Hall IC Hall IC INTRODUCTION The HALL IC is a Hall Effect switch, for low voltage battery operated systems used as a switch replacement. The chip operates in awake and sleep modes. In the awake mode in the presence of a sufficiently strong North or South magnetic flux, the output will switch to a logic LOW state, the BOP state. A weaker North or South flux will create the BRP state. In the sleep mode, the major current consuming components are switched off and the previous Bop or Brp state is stored in a latch until the next awake cycle. -1- Hall IC FEATURE AND APPLICATION Feature - Chopper stabilized amplifier stage - Micropower consumption for battery powered applications - Omnipolar, output switches with absolute value of North or South pole from magnet - Operation down to 2.5V - High Sensitivity for direct reed switch replacement applications Application - Solid state switch - Handheld Wireless Handset Awake Switch - Lid close sensor for battery powered devices - Magnet proximity sensor for reed switch replacement in low duty cycle applications -2- Hall IC STRUCTURE -3- Hall IC APPEARANCE AND DIMENSION LEAD TAPE (HED51XXU11 MODEL) LEADLESS TAPE (HED52XXU11 MODEL) -4- Hall IC PART NUMBERING HE 1 D 2 5 3 1 4 X 5 X 6 U 7 1 1 9 8 1 Abbreviation of Hall Element Including Hall 2 Operating Type 3 Operating Temperature Range 4 Serial Number of Development Order 5 User Demanding Spec 6 Serial Number of User Demanding Spec 7 Taping Direction 8 Plant 9 Production Classification IC 2 OPERATING TYPE Symbol Operating Type A Analog D Digital 3 OPERATING TEMPERATURE RANGE Symbol Operation Temperature Range 1 40 ~ 150 3 40 ~ 120 5 40 ~ 85 4 SERIAL NUMBER OF DEVELOPMENT ORDER Give a number from 1 to 9 in order of development. After 9, give a character from A in order of development except I and O can be confused with number. -5- Hall IC 5 USER DEMANDING SPEC Apply when it is necessary to classify according to spec in case of user demand Symbol User Demanding Spec A Magnetic Characteristics B Current C Voltage D Time X No Classification 6 SERIAL NUMBER OF USER DEMANDING SPEC 5. Serial number of product which is classified by 7 TAPING DIRECTION Symbol Taping Direction U Marked side is upward D Marked side is downward B No taping 8 PLANT Symbol Plant 1 Suwon, Korea 2 Tianjin. China 9 PRODUCTION CLASSIFICATION Symbol Production Classification 1 Packaging & Test & Taping 2 Test & Taping 3 Fabrication & Packaging & Test & Taping 4 Fabrication & Packaging & Test & Taping (Design by SEM) -6- Hall IC PACKAGING EMBOSSED PLASTIC TAPE A B C D E F t Ko G Ao Bo H DIMENSION ( mm ) Model A B C D E F HED51XXU11 4.000.1 2.000.05 4.000.1 1.750.1 3.500.05 8.000.3 HED52XXU11 4.000.1 2.000.05 4.000.1 1.750.1 3.500.05 8.000.3 DIMENSION ( mm ) Model G H Ao Bo Ko t HED51XXU11 MAX. 5 MAX. 5 3.150.1 3.250.1 1.300.05 0.200.05 HED52XXU11 MAX. 5 MAX. 5 2.700.1 1.400.1 1.200.05 0.200.05 -7- Hall IC TAPING SIZE Empty Section Packed Part 50 Pitch Empty Section Loading Section 55 Pitch 40 Pitch END START unit : pcs Model Symbol Taping Count Packaging Tape HED51XXU11 7" Reel 3000 Embossed Plastic Tape HED52XXU11 7" Reel 4000 Embossed Plastic Tape REEL DIMENSION W2 B C D W1 A unit : mm Model Reel A B C D W1 W2 HED51XXU11 7" 1782.0 min.60 130.5 270.8 90.3 11.41.0 HED52XXU11 7" 1782.0 min.60 130.5 270.8 90.3 11.41.0 -8- Hall IC RELIABILITY TEST DATA TEST ITEM AND CONDITION NO 1 2 3 4 ITEM Biased Humidity (HAST) Test Method and Test Conditions TA=130, RH=85% Autoclave, JESD22-A102, Condition C, Unbiased TA=121, 15psig Temperature MIL-STD-883, Method 1010 Cycle -65~+120 Latch-Up - Electro-Thermally 5 Induced Gate - Leakage Test Length Samples Comments 50 hrs 20 VDD=VOUT=3V 96hrs 20 500cycles 20 Pre/Post Reading Pre/Post Reading Human Body CDF-AEC-Q100-002 Model 7 Electrical Distributions 6 Test to ESD 6 6 x per failure test All leads>TBD Per Specification - 30 -9- Hall IC CHARACTERISTIC GRAPH PERFORMANCE GRAPHS - 10 - Hall IC BLOCK DIAGRAM Vcc Output Sleep Awake Logic Chopper GND - 11 - Hall IC APPLICATION MANUAL APPLICATION EXAMPLES Microcontroller Application Schematic with EMC Protection Typical Microcontroller Application Schematic Gnd Gnd HALL IC VDD HALL IC Output VDD R1 Controller Output Controller RL RL RL = 50k to 1M RL=50k to 1M R1= 100and below or eliminate C1,C2 = 0.01 NOTES - Confirm pin connection when circuit designs. - Use in magnetic field that is strong enough above Bop. (Magnetic circuit must have effective air gap) - Hall IC is responsible to vertical magnetic field. therefore the sensing face of HALL IC is always opposite to magnetic pole (N or S) S(N) Magnet Magnet S(N) N(S) N(S) Hall IC Hall IC Hall IC - 12 - Hall IC Typical IR solder-reflow profile 300 SOLDERING AVOVE 260 IS LIKELY TO PRODUCE FAILURES 10 s MAX. AT 260 . 250 TEMPERATURE in 10 s MiN. AT 215 200 183 150 90 s MAX. DWELL TIME AVOBE EUTECTIC TEMP. SOCK 130~160 120s MAX. 100 PREHEAT 2~3/s COOL 1~4/s 50 0 0 50 100 150 200 250 TIME in SECONDS - 13 -