BGX13S22GA-V21R - SILICON LABS

BGX13S Blue Gecko Xpress Bluetooth ®

SiP Module Data Sheet

The BGX13S Blue Gecko Xpress Bluetooth ® SiP Module family of serial replacement

modules eliminate Bluetooth firmware development complexity with a serial interface that

can operate as a raw data stream or control the device through a command API. The

BGX13S can facilitate a device-to-device cable replacement link or communicate with

mobile devices through the Xpress Bluetooth mobile library. The device integrates a

Bluetooth 5 compliant stack to future-proof applications as Bluetooth 5 adoption increa-

ses.

The device is targeted for applications where ultra-small size, reliable high performance

RF, low-power consumption, and fast time-to-market are key requirements. At 6.5 × 6.5

× 1.4 mm the BGX13S module fits applications where size is a constraint. BGX13S also

integrates a high-performance, ultra-robust antenna, which requires minimal PCB, plas-

tic, and metal clearance. The total PCB area required by BGX13S is only 51 mm2. The

BGX13S has Bluetooth, CE, full FCC, Japan and South-Korea certifications.

BGX13S SIP modules can be used in a wide variety of applications:

KEY FEATURES

• Bluetooth 5 low energy compliant

•Serial interface with hardware flow control

• GPIO control through command API

• Integrated antenna

• TX power up to 8 dBm

• Encrypted bonding and connectivity

• Operates as central or peripheral

• Onboard Bluetooth stack

• Centralized OTA through mobile app

library

• Health, sports and wellness devices

•Industrial, home and building automation

• Smart phone, tablet and PC accessories

RadioBluetooth

controller

Serial interface

Command

parser

Raw data

stream

buffers

RX/TX and flow

control

Bluetooth 5

compliant

stack

Timers

OTA

manager

Radio

transceiver

Chip

antenna

Matching

network

GPIO

control

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1. Ordering Information

Table 1.1. Ordering Information

Ordering Code Protocol Stack

Frequency Band

@ Max TX Power Antenna GPIO Packaging

BGX13S22GA-V21R Bluetooth Low

Energy

2.4 GHz @ 8 dBm Built-in 8 Reel

BGX13S22GA-V21 Bluetooth Low

Energy

2.4 GHz @ 8 dBm Built-in 8 Tray

BGX13S Blue Gecko Xpress Bluetooth ® SiP Module Data Sheet

Ordering Information

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Table of Contents

1. Ordering Information ............................2

2. Electrical Specifications ...........................5

2.1 Electrical Characteristics ..........................5

2.1.1 Absolute Maximum Ratings ........................5

2.1.2 Operating Conditions ..........................6

2.1.3 Power Consumption...........................7

2.1.4 2.4 GHz RF Transceiver Characteristics ....................8

2.1.5 Non-Volatile Configuration Storage......................12

2.1.6 General-Purpose I/O (GPIO) ........................13

3. Typical Connection Diagrams ........................15

3.1 Typical BGX13S Connections .........................15

4. Layout Guidelines ............................16

4.1 Layout Guidelines .............................16

4.2 Effect of PCB Width ............................17

4.3 Effect of Plastic and Metal Materials .......................18

4.4 Effects of Human Body ...........................18

4.5 2D Radiation Pattern Plots ..........................19

5. Pin Definitions ..............................21

5.1 BGX13S Device Pinout ...........................21

6. Functional Overview ...........................24

6.1 Introduction ...............................24

6.2 Communication Use Cases..........................24

6.3 Embedded Interface ............................24

6.4 Command Mode and Streaming Mode ......................24

6.5 Command API ..............................25

6.6 GPIO Control ..............................25

6.7 Device Configuration ............................25

6.8 Security Features .............................25

6.9 OTA .................................25

6.10 Direct Test Mode Support ..........................25

7. Package Specifications ..........................26

7.1 BGX13S Package Dimensions ........................26

7.2 BGX13S Recommeded PCB Land Pattern ....................29

7.3 BGX13S Package Marking..........................32

8. Soldering Recommendations ........................33

8.1 Soldering Recommendations .........................33

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9. Certifications ..............................34

9.1 Certifications Pending ...........................34

10. Revision History............................. 35

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2. Electrical Specifications

2.1 Electrical Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

•Typical values are based on TAMB = 25 °C and VBAT = 3.3 V, by production test and/or technology characterization.

• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-

er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.

• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,

unless stated otherwise.

Refer to for more details about operational supply and temperature limits.

2.1.1 Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of

the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure

to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-

bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.

Table 2.1. Absolute Maximum Ratings

Parameter Symbol Test Condition Min Typ Max Unit

Storage temperature range TSTG -40 — 85 °C

Voltage on any supply pin VDDMAX -0.3 — 3.8 V

Voltage ramp rate on any

supply pin

VDDRAMPMAX — — 1 V / µs

DC voltage on any GPIO pin VDIGPIN -0.3 — IOVDD+0.3 V

Maximum RF level at input PRFMAX2G4 — — 10 dBm

Total current into supply pins IVDDMAX Source — — 200 mA

Total current into VSS

ground lines

IVSSMAX Sink — — 200 mA

Current per I/O pin IIOMAX Sink — — 50 mA

Source — — 50 mA

Current for all I/O pins IIOALLMAX Sink — — 200 mA

Source — — 200 mA

Junction temperature TJ-40 — 105 °C

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Electrical Specifications

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2.1.2 Operating Conditions

The following subsections define the operating conditions for the module.

2.1.2.1 General Operating Conditions

Table 2.2. General Operating Conditions

Parameter Symbol Test Condition Min Typ Max Unit

Operating ambient tempera-

ture range

TA-40 25 85 °C

VBATT operating supply

voltage

VVBATT 2.4 3.3 3.8 V

VBATT current IVBATT — — 200 mA

IOVDD operating supply volt-

age

VIOVDD 1.62 — VVBATT V

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Electrical Specifications

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2.1.3 Power Consumption

Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the

worst conditions across process variation at T = 25 °C.

Table 2.3. Power Consumption

Parameter Symbol Test Condition Min Typ Max Unit

Active supply current, Un-

connected, Idle

IACTIVE_IDLE Baud rate ≤ 9600 bps — 3 — µA

Baud rate > 9600 bps — 3.25 — mA

Active supply current, Adver-

tising

IACTIVE_ADV Interval = 546.25 ms, Baud rate ≤

9600 bps

— 90 — µA

Interval = 20 ms, Baud rate ≤

9600 bps

— 2 — mA

Interval = 546.25 ms, Baud rate >

9600 bps

— 3.3 — mA

Interval = 20 ms, Baud rate >

9600 bps

— 4.7 — mA

Active supply current, Con-

nected, 15 ms Interval

IACTIVE_CONN Idle, Baud Rate ≤ 9600 bps — 660 — µA

TX/RX (acknowledged) at highest

throughput, Baud Rate ≤ 9600

bps

— 3.5 — mA

TX/RX (unacknowledged) at high-

est throughput, Baud Rate ≤ 9600

bps

— 4 — mA

Idle, Baud Rate > 9600 bps — 3.5 — mA

TX/RX (acknowledged) at highest

throughput, Baud Rate > 9600

bps

— 5.25 — mA

TX/RX (unacknowledged) at high-

est throughput, Baud Rate > 9600

bps

— 7 — mA

Supply current in low power

mode

ILPM Radio disabled — 3 — µA

Radio enabled, Advertising, Inter-

val = 546.25 ms

— 90 — µA

Radio enabled, Advertising, Inter-

val = 20 ms

— 2 — mA

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Electrical Specifications

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2.1.4 2.4 GHz RF Transceiver Characteristics

2.1.4.1 RF Transmitter General Characteristics for 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 2.4. RF Transmitter General Characteristics for 2.4 GHz Band

Parameter Symbol Test Condition Min Typ Max Unit

Maximum TX power1POUTMAX — 7.8 — dBm

Minimum active TX Power POUTMIN CW -30 — dBm

Output power step size POUTSTEP -5 dBm< Output power < 0 dBm — 1 — dB

0 dBm < output power <

POUTMAX

— 0.5 — dB

Output power variation vs

supply at POUTMAX

POUTVAR_V 2.4 V < VVBATT < 3.3 V — 2.1 — dB

Output power variation vs

temperature at POUTMAX

POUTVAR_T From -40 to +85 °C — 1.7 — dB

Output power variation vs RF

frequency at POUTMAX

POUTVAR_F Over RF tuning frequency range — 0.3 — dB

RF tuning frequency range FRANGE 2400 — 2483.5 MHz

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

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Electrical Specifications

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2.1.4.2 RF Receiver General Characteristics for 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 2.5. RF Receiver General Characteristics for 2.4 GHz Band

Parameter Symbol Test Condition Min Typ Max Unit

RF tuning frequency range FRANGE 2400 — 2483.5 MHz

Receive mode maximum

spurious emission

SPURRX 30 MHz to 1 GHz — -57 — dBm

1 GHz to 12 GHz — -47 — dBm

Max spurious emissions dur-

ing active receive mode, per

FCC Part 15.109(a)

SPURRX_FCC 216 MHz to 960 MHz, Conducted

Measurement

— -55.2 — dBm

Above 960 MHz, Conducted

Measurement

— -47.2 — dBm

Level above which

RFSENSE will trigger1

RFSENSETRIG CW at 2.45 GHz — -24 — dBm

Level below which

RFSENSE will not trigger1

RFSENSETHRES CW at 2.45 GHz — -50 — dBm

Note:

1. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

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Electrical Specifications

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2.1.4.3 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 2.6. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Parameter Symbol Test Condition Min Typ Max Unit

Max usable receiver input

level, 0.1% BER

SAT Signal is reference signal1. Packet

length is 20 bytes.

— 10 — dBm

Sensitivity, 0.1% BER SENS Signal is reference signal1. Using

DC-DC converter.

— -94.1 — dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1.

— -93.8 — dBm

Signal to co-channel interfer-

er, 0.1% BER

C/ICC Desired signal 3 dB above refer-

ence sensitivity.

— 9.0 — dB

N+1 adjacent channel selec-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

reference signal at -67 dBm

C/I1+ Interferer is reference signal at +1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

— -3.3 — dB

N-1 adjacent channel selec-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

reference signal at -67 dBm

C/I1- Interferer is reference signal at -1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

— -1.6 — dB

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I2Interferer is reference signal at ± 2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

— -42.0 — dB

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I3Interferer is reference signal at ± 3

MHz offset. Desired frequency

2404 MHz ≤ Fc ≤ 2480 MHz

— -46.4 — dB

Selectivity to image frequen-

cy, 0.1% BER. Desired is ref-

erence signal at -67 dBm

C/IIM Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

— -42.0 — dB

Selectivity to image frequen-

cy ± 1 MHz, 0.1% BER. De-

sired is reference signal at

-67 dBm

C/IIM+1 Interferer is reference signal at im-

age frequency ± 1 MHz with 1

MHz precision

— -47.1 — dB

Intermodulation performance IM Per Core_4.1, Vol 6, Part A, Sec-

tion 4.4 with n = 3

— -18.4 — dBm

Note:

1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

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Electrical Specifications

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2.1.4.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 2.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Parameter Symbol Test Condition Min Typ Max Unit

Max usable receiver input

level, 0.1% BER

SAT Signal is reference signal1. Packet

length is 20 bytes.

— 10 — dBm

Sensitivity, 0.1% BER SENS Signal is reference signal1. Using

DC-DC converter.

— -90.2 — dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1.

— -89.9 — dBm

Signal to co-channel interfer-

er, 0.1% BER

C/ICC Desired signal 3 dB above refer-

ence sensitivity.

— 8.6 — dB

N+1 adjacent channel selec-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

reference signal at -67 dBm

C/I1+ Interferer is reference signal at +2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

— -7.6 — dB

N-1 adjacent channel selec-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

reference signal at -67 dBm

C/I1- Interferer is reference signal at -2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

— -11.4 — dB

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I2Interferer is reference signal at ± 4

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

— -40.3 — dB

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I3Interferer is reference signal at ± 6

MHz offset. Desired frequency

2404 MHz ≤ Fc ≤ 2480 MHz

— -45.1 — dB

Selectivity to image frequen-

cy, 0.1% BER. Desired is ref-

erence signal at -67 dBm

C/IIM Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

— -7.6 — dB

Selectivity to image frequen-

cy ± 2 MHz, 0.1% BER. De-

sired is reference signal at

-67 dBm

C/IIM+1 Interferer is reference signal at im-

age frequency ± 2 MHz with 2

MHz precision

— -40.30 — dB

Intermodulation performance IM Per Core_4.1, Vol 6, Part A, Sec-

tion 4.4 with n = 3

— -18.4 — dBm

Note:

1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

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Electrical Specifications

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2.1.5 Non-Volatile Configuration Storage

Table 2.8. Non-Volatile Configuration Storage

Parameter Symbol Test Condition Min Typ Max Unit

Update cycles before failure UC 10000 — — cycles

Data retention RET 10 — — years

Supply voltage during update VDD 2.4 — 3.6 V

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Electrical Specifications

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2.1.6 General-Purpose I/O (GPIO)

Table 2.9. General-Purpose I/O (GPIO)

Parameter Symbol Test Condition Min Typ Max Unit

Input low voltage1VIL GPIO pins — — IOVDD*0.3 V

Input high voltage1VIH GPIO pins IOVDD*0.7 — — V

Output high voltage relative

to IOVDD

VOH Sourcing 3 mA, IOVDD ≥ 3 V,

Drive Strength = Weak

IOVDD*0.8 — — V

Sourcing 1.2 mA, IOVDD ≥ 1.62

Drive Strength = Weak

IOVDD*0.6 — — V

Sourcing 20 mA, IOVDD ≥ 3 V,

Drive Strength = Strong

IOVDD*0.8 — — V

Sourcing 8 mA, IOVDD ≥ 1.62 V,

Drive Strength = Strong

IOVDD*0.6 — — V

Output low voltage relative to

IOVDD

VOL Sinking 3 mA, IOVDD ≥ 3 V,

Drive Strength = Weak

— — IOVDD*0.2 V

Sinking 1.2 mA, IOVDD ≥ 1.62 V,

Drive Strength = Weak

— — IOVDD*0.4 V

Sinking 20 mA, IOVDD ≥ 3 V,

Drive Strength = Strong

— — IOVDD*0.2 V

Sinking 8 mA, IOVDD ≥ 1.62 V,

Drive Strength = Strong

— — IOVDD*0.4 V

Input leakage current IIOLEAK All GPIO except LFXO pins, GPIO

≤ IOVDD

— 0.1 30 nA

LFXO Pins, GPIO ≤ IOVDD — 0.1 50 nA

I/O pin pull-up/pull-down re-

sistor2

RPUD 30 40 65 kΩ

Pulse width of pulses re-

moved by the glitch suppres-

sion filter

tIOGLITCH 15 25 45 ns

Output fall time, From 70%

to 30% of VIO

tIOOF CL = 50 pF,

Drive Strength = Strong

— 1.8 — ns

CL = 50 pF,

Drive Strength = Weak

— 4.5 — ns

Output rise time, From 30%

to 70% of VIO

tIOOR CL = 50 pF,

Drive Strength = Strong

— 2.2 — ns

CL = 50 pF,

Drive Strength = Weak

— 7.4 — ns

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Electrical Specifications

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Parameter Symbol Test Condition Min Typ Max Unit

Note:

1. GPIO input threshold are proportional to the IOVDD supply, except for RESETn which is proportional to VBATT.

2. GPIO pull-ups are referenced to the IOVDD supply, except for RESETn, which connects to VBATT.

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Electrical Specifications

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3. Typical Connection Diagrams

3.1 Typical BGX13S Connections

Typical connections for the BGX13S module are shown in Figure 3.1 Typical Connections for BGX13S on page 15. This diagram

shows connections for:

• Power supplies

Note: The 1V8 pin is the 1.8V output of the internal DC-DC converer. This pin should be left unconnected. Do not add external de-

coupling or power external circuits from this pin.

• Antenna loop for internal antenna usage or external antenna connection - The RF and ANTENNA pins should be tied together for

correct operation of the module. An optional 0R resistor can be added between RF and ANTENNA, making it possible to measure

the signal between these pins.

• Reset line

Note:

It is recommended to connect the RESETn line to an open-drain IO pin on the host CPU.

RESETn includes an internal pull-up to the VBATT supply and input logic levels on RESETn are referenced to VBATT. In systems

where IOVDD is not equal to VBATT, additional considerations may need to be taken.

• UART connection to an embedded host

• 32.768 kHz crystal - Recommended crystal is KDS part number 1TJG125DP1A0012 or equivalent. Crystal used must have better

than 100 ppm accuracy.

• Optional BOOT pin connection - BOOT is an active-low digital input that will force the module into a DFU bootloader state after de-

vice reset. BOOT can be tied to IOVDD or left disconnected if it is unused.

BGX13S

Host CPU

RESETn

UART_TX

UART_RX

UART_CTS

UART_RTS

LFXTAL_P

LFXTAL_N

VSS

ANTENNA

RTS

CTS

GPIO

R1 (0R)

Use 0R to connect

internal antenna

R2 (0R)

Use 0R to connect external

antenna

32.768 kHz XTAL

VBATT

1V8

IOVDD

Battery / Supply Voltage

VDD

VSS

Battery or Regulator

GPIO0

GPIO1

GPIO2

GPIO3

GPIO4

GPIO5

GPIO6

GPIO7 BOOT

Figure 3.1. Typical Connections for BGX13S

BGX13S Blue Gecko Xpress Bluetooth ® SiP Module Data Sheet

Typical Connection Diagrams

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4. Layout Guidelines

For optimal performance of the BGX13S, please follow the PCB layout guidelines and ground plane recommendations indicated in this

section.

4.1 Layout Guidelines

This section contains generic PCB layout and design guidelines for the BGX13S module. For optimal performance:

• Place the module at the edge of the PCB, as shown in the figures in this chapter.

• Do not place any metal (traces, components, etc.) in the antenna clearance area.

• Connect all ground pads directly to a solid ground plane.

• Place the ground vias as close to the ground pads as possible.

Figure 4.1. BGX13S PCB Top Layer Design

The following rules are recommended for the PCB design:

•Trace to copper clearance 150um

• PTH drill size 300um

• PTH annular ring 150um

Important:

The antenna area must align with the pads precisely. Please refer to the recommended PCB land pattern for exact dimensions.

Figure 4.2. BGX13S PCB Middle and Bottom Layer Design

BGX13S Blue Gecko Xpress Bluetooth ® SiP Module Data Sheet

Layout Guidelines

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Figure 4.3. Poor Layout Designs for the BGX13S

Layout checklist for BGX13S:

1. Antenna area is aligned relative to the module pads as shown in the recommended PCB land pattern.

2. Clearance area within the inner layers and bottom layer is covering the whole antenna area as shown in the layout guidelines.

3. The antenna loop is implemented on the top layer as shown in the layoyt guidelines.

4. All dimensions within the antenna area are precisely as shown in the recommended PCB land pattern.

5. The module is placed near the edge of the PCB with max 1mm indentation.

6. The module is not placed in the corner of the PCB.

4.2 Effect of PCB Width

The BGX13S module should be placed at the center of the PCB edge. The width of the board has an impact to the radiated efficiency

and, more importantly, there should be enough ground plane on both sides of the module for optimal antenna performance. Figure

4.4 BGX13S PCB Top Layer Design on page 17 gives an indcation of ground plane size vs. maximum achievable range.

Figure 4.4. BGX13S PCB Top Layer Design

The impact of the board size to the radiated performance is a generic feature of all PCB and chip antennas and it is not a unique fea-

ture of the BGX13S. For the BGX13S the depth of the board is not important and does not impact the radiated performance.

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Layout Guidelines

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4.3 Effect of Plastic and Metal Materials

The antenna on the BGX13S is insensitive to the effects of nearby plastic and other materials with low dielectric constant. No separa-

tion between the BGX13S and plastic or other materials is needed. The board thickness does not have any impact on the module ei-

ther.

Any metal within the antenna area or in close proximity to the antenna area may detune the antenna. In this case it is possible to retune

the antenna by adjusting the width of the antenna loop. To avoid detuning of the antenna, the minimum distance to any metal should be

more than 3 mm. Encapsulating the module inside metal casing will prevent the radiation of the antenna.

Figure 4.5 Antenna Tuning on page 18 shows how it is possible to adjust the frequency of the antenna by adjusting the width of the

antenna loop. The antenna is extremely robust against any objects in close proximity or in direct contact with the antenna and it is rec-

ommended not to adjust the dimensions of the antenna area unless it is clear that a metal object, such as a coin cell battery, within the

antenna area is detuning the antenna.

Figure 4.5. Antenna Tuning

4.4 Effects of Human Body

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.

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Layout Guidelines

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4.5 2D Radiation Pattern Plots

Figure 4.6. Typical 2D Radiation Pattern – Front View

Figure 4.7. Typical 2D Radiation Pattern – Side View

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Figure 4.8. Typical 2D Radiation Pattern – Top View

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5. Pin Definitions

5.1 BGX13S Device Pinout

Figure 5.1. BGX13S Device Pinout

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-

ported features for each GPIO pin, see or .

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Table 5.1. BGX13S Device Pinout

Pin Name Pin(s) Description

VSS

Ground

RF 3 50 Ohm I/O for external antenna connection.

GPIO0 10 Pin with input/output functionality configured by the command API.

GPIO1 11 Pin with input/output functionality configured by the command API.

GPIO2 12 Pin with input/output functionality configured by the command API.

GPIO3 17 Pin with input/output functionality configured by the command API.

GPIO4 18 Pin with input/output functionality configured by the command API.

GPIO5 26 Pin with input/output functionality configured by the command API.

GPIO6 27 Pin with input/output functionality configured by the command API.

UART_TX 13 Digital output

UART_RX 14 Digital input

UART_CTS 15 Digital input

UART_RTS 16 Digital output

GPI07 28 Pin with input/output functionality configured by the command API.

VBATT 22 Battery supply voltage input to the internal DC-DC and analog supply.

IOVDD 24 Digital IO power supply.

LFXTAL_P 19 Low frequency external oscillator output pin.

LFXTAL_N 21 Low frequency external oscillator input pin.

RESETn 44

Reset input, active low. To apply an external reset source to this pin, it is required

to only drive this pin low during reset, and let the internal pull-up ensure that reset

is released.

ANTENNA 2 50 Ohm input, pin for internal 2.4 GHz antenna

1V8 23 1.8V output of the internal DC-DC converer. Do not add external decoupling or

power external circuits from this pin.

BOOT 33 Active-low digital input to force module entrance into DFU bootloader state upon

device reset. See command API documentation for functional details.

ANT_GND 47 Antenna ground.

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Pin Name Pin(s) Description

N/C

No Connect.

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6. Functional Overview

6.1 Introduction

The BGX13S creates a Bluetooth 5 compliant BLE cable replacement interface, facilitating a BLE link to a second embedded device or

a mobile device. An embedded MCU controls the device and communicates across the BLE link through a serial interface and control

signals. Parameters stored in non-volatile memory and configurable through the serial interface adjust performance characteristics of

the device. Silicon Labs offers iOS and Android mobile libraries for Blue Gecko Xpress devices to speed mobile development and sim-

plify communication with the device. This library also controls OTA management, facilitating secure and reliable updates to the device’s

embedded stack.

This functional overview does not cover each command supported by the command API. The complete command API specification is

available at https://docs.silabs.com/bgx/latest/

6.2 Communication Use Cases

The BGX13S family facilitates two types of BLE communication links:

• BGX-to-mobile

• BGX-to-BGX

In the BGX-to-mobile communication use case, the BGX13S operates as a peripheral that is discoverable and connectable when con-

figured to that state through either the command API or the pin states driven by the embedded MCU. Using the Xpress mobile library,

mobile applications can scan for BGX13S devices, connect, and communicate with the device in both streaming and remote command

modes, where the mobile app can execute command API functions remotely.

In the BGX-to-BGX communication use case, one BGX13S must be configured as the central and one or more other BGX devices

should be configured as a peripheral. Devices can be configured at runtime through the command API, or those settings can be saved

to non-volatile memory so that each device wakes from power-on or low power states as either a peripheral or central. For more infor-

mation on advertising and connection options, please see the command API documentation.

6.3 Embedded Interface

The BGX13S family uses a 8-N-1 USART interface for data and flow control signalling. The interface is used both for a raw data

streaming interface and a command interface, depending on additional hardware pin configuration.

UART_TX and UART_RX are defined with flow directions relative to the BGX. Bytes sent from the embedded host to the BGX use the

UART_RX pin. Bytes sent from the BGX to the embedded host appear on the UART_TX pin.

UART_CTS is a digital input that controls the state of the UART_RTS digital output on the other end of the wireless link. Assertion of a

CTS/RTS pair signals that the embedded MCU driving its respective UART_CTS is available to receive bytes.

The baud rate of the BGX13S is a configurable parameter. For information on the process by which a baud rate change gets processed

and executed by the device, please see the command API documentation.

State control signals and visual indicators described below can be assigned to any of the GPIO pins through the command API. These

settings can be stored in non-volatile memory and take effect during the next power cycle. For information on configuration of standard

GPIO and available special function I/O available on the device, please see the command API documentation.

6.4 Command Mode and Streaming Mode

The BGX13S is designed to wake and offer optimized serial interface with hardware follow control. When operating in a peripheral role

and when flow control signals are monitored, the device may never need to leave streaming mode during operation.

However, when use cases require more advanced runtime configuration, the device can switch to command interface through pin or

escape sequence. Commands defined here can control scanning, advertising, connection state, and GPIO settings.

The command interface is also used to configure and store customizable parameters.

Streaming mode can be switched to command mode through an escape sequence of characters if the sequence has been previously

saved in the device's configuration. A comand can be issued in command mode to switch to streaming mode. Stream mode and com-

mand mode entrance can be controlled through a device port pin state, if a pin has been previously defined for that purpose.

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6.5 Command API

Each command begins with a command name followed by arguments, and the syntax of each command is defined in the command API

documentation.

The command interface saves settings as key-value pairs. These values can be used at runtime to modify the operational state, and

they can also be stored in non-volatile memory. Values stored in non-volatile memory function to configure the device's startup/default

state.

6.6 GPIO Control

The BGX13S offers 8 GPIO pins. These pins can be configured as state control pins or visual indicator pins. Alternatively, they can be

used as general purpose I/O pins. Digital output settings can be set and digital input state can be read through the command interface

locally or remotely through the remote command execution using the mobile libraries.

6.7 Device Configuration

Device configuration is handled through the command API, where commands are executed when the serial interface is set to operate in

command mode. These commands can also be executed remotely through the mobile library unless prohibited through previous config-

uration.

Additionally, a device configuration can be generated and saved using Simplicity Studio's Xpress Configurator tool. A generated config-

uration can be submitted to Silicon Labs through the process defined in that application. Silicon Labs will then validate the configuration

request, generate a custom orderable part number, and deliver first article samples for testing. Developers should contact sales repre-

sentatives for more information about this process. Once first article samples have been validated by the customer, this custom ordera-

ble part number can be ordered directly from Silicon Labs.

6.8 Security Features

BGX13S devices communicate with LE secure connections,establishing encrypted communication upon connection.

Device OTA requires an encrypted image signed by Silicon Laboratories. Only firmware developed, signed, and encrypted by Silicon

Labs can be bootloaded successfully on the device.

6.9 OTA

The BGX13S supports secure OTA of the embedded stack and the command interface. Images are encrypted and signed by Silicon

Laboratories. OTA can be performed through the mobile library APIs. Specific device firmware versions can be selected and program-

med through these APIs. See command API documentation for more information.

For information on new functionality included firmware updates to BGX13S, please see docs.silabs.com. BGX13S module OPN firm-

ware will not be updated to include newly released features available through OTA and DFU updates provided by Silicon Labs. Module

OPN firmware will only be updated at manufacturing time to provide security-related enhancements.

Contact Silicon Labs technical support for information on customer factory programming options for custom OPN ordering with a speci-

fied device firmware version and for customer factory programming options.

6.10 Direct Test Mode Support

The BGX13S 's command API offers a command set that configure the device to support the Direct Test Mode (DTM) protocol as de-

fined in the Bluetooth Core Specification Version 4.2, Volume 6, part F.

See the command API for information about commands to support specific DTM test procedures.

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7. Package Specifications

7.1 BGX13S Package Dimensions

Figure 7.1. BGX13S Package Dimensions

Dimension MIN NOM MAX

A 1.20 1.30 1.40

A1 0.26 0.30 0.34

A2 0.95 1.00 1.05

b 0.27 0.32 0.37

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Dimension MIN NOM MAX

D 6.50 BSC

D2 2.92 BSC

D3 4.50 BSC

D4 0.68 BSC

D5 0.60 BSC

e 0.50 BSC

E 6.50 BSC

E2 1.00 BSC

E3 5.50 BSC

E4 4.00 BSC

E5 0.60 BSC

L 0.43 0.48 0.53

L1 0.11 0.16 0.21

L2 0.34 0.39 0.44

L3 0.24 0.29 0.34

L4 0.14 0.19 0.24

L5 0.62 0.67 0.72

eD1 1.20 BSC

eD2 2.40 BSC

eD3 0.07 BSC

eD4 1.50 BSC

eE1 0.30 BSC

eE2 0.20 BSC

eE3 1.60 BSC

eE4 1.65 BSC

eE5 0.80 BSC

aaa 0.10

bbb 0.10

ccc 0.10

ddd 0.10

eee 0.10

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Dimension MIN NOM MAX

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Tolerances are:

a. Decimal:

X.X = ±0.1

X.XX = ±0.05

X.XXX = ±0.03

b. Angular:

±0.1 Degrees

3. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

4. This drawing conforms to the JEDEC Solid State Outline MO-220.

5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

6. Hatching lines means package shielding area.

7. Solid pattern (3.1x3.1mm) shows non-shielding area including its side walls. For side wall, borderline between shielding area and

not-shielding area could not be defined clearly like top side.

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7.2 BGX13S Recommeded PCB Land Pattern

This section describes the recommended PCB land pattern for the BGX13S. The antenna copper clearance area is shown in Figure

7.2 BGX13S Recommended Antenna Clearance on page 29, while the X-Y cordinates of pads relative to the origin are shown in

Table 7.1 BGX13S Pad Coordinates and Sizing on page 30. The origin is the center point of pin number 47. It is very important to

align the antenna area relative to the module pads precisely.

Figure 7.2. BGX13S Recommended Antenna Clearance

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Table 7.1. BGX13S Pad Coordinates and Sizing

Pad No. Pad coordinates (X,Y) Pad size (mm)

47 Pad Center, Origin (0,0) 0.32 x 0.48

1 (0,-1.60)

2 (0,-2.10)

9 (0,-5.60)

10 (0.60,-5.75)

19 (5.10,-5.75)

20 (5.70,-5.60)

31 (5.70,-0.10)

32 (5.10,-0.05)

36 (5.10,-1.65)

45 (0.60,-1.65)

49 (0,-1.00)

46 (2.92,0)

50 1.65,-3.70) 0.67 x 0.67

51 4.05,-3.70)

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Figure 7.3. BGX13S Recommended PCB Land Pattern

Table 7.2. BGX13S Recommended PCB Land Pattern

Symbol NOM (mm)

b 0.32 BSC

D1 5.50 BSC

D2 3.70 BSC

D3 4.00 BSC

D4 0.05 BSC

D5 1.65 BSC

eD1 1.00 BSC

eD2 0.60 BSC

eD3 0.15 BSC

e 0.50 BSC

E1 5.70 BSC

E2 5.10 BSC

E3 3.60 BSC

E4 2.92 BSC

E5 1.65 BSC

E6 4.50 BSC

E7 4.50 BSC

L 0.48 BSC

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Symbol NOM (mm)

L1 0.67 BSC

eE1 0.60 BSC

eE2 0.60 BSC

eE3 2.40 BSC

Notes:

1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.

2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.

3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

4. The stencil thickness should be 0.100mm (4 mils).

5. The stencil aperture to land pad size recommendation is 70% paste coverage.

6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different

parameters and fine tune their SMT process as required for their application and tooling.

7.3 BGX13S Package Marking

The figure below shows the package markings printed on the module.

Figure 7.4. BGX13S Package Marking

Explanations:

Marking Explanation

BGX13Sxxx Model Number

Certification Marks Certification marks will be printed in this area according to regula-

tory body requirements.

YWWTTTT 1. Y = Manufacturing Year

2. WW = Manufacturing Work Week

3. TTTT = Trace Code

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8. Soldering Recommendations

8.1 Soldering Recommendations

The BGX13S is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the ther-

mal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.

• Refer to technical documentations of particular solder paste for profile configurations.

• Avoid using more than two reflow cycles.

• A no-clean, type-3 solder paste is recommended.

• A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

• Recommended stencil thickness is 0.100mm (4 mils).

• Refer to the recommended PCB land pattern for an example stencil aperture size.

• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.

• Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different

parameters and fine tune their SMT process as required for their application and tooling.

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9. Certifications

9.1 Certifications Pending

Certifications for the BGX13S are not yet complete. Certification details will be provided in future versions of this document.

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10. Revision History

Revision 1.0

December 2018

•6.9 OTA: Updated firmware update policy.

•2.1.1 Absolute Maximum Ratings: Corrected storage temperature.

•Table 2.2 General Operating Conditions on page 6: Added VIOVDD specification line.

•Table 2.8 Non-Volatile Configuration Storage on page 12: Corrected minimum supply voltage during update.

•Table 2.9 General-Purpose I/O (GPIO) on page 13: Added details about RESETn supply reference.

•2.1.4.1 RF Transmitter General Characteristics for 2.4 GHz Band: Removed references to internal supply connections.

•3.1 Typical BGX13S Connections: Updated recommended connection details for RESETn, BOOT, and 1V8.

•7.3 BGX13S Package Marking: Replaced detailed certification marks and text description with Certification Mark area.

Revision 0.5

August 2018

• Public Release

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Disclaimer

Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or

intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"

parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes

without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information.

Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the

performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant

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