BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet The BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module family of serial replacement modules eliminate Bluetooth firmware development complexity with a serial interface that can operate as a raw data stream or control the device through a command API. The BGX13S can facilitate a device-to-device cable replacement link or communicate with mobile devices through the Xpress Bluetooth mobile library. The device integrates a Bluetooth 5 compliant stack to future-proof applications as Bluetooth 5 adoption increases. The device is targeted for applications where ultra-small size, reliable high performance RF, low-power consumption, and fast time-to-market are key requirements. At 6.5 x 6.5 x 1.4 mm the BGX13S module fits applications where size is a constraint. BGX13S also integrates a high-performance, ultra-robust antenna, which requires minimal PCB, plastic, and metal clearance. The total PCB area required by BGX13S is only 51 mm2. The BGX13S has Bluetooth, CE, full FCC, Japan and South-Korea certifications. KEY FEATURES * Bluetooth 5 low energy compliant * Serial interface with hardware flow control * GPIO control through command API * Integrated antenna * TX power up to 8 dBm * Encrypted bonding and connectivity * Operates as central or peripheral * Onboard Bluetooth stack * Centralized OTA through mobile app library BGX13S SIP modules can be used in a wide variety of applications: * Health, sports and wellness devices * Industrial, home and building automation * Smart phone, tablet and PC accessories GPIO control RX/TX and flow control Serial interface silabs.com | Building a more connected world. Command parser Raw data stream buffers Bluetooth controller Radio Bluetooth 5 compliant stack Radio transceiver Timers Chip antenna OTA manager Matching network Rev. 1.0 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Ordering Information 1. Ordering Information Table 1.1. Ordering Information Frequency Band Ordering Code Protocol Stack @ Max TX Power Antenna GPIO Packaging BGX13S22GA-V21R Bluetooth Low Energy 2.4 GHz @ 8 dBm Built-in 8 Reel BGX13S22GA-V21 Bluetooth Low Energy 2.4 GHz @ 8 dBm Built-in 8 Tray silabs.com | Building a more connected world. Rev. 1.0 | 2 Table of Contents 1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Electrical Characteristics . . . . . . 2.1.1 Absolute Maximum Ratings . . . . 2.1.2 Operating Conditions . . . . . . 2.1.3 Power Consumption. . . . . . . 2.1.4 2.4 GHz RF Transceiver Characteristics 2.1.5 Non-Volatile Configuration Storage. . 2.1.6 General-Purpose I/O (GPIO) . . . . 3. Typical Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 . 5 . 6 . 7 . 8 .12 .13 . . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 Typical BGX13S Connections . 4. Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.1 Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 4.2 Effect of PCB Width . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 4.3 Effect of Plastic and Metal Materials . . . . . . . . . . . . . . . . . . . . . . .18 4.4 Effects of Human Body . . . . . . . . . . . . . . . . . . . . . . . . . . .18 4.5 2D Radiation Pattern Plots . . . . . . . . . . . . . . . . . . . . . . . . . .19 5. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.1 BGX13S Device Pinout . 6. Functional Overview 6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . .21 . . . . . . . . . . . . . . . . . . . . . . . . . . .24 . . . . . . . . . . . . . . . . . . . . . . . . .24 6.2 Communication Use Cases . . . . . . . . . . . . . . . . . . . . . . . . . .24 6.3 Embedded Interface . . . . . . . . . . . . . . . . . . . . . . . . . .24 6.4 Command Mode and Streaming Mode . . . . . . . . . . . . . . . . . . . . . .24 6.5 Command API . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 6.6 GPIO Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 6.7 Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 6.8 Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 6.9 OTA . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 6.10 Direct Test Mode Support . . . . . . . . . . . . . . . . . . . . . . . . . .25 . . . . . . . . . . . . . . 7. Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.1 BGX13S Package Dimensions . . . . . . . . . . . . . . . . . . . .26 7.2 BGX13S Recommeded PCB Land Pattern . . . . . . . . . . . . . . . . . . . .29 7.3 BGX13S Package Marking. . . . . . . . . . . . . . . . . . . .32 . 8. Soldering Recommendations 8.1 Soldering Recommendations . silabs.com | Building a more connected world. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 . . . . . . . . . . . . . . . . . . . . . . . .33 Rev. 1.0 | 3 9. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 9.1 Certifications Pending . . .34 10. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 silabs.com | Building a more connected world. . . . . . . . . . . . . . . . . . . . . . . . . Rev. 1.0 | 4 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications 2. Electrical Specifications 2.1 Electrical Characteristics All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: * Typical values are based on TAMB = 25 C and VBAT = 3.3 V, by production test and/or technology characterization. * Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 antenna. * Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. Refer to for more details about operational supply and temperature limits. 2.1.1 Absolute Maximum Ratings Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. Table 2.1. Absolute Maximum Ratings Parameter Symbol Storage temperature range Test Condition Min Typ Max Unit TSTG -40 -- 85 C Voltage on any supply pin VDDMAX -0.3 -- 3.8 V Voltage ramp rate on any supply pin VDDRAMPMAX -- -- 1 V / s DC voltage on any GPIO pin VDIGPIN -0.3 -- IOVDD+0.3 V Maximum RF level at input PRFMAX2G4 -- -- 10 dBm Total current into supply pins IVDDMAX Source -- -- 200 mA Total current into VSS ground lines IVSSMAX Sink -- -- 200 mA Current per I/O pin IIOMAX Sink -- -- 50 mA Source -- -- 50 mA Sink -- -- 200 mA Source -- -- 200 mA -40 -- 105 C Current for all I/O pins Junction temperature IIOALLMAX TJ silabs.com | Building a more connected world. Rev. 1.0 | 5 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications 2.1.2 Operating Conditions The following subsections define the operating conditions for the module. 2.1.2.1 General Operating Conditions Table 2.2. General Operating Conditions Parameter Symbol Operating ambient temperature range Min Typ Max Unit TA -40 25 85 C VBATT operating supply voltage VVBATT 2.4 3.3 3.8 V VBATT current IVBATT -- -- 200 mA 1.62 -- VVBATT V IOVDD operating supply volt- VIOVDD age silabs.com | Building a more connected world. Test Condition Rev. 1.0 | 6 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications 2.1.3 Power Consumption Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 C. Minimum and maximum values in this table represent the worst conditions across process variation at T = 25 C. Table 2.3. Power Consumption Parameter Symbol Test Condition Active supply current, Unconnected, Idle IACTIVE_IDLE Active supply current, Adver- IACTIVE_ADV tising Active supply current, Connected, 15 ms Interval Supply current in low power mode IACTIVE_CONN ILPM silabs.com | Building a more connected world. Min Typ Max Unit Baud rate 9600 bps -- 3 -- A Baud rate > 9600 bps -- 3.25 -- mA Interval = 546.25 ms, Baud rate 9600 bps -- 90 -- A Interval = 20 ms, Baud rate 9600 bps -- 2 -- mA Interval = 546.25 ms, Baud rate > 9600 bps -- 3.3 -- mA Interval = 20 ms, Baud rate > 9600 bps -- 4.7 -- mA Idle, Baud Rate 9600 bps -- 660 -- A TX/RX (acknowledged) at highest throughput, Baud Rate 9600 bps -- 3.5 -- mA TX/RX (unacknowledged) at highest throughput, Baud Rate 9600 bps -- 4 -- mA Idle, Baud Rate > 9600 bps -- 3.5 -- mA TX/RX (acknowledged) at highest throughput, Baud Rate > 9600 bps -- 5.25 -- mA TX/RX (unacknowledged) at highest throughput, Baud Rate > 9600 bps -- 7 -- mA Radio disabled -- 3 -- A Radio enabled, Advertising, Interval = 546.25 ms -- 90 -- A Radio enabled, Advertising, Interval = 20 ms -- 2 -- mA Rev. 1.0 | 7 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications 2.1.4 2.4 GHz RF Transceiver Characteristics 2.1.4.1 RF Transmitter General Characteristics for 2.4 GHz Band Unless otherwise indicated, typical conditions are: T = 25 C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 2.4. RF Transmitter General Characteristics for 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit Maximum TX power1 POUTMAX -- 7.8 -- dBm Minimum active TX Power POUTMIN CW -30 -- dBm Output power step size POUTSTEP -5 dBm< Output power < 0 dBm -- 1 -- dB 0 dBm < output power < POUTMAX -- 0.5 -- dB Output power variation vs supply at POUTMAX POUTVAR_V 2.4 V < VVBATT < 3.3 V -- 2.1 -- dB Output power variation vs temperature at POUTMAX POUTVAR_T From -40 to +85 C -- 1.7 -- dB Over RF tuning frequency range -- 0.3 -- dB 2400 -- 2483.5 MHz Output power variation vs RF POUTVAR_F frequency at POUTMAX RF tuning frequency range FRANGE Note: 1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices covered in this datasheet can be found in the Max TX Power column of the Ordering Information Table. silabs.com | Building a more connected world. Rev. 1.0 | 8 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications 2.1.4.2 RF Receiver General Characteristics for 2.4 GHz Band Unless otherwise indicated, typical conditions are: T = 25 C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 2.5. RF Receiver General Characteristics for 2.4 GHz Band Parameter Symbol RF tuning frequency range FRANGE Receive mode maximum spurious emission SPURRX Test Condition Min Typ Max Unit 2400 -- 2483.5 MHz 30 MHz to 1 GHz -- -57 -- dBm 1 GHz to 12 GHz -- -47 -- dBm Max spurious emissions dur- SPURRX_FCC ing active receive mode, per FCC Part 15.109(a) 216 MHz to 960 MHz, Conducted Measurement -- -55.2 -- dBm Above 960 MHz, Conducted Measurement -- -47.2 -- dBm Level above which RFSENSE will trigger1 RFSENSETRIG CW at 2.45 GHz -- -24 -- dBm Level below which RFSENSE will not trigger1 RFSENSETHRES CW at 2.45 GHz -- -50 -- dBm Note: 1. RFSENSE performance is only valid from 0 to 85 C. RFSENSE should be disabled outside this temperature range. silabs.com | Building a more connected world. Rev. 1.0 | 9 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications 2.1.4.3 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate Unless otherwise indicated, typical conditions are: T = 25 C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 2.6. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level, 0.1% BER SAT Signal is reference signal1. Packet length is 20 bytes. -- 10 -- dBm Sensitivity, 0.1% BER SENS Signal is reference signal1. Using DC-DC converter. -- -94.1 -- dBm With non-ideal signals as specified in RF-PHY.TS.4.2.2, section 4.6.1. -- -93.8 -- dBm Signal to co-channel interfer- C/ICC er, 0.1% BER Desired signal 3 dB above reference sensitivity. -- 9.0 -- dB N+1 adjacent channel selec- C/I1+ tivity, 0.1% BER, with allowable exceptions. Desired is reference signal at -67 dBm Interferer is reference signal at +1 MHz offset. Desired frequency 2402 MHz Fc 2480 MHz -- -3.3 -- dB N-1 adjacent channel selec- C/I1tivity, 0.1% BER, with allowable exceptions. Desired is reference signal at -67 dBm Interferer is reference signal at -1 MHz offset. Desired frequency 2402 MHz Fc 2480 MHz -- -1.6 -- dB Alternate selectivity, 0.1% BER, with allowable exceptions. Desired is reference signal at -67 dBm C/I2 Interferer is reference signal at 2 MHz offset. Desired frequency 2402 MHz Fc 2480 MHz -- -42.0 -- dB Alternate selectivity, 0.1% BER, with allowable exceptions. Desired is reference signal at -67 dBm C/I3 Interferer is reference signal at 3 MHz offset. Desired frequency 2404 MHz Fc 2480 MHz -- -46.4 -- dB Interferer is reference signal at image frequency with 1 MHz precision -- -42.0 -- dB Interferer is reference signal at image frequency 1 MHz with 1 MHz precision -- -47.1 -- dB Per Core_4.1, Vol 6, Part A, Section 4.4 with n = 3 -- -18.4 -- dBm Selectivity to image frequen- C/IIM cy, 0.1% BER. Desired is reference signal at -67 dBm Selectivity to image frequency 1 MHz, 0.1% BER. Desired is reference signal at -67 dBm C/IIM+1 Intermodulation performance IM Note: 1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9; interferer data = PRBS15; frequency accuracy better than 1 ppm. silabs.com | Building a more connected world. Rev. 1.0 | 10 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications 2.1.4.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate Unless otherwise indicated, typical conditions are: T = 25 C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 2.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level, 0.1% BER SAT Signal is reference signal1. Packet length is 20 bytes. -- 10 -- dBm Sensitivity, 0.1% BER SENS Signal is reference signal1. Using DC-DC converter. -- -90.2 -- dBm With non-ideal signals as specified in RF-PHY.TS.4.2.2, section 4.6.1. -- -89.9 -- dBm Signal to co-channel interfer- C/ICC er, 0.1% BER Desired signal 3 dB above reference sensitivity. -- 8.6 -- dB N+1 adjacent channel selec- C/I1+ tivity, 0.1% BER, with allowable exceptions. Desired is reference signal at -67 dBm Interferer is reference signal at +2 MHz offset. Desired frequency 2402 MHz Fc 2480 MHz -- -7.6 -- dB N-1 adjacent channel selec- C/I1tivity, 0.1% BER, with allowable exceptions. Desired is reference signal at -67 dBm Interferer is reference signal at -2 MHz offset. Desired frequency 2402 MHz Fc 2480 MHz -- -11.4 -- dB Alternate selectivity, 0.1% BER, with allowable exceptions. Desired is reference signal at -67 dBm C/I2 Interferer is reference signal at 4 MHz offset. Desired frequency 2402 MHz Fc 2480 MHz -- -40.3 -- dB Alternate selectivity, 0.1% BER, with allowable exceptions. Desired is reference signal at -67 dBm C/I3 Interferer is reference signal at 6 MHz offset. Desired frequency 2404 MHz Fc 2480 MHz -- -45.1 -- dB Interferer is reference signal at image frequency with 1 MHz precision -- -7.6 -- dB Interferer is reference signal at image frequency 2 MHz with 2 MHz precision -- -40.30 -- dB Per Core_4.1, Vol 6, Part A, Section 4.4 with n = 3 -- -18.4 -- dBm Selectivity to image frequen- C/IIM cy, 0.1% BER. Desired is reference signal at -67 dBm Selectivity to image frequency 2 MHz, 0.1% BER. Desired is reference signal at -67 dBm C/IIM+1 Intermodulation performance IM Note: 1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9; interferer data = PRBS15; frequency accuracy better than 1 ppm. silabs.com | Building a more connected world. Rev. 1.0 | 11 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications 2.1.5 Non-Volatile Configuration Storage Table 2.8. Non-Volatile Configuration Storage Parameter Symbol Update cycles before failure Data retention Min Typ Max Unit UC 10000 -- -- cycles RET 10 -- -- years Supply voltage during update VDD 2.4 -- 3.6 V silabs.com | Building a more connected world. Test Condition Rev. 1.0 | 12 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications 2.1.6 General-Purpose I/O (GPIO) Table 2.9. General-Purpose I/O (GPIO) Parameter Symbol Test Condition Min Typ Max Unit Input low voltage1 VIL GPIO pins -- -- IOVDD*0.3 V Input high voltage1 VIH GPIO pins IOVDD*0.7 -- -- V Output high voltage relative to IOVDD VOH Sourcing 3 mA, IOVDD 3 V, IOVDD*0.8 -- -- V IOVDD*0.6 -- -- V IOVDD*0.8 -- -- V IOVDD*0.6 -- -- V -- -- IOVDD*0.2 V -- -- IOVDD*0.4 V -- -- IOVDD*0.2 V -- -- IOVDD*0.4 V All GPIO except LFXO pins, GPIO IOVDD -- 0.1 30 nA LFXO Pins, GPIO IOVDD -- 0.1 50 nA 30 40 65 k 15 25 45 ns -- 1.8 -- ns -- 4.5 -- ns -- 2.2 -- ns -- 7.4 -- ns Drive Strength = Weak Sourcing 1.2 mA, IOVDD 1.62 V, Drive Strength = Weak Sourcing 20 mA, IOVDD 3 V, Drive Strength = Strong Sourcing 8 mA, IOVDD 1.62 V, Drive Strength = Strong Output low voltage relative to VOL IOVDD Sinking 3 mA, IOVDD 3 V, Drive Strength = Weak Sinking 1.2 mA, IOVDD 1.62 V, Drive Strength = Weak Sinking 20 mA, IOVDD 3 V, Drive Strength = Strong Sinking 8 mA, IOVDD 1.62 V, Drive Strength = Strong Input leakage current I/O pin pull-up/pull-down resistor2 IIOLEAK RPUD Pulse width of pulses retIOGLITCH moved by the glitch suppression filter Output fall time, From 70% to 30% of VIO tIOOF CL = 50 pF, Drive Strength = Strong CL = 50 pF, Drive Strength = Weak Output rise time, From 30% to 70% of VIO tIOOR CL = 50 pF, Drive Strength = Strong CL = 50 pF, Drive Strength = Weak silabs.com | Building a more connected world. Rev. 1.0 | 13 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit Note: 1. GPIO input threshold are proportional to the IOVDD supply, except for RESETn which is proportional to VBATT. 2. GPIO pull-ups are referenced to the IOVDD supply, except for RESETn, which connects to VBATT. silabs.com | Building a more connected world. Rev. 1.0 | 14 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Typical Connection Diagrams 3. Typical Connection Diagrams 3.1 Typical BGX13S Connections Typical connections for the BGX13S module are shown in Figure 3.1 Typical Connections for BGX13S on page 15. This diagram shows connections for: * Power supplies Note: The 1V8 pin is the 1.8V output of the internal DC-DC converer. This pin should be left unconnected. Do not add external decoupling or power external circuits from this pin. * Antenna loop for internal antenna usage or external antenna connection - The RF and ANTENNA pins should be tied together for correct operation of the module. An optional 0R resistor can be added between RF and ANTENNA, making it possible to measure the signal between these pins. * Reset line Note: It is recommended to connect the RESETn line to an open-drain IO pin on the host CPU. RESETn includes an internal pull-up to the VBATT supply and input logic levels on RESETn are referenced to VBATT. In systems where IOVDD is not equal to VBATT, additional considerations may need to be taken. * UART connection to an embedded host * 32.768 kHz crystal - Recommended crystal is KDS part number 1TJG125DP1A0012 or equivalent. Crystal used must have better than 100 ppm accuracy. * Optional BOOT pin connection - BOOT is an active-low digital input that will force the module into a DFU bootloader state after device reset. BOOT can be tied to IOVDD or left disconnected if it is unused. GPIO VDD IOVDD VBATT RESETn UART_TX UART_RX UART_CTS UART_RTS RF GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 RX TX RTS CTS BGX13S LFXTAL_P LFXTAL_N Host CPU VSS Use 0R to connect external antenna Battery or Regulator ANTENNA VSS R2 (0R) R1 (0R) Use 0R to connect internal antenna 1V8 Battery / Supply Voltage 32.768 kHz XTAL BOOT Figure 3.1. Typical Connections for BGX13S silabs.com | Building a more connected world. Rev. 1.0 | 15 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Layout Guidelines 4. Layout Guidelines For optimal performance of the BGX13S, please follow the PCB layout guidelines and ground plane recommendations indicated in this section. 4.1 Layout Guidelines This section contains generic PCB layout and design guidelines for the BGX13S module. For optimal performance: * Place the module at the edge of the PCB, as shown in the figures in this chapter. * Do not place any metal (traces, components, etc.) in the antenna clearance area. * Connect all ground pads directly to a solid ground plane. * Place the ground vias as close to the ground pads as possible. Figure 4.1. BGX13S PCB Top Layer Design The following rules are recommended for the PCB design: * Trace to copper clearance 150um * PTH drill size 300um * PTH annular ring 150um Important: The antenna area must align with the pads precisely. Please refer to the recommended PCB land pattern for exact dimensions. Figure 4.2. BGX13S PCB Middle and Bottom Layer Design silabs.com | Building a more connected world. Rev. 1.0 | 16 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Layout Guidelines Figure 4.3. Poor Layout Designs for the BGX13S Layout checklist for BGX13S: 1. Antenna area is aligned relative to the module pads as shown in the recommended PCB land pattern. 2. Clearance area within the inner layers and bottom layer is covering the whole antenna area as shown in the layout guidelines. 3. The antenna loop is implemented on the top layer as shown in the layoyt guidelines. 4. All dimensions within the antenna area are precisely as shown in the recommended PCB land pattern. 5. The module is placed near the edge of the PCB with max 1mm indentation. 6. The module is not placed in the corner of the PCB. 4.2 Effect of PCB Width The BGX13S module should be placed at the center of the PCB edge. The width of the board has an impact to the radiated efficiency and, more importantly, there should be enough ground plane on both sides of the module for optimal antenna performance. Figure 4.4 BGX13S PCB Top Layer Design on page 17 gives an indcation of ground plane size vs. maximum achievable range. Figure 4.4. BGX13S PCB Top Layer Design The impact of the board size to the radiated performance is a generic feature of all PCB and chip antennas and it is not a unique feature of the BGX13S. For the BGX13S the depth of the board is not important and does not impact the radiated performance. silabs.com | Building a more connected world. Rev. 1.0 | 17 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Layout Guidelines 4.3 Effect of Plastic and Metal Materials The antenna on the BGX13S is insensitive to the effects of nearby plastic and other materials with low dielectric constant. No separation between the BGX13S and plastic or other materials is needed. The board thickness does not have any impact on the module either. Any metal within the antenna area or in close proximity to the antenna area may detune the antenna. In this case it is possible to retune the antenna by adjusting the width of the antenna loop. To avoid detuning of the antenna, the minimum distance to any metal should be more than 3 mm. Encapsulating the module inside metal casing will prevent the radiation of the antenna. Figure 4.5 Antenna Tuning on page 18 shows how it is possible to adjust the frequency of the antenna by adjusting the width of the antenna loop. The antenna is extremely robust against any objects in close proximity or in direct contact with the antenna and it is recommended not to adjust the dimensions of the antenna area unless it is clear that a metal object, such as a coin cell battery, within the antenna area is detuning the antenna. Figure 4.5. Antenna Tuning 4.4 Effects of Human Body Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. silabs.com | Building a more connected world. Rev. 1.0 | 18 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Layout Guidelines 4.5 2D Radiation Pattern Plots Figure 4.6. Typical 2D Radiation Pattern - Front View Figure 4.7. Typical 2D Radiation Pattern - Side View silabs.com | Building a more connected world. Rev. 1.0 | 19 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Layout Guidelines Figure 4.8. Typical 2D Radiation Pattern - Top View silabs.com | Building a more connected world. Rev. 1.0 | 20 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Pin Definitions 5. Pin Definitions 5.1 BGX13S Device Pinout Figure 5.1. BGX13S Device Pinout The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see or . silabs.com | Building a more connected world. Rev. 1.0 | 21 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Pin Definitions Table 5.1. BGX13S Device Pinout Pin Name Pin(s) Description VSS 1 4 5 20 31 45 46 48 49 50 51 Ground RF 3 50 Ohm I/O for external antenna connection. GPIO0 10 Pin with input/output functionality configured by the command API. GPIO1 11 Pin with input/output functionality configured by the command API. GPIO2 12 Pin with input/output functionality configured by the command API. GPIO3 17 Pin with input/output functionality configured by the command API. GPIO4 18 Pin with input/output functionality configured by the command API. GPIO5 26 Pin with input/output functionality configured by the command API. GPIO6 27 Pin with input/output functionality configured by the command API. UART_TX 13 Digital output UART_RX 14 Digital input UART_CTS 15 Digital input UART_RTS 16 Digital output GPI07 28 Pin with input/output functionality configured by the command API. VBATT 22 Battery supply voltage input to the internal DC-DC and analog supply. IOVDD 24 Digital IO power supply. LFXTAL_P 19 Low frequency external oscillator output pin. LFXTAL_N 21 Low frequency external oscillator input pin. RESETn 44 Reset input, active low. To apply an external reset source to this pin, it is required to only drive this pin low during reset, and let the internal pull-up ensure that reset is released. ANTENNA 2 50 Ohm input, pin for internal 2.4 GHz antenna 1V8 23 1.8V output of the internal DC-DC converer. Do not add external decoupling or power external circuits from this pin. BOOT 33 Active-low digital input to force module entrance into DFU bootloader state upon device reset. See command API documentation for functional details. ANT_GND 47 Antenna ground. silabs.com | Building a more connected world. Rev. 1.0 | 22 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Pin Definitions Pin Name N/C Pin(s) Description 6 7 8 9 10 11 25 29 30 32 34 35 36 37 38 39 40 41 42 43 No Connect. silabs.com | Building a more connected world. Rev. 1.0 | 23 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Functional Overview 6. Functional Overview 6.1 Introduction The BGX13S creates a Bluetooth 5 compliant BLE cable replacement interface, facilitating a BLE link to a second embedded device or a mobile device. An embedded MCU controls the device and communicates across the BLE link through a serial interface and control signals. Parameters stored in non-volatile memory and configurable through the serial interface adjust performance characteristics of the device. Silicon Labs offers iOS and Android mobile libraries for Blue Gecko Xpress devices to speed mobile development and simplify communication with the device. This library also controls OTA management, facilitating secure and reliable updates to the device's embedded stack. This functional overview does not cover each command supported by the command API. The complete command API specification is available at https://docs.silabs.com/bgx/latest/ 6.2 Communication Use Cases The BGX13S family facilitates two types of BLE communication links: * BGX-to-mobile * BGX-to-BGX In the BGX-to-mobile communication use case, the BGX13S operates as a peripheral that is discoverable and connectable when configured to that state through either the command API or the pin states driven by the embedded MCU. Using the Xpress mobile library, mobile applications can scan for BGX13S devices, connect, and communicate with the device in both streaming and remote command modes, where the mobile app can execute command API functions remotely. In the BGX-to-BGX communication use case, one BGX13S must be configured as the central and one or more other BGX devices should be configured as a peripheral. Devices can be configured at runtime through the command API, or those settings can be saved to non-volatile memory so that each device wakes from power-on or low power states as either a peripheral or central. For more information on advertising and connection options, please see the command API documentation. 6.3 Embedded Interface The BGX13S family uses a 8-N-1 USART interface for data and flow control signalling. The interface is used both for a raw data streaming interface and a command interface, depending on additional hardware pin configuration. UART_TX and UART_RX are defined with flow directions relative to the BGX. Bytes sent from the embedded host to the BGX use the UART_RX pin. Bytes sent from the BGX to the embedded host appear on the UART_TX pin. UART_CTS is a digital input that controls the state of the UART_RTS digital output on the other end of the wireless link. Assertion of a CTS/RTS pair signals that the embedded MCU driving its respective UART_CTS is available to receive bytes. The baud rate of the BGX13S is a configurable parameter. For information on the process by which a baud rate change gets processed and executed by the device, please see the command API documentation. State control signals and visual indicators described below can be assigned to any of the GPIO pins through the command API. These settings can be stored in non-volatile memory and take effect during the next power cycle. For information on configuration of standard GPIO and available special function I/O available on the device, please see the command API documentation. 6.4 Command Mode and Streaming Mode The BGX13S is designed to wake and offer optimized serial interface with hardware follow control. When operating in a peripheral role and when flow control signals are monitored, the device may never need to leave streaming mode during operation. However, when use cases require more advanced runtime configuration, the device can switch to command interface through pin or escape sequence. Commands defined here can control scanning, advertising, connection state, and GPIO settings. The command interface is also used to configure and store customizable parameters. Streaming mode can be switched to command mode through an escape sequence of characters if the sequence has been previously saved in the device's configuration. A comand can be issued in command mode to switch to streaming mode. Stream mode and command mode entrance can be controlled through a device port pin state, if a pin has been previously defined for that purpose. silabs.com | Building a more connected world. Rev. 1.0 | 24 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Functional Overview 6.5 Command API Each command begins with a command name followed by arguments, and the syntax of each command is defined in the command API documentation. The command interface saves settings as key-value pairs. These values can be used at runtime to modify the operational state, and they can also be stored in non-volatile memory. Values stored in non-volatile memory function to configure the device's startup/default state. 6.6 GPIO Control The BGX13S offers 8 GPIO pins. These pins can be configured as state control pins or visual indicator pins. Alternatively, they can be used as general purpose I/O pins. Digital output settings can be set and digital input state can be read through the command interface locally or remotely through the remote command execution using the mobile libraries. 6.7 Device Configuration Device configuration is handled through the command API, where commands are executed when the serial interface is set to operate in command mode. These commands can also be executed remotely through the mobile library unless prohibited through previous configuration. Additionally, a device configuration can be generated and saved using Simplicity Studio's Xpress Configurator tool. A generated configuration can be submitted to Silicon Labs through the process defined in that application. Silicon Labs will then validate the configuration request, generate a custom orderable part number, and deliver first article samples for testing. Developers should contact sales representatives for more information about this process. Once first article samples have been validated by the customer, this custom orderable part number can be ordered directly from Silicon Labs. 6.8 Security Features BGX13S devices communicate with LE secure connections,establishing encrypted communication upon connection. Device OTA requires an encrypted image signed by Silicon Laboratories. Only firmware developed, signed, and encrypted by Silicon Labs can be bootloaded successfully on the device. 6.9 OTA The BGX13S supports secure OTA of the embedded stack and the command interface. Images are encrypted and signed by Silicon Laboratories. OTA can be performed through the mobile library APIs. Specific device firmware versions can be selected and programmed through these APIs. See command API documentation for more information. For information on new functionality included firmware updates to BGX13S, please see docs.silabs.com. BGX13S module OPN firmware will not be updated to include newly released features available through OTA and DFU updates provided by Silicon Labs. Module OPN firmware will only be updated at manufacturing time to provide security-related enhancements. Contact Silicon Labs technical support for information on customer factory programming options for custom OPN ordering with a specified device firmware version and for customer factory programming options. 6.10 Direct Test Mode Support The BGX13S 's command API offers a command set that configure the device to support the Direct Test Mode (DTM) protocol as defined in the Bluetooth Core Specification Version 4.2, Volume 6, part F. See the command API for information about commands to support specific DTM test procedures. silabs.com | Building a more connected world. Rev. 1.0 | 25 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Package Specifications 7. Package Specifications 7.1 BGX13S Package Dimensions Figure 7.1. BGX13S Package Dimensions Dimension MIN NOM MAX A 1.20 1.30 1.40 A1 0.26 0.30 0.34 A2 0.95 1.00 1.05 b 0.27 0.32 0.37 silabs.com | Building a more connected world. Rev. 1.0 | 26 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Package Specifications Dimension MIN NOM D 6.50 BSC D2 2.92 BSC D3 4.50 BSC D4 0.68 BSC D5 0.60 BSC e 0.50 BSC E 6.50 BSC E2 1.00 BSC E3 5.50 BSC E4 4.00 BSC E5 0.60 BSC MAX L 0.43 0.48 0.53 L1 0.11 0.16 0.21 L2 0.34 0.39 0.44 L3 0.24 0.29 0.34 L4 0.14 0.19 0.24 L5 0.62 0.67 0.72 eD1 1.20 BSC eD2 2.40 BSC eD3 0.07 BSC eD4 1.50 BSC eE1 0.30 BSC eE2 0.20 BSC eE3 1.60 BSC eE4 1.65 BSC eE5 0.80 BSC aaa 0.10 bbb 0.10 ccc 0.10 ddd 0.10 eee 0.10 silabs.com | Building a more connected world. Rev. 1.0 | 27 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Package Specifications Dimension MIN NOM MAX Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Tolerances are: a. Decimal: X.X = 0.1 X.XX = 0.05 X.XXX = 0.03 b. Angular: 0.1 Degrees 3. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 4. This drawing conforms to the JEDEC Solid State Outline MO-220. 5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 6. Hatching lines means package shielding area. 7. Solid pattern (3.1x3.1mm) shows non-shielding area including its side walls. For side wall, borderline between shielding area and not-shielding area could not be defined clearly like top side. silabs.com | Building a more connected world. Rev. 1.0 | 28 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Package Specifications 7.2 BGX13S Recommeded PCB Land Pattern This section describes the recommended PCB land pattern for the BGX13S. The antenna copper clearance area is shown in Figure 7.2 BGX13S Recommended Antenna Clearance on page 29, while the X-Y cordinates of pads relative to the origin are shown in Table 7.1 BGX13S Pad Coordinates and Sizing on page 30. The origin is the center point of pin number 47. It is very important to align the antenna area relative to the module pads precisely. Figure 7.2. BGX13S Recommended Antenna Clearance silabs.com | Building a more connected world. Rev. 1.0 | 29 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Package Specifications Table 7.1. BGX13S Pad Coordinates and Sizing Pad No. Pad coordinates (X,Y) Pad size (mm) 47 Pad Center, Origin (0,0) 0.32 x 0.48 1 (0,-1.60) 2 (0,-2.10) 9 (0,-5.60) 10 (0.60,-5.75) 19 (5.10,-5.75) 20 (5.70,-5.60) 31 (5.70,-0.10) 32 (5.10,-0.05) 36 (5.10,-1.65) 45 (0.60,-1.65) 49 (0,-1.00) 46 (2.92,0) 50 1.65,-3.70) 51 4.05,-3.70) silabs.com | Building a more connected world. 0.67 x 0.67 Rev. 1.0 | 30 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Package Specifications Figure 7.3. BGX13S Recommended PCB Land Pattern Table 7.2. BGX13S Recommended PCB Land Pattern Symbol NOM (mm) b 0.32 BSC D1 5.50 BSC D2 3.70 BSC D3 4.00 BSC D4 0.05 BSC D5 1.65 BSC eD1 1.00 BSC eD2 0.60 BSC eD3 0.15 BSC e 0.50 BSC E1 5.70 BSC E2 5.10 BSC E3 3.60 BSC E4 2.92 BSC E5 1.65 BSC E6 4.50 BSC E7 4.50 BSC L 0.48 BSC silabs.com | Building a more connected world. Rev. 1.0 | 31 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Package Specifications Symbol NOM (mm) L1 0.67 BSC eE1 0.60 BSC eE2 0.60 BSC eE3 2.40 BSC Notes: 1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 4. The stencil thickness should be 0.100mm (4 mils). 5. The stencil aperture to land pad size recommendation is 70% paste coverage. 6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. 7.3 BGX13S Package Marking The figure below shows the package markings printed on the module. Figure 7.4. BGX13S Package Marking Explanations: Marking Explanation BGX13Sxxx Model Number Certification Marks Certification marks will be printed in this area according to regulatory body requirements. YWWTTTT 1. Y = Manufacturing Year 2. WW = Manufacturing Work Week 3. TTTT = Trace Code silabs.com | Building a more connected world. Rev. 1.0 | 32 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Soldering Recommendations 8. Soldering Recommendations 8.1 Soldering Recommendations The BGX13S is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used. * * * * * * * * Refer to technical documentations of particular solder paste for profile configurations. Avoid using more than two reflow cycles. A no-clean, type-3 solder paste is recommended. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. Recommended stencil thickness is 0.100mm (4 mils). Refer to the recommended PCB land pattern for an example stencil aperture size. For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. silabs.com | Building a more connected world. Rev. 1.0 | 33 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Certifications 9. Certifications 9.1 Certifications Pending Certifications for the BGX13S are not yet complete. Certification details will be provided in future versions of this document. silabs.com | Building a more connected world. Rev. 1.0 | 34 BGX13S Blue Gecko Xpress Bluetooth (R) SiP Module Data Sheet Revision History 10. Revision History Revision 1.0 December 2018 * 6.9 OTA: Updated firmware update policy. * 2.1.1 Absolute Maximum Ratings: Corrected storage temperature. * Table 2.2 General Operating Conditions on page 6: Added VIOVDD specification line. * * * * * Table 2.8 Non-Volatile Configuration Storage on page 12: Corrected minimum supply voltage during update. Table 2.9 General-Purpose I/O (GPIO) on page 13: Added details about RESETn supply reference. 2.1.4.1 RF Transmitter General Characteristics for 2.4 GHz Band: Removed references to internal supply connections. 3.1 Typical BGX13S Connections: Updated recommended connection details for RESETn, BOOT, and 1V8. 7.3 BGX13S Package Marking: Replaced detailed certification marks and text description with Certification Mark area. Revision 0.5 August 2018 * Public Release silabs.com | Building a more connected world. Rev. 1.0 | 35 Simplicity Studio One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! 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