Hall IC
Hall IC
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■INTRODUCTION
The HALL IC is a Hall Effect switch, for low voltage battery operated systems used as a switch
replacement. The chip operates in awake and sleep modes. In the awake mode in the presence
of a sufficiently strong North or South magnetic flux, the output will switch to a logic LOW state,
the BOP state. A weaker North or South flux will create the BRP state. In the sleep mode, the
major current consuming components are switched off and the previous Bop or Brp state is
stored in a latch until the next awake cycle.
Hall IC
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■FEATURE AND APPLICATION
●Feature
- Chopper stabilized amplifier stage
- Micropower consumption for battery powered applications
- Omnipolar, output switches with absolute value of North or South pole from magnet
- Operation down to 2.5V
- High Sensitivity for direct reed switch replacement applications
●Application
- Solid state switch
- Handheld Wireless Handset Awake Switch
- Lid close sensor for battery powered devices
- Magnet proximity sensor for reed switch replacement in low duty cycle applications
Hall IC
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■STRUCTURE
Hall IC
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■APPEARANCE AND DIMENSION
●LEAD TAPE (HED51XXU11 MODEL)
●LEADLESS TAPE (HED52XXU11 MODEL)
Hall IC
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■PART NUMBERING
HED51XXU11
●
1●
2●
3●
4●
5●
6●
7●
8●
9
Abbreviation of Hall Element Including Hall IC
Operating Type
Operating Temperature Range
Serial Number of Development Order
User Demanding Spec
Serial Number of User Demanding Spec
Taping Direction
Plant
Production Classification
●
2OPERATING TYPE
Symbol Operating Type
AAnalog
DDigital
●
3OPERATING TEMPERATURE RANGE
Symbol Operation
Temperature Range
1―40℃~150
℃
3―40℃~120
℃
5―40℃~85
℃
●
4SERIAL NUMBER OF DEVELOPMENT ORDER
Give a number from 1 to 9 in order of development.
After 9, give a character from A in order of development except I and O
canbeconfusedwithnumber.
●
7
●
8
●
2
●
6
●
3
●
4
●
5
●
1
●
9
Hall IC
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●
5USER DEMANDING SPEC
Apply when it is necessary to classify accordingtospecincaseofuserdemand
Symbol User Demanding Spec
AMagnetic Characteristics
BCurrent
CVoltage
DTime
XNo Classification
●
6SERIAL NUMBER OF USER DEMANDING SPEC
Serial number of product which is classified by ●
5.
●
7TAPING DIRECTION
Symbol Taping Direction
UMarked side is upward
DMarked side is downward
BNo taping
●
8PLANT
Symbol Plant
1Suwon, Korea
2Tianjin. China
●
9PRODUCTION CLASSIFICATION
Symbol Production Classification
1Packaging & Test & Taping
2Test & Taping
3Fabrication & Packaging & Test & Taping
4Fabrication & Packaging & Test & Taping (Design by SEM)
Hall IC
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■PACKAGING
●EMBOSSED PLASTIC TAPE
Ao Bo H
G
F
E
D
CBA
t
Ko
Model DIMENSION ( mm )
A B C D E F
HED51XXU11 4.00±0.1 2.00±0.05 4.00±0.1 1.75±0.1 3.50±0.05 8.00±0.3
HED52XXU11 4.00±0.1 2.00±0.05 4.00±0.1 1.75±0.1 3.50±0.05 8.00±0.3
Model DIMENSION ( mm )
G H Ao Bo Ko t
HED51XXU11 MAX. 5°MAX. 5°3.15±0.1 3.25±0.1 1.30±0.05 0.20±0.05
HED52XXU11 MAX. 5°MAX. 5°2.70±0.1 1.40±0.1 1.20±0.05 0.20±0.05
Hall IC
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●TAPING SIZE
Empty Section
50 Pitch Packed Part Empty Section
55 Pitch Loading Section
40 Pitch
STARTEND
●REEL DIMENSION
Model Symbol Taping Count Packaging Tape
HED51XXU11 7" Reel 3000 Embossed Plastic Tape
HED52XXU11 7" Reel 4000 Embossed Plastic Tape
unit:pcs
Model Reel A B C D W1 W2
HED51XXU11 7" φ178±2.0 min.φ60 φ13±0.5 27±0.8 9±0.3 11.4±1.0
HED52XXU11 7" φ178±2.0 min.φ60 φ13±0.5 27±0.8 9±0.3 11.4±1.0
unit:mm
A
D
C
B
W1
W2
Hall IC
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■RELIABILITY TEST DATA
●TEST ITEM AND CONDITION
NO ITEM Test Method and
Test Conditions Test Length Samples Comments
1Biased Humidity
(HAST) TA=130℃, RH=85% 50 hrs 20 VDD=VOUT=3V
2Autoclave,
Unbiased JESD22-A102, Condition C,
TA=121℃,15psig 96hrs 20
3Temperature
Cycle MIL-STD-883, Method 1010
-65℃~+120℃500cycles 20
4Latch-Up -Pre/Post
Reading 6
5
Electro-Thermally
Induced Gate
Leakage -Pre/Post
Reading 6
6
ESD
Human Body
Model CDF-AEC-Q100-002 xper
test
Test to
failure
All
leads>TBD
7Electrical
Distributions Per Specification -30
Hall IC
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■CHARACTERISTIC GRAPH
●PERFORMANCE GRAPHS
Hall IC
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■BLOCK DIAGRAM
Sleep
Awake
Logic
Chopper ∬
Vcc
GND
Output
Hall IC
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■APPLICATION MANUAL
●APPLICATION EXAMPLES
●NOTES
- Confirm pin connection when circuit designs.
- Use in magnetic field that is strong enough above Bop.
(Magnetic circuit must have effective air gap)
- Hall IC is responsible to vertical magnetic field. therefore the sensing face of HALL IC
is always opposite to magnetic pole (N or S)
N(S)
S(N)
Hall IC
S(N) N(S)
Hall IC
Magnet
Magnet
Hall IC
Typical Microcontroller
Application Schematic
HALL IC
Controller
RL
RL = 50kΩto 1MΩ
Gnd
VDD Output
Microcontroller Application
Schematic
with EMC Protection
RL=50kΩto 1MΩ
R1= 100Ωand below or eliminate
C1,C2 = 0.01㎌
HALL IC
Controller
RL
R1 VDD
Gnd
Output
Hall IC
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●Typical IR solder-reflow profile
0
50
100
150
200
250
300
0 50 100 150 200 250
TIME in SECONDS
TEMPERATURE in ℃ .
PREHEAT
2~3℃/ s
SOLDERING AVOVE 260℃ IS
LIKELY TO PRODUCE FAILURES
COOL
1~4℃/ s
183℃
SOCK
130~160℃
120s M AX .
90 s M A X .
DWELL TIME
AVOBE
EUTECTIC
TEMP.
10 s M i N. AT 215℃
10 s M A X . AT 260℃
