■ Features
Mini-flat Half Pitch Package,
AC Input Photocoupler
1. 4-pin Mini-flat Half pitch package (Lead pitch :
1.27mm)
2. Double transfer mold package (Ideal for Flow
Soldering)
3. AC input type
4. High collector-emitter voltage (VCE : 80V)
5. Isolation voltage between input and output (Viso(rms):
2.5kV)
6. Lead-free and RoHS directive compliant
■ Description
PC3H4J00000F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin Mini-flat, half pitch type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter voltage is 80V and CTR is 20% to
400% at input current of
±
1mA.
1Sheet No.: D2-A01502EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC3H4)
2. Approved by VDE, DIN EN60747-5-2(
*
) (as an
option), file No. 40009162 (as model No. PC3H4)
3. Package resin : UL flammability grade (94V-0)
(
*
)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Agency approvals/Compliance
PC3H4J00000F
Series
*
4-channel package type is also available.
(model No. PC3Q64QJ000F)
PC3H4J00000F Series
1. Programmable controllers
■ Applications
■ Internal Connection Diagram
Anode / Cathode
Cathode / Anode
Emitter
Collector
11
2
3
4
2
4
3
2
Sheet No.: D2-A01502EN
PC3H4J00000F Series
1
SHARP mark "S" Rank mark
Date code
2.6±0.3
1.27
±0.25
23H4
4
3
4.4±0.2
0.4±0.1
5.3±0.3
(1.7)
0.2±0.05
7.0+0.2
−0.7
0.5+0.4
−0.2
0.1±0.1 2.0±0.2
Epoxy resin
Primary side mark
■ Outline Dimensions (Unit : mm)
Product mass : approx. 0.05gProduct mass : approx. 0.05g
Plating material : SnCu (Cu : TYP. 2%)
*( ) : Reference Dimensions *( ) : Reference Dimensions
1
Primary side mark
SHARP mark "S"
Date code
2.6±0.3
1.27
±0.25
23H4
4
3
4.4±0.2
0.4±0.1
5.3±0.3
(1.7)
0.2±0.05
7.0+0.2
−0.7
0.5+0.4
−0.2
0.1±0.1 2.0±0.2
Epoxy resin
4
VDE
Indenfication mark
Rank mark
VDE option
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
3
repeats in a 20 year cycle
Sheet No.: D2-A01502EN
Rank mark
Refer to the Model Line-up table
Country of origin
Japan
PC3H4J00000F Series
Sheet No.: D2-A01502EN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Terminal capacitance
Collector dark current
Transfer
charac-
teristics
Emitter-collector breakdown voltage
Collector current
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
MIN.
−
−
−
6
0.2
−
5×1010
−
−
−
TYP.
1.2
30
−
−
−
−
0.1
1×1011
0.6
4
3
MAX.
1.4
250
100
−
−
4.0
0.2
−
1.0
18
18
Unit
V
V
pF
nA
V
mA
V
Ω
pF
µs
µs
Symbol
VF
Ct
ICEO
BVCEO
BVECO
IC
VCE (sat)
Cf
tr
tf
RISO
Response time Rise time
Fall time
Input
Output
IF=±20mA
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=±1mA, VCE=5V
DC500V, 40 to 60%RH
VCE=2V, IC=2mA, RL=100Ω
V=0, f=1MHz
IF=±20mA, IC=1mA
80
(Ta=25˚C)
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current A
Power dissipation mW
Output
Collector-emitter voltage
V
Emitter-collector voltage
V
Collector current mA
Collector power dissipation
mW
Total power dissipation mW
*2 Isolation voltage
Operating temperature ˚C
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VCEO
VECO
IC
PC
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute
*3 For 10s
Rating
±50
±1
70
80
6
50
150
170
−30 to +100
−40 to +125
260
2.5 kV
4
PC3H4J00000F Series
Sheet No.: D2-A01502EN
■ Model Line-up
IC [mA]
(I
F
=±1mA, V
CE
=5V, T
a
=25˚C)
Taping
3 000pcs/reel
with or without
A
0.2 to 4.0
0.5 to 1.5
Package
DIN
EN60747-5-2
Model No.
Rank mark
PC3H4J00000F
PC3H4AJ0000F
PC3H4YJ0000F
-
Approved
PC3H4Y1J000F
5
Please contact a local SHARP sales representative to inquire about production status.
PC3H4J00000F Series
Sheet No.: D2-A01502EN
Total power dissipation Ptot (mW)
0
50
100
150
200
250
170
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Forward current IF (mA)
0
10
20
30
40
50
−30 0 25 75 100 1255550
Ambient temperature Ta (˚C)
Fig.1 Forward Current vs. Ambient
Temperature
0
20
40
60
70
80
100
−30 0 25 75 100 1255550
Ambient temperature Ta (˚C)
Diode power dissipation P (mW)
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
Collector power dissipation PC (mW)
0
200
150
100
50
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
6
Forward voltage VF (V)
75˚C 25˚C
0˚C
00.5 1 1.5 2
1
0.1
10
100
−30˚C
100˚C
Ta=50˚C
Forward current IF (mA)
Fig.6 Forward Current vs. Forward Voltage
Pulse width≤100µs
Ta=25˚C
Peak forward current IFM (mA)
10 000
1 000
100
10
10−310−210−11
Duty ratio
Fig.5 Peak Forward Current vs. Duty Ratio
PC3H4J00000F Series
Sheet No.: D2-A01502EN
Relative current transfer ratio (%)
0
150
100
50
−40 0−20 20 40 60 80 100
Ambient temperature Ta (˚C)
IF=1mA,VCE=5V
IF=5mA,VCE=5V
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Collector-emitter saturation
voltage VCE (sat) (V)
0
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
−30 0 20 40 60 80 100
Ambient temperature Ta (˚C)
IF=20mA
IC=1mA
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
7
Collector current IC (mA)
0
50
40
30
20
10
0246810
Collector-emitter voltage VCE (V)
1mA
5mA
10mA
20mA
IF=30mA
PC (MAX.) Ta=25˚C
Fig.8 Collector Current vs. Collector-emitter
Voltage
Current transfer ratio CTR (%)
0
500
400
300
200
100
0.1 1 10 100
Forward current IF (mA)
VCE=5V
Ta=25˚C
Fig.7 Current Transfer Ratio vs. Forward
Current
Collector dark current ICEO (A)
Ambient temperature Ta (˚C)
806040200−30 100
10−5
10−6
10−7
10−8
10−9
10−10
10−11
VCE=50V
Fig.11 Collector Dark Current vs. Ambient
Temperature
Response time (µs)
0.1
100
1 000
10
1
0.01 0.1 1 10 100
tr
td
tf
ts
Load resistance RL (kΩ)
VCE=2V
IC=2mA
Ta=25˚C
Fig.12 Response Time vs. Load Resistance
PC3H4J00000F Series
Sheet No.: D2-A01502EN
8
10%
Input
Output
Input Output
90%
ts
td
VCC
RDRL
tf
tr
Please refer to the conditions in Fig.12.
VCE
Fig.13 Test Circuit for Response Time
0
10
8
6
4
2
0246810
Forward current IF (mA)
7mA
5mA
3mA
1mA
Collector-emitter saturation voltage
VCE (sat) (V)
Ta=25˚C
IC=0.5mA
Fig.14 Collector-emitter Saturation Voltage
vs. Forward Current
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
PC3H4J00000F Series
Sheet No.: D2-A01502EN
■ Design Considerations
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
1.5
1.27
0.8
6.3
(Unit : mm)
● Design guide
PC3H4J00000F Series
Sheet No.: D2-A01502EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC3H4J00000F Series
Sheet No.: D2-A01502EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
11
PC3H4J00000F Series
Sheet No.: D2-A01502EN
12
■ Package specification
● Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
E
I
DJ
G
L
B
H
A
C
H
5˚
MAX.
A
12.0±0.3
B
5.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
7.5±0.1
I
0.3±0.05
J
2.3±0.1
K
3.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
L
φ1.6+0.1
−0
Dimensions List (Unit : mm)
a
c
e
g
f
b
d
a
330
b
13.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Dimensions List (Unit : mm)
Pull-out direction
[Packing : 3 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC3H4J00000F Series
13
Sheet No.: D2-A01502EN
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
■ Important Notices
PC3H4J00000F Series
[E213]
