
Tamb (°C)
Pd (W)
TDA7253L
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SIP10
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 7.1 0.280
a1 2.7 3 0.106 0.118
B 24.8 0.976
b1 0.5 0.020
b3 0.85 1.6 0.033 0.063
C 3.3 0.130
c1 0.43 0.017
c2 1.32 0.052
D 23.7 0.933
d1 14.5 0.571
e 2.54 0.100
e3 22.86 0.900
L 3.1 0.122
L1 3 0.118
L2 17.6 0.693
L3 0.25 0.010
L4 0.254 0.010
M 3.2 0.126
N 1 0.039
P 0.15 0.006
D
N
M
L1
110
d1
L3
L2
La1
e3
b1
ec1
B
A
c2 C
P
L4
SIP10
b3
OUTLINE AND
MECHANICAL DATA
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by i m pl ication or otherwise un der any patent or p atent r ights of STMi croel ectronics. Specifications mentione d i n this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics prod ucts are not
authorized for use as criti cal comp onents in l i fe support devi ces or sy st em s without exp ress writ ten approval of STM i croel ectronics.
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TDA7253L