FLASHPRO4 - Microsemi SoC - Datasheet.Live

July 2010 1

Programming Flash Devices

Introduction

This document provides an overview of the various programming options available for the Microsemi

flash families. The electronic version of this document includes active links to all programming resources,

which are available at http://www.microsemi.com/soc/products/hardware/default.aspx. For Microsemi

antifuse devices, refer to the Programming Antifuse Devices document.

Summary of Programming Support

FlashPro4 and FlashPro3 are high-performance in-system programming (ISP) tools targeted at the latest

generation of low power flash devices offered by the SmartFusion,® Fusion, IGLOO,® and ProASIC®3

families, including ARM-enabled devices. FlashPro4 and FlashPro3 offer extremely high perfor mance

through the use of USB 2.0, are high-speed compliant for full use of the 480 Mbps bandwidth, and can

program ProASIC3 devices in under 30 seconds. Powered exclusively via USB, FlashPro4 and

FlashPro3 provide a VPUMP voltage of 3.3 V for programming these devices.

FlashPro4 replaced FlashPro3 in 2010. FlashPro4 supports SmartFusion, Fusion, ProASIC3,and IGLOO

devices as well as future generation flash devices. FlashPro4 also adds 1.2 V programming for IGLOO

nano V2 devices. FlashPro4 is compatible with FlashPro3; however it adds a programming mode

(PROG_MODE) signal to the previousl y unused pin 4 of the JTAG connector. The PROG_MODE goes

high during programming and can be used to turn on a 1.5 V external supply for those devices that

require 1.5 V for programming. If both FlashPro3 and FlashPro4 programmers are used for programming

the same boards, pin 4 of the JTAG connector must not be connected to anything on the board because

FlashPro4 uses pin 4 for PROG_MODE.

Figure 1 • FlashPro Programming Setup

FlashPro

Software FlashPro3 or

FlashPro4 JTAG ProASIC3/E

Programming File:

PDB, STP, or FDB

Programming Support in Flash Devices

2 July 2010

Programming Support in Flash Devices

The flash FPGAs listed in Table 1 support flash in-system programming and the functions described in

this document.

IGLOO Te rminology

In documentation, the terms IGLOO series and IGLOO devices refer to all of the IGLOO devices as listed

in Table 1. Where the information applies to only one product line or limited devices, these exclusions will

be explicitly stated.

ProASIC3 Terminology

In documentation, the terms ProASIC3 series and ProASIC3 devices refer to all of the ProASIC3 devices

as listed in Table 1. Where the information applies to only one product line or limited devices, these

exclusions will be explicitly stated.

To further understand the differences between the IGLOO and ProASIC3 devices, refer to the Industry’s

Lowest Power FPGAs Portfolio.

Table 1 • Flash-Based FPGAs

Series Family*Description

IGLOO IGLOO Ultra-lo w power 1.2 V to 1.5 V FPGAs with Flash*Freeze technology

IGLOOe Higher density IGLOO FPGAs with six PLLs and additional I/O standards

IGLOO nano The industry’s lowest-power , smallest-size solution, supporting 1.2 V to 1.5 V

core voltage with Flash*Freeze technology

IGLOO PLUS IGLOO FPGAs with enhanced I/O capabilities

ProASIC3 ProASIC3 Low power, high-performance 1.5 V FPGAs

ProASIC3E Higher density ProASIC3 FPGAs with six PLLs and additional I/O standards

ProASIC3 nano Lowest-cost solution with enhanced I/O capabilities

ProASIC3L ProASIC3 FPGAs supporting 1.2 V to 1.5 V core voltage with Flash*Freeze

technology

RT ProASIC3 Radiation-tolerant RT3PE600L and RT3PE3000L

Military ProASIC3/EL Military temperature A3PE600L, A3P1000, and A3PE3000L

Automotive ProASIC3 ProASIC3 FPGAs qualified for automotive applications

SmartFusion SmartFusion Mixed-signal FPGA integrating FPGA fabric , programmable microcontroller

subsystem (MSS), including programmable analog and ARM® Cortex™-M3

hard processor and flash memory in a monolithic device

Fusion Fusion Mixed signal FPGA integrating ProASIC3 FPGA fabric, programmable

analog block, support for ARM® Cortex™-M1 soft processors, and flash

memory into a monolithic device

ProASIC ProASIC First generation ProASIC devices

ProASICPLUS Secon d generation ProASIC devices

Note: *The device names link to the appropriate d atasheet, includi ng product brief, DC and switchi ng characteristics,

and packaging information.

Programming Flash Devices

July 2010 3

General Flash Programming Information

Programming Basics

When choosing a programming solution, there are a number of options available. This section provides a

brief overview of those options. The next sections provide more detail on those options as they apply to

Microsemi FPGAs.

Reprogrammable or One-Time-Programmable (OTP)

Depending on the technology chosen, devices may be reprogrammable or one-time-programmable. As

the name implies, a reprogrammable device can be programmed many times. Generally, the contents of

such a device will be completely overwritten when it is reprogrammed. All Microsemi flash devices are

reprogrammable.

An OTP device is programmable one time only. Once progra mmed, no more chan ges can be made to

the contents. Microsemi flash devices provide the option of disabling the reprogrammabi lity for security

purposes. This combines the convenience of reprogrammability during design verification with the

security of an OTP technology for highly sensitive designs.

Device Programmer or In-System Programming

There are two fundamental ways to program an FPGA: using a device progra mmer or, if th e technology

permits, using in-system programming. A device programmer is a piece of equipment in a lab or on the

production floor that is used for programming F PGA devices. The devices are placed into a socket

mounted in a programming adapter module, and the appropriate electrical interface is applied. The

programmed device can then be placed on the board. A typical programmer, used during development,

programs a single device at a time and is referred to as a single-si te engineering programmer.

With ISP, the device is already mounted onto the system printed circuit board when programming occurs.

Typically, ISD programming is performed via a JTAG interface on the FPGA. The JTAG pins can be

controlled either by an on-board resource, such as a microprocessor, or by an off-board programmer

through a header connection. Once mounted, it can be programmed repeatedly and erased. If the

application requires it, the system can be designed to reprogram itself using a microprocessor, without

the use of any external programmer.

If multiple devices need to be programmed with the same program, various multi-site programming

hardware is available in order to program many devices in parallel. Microsemi In House Programming is

also available for this purpose.

Programming Features for Microsemi Devices

Flash Devices

The flash devices supplied by Microsemi are reprogrammable by either a generic device programmer or

ISP. Microsemi supports ISP using JTAG, which is supported by the FlashPro4 and FlashPro3, FlashPro

Lite, Silicon Sculptor 3, and Silicon Sculptor II programmers.

Levels of ISP support vary depending on the device chosen:

• All SmartFusion, Fusion, IGLOO, and ProASIC3 devices support ISP.

• IGLOO, IGLOOe, IGLOO nano V5, and IGLOO PLUS devices can be programmed in-system

when the device is using a 1.5 V supply voltage to the FPGA core.

• IGLOO nano V2 devices can be programmed at 1.2 V core voltage (when using FlashPro4 only)

or 1.5 V. IGLOO nano V5 devices are programmed with a VCC core voltage of 1.5 V.

General Flash Programming Information

4 July 2010

Types of Programming for Flash Devices

The number of devices to be programmed will influence the optimal programming methodology. Those

available are listed below:

• In-system programming

– Using a progra mme r

– Using a microprocessor or microcontroller

• Device programmers

– Single-site programme rs

– Multi-site programmers, batch programmers, or gang programmers

– Automated production (robo tic) programmers

• Volume programming services

– Microsemi in-house programming

– Programming centers

In-System Programming

Device Type Supported: Flash

ISP refers to programming the FPGA after it has been mounted on the system printed circuit board. The

FPGA may be preprogrammed and later reprogrammed using ISP.

The advantage of using ISP is the ability to update the FPGA design many times without any changes to

the board. This elimin ates the requirement of using a socket for the FPGA, saving cost and improving

reliability. It also reduces programming hardware expense s, as the ISP methodology is die-/package-

independent.

There are two methods of in-system programming: external and internal.

• Programmer ISP—Refer to the "In-System Programming (ISP) of Microsemi’s Low Power Flash

Devices Using FlashPro4/3/3X" section on page 295 for more information.

Using an external programmer and a cable, the device can be programmed through a header on

the system board. In Microsemi SoC Products Group documentation, this is referred to as

external ISP. Microsemi provides FlashPro4, FlashPro3, FlashPro Lite, or Silicon Sculptor 3 to

perform external ISP. Note that Silicon Sculptor II and Silicon Sculptor 3 can only provide ISP for

ProASIC and ProASICPLUS® families, not for SmartFusion, Fusion, IGLOO, or ProASIC3. Silicon

Sculptor II and Silicon Sculptor 3 can be used for programming ProASIC and ProASICPLUS

devices by using an adapter module (part number SMPA-ISP-ACTEL-3).

– Advantages: Allows local control of programming and data files for maximum security. The

programming algorithms and hard ware are available from Microsemi. The only hardw are

required on the board is a programming header.

– Limitations: A negligible board space requirement for the programming header and JTAG

signal routing

• Microprocessor ISP—Refer to the "Microprocessor Programming of Microsemi’s Low Power

Flash Devices" chapter of an appropriate FPGA fabric user’s guide for more information.

Using a microprocessor and an external or internal memory, you can store the program in

memory and use the microprocessor to perform the programming. In Microsemi documentation,

this is referred to as internal ISP. Both the code for the programming algorithm and the FPGA

programming file must be stored in memory on the board. Programming voltages must also be

generated on the board.

– Advantages: The programming code is stored in the system memory . An external programmer

is not required during programming.

– Limitations: This is the approach that requires the most design work, since some way of

getting and/or storing the data is needed; a system interface to the device must be designed;

and the low-level API to the programming firmware must be written and linked into the code

provided by Microsemi. While there are benefi ts to this methodology, serious thought and

planning should go into the decis ion.

Programming Flash Devices

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Device Programmers

Single Device Programmer

Single device programmers are used to program a device before it is mounted on the system boa rd.

The advantage of using device programmers is that no programming hardware is required on the system

board. Therefore, no additional components or board space are required.

Adapter modules are purchased with sing le device programmers to support the FPGA packages used.

The FPGA is placed in the adapter module and the programming software is run from a PC. Microsemi

supplies the programming software for all of th e Microsemi programmers. The software allows for the

selection of the correct die/package and programming files. It will then program and verify the device.

• Single-site programmers

A single-site programmer programs one device at a time. Microsemi offers Silicon Sculptor 3, built

by BP Microsystems, as a single-site programmer . Silicon Sculptor 3 and associated software are

available only from Microsemi.

– Advantages: Lower cost than multi-site programmers. No additional overhe ad for

programming on the system board. Allows local control of programming and data files for

maximum security. Allows on-demand programming on-site.

– Limitations: Only programs one device at a time.

• Multi-site programmers

Often referred to as batch or gang programmers, multi-site programmers can program multiple devices at

the same time using the same programming file. This is often used for large volume programming and by

programming houses. T he sites often have independent processors and memory enabling the sites to

operate concurrently, meaning each site may start programming the same file independently. This

enables the operator to change one device while the other sites continue programming, which increases

throughput. Multiple adapter module s for the same package are required when using a multi-site

programmer . Silicon Sculptor I, II, and 3 programmers can be cascaded to program multiple devices in a

chain. Multi-site programmers, such as the BP2610 and BP2710, can also be purchased from BP

Microsystems. When using BP Microsystems multi-site programmers, users must use programming

adapter modules available only from Microsemi. Visit the Microsemi SoC Products Group website to view

the part numbers of the desired adapter module:

http://www.microsemi.com/soc/products/hardware/program_debug/ss/modules.aspx.

Also when using BP Microsystems programmers, customers must use Microsemi

programming software to ensure the best programming result will occur.

– Advantages: Provides the capability of programming multiple devices at the same time. No

additional overhead for programming on the system board. Allows local control of

programming and data files for maximum security.

– Limitations: More expensive than a single-site programmer

• Automated production (robotic) programmers

Automated production programmers are based on multi-site programmers. Th ey consist of a large input

tray holding multiple parts and a robotic arm to select and pl ace parts into appropriate programming

sockets automatically. When the programming of the parts is complete, the parts are removed and

placed in a finished tray. The automated programmers are often used in volume programming houses to

program parts for which the programming time is small. BP Microsystems part number BP4710, BP4610,

BP3710 MK2, and BP3610 are available for this purpose. Auto programmers cannot be used to program

RTAX-S devices.

Where an auto-programmer is used, the appropriate open-top adapter module from BP Microsystems

must be used.

General Flash Programming Information

6 July 2010

Volume Programming Services

Device Type Supported: Flash and Antifuse

Once the design is stable for applications with large production volumes, preprogrammed devices can be

purchased. Table 2 describes the volume programming services.

Advantages: As programming is outsourced, this solution is easier to implement than creating a

substantial in-house programming capability. As programming houses specialize in large-volume

programming, this is often the most cost-e ffective solution.

Limitations: There are some logistical issues with the use of a programming service provider , such as the

transfer of programming files and the approval of First Articles. By definition, the programming file must

be released to a third-party programming house. Nondisclosure agreements (NDAs) can be signed to

help ensure data protection; however, for extremely security-conscious designs, this may not be an

option.

• Microsemi In-House Programming

When purchasing Microsemi devices in volume, IHP can be requested as part of the purchase. If

this option is chosen, there is a small cost adder for each device programmed. Each device is

marked with a special mark to distinguish it from blank parts. Programming files for the design will

be sent to Microsemi. Sample parts with the design programmed, First Articles, will be returned

for customer approval. Once approval of First Articles has been received, Microsemi will proceed

with programming the remainder of the order. To request Microsemi IHP, contact your local

Microsemi representative.

• Distributor Programming Centers

If purchases are made through a distributor, many distributors will provide programming for their

customers. Consult with your preferred distributor about this option.

Table 2 • Volume Programming Services

Programmer Vendor Availability

In-House Programming Microsemi Contact Microsemi Sales

Distributor Programming Centers Memec Unique Contact Distribution

Independent Programming Cen te rs Various Contact Vendor

Programming Flash Devices

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Programming Solutions

Details for the available programmers can be found in the programmer user's guides listed in the

"Related Documents" section on page 11.

All the programmers except FlashPro4 , Fl ashPro3, FlashPro Lite, and FlashPro require adapter

modules, which are designed to support device packages. All modules are listed on the Microsemi SoC

Products Group website at

http://www.microsemi.com/soc/products/hardware/program_debug/ss/modules.aspx. They are not listed

in this document, since this list is updated frequently with new package options and any upgrades

required to improve programming yield or support new families.

Table 3 • Programming Solutions

Programmer Vendor ISP Single

Device Multi-Device Availability

FlashPro4 Microsemi Only Yes Yes1Available

FlashPro3 Microsemi Only Yes Yes1Available

FlashPro Lite2Microsemi Only Yes Yes1Available

FlashPro Microsemi Only Yes Yes1Discontinued

Silicon Sculptor 3 Microsemi Ye s 3Yes Cascade option

(up to two) Available

Silicon Sculptor II Microsemi Yes3Yes Cascade option

(up to two) Available

Silicon Sculptor Microsemi Yes Yes Casca de option

(up to four) Discontinued

Sculptor 6X Microsemi No Yes Yes Discontinued

BP MicroProgrammers BP

Microsystems No Yes Yes Contact BP

Microsystems at

www.bpmicro.com

Notes:

1. Multiple devices can be connected in the same JTAG chain for programming.

2. If FlashPro Lite is used for programming, the programmer derives all of its power from the target pc

board's VDD supply. The FlashPro Lite's VPP and VPN power supplies use the target pc board's

VDD as a power source. The target pc board must supply power to both the VDDP and VDD power

pins of the ProASICPLUS device in addition to supplying VDD to the FlashPro Lite. The target pc

board needs to provide at least 500 mA of current to the FlashPro Lite VDD connection for

programming.

3. Silicon Sculptor II and Silicon Sculp to r 3 can only provide ISP for ProASIC and ProASICPLUS

families, not for Fusion, IGLOO, or Pro ASIC3 devices.

General Flash Programming Information

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Programmer Ordering Codes

The products shown in Table 4 can be ordered through Microsemi sales and will be shipped directly from

Microsemi. Products can also be ordered from Microsemi distributors, but will still be shipped directly

from Microsemi. Table 4 includes ordering codes for the full kit, as well as codes for replacement items

and any related hardware. Some additional products can be purchased from external suppliers for use

with the programmers. Ordering codes for adapte r modules used with Silicon Sculptor are available at

http://www.microsemi.com/soc/products/hardware/program_debug/ss/modules.aspx.

Programmer Device Support

Refer to www.microsemi.com/soc for the curre nt information on programmer and device support.

Certified Programming Solutions

The Microsemi-certified programmers for flash devices are FlashPro4, FlashPro3 , Fl ashPro Lite,

FlashPro, Silicon Sculptor II, Silicon Sculptor 3, and any programmer that is built by BP Microsystems. All

other programmers are cons idered noncertified programmers.

• FlashPro4, FlashPro3, FlashPro Lite, FlashPro

The Microsemi family of FlashPro device programmers provides in-system programming in an

easy-to-use, compact system that supports all flash families. Whether programming a board

containing a single device or multiple devices connected in a chain, the Microsemi line of

FlashPro programmers enables fast programming and reprogramming. Programming with the

FlashPro series of programmers saves board space and money as it eliminates the need for

sockets on the board. There are no built-in algo rithms, so there is no delay between product

release and programming support. The FlashPro programmer is no longer available.

• Silicon Sculptor 3, Silicon Sculptor II

Silicon Sculptor 3 and Silicon Sculp to r II are rob ust, compact, single-device programmers with

standalone software for the PC. They are designed to enable concurrent programming of multiple

units from the same PC with speeds equivalent to or faster than previous Microsemi

programmers.

• Noncertified Programmers

Microsemi does not test programming solutions from other vendors, and DOES NOT gua rantee

programming yield. Also, Microsemi will not perform any failure analysis on devices programmed

on non-certified programmers. Please refer to the Programming and Functional Failure

Guidelines document for more information.

Table 4 • Programming Ordering Codes

Description Vendor Ordering Code Comment

FlashPro4 ISP

programmer Microsemi FLASHPRO 4 Uses a 2×5, RA male header connector

FlashPro Li te IS P

programmer Microsemi FLASHPRO LITE Supports small programming header or

large header through header converter

(not included)

Silicon Sculptor 3 Microsemi SILICON-SCULPTOR 3 USB 2.0 high-speed production

programmer

Silicon Sculptor II Microsemi SILICON-SCULPTOR II Requires add-on adapter modules to

support devices

Silicon Sculptor ISP

module Microsemi SMPA-ISP-ACTEL-3-KIT Ships with both large and small header

support

ISP cable for small

header Microsemi ISP-CABLE-S Supplied with SMPA-ISP-ACTEL-3-KIT

ISP cable for large

header Microsemi PA-ISP-CABLE Supplied with SMPA-ISP-ACTEL-3-KIT

Programming Flash Devices

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• Programming Centers

Microsemi programming hardware pol icy also applies to programming centers. Microsemi

expects all programming centers to use certified programmers to program Microsemi devices. If a

programming center uses noncertified programmers to program Microsemi devices, the

"Noncertified Programmers" policy applies.

Important Programming Guidelines

Preprogramming Setup

Before programming, several ste ps are required to ensure an optimal pr ogramming yield.

Use Proper Handling and Electrostatic Discharge (ESD) Precautions

Microsemi FPGAs are sensitive electronic devices that are susceptible to damage from ESD and other

types of mishandling. For more information about ESD, refer to the Quality and Relia bility Guide,

beginning with page 41.

Use the Latest Version of the Designer Software to Generate Your

Programming File (recommended)

The files used to program Microsemi flash devices (*.bit, *.stp, *.pdb) contain important information about

the switches that will be programmed in the FPGA. Find the latest version and corresponding release

notes at http://www.microsemi.com/soc/download/software/designer/. Also, programming files must

always be zipped during file transfer to avoid the possibility of file corru ption.

Use the Latest Version of the Programming Software

The programming software is frequently updated to accommodate yield enhancements in FPGA

manufacturing. These updates ensure maximum pro gramming yield and minimum programming times.

Before programming, always check the ve rsion of software being used to en su re it is the most recent.

Depending on the programming software, refer to one of the following:

•FlashPro: http://www.microsemi.com/soc/download/program_debug/flashpro/

• Silicon Sculptor: http://www.microsemi.com/soc/download/program_debug/ss/

Use the Most Recent Adapter Module with Silicon Sculptor

Occasionally, Microsemi makes modificatio ns to the adapter modules to improve programming yields

and programming times. To identify the latest version of each module before programming, visit

http://www.microsemi.com/soc/products/hardware/program_debug/ss/modules.aspx.

Perform Routine Hardware Self-Diagnostic Test

• Adapter modules must be regula rly cleaned. Adapter modules need to be inserted carefully into

the programmer to make sure the DIN connectors (pins at the back side) are not damaged.

• FlashPro

The self-test is only applicable when programming with FlashPro and FlashPro3 programmers. It

is not supported with FlashPro4 or FlashPro Lite. To run the self-diagnostic test, fo llow the

instructions given in the "Performing a Self-Test" se ction of

http://www.microsemi.com/soc/documents/FlashPro_UG.pdf.

• Silicon Sculptor

The self-diagnostic test verifies correct operation of the pin drivers, power supply, CPU, memory,

and adapter module. This test should be performed with an adapter module installed and before

every programming session. At minimum, the test must be executed every week. To perform self-

diagnostic testing using the Silicon Sculptor software, perform the following steps, depending on

the operating system:

– DOS: From anywhere in the software, type ALT + D.

– Windows: Click Device > choose Actel Diagnostic > select the Test tab > click OK.

Silicon Sculptor programmers must be verified annually for calibration. Refer to the Silicon

Sculptor Verification of Calibration Work Instruction document on th e w eb s i te .

Important Programming Guidelines

10 July 2010

Signal Integrity While Using ISP

For ISP of flash devices, customers are expected to follow the board-level guidelines provided on the

Microsemi SoC Products Group website. These guidelines are discussed in the datasheets and

application notes (refer to the “Related Documents” section of the datasheet for application note links).

Customers are also expected to troubleshoot board- level signal integrity issues by measurin g voltages

and taking oscilloscope plots.

Programming Failure Allowances

Microsemi has strict policies regarding pro gramming failure allowances. Please refer to Programming

and Functional Failure Guidelines on the Microsemi SoC Products Group website for details.

Contacting the Customer Support Group

Highly skilled engineers staff the Customer Applications Center from 7:00 A.M. to 6:00 P.M., Pacific time,

Monday through Friday. You can contact the center by one of the following methods:

Electronic Mail

You can communicate your technical questions to our email address and receive answers back by email,

fax, or phone. Also, if you have design problems, you can email your design files to receive assistance.

Microsemi monitors the email account throughout the day. When sending your request to us, please be

sure to include your full name, company name, and contact information for efficient processing of your

request. The technical support email address is soc_tech@microsemi.com.

Telephone

Our Technical Support Hotline answers all calls. The center retrieves information, such as your name,

company name, telephone number, and question. Once this is done, a case number is assi gned. Then

the center forwards the information to a queu e where the first available applications engineer receives

the data and returns your call. The phone hou rs are from 7:00 A.M. to 6:00 P.M., Pacific time, Monday

through Friday.

The Customer Applications Center number is (800) 262-1060.

European customers can call +44 (0) 1256 305 600 .

Programming Flash Devices

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