SURFACE MOUNT
GLASS PASSIVATED SILICON RECTIFIER
VOLTAGE RANGE 50 to 1000 Volts CURRENT 1.0 Ampere
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25OC ambient temperature unless otherwise specfied.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
SM4007
THRU
SM4001
MAXIMUM RATINGS
(@ TA=25
OC unless otherwise noted)
ELECTRICAL CHARACTERISTICS
(@TA=25
OC unless otherwise noted)
RATINGS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
at Ambient Temperature
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
Typical Thermal Resistance (Note 1)
Typical Junction Capacitance (Note 2)
SYMBOL
V
RRM
V
DC
I
FSM
C
J
T
STG
V
RMS
UNITS
Volts
Volts
Volts
Amps1.0
30
50
15
Amps
0
C/W
0
C/W
0
C
Storage Temperature Range
Rq
JA
Typical Thermal Resistance (Note 1)20Rq
JC
I
O
pF
Operating Temperature Range T
J
SM4001
50
150
-55 to + 150
0
C
SM4002SM4003SM4004SM4005SM4006
100200400600
3570140280420
50100200400600
SM4007
SM4001SM4002SM4003SM4004SM4005SM4006SM4007
8001000
8001000
560700
2007-3
CHARACTERISTICS
Maximum Average Reverse Current
at Rated DC Blocking Voltage
V
F
SYMBOL
I
R
uA
Maximum Instantaneous Forward Voltage at 1.0A DCVolts
5.0
100
@T
A
= 25
o
C
@T
A
= 100
o
CuA
UNITS
1.1
NOTES :1. Thermal Resistance :Mounted on PCB.
2. Measured at 1 MHz and applied reverse voltage of 4.0 volts.
3. "Fully ROHS compliant","100% Sn plating (Pb-free)".
FEATURES
* Glass passivated device
* Ideal for surface mounted applications
* Low leakage current
* Metallurgically bonded construction
* Mounting position: Any
* Weight: 0.015 gram
* Epoxy : Device has UL flammability classification 94V-0
MECHANICA
DISCONTINUED-
L DATA
MELF
Dimensions in inches and (millimeters)
.205 ( 5.2 )
.190 ( 4.8 )
.024 ( 0.6 )
.016 ( 0.4 )
.106 ( 2.7 )
.095 ( 2.4 )
SOLDERABLE
ENDS
Discontinued
"This series is replaced by the FM400X series that meets to the same
fit and function parameters and share the same solder pad layout.
The FM400X series is preferred for error-free vacuum pick-up and
PCB assembly.
PERCENT OF RATED PEAK REVERSE VOLTAGE, (%)
INSTANTANEOUS FORWARD VOLTAGE, (V)
( ,TNERRUC DRAWROF SUOENATNATSNI m)A
AMBIENT TEMPERATURE, (OC)
0
0.01
1.0
0.1
10
100
1000
)A( ,TNERRUC DRAWROF EGAREVA
CJ)Fp( ,ECNATICAPAC NOITCNUJ ,
0
0.5
1.0
1.5
2.0
20 40 60 80 100 120 140
175125 1505025 75 1000
0 0.5 1.0 2.5 3.5 4.0 4.52.0
0.1
1.0
10
20
1.5 3.0 5.0
RATING AND CHARACTERISTICS CURVES ( SM4001 THRU SM4007 )
FIG.3 TYPICAL INSTANTANEOUS FORWARDFIG.3 TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS CHARACTERISTICS
FIG.1 TYPICAL FORWARD CURRENTFIG.1 TYPICAL FORWARD CURRENT
DERATING CURVE DERATING CURVE
FIG.2 TYPICAL REVERSEFIG.2 TYPICAL REVERSE
CHARACTERISTICS CHARACTERISTICS
REVERSE VOLTAGE, (V)
)A( ,TNERRUC ESREVE
R
SUOENA
T
NATS
N
I
0.1
1
8
6
4
2
10
20
40
400.4 1.0 4 10 80
FIG.4 TYPICAL JUNCTION CAPACITANCE FIG.4 TYPICAL JUNCTION CAPACITANCE
NUMBER OF CYCLES AT 60Hz
)A(
,
T
NER
R
U
C EGR
US
DRAW
R
O
F
KAEP
1
10
0
15
25
30
20
2 4 6 8 10 20 40 80 100
FIG.5 MAXIMUM NON-REPETITIVE FORWARDFIG.5 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT SURGE CURRENT
Single Phase Half Wave 60Hz
Resistive or Inductive Load
0.375" (9.5mm) Lead Length
T
J
= 25 OC
Pulse width=300S
1% Duty Cycle
T
J
= 25 OC
8.3mS Single Half Sine-Wave
JEDEC Method
T
A
= 25 OC
T
A
= 75 OC
T
A
= 100 OC
Mounting Pad Layout
Dimensions in inches and (millimeters)
.100 (2.54)
.200 (5.08)
.300 (7.62)
.100 (2.54)
.100 (2.54) F-SLOT WIDTH
OPTIMUM PAD SIZE
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specification herein, to make corrections, modifications, enhancements or other
changes. Rectron Inc or anyone on its behalf assumes no responsibility or liabi-
lity for any errors or inaccuracies. Data sheet specifications and its information
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