©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/06/18
General Purpose ESD Protection - SP1054
Description
Applications
The SP1312 bidirectional TVS is fabricated in a proprietary
silicon avalanche technology. These diodes provide a high
ESD (electrostatic discharge) protection level for electronic
equipment. The SP1312 TVS can safely absorb repetitive
ESD strikes of ±24 kV (contact and air discharge as defined
in IEC 61000-4-2) without any performance degradation.
Additionally, each TVS can safely dissipate a 3A 8/20 surge
event as defined in IEC 61000-4-5 2nd Edition.
Features
• ESD, IEC 61000-4-2,
±24kV contact, ±30kV air
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Lightning, 3A (8/20 as
defined in IEC 61000-4-5
2nd edition)
• Low capacitance of 11pF
(@ VR=0V)
• Low leakage current of
0.02μA(TYP) at 12V
• Industries smallest ESD
footprint available (01005)
• Halogen free, lead free
and RoHS compliant
• Mobile Phones
• Smart Phones
• Camcorders
• Portable Medical
• Digital Cameras
• Wearable Technology
• Portable Navigation
Components
• Tablets
• Point of Sale Terminals
Pinout
Functional Block Diagram
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
SP1312 11pF 24kV Bidirectional Discrete TVS
12
0201 Flipchip
Note: Drawing not to scale
SP1312
12
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/06/18
General Purpose ESD Protection - SP1054
Notes:
1. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and
operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 3 1A
TOP Operating Temperature -40 to 125 °C
TSTOR Storage Temperature -55 to 150 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR≤1μA 12 V
Breakdown Voltage VBR IR=1mA 13 15 V
Reverse Leakage Current ILEAK VR=12V 0.02 0.5 μA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 18.5 22 V
IPP=3A, tp=8/20µs, Fwd 22.5 27 V
Dynamic Resistance2RDYN TLP, tP=100ns, I/O to I/O 0.48 Ω
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact Discharge) ±24 kV
IEC 61000-4-2 (Air Discharge) ±30 kV
Diode Capacitance1CDReverse Bias=0V 11 14 pF
Note:
1 Parameter is guaranteed by design and/or component characterization.
2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
Clamp voltage vs. IPP for 8/20μs Waveshape
0.0
5.0
10.0
15.0
20.0
25.0
11.5 22.5 3
Clamp Voltage-Vc (V)
Peak Pulse Current-I
PP
(A)
Capacitance vs. Reverse Bias
0.0
3.0
6.0
9.0
12.0
012345678910 11 12
Capacitance (pF)
Reverse Bias Voltage (V)
SP1312
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/06/18
General Purpose ESD Protection - SP1054
8/20μs Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
SP1312
Positive Transmission Line Pulsing (TLP) Plot
0
5
10
15
20
25
30
35
40
0102030405060
TLP Current (A)
TLP Voltage (V)
Negative Transmission Line Pulsing (TLP) Plot
-40
-35
-30
-25
-20
-15
-10
-5
0
-60-50 -40-30 -20-10 0
TLP Current (A)
TLP Vo ltage (V)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/06/18
General Purpose ESD Protection - SP1054
Product Characteristics
Lead Plating Tin plating
Lead Material Copper bump
Substrate material Silicon
Flammability UL Recognized compound meeting
flammability rating V-0
Ordering Information
Part Number Package Min. Order Qty.
SP1312-01WTG 01005 Flipchip 15000
Part Numbering System
Part Marking System
SP 1312 01 TG
Series
Number of
Channels
Package
T= Tape & Reel
G= Green
–
W:01005 Flipchip
TVS Diode Arrays
(SPA® Diodes)
W
SP1312
Package Dimensions — 01005 Flipchip
Symbol
01005 Flipchip
Millimeters Inches
Min Typ Max Min Typ Max
A0.168 0.181 0.194 0.0066 0.0071 0.0076
A1 0.008 0.011 0.014 0.0003 0.0004 0.0006
A2 0.160 0.170 0.180 0.0063 0.0067 0.0071
e0.280 BSC 0.0110 BSC
E0.200 0.230 0.260 0.0079 0.0091 0.0102
D0.400 0.430 0.460 0.0157 0.0169 0.0181
F0.110 0.130 0.150 0.0043 0.0051 0.0059
G0.180 0.200 0.220 0.0071 0.0079 0.0087
P0.150 0.170 0.190 0.0059 0.0067 0.0075
L1
L2
e
P
A2
A
A1
E
Top View Bottom View
Side View
Pin 1
0.15mm
0.23mm
0.30mm
0.15mm
0.23mm
0.30mm
0.15mm
Recommended soldering pad layout Stencil apertures
D
Stencil thickness : 80um
Drawing# : W01-A
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/06/18
General Purpose ESD Protection - SP1054
Disclaimer Noce - Informaon furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applicaons. Lielfuse products are not designed for, and may not be used in, all applicaons.
Read complete Disclaimer Noce at hp://www.lielfuse.com/disclaimer-electronics.
SP1312
Embossed Carrier Tape & Reel Specification — 01005 Flipchip
,Ref.
,Ref.
,Ref.